KR20110061188A - Bake apparatus and method for cooling hot plate of the same - Google Patents

Bake apparatus and method for cooling hot plate of the same Download PDF

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Publication number
KR20110061188A
KR20110061188A KR1020090117759A KR20090117759A KR20110061188A KR 20110061188 A KR20110061188 A KR 20110061188A KR 1020090117759 A KR1020090117759 A KR 1020090117759A KR 20090117759 A KR20090117759 A KR 20090117759A KR 20110061188 A KR20110061188 A KR 20110061188A
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KR
South Korea
Prior art keywords
cooling
heating plate
air
plate
method
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Application number
KR1020090117759A
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Korean (ko)
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KR101109080B1 (en
Inventor
유양열
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세메스 주식회사
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16Coating processes; Apparatus therefor
    • G03F7/168Finishing the coated layer, e.g. drying, baking, soaking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26Processing photosensitive materials; Apparatus therefor
    • G03F7/40Treatment after imagewise removal, e.g. baking
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Exposure apparatus for microlithography
    • G03F7/708Construction of apparatus, e.g. environment, hygiene aspects or materials
    • G03F7/70858Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875Temperature
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67248Temperature monitoring

Abstract

The present invention relates to a baking apparatus and a heating plate cooling method thereof. The baking device has first and second cooling members for forcibly cooling the heating plate. The first and second cooling members directly spray the cooling air to the upper and lower surfaces of the heating plate to cool the heating plate. According to the present invention, the time required for forced cooling of the heating plate is shortened.
Figure P1020090117759
Baking device, heating plate, cooling element, forced cooling, air

Description

BAKE APPARATUS AND METHOD FOR COOLING HOT PLATE OF THE SAME}

The present invention relates to a substrate processing apparatus, and more particularly, to a baking apparatus and a method for forcibly cooling a plate.

In general, various processes such as cleaning, deposition, photolithography, etching, and ion implantation are performed to manufacture a semiconductor device. Photolithography processes performed to form circuit patterns on a substrate play an important role in achieving high integration of semiconductor devices.

A spinner system for performing a photolithography process includes an application unit, an exposure unit, a development unit, and a bake unit, wherein the wafer is a bake unit, an application unit, a bake unit, an exposure unit, a bake unit, a development unit, and a bake The process is performed while the units are moved sequentially. The baking unit has a heating member for heating a substrate, for example, a wafer, and a cooling member for cooling the wafer.

Generally, a plurality of wafers in which the process is performed are grouped. Wafers belonging to the same group are processed under the same process conditions, and wafers belonging to different groups are processed under different process conditions. For example, after the process is completed for wafers belonging to one group and before the process is performed on wafers belonging to the next group, the heating temperature of the heating member must be adjusted to suit the heating temperature of wafers belonging to the next group. Therefore, when the next group of wafers is required to be heated to a temperature lower than the process temperature of the previous group of wafers, the temperature of the heating member must be forcedly cooled.

The heating member has a heating plate on which the wafer is placed. Before the process is completed for the wafers belonging to one group and the process is carried out for the wafers belonging to the next group, the temperature of the heating plate is adapted to the processing conditions (eg, the heating temperature) of the wafers belonging to the next group described above. It must be adjusted. The temperature rise of the heating plate can be performed quickly by increasing the thermal energy provided to the heating plate.

However, since the temperature drop of the heating plate is made by the natural cooling method, it takes much time. When the heating plate is cooled by the natural cooling method, it takes about 1 minute to lower the temperature by 1 ° C. If the difference in heating temperature between the groups is about 50 ° C., the wafers belonging to the next group should wait about 50 minutes for the heating plate to cool. Therefore, the operation rate of the equipment is greatly reduced.

It is an object of the present invention to provide a baking apparatus and method for forced cooling of a plate on which a substrate is seated.

Another object of the present invention is to provide a baking apparatus and a method for forcibly cooling a plate using air.

It is still another object of the present invention to provide a baking apparatus and method for shortening the cooling time of a plate on which a substrate is seated.

In order to achieve the above objects, the baking apparatus of the present invention is characterized by cooling the heating plate using a plurality of cooling members. Such a baking device can shorten the time required for cooling a heating plate.

Baking apparatus of the present invention according to this aspect, the heating plate for heating the substrate; A first cooling member supplying cooling air to an upper surface of the heating plate; And a second cooling member supplying the cooling air to the lower surface of the heating plate.

In one embodiment, the first and second cooling members simultaneously supply the cooling air to the upper and lower surfaces of the heating plate to forcibly cool the heating plate.

In another embodiment, the baking device; A lower chamber in which the heating plate is provided on an upper surface thereof; An upper chamber coupled to the lower chamber to form an inner space for processing a baking process; A cover installed on an inner upper surface of the upper chamber and configured to insulate the air by supplying air to the inner space; And a base disposed between the heating plate and the lower chamber to secure the heating plate.

In yet another embodiment, the cover; An upper plate coupled to the inner upper surface of the upper chamber and receiving the air; It is coupled to the upper plate and spaced apart at a predetermined interval to form a sealed space, and includes a lower plate for receiving the air from the upper plate to supply to the inner space.

In another embodiment, the first cooling member is installed in the sealed space of the cover.

In another embodiment, the first cooling member is provided as a spiral tube of which the radius is smaller toward the center from the edge of the cover, and provides a plurality of air nozzles for supplying the cooling air to the lower plate. .

In another embodiment, the upper plate is formed with a groove so that the first cooling member is fixed to the lower surface; The lower plate provides through holes at positions opposite to the air nozzles to inject the cooling air supplied from the air nozzles to the upper surface of the heating plate.

In another embodiment, the first cooling member receives the cooling air at one end, the other end is closed, and is fixed to the closed space by the combination of the upper plate and the lower plate.

In another embodiment, the second cooling member is installed in the inner space of the base, and includes a plurality of air nozzles for receiving the cooling air supplied to the lower surface of the heating plate.

According to another feature of the invention, a method of forcibly cooling a heating plate of a baking device is provided. According to this method, a heating plate is cooled using a plurality of cooling members.

In the heating plate cooling method of the baking apparatus according to this aspect, when forcibly cooling the heating plate after the baking process of the baking apparatus is completed, the cooling air is simultaneously sprayed to the upper and lower surfaces of the heating plate.

In one embodiment, the simultaneous injection of the cooling air; Injecting the cooling air from the first cooling member disposed above the heating plate to the upper surface of the heating plate, and the cooling air from the second cooling member disposed below the heating plate to the lower surface of the heating plate Inject air.

In another embodiment, the method; When forcibly cooling the heating plate, the chiller arm of the baking apparatus may be in contact with the heating plate to be primarily cooled before injecting the cooling air.

As described above, the baking apparatus of the present invention can rapidly cool the heating plate by directly injecting cooling air to the upper and lower surfaces of the heating plate using the first and second cooling members.

Therefore, the baking apparatus may increase the operation rate by adjusting the temperature of the heating plate in response to various baking processes, thereby improving productivity.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 5.

1 is a view showing the configuration of a baking apparatus according to the present invention.

Referring to FIG. 1, the baking apparatus 100 includes a plurality of cooling members 120 and 140 for cooling the heating plate 106 on which the substrate is mounted.

In detail, the baking apparatus 100 includes upper and lower chambers 102 and 104, a hot plate 106, a cover 110, a base 105, and a first cooling member 120. And a second cooling member 140. The baking apparatus 100 also includes a plurality of lift pins 108 installed on the base 105.

The upper chamber 102 is movable up and down and is combined with the lower chamber 104 to form a space for processing the baking process therein. The upper chamber 102 is provided with a cover 110 on the inner top. The cover 110 receives air from the air inlet 130 of the upper chamber 102 and supplies it into the chambers 102 and 104 in order to insulate the baking process. Air is discharged to the plurality of exhaust ports 132 and 134 provided at the upper edge of the upper chamber 102 together with the air inside the chambers 102 and 104. Accordingly, during the baking process, fumes generated by the photoresist applied in the photolithography process are discharged to the exhaust ports 132 and 134.

The cover 110 is fixedly installed on the upper inner wall of the upper chamber 102. The cover 110 is provided with a plurality of discharge ports (116 of FIG. 2) that receive air supplied from the air inlet 130 and uniformly inject into the chambers 102 and 104. Air injected by the discharge ports 116 is discharged to the outside through the exhaust ports 132 and 134. The cover 110 is provided with a first cooling member 120 therein. The first cooling member 120 supplies cooling air from the upper portion of the heating plate 106 to forcibly cool the heating plate 106. A description of the first cooling member 120 will be described later with reference to FIGS. 2 and 3.

The lower chamber 104 is provided with a heating plate 106 at the top. The base 105 is disposed between the lower chamber 104 and the heating plate 106. That is, the base chamber 105 is installed on the lower chamber 104, and the heating plate 106 is installed on the base 105.

The heating plate 106 is provided as a generally circular plate opposite the substrate, on which the substrate is seated. The heating plate 106 is provided with a heater (not shown) therein to heat the substrate seated on the upper surface during the baking process. In addition, the heating plate 106 is provided with a plurality of sensors (not shown) on one side, and measures the temperature of the heating plate 106.

Base 105 secures heating plate 106 by an edge. The base 105 is electrically connected to lift pins 108, a heater (not shown), a sensor (not shown), and the like, for heating or measuring the temperature of the heating plate 106 in the lower inner portion A. Various cables (not shown) are installed. The base 105 provides a plurality of holes through which the lift pins 108 can be up and down. The lift pins 108 are moved up and down by an elevating device (not shown) to lift the substrate to a position spaced from the heating plate 106 or to rest the substrate on the heating plate 106.

In addition, the base 105 is provided with a flow path 138 for exhausting the ambient atmosphere such as various cables (not shown) installed inside the bottom. The base 105 is also provided with a second cooling member 140 in the lower inner (A).

The second cooling member 140 forcibly cools the heating plate 106 together with the first cooling member 120. The plurality of air nozzles 140 are formed in the base 105 to receive the cooling air through the flow path 136, and spray the cooling air to the lower surface of the heating plate 106. )

The baking apparatus 100 forcibly cools the heating plate 106 by using the first and second cooling members 120 and 140 after the baking process.

2 and 3, the cover 110 has a structure in which the upper plate 112 and the lower plate 114 are stacked, for example. The upper plate 112 and the lower plate 114 have substantially the same shape. The upper plate 112 is fixedly installed on the inner upper wall of the upper chamber. The lower plate 114 is coupled to the lower end of the upper plate 112.

The upper plate and the lower plate are provided with a plurality of through holes 116: 116a and 116b. The through holes 116 receive air supplied from the air inlet 130 of the upper chamber 102 and uniformly supply the air into the chambers 102 and 104.

In addition, the cover 110 forms a closed space between the upper plate 112 and the lower plate 114 by a predetermined interval apart. The first cooling member 120 is inserted and installed in this sealed space. To this end, the upper plate 112 is formed with a groove 118 of the same shape as the first cooling member 120 so that the first cooling member 120 is fixed to the lower surface.

The first cooling member 120 is generally provided as a spiral tube whose radius decreases toward the center from the edge of the upper plate 112. The first cooling member 120 is inserted through the side wall of the cover 110, that is, through the side wall of the space formed between the upper plate 112 and the lower plate 114, along the groove 118 of the upper plate 112. Is installed. Therefore, the first cooling member 120 is fixed by the upper plate 112 and the lower plate 114.

As shown in FIG. 4, the first cooling member 120 is provided with an inlet for receiving cooling air at one end 122 and the other end 124 is closed. The first cooling member 120 provides a plurality of air nozzles 126 between one end 122 and the other end 124.

The air nozzles 126 maintain a generally uniform spacing for uniformly supplying cooling air to the heating plate 106. The air nozzles 126 spray cooling air toward the lower plate 114. Therefore, the lower plate 114 provides the through holes 115 at positions opposite to the air nozzles 126, as shown in FIG. 3.

In the baking apparatus of the present invention, in order to shorten the time required to cool the heating plate 106, the heating plate 106 is supplied by supplying cooling air to the upper and lower portions of the heating plate using the first and second cooling members. ) Forced cooling.

5 is a flowchart showing a procedure for forced plate cooling of the baking apparatus according to the present invention.

Referring to FIG. 5, when the baking process is completed in step S200, the baking apparatus unloads the substrate in step S210. That is, at the time of a baking process, a board | substrate is loaded in the heating plate 106, the heating plate 106 is heated, and a board | substrate is heated. If it is necessary to forcibly cool the heating plate in step S220, for example, when the substrate is treated at a temperature lower than the temperature of the current heating plate 106 in a subsequent process, this procedure is performed in step 230 with the first and second cooling. The heating plate 106 is forcedly cooled by supplying cooling air to the upper and lower portions of the heating plate 106 using the member. At this time, the baking apparatus 100 may primarily cool the heating plate 106 by using a chill arm (not shown). That is, the baking device 100 first cools the chill arm by contacting the heating plate 106 and then the top surface of the heating plate 106 from the first and second cooling members 120, 140 and The heating plate 106 may be forcedly cooled by supplying cooling air to the lower surface. Therefore, the present invention shortens the time required to cool the heating plate 106.

Of course, the baking apparatus 100 of the present invention uses the chill arm (not shown) to cool the heating plate 106 by natural cooling or forced cooling. The heating plate 106 may be cooled by using any one of the first and second cooling members 120 and 140.

In the above, the configuration and operation of the baking apparatus according to the present invention has been shown in accordance with the detailed description and drawings, but this is merely described by way of example, and various changes and modifications can be made without departing from the spirit of the present invention. Do.

1 is a view showing the configuration of a baking apparatus according to the present invention;

FIG. 2 is a diagram showing the configuration of the shower head shown in FIG. 1; FIG.

3 is a cross-sectional view showing the configuration of the shower head shown in FIG. 2;

4 is a view showing the configuration of the air nozzle shown in FIG. 2; And

5 is a flowchart illustrating a procedure for forced plate cooling of the baking apparatus according to the present invention.

Description of the Related Art [0002]

100: baking device 102: upper chamber

104: lower chamber 106: heating plate

110 cover 120 first cooling member

126: air nozzle 140: second cooling member

Claims (12)

  1. In the baking device:
    A heating plate for heating the substrate;
    And a first cooling member for supplying cooling air to an upper surface of the heating plate.
  2. The method of claim 1,
    The baking device is;
    Further comprising a second cooling member for supplying the cooling air to the lower surface of the heating plate;
    And the first and second cooling members simultaneously supply the cooling air to the upper and lower surfaces of the heating plate to forcibly cool the heating plate.
  3. The method according to claim 1 or 2,
    The baking device is;
    A lower chamber in which the heating plate is provided on an upper surface thereof;
    An upper chamber coupled to the lower chamber to form an inner space for processing a baking process;
    A cover installed on an inner upper surface of the upper chamber and configured to insulate the air by supplying air to the inner space;
    And a base disposed between the heating plate and the lower chamber to fix the heating plate.
  4. The method of claim 3, wherein
    The cover is
    An upper plate coupled to the inner upper surface of the upper chamber and receiving the air;
    And a lower plate coupled to the upper plate at a predetermined interval to form a sealed space and receiving the air from the upper plate and supplying the air to the inner space.
  5. The method of claim 4, wherein
    And the first cooling member is installed in the sealed space of the cover.
  6. The method of claim 5,
    The first cooling member is provided with a spiral tube of which the radius is smaller toward the center from the edge of the cover, the baking device characterized in that it provides a plurality of air nozzles for supplying the cooling air to the lower plate .
  7. The method of claim 6,
    The upper plate is formed with a groove so that the first cooling member is fixed to the lower surface;
    And the lower plate provides through holes at positions opposite to the air nozzles to inject the cooling air supplied from the air nozzles to an upper surface of the heating plate.
  8. The method of claim 7, wherein
    And the first cooling member receives the cooling air at one end thereof, and the other end thereof is closed and fixed to the sealed space by coupling the upper plate and the lower plate.
  9. The method of claim 3, wherein
    The second cooling member is installed in the inner space of the base, the baking device, characterized in that it comprises a plurality of air nozzles for supplying the cooling air and spraying to the lower surface of the heating plate.
  10. In the method of cooling the heating plate of the baking apparatus:
    And heating the cooling plate to the upper surface of the heating plate when the heating plate is forcedly cooled after the baking process of the baking device is completed.
  11. 11. The method of claim 10,
    The method;
    Injecting the cooling air to the lower surface of the heating plate further;
    Spraying the cooling air;
    The cooling air is injected from the first cooling member disposed above the heating plate to the upper surface of the heating plate, and at the same time the cooling from the second cooling member disposed below the heating plate to the lower surface of the heating plate. Heating plate cooling method characterized by injecting the air.
  12. The method of claim 10 or 11,
    The method;
    And, when forcibly cooling the heating plate, cooling the chill arm of the baking device to the heating plate and cooling it primarily before injecting the cooling air.
KR1020090117759A 2009-12-01 2009-12-01 Bake apparatus and method for cooling hot plate of the same KR101109080B1 (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020090117759A KR101109080B1 (en) 2009-12-01 2009-12-01 Bake apparatus and method for cooling hot plate of the same

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KR101109080B1 KR101109080B1 (en) 2012-02-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149883A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Chamber design for semiconductor processing

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Publication number Priority date Publication date Assignee Title
KR101333619B1 (en) * 2013-06-04 2013-11-27 주식회사 광림 Snow plow having cyclone type melting appratus of snow

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KR100543711B1 (en) * 2004-06-19 2006-01-20 삼성전자주식회사 Heat treatment apparatus
JP4939850B2 (en) * 2006-06-16 2012-05-30 株式会社東芝 Substrate processing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014149883A1 (en) * 2013-03-15 2014-09-25 Applied Materials, Inc. Chamber design for semiconductor processing

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