JP2005208175A - Optical component and manufacturing method thereof, optical module, optical communication apparatus, and electronic appliance - Google Patents

Optical component and manufacturing method thereof, optical module, optical communication apparatus, and electronic appliance Download PDF

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JP2005208175A
JP2005208175A JP2004012437A JP2004012437A JP2005208175A JP 2005208175 A JP2005208175 A JP 2005208175A JP 2004012437 A JP2004012437 A JP 2004012437A JP 2004012437 A JP2004012437 A JP 2004012437A JP 2005208175 A JP2005208175 A JP 2005208175A
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optical
base material
step
optical component
region
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Eiichi Fujii
Tomoko Koyama
智子 小山
永一 藤井
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Seiko Epson Corp
セイコーエプソン株式会社
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Abstract

PROBLEM TO BE SOLVED: To provide an optical component that can be easily manufactured and reduced in cost, and a manufacturing method thereof.
An optical component (10) having a function of connecting an optical path (30) and a plurality of optical elements (20), comprising: a light-transmitting base material (11); Each of the plurality of optical elements emits light emitted from the light path into the base material between the one surface on which the optical path is to be disposed and the other surface on which the optical path is to be disposed. Or a diffractive optical element (12) having a function of guiding the light emitted from the optical element into the base material to the optical path, and the position where each of the optical elements should be arranged on one surface of the base material An optical component set at one of rotationally symmetric positions about the optical path connection point (34).
[Selection] Figure 1

Description

  The present invention relates to an optical component that is used in optical communication and has a function of optically connecting a light emitting element or a light receiving element and an optical path (such as an optical fiber), and a preferred manufacturing method thereof.

  An optical communication system basically has a configuration in which a light emitting element that converts an electrical signal into an optical signal and a light receiving element that converts an optical signal into an electrical signal are connected by an optical path such as an optical fiber. Various optical components (connectors and the like) are used to optically connect the optical path such as the light emitting element and the light receiving element with the optical path.

  Using optical branching means such as a diffractive optical element, for example, an optical connection that connects between a plurality of optical elements and an optical path by, for example, configuring the optical signal emitted from the optical path to branch in a plurality of directions A structure is realized. For example, the optical connection structure described above can be realized by interposing an optical component formed by forming a diffractive optical element in a base material such as optical glass between the optical path and each optical element. A method of forming a diffractive optical element in a substrate such as optical glass is described in, for example, Japanese Patent Application Laid-Open No. 2000-56112 (Patent Document 1). In this document, a predetermined laser beam is irradiated into a substrate such as optical glass to modify the irradiated portion, thereby generating a three-dimensional distribution of the refractive index, thereby diffracting the refractive index distribution. A method of forming an optical element is disclosed.

JP 2000-56112 A

  In order to realize the diffractive optical element having the light branching function as described above, it is necessary to design a relatively complicated diffraction pattern. Such a diffraction pattern tends to become more complex as the number of optical elements increases and the number of branches of the optical signal increases. Such a complicated diffraction pattern design is not so easy, and it is difficult to reduce the cost. In addition, when forming a diffractive optical element in a substrate by the above-described technique, it is necessary to control the formation conditions such as laser light irradiation conditions relatively accurately, so that the pattern of the diffractive optical element is complicated. Indeed, the manufacture is not easy, and this also hinders cost reduction.

  Accordingly, an object of the present invention is to provide an optical component that can be easily manufactured and reduced in cost, and a method for manufacturing the optical component.

  The first aspect of the present invention is an optical component having a function of connecting an optical path and a plurality of optical elements, each having a light-transmitting base material and the optical elements of the base material disposed thereon. A light that is formed between the one surface and the other surface on which the light path is to be disposed and is formed inside the base material, and is emitted from the light path into the base material is one of the plurality of optical elements. Or a diffractive optical element having a function of guiding light emitted from the optical element into the base material to the optical path, and each of the optical elements should be disposed on one surface of the base material. Is an optical component set at one of rotationally symmetric positions about the connection point of the optical path.

  The position where each optical element should be placed is set to a rotationally symmetric position around a predetermined position, in other words, a highly symmetric position, so that the diffraction pattern of the diffractive optical element is relatively simplified and designed. And easy to manufacture. Therefore, an optical component that is easy to manufacture and can be manufactured at a low cost is obtained.

  The substrate preferably has a first recess corresponding to a position where each of the optical elements is to be disposed.

  This facilitates positioning when mounting the optical element.

  It is preferable that the base material has a second recess corresponding to a position where the light path is to be disposed.

  This makes it possible to support an optical path such as an optical fiber by the optical component itself, which is convenient because it is not necessary to separately combine a member (socket or the like) for supporting the optical path.

  The diffractive optical element is preferably formed by giving a three-dimensional refractive index distribution to a predetermined region in the substrate.

  Thereby, it becomes easy to obtain the diffractive optical element disposed inside the substrate.

  The second aspect of the present invention is an optical module including the optical component according to the present invention described above and a plurality of optical elements arranged at predetermined positions of the optical component. As a result, an optical module that is easy to manufacture and can be reduced in cost can be obtained.

  The third aspect of the present invention is an optical communication apparatus (optical transceiver) including the optical module according to the present invention as described above and further including a drive circuit for driving an optical element and other elements as appropriate. Such an optical communication device according to the present invention is used for various electronic devices that perform information communication with an external device or the like using light as a transmission medium, such as a personal computer or a so-called PDA (portable information terminal device). It is possible. In this specification, the term “optical communication device” refers not only to a device that includes both a configuration related to transmission of signal light (such as a light emitting element) and a configuration related to reception of signal light (such as a light receiving element). It includes an apparatus having only such a configuration (so-called optical transmission module) and an apparatus having only a configuration relating to reception (so-called optical reception module).

  The fourth aspect of the present invention is an electronic apparatus including the above-described optical component, optical module, or optical communication device. Here, “electronic device” refers to a device in general that realizes a certain function using an electronic circuit or the like, and its configuration is not particularly limited. For example, a personal computer, a PDA (portable information terminal), an electronic device, etc. Various devices such as notebooks are listed.

  The fifth aspect of the present invention is a preferred method for manufacturing an optical component according to the first aspect. Specifically, the present invention is provided in a light transmissive substrate having one surface on which a plurality of optical elements are to be disposed and the other surface on which the light path is disposed, and the substrate. A diffractive optical element having a function of guiding light emitted from the optical path into the base material to any of the plurality of optical elements, or guiding light emitted from the optical element into the base material to the optical path. A position where each of the optical elements is to be arranged is on one side of the base material and a rotationally symmetric position about the connection point of the optical path The first step of setting (designing) the pattern of the diffractive optical element so as to be any one of the above, and irradiating the inside of the substrate with laser light while scanning the focal point corresponding to the pattern, By altering the area irradiated with laser light, Comprising a second step of forming an optical element, and a method for manufacturing an optical component.

  The position where each optical element should be placed is set to a rotationally symmetric position around a predetermined position, in other words, a highly symmetric position, so that the diffraction pattern of the diffractive optical element is relatively simplified and designed. And easy to manufacture. Therefore, it becomes easy to manufacture the optical component, and the manufacturing cost can be reduced.

  In the second step, it is preferable that the diffractive optical element is formed by causing a difference in refractive index between the region irradiated with the laser light and the other region.

  Thereby, a diffractive optical element can be formed relatively easily.

  As the laser beam in the second step, it is preferable to employ a pulsed laser beam.

  By using pulsed laser light, it is possible to minimize unnecessary energy application to parts other than the region of the base material to be irradiated with the laser light.

  Various materials can be used as the base material, but when the base material is made of glass, the pulse width of the above-described pulse laser beam is in the femtosecond order (for example, several tens to several hundreds). It is preferable to use a femtosecond laser beam that is femtosecond).

  By using femtosecond laser light, it is possible to locally change the desired position of the substrate made of glass to cause a change in refractive index. This makes it possible to form a pattern (refractive index distribution) with high accuracy even when the pattern of the diffractive optical element is fine and complicated.

  Moreover, it is preferable to further include a third step of forming a first recess at a position where each of the optical elements on the one surface of the substrate is to be disposed.

  This makes it possible to ensure the positional accuracy of the optical element at the stage where the first recess is formed, thus greatly simplifying the alignment when mounting the optical element on the optical component, and omitting it in some cases. It becomes possible.

  The third step includes a laser beam irradiation step of irradiating a region where the first concave portion of the substrate is to be formed with a laser beam to alter the region, and a region altered by the laser beam irradiation (degeneration). And an etching step of removing the region by etching.

  As a result, the first recess can be formed with higher accuracy. Further, the laser light irradiation step in the formation of the diffractive optical element and the laser light irradiation step in the third step can be performed in parallel or continuously by the same apparatus or the like, so that the process can be simplified. Convenient from the point of view.

  Moreover, it is more preferable to perform the laser beam irradiation step in the third step before the second step.

  Since the irradiation of the laser beam to the altered region for forming the first recess is performed first, the refractive index distribution pattern constituting the diffractive optical element is not affected, so that a more precise refractive index This is convenient when forming a distribution.

  Moreover, it is preferable to further include a fourth step of forming a second recess at a position where the optical path on the other surface side of the base material is to be disposed.

  Thereby, the structure which can support optical paths, such as an optical fiber, with optical components itself is obtained. This is convenient because it is not necessary to separately combine a member (socket or the like) for supporting the light path. Moreover, since it becomes possible to ensure the positional accuracy of the optical path at the stage where the second recess is formed, the alignment when connecting the optical path to the optical component is greatly simplified and may be omitted in some cases. Is possible.

  The fourth step includes a laser beam irradiation step of irradiating a region where the second concave portion of the base material is to be formed with a laser beam to alter the region, and a region altered by the laser beam irradiation (degeneration). And an etching step of removing the region by etching.

  As a result, the second recess can be formed with higher accuracy. Further, the laser light irradiation step in the formation of the diffractive optical element and the laser light irradiation step in the fourth step can be performed in parallel or continuously by the same apparatus or the like, so that the process can be simplified. Convenient from the point of view.

  Moreover, it is preferable to perform the laser beam irradiation step in the fourth step before the second step.

  Since the refractive index distribution constituting the diffractive optical element is not affected by the irradiation of the laser beam applied to the altered region for forming the second concave portion first, a more precise refractive index distribution can be obtained. Convenient for forming.

  Embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a diagram illustrating the configuration of an optical component according to an embodiment and an optical module including the optical component. FIG. 1A shows a cross-sectional view of the optical module of the present embodiment, and FIG. 1B shows a plan view (top view) of the optical module. Note that FIG. 1A illustrates a cross section in the direction of the aa line illustrated in FIG.

  The optical module shown in FIG. 1 includes an optical component 10 composed of a translucent base material 11 and a plurality of optical elements 20 arranged on one surface side of the base material 11. Here, the optical element 20 includes a light emitting element such as a VCSEL (surface emitting laser) and a light receiving element such as a photodiode or a phototransistor.

  The optical component 10 has a function of optically connecting between an optical path 30 such as an optical fiber and each of the plurality of optical elements 20, and includes a diffractive optical element 12 therein. As the base material 11 constituting the optical component 10, various materials can be used as long as they are substantially transparent with respect to the wavelength of an optical signal emitted or received by the optical element 20 and can obtain a desired mechanical strength. It is possible to use. Examples of such a material include polymer materials such as glass and acrylic resin, and anisotropic materials such as quartz. In this embodiment, the optical component 10 is comprised using the base material 11 which consists of optical glass.

  In addition, the substrate 11 includes a first recess 14 corresponding to a position where each of the optical elements 20 should be disposed, and a second recess 16 corresponding to a position where the optical path 30 should be disposed. As illustrated, each optical element 20 is arranged so as to be embedded in each first recess 14. The optical path 30 is disposed so that the end portion is embedded in the second recess 16 and is fixed to the base material 11 by a fixing material 32 such as an adhesive.

  The diffractive optical element 12 is formed inside the base material 11 between a surface on which each of the optical elements 20 is to be disposed and a surface on which the optical path 30 is to be disposed. The optical signal emitted into the optical element 11 is guided to one of the optical elements 20, or the optical signal emitted from the optical element 20 into the substrate 11 is guided to the optical path 30. The diffractive optical element 12 is formed by giving a three-dimensional distribution of refractive index to a predetermined region in the substrate 11 and has a light collecting function, a branching function, a wavelength branching function, and the like for an optical signal. A method for forming such a diffractive optical element 12 will be described later.

  As shown in FIG. 1B, in the optical component 10 of the present embodiment, the position where each of the optical elements 20 should be arranged on one surface of the base material 11 is centered on the connection point 34 of the optical path 30. It is set to one of rotationally symmetric positions. FIG. 1B shows an example in which each optical element 20 is arranged at each of six-fold symmetrical positions corresponding to six-fold rotation (rotation by 60 °) about the connection point 34. . In the illustrated example, for convenience, an optical element (light emitting element) 20 that emits an optical signal is indicated as “V”, and an optical element (light receiving element) 20 that receives an optical signal and converts it into an electrical signal is indicated as “P”. . The pattern design of the diffractive optical element 12 is facilitated by setting the arrangement of the optical elements 20 at such rotationally symmetric positions, in other words, positions with high symmetry.

  The optical component and the optical module of the present embodiment have such a configuration, and an example of a suitable manufacturing method will be described next.

  2 and 3 are process diagrams illustrating an optical component and an optical module manufacturing method.

  First, the diffractive optical element 12 is arranged so that the position where each of the optical elements 20 is to be arranged is one of the surfaces of the substrate 11 and a rotationally symmetric position about the connection point 34 of the optical path 30. Set the pattern. Here, the pattern of the diffractive optical element 12 in this example refers to a three-dimensional distribution of refractive index inside the substrate 11.

  Next, as shown in FIG. 2A, the region 11 in which the first recess 14 of the base material 11 is to be formed is irradiated with the laser light L to alter the region, thereby forming the altered region 50. Further, as shown in FIG. 2B, the region where the second concave portion 16 of the base material 11 is to be formed is irradiated with the laser light L to alter the region, thereby forming the altered region 52.

  Here, the “altered region” refers to a region where the density, refractive index, mechanical strength, and other physical characteristics are different from the surroundings, and includes those in which minute cracks are generated. Thus, by providing a modified region by light irradiation, a difference in etching rate occurs between the region and the other region, and each recessed portion can be formed by etching the modified region later. Such a processing technique is also disclosed in documents such as JP-A-9-309744.

  As long as the altered regions 50 and 52 as described above can be formed on the substrate 11, various laser beams L can be adopted. Further, in addition to the laser light, any means can be employed as long as it can locally give energy to a desired position of the substrate 11 such as electron beam irradiation.

  In this embodiment, since the substrate 11 made of glass is employed, femtosecond laser light is used as a suitable laser light in this case. Here, femtosecond laser light refers to pulsed laser light having a pulse width on the order of femtoseconds (for example, several tens to several hundreds femtoseconds). For example, femtosecond laser light having a wavelength of 800 nm, a pulse width of 100 fs (femtosecond), and a repetition frequency of 1 kHz is preferably used.

When femtosecond laser light is irradiated, the energy density is extremely high in the vicinity of the condensing point, and large energy can be injected locally instantaneously. In the portion irradiated with the femtosecond laser light, various microscopic structural changes are caused by various nonlinear interactions (for example, multiphoton absorption, multiphoton ionization, etc.) between the laser light and the substance constituting the substrate 11. Induced. The induced structural change depends on the intensity of the laser beam, and (a) coloring by oxidation-reduction of active ions (rare earth, transition metal, etc.), (b) refractive index change by generation and densification of defects, (c) melting And void formation by laser shock waves, and (d) formation of micro cracks by optical breakdown. In many cases, the induced structural changes are complex and have a certain spatial distribution. Of these structural changes, the microcracks (d) are preferably used mainly as the altered region 50 for forming the first recess 14 and the altered region 52 for forming the second recess 16. This microcrack is induced by a phenomenon (breakdown) in which stress distortion occurs in the vicinity of the focal point. When femtosecond laser light is used, the pulse width is shorter than the coupling time between electrons and phonons (on the order of 10-12 seconds), so the energy of the laser light is irradiated sufficiently faster than the thermal diffusion rate of the material. The plasma is generated by being injected in a concentrated manner. Cracks are induced by shock waves generated when the plasma diffuses. Therefore, the irradiation conditions (intensity, pulse width, mode, wavelength, etc.) of the laser beam L when forming the first recess 14 are appropriately set so that microcracks are mainly generated in the substrate 11. As a result, the altered regions 50 and 52 can be formed with extremely high positional accuracy.

  Next, as shown in FIG. 2C, the laser beam L is focused inside the substrate 11, and the laser is scanned while scanning the focal point corresponding to the pattern (refractive index distribution) of the diffractive optical element 12. Irradiate light L. Also in this step, femtosecond laser light is used as the laser light L. In this step, the irradiation condition of the laser beam L is set so that an altered region mainly composed of a refractive index change is generated in the region irradiated with the laser beam L. As a result, a difference occurs in the refractive index between the region (modified region) irradiated with the laser light L in the substrate 11 and the other region, and the diffractive optical element 12 is formed in the substrate 11.

  Note that the steps in FIGS. 2A to 2C can be interchanged in order. When performed in the order as in this example, the refractive index distribution pattern constituting the diffractive optical element 12 is not affected by the irradiation of the laser light for forming the altered regions 50 and 52. This is convenient when a precise refractive index profile is formed.

  Next, as shown in FIG. 3A, the region altered by the irradiation of the laser beam L is removed by etching. As a result, the first concave portion 14 is formed on one surface side of the base material 11 corresponding to the altered region 50, and the second concave portion 16 is formed on the other surface side of the base material 11 corresponding to the altered region 52. The In this example, since the base material 11 made of glass is employed, a solvent (for example, a hydrofluoric acid solution) suitable for glass etching is used to remove the altered regions 50 and 52. Dry etching using a fluorine compound gas may be employed.

  Through the above steps, the optical component 10 according to this embodiment is completed. By mounting each optical element 20 on the optical component 10 as shown in FIG. 3B, the optical module according to the present embodiment is completed. Further, as shown in FIG. 3C, the optical path 30 is fixed to the optical module by inserting the optical path 30 into the second recess 16 and forming a fixing member 32 at a predetermined position.

  FIG. 4 is a diagram illustrating an example of the mounting state of each optical element 20. FIG. 4 shows a configuration example when a surface emitting laser is adopted as the optical element 20. In the optical element (surface emitting laser) 20 of this example, the center of the light emitting region of the light emitting layer 21 substantially coincides with the geometric center. An insulating film 22 is provided on the side surface of the optical element 20. An electrode 23 is formed on substantially the entire surface of the light emitting layer 21. For example, the electrode 23 is disposed so as to be in contact with a wiring film 25 formed on one surface of the substrate 11 as illustrated. On the lower surface of the light emitting layer, an electrode 24 is formed circumferentially along the edge. For example, the electrode 24 is disposed so as to be in contact with a wiring film 26 formed from one surface of the substrate 11 to the inside of the first recess 14 as shown in the drawing. The optical element 20 is electrically connected to the drive circuit (not shown) via the wiring films 25 and 26. Light emitted from the light emitting layer 21 is emitted toward the inside of the base material 11 through a central opening not blocked by the electrode 24.

  As a mounting method of the optical element 20 in the case where the structure shown in FIG. 4 is adopted, each optical element 20 may be individually attached to each first recess 14 by a mechanical method. It is also preferable to use a method as disclosed in US Pat. Such a document describes a method of efficiently mounting an optical element in a recess by mixing an optical element in a predetermined liquid and allowing the liquid to flow after disposing the substrate 11 in the liquid.

  In addition, the installation method of the wiring with respect to the optical element 20 is not limited to said example, Other methods (for example, wire bonding etc.) can also be employ | adopted. When the optical element 20 is a light receiving element, the light receiving surface is arranged so as to face the inside of the substrate 11. It is also preferable to change the shape and size of the light emitting element and the light receiving element. This facilitates the distinction between the light emitting element and the light receiving element. In addition, when the above-described optical element mounting method using a liquid is employed, each element can be mounted more easily.

  Thus, in the present embodiment, the position where each optical element 20 should be arranged is set to a rotationally symmetric position about the connection point 34 of the optical path 30, in other words, a highly symmetric position. The diffraction pattern of the diffractive optical element 12 is relatively simplified, and design and manufacture are facilitated.

  In the optical component 10 according to the present embodiment, the diffractive optical element 12, a recess (mounting hole) for mounting each optical element 20, and a recess (socket part) for inserting the optical path 30 are integrated. Since this is the structure, the number of parts is reduced. Further, the optical loss can be reduced by the integration of the structure. Furthermore, since the positional accuracy of the optical element and the optical path is ensured at the stage of forming each recess, alignment at the time of mounting the optical element or the like becomes very easy.

  The optical component according to the present embodiment or an optical module including the optical component is suitable for use in an optical communication device (optical transceiver). Such an optical communication device according to the present invention is used for various electronic devices that perform information communication with an external device or the like using light as a transmission medium, such as a personal computer or a so-called PDA (portable information terminal device). It is possible.

  In addition, this invention is not limited to the content of embodiment mentioned above, A various deformation | transformation implementation is possible within the range of the summary of this invention.

  For example, in the above-described embodiment, an example is described in which each optical element is arranged at each of six-fold symmetrical positions corresponding to six-fold rotation (rotation by 60 °) about the connection point of the optical path. However, the arrangement of the optical elements is not limited to this, and various other examples are conceivable.

  FIG. 5 is a diagram illustrating another example of the arrangement of optical elements. In the example shown in FIG. 5 (A), each optical element 20 as a light receiving element is arranged at each of four-fold symmetrical positions corresponding to four-fold rotation (rotation by 90 °) about the connection point. . Moreover, in this example, the optical element 20 as a light emitting element is arrange | positioned in the position facing a connection point. In the example shown in FIG. 5B, each optical element 20 is arranged at each of eight-fold symmetrical positions corresponding to eight-fold rotation (rotation by 45 °) about the connection point. In this example, the optical element 20 as a light receiving element is disposed at a position facing the connection point. In the example shown in FIG. 5B, the optical element 20 as the light emitting element is arranged at each of the four-fold symmetry positions, and is shifted by 45 ° from these arrangements so that the optical element 20 as the light receiving element is four-fold symmetry. It can also be understood that it is arranged at each position.

  In the above-described embodiment, the step of forming the first recess 14 and the second recess 16 is performed by a combination of laser irradiation and etching, but a mechanical method using a cutting tool such as a drill, You may perform by other methods, such as the method by the combination of the photolithographic method and an etching method. When the base material 11 is made of a polymer material or the like, the base material 11 having the first concave portion 14 and the second concave portion 16 may be integrally formed by a technique such as an injection molding method.

  In the above-described embodiment, glass is used as the base material 11 and a femtosecond laser is used as a laser beam suitable for forming an altered region on the glass. However, other materials are used as the base material 11. In that case, it is also preferable to change the type of the laser beam corresponding to the other material. For example, when a base material made of a polymer material such as an acrylic resin is employed, a diffractive optical element and each concave portion are formed by generating an altered region in the base material even by employing an argon laser as the laser light. It is possible.

  In addition, the optical component does not necessarily have the first recess for mounting the optical element 20, and each optical element is directly formed on one surface of the substrate 11 as in the configuration example shown in FIG. 20 may be arranged.

  Similarly, the optical component does not necessarily have to have the second recess for inserting the optical path 30. For example, a socket 36 may be arranged on the other surface side of the base material 11 as shown in the configuration example shown in FIG. 7, and the optical path 30 may be inserted into the socket 36. In the configuration example shown in FIG. In this way, the optical waveguide 38 may be arranged on the other surface side of the substrate 11.

  Alternatively, the light emitting element and the light receiving element may be paired, and the pair of optical elements may be disposed at rotationally symmetric positions. Furthermore, an optical element having both functions of light emission and light reception may be used.

  In the above-described embodiment, the diffractive optical element is formed by causing a change in the refractive index in the base material. However, if a desired phase difference is given to the optical signal, another method is adopted. May be. For example, a diffractive optical element can be realized by altering a desired position in the base material by some method, for example, generating a microcrack in the base material. If microcracks are generated at desired positions in the substrate, a diffractive optical element can be realized by a periodic arrangement of microcracks.

  Further, in the manufacturing method of the above-described embodiment, the description has been given focusing on one optical component and an optical module. However, the manufacturing method according to the present embodiment is used when a large number of optical components and the like are formed in a lump. Is also applicable. In this case, the above-described manufacturing method may be performed in parallel at a plurality of locations on the base material, and finally divided (cut) for each optical component or optical module. This makes it possible to reduce the cost due to the mass production effect.

It is a figure explaining the structure of the optical component of one Embodiment, and the optical module comprised including this. It is process drawing explaining the manufacturing method of an optical component and an optical module. It is process drawing explaining the manufacturing method of an optical component and an optical module. It is a figure explaining an example of the mounting state of each optical element. It is a figure explaining the other example of arrangement | positioning of an optical element. It is a figure explaining the structural example of an optical component. It is a figure explaining the structural example of an optical component. It is a figure explaining the structural example of an optical component.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Optical component, 11 ... Base material, 12 ... Diffractive optical element, 14 ... 1st recessed part, 16 ... 2nd recessed part, 20 ... Optical element, 30 ... Optical path, 50, 52 ... Alteration area | region

Claims (17)

  1. An optical component responsible for connecting an optical path and a plurality of optical elements,
    A light transmissive substrate;
    Each of the optical elements of the substrate is formed between the one surface on which the optical element is to be disposed and the other surface on which the light path is to be disposed, and is formed inside the substrate. A diffractive optical element having a function of guiding light emitted to one of a plurality of the optical elements, or guiding light emitted from the optical elements into the base material to the optical path,
    An optical component in which a position where each of the optical elements is to be arranged on one surface of the base material is set to one of rotationally symmetric positions about a connection point of the optical path.
  2.   The optical component according to claim 1, wherein the base member has a first concave portion corresponding to a position where each of the optical elements is to be disposed.
  3.   The optical component according to claim 1, wherein the base has a second recess corresponding to a position where the optical path is to be disposed.
  4.   The optical component according to claim 1, wherein the diffractive optical element is formed by giving a three-dimensional distribution of refractive index to a predetermined region in the base material.
  5.   An optical module comprising the optical component according to claim 1 and a plurality of optical elements arranged at predetermined positions of the optical component.
  6.   An optical communication apparatus comprising the optical module according to claim 5.
  7.   An electronic apparatus comprising the optical communication device according to claim 6.
  8. A light-transmitting base material having one surface on which a plurality of optical elements are to be disposed and the other surface on which the light path is to be disposed; and provided in the base material from the light path into the base material A diffractive optical element having a function of guiding light emitted to one of the plurality of optical elements, or guiding light emitted from the optical elements into the base material to the optical path, Because
    The pattern of the diffractive optical element is such that the position where each of the optical elements is to be arranged is one of the rotationally symmetrical positions about the connection point of the optical path on one side of the substrate. A first step of setting
    A second step of forming the diffractive optical element by irradiating the inside of the base material with laser light while scanning the focal point corresponding to the pattern, and changing the region irradiated with the laser light; and
    A method for manufacturing an optical component, comprising:
  9.   9. The method of manufacturing an optical component according to claim 8, wherein the second step forms the diffractive optical element by causing a difference in refractive index between a region irradiated with the laser light and a region other than the region irradiated with the laser light.
  10.   The method for manufacturing an optical component according to claim 9, wherein the laser beam in the second step is a pulsed laser beam.
  11. The substrate is made of glass;
    The method of manufacturing an optical component according to claim 10, wherein the pulse laser beam is a femtosecond laser beam.
  12.   The method for manufacturing an optical component according to claim 8, further comprising a third step of forming a first recess at a position where each of the optical elements on one surface of the base material is to be disposed.
  13. The third step includes
    A laser beam irradiation step of irradiating a laser beam to a region where the first concave portion of the base material is to be formed to alter the region;
    An etching step of etching and removing the region altered by the irradiation of the laser beam;
    The manufacturing method of the optical component of Claim 12 containing these.
  14.   The method for manufacturing an optical component according to claim 13, wherein the laser light irradiation step in the third step is performed prior to the second step.
  15.   The method of manufacturing an optical component according to claim 8, further comprising a fourth step of forming a second recess at a position where the optical path on the other surface side of the base material is to be disposed.
  16. The fourth step includes
    A laser beam irradiation step of irradiating a laser beam to a region where the second concave portion of the base material is to be formed to alter the region;
    An etching step of etching and removing the region altered by the irradiation of the laser beam;
    The manufacturing method of the optical component of Claim 15 containing this.
  17. The method for manufacturing an optical component according to claim 16, wherein the laser light irradiation step in the fourth step is performed prior to the second step.

JP2004012437A 2004-01-20 2004-01-20 Optical component and manufacturing method thereof, optical module, optical communication apparatus, and electronic appliance Pending JP2005208175A (en)

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2463226A (en) * 2008-07-22 2010-03-10 Conjunct Ltd Optical sub-assembly
US8541319B2 (en) 2010-07-26 2013-09-24 Hamamatsu Photonics K.K. Laser processing method
US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
US8685269B2 (en) 2010-07-26 2014-04-01 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2463226A (en) * 2008-07-22 2010-03-10 Conjunct Ltd Optical sub-assembly
GB2463226B (en) * 2008-07-22 2011-01-12 Conjunct Ltd Optical sub-assembly
US8802544B2 (en) 2010-07-26 2014-08-12 Hamamatsu Photonics K.K. Method for manufacturing chip including a functional device formed on a substrate
US8591753B2 (en) 2010-07-26 2013-11-26 Hamamatsu Photonics K.K. Laser processing method
US8673167B2 (en) 2010-07-26 2014-03-18 Hamamatsu Photonics K.K. Laser processing method
US8685269B2 (en) 2010-07-26 2014-04-01 Hamamatsu Photonics K.K. Laser processing method
US8741777B2 (en) 2010-07-26 2014-06-03 Hamamatsu Photonics K.K. Substrate processing method
US8541319B2 (en) 2010-07-26 2013-09-24 Hamamatsu Photonics K.K. Laser processing method
US8828260B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Substrate processing method
US8828873B2 (en) 2010-07-26 2014-09-09 Hamamatsu Photonics K.K. Method for manufacturing semiconductor device
US8841213B2 (en) 2010-07-26 2014-09-23 Hamamatsu Photonics K.K. Method for manufacturing interposer
US8945416B2 (en) 2010-07-26 2015-02-03 Hamamatsu Photonics K.K. Laser processing method
US8961806B2 (en) 2010-07-26 2015-02-24 Hamamatsu Photonics K.K. Laser processing method
US9108269B2 (en) 2010-07-26 2015-08-18 Hamamatsu Photonics K. K. Method for manufacturing light-absorbing substrate and method for manufacturing mold for making same

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