KR20110079697A - Bonded structural body, bonding method and bonding apparatus - Google Patents

Abstract

The joining structure according to the present invention includes a first joining member and a second joining member, and at least one of the first joining member and the second joining member includes the first joining member and the second joining member. The groove part is provided in the bonding interface between them, The space of the said groove part is depressurized, and the said 1st bonding member and the said 2nd bonding member are joined in the state in which the said 1st bonding member and the said 2nd bonding member were in close contact. It is characterized by. When joining together or joining a joining member and a light absorber, it can contact easily.

Description

Bonded Structure, Bonding Method and Bonding Device {BONDED STRUCTURAL BODY, BONDING METHOD AND BONDING APPARATUS}

TECHNICAL FIELD This invention relates to a joining structure, a joining method, and a joining apparatus. Specifically, It is related with the joining structure, the joining method, and the joining apparatus which adhere | attach a plurality of members.

 As a method of joining a plurality of members, there is a method using frit or lead. For example, a light emitting panel such as a plasma display panel (PDP), a surface-conduction electron-emitter display (SED), a field emission display (FED), an organic electroluminescence display (Organic EL display), and the like, is formed by bonding two pieces of glass through a frame. It may have a structure. The above-mentioned method is used a lot in these joining.

As another method for joining a plurality of members, there is a joining method by laser light irradiation. This joining method is a method in which the joining member is heated and melted by absorbing the irradiated laser light energy at the joining interface and then joined by solidifying again. For example, in the case of bonding a resin film, there is a method of embedding a light absorbing material in the bonding interface in order to further increase the absorbency of laser light (Japanese Patent Laid-Open No. 2002-67164). Moreover, similarly to this, there exists a method of apply | coating or attaching or film-forming a light absorber to a joining interface, and joining inorganic materials, such as glass (Japanese Unexamined-Japanese-Patent No. 2003-170290).

Since the joining method by irradiation of the laser beam is a joining method in which the joining member is melted by heat generation such as a light absorber, it is necessary to efficiently conduct heat generation of the light absorbing member to the joining member. For this purpose, it is important to fix the bonding members in close contact when bonding the bonding members and the light absorber. This is because heat transfer is lowered by the gap which exists in these interfaces in the state in which the bonding members or the adhesion of the bonding member and the light absorber are weak. As a result, there is a fear that the required bonding strength cannot be obtained.

As a method of bringing the joining members or the joining member and the light absorbing material into close contact with each other, there is a method of applying a pressing pressure to the joining member using a mechanical mechanism (pressing mechanism). However, there is a problem that the bonding member may be damaged by the pressing mechanism, or a special pressing mechanism for uniformly applying the pressing pressure to the bonding member is required.

Patent Document 1: Japanese Patent Application Laid-Open No. 2002-67164 Patent Document 2: Japanese Patent Laid-Open No. 2003-170290

This invention is made | formed based on such subject recognition, and provides the joining structure, the joining method, and the joining apparatus which can be easily brought together when joining joining members or joining member and a light absorber.

According to one aspect of the present invention, there is provided a first joining member and a second joining member, and at least one of the first joining member and the second joining member includes the first joining member and the second joining member. The first joining member and the second joining member are joined to each other in a state in which a groove part is provided at a joining interface therebetween, and the space of the groove part is depressurized and the first joining member and the second joining member are in close contact with each other. Characterized by the bonding structure is provided.

In addition, according to another aspect of the present invention, in at least one of the first bonding member and the second bonding member, a groove is formed at the bonding interface between the first bonding member and the second bonding member, and the groove is formed. A joining method is provided, wherein the first joining member and the second joining member are joined in a state where the negative space is reduced in pressure and the first joining member and the second joining member are brought into close contact with each other.

According to another aspect of the present invention, there is provided an energy irradiation means for discharging a heating source toward a first joining member and a second joining member;

Positioning means for determining a relative position of said first and second bonding members and said energy irradiation means;

In at least one of the said 1st bonding member and the said 2nd bonding member, the groove part formed in the bonding interface between the said 1st bonding member and the said 2nd bonding member (Note: A groove part is a 1st bonding member and a 2nd bonding member). Pressure-reducing means capable of depressurizing the space of the at least one of the bonding interfaces, and allowing the first bonding member and the second bonding member to be in close contact with each other;

It is provided with the control part which controls the said positioning means so that the said 1st bonding member and the said 2nd bonding member may be joined by releasing the said heating source to the bonding interface between the said 1st bonding member and the said 2nd bonding member. Characterized by a bonding device is provided.

According to the present invention, there is provided a joining structure, a joining method, and a joining device, which can be easily brought into contact with each other when joining the joining members or the joining member and the light absorber.

1 is a schematic diagram illustrating a bonded structure according to a first embodiment of the present invention.
2 is a schematic diagram illustrating a joining member according to a modification of the groove portion.
3 is a schematic cross-sectional view of the bonded structure placed on the stage viewed from the front.
Figure 4 is a schematic cross-sectional view of the bonded structure placed on the stage in an enlarged view from the front.
5 is a schematic cross-sectional view of a modified example of the bonded structure placed on the stage, enlarged from the front.
6 is a schematic diagram illustrating the bonding method according to the present embodiment.
It is a schematic diagram which illustrates the bonding structure which concerns on 2nd Embodiment of this invention.
8 is a schematic cross-sectional view of the bonded structure placed on the stage from the front.
9 is a schematic cross-sectional view of the bonded structure placed on the stage, seen from an enlarged front.
10 is a schematic cross-sectional view of a modified example of the bonded structure placed on the stage, seen from an enlarged front.
11 is an enlarged schematic view of the bonding member 104 in an enlarged manner.
FIG. 12: is a schematic diagram which looked at the whole bonding member 104 from the top, and corresponds to the schematic diagram seen from the arrow A direction shown in FIG.
13 is an enlarged schematic view in which a modified example of the bonding member 104 is enlarged and viewed.
FIG. 14: is a schematic diagram which illustrates the joining method which concerns on this embodiment, and is corresponded to the BB cross section shown in FIG.
FIG. 15: is a schematic diagram which illustrates the bonding method which concerns on this embodiment, and is corresponded to the BB cross section shown in FIG.
FIG. 16: is a schematic diagram which illustrates the joining method of the bonding member of the modification shown in FIG. 13, and is corresponded to BB sectional drawing shown in FIG.
17 is a schematic cross-sectional view of the bonded structure according to a modification of the present embodiment, in an enlarged manner, as viewed from the front.
FIG. 18 is a schematic cross-sectional view of the bonded structure according to another modification of the present embodiment, in an enlarged manner, viewed from the front. FIG.
It is a schematic diagram for demonstrating the laser beam irradiation method.
It is a schematic diagram for demonstrating the other irradiation method of a laser beam.
21 is a schematic diagram illustrating a joining method according to a modification of the present embodiment.
22 is a schematic cross-sectional view of the bonded structure placed on the stage, seen from an enlarged front.
23 is a block diagram illustrating the configuration of a bonding apparatus according to the present embodiment.
24 is a block diagram illustrating the configuration of a bonding apparatus according to a modification of the present embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings. In addition, in each figure, the same code | symbol is attached | subjected to the same component, and detailed description is abbreviate | omitted suitably.

1 is a schematic diagram illustrating a bonded structure according to a first embodiment of the present invention.

1 (a) is an exploded schematic view in which the bonded structure according to the present embodiment is disassembled and viewed, and FIG. 1 (b) is an assembled schematic diagram showing a state in which the bonded structure according to the present embodiment is assembled.

2 is a schematic diagram which illustrates the joining member which concerns on the modification of a groove part.

On the other hand, Fig. 2 (a) is a perspective schematic view obliquely looking at the entire bonding member according to the present modification, Fig. 2 (b) to (d) is a cross-sectional schematic diagram illustrating the cross-sectional shape of the groove portion according to the present modification. .

The bonding structure shown in FIG. 1 is provided with the bonding member 101a (1st bonding member) and the bonding member 101b (2nd bonding member). The groove part 108a is formed annularly in the bonding interface with the bonding member 101b in the bonding member 101a. However, the shape of the groove 108a is not limited to the annular shape as shown in FIG. 1, and can be appropriately changed depending on the position, the shape, and the like. That is, the groove portion may be formed with a plurality of groove portions 108h spaced apart, as in the modification shown in FIG. And the cross-sectional shape of this groove part 108h may be substantially rectangular as shown in FIG.2 (b), and may be substantially arc-shaped as shown in FIG.2 (c), and it may be in FIG.2 (d). As shown, it may be substantially triangular. In addition, the opening shape of the groove part 108h is not limited only to a substantially circular shape as shown to Fig.2 (a), but may be a substantially rectangular shape, for example.

The joining member 101a and the joining member 101b are joined together by the joining method by a laser beam, electricity, gas, etc., as described later in detail. Hereinafter, the bonding structure and the bonding method which concern on FIGS. 3-6 are demonstrated more concretely.

3 is a schematic cross-sectional view of the bonded structure placed on the stage viewed from the front.

4 is a schematic cross-sectional view of the bonded structure placed on the stage in an enlarged view from the front.

5 is the cross-sectional schematic diagram which looked at the modified example of the bonding structure put on the stage and expanded from the front.

3 to 5 correspond to the D-D cross-sectional view shown in FIG. 1.

As mentioned above, the groove part 108a is formed in the bonding interface with the bonding member 101b in the bonding member 101a. For this reason, the space by the groove part 108a exists between the joining member 101a and the joining member 101b. Moreover, the exhaust hole 112a which forms an exhaust path is formed in the joining member 101a.

In the stage 204 on which the joining members 101a and 101b are placed, an exhaust hole 214 forming an exhaust path is formed. The shape of the exhaust hole 214 is not limited to the hole, but may have a groove. The stage 204 is connected to the pump 206 through the exhaust hole 214. The pump 206 can depressurize the space by sucking the gas in the connected space. For this reason, the pump 206 can pressure-reduce the space (space by the groove part 108a) between the joining member 101a and the joining member 101b via the exhaust hole 214 and the exhaust hole 112a. .

When the space between the joining member 101a and the joining member 101b is depressurized, a pressure difference (atmospheric pressure difference) occurs between the space and the outside space. That is, the pressure in the space between the joining member 101a and the joining member 101b is lower than the pressure in the external space. For this reason, the joining member 101a and the joining member 101b can contact easily.

On the other hand, as in the modification shown in Fig. 5A, only the exhaust hole 112c is formed in the joining member 101c (first joining member), and the joining in the joining member 101d (second joining member) is performed. The groove portion 108d may be formed at the bonding interface with the member 101c. According to this, since only the exhaust hole 112c is formed in the joining member 101c, the intensity | strength (stiffness) of the joining member 101c can be kept larger. For this reason, when carrying in or installing the joining member 101c, it can further prevent that the joining member 101c deforms.

Alternatively, the groove 108e and the exhaust hole 112e are formed in the joining member 101e (first joining member) as shown in the modification shown in FIG. 5B, and the joining member 101e and the joining member are also provided. The space 150 may exist between 101b (the 2nd bonding member). According to this, the space 150 surrounded by the bonding member 101e and the bonding member 101b can be used as a sealing space, and can be applied to light emitting panels such as PDPs, SEDs, FEDs, organic EL displays, and the like.

Alternatively, as in the modification shown in FIG. 5C, in the modification shown in FIG. 5B, only the exhaust hole 112f is formed in the joining member 101f (first joining member), and the joining is performed. The groove portion 108g may be formed at the bonding interface with the bonding member 101f in the member 101g (second bonding member). According to this, the space 150 surrounded by the joining member 101f and the joining member 101g can be used as the sealing space while maintaining the strength of the joining member 101f more. Therefore, as described above with reference to FIG. 5B, the present invention can be applied to, for example, a light emitting panel.

As described above, even in the modification as shown in FIGS. 5A to 5C, the pressure in the space between the first joining member and the second joining member is lower than the pressure in the external space. For this reason, a 1st bonding member and a 2nd bonding member can be easily stuck.

6 is a schematic diagram illustrating the bonding method according to the present embodiment.

6A is a schematic diagram illustrating a bonding method of directly irradiating a laser light to a bonding interface, and FIG. 6B illustrates a bonding method of irradiating a laser light to a bonding interface through a bonding member. It is a schematic diagram. 6A and 6B correspond to the sectional view taken along the line D-D shown in FIG. 1.

First, the joining member 101a and the joining member 101b are mounted on the stage 204, and then the pump 206 is operated. Then, as described above with reference to FIGS. 3 to 5, the joining member 101a and the joining member 101b are in close contact with each other. In this state, as shown in Fig. 6A, the laser beam 120 is directly irradiated to the bonding interface between the bonding member 101a and the bonding member 101b.

When the laser beam 120 is irradiated to the bonding interface, the bonding members 101a and 101b absorb the laser beam 120 and generate heat. And by this heat_generation | fever, at least any one of the bonding member 101a and the bonding member 101b fuse | melts and solidifies, and a joining part is formed. As a result, the joining member 101a and the joining member 101b are joined at this joining part. Subsequently, in the case where the bonding member 101a and the bonding member 101b are bonded to each other over the entire circumference, for example, the laser optical system is appropriately moved in parallel with the bonding members 101a and 101b, the bonding member 101a and The joining member 101b can be joined over the whole perimeter.

On the other hand, the irradiation direction of the laser beam 120 is not limited to the direction illustrated in FIG. 6A, and as shown in FIG. 6B, for example, the upper direction of the bonding member 101b is approximately. You may irradiate through the bonding member 101b in a perpendicular direction. In this case, the bonding member 101b needs to be transparent to the laser light. Here, the transmittance to the laser light means that the laser light as a heating source is transmitted with almost no reflection or absorption, or the remaining laser light is transmitted without melting (melting) even when partially absorbing or reflecting the laser light, It means the property which can reach to a junction interface. In addition, the method of joining the joining member 101a and the joining member 101b is not limited to the joining method by a laser beam like the joining method shown in FIG. 6, The joining method by electricity, gas, etc. may be sufficient.

As described above, by bonding the joining members in close contact with each other, the heat transfer can be prevented from being lowered due to the gap present in the joining interface, and as a result, a larger joining strength can be obtained between the joining members. In addition, since the joining members can be easily brought into close contact with each other without using a special apparatus such as a vacuum chamber or a mechanism for mechanically pressing the joining members, the joining apparatus can be simplified.

In the state (vacuum state) reduced in pressure from the outside, heat becomes difficult to diffuse to the periphery part by the heat insulation effect of the vacuum. Here, since the space by the groove part 108a between the joining member 101a and the joining member 101b is in a state of being reduced in pressure from the outside, the heat which generate | occur | produced in the joining members 101a and 101b spreads to the peripheral part. Becomes difficult. For this reason, at least one of the bonding member 101a and the bonding member 101b melt | dissolves more reliably. As a result, larger bonding strength can be obtained between the joining members. Moreover, since it is not necessary to perform excessive heat input, the damage to the joining members 101a and 101b can be suppressed by the influence of heat.

Although the case where the 1st bonding member and the 2nd bonding member were directly contacted and joined was demonstrated about the bonded structure and joining method shown in FIGS. 1-6, the absorbing material which absorbs laser beam energy and generate | occur | produces heat is demonstrated as an example. You may sandwich and join between 1st bonding member and a 2nd bonding member. In this case, the light absorbing material absorbs the laser light and generates heat, and at least one of the first bonding member, the second bonding member, and the light absorbing material melts and solidifies by the heat generation, whereby the first bonding member and the second bonding member are solidified. Is bonded through the light absorber. Hereinafter, with reference to FIGS. 7-23, the case where the some joining member is joined through a light absorber is taken as an example, and it demonstrates, referring drawings.

It is a schematic diagram which illustrates the bonding structure which concerns on 2nd Embodiment of this invention.

7A is an exploded schematic view in which the bonded structure according to the present embodiment is disassembled and viewed, and FIG. 7B is an assembled schematic diagram showing a state in which the bonded structure according to the present embodiment is assembled.

The bonding structure shown in FIG. 7 has a bonding member 102a (first bonding member), a bonding member 102b (third bonding member) made of a material having transparency to the laser beam, and a transparency to the laser beam. It consists of the material which has, and is provided with the bonding member 104 (2nd bonding member) pinched | interposed between the bonding member 102a and the bonding member 102b. Hereinafter, the transmittance to laser light means that the laser light as a heating source is transmitted with almost no reflection or absorption, or the remaining laser light is transmitted without melting (melting) even when partially absorbed or reflected. , The property that can reach the absorber.

The bonding member 102a may be made of a material that is transparent to the laser light, or may be made of a material that is non-transmissive to the laser light. As a member which has a non-transmissivity with respect to a laser beam, the member by which the wiring is patterned at the member, the electronic element, the optical element, etc. are provided, for example. In addition, although the bonding member 104 has an annular shape, it is not limited only to this, It may be plate-like similarly to the bonding members 102a and 102b.

The bonding members 102a and 102b and the bonding member 104 are bonded to each other by irradiation of laser light, as will be described later in detail. And when the joining member 104 has an annular shape, the sealing space enclosed by the joining members 102a and 102b and the joining member 104 is formed. As such a bonded structure, light emitting panels, such as a PDP, SED, FED, and an organic electroluminescent display, are mentioned, for example. Hereinafter, as illustrated in the light emitting panel, a case where a plurality of bonding members are joined through an annular (frame type) bonding member will be described as an example.

8 is a schematic cross-sectional view of the bonded structure placed on the stage from the front.

9 is the cross-sectional schematic diagram which looked at the bonding structure put on the stage and expanded from the front.

10 is a schematic cross-sectional view of a modified example of the bonded structure placed on the stage, enlarged from the front.

8 to 10 correspond to the sectional view taken along line B-B in FIG.

In the joining interface with the joining member 102a in the joining member 104, the groove part 108a is annularly formed in the annular joining member 104 similarly. In the joining interface with the joining member 102b in the joining member 104, the groove portion 108b is similarly formed in the annular joining member 104 in an annular manner. For this reason, the space by the groove part 108a exists between the joining member 102a and the joining member 104. FIG. In addition, a space due to the groove 108b exists between the joining member 102b and the joining member 104. Moreover, the through-hole 114 which communicates the groove part 108a and the groove part 108b is formed in the joining member 104. As shown in FIG.

An exhaust hole 112 for forming an exhaust path is formed in the joining member 102a. In addition, an exhaust hole 214 for forming an exhaust path is formed in the stage 204 on which the joining members 102a, 102b, and 104 are placed. The shape of the exhaust hole 214 is not limited to the hole, but may have a groove. The formation positions of the exhaust holes 112 and 214 need not correspond to the formation positions of the through holes 114, and the number of formation of the through holes 114 does not have to correspond to the number of formation of the through holes 114. For example, the exhaust hole 112 and the exhaust hole 214 may be formed in only one place, and the through hole 114 may be formed in two or more places.

As shown in FIG. 9, between the bonding member 102a and the bonding member 104, the light absorbing materials 106a and 106c (1st light absorbing material) which absorb and generate | occur | produce laser beam energy are provided. On the other hand, between the bonding member 102b and the bonding member 104, the light absorbing materials 106b and 106d (2nd light absorbing material) which similarly absorb a laser beam energy and generate heat are provided.

The stage 204 is connected to the pump 206 through the exhaust hole 214. The pump 206 can depressurize the space by sucking the gas in the connected space. For this reason, the pump 206 can pressure-reduce the space (space by the groove part 108a) between the joining member 102a and the joining member 104 via the exhaust hole 214 and the exhaust hole 112. . Moreover, since the through-hole 114 which communicates the groove part 108a and the groove part 108b is formed in the joining member 104, the pump 206 is the space between the joining member 102b and the joining member 104. The space by the groove 108b can also be depressurized.

When the space between the joining member 102a and the joining member 104 and the space between the joining member 102b and the joining member 104 are depressurized, a pressure difference (atmospheric pressure difference) occurs between these spaces and the outer space. That is, the pressure of the space between the joining member 102a and the joining member 104 and the space between the joining member 102b and the joining member 104 is lower than the pressure of the external space. For this reason, the joining member 102a and the joining member 104 can contact easily. In addition, the bonding member 102b and the bonding member 104 can be brought into close contact with each other easily.

In this way, the bonding members can be brought into close contact with each other, whereby the heat transfer can be prevented from being lowered due to the gap present at the bonding interface. As a result, larger bonding strength can be obtained between the joining members. In addition, since the joining members can be easily brought into close contact with each other without using a special apparatus such as a vacuum chamber or a mechanism for mechanically pressing the joining members, the joining apparatus can be simplified. In addition, the joining portion can be easily brought into close contact with each other without reducing the space 150 surrounded by the joining member 102a, the joining member 102b, and the joining member 104.

In a state where pressure is reduced more than the outside, heat becomes less likely to diffuse to the peripheral portion due to the vacuum heat insulating effect. Here, the space between the joining member 102a and the joining member 104 and the space between the joining member 102b and the joining member 104 are in a reduced pressure state than outside, so that the light absorbers 106a, 106b, Heat generated in 106c and 106d becomes difficult to diffuse to the periphery. For this reason, the heat generated by the light absorbers 106a, 106b, 106c, and 106d is efficiently transmitted to the bonding members 102a, 102b, and 104, respectively. And at least any one of the bonding members 102a, 102b, 104, and the light absorbing materials 106a, 106b, 106c, and 106d is melted more reliably. As a result, larger bonding strength can be obtained between the joining members. Moreover, since it is not necessary to perform excessive heat input, the damage to the joining members 102a, 102b, and 104 can be suppressed by the influence of heat.

In the joining method by irradiation of a laser beam, when the whole circumference | surroundings of the laser beam irradiation part are in a vacuum state, the heat insulation effect of vacuum becomes larger. For this reason, in the case where the bonding portion is brought into close contact with each other by reducing the space of the groove portion, as in the modified example shown in FIG. 10, when the circumference of the irradiation portion is the groove portion, the heat insulating effect is greater.

In the modification shown in FIG. 10, by operating the pump 206, the spaces of the grooves 138a and 138c can be reduced in pressure through the exhaust holes 274, 274a and 274b and the exhaust holes 142a and 142b. have. In addition, since the through-hole 144a which communicates the groove part 138a and the groove part 138b is formed in the joining member 134, and the through-hole 144b which communicates the groove part 138c and the groove part 138d, The space by the grooves 138b and 138d can also be reduced in pressure. For this reason, the circumference | surroundings of the bonding interface (irradiation part of a laser beam) in which the light absorbing materials 136a and 136b were provided turn into the space where all pressure was reduced. Therefore, for example, when the periphery of the irradiated portion is a groove portion as in the modification shown in FIG.

On the other hand, in the joining structure shown in FIG. 8 and FIG. 9, although the groove part 108a, 108b is formed only in the joining member 104, not only this but the groove part in the joining member 102a or the joining member 102b. It may be formed. Also in this case, a space can be created between the joining member 102a and the joining member 104 and between the joining member 102b and the joining member 104. That is, a space capable of reducing the pressure may be present between the joining member 102a and the joining member 104 and between the joining member 102b and the joining member 104. However, considering the processing step of the groove portion, it is more preferable to form the groove portions 108a and 108b only in the joining member 104 because the process can be simplified.

11 is an enlarged schematic view of the bonding member 104 in an enlarged manner.

On the other hand, Fig. 11 (a) is a plan view schematically showing the joining member 104 enlarged from above, and corresponds to a schematic view seen from the direction of arrow A shown in Fig. 7. FIG. 11B is a schematic cross-sectional view of the bonding member 104 as viewed from the front, and corresponds to the cross-sectional view taken along line C-C shown in FIG. 11A.

12 is the schematic diagram which looked at the whole bonding member 104 from the upper side, and is corresponded to the schematic diagram seen from the direction of arrow A shown in FIG.

13 is the enlarged schematic diagram which expanded and looked at the modification of the bonding member 104. Moreover, FIG.

FIG. 13A is a plan view schematically illustrating an enlarged view of the joining member according to the present modification, and corresponds to a schematic view seen from the direction of arrow A shown in FIG. 7. FIG. 13 (b) is a schematic cross-sectional view of the bonding member of the present modified example viewed from the front, and corresponds to the cross-sectional view taken along the line C-C shown in FIG.

On the upper surface (bonding interface with the joining member 102b) and the lower surface (bonding interface with the joining member 102a] of the joining member 104, as described above, the grooves 108b and 108a have an annular joining member 104. Similarly, each is formed in an annular shape. As shown in Figs. 11A and 12, through holes 114 communicating the groove portions 108a and the groove portions 108b are formed at predetermined intervals.

Light absorbing materials 106b and 106d are formed in advance on the upper surface of the bonding member 104, and light absorbing materials 106a and 106c are formed in advance in the lower surface. And when the joining member 104 is seen perpendicularly to the upper surface or the lower surface, the light absorbing material 106a and the light absorbing material 106b are formed so as not to overlap with each other. Similarly, the light absorbing material 106c and the light absorbing material 106d are formed so as not to overlap each other.

 In addition, as shown in FIG. 12, the light absorbing material 106a, the light absorbing material 106b, the light absorbing material 106c, and the light absorbing material 106d are annularly formed in the annular joining member 104 similarly. And when the joining member 104 is seen from the direction perpendicular | vertical with respect to the upper surface or the lower surface, the light absorber 106a and the light absorber 106b are formed so that it may not overlap with each other in an annular extension. Similarly, the light absorbing material 106c and the light absorbing material 106d are formed so as not to overlap each other in all extending in an annular shape.

On the other hand, in the bonding member 104 shown to FIG. 11 and FIG. 12, the light absorbing material 106a, 106c arrange | positioned inside (opening side) of the bonding member 104 is previously formed in the lower surface, and the bonding member 104 is carried out. Although the case where the light absorbing materials 106b and 106d arrange | positioned at the outer side of the upper surface is illustrated previously, it is not limited only to this, The light absorbing materials 106a and 106c are previously formed in the upper surface, and the light absorbing materials 106b and 106d are shown. May be formed on the lower surface in advance.

In addition, in the bonding member 104 shown to FIG. 11 and FIG. 12, although two light absorbers 106b and 106d are previously formed in the upper surface, and two light absorbers 106a and 106c are previously formed in the lower surface, As in the modification shown in FIG. 13, only one light absorber 106d may be formed in advance on the upper surface, and only one light absorber 106a may be formed in advance on the lower surface. Even in this case, the joining members 102a can be joined to each other in a state where the joining member 102a and the joining member 104 are brought into close contact with each other, and the joining member 102b and the joining member 104 are brought into close contact with each other. This also applies to embodiments and modifications described below.

The material of the light absorbers 106a, 106b, 106c, and 106d is preferably metal, ceramic, colored paint, a combination thereof, or the like, and the form is preferably foil, film, powder, ribbon, or plate. In addition, the light absorbing materials 106a, 106b, 106c, and 106d may not be formed in the bonding member 104 in advance, as shown in FIGS. 11 and 12. However, in consideration of handling at the time of installation between joining members, alignment of an installation position, etc., it is more preferable to form previously in the joining member 104 or joining members 102a and 102b. As the method for forming the light absorbers 106a, 106b, 106c, and 106d, techniques such as vapor deposition, sputtering, adhesion, coating, or transfer can be used.

14-15 is a schematic diagram which illustrates the joining method which concerns on this embodiment, and is corresponded to the B-B cross section shown in FIG.

16 is a schematic diagram which illustrates the joining method of the joining member of the modification shown in FIG. 13, and is corresponded to B-B sectional drawing shown in FIG.

First, the bonding member 102a is mounted on the stage 204 (FIG. 14 (a)). Subsequently, the light absorbing members 106b and 106d are formed on the upper surface in advance, and the joining member 104 having the light absorbers 106a and 106c formed on the lower surface in advance is brought into contact with the bonding member 102a (Fig. 14 (a)). . Next, the joining member 102b is brought into contact with the joining member 104 (FIG. 14A).

In this manner, the light absorbers 106a and 106c are sandwiched between the joining member 102a and the joining member 104, and the light absorbers 106b and 106d are sandwiched between the joining member 102b and the joining member 104. In the sandwiched state, the joining members 102a, 102b, 104 are placed on the stage 204 (FIG. 14B).

The pump 206 is then operated. Then, the pump 206 sucks the gas in the space of the exhaust hole 214 and the exhaust hole 112 like the arrow shown to FIG. 15 (a). As a result, since the space between the pump 206 and the joining member 102a and the joining member 104 (the space by the groove 108a) communicates through the exhaust holes 214 and 112, the recess 108a The space by) is depressurized. In addition, since the space between the joining member 102b and the joining member 104 (the space by the groove 108b) and the space by the groove 108a communicate with each other through the through hole 114, the groove 108b. The space by) is also decompressed.

When the space by the grooves 108a and 108b is depressurized, as described above, a pressure difference (atmospheric pressure difference) occurs between these spaces and the external space. For this reason, the joining member 102a, the joining member 104, and the joining member 102b and the joining member 104 come in close contact with each other. At this time, when the stage 204 is non-transparent to the laser light, or when, for example, the wiring is patterned on the bonding member 102a, or an electronic device, an optical device, or the like is provided, the stage 204 and the bonding are provided. Laser light cannot be irradiated to the light absorbers 106a and 106c through the member 102a.

Thus, in the bonding method according to the present embodiment, as shown in FIG. 15B, the laser beam 120a only on the bonding member 102b side in a state where the bonding members 102a, 102b, 104 are in close contact with each other. , 120b, 120c, and 120d can be irradiated to the light absorbers 106a, 106b, 106c, and 106d, respectively (FIG. 15B). As described above with reference to FIGS. 11 and 12, when the bonding member 104 is viewed in a direction perpendicular to the upper or lower surface thereof, the light absorbing member 106a and the light absorbing member 106b are formed so as not to overlap each other. Therefore, the laser beam 120a can reach the light absorber 106a. Similarly, the laser light 120c may reach the light absorbing material 106c.

On the other hand, like the joining member 124 of the modification shown in FIG. 13, only one light absorbing material 106a is provided at the joining interface with the joining member 102a, and one light absorption at the joining interface with the joining member 102b. Even when only the ash 106d is provided, as shown in FIG. 16, the laser beams 120a and 120d can be irradiated to the light absorbing materials 106a and 106d only on the bonding member 102b side, respectively. When the bonding member 124 is viewed from the direction perpendicular to the upper or lower surface thereof, the light absorbing member 106a and the light absorbing member 106d are formed so as not to overlap each other, so that the laser light 120a is the light absorbing member 106a. ) Can be reached.

The light absorbers 106a and 106c absorb the laser lights 120a and 120c and generate heat. And by this heat | fever, at least any one of the bonding member 102a, the bonding member 104, and the light absorbing materials 106a and 106c melts and solidifies, the joining part (first joining part) by the light absorbing material 106a, The junction part by the light absorber 106c is formed, and the junction member 102a and the junction member 104 are joined by these junction parts. In addition, the light absorbers 106b and 106d absorb the laser beams 120b and 120d, respectively, and generate heat. And by this heat_generation | fever, at least any one of the bonding member 102b, the bonding member 104, and the light absorbers 106b and 106d melts and solidifies, and the joining part (2nd junction part) by the light absorber 106b, The junction part by the light absorber 106d is formed, and the junction member 102b and the junction member 104 are joined by these junction parts.

Subsequently, the laser optical system is appropriately moved in parallel with the bonding members 102a, 102b, and 104, so that the laser beams 120a, 120b, over the entire circumference of the light absorbers 106a, 106b, 106c, and 106d formed in the circumferential shape. 120c and 120d) can be irradiated, respectively. As a result, the joining member 102a and the joining member 104 can be joined over the whole perimeter, and the joining member 102b and the joining member 104 can be joined over the whole perimeter. On the other hand, the laser beams 120a, 120b, 120c, and 120d may be irradiated from different laser optical systems, or may be irradiated integrally from an optical system enabling multiple focuses. In addition, the laser beam irradiated from one laser optical system may be separated into a plurality by a splitter or the like. In addition, as shown in Fig. 6A, the light absorbing material may be directly irradiated with a laser beam without passing through the bonding member 102b.

Thus, according to the bonding method which concerns on this embodiment, the bonding by irradiation of a laser beam can be performed in the state in which the bonding members 102a, 102b, 104 were in close contact with each other. For this reason, heat transfer can be prevented from falling by the clearance gap which exists in a joining interface, and larger joining strength can be obtained between joining members 102a, 102b, 104. As a result, the reliability of joining can be improved. Moreover, even if the stage 204 and the bonding member (bonding member 102a) of one outermost layer have non-transmission to a laser beam, the bonding member of the other outermost layer (bonding member) which is transparent to a laser beam (102b)] can be bonded together by irradiating a laser beam only from the side. For this reason, joining time can be shortened and the efficiency of joining operation can be improved. In addition, the same effects as those described above with respect to FIGS. 8 and 9 can be obtained.

17 is a schematic cross-sectional view of the bonded structure according to a modification of the present embodiment, in an enlarged manner, as viewed from the front. In addition, FIG. 17 corresponds to the sectional view B-B shown in FIG. 7 similarly to FIG.

In the bonding interface with the bonding member 152a in the bonding member 154 of this modification, groove parts 158a, 158c, and 158e are similarly formed in the annular bonding member 154 annularly. In the joining interface with the joining member 102b in the joining member 154, the groove portions 158b and 158d are similarly formed in the annular joining member 154 annularly.

For this reason, the space by the groove part 158a, 158c, 158e exists between the joining member 152a and the joining member 154. As shown in FIG. In addition, a space due to the grooves 158b and 158d exists between the joining member 102b and the joining member 154. On the other hand, the groove portions 158a, 158b, 158c, 158d, and 158e have curved surfaces as shown in FIG. 17, but may have a flat surface similar to the joining member 104 shown in FIG. 9. Further, the joining member 154 is provided with a through hole 164a for communicating the groove 158a and the groove 158b, and a through hole 164b for communicating the groove 158d and the groove 158e.

In the joining member 152a, exhaust holes 162a, 162b, and 162c forming the exhaust path are formed, respectively. In the stage 254 on which the joining members 152a, 102b, and 154 are placed, exhaust holes 264a, 264b, and 264c for forming an exhaust path are formed, respectively. The exhaust holes 264a, 264b, and 264c are coupled as the exhaust holes 264 while communicating with the pump 206 (see FIG. 8).

As shown in FIG. 17, between the bonding member 152a and the bonding member 154, the light absorbing material 156a, 156c, 156e, 156g which absorbs a laser beam energy and generates heat is provided. On the other hand, between the bonding member 102b and the bonding member 154, the light absorbers 156b, 156d, and 156f which similarly absorb a laser beam energy and generate | occur | produce heat are provided. Other structures are similar to those of the bonded structure shown in FIGS. 8 and 9.

According to this modification, by operating the pump 206, the space (space by the groove parts 158a, 158c, 158e) between the joining member 152a and the joining member 154 can be decompressed. In addition, since the through-holes 164a and 164b are formed in the joining member 154, the space (grooves 158b and 158d) between the joining member 102b and the joining member 154 via these through-holes 164a and 164b. The space by) can also be reduced in pressure.

In this way, since a pressure difference arises between these spaces and the external space, the joining member 152a and the joining member 154 can be easily brought into close contact with each other. In addition, the bonding member 102b and the bonding member 154 can be easily brought into close contact with each other. At this time, since the groove portions 158a, 158b, 158c, 158d, and 158e are widely formed in left and right sides on the upper surface or the lower surface of the bonding member 154, the bonding members 152a, 102b, and 154 are separated from each other in this modification. Can be in close contact over a wider range.

By bringing the joining members into close contact with each other over a wider range, the gap existing at the joining interface can be made smaller. For this reason, it can prevent that heat transfer falls by this clearance gap. As a result, larger joint strength can be obtained between joining members, and the reliability of joining can be improved. In addition, grooves 158b and 158d are disposed in the vicinity of the light absorber 156d, grooves 158a and 158c are disposed in the vicinity of the light absorber 156c, and grooves 158c and 158c in the vicinity of the light absorber 156e. Since 158e) is arranged, as described above with respect to FIG. 10, the heat insulating effect of the vacuum becomes larger in these irradiation units. Here, "nearby" means the thing close | similar enough to suppress the heat | fever diffusion to the peripheral part of a light absorber by the vacuum heat insulation effect in a groove part. As for other effects, the same effects as those described above with respect to FIGS. 8 and 9 can be obtained.

On the other hand, the light absorbing materials 156a, 156b, 156c, 156d, 156e, 156f, and 156g are formed so as not to overlap with each other when the bonding member 154 is viewed perpendicularly to the upper or lower surface thereof, as shown in FIG. have. For this reason, as described above with respect to FIG. 15, even if the stage 254 and the bonding member 152a have a non-transmissivity with respect to the laser beam, for example, only the side of the bonding member 102b having transparency to the laser beam is laser light. The joining members can be joined together by irradiating.

FIG. 18 is a schematic cross-sectional view of the bonded structure according to another modification of the present embodiment, in an enlarged manner, viewed from the front. FIG. 18 corresponds to the sectional view B-B shown in FIG. 7 similarly to FIG.

In the joining interface with the joining member 102a in the joining member 174 of this modification, the groove part 178a is annularly formed in the annular joining member 174 similarly. On the other hand, the groove part is not formed in the bonding interface with the bonding member 102b in the bonding member 174 like the bonding member 104 shown in FIG. And the groove part 178b is formed in the bonding interface with the bonding member 174 in the bonding member 172b which contacted the upper surface of the bonding member 174. As shown in FIG. This groove portion 178b is formed in the annular joining member 174 in an annular manner as well. The other structure is the same as that of the bonded structure shown in FIG. 8 and FIG.

According to this modification, since only the groove part 178a is formed in the annular joining member 174, the intensity | strength (stiffness) of the joining member 174 can be kept larger. For this reason, when carrying in or installing the joining member 174, it can further prevent that the joining member 174 is deformed. On the other hand, although the groove part 178b is formed in the joining member 172b, since the joining member 172b has a plate shape, there is little possibility that the intensity | strength (stiffness) will fall large.

Between the joining member 172b and the joining member 174, there exists a space by the groove part 178b formed in the joining member 172b. In addition, a space due to the groove 178a exists between the joining member 102a and the joining member 174. In the joining member 174, a through hole 184 communicating with the groove 178a and the upper surface is formed.

For this reason, also in this modification, by operating the pump 206, the space (space by the groove part 178a) between the joining member 102a and the joining member 174 can be reduced. Moreover, since the through-hole 184 is formed in the joining member 174, the space between the joining member 172b and the joining member 174 via this through-hole 184 (space by the groove part 178b). The pressure can also be reduced. And by the above-mentioned action, the bonding member 102a and the bonding member 174 can be easily brought into close contact. In addition, the bonding member 172b and the bonding member 174 can be easily brought into close contact with each other. In this state, the bonding members can be bonded to each other by irradiating the laser light only on the side of the bonding member 172b having transparency to the laser beam.

On the other hand, in the modified example shown in FIG. 17 and FIG. 18, although the some light absorbing material is provided in the bonding interface, as mentioned above regarding FIG. 13, only one light absorbing material may be provided in each bonding interface, respectively. Even in this case, the joining members can be joined by bringing the joining members into close contact and irradiating the laser light only on the joining member side having transparency to the laser beam.

Next, the irradiation method of a laser beam is demonstrated, referring drawings.

It is a schematic diagram for demonstrating the laser beam irradiation method.

On the other hand, Fig.19 (a) is the plan schematic diagram which looked at the bonding structure enlarged from the top, and is corresponded to the schematic diagram seen from the direction of arrow A shown in FIG. FIG. 19B is a side view schematically illustrating the bonded structure in an enlarged manner from the front, and corresponds to the cross-sectional view taken along line B-B in FIG. 7.

As one method of irradiating a laser beam, as shown to FIG. 15 (b), the method of irradiating from the laser optical system corresponding to the light absorbing material 106a, 106b, 106c, 106d, respectively is mentioned. In contrast, in the present irradiation method, the light absorbing material 106a and the light absorbing material 106b are irradiated with the laser light 120a output from one laser optical system. In addition, the laser light 120b outputted from the other laser optical system is irradiated to the light absorbing material 106c and the light absorbing material 106d.

As shown in FIG. 19, the focal position of the laser light 120a is approximately the midpoint of the up and down direction of the light absorbing material 106a and the light absorbing material 106b, and the focal position of the laser light 120b is the light absorbing material ( It is approximately an intermediate point of the up-down direction of 106c) and the light absorber 106d. This substantially coincides with an approximately midpoint between the upper surface and the lower surface of the joining member 104. In this way, even if the focal position of the laser beams 120a and 120b is not present at the formation position (installation position) of the light absorbers 106a, 106b, 106c and 106d, the light absorbers 106a, 106b, 106c and 106d are the laser beams ( There is sufficient energy to absorb and heat or dissolve 120a and 120b).

And the laser beam 120a in the light absorber 106a and the light absorber 106b is set by setting the focal position of the laser light 120a to the substantially midpoint of the up-down direction of the light absorber 106a and the light absorber 106b. The irradiation energy of) can be made approximately uniform. Similarly, by setting the focal position of the laser light 120b to approximately halfway between the light absorbing material 106c and the light absorbing material 106d in the vertical direction, the laser light is absorbed in the light absorbing material 106c and the light absorbing material 106d. The irradiation energy of 120b can be made substantially uniform.

Subsequently, the laser beams 120a and 120b are irradiated to the light absorbers 106a and 106b and the light absorbers 106c and 106d at substantially the same time, respectively, and the bonding members 102a and 102b as shown by the arrow shown in Fig. 19A. , The laser light system 120b can be irradiated over the entire circumference of the annular light-absorbing materials 106a, 106b, 106c, and 106d by appropriately moving the laser optical system substantially in parallel with. As a result, the joining member 102a and the joining member 104 can be joined over the whole perimeter, and the joining member 102b and the joining member 104 can be joined over the whole perimeter.

Thereby, even when joining four junction parts, it can join by two laser optical systems. For this reason, the number of installations of a laser optical system can be reduced and a bonding apparatus can be simplified. In addition, since the laser beam 120a, 120b of substantially uniform energy can be irradiated to each of the light absorbing materials 106a, 106b, 106c, and 106d, it is possible to obtain approximately the same bonding strength at each joint. For this reason, control of joining conditions becomes easier. In addition, since the light absorbing materials 106a, 106b, 106c, and 106d can be irradiated with a laser beam at about the same time to generate heat, and bonded to each other, the influence of the distortion of the joining member on the joint can be suppressed rather than individually irradiated to generate heat. have. For this reason, larger joining strength can be obtained between joining members. As a result, the reliability of joining can be improved.

On the other hand, the light absorbing materials 106a and 106b absorb light when the bonding member 104 is viewed perpendicularly to its upper surface (bonding interface with the bonding member 102b) or lower surface (bonding interface with the bonding member 102a]. One end of the ash 106a (first light absorber) and one end of the light absorber 106b (second light absorber) may be formed to substantially coincide with each other. That is, the light absorbing materials 106a and 106b may not be formed so as not to overlap each other when the bonding member 104 is viewed perpendicularly to the upper surface or the lower surface thereof.

In this case, one laser optical system is shown in Figs. 19A and 19B at a portion where one end of the light absorber 106a and one end of the light absorber 106b are substantially coincident with each other. The laser light 120a output from the light absorber 106a and the light absorber 106b can be irradiated. The laser light 120a can be irradiated over the entire circumference of the annular light absorbers 106a and 106b by appropriately moving the laser optical system in parallel with the bonding members 102a, 102b and 104. As a result, either one of the inner circumferential end and the outer circumferential end of the bonding portion (first bonding portion) in the light absorber 106a and the other of the inner circumferential edge and the outer circumferential edge of the bonding portion (second bonding portion) in the light absorber 106b are planar. Seen in roughly identical. This also applies to the junction part in the light absorber 106c and the junction part in the light absorber 106d.

In addition, one end portion of the light absorber 106a and one end portion of the light absorber 106b may overlap so that the laser light 120a output from one laser optical system can be irradiated at about the same time. Even in this case, when the bonding member 104 is viewed vertically with respect to the upper or lower surface thereof, the laser beam 120a outputted from one laser optical system at the boundary between the light absorbing member 106a and the light absorbing member 106b. Can be investigated. As a result, either one of the inner circumferential end and the outer circumferential end of the joint in the light absorber 106a and the other of the inner circumferential end and the outer circumferential end of the joint in the light absorber 106b coincide substantially in plan view. This also applies to the light absorbing materials 106c and 106d.

It is a schematic diagram for demonstrating the other irradiation method of a laser beam.

On the other hand, FIG. 20A is a plan view schematically illustrating the bonded structure enlarged from above, and corresponds to the schematic view seen from the direction of arrow A shown in FIG. 7. FIG. 20B is a side schematic view of the bonded structure, seen from an enlarged front, and corresponds to the cross-sectional view B-B shown in FIG. 7.

Here, the case where three plate-shaped joining members 102a, 102b, 102c are joined is considered. An annular joining member 104a is sandwiched between the joining member 102a and the joining member 102b, and an annular joining member 104b is sandwiched between the joining member 102b and the joining member 102c.

Therefore, in this irradiation method, the light absorbing material 106a and the light absorbing material 106b are irradiated with the laser light 120a output from one laser optical system. In addition, the laser light 120b outputted from the other laser optical system is irradiated to the light absorbing material 106c and the light absorbing material 106d. Further, the laser light 120c outputted from the other laser optical system is irradiated to the light absorbing material 106e and the light absorbing material 106f. Further, the laser light 120d outputted from the other laser optical system is irradiated to the light absorbing material 106g and the light absorbing material 106h.

As shown in FIG. 20, the focal position of the laser light 120a is approximately the midpoint of the up and down direction of the light absorbing material 106a and the light absorbing material 106b, and the focal position of the laser light 120b is the light absorbing material ( It is approximately an intermediate point of the up-down direction of 106c) and the light absorber 106d. The focal position of the laser light 120c is approximately the midpoint of the up and down direction of the light absorber 106e and the light absorber 106f, and the focal position of the laser light 120d is the light absorber 106g and the light absorber 106h. It is the midpoint of the up and down direction of). These focal positions are substantially coincident with approximately intermediate points in the vertical direction of the upper and lower surfaces of the bonding members 104a and 104b, respectively.

According to this, as described above with respect to FIG. 19, the irradiation energy of the laser light 120a in the light absorber 106a and the light absorber 106b, and the laser light in the light absorber 106c and the light absorber 106d. The irradiation energy of 120b, the irradiation energy of the light absorbing material 106e and the laser light 120c in the light absorbing material 106f, and the laser light 120d in the light absorbing material 106g and the light absorbing material 106h. The irradiation energy of can be made approximately uniform.

Subsequently, as shown by the arrow shown in FIG. 20 (a), the light absorbers 106a and 106b formed annularly by appropriately moving the laser optical system substantially in parallel with the bonding members 102a, 102b, 102c, 102d, 104a, and 104b. Laser beams 120a, 120b, 120c, and 120d can be irradiated over the entire circumference of the lines 106c, 106d, 106e, 106f, 106g, and 106h. As a result, the joining members can be joined over the entire circumference.

Thereby, even when joining three plate-shaped joining members, the joining members can be joined together through two annular joining members by irradiating a laser beam only from one side. In addition, as shown in Fig. 20B, even in the case of joining eight joint parts, the joining can be performed by four laser optical systems. For this reason, the number of installations of a laser optical system can be reduced and a bonding apparatus can be simplified.

Furthermore, as shown in Fig. 20A, the laser beam 120a and the laser beam 120c are irradiated slightly back and forth in the advancing direction, and the laser beam 120b and the laser beam 120d are slightly advancing in the advancing direction. By irradiating from the front and the back, a laser beam can be irradiated more extensively about the advancing direction. In addition, with respect to other effects, the same effects as those described above with respect to FIG. 19 can be obtained.

Also in the present irradiation method, as described above with respect to FIG. 19, the light absorbing materials 106a and 106b have the bonding member 104 on its upper surface (bonding interface with the bonding member 102b) or on the lower surface (bonding member ( 102a) is formed such that one end of the light absorber 106a (first light absorber) and one end of the light absorber 106b (second light absorber) substantially coincide with each other when viewed perpendicularly. You may be. In addition, one end portion of the light absorber 106a and one end portion of the light absorber 106b may overlap so that the laser light 120a output from one laser optical system can be irradiated at about the same time. This also applies to the light absorbing materials 106c, 106d, 106e, 106f, 106g, and 106h.

On the other hand, in the laser beam irradiation method described above with reference to FIGS. 19 and 20, the focal position of the laser beam is set at approximately an intermediate point in the vertical direction of the light absorbing material, but is not limited thereto. For example, the laser light irradiated from the optical system which enables plural focal points can be irradiated to the light absorber 106a and the light absorber 106b, respectively. That is, laser light having different foci irradiated from one optical system can be irradiated to the light absorbing member 106a and the light absorbing member 106b, respectively.

In this case, the distance (pitch) between two laser beams having different focal points can be easily changed by rotating the optical system about one central axis. For this reason, it can respond flexibly with respect to the width | variety, the magnitude | size, or these installation positions of the light absorber 106a and the light absorber 106b.

Also in this case, since the number of installations of the laser optical system can be reduced, the bonding apparatus can be simplified. In addition, since the laser beam of substantially uniform energy can be irradiated to each light absorbing material, about the same bonding strength can be obtained in each joining part.

21 is a schematic diagram illustrating a joining method according to a modification of the present embodiment.

22 is the cross-sectional schematic diagram which looked at the bonding structure put on the stage and expanded from the front.

21 and 22 correspond to B-B sectional drawing shown in FIG.

In the bonding method which concerns on this modification, it bonds by irradiating a laser beam, keeping the bonding members in close contact using the chamber 200. In the chamber 200 shown in FIG. 21, the laser incident windows 202 that can transmit the laser beams 120a and 120b and the joining members 172a, 102b and 194 can be arranged and positioned in three axes. It has a stage 234 and a valve 208 which can open or close the inside of the chamber 200.

As shown in FIG. 22, in the joining member 194, the grooves 198a and 198b are annularly similar to the annular joining member 194 at the joining interface between the joining member 172a and the joining member 102b. Each is formed. On the other hand, like the joining member 104 shown in FIG. 9, the through-hole which communicates the groove part 198a and the groove part 198b is not formed. Moreover, the exhaust hole which forms an exhaust path is not formed in the joining member 172a, and the exhaust hole which forms an exhaust path is not formed in the stage 234, either.

Therefore, first, the joining members 172a, 102b, and 194 are appropriately loaded into the chamber 200. Subsequently, the inside of the chamber 200 is reduced in pressure to close the valve 208, and the joining member 172a, the joining member 194, and the joining member 102b are superimposed in this order as it is. Accordingly, the space 150 surrounded by the joining member 102a, the joining member 102b, and the joining member 104, and the space between the joining member 172a and the joining member 194 (space by the groove portion 198a) ] And the space between the joining member 102b and the joining member 194 (space by the groove portion 198b) become a substantially closed space at reduced pressure. Then, the valve 208 is opened again to increase the pressure inside the chamber 200.

Then, a pressure difference arises between the internal pressure and the external pressure of the space 150 surrounded by the joint member 172a, the joint member 102b, and the joint member 194. In addition, a pressure difference occurs between the internal pressure and the external pressure of the space by the grooves 198a and 198b.

At this time, it is not necessary to raise the pressure inside the chamber 200 to atmospheric pressure. In at least one of between the internal pressure and the external pressure of the space 150 and between the internal pressure and the external pressure of the space by the grooves 198a and 198b, such that there is a pressure difference that can bring the bonding members into close contact with each other, The internal pressure of the chamber 200 may be increased. According to this, by keeping the inside of the chamber 200 at a certain pressure reduction state, the chamber 200 is formed on the surfaces of the joining members 172a, 102b, 194 by the heat insulating effect of the vacuum described above with reference to FIGS. 8 to 10. It is possible to suppress the diffusion of heat into the interior.

In this way, the joining members 172a, 102b, and 194 are in close contact with each other. In this state, by the laser beam irradiation method described above with reference to Figs. 15B, 19, and 20, the light absorbing members 106a, 106b, 106c, and 106d are only simultaneously joined to the bonding member 102b. The laser beams 120a and 120b are irradiated respectively.

According to this, the joining members can be brought into close contact with each other without forming a through hole in the joining member 194 communicating with the groove 198a and the groove 198b. In addition, the joining members can be brought into close contact with each other without forming an exhaust hole for forming an exhaust path in the joining member 172a or the stage 234. For this reason, the process of processing a through hole in the joining member 194 can be skipped, and the process of processing an exhaust hole in the joining member 172a and the stage 234 can be skipped. That is, the efficiency of a joining operation can be improved. In addition, the shapes of the joining members 172a and 194 and the stage 234 can be simplified.

In this way, the bonding members can be brought into close contact with each other, whereby the heat transfer can be prevented from being lowered due to the gap present at the bonding interface. As a result, larger joint strength can be obtained between joining members, and the reliability of joining can be improved. In addition, as described above, since the inside of the chamber 200 is kept at a reduced pressure level to some extent, heat is less likely to diffuse to the periphery due to the vacuum insulation effect, so that the light absorbers 106a, 106b, 106c, and 106d are used. The heat generated in the heat transfer) is efficiently transmitted to the bonding members 172a, 102b, and 194, respectively. As a result, larger bonding strength can be obtained between the joining members. Moreover, since it is not necessary to perform excessive heat input, the damage to the joining members 172a, 102b, and 194 can be suppressed by the influence of heat.

23 is a block diagram illustrating the configuration of a bonding apparatus according to the present embodiment. The bonding apparatus according to the present embodiment includes optical systems 222a and 222b (energy irradiation means) having an optical element such as a lens for condensing laser light as a heating source and irradiating a predetermined position, respectively, and a laser oscillator for outputting laser light. 224a and 224b, power sources 226a and 226b for applying driving power of arbitrary magnitude to the laser oscillators 224a and 224b, and an optical system that can adjust the positions of the optical systems 222a and 222b in three axis directions, respectively. The driving units 228a and 228b (positioning means), the stage driving unit 210 (positioning means) capable of adjusting the position of the stage in three axis directions, and the laser oscillators 224a and 224b by the power sources 226a and 226b. A control unit 230 for controlling the driving power applied to the) is provided.

Moreover, the chamber 200 and the pump 206 are suitably equipped with the method of contact | adhering a joining member by decompressing the groove part formed in the joining interface as mentioned above. On the other hand, although the bonding apparatus shown in FIG. 23 is equipped with two optical systems 222a and 222b, it is not limited only to this, You may comprise three or more optical systems according to the number of site | parts of a junction part. In addition, only one optical system may be provided. In this case, the power supply, the laser oscillator and the optical system driving unit may each be provided one by one.

The control unit 230 may control the power supplies 226a and 226b to change and change the pulse shape, the pulse width, and the like of the laser lights 120a and 120b according to an instruction from the user. In other words, the pulse shapes of the laser beams 120a and 120b output from the laser oscillators 224a and 224b are controlled in accordance with the waveform of the driving power applied by the power sources 226a and 226b. Under control by the control unit 230, the waveform of the driving power applied to the laser oscillators 224a and 224b by the power sources 226a and 226b is changed, so that the predetermined peak output and energy density from the laser oscillators 224a and 224b are changed. The laser beams 120a and 120b having the output are output.

In addition, the controller 230 may control operations of the optical system drivers 228a and 228b. That is, the control unit 230 can control the optical system drive units 228a and 228b so that the laser beams 120a and 120b are irradiated to a predetermined position based on the position information of the bonding member set in advance. In addition, the controller 230 may control the operation of the stage driver 210. In other words, the irradiation positions of the laser beams 120a and 120b may be adjusted in the three-axis direction by the control unit 230 controlling the position of the stage through the stage driver 210. According to this, at least one of the optical system driving units 228a and 228b (positioning means) and the stage driving unit 210 (positioning means) determines the relative positions of the bonding member and the optical systems 222a and 222b (energy irradiation means). You can decide.

In addition, the bonding apparatus shown in FIG. 23 may further be provided with optical elements, such as a camera which is not shown in figure in order to acquire the image of a bonding member. According to this, the image data photographed by the camera is output to the control part 230, and image analysis is carried out. And based on the result, the control part 230 can control the optical system drive part 228a, 228b so that the laser beam 120a, 120b may be irradiated to a predetermined position. By doing in this way, laser beam 120a, 120b can be irradiated to a predetermined position more accurately in a short time.

24 is a block diagram illustrating the configuration of a bonding apparatus according to a modification of the present embodiment.

In the bonding apparatus according to the present modification, electricity or gas is used as the heating source instead of the laser light. That is, the heating source in the joining method of a some bonding member is not limited only to a laser beam.

Therefore, the bonding apparatus which concerns on this modification is equipped with the emission system 245 (energy irradiation means) which discharge | releases electricity, gas, etc. as a heating source. In addition, the power supply 241 for applying the driving power of arbitrary magnitude to the emission system 245, and the emission system driver 247 (positioning means) which can adjust the position of the emission system 245 in three axes, respectively. And a stage driver 210 (positioning means) capable of adjusting the position of the stage in the three-axis direction, and a controller 230 for controlling driving power applied to the emission system 245 by the power source 241. Doing. Moreover, the chamber 200 and the pump 206 are suitably equipped with the method of contact | adhering a joining member by decompressing the groove part formed in the joining interface as mentioned above.

The control unit 230 may control the power source 241 to change the setting of the output of the heating source 249 such as electricity or gas according to an instruction from the user. That is, the heating source 249 emitted from the emission system 245 is controlled in accordance with the driving power applied by the power source 241.

In addition, the controller 230 may control the operation of the emission meter driver 247. That is, the control unit 230 can control the emission meter drive unit 247 so that the heating source 249 is discharged to a predetermined position based on the position information of the bonding member set in advance. In addition, the controller 230 may control the operation of the stage driver 210. That is, the discharge position of the heating source 249 may be adjusted in the three-axis direction by the control part 230 controlling the position of the stage through the stage drive part 210. According to this, at least one of the emission system driver 247 (positioning means) and the stage driver 210 (positioning means) can determine the relative positions of the joining member and the emission system 245 (energy irradiation means). have. On the other hand, as described above with respect to FIG. 23, the bonding apparatus of this modification may further include optical elements such as a camera (not shown) for acquiring an image of the bonding member.

According to the bonding apparatus shown in FIG. 24, by releasing electricity, gas, etc. as a heating source to a predetermined position, at least one of the some joining members melts and solidifies, and a joining part is formed. As a result, a plurality of joining members are joined at the joining portion. In addition, since the bonding apparatus of this modification is bonded using heat similarly to the bonding apparatus using a laser beam, the above-mentioned vacuum insulation effect can be obtained.

That is, by keeping the inside of the chamber 200 at a reduced pressure level to some extent, heat is less likely to diffuse to the periphery due to the vacuum heat insulating effect, so that heat by electricity or gas or the like is efficiently transmitted to the joining member. As a result, larger bonding strength can be obtained between the joining members. Moreover, since it is not necessary to perform excessive heat input, the damage which the influence of heat affects a joining member can be suppressed.

As described above, according to the present embodiment, the space between the joining member 102a and the joining member 104 (the space by the groove 108a) and the space between the joining member 102b and the joining member 104 [ The space by the groove 108b can be reduced in pressure using the pump 206. For this reason, when joining bonding members or a joining member and a light absorber, it can contact easily. According to this, it can prevent that heat transfer falls by the clearance gap which exists in a joining interface. As a result, larger joint strength can be obtained between joining members, and the reliability of joining can be improved.

In addition, by using the chamber 200, the space 150 surrounded by the joining member 102a, the joining member 102b, and the joining member 104 can be formed without forming a through hole or an exhaust hole in the joining member or the stage. The space by the grooves 198a and 198b can be reduced in pressure. For this reason, when joining bonding members or a joining member and a light absorber, it can contact easily. Thereby, the above-mentioned effect can also be obtained.

In addition, when the bonding members 104, 124, 154, 174, and 194 are viewed perpendicular to the upper surface or the lower surface thereof, the light absorbing members are formed so as not to overlap each other. For this reason, even if the member of one outermost layer has a non-transmissivity with respect to a laser beam, a laser beam can be irradiated only at the member side of the other outermost layer which has transparency to a laser beam, and can join members.

In the above, embodiment of this invention was described. However, the present invention is not limited to these techniques. The design changes appropriately made by those skilled in the art to the above-described embodiments are included in the scope of the present invention as long as they have the features of the present invention. For example, the shape, dimension, material, arrangement | positioning, etc. of the each element with a bonding apparatus etc., the installation form of a light absorber, etc. are not limited to what was illustrated, and can be changed suitably.

In addition, the material and shape of a to-be-processed object are not limited to what was illustrated, and can be changed suitably. The workpiece is not limited to light emitting panels such as PDPs, SEDs, FEDs, organic EL displays, and the like, and may be, for example, solar cells or secondary batteries. And as a material which has transparency to a laser beam, the glass etc. which are used for a light emitting panel, a solar cell panel, etc. are mentioned, for example. On the other hand, as a material which is non-transmissive with respect to a laser beam, metal, such as a can used for a secondary battery, resin, such as a water tank, is mentioned, for example.

In addition, as mentioned above, the joining member 104 etc. which are pinched by the plate-shaped joining member 102a and the joining member 102b are not limited to an annular shape, You may have a plate shape.

In addition, each element with which each embodiment mentioned above can be combined in the technically possible range, and combining these elements is also included in the scope of the present invention, as long as it contains the characteristics of this invention.

According to the present invention, there is provided a joining structure, a joining method, and a joining device, which can be easily brought into contact with each other when joining the joining members or the joining member and the light absorber.

101a, 101b, 101c, 101d, 101e, 101f, 101g: joining member
102a, 102b, 102c, 104, 104a, 104b: joining member
106a, 106b, 106c, 106d, 106e, 106f, 106g, 106h: Light absorbing material
108a, 108b, 108d, 108e, 108g: groove portion
112, 112a, 112c, 112e, 112f: exhaust holes
114: through hole
120, 120a, 120b, 120c, 120d: laser light
124, 132a, 134: joining member
136a, 136b: light absorbing material
138a, 138b, 138c, 138d: groove
142a, 142b: exhaust hole
144a, 144b: through hole
150: space
152a, 154: joining member
156a, 156b, 156c, 156d, 156e, 156f, 156g: Light absorbing material
158a, 158b, 158c, 158d, 158e: groove portion
162a, 162b, 162c: exhaust hole
164a, 164b: through hole
172a, 172b, 174: joining member
178a, 178b: groove
184: through hole
194: joining member,
198a, 198b: groove
200: chamber
202: laser entrance window
204: stage
206: Pump
208: Valve
210: stage driving unit
214: exhaust hole
222a, 222b: optical system
224a, 224b: Laser Oscillator
226a, 226b: power
228a, 228b: optical system driver
230: control unit
234, 254: stage
241: power
245: emission meter,
247: emission meter drive unit
249: heating source
264, 264a, 264b, 264c, 274, 274a, 274b, 274c: exhaust hole
284 stage

Claims (23)

The first joining member,
And a second joining member,
At least one of the said 1st bonding member and the said 2nd bonding member is equipped with the groove part in the bonding interface between the said 1st bonding member and the said 2nd bonding member,
The joining structure, wherein the first joining member and the second joining member are joined in a state where the space of the groove is reduced in pressure, and the first joining member and the second joining member are in close contact with each other. The said 1st joining member is equipped with the exhaust hole which forms an exhaust path,
The first joining member and the second joining member are joined to each other in a state where the space of the groove portion is reduced in pressure through the exhaust hole, and the first joining member and the second joining member are in close contact with each other. Junction structure. The joining structure according to claim 1, wherein the first joining member and the second joining member are joined by irradiating a laser beam to a joining interface between the first joining member and the second joining member. The light absorbing material according to claim 3, further comprising a light absorbing material provided at the bonding interface,
The said 1st bonding member and the said 2nd bonding member are joined by irradiating a laser beam to the said light absorber, The bonding structure characterized by the above-mentioned. The said 2nd bonding member is a material which has permeability | transmittance with respect to a laser beam, The said 1st bonding member and said 2nd are made by irradiating a laser beam to the said light absorber through the said 2nd bonding member. A joining structure, wherein the joining member is joined. The bonding structure according to claim 4, wherein the light absorber is provided near the groove portion. The method of claim 2, further comprising a third joining member,
At least one of the said 2nd bonding member and the said 3rd bonding member is equipped with the groove part in the bonding interface between the said 2nd bonding member and the said 3rd bonding member,
The second joining member is sandwiched between the first joining member and the third joining member, the groove portion at the joining interface between the first joining member and the second joining member, and the second joining member; Further provided with a through hole for communicating the groove between the third bonding member,
The space of the groove portion between the first bonding member and the second bonding member and the space of the groove portion between the second bonding member and the third bonding member are decompressed through the exhaust hole and the through hole. And the first joining member and the second joining member are joined in a state where the first joining member and the second joining member are in close contact with each other, and the second joining member and the third joining member are in contact with each other. The joining structure, wherein the second joining member and the third joining member are joined to each other. In at least one of a 1st bonding member and a 2nd bonding member, a groove part is formed in the bonding interface between the said 1st bonding member and the said 2nd bonding member,
A joining method, characterized in that the first joining member and the second joining member are joined in a state where the space of the groove is reduced in pressure and the first joining member and the second joining member are brought into close contact with each other. The method of claim 8, wherein an exhaust hole for forming an exhaust path in the first joining member is formed,
The space | interval of the said groove part is decompressed through the said exhaust hole, and the said 1st bonding member and the said 2nd bonding member are joined in the state which contact | connected the said 1st bonding member and the said 2nd bonding member, The joining characterized by the above-mentioned. Way. The bonding method according to claim 8, wherein the decompression is performed by a chamber capable of maintaining a reduced pressure atmosphere. The pressure in the chamber according to claim 10, wherein the first joining member and the second joining member are brought into the chamber, the pressure in the chamber is reduced, and the first joining member and the second joining member are brought into contact with each other. To a pressure higher than the reduced pressure and lower than atmospheric pressure to bring the pressure difference between the internal pressure of the groove portion and the external pressure of the groove portion to bring the pressure into close contact. The joining method according to claim 8, wherein the first joining member and the second joining member are joined by irradiating a laser beam to a joining interface between the first joining member and the second joining member. The bonding method according to claim 12, wherein a light absorbing material is provided at the bonding interface, and the first bonding member and the second bonding member are joined by irradiating a laser beam to the light absorbing material. The said 1st bonding member and said 2nd bonding member are joined together by irradiating a laser beam to the said light absorbing material through the 2nd bonding member which consists of a material which has permeability | transmission with respect to a laser beam. Bonding method. The said 1st bonding member and the said 2nd bonding member are bonded together by providing the said light absorber in the vicinity of the said groove part, and irradiating a laser beam to the said light absorber. The grooved portion according to claim 9, wherein at least one of the second bonding member and the third bonding member includes a groove portion at a bonding interface between the second bonding member and the third bonding member,
The second joining member is sandwiched between the first joining member and the third joining member,
A through hole communicating with the groove portion between the first bonding member and the second bonding member and the groove portion between the second bonding member and the third bonding member is further formed in the second bonding member,
The space of the groove portion between the first bonding member and the second bonding member and the space of the groove portion between the second bonding member and the third bonding member are decompressed through the exhaust hole and the through hole. And the first joining member and the second joining member are joined to each other in a state where the first joining member and the second joining member are brought into close contact with each other, and the second joining member and the third joining member are brought into close contact with each other. 2 A joining method and the said 3rd joining member are joined, The joining method characterized by the above-mentioned. The method according to claim 16, wherein a first light absorbing material is formed at the bonding interface with the first bonding member in the second bonding member,
The first light absorption when viewed in a direction perpendicular to the bonding interface with the first bonding member or the bonding interface with the third bonding member in the bonding interface with the third bonding member in the second bonding member. Forming a second light absorber having a portion which does not overlap with the ash,
A first bonding member is brought into contact with the first light absorber,
Contacting the third bonding member to the second light absorber,
By irradiating the laser light to the first and the second light absorbing material on the third bonding member side,
At least one of the first bonding member, the second bonding member, and the first light absorbing material is melted and solidified to form a first bonding portion, and the first bonding member and the second bonding member are bonded together;
At least one of the second joining member, the third joining member, and the second light absorbing material is melted and solidified to form a second joining portion, and the second joining member and the third joining member are joined. Splicing method. The said 1st bonding part and said 2nd bonding part are formed simultaneously by irradiating a part of laser beam to a said 1st light absorber, and irradiating another part of said laser light to a said 2nd light absorber. Splicing method. Energy irradiation means for discharging the heating source toward the first bonding member and the second bonding member;
Positioning means for determining a relative position of said first and second bonding members and said energy irradiation means;
In at least one of the said 1st bonding member and the said 2nd bonding member, the space of the groove part formed in the bonding interface between the said 1st bonding member and the said 2nd bonding member is decompressed, and the said 1st bonding member and the said 1st bonding member are made. Decompression means capable of bringing the two joining members into close contact,
The control part which controls the said positioning means so that the said 1st bonding member and the said 2nd bonding member may be joined by releasing the said heating source to the bonding interface between the said 1st bonding member and the said 2nd bonding member.
Bonding device comprising a. The bonding apparatus according to claim 19, wherein the heating source is a laser light. The bonding apparatus according to claim 19, wherein the decompression means is a chamber capable of maintaining a decompression atmosphere. 20. The apparatus of claim 19, further comprising a stage for disposing the first and second joining members,
The said stage is equipped with the exhaust hole which communicates with the said groove part, The bonding apparatus characterized by the above-mentioned that can depress | reduce the space by attracting the gas in the space of the said groove part through the said exhaust hole. The method of claim 20, wherein the control unit,
A first light absorbing material formed at the bonding interface with the first bonding member in the second bonding member;
In the second bonding member, perpendicular to the bonding interface with the first bonding member or the bonding interface with the third bonding member, to the bonding interface with the third bonding member made of a material having transparency to the laser beam. When viewed from the phosphorus direction, in the second light absorber formed to have a portion which does not overlap with the first light absorber,
By irradiating a laser beam from the third bonding member side, the positioning means is controlled to bond the first bonding member and the second bonding member and to bond the second bonding member and the third bonding member. ,
The focal position of the laser beam is set at approximately an intermediate point in the vertical direction of the first light absorbing material and the second light absorbing material.

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