KR20110060868A - Heat sink board and manufacturing method thereof, light emitting diode package module having the same and manufacturing method thereof - Google Patents

Abstract

PURPOSE: A heat sink board, a light emitting diode package module including the same and manufacturing methods thereof are provided to improve heat dissipation efficiency by directly connecting the light emitting diode package to the heat sink board. CONSTITUTION: A light emitting diode package(120) is mounted on a heat sink board(110) by a conductive adhesion layer. The heat sink board includes a heat sink body(112), an insulation unit(116), and a solder resist layer(119). A zener diode(170) and a thermistor(180) are respectively mounted on the heat sink board. An alignment mark(190) is formed on the heat sink board. A package substrate(121) is comprised of a first substrate and a second substrate.

Description

Heat dissipation board, manufacturing method thereof, light emitting diode package module having heat dissipation board and manufacturing method {HEAT SINK BOARD AND MANUFACTURING METHOD THEREOF, LIGHT EMITTING DIODE PACKAGE MODULE HAVING THE SAME AND MANUFACTURING METHOD THEREOF}

The present invention relates to a heat dissipation substrate, a method of manufacturing the same, a light emitting diode package module having a heat dissipation substrate, and a method of manufacturing the same.

The light emitting diode package module includes a light emitting diode package on which a light emitting diode is mounted, and a substrate on which the light emitting diode package is mounted. The light emitting diode package module is coupled to a heat sink, whereby heat generated from the light emitting diode is discharged to the outside. Can be.

Conventionally, a printed circuit board (PCB) having a circuit pattern is used to electrically connect the light emitting diode to the driving driver module as a substrate for mounting the LED package.

However, when a general printed circuit board is used as the substrate, although the electrical connection between the driving driver module and the light emitting diode can be easily realized, the insulating layer formed on the printed circuit board acts as a thermal resistance, so that the heat radiation characteristics of the light source module are improved. There is a problem that is significantly reduced.

In addition, due to the deterioration of the heat dissipation characteristics, the light quantity of the light emitting diodes is reduced and the lifespan is shortened, so that it is difficult to apply the light emitting diodes to a high power head lamp requiring a high level of heat dissipation characteristics.

In addition, although the conventional electrical connection between the light emitting diode package and the substrate is implemented using a wire, in the case of using the wire as described above, an additional protection means for protecting the wire has been required. Accordingly, the size of the module is unnecessarily increased. In addition, manufacturing costs and time have also been increased.

The present invention provides a heat dissipation substrate having improved heat dissipation efficiency and improved connection reliability with a light emitting diode package, a method of manufacturing the same, a light emitting diode package module having the same, and a method of manufacturing the same.

According to an aspect of the present invention, a heat dissipation substrate includes: a heat dissipation body having a top surface on which protrusions are formed; An insulation layer formed on an area of the upper surface of the heat dissipation body in which the protrusion is not formed; And an electrode part formed on the insulating layer so as to be electrically insulated from the heat dissipating main body, and having an upper surface positioned at substantially the same height as the upper surface of the protrusion.

The heat dissipation body may include a flat plate having a flat upper surface, and a protrusion formed on the upper surface of the flat plate.

The protrusion may be made of the same material as the heat dissipation body.

Heat dissipation substrate according to an embodiment of the present invention is a heat dissipation body; An insulation part formed on an outer circumferential surface of the heat dissipation body and having a height lower than that of the heat dissipation body; And an electrode part formed on the insulating part so as to be electrically insulated from the heat dissipating body and having an upper surface substantially positioned at the same height as the top surface of the heat dissipating body.

The heat dissipation body may be made of a material including copper (Cu).

According to another aspect of the present invention, a light emitting diode package module includes a heat dissipation body having an upper surface on which a protrusion is formed, an insulating layer formed on an area where the protrusion is not formed on an upper surface of the heat dissipation body, and electrically insulated from the heat dissipation body. A heat dissipation substrate formed on the insulating layer, the heat dissipation substrate including an electrode part having an upper surface positioned at substantially the same height as an upper surface of the protrusion; And a light emitting diode package disposed on the protrusion and electrically connected to the electrode.

The heat dissipation body may include a flat plate having a flat upper surface, and a protrusion formed on the upper surface of the flat plate.

The protrusion may be made of the same material as the heat dissipation body.

A light emitting diode package module according to an embodiment of the present invention is formed on the heat dissipation body, the outer peripheral surface of the heat dissipation body and the insulating portion having a lower height than the heat dissipation body, and is formed on the insulator to be electrically insulated from the heat dissipation body; A heat dissipation substrate including an electrode portion having an upper surface positioned at substantially the same height as an upper surface of the heat dissipation body; And a light emitting diode package disposed on an upper surface of the heat dissipation body and electrically connected to the electrode unit.

The light emitting diode package includes a package substrate; A light emitting diode chip mounted on one surface of the package substrate; An electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; And a heat dissipation pad formed on the other surface of the package substrate to face the protrusion and electrically insulated from the electrode pad.

The heat dissipation pad may be bonded to the protrusion.

The light emitting diode package includes a package substrate; A light emitting diode chip mounted on one surface of the package substrate; An electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; And a heat dissipation pad formed on the other surface of the package substrate to face the top surface of the heat dissipation body and electrically insulated from the electrode pad.

The heat dissipation pad may be bonded to an upper surface of the heat dissipation body.

The heat dissipation body may be made of a material containing copper.

The package substrate may be made of a material including ceramic.

The electrode pad may be formed to face the electrode portion on the package substrate and may be bonded to the electrode portion.

The conductive adhesive layer may be further interposed between the protrusion and the heat dissipation pad, and between the electrode unit and the electrode pad.

The apparatus may further include a conductive adhesive layer interposed between the heat dissipation body and the heat dissipation pad and between the electrode portion and the electrode pad.

Opposite surfaces of the protrusion and the heat dissipation pad may have the same size, and opposing surfaces of the electrode portion and the electrode pad may have the same size.

An upper surface of the heat dissipation body and an opposing surface of the heat dissipation pad may have the same size, and an opposite surface of the electrode portion and the electrode pad may have the same size.

The conductive adhesive layer may be made of solder or may be made of a paste of a buffer material.

The display device may further include an alignment mark formed on the heat dissipation substrate to determine whether the package substrate is aligned with the heat dissipation substrate.

According to another aspect of the present invention, a method of manufacturing a heat dissipation substrate includes: forming a protrusion on an upper surface of a heat dissipation body; Forming an insulating part in an area of the upper surface of the heat dissipating body in which the protrusion is not formed; And forming an electrode part on the insulating part to be electrically insulated from the heat dissipating main body, wherein an upper surface of the electrode part is positioned at the same height as an upper surface of the protrusion part.

The forming of the protrusions on the upper surface of the heat dissipation main body may include forming the protrusions separately from the heat dissipation main body to be bonded to the upper surface of the heat dissipation main body.

Method for manufacturing a heat radiation board according to an embodiment of the present invention comprises the steps of preparing a heat dissipation body; Forming an insulating part having a lower height than the heat dissipating body on an outer circumferential surface of the heat dissipating body; Forming an insulating part in an area of the upper surface of the heat dissipating body in which the protrusion is not formed; And forming an electrode part on the insulating part to be electrically insulated from the heat dissipating body, wherein an upper surface of the electrode part is positioned at the same height as an upper surface of the heat dissipating body.

The forming of the insulating part may be performed by applying an insulating material to an upper surface of the heat dissipating body.

The forming of the insulating part may be performed by laminating an insulating sheet on an upper surface of the heat dissipating body.

According to another aspect of the present invention, there is provided a light emitting diode package module manufacturing method including a heat dissipation body having an upper surface on which a protrusion is formed, an insulating layer formed on an area where the protrusion is not formed on an upper surface of the heat dissipation body, and the heat dissipation body. Providing a heat dissipation substrate formed on the insulating layer so as to be insulated, the heat dissipation substrate including an electrode portion having an upper surface positioned at substantially the same height as the upper surface of the protrusion; Providing a package substrate having heat dissipation pads and electrode pads facing the protrusions and the electrode portions, respectively, and mounted with a light emitting diode chip electrically connected to the electrode pads; And bonding the heat dissipation pad and the electrode pad to the protrusion and the electrode, respectively, to mount the package substrate on the heat dissipation substrate.

The method of manufacturing a light emitting diode package module according to an embodiment of the present invention includes a heat dissipation body, an insulation portion formed on an outer circumferential surface of the heat dissipation body, and having a lower height than the heat dissipation body, and on the insulation portion to be electrically insulated from the heat dissipation body. Providing a heat dissipation substrate, the heat dissipation substrate including an electrode portion having an upper surface disposed at substantially the same height as an upper surface of the heat dissipating body; Providing a package substrate on which a heat dissipation pad and an electrode pad face the heat dissipation body and the electrode portion, respectively, and are mounted such that a light emitting diode chip is electrically connected to the electrode pad; And bonding the heat dissipation pad and the electrode pad to the heat dissipation body and the electrode, respectively, to mount the package substrate on the heat dissipation substrate.

The mounting of the package substrate may be performed by a single process.

The mounting of the package substrate may be performed through a conductive adhesive layer between the protrusion and the heat dissipation pad, and between the electrode and the electrode pad, respectively.

The mounting of the package substrate may be performed through a conductive adhesive layer between the heat dissipation body and the heat dissipation pad, and between the electrode portion and the electrode pad, respectively.

The conductive adhesive layer is made of solder, and the mounting of the package substrate may be performed by surface mounting technology (SMT).

The conductive adhesive layer may be made of a paste of a buffer material.

After mounting the package substrate, the method may further include determining whether the package substrate is aligned with the heat radiating substrate using an alignment mark formed on the heat radiating substrate.

According to the present invention, since the LED package and the heat dissipation board are directly connected, the heat dissipation efficiency is improved, and since the LED package can be mounted on the heat dissipation board in a single process, the connection between the LED package and the heat dissipation board is simple and the connection reliability is high. Can be improved.

1 is a perspective view showing an embodiment of a light emitting diode package module according to an aspect of the present invention.
FIG. 2 is a cross-sectional view taken along line AA of an LED package module according to an embodiment of the present invention shown in FIG. 1.
3 is a plan view showing an embodiment of a light emitting diode package module according to an aspect of the present invention.
Figure 4 is a plan view showing an embodiment of a heat radiation substrate according to an aspect of the present invention.
5 is a bottom view showing a light emitting diode package of an embodiment of a light emitting diode package module according to an aspect of the present invention.
6 is a perspective view showing the arrangement of the LED pattern and the electrical connection of the LED chip of the LED package module according to an embodiment of the present invention.
7 is a circuit diagram illustrating an electrical connection state of a light emitting diode chip, a zener diode, and a thermistor of an embodiment of a light emitting diode package module according to an aspect of the present invention;
8 is a view showing an embodiment of a vehicle head lamp module to which the light emitting diode package module according to an aspect of the present invention is applied.
9 to 13 are cross-sectional views showing another embodiment of a light emitting diode package module according to an aspect of the present invention.
14 is a flow chart showing an embodiment of a method of manufacturing a light emitting diode package module according to another aspect of the present invention.
15 to 21 are cross-sectional views illustrating respective processes of a method of manufacturing a light emitting diode package module according to another aspect of the present invention.
22 to 27 are cross-sectional views illustrating respective processes of a method of manufacturing a light emitting diode package module according to another aspect of the present invention.

An embodiment of a light emitting diode package, a light emitting diode package module having the same, a method of manufacturing the same, a head lamp module having the same, and a method of controlling the same according to the present invention will be described in detail with reference to the accompanying drawings. In the description, the same or corresponding components are assigned the same reference numerals, and redundant description thereof will be omitted.

First, an embodiment of the LED package module 100 according to an aspect of the present invention will be described with reference to FIGS. 1 to 8.

1 is a perspective view showing an embodiment of a light emitting diode package module 100 according to an aspect of the present invention. 2 is a cross-sectional view illustrating a light emitting diode package module 100 according to an embodiment of the present invention illustrated in FIG. 3 is a plan view showing an embodiment of a light emitting diode package module 100 according to an aspect of the present invention.

According to the present exemplary embodiment, as illustrated in FIGS. 1 to 3, the light emitting diode package 120 and the heat dissipation substrate 110 mounted on the heat dissipation substrate 110 by the heat dissipation substrate 110 and the conductive adhesive layer 140. A light emitting diode package module 100 including a zener diode 170, a thermistor 180, and an alignment mark 190 formed on a heat dissipation substrate 110, respectively, is provided.

1 to 3, the heat dissipation substrate 110 includes a heat dissipation body 112, an insulation unit 116, an electrode unit 118, and a solder resist layer 119, and includes a light emitting diode package. The package 120 includes a package substrate 121, a cavity 124, a heat radiation pad 125, an electrode pad 126, a circuit pattern 127, and a via formed of the first substrate 122 and the second substrate 123. 128), a light emitting diode chip 130 and a phosphor 150.

According to this embodiment, since the insulating layer having low thermal conductivity is not interposed between the package substrate 121 and the heat dissipation main body 112, the heat dissipation efficiency of the light emitting diode package 120 to the heat dissipation main body 112 is remarkably increased. Can be improved.

In addition, since a separate wire for the electrical connection between the LED package 120 and the electrode unit 118 is not used, the electrical connection reliability of the LED package module 100 may be improved and the size may be further reduced.

Hereinafter, each configuration of the LED package module 100 according to the present embodiment will be described in more detail with reference to FIGS. 1 to 8.

As shown in FIGS. 1 and 2, the heat dissipation substrate 110 includes a heat dissipation main body 112, an insulation part 116, and an electrode part 118. On the exposed surface of the heat dissipation body 112, the light emitting diode package 120 is mounted using the conductive adhesive layer 140, and the other surface on which the light emitting diode package 120 of the heat dissipation body 112 is not mounted is an external heat sink ( And 22) of FIG. 8.

Accordingly, the heat of the light emitting diode chip 130 accompanying the light emission of the light emitting diode chip 130 is generated by the package substrate 121, the conductive adhesive layer 140, the heat dissipating body 112, and the external heat sink (see FIG. 8). 22) can be released to the outside. In this case, since the heat dissipation body 112 is made of a conductive material, heat generated from the light emitting diode chip 130 may be effectively transferred to the external heat dissipation body.

In addition, the heat dissipation body 112 may be made of copper (Cu). Since the heat dissipation main body 112 made of copper has a small difference in coefficient of thermal expansion from a package substrate 121 made of ceramic such as Al ₂ O ₃ , the conductivity is high, for example, 50 K / W, but the flexibility is not large. Even though the heat dissipating body 112 and the package substrate 121 are bonded using the solder as the conductive adhesive layer 140, the thermal stress applied to the bonding portion may be minimized. Accordingly, breakage of the bonding portion due to heat transferred from the light emitting diode chip 130 may be prevented.

The heat dissipation body 112 may be made of a material such as aluminum (Al) having excellent thermal conductivity in addition to copper.

The electrode part 118 may also be made of a conductive material such as copper, but as shown in FIGS. 1 and 2, the heat dissipating body 112 and the heat dissipating body 112 may be formed by an insulating part 116 interposed between the electrode part 118 and the heat dissipating body 112. Electrically insulated. Since the electrode part 118 may be electrically connected to the driver module 30 of FIG. 8 through a circuit and a terminal connected to the electrode part 118, an electrode formed to face the electrode part 118 on the package substrate 121. The pad 126 and the electrode unit 118 are bonded to the conductive adhesive layer 140, so that the LED chip 130 electrically connected to the electrode pad 126 is electrically connected to the driver module 30 of FIG. 8. The operation of the LED chip 130 may be controlled by the driver module 30 of FIG. 8.

In the present embodiment, the case where the insulating portion 116 electrically insulating the heat dissipating body 112 and the electrode unit 118 is described as an example, but not only that, but the heat dissipating main body 112 is compared with the thermal conductivity. If the electrical conductivity is made of a material that is significantly low, if the heat dissipating body 112 and the electrode portion 118 can be electrically insulated without the insulating portion 116, such a case may also be included in the scope of the present invention, of course. to be.

More specifically, as shown in FIG. 2, on the upper surface 114 of the heat dissipation main body 112, a protrusion 113 is provided on a side opposite to the package substrate 121. The protrusion 113 is formed to face the heat dissipation pad 125 formed on the package substrate 121. The insulating part 116 is formed on the upper surface 114 of the heat dissipation body, and the electrode part 118 is formed on the insulating part 116 to face the electrode pad 126.

In addition, an electrode portion 118 having a position corresponding to the position of the electrode pad 126 and a circuit and a terminal connected to the electrode portion 118 are formed on the insulating portion 116.

Accordingly, as shown in FIGS. 1 and 2, the protrusion 113 may be exposed at the center of the heat dissipation substrate 110, and the electrode pad 126 may be adjacent to the exposed surface of the protrusion 113. Opposite electrode portions 118 may be formed.

In this way, the insulating portion 116 is formed on the upper surface of the heat dissipation main body 112, thereby forming the electrode portion 118 electrically insulated from the heat dissipation main body 112, while maintaining the volume of the heat dissipation main body 112 as a heat medium as much as possible. As such, the heat dissipation efficiency of the LED package module 100 may be maximized.

In this case, as shown in FIG. 2, the upper surface of the convex portion 113 and the upper surface of the electrode portion 118 may be formed to be positioned at substantially the same height.

Accordingly, when the light emitting diode package 120 is mounted on the heat dissipation substrate 110, the heat dissipation pad 125 and the upper surface of the protrusion 113 and the electrode pad 126 using surface mounting technology (SMT). ) And the upper surface of the electrode unit 118 can be bonded by a single process, thereby reducing the manufacturing cost and time.

In the present embodiment, the upper surface of the protrusion 113 facing the heat dissipation pad 125 and the upper surface of the electrode portion 118 opposite the electrode pad 126 are physically located on the same plane.

Although the case has been presented as an example, the height of the upper surface of the protrusion 113 facing the heat dissipation pad 125 and the upper surface of the electrode portion 118 facing the electrode pad 126 is within the tolerance range, thereby providing surface mounting. If the bonding of the light emitting diode package 120 by the technology can be included in the scope of the present invention, of course.

 On the circuit connected to the insulating unit 116 and the electrode unit 118, as shown in FIGS. 1 and 2, the solder resist layer (except for the portion where the zener diode 170 and the thermistor 180 are electrically connected) is formed. 119 may be formed.

As shown in FIGS. 1 to 3, the light emitting diode package 120 includes a package substrate 121, a cavity 124, and a heat radiation pad 125 including a first substrate 122 and a second substrate 123. The electrode pad 126, the circuit pattern 127, the via 128, the light emitting diode chip 130, and the phosphor 150 may be formed.

As illustrated in FIGS. 1 to 3, the package substrate 121 is disposed on the heat dissipation substrate 110 and includes a first substrate 122 and a second substrate 123 stacked thereon.

A cavity 124 larger than the size of the light emitting diode chip 130 is formed on the second substrate 123 to accommodate the light emitting diode chip 130.

Since the package substrate 121 may be formed of a ceramic material and may have characteristics such as high heat resistance, excellent thermal conductivity, and high reflection efficiency, light emission for a high power automotive head lamp module (300 of FIG. 8) requiring high heat dissipation characteristics is required. It is advantageous to be applied to the diode package 120.

On the other hand, unlike the present embodiment, the package substrate 121 may be formed of a single layer, which is illustrated through FIGS. 9 to 11. Although not specifically illustrated in the drawing, this is a case where the light emitting diode chip 130 is flip-chip bonded to the package substrate 121, which will be described with reference to FIGS. 9 to 11. The description of the example will be described in more detail.

As illustrated in FIG. 2, the circuit pattern 127 is formed on the package substrate 121 and electrically connected to the light emitting diode chip 130. That is, the circuit pattern 127 is formed between the first substrate 122 and the second substrate 123 of the package substrate 121, and is connected to and electrically connected to the electrodes formed on the bottom surface of the LED chip 130. The electrode formed on the upper surface of the LED chip 130 may be electrically connected by the circuit pattern 127 and the wire 135.

As illustrated in FIG. 2, the via 128 is formed in the package substrate 121 to electrically connect the circuit pattern 127 and the electrode pad 126. That is, the vias 128 are formed in the first substrate 122 and are formed on the surface of the first substrate 122 and the circuit pattern 127 interposed between the first substrate 122 and the second substrate 123. By electrically connecting the pad 126, the light emitting diode chip 130 may be electrically connected to the electrode unit 118.

4 is a plan view illustrating the heat dissipation substrate 110 of the light emitting diode package module 100 according to an embodiment of the present invention. 5 is a bottom view illustrating a light emitting diode package 120 according to an embodiment of the light emitting diode package module 100 according to an embodiment of the present invention.

As illustrated in FIGS. 2, 4, and 5, the heat radiating pad 125 is formed on the package substrate 121 to face the protrusion 113 and bonded to the protrusion 113. The heat dissipation pad 125 is formed on the lower surface of the package substrate 121 to be electrically insulated from the electrode pad 126, and is formed at a position corresponding to the position of the exposed surface of the protrusion 113. The heat dissipation pad 125 is bonded to the heat dissipation body 112 by bonding the exposed surface of the protrusion 113 with the conductive adhesive layer 140, that is, the solder.

As such, the heat radiation pad 125 and the protrusion 113 are bonded without the insulating layer interposed therebetween, so that the heat generated from the light emitting diode chip 130 is transferred from the heat radiation pad 125 to the heat radiation body 112 without thermal resistance. Can be delivered effectively. As a result, heat dissipation characteristics of the LED package module 100 may be remarkably improved.

In this case, the bonding means that the two components are physically in direct contact with each other, or indirectly coupled to each other by interposing a different material between the components. In this embodiment, the heat dissipation pad 125 and The conductive adhesive layer 140 is interposed between the protrusions 113 and between the electrode pad 126 and the upper surface of the electrode portion 118 so that the heat dissipation pad 125 and the heat dissipation body 112 are formed by the conductive adhesive layer 140. An example in which the electrode pad 126 and the electrode unit 118 are indirectly coupled to each other is shown as an example.

As illustrated in FIGS. 2, 4, and 5, the electrode pad 126 is formed on the package substrate 121 so as to face the electrode portion 118 and bonded to the electrode portion 118. The pair of electrode pads 126 are formed on the bottom surface of the package substrate 121 and are spaced apart from each other to be electrically insulated from the heat dissipation pad 125. In addition, the electrode pad 126 is formed to correspond to the position of the electrode unit 118 and is bonded to the electrode pad 126 by bonding by the conductive adhesive layer 140, that is, solder.

As such, since the electrode pad 126 is directly bonded to the electrode unit 118 using solder instead of using wires, the manufacturing process of the LED package module 100 is simplified as compared with the conventional wire bonding method. The size of the electrode 118 and the electrode pad 126 can be improved.

That is, in the conventional method of implementing electrical connection by wire bonding, in addition to the wire bonding process itself, a process of wrapping the wire around with a material such as rubber is required to protect the wire connecting portion, but in the present embodiment By not using it itself, this ancillary process can be omitted completely.

In addition, in the past, a protective means such as rubber wrapping the wires has unnecessarily occupied a space, but in the case of the present embodiment, such a problem does not occur since it does not depend on the wire bonding method.

Meanwhile, as described above, by bonding the electrode pad 126 and the heat dissipation pad 125 to the electrode unit 118 and the heat dissipation main body 112 by a single process, respectively, by the surface mounting technique, the manufacturing cost and time can be reduced. The effect can be further improved.

In the present embodiment, instead of the wire, the conductive adhesive layer 140, that is, the electrode part 118 and the electrode pad 126 are stably bonded by solder, and the solder has a high conductivity of 50 K / W, for example. In addition, the connection reliability of the LED package module 100 may be remarkably improved as compared to the wire bonding method.

As illustrated in FIG. 2, the conductive adhesive layer 140 is interposed between the heat dissipation body 112 and the heat dissipation pad 125 and between the electrode portion 118 and the electrode pad 126. Here, the conductive adhesive layer 140 may be made of solder, and as described above, the solder has a high conductivity of, for example, 50 K / W, and thus effectively heats the heat between the heat radiating pad 125 and the heat radiating body 112. In addition to the transmission, an electrical signal may also be effectively transmitted between the electrode pad 126 and the electrode unit 118.

In the present exemplary embodiment, since the heat dissipation body 112 is formed of copper having a similar thermal expansion coefficient to the package substrate 121 made of ceramic, even if the flexibility of the solder is insufficient, the light emitting diode chip 130 may be generated. The thermal stress acting on the interface between the conductive adhesive layer 140 and the heat dissipation body 112 and the package substrate 121 may be minimized by heat, and thus, the junction between the heat dissipation body 112 and the package substrate 121 may be minimized. Damage can be prevented.

Meanwhile, as shown in FIGS. 4 and 5, the opposing surfaces of the protrusion 113 and the heat dissipation pad 125 are substantially the same in size, and the electrodes 118 and the electrode pad 126 oppose each other. The faces are substantially the same size in size. And the conductive adhesive layer 140, as shown in Figure 2, between the opposing face of the protrusion 113 and the heat radiation pad 125 and between the opposing face of the electrode portion 118 and the electrode pad 126, respectively It is interposed.

More specifically, the size of the surface of the exposed protrusion 113 that is the surface facing the heat dissipation pad 125, that is, the width w1 and the length l1 shown in FIG. 4, is the heat dissipation that is the surface facing the protrusion 113. The size of the surface of the pad 125 is the same as the width w3 and length l3 shown in FIG. 5. In addition, the size of the surface of the electrode portion 118, which is the surface facing the electrode pad 126, that is, the width w2 and the length l2 illustrated in FIG. 4, may be defined as the electrode pad (which is the surface facing the electrode portion 118). 126) is the same size as the surface, i.e. width w4 and length l4 shown in FIG.

The conductive adhesive layer 140 is uniformly interposed between the protrusion 113 and the opposing face of the heat dissipation pad 125 and between the opposing face of the electrode part 118 and the electrode pad 126. Join the faces together.

Since the sizes of the surfaces bonded to each other by the conductive adhesive layer 140 are substantially the same as each other, the LED package 120 may achieve a so-called self-alignment on the heat dissipation substrate 110. A separate alignment mark for the alignment of the light emitting diode package 120 during the process and a separate jig for supporting the light emitting diode package 120 at a predetermined position during the manufacturing process are not required.

That is, the conductive adhesive layer 140 in the molten state, that is, solder is applied to the surface of the heat dissipation body 112 and the pair of electrode portions 118 that are exposed to the outside and face the heat dissipation pad 125 by the surface mounting technique. Afterwards, when the heat dissipation pad 125 and the pair of electrode pads 126 correspond to the exposed surface of the heat dissipation body 112 and the electrode unit 118 on the solder, the LED package 120 is mounted. Due to the same size of each of the heat dissipation pad 125 and the pair of electrode pads 126, the exposed surface of the heat dissipation main body 112, and the pair of electrode portions 118, the heat dissipation of the LED package 120 and the heat dissipation pad 125 are performed. Three stable bonding sites by molten solder are formed between the substrates 110.

In other words, since the heat radiating pad 125 and the pair of electrode pads 126, the protrusion 113, and the electrode portion 118 are disposed to face each other and have substantially the same surface size, the above-described three bonding sites The surface tension of the molten solder is stable. Therefore, even if the external load is applied to the light emitting diode package 120 before the hardening of the solder, the light emitting diode package 120 flows to some extent, and the light emitting diode package 120 eventually returns to its original position due to the surface tension effect. You can maintain your position.

The light emitting diode chip 130 is a semiconductor device capable of realizing various colors of light by configuring a light emitting source by changing a compound semiconductor material such as GaAs, AlGaAs, GaN, InGaInP, etc. As shown in FIG. 3, it is mounted on the top surface of the package substrate 121 and is electrically connected to the electrode pad 126. That is, the light emitting diode chip 130 is accommodated in the cavity 124 formed on the upper surface of the package substrate 121, and is electrically connected to the circuit pattern 127 exposed to the bottom surface of the cavity 124.

6 is a perspective view illustrating the electrical connection state and the arrangement of the circuit pattern 127 of the LED chip module 130 according to an embodiment of the LED package module 100 according to an embodiment of the present invention.

Referring to FIG. 6, an electrode under the light emitting diode chip 130 may be bonded to the circuit pattern 127 and electrically connected to each other. The electrode on the light emitting diode chip 130 may be wire-bonded by a wire 135. It may be electrically connected to the circuit pattern 127. In this case, the circuit pattern 127 is electrically connected to the electrode pad 118 through the via 128, and the heat radiation pad 125 is formed under the first substrate 122 to perform a heat transfer function. In addition, the electrode pad 118 and the circuit pattern 127 are electrically insulated from each other.

As illustrated in FIG. 6, the plurality of light emitting diode chips 130 may be arranged in a line, and may be electrically connected in series with each other by the circuit pattern 127 and the wire 135. By arranging the plurality of light emitting diode chips 130 in this manner, it is advantageous to satisfy the light distribution distribution of the headlamp module for automobiles (300 of FIG. 8) that should be spread laterally to both sides, and the plurality of light emitting diode chips ( Since 130 is connected in series, a relatively low current is required for the same power, which is more advantageous for applying the LED package module 100 to the automotive head lamp module (300 of FIG. 8).

In the present embodiment, a case in which a plurality of light emitting diode chips 130 are connected in series is shown as an example, but in addition, one or more light emitting diode chips 130 may be electrically connected in series, in parallel, or in parallel and in various forms. It goes without saying that it is included in the scope of the present invention.

The phosphor 150 is formed on the light emitting diode chip 130, as shown in FIGS. 1 to 3. That is, the phosphor 150 is charged in the cavity 124 in which the light emitting diode chip 130 is mounted, and serves to protect the light emitting diode chip 130, while the light emitted from the light emitting diode chip 130 is exemplified. For example, a function of converting into white light can be performed.

The zener diodes 170 are mounted on the heat dissipation substrate 110, as shown in FIGS. 1 to 3. The zener diode 170 is a semiconductor device that prevents damage to the light emitting diode chip 130 by static electricity, and is electrically connected to a pair of electrode portions 118 formed on the heat dissipation substrate 110.

The thermistor 180 is mounted on the heat dissipation substrate 110, as shown in FIGS. 1 to 3. The thermistor 180 is a semiconductor device for temperature control of the light emitting diode package module 100 using a resistance change, and the like, and is electrically connected to an external controller (not shown) through a circuit and a terminal.

7 is a circuit diagram illustrating an electrical connection state of a light emitting diode chip 130, a zener diode 170, and a thermistor 180 according to an embodiment of the light emitting diode package module 100.

As illustrated in FIG. 7, the zener diodes 170 may be connected in parallel with opposite polarities through a plurality of light emitting diode chips 130 and an electrode unit 118 electrically connected in series. In addition, the thermistor 180 may be connected to the LED chip 130 and the zener diode 170 in an independent circuit so as to be used for temperature control of the LED package module 100.

The alignment marks 190 are formed on the heat dissipation substrate 110 to determine whether the package substrate 121 is aligned with the heat dissipation substrate 110, as shown in FIGS. 1 to 3. After the light emitting diode package 120 is mounted on the heat dissipating substrate 110 by the conductive adhesive layer 140, that is, the solder, the heat dissipating substrate 110 and the light emitting diode package 120, specifically, the light emitting diode chip 130. In order to visually check the alignment state of the heat dissipation substrate, through holes are formed on both sides of the heat dissipation substrate 110 as alignment marks 190, and the areas extending horizontally from these through holes to the exposed surface side of the heat dissipation main body 112. As the solder resist layer 119 is removed, a portion of the insulating portion 116 is exposed.

As described above, in addition to exposing the insulating portion 116 by removing a part of the solder resist layer 119, a separate material may be printed on the solder resist layer 119.

However, the alignment mark 190 of the present embodiment is a means for visually confirming the alignment state at the end of the manufacturing process, and is not intended to align the light emitting diode package 120 during the manufacturing process. Naturally, the self-alignment function of the LED package 120 described above cannot be denied due to the presence.

8 is a view showing an embodiment of a head lamp module 300 for a vehicle to which the light emitting diode package module 100 according to an aspect of the present invention is applied.

As shown in FIG. 8, an automotive head lamp module 300 may be implemented using the LED package module 100 according to the present embodiment. As shown in FIG. 8, the automotive head lamp module 300 includes, in addition to the light emitting diode package module 100, a frame 14 supporting the light emitting diode package module 100, and a light emitting diode package module 100. A reflector 16 for reflecting the light generated from the light source and a lens 12 for refracting the light reflected by the reflector 16 at a desired angle, thereby providing a light distribution angle of the light generated by the light emitting diode package module 100. The optical module 10 to change the angle, the heat sink 22 is coupled to the lower portion of the light emitting diode package module 100 and the fan 24 to dissipate heat from the heat sink 22, the light emitting diode package module ( The heat dissipation module 20 for dissipating heat generated by the external unit 100 and the driver module 30 electrically connected to the LED package module 100 and the fan 24 and controlling their operation may be provided. have.

As such, the headlamp module 300 for automobiles illustrated in FIG. 8 may be used as a downlight of a vehicle. For example, four light emitting diode package modules 100 may have various angles depending on a desired light distribution on the frame 14. May be placed in position.

In addition, the light emitting diode package module 100 of the present embodiment may be used as an uplight of an automobile. In this case, the reflector 16 shown in FIG. 8 is omitted, and the light generated by the light emitting diode package module 100 is omitted. The angle and position of the LED package module 100 are changed to face the lens 12 directly. In this case, since the reflector 16 is omitted in the case of the uplight, the number of light emitting diode package modules 100 to be installed may be reduced compared to the case of the downlight.

The head lamp module 300 described above may be controlled by the following operation of the driver module 30.

First, a light emission signal is applied to the LED package module 100 to generate light irradiated toward the optical module 10.

That is, as shown in FIG. 8, since the driver module 30 is electrically connected to the LED package module 100, when the user wants to operate the head lamp module 300 through a switch or the like, the driver module 30 receives the electrical operation signal from the switch, and applies the electrical light emission signal to the LED package module 100.

When the light emitting signal is input to the light emitting diode package module 100 as described above, the light emitting diode package module 100 may be operated to generate light from the light emitting diode package module 100, and the light may be generated by the optical module 10. It may be irradiated to and reflected or refracted and then emitted to the outside.

Subsequently, a heat radiation signal is applied to the heat dissipation module 20 according to the temperature change of the light emitting diode package module 100, thereby dissipating heat generated by the light emitting diode package module 100 to the outside.

That is, as shown in FIG. 8, the driver module 30 is electrically connected to the light emitting diode package module 100 and the heat dissipation module 20, and the light emitting diode package module 100 is shown in FIGS. 1 and 2. As shown in the drawing, a thermistor 180 capable of sensing temperature may be mounted.

Since the thermistor 180 may also be electrically connected to the driver module 30, the thermistor 30 detects a temperature change of the LED package module 100 and transmits a corresponding electrical temperature signal to the driver module 30. In this case, the driver module 30 applies the electric heat radiation signal to the heat dissipation module 20, more specifically, the fan 24 according to the temperature signal.

When the heat radiation signal is input to the heat dissipation module 20 as described above, the fan 24 of the heat dissipation module 20 is operated so that the heat generated from the light emitting diode package module 100 is discharged to the outside from the heat dissipation module 20. Can be.

Hereinafter, another embodiment of the light emitting diode package module 100 according to an aspect of the present invention will be described with reference to FIGS. 8 to 12.

9 to 13 are cross-sectional views illustrating another embodiment of the LED package module 100 according to an aspect of the present invention.

Hereinafter, in presenting the respective embodiments shown in FIGS. 9 to 13, the same or similar components that have been already described through the above-described embodiments will be omitted, and different configurations from the above-described embodiments will be omitted. The explanation is centered.

Referring to FIG. 9, an embodiment of a light emitting diode package module 100 in which a package substrate 121 is formed of a single layer and paste is used as the conductive adhesive layer 140 is illustrated.

In the present embodiment, as shown in Figure 9, the package substrate 121 is composed of a single layer, the light emitting diode chip 130 is mounted on the package substrate 121 is exposed to the outside.

Although not illustrated in the drawing, the light emitting diode chip 130 may be bonded to the circuit pattern 127 in a flip chip manner, and thus, the light emitting diode chip 130, the light emitting diode chip 130, and the circuit pattern 127 may be bonded to each other. The protection of the wires for the electrical connection with them is not necessarily required.

Therefore, in the present embodiment, it is sufficient if the fluorescent layer is formed only on the upper portion of the light emitting diode chip 130, and the cavity 124 for accommodating the light emitting diode chip 130 need not be separately provided. As a result, according to the present embodiment, a separate configuration for protecting the LED chip 130 and the wires may be omitted, and thus the structure of the LED package module 100 may be simplified, thereby simplifying the manufacturing process. The manufacturing cost and time can be saved.

In addition, in the present embodiment, the conductive adhesive layer 140 may be a paste of a buffer material. Accordingly, even though the thermal expansion coefficient of the heat dissipation body 112 is slightly different from that of the package substrate 121 made of ceramic, the heat dissipation body 112 and the package substrate are formed by the flexible buffer material. Even if the 121 is expanded differently, the conductive adhesive layer 140 may buffer a space therebetween, thereby preventing damage to the light emitting diode package module 100.

In addition, in the present embodiment, the shape of the heat dissipation body 112 may be formed slightly different from the above-described embodiment. That is, the upper surface 114 of the heat dissipation body 112 may not be formed along the entire edge of the protrusion 113 facing the package substrate 121, but may be formed at one side of the edge of the protrusion 113. In addition, if it is possible to form the insulating portion 116 and the electrode portion 118, it is also possible to form the upper surface 114 of various shapes.

Referring to FIG. 10, the package substrate 121 is formed of a single layer, a paste is used as the conductive adhesive layer 140, and the light emitting diode package module 100 is formed on the outer circumferential surface of the heat dissipation body 112. An embodiment of) is shown.

Among these, since the description of the package substrate 121 and the conductive adhesive layer 140 has already been described through the embodiment shown in FIG. 9, the description thereof will be omitted and the heat dissipating body 112 and the insulating portion 116 will be omitted. The structure will be described in the following.

In the present embodiment, as shown in FIG. 10, the insulation portion 116 is formed on the outer circumferential surface of the heat dissipation body 112, and the electrode portion 118 faces the electrode pad 126 on the insulation portion 116. It is formed to. The insulating portion 116 is formed on the outer circumferential surface of the heat dissipating body 112 at a height except for a thickness that may be formed in the electrode portion 118. Due to the height difference between the heat dissipation body 112 and the insulation 116, the protrusion 113 facing the heat dissipation pad 125 may be naturally formed.

According to this embodiment, since the process for processing the space portion (114 in Figure 9) in the heat dissipating body 112 can be omitted, correspondingly the manufacturing cost and time of the light emitting diode package module 100 is reduced Can be.

In the present embodiment, the case where the insulating portion 116 is formed on one side of the outer peripheral surface of the heat dissipating body 112 is presented as an example, but not only the insulating portion 116 is a heat dissipating body along the outer peripheral surface of the heat dissipating body 112. It may be formed to surround the 112, and if it is possible to provide an area for the formation of the electrode portion 118 electrically insulated from the heat dissipation body 112, in addition to the structure of the insulating portion 116 may be variously modified. will be.

Meanwhile, in the embodiments shown in FIGS. 9 and 10, the solder resist layer (119 of FIG. 2), the zener diode (170 of FIG. 2) and the thermistor (180 of FIG. 1) are not shown. Of course, such configurations may be included.

Referring to FIG. 11, an embodiment of the LED package module 100 in which the package substrate 121 is formed of a single layer is illustrated.

In the present embodiment, as shown in FIG. 11, the package substrate 121 is formed as a single layer, and the light emitting diode chip 130 is mounted on the package substrate 121 and exposed to the outside. A portion of the solder resist layer 119 corresponding to the space between the heat radiating pad 125 and the electrode pad 126 is removed.

As described with reference to the embodiment illustrated in FIG. 9, since the light emitting diode chip 130 may be bonded in a flip chip method, the light emitting diode chip 130, the light emitting diode chip 130, and the circuit pattern 127 may be separated from each other. Protection of wires for electrical connection is not necessary.

Therefore, even in the present embodiment, since the fluorescent layer is formed only on the upper portion of the light emitting diode chip 130, the cavity 124 for accommodating the light emitting diode chip 130 need not be provided separately, and thus, the light emitting diode package module The structure of 100 can be simplified, and thus manufacturing cost and time can also be reduced.

As shown in FIG. 11, a portion of the solder resist layer 119 corresponding to the space between the heat radiating pad 125 and the electrode pad 126 may be removed. That is, the solder resist layer 119 interposed between the exposed heat dissipating body 112 and the electrode unit 118 may be removed, and a step having a predetermined height may be formed on the surface while the insulating layer 116 below is exposed. have.

In the manufacturing process of mounting the light emitting diode package 120 to the heat dissipation substrate 110, an uncured conductive adhesive layer 140 is applied to the exposed heat dissipation body 112 and the electrode portion 118 of the heat dissipation substrate 110, respectively. That is, the solder in the molten state flows along the surface of the solder resist layer 119 and is mixed with each other, so that an electrical short may occur between the electrode portion 118 and the heat dissipation main body 112.

However, in the present embodiment, by forming a step by removing the solder resist layer 119 interposed between the exposed heat dissipating body 112 and the electrode portion 118, the amount of the conductive adhesive layer 140, that is, the amount of solder Even when the excess conductive adhesive layer 140 is applied to a little more than the set amount and flows around the surfaces of the heat dissipating body 112 and the electrode unit 118, the excess conductive adhesive layer 140 is not mixed with each other and the solder resist Since the layer 119 flows into the removed space, a short circuit may be prevented between the electrode unit 118 and the heat dissipation main body 112.

Referring to FIG. 12, an embodiment of the LED package module 100 in which the cavity 124 of the package substrate 121 is covered by the glass layer 160 is illustrated.

In this embodiment, as shown in FIG. 12, the glass layer 160 covers the cavity 124. As shown in FIG. 12, the fluorescent layer is formed only on the upper surface of the LED chip 130, so that the wire 135 for implementing an electrical connection between the LED chip 130 and the circuit pattern 127 is provided in the cavity 124. ) Is exposed. Accordingly, by further stacking the glass layer 160 on the cavity 124, the LED chip 130 and the wire 135 may be stably protected without filling the phosphor 150 in the cavity 124. have. Meanwhile, in the case of the embodiments shown in FIGS. 11 and 12, the zener diode (170 of FIG. 2) and the thermistor (180 of FIG. 1) are not shown, but these embodiments may also include such configurations. .

Referring to FIG. 13, an embodiment of the light emitting diode package module 100 in which the heat dissipation body 112 includes a flat plate portion 112a and a protrusion 113 is illustrated.

In the present embodiment, as shown in FIG. 13, the heat dissipation main body 112 includes a flat part 112a and a protrusion 113 formed in a portion of the flat part 112a corresponding to the heat dissipation pad 125. .

That is, in the present embodiment, as shown in FIGS. 2, 9, and 12, the protrusion 113 is not formed by removing a portion of the heat dissipation main body 112, and the flat portion 112a having both surfaces is flat. It may be formed by separately forming a protrusion 113 having a height corresponding to the sum of the thicknesses of the insulating portion 116 and the electrode portion 118 in a portion of the () and then bonded to the flat plate portion 112a by welding or the like. . Alternatively, the protrusion 113 may be formed in a portion of the plate portion 112a by plating or the like.

Next, an embodiment of a method of manufacturing the LED package module 200 according to another aspect of the present invention will be described with reference to FIGS. 14 to 21.

14 is a flowchart illustrating an embodiment of a method of manufacturing a light emitting diode package module 200 according to another aspect of the present invention. 15 to 21 are cross-sectional views illustrating respective processes of a method of manufacturing the LED package module 200 according to another aspect of the present invention.

According to the present embodiment, as shown in FIGS. 14 to 21, a process of providing a heat dissipation substrate 210 (S110), a process of providing a package substrate 221 (S120), and a package of the heat dissipation substrate 210. Process of mounting the substrate 221 (S130), process of mounting the zener diode 270 on the heat radiation substrate 210 (S140), process of mounting the thermistor (180 in Fig. 1) on the heat radiation substrate 210 (S150) And a process of determining whether the package substrate 221 is aligned with the heat dissipation substrate 210 (S160), a method of manufacturing the LED package module 200 is provided.

According to the present embodiment as described above, since a separate wire or the like for the electrical connection between the light emitting diode package 220 and the electrode unit 218 is not used, the process can be simplified, manufacturing cost of the light emitting diode package module 200 And manufacturing time can be significantly reduced.

Hereinafter, a method of manufacturing the LED package module 200 according to the present embodiment will be described in more detail with reference to FIGS. 14 to 21.

In the present embodiment, the heat dissipation substrate 210, the heat dissipation main body 212, the insulating portion 216, the electrode portion 218, the solder resist layer 219, the light emitting diode package 220, the package substrate 221, and the first 1 substrate 222, second substrate 223, cavity 224, heat dissipation pad 225, electrode pad 226, circuit pattern 227, via 228, light emitting diode chip 230, conductive adhesive layer The structure of the 240, the phosphor 250, the glass layer 260, and the zener diode 270, and the functions thereof, may include the heat dissipation substrate of the light emitting diode package module 100 (see FIG. 2). 110, the heat dissipation body 112, the insulating unit 116, the electrode unit 118, the solder resist layer 119, the light emitting diode package 120, the package substrate 121, the first substrate 122, and the second Substrate 123, cavity 124, heat dissipation pad 125, electrode pad 126, circuit pattern 127, via 128, light emitting diode chip 130, conductive adhesive layer 140, phosphor 150 , The same as or similar to the glass layer 160 and the zener diode 170, respectively, A detailed description of their structure will be omitted hereinafter, and a description is made of the manufacturing process itself of the LED package module 200.

First, as shown in FIGS. 15 to 17, a heat dissipation substrate 210 including a heat dissipation body 212, an insulation unit 216, and an electrode unit 218 is provided (S110). This process is made of a conductive material and is formed on the heat dissipation body 212 having the protrusion 213, the insulating portion 216 formed on the upper surface 214 of the heat dissipating body, and the insulating portion 216, the heat dissipation body 212 A process of providing a heat dissipation substrate 210 including an electrode portion 218 electrically insulated from each other may be described as follows.

First, as shown in FIG. 15, the protrusion 213 is formed on the side of the heat dissipation body 212 that faces the package substrate 221. A portion of the heat dissipation body 212 may be removed to form the protrusion 213 by etching, or the protrusion 213 may be formed using a laser or the like.

As shown in FIG. 16, the insulating part 216 is formed on the upper surface 214 of the heat dissipating body, and then the electrode part 218 is formed on the insulating part 216 so as to face the electrode pad 226. . The insulating portion 216 may be formed by applying an insulating material or stacking an insulating sheet on the upper surface 214 of the heat dissipating body, and the electrode portion 218 may be formed on a portion of the insulating portion 216, for example, a conductive material. It may be formed by plating. When the electrode unit 218 is formed, a circuit and a terminal connected to the electrode unit 218 and electrically connected to an external controller (not shown) may be simultaneously formed.

In this case, the upper surface of the protrusion 213 facing the heat dissipation pad 225 and the upper surface of the electrode portion 218 facing the electrode pad 226 are located at substantially the same height. Accordingly, the light emitting diode package 220 may be efficiently mounted on the heat dissipation substrate 210 by the surface mount technology by a single process, thereby significantly reducing manufacturing cost and time.

Thereafter, as illustrated in FIG. 17, a solder resist layer 219 is formed on the insulating portion 216. That is, after the solder resist layer 219 is formed to cover the insulating portion 216 and the electrode portion 218, the protrusion 213 of the protrusion 213 facing the heat dissipation pad 225 by a photo-lithography process or the like is formed. The upper surface, a portion of the surface of the electrode unit 218 and a circuit connected to the electrode unit 218 is to be mounted zener diode 270 and the thermistor (180 of FIG. 1), and connected to such a circuit and the external control unit (not shown) Expose terminals to be electrically connected to the outside.

Next, as shown in FIGS. 18 to 20, the heat radiation pad 225 and the electrode pad 226 are formed to face the protrusion 213 and the electrode 218, respectively, and the light emitting diode chip 230 is formed. A package substrate 221 mounted to be electrically connected to the electrode pad 226 is provided (S120). This process can be explained by dividing as follows.

First, as shown in FIG. 18, the heat dissipation pad 225 and the electrode pad 226 are formed on the bottom surface of the first substrate 222 of the package substrate 221, and are electrically connected to the LED chip 230. The circuit pattern 227 is formed on the upper surface of the first substrate 222 of the package substrate 221, and the first substrate of the package substrate 221 is electrically connected to the circuit pattern 227 and the electrode pad 226. A via 228 is formed in 222.

In this process, the via hole is formed on the first substrate 222 so as to correspond to the position at which the circuit pattern 227 and the electrode pad 226 are to be formed, and then the via hole is filled using a conductive material. The circuit pattern 227 may be formed on the top surface of the circuit board, and the electrode pad 226 and the heat radiation pad 225 may be formed on the bottom surface of the circuit pattern 227. The via 228, the circuit pattern 227, the heat dissipation pad 225, and the electrode pad 226 may be formed by various methods such as plating, screen printing or inkjet printing.

Subsequently, as shown in FIG. 19, a cavity 224 in which the light emitting diode chip 230 is accommodated is formed on the second substrate 223, and the second substrate 223 is stacked on the first substrate 222. do. After forming the cavity 224 at the position where the LED chip 230 of the second substrate 223 is to be mounted, the second substrate 223 is stacked on the first substrate 222 to form the multilayer package substrate 221. In this process, the circuit pattern 227 formed on the upper surface of the first substrate 222 is exposed to the inside of the cavity 224 according to the present process.

In the present exemplary embodiment, a case in which the second substrate is stacked on the first substrate 222 after the cavity 224 is formed on the second substrate 223 is illustrated as an example. It is also possible to form the cavity 224 after the two substrates 223 are stacked.

Next, as shown in FIG. 20, the light emitting diode chip 230 is mounted in the cavity 224, and the phosphor 250 is formed on the light emitting diode chip 230. The lower electrode of the LED chip 230 is electrically bonded to the circuit pattern 227 exposed by the cavity 224, and the upper electrode of the LED chip 230 is connected to the circuit pattern 227 by the wire 235. Electrically connected. The phosphor 250 is filled in the cavity 224 to protect the light emitting diode chip 230 and the wire 235.

In the present exemplary embodiment, the case in which the phosphor 250 is filled in the cavity 224 to cover the light emitting diode chip 230 is illustrated as an example. In addition, the phosphor 250 is formed only on the top of the light emitting diode chip 230. In this case, as shown in FIG. 12, the glass layer 160 (FIG. 12) may be stacked to cover the cavity 124 of FIG. 12.

Next, as shown in FIG. 21, the heat dissipation pad 225 and the electrode pad 226 are bonded to the heat dissipation body 212 and the electrode portion 218 by a conductive adhesive layer 240 in a single process, respectively. The package substrate 221 is mounted on the substrate 210 (S130).

Since the heat dissipation pad 225 and the heat dissipation body 212 are formed to face each other, and the electrode pad 226 and the electrode portion 218 are formed to face each other, the conductive adhesive layer 240, that is, the solder is interposed therebetween, so that they Can be bonded to each other.

As such, the heat dissipation pad 225 and the heat dissipation body 212 are bonded without the insulating layer interposed therebetween, so that the heat dissipation characteristics of the LED package module 200 may be improved, and the electrode pad 226 may use a wire. By directly bonding the solder to the electrode unit 218 via the solder, the manufacturing process of the LED package module 200 can be simplified, the size can be further reduced, and the electrode unit 218 and the electrode pad 226 can be simplified. Connection reliability) can be improved.

In this case, the above-described process of mounting the package substrate 221 (S130) may be performed by a single process, thereby reducing the manufacturing cost and time. In addition, by performing the process using the surface mount technology, such a manufacturing cost and time saving effect can be further improved.

On the other hand, as described above, the surfaces of the heat dissipation body 212 and the heat dissipation pad 225 are substantially the same in size (width and length), and the electrode portions 218 and the electrode pads 226 face each other. The faces can be formed substantially the same in size (width and length) from one another.

The conductive adhesive layer 240, that is, the solder, is uniform in the molten state between the opposite surfaces of the heat dissipation body 212 and the heat dissipation pad 225 and between the opposite sides of the electrode portion 218 and the electrode pad 226. Each of them may be bonded to each other as it is hardened after being interposed.

As described above, the sizes of the surfaces bonded to each other by the conductive adhesive layer 240 are substantially the same, so that the electrodes 218 and the electrode pads 226 are disposed between opposite surfaces of the heat dissipation body 212 and the heat dissipation pad 225. The conductive adhesive layer 240 in the molten state, ie, the solder, which is uniformly interposed between opposing faces of the solder, will stably provide the surface tension to their joint sites.

Therefore, since the light emitting diode package 220 may achieve a so-called self alignment on the heat dissipation substrate 210, a separate alignment mark for aligning the light emitting diode package 220 during the mounting process (S130) of the package substrate 221. And a separate jig (jig) for supporting the light emitting diode package 220 in a predetermined position is not necessary.

Next, as shown in FIG. 21, the zener diode 270 is mounted on the heat dissipation substrate 210 (S140), and the thermistor (180 of FIG. 1) is mounted on the heat dissipation substrate 210 (S150).

That is, the zener diode 270 and the thermistor (180 in FIG. 1) may be radiated by using the same conductive adhesive layer 240 as the conductive adhesive layer 240 for bonding the light emitting diode package 220 to the heat radiating substrate 210. Bond to the circuit of 210.

The present process may be performed at the same time as the package substrate 221 mounting process (S130) described above by surface mount technology, and thus, the light emitting diode package 220, the zener diode 270, and the thermistor 280 by a single process. If both are mounted at the same time, the process cost and time can be further reduced.

Next, the alignment mark (190 of FIG. 1) formed on the heat dissipation substrate 210 is used to determine whether the package substrate 221 is aligned with the heat dissipation substrate 210 (S160). When performing the process of providing the heat dissipation substrate 210 (S110), through holes are formed on the heat dissipation substrate 210 so as to correspond to the positions where the LED chip 230 is to be mounted, and the heat dissipation body 212 is exposed from the through holes. The alignment mark (190 of FIG. 1) may be formed by removing the solder resist layer 219 in the region extending horizontally to the surface side thereof to expose the lower insulating portion 216.

The alignment mark 190 of FIG. 1 may be formed by printing a separate material on the solder resist layer 219 in addition to removing the solder resist layer 219 to expose the insulating portion 216.

This process is to visually check the alignment of the light emitting diode chip 230 at the end of the manufacturing process using the alignment mark (190 of FIG. 1), whether or not alignment using such alignment mark (190 of FIG. 1). By the determination process, the above-described self-alignment effect of the LED package 220 may not be denied.

Hereinafter, another embodiment of a method of manufacturing the LED package module 200 according to another aspect of the present invention will be described with reference to FIGS. 22 to 27.

22 to 27 are cross-sectional views illustrating respective processes of a method of manufacturing a light emitting diode package module 200 according to another aspect of the present invention.

In the present embodiment, similar to the embodiment of the manufacturing method of the light emitting diode package module 200 shown in FIG. 14, a process of providing a heat dissipation substrate 210 (S110) and a process of providing a package substrate 221 (S120). The process of mounting the package substrate 221 on the heat dissipation substrate 210 (S130), the process of mounting the zener diode 270 on the heat dissipation substrate 210 (S140), and the thermistor 280 on the heat dissipation substrate 210. The mounting step (S150), and the step (S160) of determining whether or not the alignment between the package substrate 221 and the heat dissipation substrate 210.

However, in the present exemplary embodiment, the package substrate 221 is mounted on the process (S110) of providing the heat dissipation substrate 210, the process of providing the package substrate 221 (S120), and the heat dissipation substrate 210. Since there is a difference from the above-described embodiment in the detailed process of the step (S130) to be described below, the present embodiment will be described based on these differences.

In addition, in the present embodiment, the heat dissipation substrate 210, the heat dissipation body 212, the insulating portion 216, the electrode portion 218, the light emitting diode package 220, the package substrate 221, the heat dissipation pad 225, The structure and function of the electrode pad 226, the circuit pattern 227, the via 228, the light emitting diode chip 230, the conductive adhesive layer 240, the phosphor 250, and the glass layer 260 are described above. The heat dissipation substrate 110, the heat dissipation body 112, the insulation unit 116, the electrode unit 118, the light emitting diode package 120, and the package substrate of the LED package module (100 of FIG. 10) presented through the embodiment. (121), heat dissipation pad 125, electrode pad 126, circuit pattern 127, via 128, light emitting diode chip 130, conductive adhesive layer 140, phosphor 150, and glass layer 160. Since they are the same as or similar to each other, a detailed description of these structures will be omitted, and will be described with reference to the manufacturing process itself of the LED package module 200.

First, as shown in FIGS. 22 to 24, a heat dissipation substrate 210 including a heat dissipation body 212, an insulation part 216, and an electrode part 218 is provided (S110). The process includes the heat dissipation body 212 made of a conductive material, an insulation portion 216 formed on the outer circumferential surface of the heat dissipation body 212, and an electrode portion 218 formed on the insulation portion 216 and electrically insulated from the heat dissipation body 212. In the process of providing a heat dissipation substrate 210 including a), it can be described by dividing as follows.

First, as shown in FIGS. 22 and 23, the insulating portion 216 is formed on the outer circumferential surface of the heat dissipation body 212. That is, the insulating part 216 is formed around the heat dissipating body 212 without forming a separate protrusion 213 on the heat dissipating body 212, and the insulating part 216 may be formed with the electrode part 218. The protrusion 213 is naturally formed by being formed on the outer circumferential surface of the heat dissipating body 212 by a height excluding a thickness such that there is a sufficient thickness. As such, the process for processing the protrusion 213 on the heat dissipation body 212 is omitted, thereby reducing the manufacturing cost and time of the LED package module 200.

In this case, the insulation portion 216 may be formed to surround the heat dissipation body 212 along the outer circumferential surface of the heat dissipation body 212, and in addition, the insulation portion 216 may be modified in various structures.

Subsequently, as shown in FIG. 24, the electrode part 218 is formed on the insulating part 216 so as to face the electrode pad 226. The electrode part 218 may be formed by, for example, plating a conductive material on a portion of the insulating part 216.

Next, as shown in FIGS. 25 to 26, the heat dissipation pad 225 and the electrode pad 226 are formed to face the heat dissipation main body 212 and the electrode portion 218, respectively, and the light emitting diode chip 230 A package substrate 221 mounted to be electrically connected to the electrode pad 226 is provided (S120). This process can be explained by dividing as follows.

First, as shown in FIG. 25, the heat dissipation pad 225 and the electrode pad 226 are formed on the bottom surface of the package substrate 221, and the package substrate 221 is electrically connected to the light emitting diode chip 230. The circuit pattern 227 is formed on the upper surface, and the via 228 is formed in the package substrate 221 to electrically connect the circuit pattern 227 and the electrode pad 226. After the via hole is formed in the package substrate 221, the via 228, the circuit pattern 227, the heat radiating pad 225, and the electrode pad 226 may be formed by various methods such as plating, screen printing, or inkjet printing. It can be carried out by forming a.

Next, as shown in FIG. 26, the phosphor 250 is formed on the light emitting diode chip 230, and the light emitting diode chip 230 is mounted. Since the light emitting diode chip 230 may be bonded to the circuit pattern 227 in a flip chip manner, the phosphor 250 may be formed only on the top of the light emitting diode chip 230.

Since the light emitting diode chip 230 having the phosphor 250 formed thereon is flip-chip mounted, a separate configuration for protecting the light emitting diode chip 230 and the wires may be omitted, and thus, the light emitting diode package module 200 may be The manufacturing process can be simplified to reduce manufacturing costs and time.

Next, as illustrated in FIG. 27, the heat dissipation pad 225 and the electrode pad 226 are bonded to the heat dissipation body 212 and the electrode unit 218 by a conductive adhesive layer 240 in a single process, respectively, to dissipate heat. The package substrate 221 is mounted on the substrate 210 (S130). In the present embodiment, the conductive adhesive layer 240 is different from the above-described embodiment in that the buffer material is used as a paste, but in the case of using the paste as described above, the self-alignment effect of the LED package 220 is It can be used as it is.

That is, the light emitting pad 225 and the electrode pad 226 are light-emitting so as to correspond to the positions of the heat dissipating body 212 and the electrode unit 218, respectively, on the heat dissipating substrate 210 to which the paste having fluidity is applied because it is not dried. When the diode package 220 is mounted, the light emitting diode package 220 may maintain a constant position on the heat dissipation substrate 210 without a separate jig due to the surface tension of the paste having fluidity.

In addition, by using the buffer material paste as the conductive adhesive layer 240, even if the thermal expansion coefficient of the heat dissipation body 212 is slightly different from the package substrate 212 made of ceramic or the like, the light emitting diode package module Damage to the 200 can be prevented.

Next, a zener diode (170 of FIG. 2) is mounted on the heat dissipation substrate 210 (S140), and after mounting a thermistor (180 of FIG. 1) on the heat dissipation substrate 210 (S150), the heat dissipation substrate 210. It is determined whether the package substrate 221 is aligned with the heat dissipation substrate 210 by using the alignment mark (190 of FIG. 1) formed at (S160).

As mentioned above, although an embodiment of the present invention has been described, those of ordinary skill in the art may add, change, delete or add components within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

100: light emitting diode package module 110: heat dissipation board
112: heat dissipation main body 112a: flat plate portion
113: protrusion 114: upper surface of the heat dissipation main body
116: insulation portion 118: electrode portion
119: solder resist layer 120: light emitting diode package
121: package substrate 122: first substrate
123: second substrate 124: cavity
125: heat dissipation pad 126: electrode pad
127: circuit pattern 128: via
130: light emitting diode chip 135: wire
140: conductive adhesive layer 150: phosphor
160: glass layer 170: zener diode
180: thermistor 190: alignment mark

Claims (36)

A heat dissipation body having an upper surface on which protrusions are formed;
An insulation layer formed on an area of the upper surface of the heat dissipation body in which the protrusion is not formed; And
And an electrode part formed on the insulating layer so as to be electrically insulated from the heat dissipating main body, the electrode part having an upper surface disposed at substantially the same height as the upper surface of the protrusion.
The method of claim 1
The heat dissipation body includes a flat plate having a flat upper surface, and a protrusion formed on an upper surface of the flat plate.
The method according to claim 2, wherein
And the projecting portion is made of the same material as the heat dissipating body.
Heat dissipation body;
An insulation part formed on an outer circumferential surface of the heat dissipation body and having a height lower than that of the heat dissipation body; And
And an electrode portion formed on the insulating portion so as to be electrically insulated from the heat dissipating body and having an upper surface substantially positioned at the same height as the top surface of the heat dissipating body.
The method according to any one of claims 1 to 4,
The heat dissipation body is a heat dissipation substrate, characterized in that made of a material containing copper (Cu).
A heat dissipation body having an upper surface on which a protrusion is formed, an insulating layer formed on an area of the top surface of the heat dissipation body where the protrusion is not formed, and formed on the insulation layer to be electrically insulated from the heat dissipation body, and an upper surface of the protrusion A heat dissipation substrate including an electrode part having an upper surface positioned at substantially the same height as the first heat dissipation plate; And
A light emitting diode package module disposed on the protrusion and including a light emitting diode package electrically connected to the electrode part.
The method of claim 6
The heat dissipation body includes a flat plate having a flat upper surface, and a light emitting diode package module, characterized in that it comprises a protrusion formed on the upper surface of the flat portion.
The method of claim 7,
The projecting portion is a light emitting diode package module, characterized in that the same material as the heat dissipation body.
A heat dissipation body, an insulation portion formed on an outer circumferential surface of the heat dissipation body and having a lower height than the heat dissipation body, and formed on the insulation portion so as to be electrically insulated from the heat dissipation body, and positioned at substantially the same height as an upper surface of the heat dissipation body. A heat radiation substrate including an electrode portion having an upper surface; And
The light emitting diode package module is disposed on an upper surface of the heat dissipation main body, and includes a light emitting diode package electrically connected to the electrode unit.
The method of claim 6,
The light emitting diode package,
A package substrate;
A light emitting diode chip mounted on one surface of the package substrate;
An electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; And
And a heat dissipation pad formed on the other surface of the package substrate to face the protrusion and electrically insulated from the electrode pad.
The method of claim 10,
The heat dissipation pad is a light emitting diode package module, characterized in that bonded to the protrusion (bonding).
The method of claim 9,
The light emitting diode package,
A package substrate;
A light emitting diode chip mounted on one surface of the package substrate;
An electrode pad formed on the other surface of the package substrate so as to face an upper surface of the heat dissipation body and electrically connected to the light emitting diode chip; And
And a heat dissipation pad formed on the other surface of the package substrate so as to face the top surface of the heat dissipation body and electrically insulated from the electrode pad.
The method of claim 12,
The heat dissipation pad is a light emitting diode package module, characterized in that bonded to the upper surface (bonding) of the heat dissipation body.
The method according to any one of claims 6 to 9,
The heat dissipation body is a light emitting diode package module, characterized in that made of a material containing copper.
The method according to any one of claims 10 to 13,
The package substrate is a light emitting diode package module, characterized in that made of a material containing a ceramic.
The method according to any one of claims 10 to 13,
The electrode pad is formed on the package substrate to face the electrode portion, the light emitting diode package module, characterized in that bonded to the electrode portion.
The method of claim 10,
And a conductive adhesive layer interposed between the protrusion and the heat dissipation pad, and between the electrode and the electrode pad.
The method of claim 12,
And a conductive adhesive layer interposed between the heat dissipation body and the heat dissipation pad, and between the electrode portion and the electrode pad, respectively.
The method according to claim 10 or 11,
Opposite surfaces of the protrusion and the heat dissipation pad have the same size, opposing surfaces of the electrode portion and the electrode pad have the same size, and the conductive adhesive layer is disposed between the protruded portion and the opposing face of the heat dissipation pad. And a light emitting diode package module interposed between the electrode portion and an opposing surface of the electrode pad.
The method according to claim 12 or 13,
The top surface of the heat dissipation body and the opposing face of the heat dissipation pad are the same in size, and the light emitting diode package module, characterized in that the opposite surface of the electrode portion and the electrode pad is the same size.
The method of claim 17 or 18,
The conductive adhesive layer is a light emitting diode package module, characterized in that consisting of a solder (solder).
The method of claim 17 or 18,
The conductive adhesive layer is a light emitting diode package module, characterized in that made of a paste of the buffer material (paste).
The method according to any one of claims 10 to 13,
And an alignment mark formed on the heat dissipation substrate to determine whether the package substrate is aligned with the heat dissipation substrate.
Forming a protrusion on an upper surface of the heat dissipation body;
Forming an insulating part in an area of the upper surface of the heat dissipating body in which the protrusion is not formed; And
Forming an electrode part on the insulating part to be electrically insulated from the heat dissipating body;
The top surface of the electrode unit is located on the same height as the top surface of the protrusion part manufacturing method.
The method of claim 24
Forming a protrusion on the upper surface of the heat dissipating body, comprising the steps of providing a flat plate having a flat upper surface and forming a protrusion on the upper surface of the flat portion.
Providing a heat dissipation body;
Forming an insulating part having a lower height than the heat dissipating body on an outer circumferential surface of the heat dissipating body;
Forming an insulating part in an area of the upper surface of the heat dissipating body in which the protrusion is not formed; And
Forming an electrode part on the insulating part to be electrically insulated from the heat dissipating body;
The top surface of the electrode unit is located on the same height as the top surface of the protrusion part manufacturing method.
The method according to any one of claims 24 to 26,
The forming of the insulating part may include performing an insulating material on an upper surface of the heat dissipating body.
The method according to any one of claims 24 to 26,
Forming the insulating portion, the heat radiation substrate manufacturing method characterized in that it is carried out by laminating an insulating sheet on the upper surface of the heat radiating body.
A heat dissipation body having an upper surface on which a protrusion is formed, an insulating layer formed on an area of the top surface of the heat dissipation body where the protrusion is not formed, and formed on the insulation layer to be electrically insulated from the heat dissipation body, and an upper surface of the protrusion Providing a heat dissipation substrate comprising an electrode portion having an upper surface positioned at substantially the same height as the upper surface thereof;
Providing a package substrate having heat dissipation pads and electrode pads facing the protrusions and the electrode portions, respectively, and mounted with a light emitting diode chip electrically connected to the electrode pads; And
Bonding the heat dissipation pad and the electrode pad to the protrusion and the electrode, respectively, and mounting the package substrate on the heat dissipation substrate.
A heat dissipation body, an insulation portion formed on an outer circumferential surface of the heat dissipation body and having a lower height than the heat dissipation body, and formed on the insulation portion so as to be electrically insulated from the heat dissipation body, and positioned at substantially the same height as an upper surface of the heat dissipation body. Providing a heat radiation substrate including an electrode portion having an upper surface;
Providing a package substrate on which a heat dissipation pad and an electrode pad face the heat dissipation body and the electrode portion, respectively, and are mounted such that a light emitting diode chip is electrically connected to the electrode pad; And
Bonding the heat dissipation pad and the electrode pad to the heat dissipation body and the electrode, respectively, and mounting the package substrate on the heat dissipation substrate.
The method of claim 29 or 30,
The method of manufacturing a light emitting diode package module, wherein the mounting of the package substrate is performed by a single process.
The method of claim 29,
Mounting the package substrate,
The method of manufacturing a light emitting diode package module, characterized in that is performed between the protrusion and the heat dissipation pad, and between the electrode portion and the electrode pad via a conductive adhesive layer, respectively.
The method of claim 30,
Mounting the package substrate,
The method of manufacturing a light emitting diode package module, characterized in that the conductive adhesive layer is performed between the heat dissipation body and the heat dissipation pad, and between the electrode portion and the electrode pad.
34. The method of claim 32 or 33,
The conductive adhesive layer is made of solder,
The mounting of the package substrate is a method of manufacturing a light emitting diode package module, characterized in that performed by surface mounting technology (SMT, surface mounting technology).
34. The method of claim 32 or 33,
The conductive adhesive layer is a light emitting diode package module manufacturing method, characterized in that consisting of a buffer material paste.
The method of claim 29 or 30,
After the mounting of the package substrate, determining whether the package substrate is aligned with the heat dissipation substrate by using an alignment mark formed on the heat dissipation substrate.

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