KR20110061186A - Nozzle cleaning apparatus, substrate coating apparatus including the same and method for cleaning nozzle thereof - Google Patents

Abstract

PURPOSE: A nozzle cleaning device, a substrate coating device including the same, and a nozzle cleaning method thereof are provided to prevent photoresist remaining on an outlet of a silt nozzle from being hardened by cleaning the outlet of the slit nozzle with a noncontact method. CONSTITUTION: A slit nozzle(110) spreads photoresist on the surface of a substrate(S). A nozzle cleaning device(120) cleans the outlet of the slit nozzle with a noncontact method. A plate(106) is arranged on one side of a base(102). The nozzle cleaning device and a preliminary discharge device(130) are arranged on the other side of the base in parallel. A bubbler generates bubbles with first cleaning solutions received in a first bath.

Description

NOZZLE CLEANING APPARATUS, SUBSTRATE COATING APPARATUS INCLUDING THE SAME AND METHOD FOR CLEANING NOZZLE THEREOF

The present invention relates to a substrate coating apparatus, and more particularly to a nozzle cleaning apparatus for cleaning the discharge port of the slit nozzle for applying a photoresist to the substrate, and a substrate coating apparatus having the same and a nozzle cleaning method thereof.

Semiconductor and flat panel display manufacturing processes use processes to which various methods are applied to form desired circuit patterns on substrates such as wafers, glass substrates, and the like. The substrate processing apparatus for treating the substrate forms a circuit pattern on the substrate by processing a photolithography process. The photolithography process is largely composed of a photoresist coating process, an exposure process and a developing process.

In general, a photolithography process is performed in a spinner facility in which an exposure apparatus is connected to one side to continuously process an application process, an exposure process, and a developing process. The spinner facility has a substrate processing section consisting of an indexer, an application unit, a developing unit, and a baking unit. The application unit coats the photoresist on the substrate surface using a nozzle. In general, photoresists are easily hardened when exposed to the outside. Therefore, the coating unit periodically cleans the discharge port of the nozzle to prevent the discharge port of the nozzle from sticking due to curing of the photoresist.

For example, a general coating unit simply sprays a cleaning liquid that prevents curing of the photoresist toward the discharge port of the nozzle, or periodically discharges a certain amount of photoresist from the discharge port of the nozzle to prevent curing of the discharge port of the nozzle.

However, such a nozzle cleaning method has a problem in that the amount of the photoresist and the cleaning solution is increased by supplying the nozzle without cleaning the flow rate of the cleaning solution to prevent hardening and sticking, thereby cleaning the nozzle. In addition, since the amount of the cleaning liquid cannot be adjusted during nozzle cleaning, it is not effective to prevent photoresist hardening and sticking at the nozzle discharge port.

An object of the present invention is to provide a nozzle cleaning apparatus for cleaning a discharge port of a slit nozzle for applying a photoresist.

It is another object of the present invention to provide a substrate applying apparatus and method comprising a nozzle cleaning apparatus for cleaning a discharge port of a slit nozzle for applying a photoresist to a surface of a substrate.

It is still another object of the present invention to provide an apparatus and method for preventing the hardening and sticking of photoresist remaining at the discharge port of the slit nozzle for applying the photoresist.

To achieve the above objects, the nozzle cleaning apparatus of the present invention is characterized by generating bubbles with a cleaning liquid for cleaning the outlet of the slit nozzle. Such a nozzle cleaning apparatus may adjust the amount of bubbles generated to adjust the amount of volatilization of the cleaning liquid.

The nozzle cleaning apparatus of the present invention according to this aspect includes a bath for opening an upper portion where a slit nozzle is located, extending corresponding to the length of the slit nozzle, and accommodating a cleaning liquid therein; And a bubbler installed inside the bath to generate bubbles with the cleaning liquid contained in the bath to adjust the volatilization amount of the cleaning liquid. The nozzle cleaning apparatus cleans the discharge port of the slit nozzle with the volatilized cleaning liquid.

In one embodiment, the bubbler is; A body installed on the bottom surface of the bath; It is formed in the body, and includes a plurality of injection holes for injecting the gas into the cleaning liquid to generate a bubble.

In another embodiment, the body is provided in the shape of a polygonal column that is open to one side facing the lower wall of the bath, and extends corresponding to the bath. The injection holes are provided through the surface of the body. Accordingly, the bubbler receives the gas into the inner space formed by the lower wall of the bath and the body to generate bubbles out of the body through the injection holes.

In another embodiment, the body is provided in a cylindrical columnar shape, one side of which is opposite to the lower wall of the bath is open and extends corresponding to the bath. The injection holes are provided through the surface of the body. Accordingly, the bubbler receives the gas into the inner space formed by the lower wall of the bath and the body to generate bubbles out of the body through the injection holes.

According to another characteristic of this invention, the board | substrate coating apparatus for cleaning the discharge port of the slit nozzle which apply | coats a photoresist to the surface of a board | substrate is provided. Such a substrate coating apparatus of the present invention can generate bubbles with a cleaning liquid for cleaning the discharge port of the slit nozzle and can be cleaned in a non-contact manner.

A substrate applying apparatus of the present invention according to this aspect includes a plate on which a substrate is seated; A slit nozzle having a discharge port which moves in the longitudinal direction of the substrate to apply a photoresist to the surface of the substrate; And a nozzle cleaning device disposed on one side of the plate, accommodating a first cleaning liquid therein, and cleaning the discharge port of the slit nozzle with the first cleaning liquid in a non-contact manner.

In one embodiment, the substrate applying apparatus; The apparatus may further include a preliminary ejection apparatus disposed between the plate and the nozzle cleaning apparatus to accommodate a second cleaning liquid therein and to clean the ejection opening of the slit nozzle by a contact method using the second cleaning liquid.

In another embodiment, the nozzle cleaning apparatus; A first bath having an upper opening, extending corresponding to the length of the slit nozzle, and accommodating the first cleaning liquid therein; And a bubbler installed inside the first bath to generate bubbles with the first cleaning solution contained in the first bath to adjust the volatilization amount of the first cleaning solution.

In yet another embodiment, the bubbler is; A body installed on a lower surface of the first bath; It is formed in the body, and includes a plurality of injection holes for injecting the gas into the first cleaning liquid to generate a bubble.

In another embodiment, the body is provided in the shape of a cylindrical pillar or a polygonal cylinder that is open to one side facing the lower wall of the first bath, and extends corresponding to the first bath. The injection holes are provided through the surface of the body. Accordingly, the bubbler receives the gas into the inner space formed by the lower wall of the first bath and the body to generate bubbles out of the body through the injection holes.

In another embodiment, the preliminary ejection device; A second bath in which an upper portion at which the slit nozzle is located is opened, extends corresponding to the length of the slit nozzle, and accommodates the second cleaning liquid therein; A part protrudes above the water surface of the second cleaning liquid contained in the second bath, the part and the discharge port of the slit nozzle come into contact with each other to wet the second cleaning liquid to the discharge port of the slit nozzle, and rotate the second And a roller for cleaning the entire surface with the cleaning liquid.

According to still another feature of the present invention, there is provided a nozzle cleaning method of a substrate coating apparatus comprising a slit nozzle for applying a photoresist to a substrate surface.

According to this method, the discharge port of the slit nozzle is positioned above the bath containing the cleaning liquid, and the gas is supplied to generate bubbles with the cleaning liquid to adjust the volatilization amount of the cleaning liquid. The discharge port of the slit nozzle is cleaned with the volatilized cleaning solution.

In one embodiment, adjusting the volatilization amount of the cleaning liquid; The amount of generation of the bubbles is controlled by adjusting the flow rate of the gas.

As described above, the nozzle cleaning apparatus of the present invention supplies bubbles to the cleaning liquid for cleaning the discharge port of the slit nozzle to generate bubbles, thereby controlling the amount of bubbles generated according to the flow rate of the gas during the cleaning of the slit nozzle to volatilize the cleaning liquid. The amount can be adjusted.

In addition, the substrate coating apparatus of the present invention generates bubbles with the cleaning liquid and cleans the discharge opening of the slit nozzle in a non-contact manner by using the cleaning liquid atmosphere generated by the bubble, thereby curing or fixing the photoresist remaining at the discharge opening of the slit nozzle. Can be prevented.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 1 to 6.

1 is a perspective view showing the configuration of a substrate coating apparatus according to the present invention, Figures 2 and 3 are views showing a configuration according to an embodiment of the nozzle cleaning apparatus shown in FIG.

Referring to FIG. 1, the substrate applying apparatus 100 is, for example, a slit coater for applying a photoresist to the surface of the display substrate S, and to apply the photoresist to the surface of the substrate S. And a nozzle cleaning device 120 for cleaning the discharge port (112 in FIG. 2) of the slit nozzle 110 in a non-contact manner. In addition, the substrate applying apparatus 100 includes a base 102, a plate 106 disposed on the base 102 and a substrate S on which the substrate S is seated, and a preliminary discharge device 130 disposed on one side of the plate 106. And a processing liquid supply part 104 for supplying the photoresist pressurized to the slit nozzle 110 at a predetermined pressure.

The base 102 has a constant height and is provided flat at the top. Base 102 is a plate 106 is disposed on one side of the top. The base 102 has the nozzle cleaning device 120 and the preliminary ejection device 130 arranged side by side on the other side of the upper end. In addition, the base 102 is provided with utilities (not shown) such as piping and driving devices of the substrate coating apparatus 100 therein.

The slit nozzle 110 is a rod-shaped nozzle and extends in the width direction perpendicular to the length direction of the substrate S. In general, the slit nozzle 110 has a length similar to the width of the substrate (S). The slit nozzle 110 is moved back and forth and up and down on the base 102. The slit nozzle 110 has a slit-shaped discharge port 112 for discharging the photoresist at a lower end facing the substrate S. The slit nozzle 110 discharges a predetermined amount of photoresist onto the surface of the substrate S while scanning movement in the front-rear direction, that is, the longitudinal direction of the substrate S, from the upper portion of the substrate S, thereby depositing the photoresist on the entire substrate S. Apply evenly. Therefore, the slit nozzle 110 receives the photoresist pressurized from the processing liquid supply part 104 at a predetermined pressure and discharges it to the surface of the substrate S through the discharge port 112. The slit nozzle 110 is located above the nozzle cleaning device 120 in the process atmosphere.

The nozzle cleaning apparatus 120 cleans the discharge holes 112 of the slit nozzle 110 in order to prevent the photoresist remaining in the discharge holes 112 of the slit nozzle 110 waiting for the process to be hardened or fixed. The nozzle cleaning device 120 is disposed on one side of the plate 106. The nozzle cleaning apparatus 120 accommodates the first cleaning liquid therein and cleans the discharge port 112 of the slit nozzle 110 with the first cleaning liquid in a non-contact manner.

That is, the first cleaning liquid is a volatile chemical liquid, and includes, for example, a thinner. Accordingly, the nozzle cleaning apparatus 120 volatilizes the first cleaning liquid to form the first cleaning liquid atmosphere around the discharge port 112 of the slit nozzle 110, and discharges the opening of the slit nozzle 110 using the first cleaning liquid atmosphere. The photoresist remaining at 112 is prevented from curing or sticking. At this time, the nozzle cleaning apparatus 120 receives gas and sprays the first cleaning liquid to generate bubbles in order to adjust the volatilization amount of the first cleaning liquid.

Specifically, the nozzle cleaning apparatus 100 of this embodiment, as shown in Figures 2 and 3, the first bath (dip bath) 122, the bubbler (bubbler 140), and the gas supply unit 144 It includes.

The first bath 122 receives the first cleaning liquid 124 therein. The first bath 122 has an upper portion at which the slit nozzle 110 is located and extends corresponding to the length of the slit nozzle 110.

The bubbler 140 is installed inside the first bath 122, receives the gas from the gas supply unit 144, generates bubbles with the first cleaning liquid 124 accommodated in the first bath 122, and the second cleaning liquid. Adjust the volatilization of (124). The volatilized first cleaning liquid 124 forms a first cleaning liquid atmosphere around the discharge port 112 of the slit nozzle 110.

The bubbler 140 includes a body 146 installed on the lower surface of the first bath 122 and a plurality of injection holes formed in the body 146 and injecting gas into the first cleaning liquid 124 to generate bubbles. And (142). The body 146 is provided in a polygonal cylindrical shape in which one surface facing the lower wall of the first bath 122 is opened and extends corresponding to the first bath 122. The injection holes 142 are provided through the body 146. Accordingly, the bubbler 140 receives the gas from the gas supply unit 144 into the inner space formed by the lower wall of the first bath 122 and the body 146, and then moves outward from the body 146 through the injection holes 142. Generate a bubble.

The gas supply unit 144 adjusts the flow rate of the gas and supplies the gas to the bubbler 140. That is, the gas supply unit 144 supplies gas to the inner space formed by the lower wall of the first bath 122 and the body 146. For example, the gas supply unit 144 supplies a gas that does not affect the process, for example, air or nitrogen (N 2) gas, to the bubbler 140. At this time, the gas supply unit 144 adjusts the flow rate of the gas, and adjusts the generation amount (ie, the amount of bubbles) of the bubble generated from the bubbler 140. Therefore, the volatilization amount of the first cleaning solution 124 may be adjusted in response to the bubble amount generated from the bubbler 140.

As another embodiment 100a, the nozzle cleaning apparatus 120a provides a cylindrical columnar bubbler 140a, as shown in FIGS. 4 and 5. That is, the bubbler 140a has one side of a cylindrical columnar shape facing the lower wall of the first bath 122, and the body 146a and the body 146a extending in correspondence with the first bath 122. It includes a plurality of injection holes (142a) provided through the. The bubbler 140a also receives gas from the gas supply unit 144 into the inner space formed by the lower wall of the first bath 122 and the body 146a and then outwards the body 146a through the injection holes 142a. Generate a bubble.

As described above, the substrate coating apparatuses 100 and 100a of the present invention locate the discharge port 112 of the slit nozzle 110 above the first bath 122 containing the first cleaning liquid 124, and supply gas. And generate bubbles with the first cleaning liquid 124 to adjust the volatilization amount of the first cleaning liquid 124, and then clean the outlet 112 of the slit nozzle 110 with the volatilized first cleaning liquid 124 in a non-contact manner. do. At this time, the amount of volatilization of the first cleaning liquid 124 is controlled by the flow rate of the gas.

The preliminary ejection apparatus 130 performs preliminary ejection and cleaning processing of the slit nozzle 110 before the slit nozzle 110 applies the photoresist to the substrate S. FIG. The preliminary ejection device 130 is disposed side by side between the plate 106 and the nozzle cleaning device 120. The preliminary discharge device 130 accommodates the second cleaning liquid 136 therein and cleans the discharge port 112 of the slit nozzle 110 by the contact method using the second cleaning liquid 136.

That is, referring to FIG. 6, the preliminary ejection device 130 may have an upper portion where the slit nozzle 110 is located, open to correspond to the length of the slit nozzle 110, and have a second cleaning liquid 136 therein. A second bath 132 to be accommodated, and a roller 134 is rotatably installed in the second bath 132 and preliminarily discharges the photoresist from the discharge port 112 of the slit nozzle 110. The second cleaning liquid 136 includes a chemical liquid for removing the photoresist, for example, sorbent and the like. When the roller 134 rotates, a part of the roller 134 protrudes above the water surface of the second cleaning liquid 136 accommodated in the second bath 132. When the roller 134 rotates, a part of the roller 134 contacts the discharge port 112 of the slit nozzle 110. At this time, the slit nozzle 110 is located above the second bath 132, and preliminarily discharges a small amount of photoresist to the discharge port 112. The pre-discharged photoresist is removed by the roller 134 while the roller 134 in contact with the discharge port 112 is rotated. The roller 134 is rotated to clean the discharge port 112 by bringing the second cleaning liquid 136 into contact with the discharge port 112 of the slit nozzle 110.

The substrate coating apparatuses 100 and 100a of the present invention described above generate bubbles with the first cleaning liquid 124 using the nozzle cleaning apparatuses 120 and 120a, thereby discharging the opening 112 of the slit nozzle 110 in a non-contact manner. Can be cleaned. In addition, the substrate coating apparatuses 100 and 100a may use the preliminary ejection apparatus 130 to clean the ejection openings 112 of the slit nozzle 110 in a contact manner during preliminary ejection.

When the substrate S is loaded onto the plate 106, the substrate applying apparatuses 100 and 100a may have the slit nozzle 110 above the preliminary ejection apparatus 130 before the photoresist is applied to the substrate S. The discharge port 112 is moved to be located. The preliminary ejection device 130 rotates the roller 134 to contact the ejection opening 112 of the slit nozzle 110. At this time, the slit nozzle 110 preliminarily discharges a small amount of photoresist on the contact surface of the roller 134. The photoresist discharged on the surface of the roller 134 is removed in the second bath 132 in which the second cleaning liquid 136 is accommodated as the roller 134 rotates. In addition, when the discharge port 112 of the slit nozzle 110 is connected to the roller 134 and rotated, the second cleaning liquid absorbed by the roller 134 inside the second bath 132 may facilitate discharge of the slit nozzle 110. The outlet 112 is cleaned by wetting the outlet 112.

In addition, the substrate applying apparatuses 100 and 100a may use the nozzle cleaning apparatus 120 or 120a as a slit nozzle 110 to prevent the photoresist remaining in the discharge port 112 of the slit nozzle 110 in the air and adhered to the foreign matter. The discharge port 112 of is cleaned.

That is, the substrate applying apparatuses 100 and 100a move the slit nozzle 110 over the substrate S, apply a photoresist to the surface of the substrate S, and then apply the applied substrate S to the plate 106. Unloaded from and move the slit nozzle 110 to the top of the nozzle cleaning apparatus 120, 120a while the new substrate S is loaded into the plate 106. At this time, the slit nozzle 110 moved to the upper portion of the nozzle cleaner 120 waits without discharging the photoresist. Therefore, the nozzle cleaning apparatuses 120 and 120a clean the discharge holes 112 during the waiting time of the slit nozzle 110.

In the above, the configuration and operation of the nozzle cleaning apparatus and the substrate coating apparatus having the same according to the present invention have been disclosed in accordance with the detailed description and the drawings. Various changes and modifications are possible within the scope.

1 is a perspective view showing the configuration of a substrate coating apparatus according to the present invention;

2 is a perspective view showing a configuration according to an embodiment of the nozzle cleaning apparatus shown in FIG. 1;

3 is a cross-sectional view showing the configuration of the nozzle cleaning apparatus shown in FIG. 2;

4 is a perspective view showing a configuration according to another embodiment of the nozzle cleaning apparatus shown in FIG. 1;

FIG. 5 is a sectional view showing a configuration of the nozzle cleaning device shown in FIG. 4; FIG. And

6 is a cross-sectional view showing the configuration of the preliminary ejection apparatus shown in FIG. 1.

Description of the Related Art [0002]

100, 100a: substrate coating device 102: base

104: treatment liquid supply 106: plate

110: slit nozzle 112: discharge port

120, 120a: nozzle cleaning device 122: first bath

130: preliminary ejection device 140, 140a: bubbler

142, 142a: injection hole 144: gas supply unit

146, 146a: body

Claims (12)

In the nozzle cleaning device: A bath in which an upper portion at which the slit nozzle is located is opened, extends corresponding to the length of the slit nozzle, and accommodates the cleaning liquid therein; A bubbler installed inside the bath and generating a bubble with the cleaning liquid contained in the bath by receiving gas, thereby controlling a volatilization amount of the cleaning liquid; And the nozzle cleaning device cleans the discharge port of the slit nozzle with the volatilized cleaning liquid. The method of claim 1, The bubbler; A body installed on the bottom surface of the bath; And a plurality of injection holes formed in the body and generating bubbles by injecting the gas into the cleaning liquid. The method of claim 2, The body is provided in the shape of a polygonal cylindrical column which is open on one side facing the lower wall of the bath, and extends corresponding to the bath; The injection holes are provided through the surface of the body; And the bubbler receives the gas into an inner space formed by the lower wall of the bath and the body to generate bubbles out of the body through the injection holes. The method of claim 2, The body is provided in a cylindrical columnar shape that one side opposite to the lower wall of the bath is open and extends corresponding to the bath; The injection holes are provided through the surface of the body; And the bubbler receives the gas into an inner space formed by the lower wall of the bath and the body to generate bubbles out of the body through the injection holes. In the substrate applying apparatus: A plate on which the substrate is seated; A slit nozzle having a discharge port which moves in the longitudinal direction of the substrate to apply a photoresist to the surface of the substrate; And a nozzle cleaning device disposed at one side of the plate, accommodating a first cleaning liquid therein, and cleaning the discharge port of the slit nozzle with the first cleaning liquid in a non-contact manner. The method of claim 5, The substrate coating device; And a preliminary ejection apparatus disposed between the plate and the nozzle cleaning apparatus, accommodating a second cleaning liquid therein and cleaning the ejection opening of the slit nozzle by a contact method using the second cleaning liquid. Substrate coating device The method according to claim 5 or 6, The nozzle cleaning device; A first bath having an upper opening, extending corresponding to the length of the slit nozzle, and accommodating the first cleaning liquid therein; And a bubbler installed inside the first bath to generate bubbles with the first cleaning solution contained in the first bath to control the volatilization amount of the first cleaning solution. Device. The method of claim 7, wherein The bubbler; A body installed on a lower surface of the first bath; And a plurality of injection holes formed in the body and generating bubbles by injecting the gas into the first cleaning liquid. The method of claim 8, The body is provided in the shape of a cylindrical column or a polygonal column, one side of which is opened to face the lower wall of the first bath, and extends corresponding to the first bath; The injection holes are provided through the surface of the body; And the bubbler receives the gas into the inner space formed by the lower wall of the first bath and the body to generate bubbles to the outside of the body through the injection holes. The method of claim 6, The preliminary ejection device is; A second bath in which an upper portion at which the slit nozzle is located is opened, extends corresponding to the length of the slit nozzle, and accommodates the second cleaning liquid therein; A part protrudes above the water surface of the second cleaning liquid contained in the second bath, the part and the discharge port of the slit nozzle come into contact with each other to wet the second cleaning liquid to the discharge port of the slit nozzle, and rotate the second And a roller for washing the entire surface with the cleaning liquid. A nozzle cleaning method of a substrate applying apparatus comprising a slit nozzle for applying a photoresist to a substrate surface: The discharge port of the slit nozzle is located above the bath containing the cleaning liquid, and the gas is supplied to generate bubbles to the cleaning liquid to adjust the volatilization amount of the cleaning liquid, thereby cleaning the discharge port of the slit nozzle with the volatilized cleaning liquid. A nozzle cleaning method of a substrate coating device, characterized by the above-mentioned. The method of claim 11, Adjusting the volatilization amount of the cleaning liquid; The nozzle cleaning method of the substrate coating apparatus, characterized in that for adjusting the flow rate of the gas to control the generation amount of the bubble.

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