KR20110077494A - Supply-pipe and mixing reservoir having the same - Google Patents

Supply-pipe and mixing reservoir having the same Download PDF

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Publication number
KR20110077494A
KR20110077494A KR1020090134093A KR20090134093A KR20110077494A KR 20110077494 A KR20110077494 A KR 20110077494A KR 1020090134093 A KR1020090134093 A KR 1020090134093A KR 20090134093 A KR20090134093 A KR 20090134093A KR 20110077494 A KR20110077494 A KR 20110077494A
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South Korea
Prior art keywords
plate
supply pipe
plating
mixing
pipe
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KR1020090134093A
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Korean (ko)
Inventor
유달현
최창환
이효석
최연홍
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삼성전기주식회사
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Priority to KR1020090134093A priority Critical patent/KR20110077494A/en
Priority to CN2010101885540A priority patent/CN102115905B/en
Publication of KR20110077494A publication Critical patent/KR20110077494A/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Accessories For Mixers (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE: A supply pipe and a mixing reservoir therewith are provided to uniformly supply mixed liquid by coupling a plate-shaped member, which generates a turbulent flow, inside the supply pipe. CONSTITUTION: A supply pipe(120) comprises multiple plate-shaped members(124). The plate-shaped members are arranged in a row and generate a turbulent flow in order to mix flowing fluid. The plate-shaped members are arranged to be parallel to the flowing direction of the fluid. A distance between the plate-shaped members is shorter than the length of the plate-shaped member.

Description

공급관 및 이를 구비하는 혼합조 {Supply-Pipe and Mixing Reservoir Having the Same}Supply pipe and mixing tank having same {Supply-Pipe and Mixing Reservoir Having the Same}

본 발명은 공급관 및 이를 구비하는 혼합조에 관한 것이다.The present invention relates to a feed pipe and a mixing tank having the same.

인쇄회로기판을 제조하는데 있어서, 수 차례의 도금 공정이 수행될 수 있다. 도금 고정은 전압이 인가된 기판에 도금액을 투입하여 수행될 수 있다. 이 때, 도금액은 여러 가지 용액이 혼합되어 이루어지며, 이들의 혼합이 불 균일한 경우, 도금의 편차가 발생할 수 있다. In manufacturing a printed circuit board, several plating processes may be performed. Plating fixing may be performed by injecting a plating liquid into a substrate to which a voltage is applied. At this time, the plating solution is made by mixing a variety of solutions, if the mixing is not uniform, deviation of plating may occur.

따라서, 도금 품질의 향상을 위해, 도금액의 균일한 혼합이 요구되고 있는 실정이다. 특히, 회로패턴의 미세화가 이루어지고 있는 현 추세에 비추어 볼 때, 도금액의 균일한 혼합은 도금 편차와 직결되는 문제로 그 해결이 절실한 상황이다. Therefore, in order to improve the plating quality, uniform mixing of the plating liquid is required. In particular, in view of the current trend of miniaturization of circuit patterns, the uniform mixing of the plating liquid is a problem that is directly related to the plating deviation, which is an urgent situation to be solved.

본 발명은 균일하게 혼합된 액체를 공급할 수 있는 공급관 및 혼합조를 제공 하는 것이다.The present invention provides a supply pipe and a mixing tank capable of supplying a liquid mixed uniformly.

본 발명의 일 측면에 따르면, 유동하는 유체가 혼합되도록 난류를 발생시키는 판형부재가 내부에 결합되는 공급관이 제공된다.According to one aspect of the present invention, there is provided a feed pipe in which a plate-like member for generating turbulence is coupled therein so that a flowing fluid is mixed.

여기서, 판형부재는 유체의 유동 방향과 평행하게 결합될 수 있으며, 판형부재는 복수 일 수 있다. Here, the plate member may be coupled in parallel with the flow direction of the fluid, the plate member may be a plurality.

이 때, 복수의 판형부재는 일렬로 배치될 수 있으며, 인접한 복수의 판형부재 간에 이격 거리는 판형부재의 길이보다 짧을 수 있다.In this case, the plurality of plate members may be arranged in a line, and the separation distance between the plurality of adjacent plate members may be shorter than the length of the plate member.

그리고, 복수의 판형부재의 일면은 서로 경사지게 배치될 수 있으며, 인접한 복수의 판형부재는 직교하도록 배치될 수 있다.One surface of the plurality of plate members may be disposed to be inclined with respect to each other, and the plurality of adjacent plate members may be disposed to be orthogonal to each other.

또한, 본 발명의 다른 측면에 따르면, 상술한 공급관 가운데 어느 한 공급관과, 공급관과 결합하며, 유체가 저장되는 저장탱크를 포함하는 혼합조가 제공된다.In addition, according to another aspect of the present invention, there is provided a mixing tank including any one of the above-described supply pipe, and a storage tank coupled with the supply pipe, the fluid is stored.

본 발명의 실시 예에 따르면, 균일하게 혼합된 액체를 공급할 수 있다.According to an embodiment of the present invention, it is possible to supply a liquid mixed uniformly.

본 발명의 특징, 이점이 이하의 도면과 발명의 상세한 설명으로부터 명확해질 것이다.The features and advantages of the present invention will become apparent from the following drawings and detailed description of the invention.

이하, 본 발명에 따른 혼합조의 실시 예를 첨부도면을 참조하여 상세히 설명하기로 하며, 첨부 도면을 참조하여 설명함에 있어, 동일하거나 대응하는 구성 요소는 동일한 도면번호를 부여하고 이에 대한 중복되는 설명은 생략하기로 한다.Hereinafter, an embodiment of the mixing tank according to the present invention will be described in detail with reference to the accompanying drawings, in the description with reference to the accompanying drawings, the same or corresponding components are given the same reference numerals and duplicate description thereof It will be omitted.

도 1은 본 발명의 일 실시 예에 따른 혼합조(100)가 적용되는 도금공정을 나타낸 도면이다. 도 1에 도시된 바와 같이, 도금공정은 수평 방향으로 기판(10)이 연속적으로 투입될 때, 기판(10)에 전압이 인가되고, 여기에 도금액을 분사하여 이루어질 수 있다. 1 is a view showing a plating process to which the mixing tank 100 according to an embodiment of the present invention is applied. As shown in FIG. 1, the plating process may be performed by applying a voltage to the substrate 10 when the substrate 10 is continuously input in the horizontal direction, and spraying the plating liquid thereon.

이 때, 도금액은 금속이온과 여러 가지 첨가제를 포함하는 유기물과 무기물의 혼합액일 수 있다. 무기물은 예를 들어, H2O, H2SO4 및 CuSO4 를 포함할 수 있다. 도금액은 도금조(이하, 본 실시 예에서는 혼합조(100)라 칭함)에 저장되어 있다가, 노즐(20)을 통해 기판(10)에 분사될 수 있다.In this case, the plating solution may be a mixed solution of an organic material and an inorganic material including metal ions and various additives. Inorganic materials may include, for example, H 2 O, H 2 SO 4 and CuSO 4. The plating liquid may be stored in a plating bath (hereinafter, referred to as a mixing bath 100 in the present embodiment) and then sprayed onto the substrate 10 through the nozzle 20.

도 2는 본 발명의 일 실시 예에 따른 혼합조(100)를 나타낸 사시도이다. 도 2에 도시된 바와 같이, 혼합조(100)는 저장탱크(110), 유입관(112) 및 공급관(120)을 포함할 수 있다. 2 is a perspective view showing a mixing tank 100 according to an embodiment of the present invention. As shown in FIG. 2, the mixing tank 100 may include a storage tank 110, an inflow pipe 112, and a supply pipe 120.

저장탱크(110)는 그 내부에 도금액을 수용할 수 있다. 저장탱크(110)의 일측에는 복수의 유입관(112)이 결합될 수 있다. 유입관(112)은 혼합되는 용액의 종류에 상응하는 개수가 결합될 수 있다.The storage tank 110 may accommodate the plating liquid therein. One side of the storage tank 110 may be coupled to a plurality of inlet pipe (112). Inlet pipe 112 may be combined in the number corresponding to the type of the solution to be mixed.

저장탱크(110)의 일단에는 공급관(120)이 결합될 수 있다. 공급관(120)은 그 내부에 판형부재(124)가 결합될 수 있다. 판형부재(124)는 공급관(120)을 통해 유동하는 유체에 유동저항을 제공하여 난류를 발생시킬 수 있다. One end of the storage tank 110 may be coupled to the supply pipe 120. The supply pipe 120 may be coupled to the plate member 124 therein. The plate member 124 may generate turbulence by providing flow resistance to the fluid flowing through the supply pipe 120.

난류로 인해 유체에 포함된 여러 가지 물질은 서로 혼합될 수 있다. 따라서, 저장탱크(110)에 유입된 서로 다른 액체들은 공급관(120)을 통해 유동하는 동안, 판형부재(124)에 의해 발생된 난류에 의해 서로 혼합될 수 있다. Turbulent flow can cause the various materials in the fluid to mix with each other. Therefore, different liquids introduced into the storage tank 110 may be mixed with each other by turbulence generated by the plate member 124 while flowing through the supply pipe 120.

본 실시 예에서와 같이, 혼합조(100)가 도금조로 사용되는 경우, 도금액에 포함된 여러 가지 물질은 공급관(120)을 통해 유동되는 동안 혼합되어, 보다 균일한 도금액이 조성될 수 있으며, 이로써, 도금액의 불 균일로 인한 도금 편차의 발생은 방지될 수 있다.As in the present embodiment, when the mixing tank 100 is used as a plating bath, various materials included in the plating liquid may be mixed while flowing through the supply pipe 120, thereby forming a more uniform plating liquid. The occurrence of plating deviation due to the unevenness of the plating liquid can be prevented.

판형부재(124)는 공급관(120) 내부에 도금액의 유동 방향과 평행하게 복수 개가 결합될 수 있다. 판형부재(124)는 도금액의 유동 방향과 평행하게 배치되어 공급관(120) 내부의 단면적의 감소를 최소화하여 도금액에 난류를 발생시키면서도 그 유동량의 감소를 최소화 할 수 있다.The plate member 124 may be coupled to a plurality of parallel to the flow direction of the plating liquid inside the supply pipe (120). The plate member 124 is disposed in parallel with the flow direction of the plating liquid to minimize the reduction of the cross-sectional area inside the supply pipe 120 can generate a turbulence in the plating liquid while minimizing the decrease in the flow amount.

인접한 판형부재(124)는 서로 직교하도록 배치될 수 있으며, 이 때, 복수의 판형부재(124)로 인해 발생되는 난류 강도를 증가되어, 공급관(120)의 혼합작용은 최대가 될 수 있다.Adjacent plate members 124 may be arranged to be orthogonal to each other, and at this time, the turbulence intensity generated by the plurality of plate members 124 is increased, so that the mixing action of the supply pipe 120 may be maximized.

도 3은 본 발명의 일 실시 예에 따른 공급관(120)을 나타낸 사시도이다. 도 3에 도시된 바와 같이, 인접한 판형부재(124)는 서로 이격될 수 있으며, 이들 간에 이격 거리(d1)는 인접한 판형부재(124)의 액체 유동 방향으로의 길이(d2) 보다 짧을 수 있다. 3 is a perspective view showing a supply pipe 120 according to an embodiment of the present invention. As shown in FIG. 3, the adjacent plate members 124 may be spaced apart from each other, and the separation distance d1 between them may be shorter than the length d2 of the adjacent plate members 124 in the liquid flow direction.

인접한 판형부재(124) 간에 이러한 결합관계는 난류 강도를 보다 증가시켜, 도금액의 혼합작용을 보다 증대시킬 수 있다.This coupling relationship between adjacent plate members 124 further increases the turbulence intensity, thereby further increasing the mixing action of the plating liquid.

도 4 내지 도 5는 혼합 과정의 시뮬레이션 결과를 나타낸 도면이다. 도 4 내지 도 5는 도금조에 3가지 종류의 용액이 유입된 경우에 혼합 결과를 나타내고 있다. 먼저, 도 4는 판형부재(124)가 없는 경우로, 공급관(120) 내부를 유동하는 도금액이 불 균일한 상태임을 알 수 있다. 4 to 5 are diagrams showing simulation results of a mixing process. 4 to 5 show the mixing results when three kinds of solutions are introduced into the plating bath. First, FIG. 4 illustrates that the plate-shaped member 124 is not present, and the plating liquid flowing in the supply pipe 120 is in an uneven state.

그러나, 도 5에 도시된 바와 같이, 공급관(120) 내부에 十자 형태로 서로 직교하는 판형부재(124)가 있는 경우, 공급관(120)을 유동하는 과정에서 도금액이 균일한 상태를 이루고 있음을 알 수 있다.However, as shown in FIG. 5, when there are plate members 124 orthogonal to each other in a cross shape in the supply pipe 120, the plating solution is uniform in the process of flowing the supply pipe 120. Able to know.

따라서, 본 실시예의 혼합조(100)는 별도의 혼합장치를 생략할 수 있으면서도, 그 내부에 저장되는 여러 가지 물질을 혼합시킬 수 있다.Therefore, the mixing tank 100 of the present embodiment can mix various materials stored therein while the separate mixing device can be omitted.

상기에서는 본 발명의 바람직한 실시예를 참조하여 설명하였지만, 해당 기술 분야에서 통상의 지식을 가진 자라면 하기의 특허 청구의 범위에 기재된 본 발명의 사상 및 영역으로부터 벗어나지 않는 범위 내에서 본 발명을 다양하게 수정 및 변경시킬 수 있음을 이해할 수 있을 것이다.It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It will be understood that the invention may be varied and varied without departing from the scope of the invention.

도 1은 본 발명의 일 실시 예에 따른 혼합조가 적용되는 도금공정을 나타낸 도면.1 is a view showing a plating process to which the mixing bath is applied according to an embodiment of the present invention.

도 2는 본 발명의 일 실시 예에 따른 혼합조를 나타낸 사시도.2 is a perspective view showing a mixing tank according to an embodiment of the present invention.

도 3은 본 발명의 일 실시 예에 따른 공급관을 나타낸 사시도.3 is a perspective view showing a supply pipe according to an embodiment of the present invention.

도 4 내지 도 5는 혼합 과정의 시뮬레이션 결과를 나타낸 도면.4 to 5 show simulation results of the mixing process.

Claims (8)

유동하는 유체가 혼합되도록 난류를 발생시키는 판형부재가 내부에 결합되는 공급관.A feed pipe having a plate-like member for generating turbulent flow so that the flowing fluid is mixed therein. 제1항에 있어서,The method of claim 1, 상기 판형부재는 상기 유체의 유동 방향과 평행하게 결합되는 것을 특징으로 하는 공급관.The plate member is characterized in that the supply pipe is coupled in parallel with the flow direction of the fluid. 제1항에 있어서,The method of claim 1, 상기 판형부재는 복수 인 것을 특징으로 하는 공급관.The plate member is characterized in that the plurality of supply pipes. 제3항에 있어서,The method of claim 3, 복수의 상기 판형부재는 일렬로 배치되는 것을 특징으로 하는 공급관.A plurality of the plate-like member is arranged in a line supply pipe. 제4항에 있어서,5. The method of claim 4, 인접한 복수의 상기 판형부재 간에 이격 거리는 상기 판형부재의 길이보다 짧은 것을 특징으로 하는 공급관.And a separation distance between the plurality of adjacent plate members is shorter than the length of the plate member. 제4항에 있어서,5. The method of claim 4, 복수의 상기 판형부재의 일면은 서로 경사지게 배치되는 것을 특징으로 하는 공급관.One surface of the plurality of plate-like member is disposed inclined with each other. 제6항에 있어서,The method of claim 6, 인접한 복수의 상기 판형부재는 직교하도록 배치되는 것을 특징으로 하는 공급관.And a plurality of adjacent plate members arranged at right angles to each other. 제1항 내지 제7항 가운데 어느 한 항의 상기 공급관과,The said supply pipe of any one of Claims 1-7, 상기 공급관과 결합하며, 상기 유체가 저장되는 저장탱크를 포함하는 혼합조.A mixing tank coupled to the supply pipe and including a storage tank in which the fluid is stored.
KR1020090134093A 2009-12-30 2009-12-30 Supply-pipe and mixing reservoir having the same KR20110077494A (en)

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Application Number Priority Date Filing Date Title
KR1020090134093A KR20110077494A (en) 2009-12-30 2009-12-30 Supply-pipe and mixing reservoir having the same
CN2010101885540A CN102115905B (en) 2009-12-30 2010-05-25 Supply pipe and mixed liquid storage container equipped therewith

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Application Number Priority Date Filing Date Title
KR1020090134093A KR20110077494A (en) 2009-12-30 2009-12-30 Supply-pipe and mixing reservoir having the same

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KR20110077494A true KR20110077494A (en) 2011-07-07

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JPH06264273A (en) * 1993-03-10 1994-09-20 Yoshitama Sugaya Turbulent flow generator for liquid tank
US6277340B1 (en) * 1998-01-02 2001-08-21 Abb Lummus Global, Inc. Structured packing and element therefor
WO2002089966A2 (en) * 2001-05-07 2002-11-14 Uop Llc Apparatus for mixing and reacting at least two fluids
KR20040049056A (en) * 2002-12-03 2004-06-11 엘지전자 주식회사 device for promoting mixing fuel and air in mixing pipe for gas radiation burner
CN2673486Y (en) * 2003-04-16 2005-01-26 吴民权 Liquid-liquid fast pipeline mixer
AU2003902014A0 (en) * 2003-04-28 2003-05-15 Indigo Technologies Group Pty Ltd Particle agglomeration
JP2005105976A (en) * 2003-09-30 2005-04-21 Kazuyuki Kobayashi Air guide panel for air filter, and air filter case
CN201073592Y (en) * 2007-07-27 2008-06-18 攀枝花新钢钒股份有限公司 Hole plate pipeline fluid mixer

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CN102115905B (en) 2013-02-06

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