KR20110070876A - 홈을 갖는 실리콘 기판 상의 본딩 - Google Patents

홈을 갖는 실리콘 기판 상의 본딩 Download PDF

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Publication number
KR20110070876A
KR20110070876A KR1020117008761A KR20117008761A KR20110070876A KR 20110070876 A KR20110070876 A KR 20110070876A KR 1020117008761 A KR1020117008761 A KR 1020117008761A KR 20117008761 A KR20117008761 A KR 20117008761A KR 20110070876 A KR20110070876 A KR 20110070876A
Authority
KR
South Korea
Prior art keywords
adhesive
transducer
membrane
grooves
microns
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020117008761A
Other languages
English (en)
Korean (ko)
Inventor
크리스토프 멘첼
그레고리 데브라반더
코리나 니스토리카
Original Assignee
후지필름 디마틱스, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지필름 디마틱스, 인크. filed Critical 후지필름 디마틱스, 인크.
Publication of KR20110070876A publication Critical patent/KR20110070876A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
    • H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
    • H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
KR1020117008761A 2008-09-18 2009-09-18 홈을 갖는 실리콘 기판 상의 본딩 Ceased KR20110070876A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9818708P 2008-09-18 2008-09-18
US61/098,187 2008-09-18

Publications (1)

Publication Number Publication Date
KR20110070876A true KR20110070876A (ko) 2011-06-24

Family

ID=42006580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020117008761A Ceased KR20110070876A (ko) 2008-09-18 2009-09-18 홈을 갖는 실리콘 기판 상의 본딩

Country Status (6)

Country Link
US (1) US8853915B2 (enExample)
EP (1) EP2332169B1 (enExample)
JP (1) JP2012502824A (enExample)
KR (1) KR20110070876A (enExample)
CN (1) CN102165574A (enExample)
WO (1) WO2010033774A2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8853915B2 (en) 2008-09-18 2014-10-07 Fujifilm Dimatix, Inc. Bonding on silicon substrate having a groove
CN110902648B (zh) * 2019-12-06 2023-01-17 太原科技大学 聚合物电解质与金属的超声辅助阳极键合装置及其方法
WO2021118605A1 (en) * 2019-12-13 2021-06-17 Hewlett-Packard Development Company, L.P. Fluidic device die
WO2025153968A1 (en) * 2024-01-16 2025-07-24 Luxottica S.R.L. Hinge for eyeglass frame, frame and eyeglass comprising such a hinge, and method for assembling such a hinge

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55109668A (en) * 1980-01-07 1980-08-23 Ricoh Co Ltd Vibrator of ink jet device
JP2712602B2 (ja) * 1989-08-10 1998-02-16 株式会社村田製作所 圧電共振子の製造方法
DE69032666T2 (de) * 1990-02-09 1999-03-11 Toyo Communication Equipment Co., Ltd., Kanagawa Eingekapselter piezoelektrischer Resonator
JP3052336B2 (ja) * 1990-05-29 2000-06-12 セイコーエプソン株式会社 インクジェットヘッド
JP3175301B2 (ja) * 1992-06-03 2001-06-11 セイコーエプソン株式会社 インクジェット記録ヘッド及びインクジェット記録ヘッドの製造方法
US6688718B1 (en) * 1999-07-02 2004-02-10 Hewlett-Packard Development Company, L.P. Heat transfer device for an inkjet printer
JP4361658B2 (ja) * 2000-02-14 2009-11-11 富士通マイクロエレクトロニクス株式会社 実装基板及び実装方法
JP2002210965A (ja) 2001-01-17 2002-07-31 Seiko Epson Corp ノズルプレート及びインクジェット式記録ヘッド並びにインクジェット式記録装置
US6856075B1 (en) * 2001-06-22 2005-02-15 Hutchinson Technology Incorporated Enhancements for adhesive attachment of piezoelectric motor elements to a disk drive suspension
JP2003157565A (ja) * 2001-11-21 2003-05-30 Ricoh Co Ltd 波面収差補正ミラー及び該ミラーを用いた光ディスク装置
US6794958B2 (en) * 2002-07-25 2004-09-21 Agilent Technologies, Inc. Method of fabricating a semiconductor device and an apparatus embodying the method
US7266868B2 (en) * 2003-06-30 2007-09-11 Brother Kogyo Kabushiki Kaisha Method of manufacturing liquid delivery apparatus
JP2005104038A (ja) * 2003-09-30 2005-04-21 Fuji Photo Film Co Ltd 吐出ヘッド及び液吐出装置
WO2005037558A2 (en) * 2003-10-10 2005-04-28 Dimatix, Inc. Print head with thin membrane
US7048361B2 (en) * 2003-11-05 2006-05-23 Xerox Corporation Ink jet apparatus
US20050247990A1 (en) * 2004-05-05 2005-11-10 Ming-Te Cheng Image sensor packages and method of assembling the same
JP2006076128A (ja) * 2004-09-09 2006-03-23 Fuji Xerox Co Ltd インクジェット記録ヘッド
US7448732B2 (en) * 2004-09-30 2008-11-11 Fujifilm Corporation Liquid ejection head and manufacturing method thereof
ATE502893T1 (de) * 2004-10-21 2011-04-15 Fujifilm Dimatix Inc Ätzverfahren mit verwendung eines opfersubstrats
JP4520317B2 (ja) * 2005-01-25 2010-08-04 パナソニック株式会社 超音波探触子、超音波診断装置及び超音波探傷装置
JP4929598B2 (ja) * 2005-02-07 2012-05-09 富士ゼロックス株式会社 液滴吐出ヘッド、及び、液滴吐出装置
WO2007008986A1 (en) * 2005-07-13 2007-01-18 Fujifilm Dimatix, Inc. Method and apparatus for scalable droplet ejection manufacturing
US7683524B2 (en) * 2005-08-31 2010-03-23 Xinetics, Inc. Multichannel, surface parallel, zonal transducer system
US20070120896A1 (en) * 2005-11-30 2007-05-31 Xerox Corporation Drop generator
US20070263038A1 (en) * 2006-05-12 2007-11-15 Andreas Bibl Buried heater in printhead module
US20110250403A1 (en) * 2008-09-18 2011-10-13 Fujifilm Corporation Bonding on silicon substrate
US8853915B2 (en) 2008-09-18 2014-10-07 Fujifilm Dimatix, Inc. Bonding on silicon substrate having a groove

Also Published As

Publication number Publication date
WO2010033774A2 (en) 2010-03-25
EP2332169A4 (en) 2013-05-29
EP2332169B1 (en) 2016-02-24
CN102165574A (zh) 2011-08-24
WO2010033774A3 (en) 2010-06-03
US20100066206A1 (en) 2010-03-18
JP2012502824A (ja) 2012-02-02
EP2332169A2 (en) 2011-06-15
HK1157936A1 (zh) 2012-07-06
US8853915B2 (en) 2014-10-07

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