KR20110065236A - Variable lighting alumimum heat sink structure - Google Patents

Variable lighting alumimum heat sink structure Download PDF

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Publication number
KR20110065236A
KR20110065236A KR1020090122131A KR20090122131A KR20110065236A KR 20110065236 A KR20110065236 A KR 20110065236A KR 1020090122131 A KR1020090122131 A KR 1020090122131A KR 20090122131 A KR20090122131 A KR 20090122131A KR 20110065236 A KR20110065236 A KR 20110065236A
Authority
KR
South Korea
Prior art keywords
lead frame
heat sink
led chip
alumimum
led
Prior art date
Application number
KR1020090122131A
Other languages
Korean (ko)
Inventor
김종근
Original Assignee
(주) 유천
태림전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 유천, 태림전자 주식회사 filed Critical (주) 유천
Priority to KR1020090122131A priority Critical patent/KR20110065236A/en
Publication of KR20110065236A publication Critical patent/KR20110065236A/en

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE: A variable lighting alumimum heat sink structure is provided to reduce manufacturing costs while having excellent reflection rate. CONSTITUTION: In a variable lighting alumimum heat sink structure, a cup is formed in a lead frame through striking. A plurality of LED chips are attached on the lead frame as a package. A fluorescent substance is coated on a blue LED chip. A gold wire is used for bonding. A resin sealing part is formed on the lead frame. The package of the LED chip on the lead frame is divided individually.

Description

Variable Lighting Alumimum Heat Sink Structure

[Mission of drawing]

1A: High Brightness L E D

FIG. 2A: Variable Module of PCB BAR Type

3a: heat sink

Figure 4a: manufacturing process diagram

By attaching PCB BAR of variable type (60W, 90W, 120W, 150W) on one heat sink structure, it is intended to simplify the manufacturing process and achieve stable heat dissipation.

The present invention relates to a method for manufacturing a high brightness LED having a reflector (reflector cup), and to a LED manufacturing method in which a reflector is made by using the thickness of the LED frame and a double injection reflector is integrated.

1A is a first embodiment of a conventional LED device. As shown in FIG. 1, there is an LED device in which resin molding is performed on a lead frame 3 made of a metal thin plate, and an LED chip is mounted on the lead frame 3. In more detail, the funnel-shaped recessed part 2 is formed on the molding resin 1, and the lead frame 3 is buried in the bottom face of the recessed part 2. As shown in FIG. Then, the LED chip is mounted on the lead frame 3 and connected to the terminal portion 5 of the lead frame 3 by wire bonding of the metal session.

In such an example, an increase in costs for the mold for molding the lead frame 3 and the mold for molding the resin occurs. In addition, the difficulty of plating a metal of uniform thickness on the molded resin 1 also follows. Thus, the reflection efficiency of light emitted from the LED device is lowered.

FIG. 2A is a second embodiment of a conventional LED device, and is a cross-sectional view of molding completed individually using a liquid silicone resin between the lead frame and PPA injection product of FIG. 2A.

In such an example, it is the form which has the structure of the injection molded product which used PPA to form a reflecting plate separately on a lead frame, and brings about the high cost of PPA and the fall of reflectance. Conventional streetlight manufacturing technology is designed to attach the POWER LED on the heat sink to achieve heat dissipation.

Conventional LED street light is not possible to manufacture a variable type that produces a variety of luminous efficiency due to the direct attachment of the POWER LED on the heat sink, but the variable type street light to achieve the present invention can be used by connecting several PCB BAR and heat sink as desired power consumption It has the advantage of being able to be connected to the individual LED PCB and freely connected heat sink structure. It is possible to standardized mass production and assembly by adjusting the power consumption as needed. The luminous efficiency can be modified by replacing it, and the internal structure of the heat sink has a wing-type air-cooled heat dissipation structure, which has an excellent heat dissipation structure than the basic heat dissipation structure.

[Refer to the heat sink structure drawing]

In order to solve the above problems, the present invention provides a high-brightness LED manufacturing method capable of manufacturing a reflector with excellent reflectance, low material cost, and simple manufacturing process without having different materials for each desired LED chip size. It aims to do it.

The present invention forms a lead frame having a reflecting plate, the lead frame

First step; Form a cup by punching on the lead frame

Second process; Attach the LED chips (RED, GREEN, BLUE) as packages on the lead frame, apply phosphor on the BLUE chip and bond the gold wire

Third process; Resin sealing portion is formed on the lead frame is coated with the filler

4th process; And it provides a high brightness LED manufacturing method having a reflector including a step of separating the package of the LED chip on the lead frame formed with the resin seal separately.

In addition, the present invention has a reflecting plate, the upper surface is plated with silver and the lead frame is formed by the punching; An LED chip and a Zener diode chip attached to the lead frame in a package and bonded with gold wires; A filler applied to the lead frame to which the LED chip and the zener diode chip are attached and bonded with gold wires; And a resin encapsulation portion formed on the lead frame to which the filler is applied.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 5A is a process chart of a high brightness LED manufacturing method having a reflecting plate of the present invention. FIG.

As shown in FIG. 5A, a high brightness LED manufacturing method having a reflecting plate is as follows.

First, [FIG. 5A-1] is a plan view in which a lead frame is arranged, and has a reflecting plate as shown in [FIG. 5A-1], forming an iron (FE) lead frame, and plating silver (AG) on the upper surface of the lead frame. . Lead frame material is FE series .

The lead frame has a structure for connecting the LED chip and the zener diode chip (not shown) to the gold wire using epoxy in a later process, and emits heat generated from the high brightness LED chip. It is raw material to do. And, when designing the reflector [Fig. 5A-2], the maximum efficiency and the angle of the emitted light should be adapted to the design purpose. In other words, in order to maximize the efficiency of light, the inclination and depth of the reflecting plate is also important, but the area of the reflecting plate should be as small as possible compared with the LED chip. This is because the larger the reflection plate is, the longer the path of light travels, and thus, the optimal power of light is reduced.

Thereafter, a punching cup is made on the silver-plated lead frame.

The punching cup itself uses the thickness of the lead frame.

Subsequently, as shown in FIG. 5A-3, the lead frame (the LED chip and the zener diode chip) are attached to the package and the gold wire 5a-4 is bonded. The bonding of the gold wire is an LED chip. This is to electrically conduct electricity.

Subsequently, a filler is applied onto the lead frame to which the LED chip and the gold wire are bonded as shown in [FIG. 5A-5]. The filler is a liquid silicone resin and a yellow phosphor.

This process is for manufacturing a white LED chip.

The resin encapsulation is formed on the lead frame to which the filler is applied by using a transfer mold. The resin seal consists of a lead frame, LED chip, a base plate to protect the gold wire, a drive plate, an eject plate and a cavity block to obtain the required shape. Mold.

The high-brightness LED package having the reflector as described above is not only the structure of the reflector, but also minimizes the amount of silicone resin and processes the width, depth and width of the reflector to suit the size of the LED chip to minimize yellow bands, and is a thermosetting resin circuit. It is a structure that can contribute to mass production and cost reduction by sealing with a protective encapsulant.

In addition, unlike the conventional manufacturing method of the high brightness LED chip, the high brightness LED chip package having the reflector of the present invention uses silver plated on its own lead frame 100 without using any PPA injection products. This enables the manufacture of high brightness LED chips having a reflectance of 90 to 92%. Reflective plate structure is processed to move the size of LED chip and the path of light at the same distance, and the same filler is applied to the X-axis and Y-axis space, which is a compound of silicon and phosphors required for the manufacture of white LED chip. It is possible to minimize yellow bands that may occur in the lens-type package.

It will be appreciated by those skilled in the art that various changes and modifications can be made without departing from the technical spirit of the present invention through the above description. Therefore, the technical scope of the present invention should not be limited only to the contents described in the embodiments, but should be defined by the claims.

The structure of the heat dissipation structure, that is, the heat sink, can be used by connecting individual injection-induced aluminum heat dissipation structures as shown in the drawing.

The structure of the injection molding can be divided into the part of the wing that facilitates heat dissipation and the part of connecting the structures of the parts fixing the LED PCB. The structure of the part connecting each individual structure is the same as the design drawing.

Variable street light and security lamp lighting can be directed downward in the form of a gentle curve, thereby optimizing power consumption by reducing unnecessary light consumption.

In order to achieve the above object, the present invention is composed of a high-brightness LED of a dual reflection structure and a heat sink of a multi-function PCB air-cooled heat dissipation structure.

As described above, a high-brightness LED chip package having a reflector according to the present invention and a method for manufacturing the same have a significantly improved reflectance without having different materials depending on the size of the desired LED chip, a low manufacturing cost, and a simple manufacturing process. It is possible to easily manufacture the reflector. Then, mass production of the power LED chip package using the mold die is possible, and constant shape and optical characteristics are maintained.

The present invention can reduce the production cost and improve the reliability of the product by excellent heat dissipation, excellent heat dissipation effect can reduce the light loss can bring the effect of saving the electrical energy.

Claims (4)

Dual Reflective High Brightness LED The module of claim 1, wherein the module is in the form of a PCB BAR. The heat sink of claim 1, wherein the heat sink has an air-cooled structure. The variable heat sink of claim 3, wherein
KR1020090122131A 2009-12-08 2009-12-08 Variable lighting alumimum heat sink structure KR20110065236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090122131A KR20110065236A (en) 2009-12-08 2009-12-08 Variable lighting alumimum heat sink structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090122131A KR20110065236A (en) 2009-12-08 2009-12-08 Variable lighting alumimum heat sink structure

Publications (1)

Publication Number Publication Date
KR20110065236A true KR20110065236A (en) 2011-06-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090122131A KR20110065236A (en) 2009-12-08 2009-12-08 Variable lighting alumimum heat sink structure

Country Status (1)

Country Link
KR (1) KR20110065236A (en)

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