JP2012019520A5 - - Google Patents
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- Publication number
- JP2012019520A5 JP2012019520A5 JP2011150517A JP2011150517A JP2012019520A5 JP 2012019520 A5 JP2012019520 A5 JP 2012019520A5 JP 2011150517 A JP2011150517 A JP 2011150517A JP 2011150517 A JP2011150517 A JP 2011150517A JP 2012019520 A5 JP2012019520 A5 JP 2012019520A5
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- backing
- matching layer
- wing
- ultrasonic transducer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002604 ultrasonography Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/833,101 US8232705B2 (en) | 2010-07-09 | 2010-07-09 | Thermal transfer and acoustic matching layers for ultrasound transducer |
| US12/833,101 | 2010-07-09 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012019520A JP2012019520A (ja) | 2012-01-26 |
| JP2012019520A5 true JP2012019520A5 (enExample) | 2014-08-07 |
| JP6068782B2 JP6068782B2 (ja) | 2017-01-25 |
Family
ID=45375815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011150517A Expired - Fee Related JP6068782B2 (ja) | 2010-07-09 | 2011-07-07 | 超音波トランスジューサ用の熱伝達及び音響整合層 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8232705B2 (enExample) |
| JP (1) | JP6068782B2 (enExample) |
| KR (1) | KR20120005975A (enExample) |
| CN (1) | CN102371243B (enExample) |
| FR (1) | FR2962533A1 (enExample) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2662154B1 (en) * | 2011-02-15 | 2017-03-15 | Halliburton Energy Services, Inc. | Acoustic transducer with impedance matching layer |
| US9237880B2 (en) * | 2011-03-17 | 2016-01-19 | Koninklijke Philips N.V. | Composite acoustic backing with high thermal conductivity for ultrasound transducer array |
| JP5436590B2 (ja) | 2012-02-01 | 2014-03-05 | キヤノン株式会社 | 磁性トナー |
| JP5550706B2 (ja) * | 2012-10-31 | 2014-07-16 | 日立アロカメディカル株式会社 | 超音波探触子 |
| WO2014069500A1 (ja) | 2012-10-31 | 2014-05-08 | 日立アロカメディカル株式会社 | 超音波探触子 |
| KR101697306B1 (ko) * | 2012-11-01 | 2017-01-17 | 알피니언메디칼시스템 주식회사 | 복수의 음향 경로를 갖는 프로브 |
| US9419202B2 (en) * | 2013-06-21 | 2016-08-16 | General Electric Company | Ultrasound transducer and method for manufacturing an ultrasound transducer |
| KR20150006519A (ko) * | 2013-07-08 | 2015-01-19 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| KR101613413B1 (ko) | 2013-12-09 | 2016-04-19 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| JP6255961B2 (ja) * | 2013-12-10 | 2018-01-10 | コニカミノルタ株式会社 | 複合圧電体、超音波探触子及び超音波画像診断装置 |
| EP2992829B1 (en) * | 2014-09-02 | 2018-06-20 | Esaote S.p.A. | Ultrasound probe with optimized thermal management |
| KR102369731B1 (ko) * | 2014-12-26 | 2022-03-04 | 삼성메디슨 주식회사 | 프로브 및 프로브의 제조방법 |
| KR101730226B1 (ko) * | 2014-12-30 | 2017-04-26 | 동국대학교 산학협력단 | 혈관 내 진단 및 치료용 단일소자 초음파 변환자 및 그 제조방법 |
| US11090031B2 (en) * | 2015-02-06 | 2021-08-17 | Koninklijke Philips N.V. | Systems, methods, and apparatuses for thermal management of ultrasound transducers |
| KR102044705B1 (ko) * | 2015-02-24 | 2019-11-14 | 알피니언메디칼시스템 주식회사 | 복합 구조의 정합층을 가진 초음파 트랜스듀서 및 그 제조방법 |
| WO2016137022A1 (ko) * | 2015-02-24 | 2016-09-01 | 알피니언메디칼시스템 주식회사 | 금속층을 가진 정합층을 포함하는 초음파 트랜스듀서 및 그 제조방법 |
| CN104722469B (zh) * | 2015-03-02 | 2017-05-24 | 深圳市理邦精密仪器股份有限公司 | 超声波换能器及其制造方法 |
| WO2016183243A1 (en) * | 2015-05-11 | 2016-11-17 | Measurement Specialties, Inc. | Impedance matching layer for ultrasonic transducers with metallic protection structure |
| KR101586297B1 (ko) * | 2015-05-21 | 2016-01-19 | 삼성메디슨 주식회사 | 초음파 프로브 및 그 제조방법 |
| KR102627726B1 (ko) * | 2016-05-10 | 2024-01-23 | 삼성메디슨 주식회사 | 초음파 프로브 |
| CN107921281B (zh) * | 2016-05-19 | 2020-07-21 | 山下洋八 | 超声波照射装置以及超声波照射系统 |
| AU2017376276A1 (en) * | 2016-12-13 | 2019-05-23 | Butterfly Network, Inc. | Acoustic lens and applications thereof |
| KR102803133B1 (ko) * | 2017-02-23 | 2025-05-07 | 삼성메디슨 주식회사 | 초음파 프로브 |
| CN107520110A (zh) * | 2017-07-31 | 2017-12-29 | 瑞声科技(新加坡)有限公司 | 压电超声换能器及其制备方法 |
| US10809233B2 (en) | 2017-12-13 | 2020-10-20 | General Electric Company | Backing component in ultrasound probe |
| WO2019199978A1 (en) * | 2018-04-10 | 2019-10-17 | Nrg Systems, Inc. | Techniques for providing acoustic impedance matching for a broad-band ultrasonic transducer device and a method of wildlife deterrence using same |
| WO2020062258A1 (zh) * | 2018-09-30 | 2020-04-02 | 深圳迈瑞生物医疗电子股份有限公司 | 一种超声探头 |
| US11333016B2 (en) | 2020-01-22 | 2022-05-17 | Halliburton Energy Services, Inc. | Ultrasonic transducer for measuring wellbore characteristics |
| EP4056960B1 (de) * | 2021-03-11 | 2023-11-15 | SICK Engineering GmbH | Ultraschallwandler zum senden und/oder empfangen von ultraschallwellen |
| KR102611563B1 (ko) * | 2021-05-18 | 2023-12-12 | 한국기계연구원 | 임피던스 매칭 부재 및 이의 제조 방법 |
| CN113812973A (zh) * | 2021-09-06 | 2021-12-21 | 江苏霆升科技有限公司 | 一种基于热敏背衬的微型超声换能器 |
| CN114145713A (zh) * | 2021-11-30 | 2022-03-08 | 深圳先进技术研究院 | 一种双频内窥导管及成像装置 |
| CN119310189A (zh) * | 2023-07-12 | 2025-01-14 | 华为技术有限公司 | 一种超声检测装置以及指纹识别装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07106201B2 (ja) * | 1989-02-01 | 1995-11-15 | アロカ株式会社 | 超音波探触子 |
| JP3420954B2 (ja) * | 1998-12-14 | 2003-06-30 | 松下電器産業株式会社 | 超音波探触子 |
| JP3923846B2 (ja) * | 2002-04-30 | 2007-06-06 | 松下電器産業株式会社 | 超音波探触子 |
| US20070222339A1 (en) * | 2004-04-20 | 2007-09-27 | Mark Lukacs | Arrayed ultrasonic transducer |
| CN100506323C (zh) * | 2005-01-10 | 2009-07-01 | 重庆海扶(Hifu)技术有限公司 | 一体化超声治疗换能器装置 |
| US7405510B2 (en) * | 2005-07-20 | 2008-07-29 | Ust, Inc. | Thermally enhanced piezoelectric element |
| JP2009505468A (ja) * | 2005-08-08 | 2009-02-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ポリエチレン第三整合層を備える広帯域マトリックストランスデューサ |
| JP4843395B2 (ja) * | 2006-07-10 | 2011-12-21 | 日本電波工業株式会社 | 超音波探触子 |
| JP2008066972A (ja) * | 2006-09-06 | 2008-03-21 | Toshiba Corp | 超音波プローブ及び超音波診断装置 |
| KR100966194B1 (ko) * | 2006-09-26 | 2010-06-25 | 가부시끼가이샤 도시바 | 초음파 탐촉자 |
| JP4171038B2 (ja) * | 2006-10-31 | 2008-10-22 | 株式会社東芝 | 超音波プローブおよび超音波診断装置 |
| JP4524719B2 (ja) * | 2008-10-17 | 2010-08-18 | コニカミノルタエムジー株式会社 | アレイ型超音波振動子 |
-
2010
- 2010-07-09 US US12/833,101 patent/US8232705B2/en not_active Expired - Fee Related
-
2011
- 2011-07-07 JP JP2011150517A patent/JP6068782B2/ja not_active Expired - Fee Related
- 2011-07-08 FR FR1156206A patent/FR2962533A1/fr not_active Withdrawn
- 2011-07-08 CN CN201110197165.9A patent/CN102371243B/zh not_active Expired - Fee Related
- 2011-07-08 KR KR1020110067660A patent/KR20120005975A/ko not_active Abandoned
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