KR20110031406A - 넓은 면적의 모듈러 센서 어레이 어셈블리, 변환기 센서 어레이 어셈블리, 넓은 면적의 모듈러 센서 어레이 어셈블리를 구성하는 방법 - Google Patents
넓은 면적의 모듈러 센서 어레이 어셈블리, 변환기 센서 어레이 어셈블리, 넓은 면적의 모듈러 센서 어레이 어셈블리를 구성하는 방법 Download PDFInfo
- Publication number
- KR20110031406A KR20110031406A KR1020100092709A KR20100092709A KR20110031406A KR 20110031406 A KR20110031406 A KR 20110031406A KR 1020100092709 A KR1020100092709 A KR 1020100092709A KR 20100092709 A KR20100092709 A KR 20100092709A KR 20110031406 A KR20110031406 A KR 20110031406A
- Authority
- KR
- South Korea
- Prior art keywords
- interposer
- sensor array
- array assembly
- integrated circuit
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
- A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Soldering of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
- G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
- G01S7/52—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00
- G01S7/52017—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S15/00 particularly adapted to short-range imaging
- G01S7/52079—Constructional features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/10—Number of transducers
- G01N2291/106—Number of transducers one or more transducer arrays
Landscapes
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Animal Behavior & Ethology (AREA)
- Gynecology & Obstetrics (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- Surgery (AREA)
- Biophysics (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Computer Networks & Wireless Communication (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US24406909P | 2009-09-20 | 2009-09-20 | |
| US61/244,069 | 2009-09-20 | ||
| US12/714,239 | 2010-02-26 | ||
| US12/714,239 US8345508B2 (en) | 2009-09-20 | 2010-02-26 | Large area modular sensor array assembly and method for making the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20110031406A true KR20110031406A (ko) | 2011-03-28 |
Family
ID=43757222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020100092709A Ceased KR20110031406A (ko) | 2009-09-20 | 2010-09-20 | 넓은 면적의 모듈러 센서 어레이 어셈블리, 변환기 센서 어레이 어셈블리, 넓은 면적의 모듈러 센서 어레이 어셈블리를 구성하는 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8345508B2 (https=) |
| JP (1) | JP5675242B2 (https=) |
| KR (1) | KR20110031406A (https=) |
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| KR101387225B1 (ko) * | 2012-02-24 | 2014-04-21 | 경북대학교 산학협력단 | 2d 배열형 초음파 프로브의 소형화 기술 |
| KR20140148452A (ko) * | 2012-03-30 | 2014-12-31 | 세이코 엡슨 가부시키가이샤 | 초음파 트랜스듀서 소자 칩 및 프로브, 및 전자 기기 및 초음파 진단 장치 |
| US8932941B2 (en) | 2012-08-29 | 2015-01-13 | Samsung Electronics Co., Ltd. | Graphene device and method of fabricating the same |
| US8975096B2 (en) | 2012-06-25 | 2015-03-10 | Samsung Electronics Co., Ltd. | Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig |
| US9233396B2 (en) | 2012-09-13 | 2016-01-12 | Samsung Electronics Co., Ltd. | Micromachined ultrasonic transducer array |
| JP2019187526A (ja) * | 2018-04-18 | 2019-10-31 | キヤノンメディカルシステムズ株式会社 | 超音波プローブ及び超音波診断装置 |
| KR20200052224A (ko) * | 2018-11-06 | 2020-05-14 | 지멘스 메디컬 솔루션즈 유에스에이, 인크. | 다차원 트랜스듀서 어레이를 위한 인터포저를 갖는 칩-온-어레이 |
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| KR101378012B1 (ko) | 2012-03-14 | 2014-03-24 | 삼성전자주식회사 | 멀티 어레이형 초음파 프로브 장치 및 멀티 어레이형 초음파 프로브 장치의 제조 방법 |
| US8742646B2 (en) | 2012-03-29 | 2014-06-03 | General Electric Company | Ultrasound acoustic assemblies and methods of manufacture |
| KR101383298B1 (ko) | 2012-04-25 | 2014-04-09 | 삼성전자주식회사 | 초음파 프로브 장치 및 초음파 프로브 장치의 제조 방법 |
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- 2010-09-17 JP JP2010208824A patent/JP5675242B2/ja active Active
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Also Published As
| Publication number | Publication date |
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| JP5675242B2 (ja) | 2015-02-25 |
| US20110071397A1 (en) | 2011-03-24 |
| US8345508B2 (en) | 2013-01-01 |
| JP2011078755A (ja) | 2011-04-21 |
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