KR20110053736A - Apparatus for coating photoresist - Google Patents
Apparatus for coating photoresist Download PDFInfo
- Publication number
- KR20110053736A KR20110053736A KR1020090110401A KR20090110401A KR20110053736A KR 20110053736 A KR20110053736 A KR 20110053736A KR 1020090110401 A KR1020090110401 A KR 1020090110401A KR 20090110401 A KR20090110401 A KR 20090110401A KR 20110053736 A KR20110053736 A KR 20110053736A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- photoresist
- nozzle
- hole
- air pad
- Prior art date
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Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
Description
The present invention relates to a photoresist application apparatus, and more particularly, to transfer a substrate under a slit nozzle and to prevent the slit nozzle from being dried by an air pad formed under the substrate when the photoresist is applied onto the substrate. It relates to a photoresist application device.
Recently, liquid crystal display (LCD) devices, plasma display panel (PDP) devices, and the like have been rapidly replacing conventional CRTs as display devices for displaying images. These use substrates commonly referred to as flat panel displays (FPDs).
In order to manufacture a flat panel display, many processes such as a substrate fabrication process, a cell fabrication process, and a module fabrication process must be performed. In particular, in the substrate fabrication process, in order to form various patterns on the substrate, photolithography techniques are generally applied, starting with a cleaning process.
The photolithography technique includes applying a photoresist, a photoresist, to a film formed on a substrate, drying the photoresist to volatilize a solvent of the photoresist, and relatively low temperature. Soft baking the photoresist, exposing the photoresist film according to a pattern formed on the photomask after covering the photoresist with a photo mask, and developing the exposed photoresist film. And hard baking the developed photoresist at a relatively high temperature, and patterning the film quality exposed between the photoresist films.
The method of applying the photoresist to the substrate is to transfer the substrate under the fixed slit nozzle and apply the photoresist to the entire surface of the substrate.The slit nozzle is moved on the fixed substrate and the photoresist is applied to the entire surface of the substrate. There is a method of coating. The present invention relates to an apparatus for transferring a substrate under a fixed slit nozzle and applying a photoresist to the entire surface of the substrate.
At the time of transferring the substrate, a plurality of air pads having a plurality of injection holes for injecting air toward the substrate and a vacuum hole for sucking air are formed along the transfer path of the substrate. By injecting air toward the substrate through the injection hole, it is possible to provide a flotation force to prevent the substrate from sagging and to move the substrate in a suspended state without contacting the lower portion. At this time, the photoresist is applied onto the substrate transferred through the slit nozzle in a fixed position on the upper portion of the substrate. The air pad must be operated to transfer the substrate despite the application of the photoresist to the substrate. . At this time, when the substrate is no longer present between the air pad and the nozzle, the nozzle is affected by the operation of the air pad. The nozzle may be exposed from the injection hole below the nozzle to dry the photoresist inside the nozzle and solidify therein. Therefore, there arises a problem that the photoresist cannot be uniformly applied onto the substrate through the nozzle.
The present invention has been devised to solve the above problems, and an object of the present invention is to provide a photoresist application apparatus which prevents the photoresist inside the nozzle from being dried by an air pad necessary for transferring a substrate.
The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.
In order to achieve the above object, the photoresist coating apparatus according to an embodiment of the present invention includes a substrate transfer unit for transferring a substrate; And a nozzle for applying a photoresist onto the transferred substrate at a fixed position on the upper portion of the substrate, wherein the substrate transfer part includes: a substrate support part supporting both edges of the substrate; An air pad having a plurality of injection holes for injecting air toward the substrate and a vacuum hole for sucking the air along a transport path of the substrate under the substrate; A control unit controlling an operation of the air pad; And a conveying part for conveying the substrate support, wherein the control part includes a spraying hole and a vacuum hole of the air pad in a predetermined first area and a spraying hole of the air pad in the remaining second area under the nozzle. And individually controlling the operation of the vacuum hole.
According to the photoresist application device of the present invention as described above has one or more of the following effects.
First, there is an advantage that the photoresist inside the nozzle is dried by the operation of the air pad, so that the operation of the air pad used to transfer the substrate can be controlled separately by dividing into two areas.
Second, there is an advantage that the inside of the nozzle can be prevented from being dried by the air pad, thereby improving the uniformity of the coating.
Details of the embodiments are included in the detailed description and drawings.
Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.
Hereinafter, the present invention will be described with reference to the drawings for describing the photoresist application apparatus according to embodiments of the present invention.
1 is a perspective view of a photoresist application device according to an embodiment of the present invention, Figure 2 shows a spray hole, a vacuum hole and a nozzle formed in the air pad in the photoresist application device according to an embodiment of the present invention 3 and 4 are views for explaining the individual operation control of the air pad in the photoresist application device according to an embodiment of the present invention.
The photoresist application apparatus according to an embodiment of the present invention may include a substrate transfer part and a
The substrate transfer part serves to transfer the substrate W under the
The substrate support 110 is formed at both edges of the surface plate 100 to support both edges of the substrate W. An adsorption hole (not shown) for sucking gas is formed in a surface of the substrate support 110 that is in contact with the substrate W. The substrate W can be adsorbed onto the substrate support 110 by vacuum.
The surface plate 100 serves as a support for supporting the entire equipment.
The
The transfer unit 130 transfers the substrate support 110. Although not shown in detail, the transfer unit 130 may be composed of an LM guide, a ball screw drive unit, and a power unit generating power. Since the structure of the transfer unit 130 for transferring the substrate support 110 may use a variety of well-known techniques, a detailed description thereof will be omitted.
The substrate W is provided with a force for adsorbing the substrate W through an adsorption hole (not shown) formed in a surface contacting the substrate support 110, and is provided to the
The controller (not shown) controls the operation of the
In more detail, the substrate W is supported by the
However, as shown in FIG. 4, when the substrate W is positioned at the position immediately before the application of the photoresist P onto the substrate W is finished, the controller (not shown) may have a spray hole (not shown) in the first region. 122 and the
That is, in the present invention, after the application of the photoresist P to the substrate W is terminated, the
The
The operation of the photoresist application apparatus according to an embodiment of the present invention will be described.
First, the substrate W is transferred by an external substrate transfer apparatus and is mounted on the substrate support 110. In a state in which the substrate W is seated on the substrate support 110, the substrate support 110 adsorbs the substrate W through an adsorption hole (not shown) and simultaneously lifts the substrate W through the
When the substrate support part 110 is transferred by the transfer part 130 while the substrate W is horizontal, the substrate W can be transferred. The
At this time, in the present invention, the control unit (not shown) stops the operation of the
Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.
1 is a perspective view of a photoresist application apparatus according to an embodiment of the present invention.
2 is a view showing the injection hole, the vacuum hole and the nozzle formed in the air pad in the photoresist application apparatus according to an embodiment of the present invention.
3 and 4 are views for explaining the individual operation control of the air pad in the photoresist application device according to an embodiment of the present invention.
<Explanation of symbols for the main parts of the drawings>
100: surface plate
110: substrate support
120: air pad
122: injection hole
124: vacuum hole
130: transfer unit
150: slit nozzle
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090110401A KR20110053736A (en) | 2009-11-16 | 2009-11-16 | Apparatus for coating photoresist |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020090110401A KR20110053736A (en) | 2009-11-16 | 2009-11-16 | Apparatus for coating photoresist |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20110053736A true KR20110053736A (en) | 2011-05-24 |
Family
ID=44363189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090110401A KR20110053736A (en) | 2009-11-16 | 2009-11-16 | Apparatus for coating photoresist |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20110053736A (en) |
-
2009
- 2009-11-16 KR KR1020090110401A patent/KR20110053736A/en not_active Application Discontinuation
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A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |