KR20110053736A - Apparatus for coating photoresist - Google Patents

Apparatus for coating photoresist Download PDF

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Publication number
KR20110053736A
KR20110053736A KR1020090110401A KR20090110401A KR20110053736A KR 20110053736 A KR20110053736 A KR 20110053736A KR 1020090110401 A KR1020090110401 A KR 1020090110401A KR 20090110401 A KR20090110401 A KR 20090110401A KR 20110053736 A KR20110053736 A KR 20110053736A
Authority
KR
South Korea
Prior art keywords
substrate
photoresist
nozzle
hole
air pad
Prior art date
Application number
KR1020090110401A
Other languages
Korean (ko)
Inventor
현재일
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020090110401A priority Critical patent/KR20110053736A/en
Publication of KR20110053736A publication Critical patent/KR20110053736A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Coating Apparatus (AREA)

Abstract

PURPOSE: A photoresist coating device is provided to improve the uniformity of coating by preventing a nozzle from being dried through an air pad. CONSTITUTION: A substrate transfer unit transfers a substrate. A photoresist is coated on the surface transferred from a fixed position through the nozzle. A substrate support unit supports both edges of the substrate. A plurality of spray holes(122) for spraying air and vacuum holes(124) for inhaling the air are formed on an air pad(120) along a transfer path of a substrate. A controller controls the operation of the air pad. A transfer unit transfers a substrate support unit.

Description

Apparatus for coating photoresist

The present invention relates to a photoresist application apparatus, and more particularly, to transfer a substrate under a slit nozzle and to prevent the slit nozzle from being dried by an air pad formed under the substrate when the photoresist is applied onto the substrate. It relates to a photoresist application device.

Recently, liquid crystal display (LCD) devices, plasma display panel (PDP) devices, and the like have been rapidly replacing conventional CRTs as display devices for displaying images. These use substrates commonly referred to as flat panel displays (FPDs).

In order to manufacture a flat panel display, many processes such as a substrate fabrication process, a cell fabrication process, and a module fabrication process must be performed. In particular, in the substrate fabrication process, in order to form various patterns on the substrate, photolithography techniques are generally applied, starting with a cleaning process.

The photolithography technique includes applying a photoresist, a photoresist, to a film formed on a substrate, drying the photoresist to volatilize a solvent of the photoresist, and relatively low temperature. Soft baking the photoresist, exposing the photoresist film according to a pattern formed on the photomask after covering the photoresist with a photo mask, and developing the exposed photoresist film. And hard baking the developed photoresist at a relatively high temperature, and patterning the film quality exposed between the photoresist films.

The method of applying the photoresist to the substrate is to transfer the substrate under the fixed slit nozzle and apply the photoresist to the entire surface of the substrate.The slit nozzle is moved on the fixed substrate and the photoresist is applied to the entire surface of the substrate. There is a method of coating. The present invention relates to an apparatus for transferring a substrate under a fixed slit nozzle and applying a photoresist to the entire surface of the substrate.

At the time of transferring the substrate, a plurality of air pads having a plurality of injection holes for injecting air toward the substrate and a vacuum hole for sucking air are formed along the transfer path of the substrate. By injecting air toward the substrate through the injection hole, it is possible to provide a flotation force to prevent the substrate from sagging and to move the substrate in a suspended state without contacting the lower portion. At this time, the photoresist is applied onto the substrate transferred through the slit nozzle in a fixed position on the upper portion of the substrate. The air pad must be operated to transfer the substrate despite the application of the photoresist to the substrate. . At this time, when the substrate is no longer present between the air pad and the nozzle, the nozzle is affected by the operation of the air pad. The nozzle may be exposed from the injection hole below the nozzle to dry the photoresist inside the nozzle and solidify therein. Therefore, there arises a problem that the photoresist cannot be uniformly applied onto the substrate through the nozzle.

The present invention has been devised to solve the above problems, and an object of the present invention is to provide a photoresist application apparatus which prevents the photoresist inside the nozzle from being dried by an air pad necessary for transferring a substrate.

The objects of the present invention are not limited to the above-mentioned objects, and other objects that are not mentioned will be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, the photoresist coating apparatus according to an embodiment of the present invention includes a substrate transfer unit for transferring a substrate; And a nozzle for applying a photoresist onto the transferred substrate at a fixed position on the upper portion of the substrate, wherein the substrate transfer part includes: a substrate support part supporting both edges of the substrate; An air pad having a plurality of injection holes for injecting air toward the substrate and a vacuum hole for sucking the air along a transport path of the substrate under the substrate; A control unit controlling an operation of the air pad; And a conveying part for conveying the substrate support, wherein the control part includes a spraying hole and a vacuum hole of the air pad in a predetermined first area and a spraying hole of the air pad in the remaining second area under the nozzle. And individually controlling the operation of the vacuum hole.

According to the photoresist application device of the present invention as described above has one or more of the following effects.

First, there is an advantage that the photoresist inside the nozzle is dried by the operation of the air pad, so that the operation of the air pad used to transfer the substrate can be controlled separately by dividing into two areas.

Second, there is an advantage that the inside of the nozzle can be prevented from being dried by the air pad, thereby improving the uniformity of the coating.

Details of the embodiments are included in the detailed description and drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms, and only the embodiments make the disclosure of the present invention complete, and the general knowledge in the art to which the present invention belongs. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

Hereinafter, the present invention will be described with reference to the drawings for describing the photoresist application apparatus according to embodiments of the present invention.

1 is a perspective view of a photoresist application device according to an embodiment of the present invention, Figure 2 shows a spray hole, a vacuum hole and a nozzle formed in the air pad in the photoresist application device according to an embodiment of the present invention 3 and 4 are views for explaining the individual operation control of the air pad in the photoresist application device according to an embodiment of the present invention.

The photoresist application apparatus according to an embodiment of the present invention may include a substrate transfer part and a nozzle 150. First, the present invention relates to an apparatus for applying a photoresist to the entire surface of the substrate W by moving the substrate W under the nozzle 150 in a fixed position as described above.

The substrate transfer part serves to transfer the substrate W under the nozzle 150. The substrate transfer unit may include a substrate support unit 110, an air pad 120, a transfer unit 130, and a controller (not shown).

The substrate support 110 is formed at both edges of the surface plate 100 to support both edges of the substrate W. An adsorption hole (not shown) for sucking gas is formed in a surface of the substrate support 110 that is in contact with the substrate W. The substrate W can be adsorbed onto the substrate support 110 by vacuum.

The surface plate 100 serves as a support for supporting the entire equipment.

The air pad 120 is formed on the surface plate 100. The injection hole 122 for injecting air toward the substrate W and the vacuum hole 124 for sucking air are provided under the substrate W. A plurality may be formed along the conveyance path of?). Preferably, as shown in FIG. 2, the injection holes 122 and the vacuum holes 124 have the same size, and may be formed to be alternately repeated at regular intervals. By spraying air toward the substrate W through the injection hole 122 and sucking air through the vacuum hole 124, the substrate W can be prevented from sagging and the substrate W can be kept horizontal. have.

The transfer unit 130 transfers the substrate support 110. Although not shown in detail, the transfer unit 130 may be composed of an LM guide, a ball screw drive unit, and a power unit generating power. Since the structure of the transfer unit 130 for transferring the substrate support 110 may use a variety of well-known techniques, a detailed description thereof will be omitted.

The substrate W is provided with a force for adsorbing the substrate W through an adsorption hole (not shown) formed in a surface contacting the substrate support 110, and is provided to the air pad 120 under the substrate W. As a result of being provided with a supporting force while keeping the substrate W horizontal, the air gap can be supported by forming an air gap in contact with only the substrate support 110. At this time, by receiving power from the transfer unit 130, the substrate support unit 110 can transfer, and thus can transfer the substrate (W).

The controller (not shown) controls the operation of the air pad 120. In more detail, the air is injected and sucked by the plurality of injection holes 122 and the vacuum holes 124 formed in the air pad 120. At this time, as shown in Figure 3, the air pad 120 according to an embodiment of the present invention is the injection hole 122 and the vacuum hole 124 in a predetermined first area below the vertical of the nozzle 150 ) And the injection hole 122 and the vacuum hole 124 in the second area, which is the remaining area. In this case, the controller (not shown) may individually control the operations of the injection hole 122 and the vacuum hole 124 in the air pad 120 of the first area and the second area.

In more detail, the substrate W is supported by the air pad 120, and the substrate W is transferred, and when the nozzle 150 is reached below, the application of the photoresist P is started. While the application is in progress, as illustrated in FIG. 3, the controller (not shown) may control the air pad 120 to operate all the injection holes 122 and the vacuum holes 124 in the first area and the second area.

However, as shown in FIG. 4, when the substrate W is positioned at the position immediately before the application of the photoresist P onto the substrate W is finished, the controller (not shown) may have a spray hole (not shown) in the first region. 122 and the vacuum hole 124 is stopped and only the injection hole 122 and the vacuum hole 124 in the second region are operated.

That is, in the present invention, after the application of the photoresist P to the substrate W is terminated, the air pad 120 does not exist between the nozzle 150 and the air pad 120. By the flow of air generated from the operation of the photoresist (P) in the interior of the nozzle 150 may be prevented from drying and solidifying.

The nozzle 150 coats the photoresist P on the substrate W from the top of the substrate W. Preferably, the nozzle 150 may be a slit nozzle 150 that is long in the longitudinal direction. The slit nozzle 150 is fixed from both nozzle supports 155, the width of the slit nozzle 150 may be formed to be the same or slightly larger than the width of the substrate (W), the upper portion of the substrate (W) As the photoresist P is supplied through the slit nozzle 150 fixed in the substrate, the substrate W is transferred under the slit nozzle 150, so that the photoresist P is uniformly applied to the entire surface of the substrate W. It can be applied. Since the configuration of the slit nozzle 150 is well known in the art, a detailed description thereof will be omitted.

The operation of the photoresist application apparatus according to an embodiment of the present invention will be described.

First, the substrate W is transferred by an external substrate transfer apparatus and is mounted on the substrate support 110. In a state in which the substrate W is seated on the substrate support 110, the substrate support 110 adsorbs the substrate W through an adsorption hole (not shown) and simultaneously lifts the substrate W through the air pad 120. By injecting air and sucking air toward the substrate W, the substrate W can be leveled and floated.

When the substrate support part 110 is transferred by the transfer part 130 while the substrate W is horizontal, the substrate W can be transferred. The slit nozzle 150 corresponding to the width of the substrate W is formed at the fixed position on the substrate W. Therefore, the photoresist P is continuously supplied through the fixed slit nozzle 150 and the slit is slit. The photoresist can be applied to the entire surface of the substrate W by transferring the substrate W under the nozzle 150.

At this time, in the present invention, the control unit (not shown) stops the operation of the air pad 120 in the first area at the end point of applying the chemical on the substrate W, thereby the air pad 120 in the first area. ), It is possible to prevent the photoresist P chemical liquid inside the nozzle 150 at the top from being dried and solidified.

Those skilled in the art will appreciate that the present invention can be embodied in other specific forms without changing the technical spirit or essential features of the present invention. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is indicated by the scope of the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and the equivalent concept are included in the scope of the present invention. Should be interpreted.

1 is a perspective view of a photoresist application apparatus according to an embodiment of the present invention.

2 is a view showing the injection hole, the vacuum hole and the nozzle formed in the air pad in the photoresist application apparatus according to an embodiment of the present invention.

3 and 4 are views for explaining the individual operation control of the air pad in the photoresist application device according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: surface plate

110: substrate support

120: air pad

122: injection hole

124: vacuum hole

130: transfer unit

150: slit nozzle

Claims (5)

A substrate transfer unit for transferring a substrate; And A nozzle for applying a photoresist on the transferred substrate at a fixed position on the upper portion of the substrate, The substrate transfer unit A substrate support part supporting both edges of the substrate; An air pad having a plurality of injection holes for injecting air toward the substrate and a vacuum hole for sucking the air along a transport path of the substrate under the substrate; A control unit controlling an operation of the air pad; And It includes a transfer unit for transferring the substrate support, The control unit is applied to the photoresist for individually controlling the operation of the injection hole and the vacuum hole of the air pad in the predetermined first area below the nozzle and the operation of the injection hole and the vacuum hole in the remaining second area Device. The method of claim 1, And the substrate support part is provided with a suction hole for adsorbing the substrate by vacuum at a portion in contact with the substrate. The method of claim 1, And the injection holes and the vacuum holes are alternately repeated at equal intervals. The method of claim 1, The control unit operates both the injection hole and the vacuum hole in the first area and the second area of the air pad while applying the photoresist on the substrate, and immediately before the application of the photoresist on the substrate is finished. And a photoresist coating device for controlling to stop the operation of the injection hole and the vacuum hole in the first region. The method of claim 1, And the nozzle is a slit nozzle.
KR1020090110401A 2009-11-16 2009-11-16 Apparatus for coating photoresist KR20110053736A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090110401A KR20110053736A (en) 2009-11-16 2009-11-16 Apparatus for coating photoresist

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Application Number Priority Date Filing Date Title
KR1020090110401A KR20110053736A (en) 2009-11-16 2009-11-16 Apparatus for coating photoresist

Publications (1)

Publication Number Publication Date
KR20110053736A true KR20110053736A (en) 2011-05-24

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