KR20120005975A - 초음파 트랜스듀서 및 이의 제조 방법 - Google Patents
초음파 트랜스듀서 및 이의 제조 방법 Download PDFInfo
- Publication number
- KR20120005975A KR20120005975A KR1020110067660A KR20110067660A KR20120005975A KR 20120005975 A KR20120005975 A KR 20120005975A KR 1020110067660 A KR1020110067660 A KR 1020110067660A KR 20110067660 A KR20110067660 A KR 20110067660A KR 20120005975 A KR20120005975 A KR 20120005975A
- Authority
- KR
- South Korea
- Prior art keywords
- backing
- piezoelectric elements
- ultrasonic transducer
- matching layers
- acoustic impedance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000000034 method Methods 0.000 claims abstract description 21
- 230000013011 mating Effects 0.000 claims abstract description 16
- 238000005520 cutting process Methods 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 238000002604 ultrasonography Methods 0.000 description 17
- 239000000463 material Substances 0.000 description 14
- 239000004593 Epoxy Substances 0.000 description 13
- 239000000945 filler Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000004088 simulation Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910002804 graphite Inorganic materials 0.000 description 4
- 239000010439 graphite Substances 0.000 description 4
- 238000005094 computer simulation Methods 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 229910000861 Mg alloy Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- -1 epoxies Chemical class 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
- B06B1/0662—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface
- B06B1/067—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element with an electrode on the sensitive surface which is used as, or combined with, an impedance matching layer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Pathology (AREA)
- Acoustics & Sound (AREA)
- Radiology & Medical Imaging (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Signal Processing (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Biochemistry (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/833,101 US8232705B2 (en) | 2010-07-09 | 2010-07-09 | Thermal transfer and acoustic matching layers for ultrasound transducer |
| US12/833,101 | 2010-07-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20120005975A true KR20120005975A (ko) | 2012-01-17 |
Family
ID=45375815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110067660A Abandoned KR20120005975A (ko) | 2010-07-09 | 2011-07-08 | 초음파 트랜스듀서 및 이의 제조 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8232705B2 (enExample) |
| JP (1) | JP6068782B2 (enExample) |
| KR (1) | KR20120005975A (enExample) |
| CN (1) | CN102371243B (enExample) |
| FR (1) | FR2962533A1 (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015005586A1 (en) * | 2013-07-08 | 2015-01-15 | Samsung Medison Co., Ltd. | Ultrasonic probe and manufacturing method thereof |
| KR20150065632A (ko) * | 2015-05-21 | 2015-06-15 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| KR20150077417A (ko) * | 2012-11-01 | 2015-07-07 | 알피니언메디칼시스템 주식회사 | 복수의 음향 경로를 갖는 프로브 |
| KR20160079305A (ko) * | 2014-12-26 | 2016-07-06 | 삼성메디슨 주식회사 | 프로브 및 프로브의 제조방법 |
| WO2016108409A1 (ko) * | 2014-12-30 | 2016-07-07 | 동국대학교 산학협력단 | 혈관 내 진단 및 치료용 단일소자 초음파 변환자 및 그 제조방법 |
| WO2016137022A1 (ko) * | 2015-02-24 | 2016-09-01 | 알피니언메디칼시스템 주식회사 | 금속층을 가진 정합층을 포함하는 초음파 트랜스듀서 및 그 제조방법 |
| WO2016137023A1 (ko) * | 2015-02-24 | 2016-09-01 | 알피니언메디칼시스템 주식회사 | 복합 구조의 정합층을 가진 초음파 트랜스듀서 및 그 제조방법 |
| US9642597B2 (en) | 2013-12-09 | 2017-05-09 | Samsung Medison Co., Ltd. | Ultrasonic diagnostic instrument and manufacturing method thereof |
| KR20170099833A (ko) * | 2014-09-02 | 2017-09-01 | 에사오테 에스.피.에이. | 최적 열-조절식 초음파 프로브 |
| KR20170126579A (ko) * | 2016-05-10 | 2017-11-20 | 삼성메디슨 주식회사 | 초음파 프로브 |
| KR20180097285A (ko) * | 2017-02-23 | 2018-08-31 | 삼성메디슨 주식회사 | 초음파 프로브 |
| KR20190009734A (ko) * | 2016-05-19 | 2019-01-29 | 요하치 야마시타 | 초음파 조사장치와 시스템 및 초음파 조사방법 |
| KR20220156696A (ko) * | 2021-05-18 | 2022-11-28 | 한국기계연구원 | 임피던스 매칭 부재 및 이의 제조 방법 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2662154B1 (en) * | 2011-02-15 | 2017-03-15 | Halliburton Energy Services, Inc. | Acoustic transducer with impedance matching layer |
| US9237880B2 (en) * | 2011-03-17 | 2016-01-19 | Koninklijke Philips N.V. | Composite acoustic backing with high thermal conductivity for ultrasound transducer array |
| JP5436590B2 (ja) | 2012-02-01 | 2014-03-05 | キヤノン株式会社 | 磁性トナー |
| JP5550706B2 (ja) * | 2012-10-31 | 2014-07-16 | 日立アロカメディカル株式会社 | 超音波探触子 |
| WO2014069500A1 (ja) | 2012-10-31 | 2014-05-08 | 日立アロカメディカル株式会社 | 超音波探触子 |
| US9419202B2 (en) * | 2013-06-21 | 2016-08-16 | General Electric Company | Ultrasound transducer and method for manufacturing an ultrasound transducer |
| JP6255961B2 (ja) * | 2013-12-10 | 2018-01-10 | コニカミノルタ株式会社 | 複合圧電体、超音波探触子及び超音波画像診断装置 |
| US11090031B2 (en) * | 2015-02-06 | 2021-08-17 | Koninklijke Philips N.V. | Systems, methods, and apparatuses for thermal management of ultrasound transducers |
| CN104722469B (zh) * | 2015-03-02 | 2017-05-24 | 深圳市理邦精密仪器股份有限公司 | 超声波换能器及其制造方法 |
| WO2016183243A1 (en) * | 2015-05-11 | 2016-11-17 | Measurement Specialties, Inc. | Impedance matching layer for ultrasonic transducers with metallic protection structure |
| AU2017376276A1 (en) * | 2016-12-13 | 2019-05-23 | Butterfly Network, Inc. | Acoustic lens and applications thereof |
| CN107520110A (zh) * | 2017-07-31 | 2017-12-29 | 瑞声科技(新加坡)有限公司 | 压电超声换能器及其制备方法 |
| US10809233B2 (en) | 2017-12-13 | 2020-10-20 | General Electric Company | Backing component in ultrasound probe |
| WO2019199978A1 (en) * | 2018-04-10 | 2019-10-17 | Nrg Systems, Inc. | Techniques for providing acoustic impedance matching for a broad-band ultrasonic transducer device and a method of wildlife deterrence using same |
| WO2020062258A1 (zh) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | 一种超声探头 |
| US11333016B2 (en) | 2020-01-22 | 2022-05-17 | Halliburton Energy Services, Inc. | Ultrasonic transducer for measuring wellbore characteristics |
| EP4056960B1 (de) * | 2021-03-11 | 2023-11-15 | SICK Engineering GmbH | Ultraschallwandler zum senden und/oder empfangen von ultraschallwellen |
| CN113812973A (zh) * | 2021-09-06 | 2021-12-21 | 江苏霆升科技有限公司 | 一种基于热敏背衬的微型超声换能器 |
| CN114145713A (zh) * | 2021-11-30 | 2022-03-08 | 深圳先进技术研究院 | 一种双频内窥导管及成像装置 |
| CN119310189A (zh) * | 2023-07-12 | 2025-01-14 | 华为技术有限公司 | 一种超声检测装置以及指纹识别装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106201B2 (ja) * | 1989-02-01 | 1995-11-15 | アロカ株式会社 | 超音波探触子 |
| JP3420954B2 (ja) * | 1998-12-14 | 2003-06-30 | 松下電器産業株式会社 | 超音波探触子 |
| JP3923846B2 (ja) * | 2002-04-30 | 2007-06-06 | 松下電器産業株式会社 | 超音波探触子 |
| US20070222339A1 (en) * | 2004-04-20 | 2007-09-27 | Mark Lukacs | Arrayed ultrasonic transducer |
| CN100506323C (zh) * | 2005-01-10 | 2009-07-01 | 重庆海扶(Hifu)技术有限公司 | 一体化超声治疗换能器装置 |
| US7405510B2 (en) * | 2005-07-20 | 2008-07-29 | Ust, Inc. | Thermally enhanced piezoelectric element |
| JP2009505468A (ja) * | 2005-08-08 | 2009-02-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ポリエチレン第三整合層を備える広帯域マトリックストランスデューサ |
| JP4843395B2 (ja) * | 2006-07-10 | 2011-12-21 | 日本電波工業株式会社 | 超音波探触子 |
| JP2008066972A (ja) * | 2006-09-06 | 2008-03-21 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
| KR100966194B1 (ko) * | 2006-09-26 | 2010-06-25 | 가부시끼가이샤 도시바 | 초음파 탐촉자 |
| JP4171038B2 (ja) * | 2006-10-31 | 2008-10-22 | 株式会社東芝 | 超音波プローブおよび超音波診断装置 |
| JP4524719B2 (ja) * | 2008-10-17 | 2010-08-18 | コニカミノルタエムジー株式会社 | アレイ型超音波振動子 |
-
2010
- 2010-07-09 US US12/833,101 patent/US8232705B2/en not_active Expired - Fee Related
-
2011
- 2011-07-07 JP JP2011150517A patent/JP6068782B2/ja not_active Expired - Fee Related
- 2011-07-08 FR FR1156206A patent/FR2962533A1/fr not_active Withdrawn
- 2011-07-08 CN CN201110197165.9A patent/CN102371243B/zh not_active Expired - Fee Related
- 2011-07-08 KR KR1020110067660A patent/KR20120005975A/ko not_active Abandoned
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20150077417A (ko) * | 2012-11-01 | 2015-07-07 | 알피니언메디칼시스템 주식회사 | 복수의 음향 경로를 갖는 프로브 |
| WO2015005586A1 (en) * | 2013-07-08 | 2015-01-15 | Samsung Medison Co., Ltd. | Ultrasonic probe and manufacturing method thereof |
| US9642597B2 (en) | 2013-12-09 | 2017-05-09 | Samsung Medison Co., Ltd. | Ultrasonic diagnostic instrument and manufacturing method thereof |
| KR20170099833A (ko) * | 2014-09-02 | 2017-09-01 | 에사오테 에스.피.에이. | 최적 열-조절식 초음파 프로브 |
| KR20160079305A (ko) * | 2014-12-26 | 2016-07-06 | 삼성메디슨 주식회사 | 프로브 및 프로브의 제조방법 |
| WO2016108409A1 (ko) * | 2014-12-30 | 2016-07-07 | 동국대학교 산학협력단 | 혈관 내 진단 및 치료용 단일소자 초음파 변환자 및 그 제조방법 |
| WO2016137023A1 (ko) * | 2015-02-24 | 2016-09-01 | 알피니언메디칼시스템 주식회사 | 복합 구조의 정합층을 가진 초음파 트랜스듀서 및 그 제조방법 |
| WO2016137022A1 (ko) * | 2015-02-24 | 2016-09-01 | 알피니언메디칼시스템 주식회사 | 금속층을 가진 정합층을 포함하는 초음파 트랜스듀서 및 그 제조방법 |
| KR20150065632A (ko) * | 2015-05-21 | 2015-06-15 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| KR20170126579A (ko) * | 2016-05-10 | 2017-11-20 | 삼성메디슨 주식회사 | 초음파 프로브 |
| KR20190009734A (ko) * | 2016-05-19 | 2019-01-29 | 요하치 야마시타 | 초음파 조사장치와 시스템 및 초음파 조사방법 |
| KR20180097285A (ko) * | 2017-02-23 | 2018-08-31 | 삼성메디슨 주식회사 | 초음파 프로브 |
| KR20220156696A (ko) * | 2021-05-18 | 2022-11-28 | 한국기계연구원 | 임피던스 매칭 부재 및 이의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2962533A1 (fr) | 2012-01-13 |
| CN102371243B (zh) | 2015-12-09 |
| JP6068782B2 (ja) | 2017-01-25 |
| US20120007471A1 (en) | 2012-01-12 |
| JP2012019520A (ja) | 2012-01-26 |
| US8232705B2 (en) | 2012-07-31 |
| CN102371243A (zh) | 2012-03-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20110708 |
|
| PG1501 | Laying open of application | ||
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