KR20100127056A - Apparatus manufacturing for flat panel display device and mathod for manufacturing the same - Google Patents

Abstract

PURPOSE: An apparatus and a method for manufacturing a flat panel display device are provided to reduce the manufacturing costs of the flat panel display device by simplifying manufacturing apparatuses. CONSTITUTION: A cleaning unit(T1) cleans a substrate. A PR shaping unit(T2) forms a photo resist on the cleaned substrate. A solvent remover(T3) removes a solvent from the photo resist by using radiant heat in a vacuum pressure state. An exposing unit(T6) exposes a substrate with the photo resist. A developing unit(T7) develops the exposed substrate.

Description

Flat panel display manufacturing equipment and its manufacturing method {APPARATUS MANUFACTURING FOR FLAT PANEL DISPLAY DEVICE AND MATHOD FOR MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to manufacturing equipment for a flat panel display device, and more particularly, to manufacturing equipment for a flat panel display device and a manufacturing method thereof to improve manufacturing process efficiency and to reduce manufacturing costs. It is about.

Background Art In recent years, lightweight thin flat panel displays have been mainly used as video display devices used for personal computers, portable terminals, monitors of various information apparatuses, and the like. Such flat panel displays include liquid crystal displays, light emitting displays, plasma display panels, field emission displays, and the like.

Among them, an organic electroluminescent device is mainly used as a light emitting display device. The organic electroluminescent device includes an organic thin film layer and a first electrode and a second electrode formed with the organic thin film layer interposed therebetween. Here, either one of the first and second electrodes may be an anode electrode and another may be a cathode electrode.

On the other hand, the liquid crystal display device is composed of a pair of substrates having a predetermined space and bonded together, and a liquid crystal layer injected between the substrates. In this case, the pair of substrates includes a thin film transistor (TFT) array substrate and a color filter substrate. Here, the TFT array substrate has a plurality of pixel electrodes formed in a matrix type in each pixel region defined by crossing each gate line and data line, and is switched by a signal of a gate line to convert a signal of a data line. A plurality of thin film transistors that are delivered to each pixel electrode are formed.

In order to manufacture the flat panel display devices as described above, various patterns or color filters must be formed on at least one of a pair of substrates, and the various patterns or color filters are subjected to a photolithography process. Is formed.

The photolithography process is a process of cleaning a substrate, a process of forming a photoresist (PR; Photoresist) on the cleaned substrate, and pressure-curing the formed photoresist in a vacuum state to remove the solvent contained in the photoresist. Removing, drying the cured photoresist by soft-baking, exposing the cured photoresist using a photomask, developing the exposed photoresist, and the like. do.

In the conventional photolithography process, the substrate is pressurized to a low vacuum state using a curing device (VCD; Vacuum Dry) to harden the solvent included in the photoresist to cure the photoresist. Then, the photoresist is dried by heating the substrate using an oven having an SHP (Softbake Hot Plate).

However, in the conventional photolithography process as described above, the solvent of the photoresist is first removed using a VCD, and then moved to an oven having SHP to remove the solvent of the photoresist. There is a problem in that the tac time required for a long time. In other words, in the conventional case of curing the photoresist, and then moving the substrate to dry again, the operation time required for the entire process is inevitably long, and since a device such as an oven having a VCD and an SHP is required, a flat panel display device is required. Their manufacturing costs will also increase.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems. The present invention provides a flat panel display manufacturing apparatus and a method for manufacturing the flat panel display apparatus, which can simplify the manufacturing equipment of the flat panel display to improve its manufacturing process efficiency and reduce manufacturing costs. The purpose is to provide.

According to an aspect of the present invention, there is provided a manufacturing apparatus of a flat panel display, including: a cleaning unit for cleaning a substrate from the outside; A PR forming unit for forming a photoresist on the cleaned substrate; Solvent removal unit for removing the solvent of the photoresist by curing and drying the photoresist formed on the substrate using a radiant heat under vacuum pressurization in a single process; An exposure unit performing an exposure process on the photoresist formation substrate; And a developing unit receiving the exposed substrate and performing a developing process.

A temperature control CP for reducing the temperature of the photoresist forming substrate, a buffer unit for temporarily storing the photoresist forming substrate before the exposure process is performed, and curing the patterned photoresist through the developing process to improve its adhesion and durability A hard bake portion and a washing portion, a PR forming portion, a solvent removing portion, a temperature control CP, an exposure portion, a buffer portion, a developing portion, and a hard bake portion to be movable. It is characterized by further comprising at least one transfer loader for transferring.

The solvent removing unit is provided at a lower portion of the chamber to allow the vacuum chamber, the plurality of seating pins on which the photoresist forming substrate is to be seated, and the plurality of seating pins to pass therethrough so that the substrate is loaded or not in accordance with the vertical movement of the seating pins. The substrate plate being unloaded, a radiant heat applying plate provided to face the substrate plate at an upper portion of the chamber to apply radiant heat to the substrate on which the photoresist is formed, and the inside of the chamber through at least one vacuum tube connected to the chamber. It characterized in that it comprises a vacuum pump to achieve a vacuum state, a pressure control unit for adjusting the pressure in the chamber and the exhaust pipe for discharging the solvent extracted from the photoresist to the outside of the chamber.

The radiant heat applying plate is first applied to remove the solvents of the photoresist by applying radiant heat at any temperature of 80 ℃ to 120 ℃ to the photoresist in a vacuum of any one of 2 to 3 torr, and then again The solvent of the photoresist may be secondarily removed by applying radiant heat at any temperature of 150 ° C. to 150 ° C. in a vacuum state of any one of 0.2 Torr and 1.5 Torr.

In addition, a method of manufacturing a flat panel display device according to an embodiment of the present invention for achieving the above object comprises the steps of cleaning the substrate from the outside; Forming a photoresist on the cleaned substrate; Removing the solvent of the photoresist by curing and drying the photoresist formed on the substrate using a radiant heat under vacuum pressurization in a single process; Performing an exposure process on the photoresist forming substrate; And receiving the exposed substrate to perform a developing process.

Reducing the temperature of the photoresist forming substrate, temporarily storing the photoresist forming substrate before the exposure process is performed, and curing the patterned photoresist through the developing process to improve its adhesion and durability. It is characterized by including more.

The removing of the solvent may include a plurality of seating pins on which the photoresist forming substrate is seated in the vacuum-capable chamber, and a lower portion of the chamber through which the plurality of seating pins pass. A substrate plate on which the substrate is loaded or unloaded, a radiant heat applying plate provided on an upper portion of the chamber to face the substrate plate to apply radiant heat to the photoresist formed substrate, and at least one connected to the chamber Solvent removal with a vacuum pump to make the interior of the chamber in a vacuum state through a vacuum tube, a pressure control unit for adjusting the pressure inside the chamber and an exhaust pipe for discharging the solvent extracted from the photoresist to the outside of the chamber The photoresist by using And a solvent characterized in that the curing and drying in a single step.

In the solvent removing step, the photoresist is applied to the photoresist at a temperature of 80 ° C. to 120 ° C. in a vacuum state of any one of 2 to 3 torr by using the radiant heat applying plate. After removing the solvents of the resist, it is characterized in that the second solvent to remove the solvent of the photoresist by applying a radiant heat at any temperature of 150 ℃ to 150 ℃ again in a vacuum of any one of 0.2 Torr to 1.5 Torr .

The manufacturing equipment and the manufacturing method of the flat panel display device according to the embodiment of the present invention having the above characteristics can improve the process efficiency by reducing the time required for the manufacturing process by simplifying the manufacturing equipment of the flat panel display device. In addition, the manufacturing cost of the flat panel display can be reduced by simplifying the manufacturing equipment.

Hereinafter, a manufacturing apparatus and a manufacturing method of a flat panel display device according to an embodiment of the present invention having the above characteristics will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating a layout structure for a manufacturing process of a flat panel display device according to an exemplary embodiment of the present invention.

The manufacturing equipment of the flat panel display shown in FIG. 1 includes a cleaning unit T1 for cleaning a substrate from the outside; A PR forming unit T2 for forming a photoresist (PR) on the cleaned substrate; Solvent removal unit (T3) for removing the solvent (PR Solvent) of the PR by curing and drying the PR formed on the substrate using a radiant heat in a vacuum pressurization in a single process; A temperature control CP (T4) for reducing the temperature of the PR forming substrate; An exposure unit T6 which performs an exposure process on the PR forming substrate; A buffer unit T5 for temporarily storing the PR forming substrate before the exposure process is performed; A developing unit T7 which receives the exposed substrate and performs a developing process; A hard bake portion T8 for curing the PR patterned through the developing process to improve its adhesion and durability; And the cleaning unit T1, the PR forming unit T2, the solvent removing unit T3, the temperature control CP T4, the exposure unit T6, the buffer unit T5, the developing unit T7, and the hard bake unit. At least one transfer loader part R1, R2 is provided so as to be movable between T8 and transfers the substrate to the respective components.

The cleaning unit T1 cleans the substrates supplied through the transfer loaders R1 and R2, and transfers the washed substrates back to the PR forming unit T2 through the transfer loaders R1 and R2. . In this case, the substrate may be a lower substrate on which TFTs, gates, and data lines are formed, or an upper substrate on which color filters are formed. In the case of manufacturing a light emitting display device, the organic light emitting display device may be a substrate on which an organic thin film layer or anode and cathode electrodes are formed.

The PR forming unit T2 receives the substrates cleaned from the cleaning unit T1 and forms the PR to a predetermined thickness. Here, the PR forming unit T2 may use a spin coating method using a spin coater to evenly coat the PR on the entire surface of the substrate. The spin coating method is a method of dropping PR at the center of rotation of the substrate and simultaneously rotating the substrate at high speed so that the PR is evenly applied to the entire substrate by centrifugal force. In this spin coating method, the thickness of the PR is dripped, which is determined by the viscosity of the PR and the rotational speed of the substrate. Of course, it is also possible to use a PR coater of the printing method that can print a PR of the desired thickness from the beginning without rotating the substrate.

The solvent remover T3 may be an oven having a radiant heat plate, and the solvent remover T3 may include a substrate on which a PR is formed from at least one loader R1 and R2. The radiant heat is applied to the substrate on which the PR is formed under a vacuum pressure of 3 Torr to 0.2 Torr. As described above, the solvent removing unit T3 hardens and dries the PR formed on the substrate by simultaneously applying radiant heat to the upper surface of the substrate on which the PR is formed to remove the solvent of the PR. In addition, the solvent removal unit T3 may further include a soft bake plate to further facilitate the solvent removal process.

The vacuum pressurization state of the solvent removing unit T3 can shorten the tack time (time for the curing process for one substrate) as much as possible, but the degree of complete curing and drying can be simultaneously performed during the corresponding tack time. Most preferably, it is set to proceed in a vacuum state of. The configuration of the solvent removal unit T3 and the solvent removal process will be described in more detail with reference to the accompanying drawings.

The temperature control CP T4 is a CP (Cool Plate) for reducing the temperature of the substrate carried out from the solvent removing unit T3. That is, the temperature control CP (T4) is configured to perform temperature control for each substrate before the exposure operation is performed by receiving a substrate from which solvent is removed, thereby enabling precise exposure operation and deforming the substrate after the exposure operation. As a result, a defect in which the exposure position is not accurate can be eliminated.

The buffer unit T5 temporarily stores the substrate whose temperature is reduced through the temperature control CP T4 before the exposure process is performed. The buffer part T5 is provided according to the tack time of the exposure part T6, and may be used if necessary and may not be provided.

The exposure unit T6 performs an exposure process by disposing a photomask corresponding to a desired pattern on the substrate on which the PR is formed, and irradiating ultraviolet rays to the entire surface of the substrate including the photomask.

The developing unit T7 receives the substrate subjected to the exposure process in the exposure unit T6 to develop a PR of a desired portion.

The hard bake portion T8 is provided at a post-processing position of the developing portion T7 to perform a hard bake process to improve curing and adhesiveness and durability of the patterned PR. Here, the hard bake process is a process of curing the substrate at a temperature of about 100 ° C. to 150 ° C. using a hard bake hot plate.

The transfer loaders R1 and R2 include the cleaning unit T1, the PR forming unit T2, the solvent removing unit T3, the temperature control CP T4, the exposure unit T6, the buffer unit T5, and the developing unit. It is provided to be movable between the T7 and the hard bake portion T8 to transfer and carry in and out / out each of the substrates to the respective processing apparatuses. In this case, the transport loader (R1, R2) may include a robot arm or a conveyor, it is particularly preferably made of a robot arm having at least one finger.

FIG. 2 is a perspective view schematically illustrating the solvent remover illustrated in FIG. 1, and FIG. 3 is a cross-sectional view illustrating the solvent remover illustrated in FIG. 2 in more detail.

The solvent removing part T3 of the present invention shown in FIGS. 2 and 3 may be provided between the PR forming part T2 and the exposure part T6, and in a vacuum pressurized state on the substrate 1 on which the PR is formed. The application of radiant heat allows the PR to be dried and cured in a single process so that the solvent contained in the PR can be completely volatilized in one process.

The solvent removal part T3 may be formed in the chamber 2 such that the vacuum chamber 2, the plurality of seating pins 6 on which the PR forming substrate 1 is seated, and the plurality of seating pins 6 pass therethrough. A substrate plate 4 which is provided at a lower side and is loaded or unloaded from the substrate 1 according to the vertical movement of the mounting pins 6, and is provided to face the substrate plate 4 at an upper portion of the chamber 2. A radiant heat applying plate 14 for applying radiant heat onto the substrate on which the PR is formed, a vacuum pump 10 for allowing the inside of the chamber 2 to be in a vacuum state through at least one vacuum tube 8, and the chamber 2. Pressure control unit 18 for adjusting the pressure inside the) and the exhaust pipe 12 for discharging the solvent extracted from the PR to the outside of the chamber (2).

The chamber 2 is formed such that the front or side of the chamber 2 can be opened to allow the inflow and outflow of the substrate 1 while forming the exterior of the solvent removing part T3. The chamber 2 may be formed in a rectangular box shape having an upper surface closed, and when the opened surface is closed, the inside of the chamber 2 is formed to enable a vacuum state.

The substrate plate 4 is configured with a plurality of seating pins 6 to penetrate the substrate plate 4. Here, the substrate plate 4 is fixed to the lower side of the inner surface of the chamber 2, the plurality of seating pins 6 are moved in the vertical direction by a pin driver not shown. Since a predetermined heating wire is provided inside the substrate plate 4 so that predetermined heat can be applied to the seated substrate 1, the temperature of the substrate 1 can be adjusted. That is, the substrate plate 4 may be configured to perform a softbake hot plate process to facilitate the solvent removal process. To this end, a temperature controller not shown may be connected to the heating wire provided in the substrate plate 4.

On the other hand, the plurality of seating pins 6 are movable in the vertical direction, that is, in the vertical direction of the chamber 2, and the substrate 1 from the outside on the substrate plate 4 in accordance with the vertical movement state of the seating pins 6. ) Is sometimes settled. That is, when the plurality of seating pins 6 are maximally moved in the lower direction of the chamber 2, the substrate 1 seated on the seating pins 6 may be seated on the upper side of the substrate plate 4. Such a plurality of seating pins 6 may be pins that are thin so that the mounting of the substrate 1 may be possible but the contact area with the substrate 1 may be minimized. The configuration of the seating pins 6 described above is to minimize stains that may occur due to contact with the substrate 1. Of course, the position of each seating pin 6 is preferably disposed so as to support a dummy portion (not shown) of each portion of the substrate (1). In particular, it is preferable that each of the seating pins 6 is formed to have an appropriate protruding height and is disposed to have an appropriate interval therebetween. At this time, the protruding height of each of the seating pins 6 is such that when the substrate 1 is placed on the upper surface of the seating pins 6, air flow is possible between the bottom of the board 1 and the substrate plate 4. When the substrate 1 is mounted at the same time as the height or more, it is preferable to be formed at a height and an interval such that the warpage does not occur. That is, by allowing the air to flow smoothly to the bottom of the substrate 1, the solvent volatilization in the PR can be made more smoothly. Of course, the projecting height of each seating pin 6 is formed higher than the thickness of each finger of the robot arm constituting the transport loader (R1, R2). In addition, the space between each seating pin 6 is configured to be positioned wider than the width formed by each finger of the robot arm, which is the transfer loaders R1 and R2, so that the robot arm is brought into the chamber 2 and / or, It is preferable not to interfere with each seating pin 6 when it is taken out.

The radiant heat applying plate 14 may be provided at the top or on one side of the chamber 2, in particular as shown in FIG. 3, corresponding to the substrate plate 4 and the plurality of insole fins 6. It is preferred to be provided facing each other. The radiant heat applying plate 14 of the present invention configured as described above is dried at the same time as curing the PR by applying radiant heat on the substrate 1 on which the PR is formed as shown by the arrows in FIG. 3. This, the radiant heat applying plate 14 may be adjusted through its plate driving unit 16 and the degree of radiant heat application. Specifically, the radiant heat applying plate 14 first removes the PR solvents by applying radiant heat of about 80 ° C. to 120 ° C. to the PR at a low vacuum and low pressure of about 3 Torr, and then removes about 0.2 Torr of high vacuum. At high pressure, radiant heat of about 150 ° C. may be applied again to remove the solvent of the PR secondary. Here, the secondary solvent removal process is to allow the solvent that is not volatilized at the time of primary substrate curing to be completely volatilized, and to dry the cured PR more reliably.

The vacuum pump 10 allows the interior of the chamber 2 to be in a low or high vacuum state through at least one vacuum tube 8 connected to the interior of the chamber 2. In addition, the pressure control unit 18 is provided on one side of the inner surface of the chamber 2 to adjust the pressure inside the chamber 2.

Such a vacuum pump 10 and the pressure control unit 18 may make the interior of the chamber 2 high or low vacuum and lower the pressure to lower the temperature. In this state, the substrate ( Solvents included in PR of 1) are volatilized by heat and vacuum. When the solvent of PR is volatilized to some extent after a predetermined time, an inert gas such as nitrogen is introduced through a gas supply valve (not shown) to relieve the vacuum pressure. At this time, the circulation fan of the chamber 2, not shown, rapidly circulates the inert gas introduced through the gas valve to make the inside of the chamber 2 atmospheric pressure so that the door of the chamber 2 is easy to open.

The exhaust pipe 12 is preferably connected to at least one of the peripheral surfaces of the chamber 2 so as to be in communication with the internal space of the chamber 2, but as shown in the circumference of the chamber 2 It is preferable to provide at least one or more on both sides of the surface. This, the exhaust pipe 12 is connected to the space of the low pressure state than the inside of the chamber 2 so that the air in the chamber 2 can be naturally exhausted as possible. Of course, by installing a separate circulation fan in the exhaust pipe 12 may be configured to force the air inside the chamber (2).

The solvent removing unit T3 according to the embodiment of the present invention configured as described above is preferably provided to at least one when applied to the manufacturing equipment layout of the flat panel display device according to the embodiment of the present invention. At this time, the solvent removal unit (T3) has a tack time that does not exceed the tack time of the process having the longest working time of the other components for a time that the volatilization of the solvent contained in the PR is approximately completed It is preferable that the number is set to have.

4 is a flowchart illustrating a method of manufacturing a flat panel display device according to an exemplary embodiment of the present invention.

First, a method of manufacturing a flat panel display device according to an embodiment of the present invention includes a substrate cleaning step (ST1); Forming step PR (ST2); Solvent removal step (ST3); An exposure step ST4 of the PR forming substrate; The developing step ST5 of the exposed PR and the hard bake process and the post-processing step ST6 are included.

The substrate cleaning step ST1 cleans the substrates supplied from the outside through the respective transfer loaders R1 and R2, and the washed substrate is again PR through the transfer loaders R1 and R2. It is an idle step to be transported to.

The forming step ST2 of the PR is to form a PR having a predetermined thickness by receiving the substrates cleaned from the cleaning unit T1. In the solvent removing step ST3, a spin coating method using a spin coater is used. To evenly spread the PR across the substrate. On the other hand, in the formation step ST2 of PR, a PR coater of a printing method that can print PR of a desired thickness from the beginning on the substrate 1 may be used.

In the solvent removing step ST3, the substrate on which PR is formed is received from at least one loader part R1 and R2, and radiant heat is applied to the substrate on which PR is formed under vacuum pressurization of 3 Torr to 0.2 Torr. As described above, in the solvent removal step ST3, the radiant heat is applied to the upper surface of the substrate on which the PR is formed, thereby simultaneously curing and drying the PR formed on the substrate to remove the solvent of the PR. In addition, in the solvent removal step ST3, the solvent may be more easily removed by using a softbake plate. The time for allowing most of the solvent contained in the PR of the substrate 1 to be volatilized is about 300 seconds to about 400 seconds, and most of the volatilized solvent means about 85% of the total amount of the solvent contained in the PR. For example, after drying a PR having a thickness of 10 μm for about 300 seconds, the thickness thereof is reduced to 1.5 μm, indicating that volatilization of the solvent is about 85%. On the other hand, in the solvent removal step (ST3) in order to reduce the tack time of the process as much as possible to apply a high temperature radiant heat for a short time in a high vacuum state to cure and dry the PR within a short time.

Subsequently, in the exposure step ST4 of the PR forming substrate and the developing step ST5 of the exposed PR, the PR forming substrate 1 from which the solvent is removed is exposed to the exposure part T6 and the developing part T7 sequentially. Photolithography is performed to expose and develop a desired pattern.

Subsequently, in the hard bake process and the post-treatment step (ST6), the hard bake process is performed on the substrate having completed the development process, and the post-treatment process such as the cleaning process is performed to further improve the adhesion and durability of the patterned PR.

As described above, the manufacturing apparatus and the manufacturing method of the flat panel display device according to the embodiment of the present invention can perform the PR curing and drying process to remove the solvent of the PR in one process process at the same time. Accordingly, the present invention can simplify the manufacturing equipment of the flat panel display device to shorten the time required for the manufacturing process and improve the process efficiency thereof. In addition, the manufacturing cost of the flat panel display may be reduced by simplifying the manufacturing equipment.

In the detailed description of the present invention described above with reference to the preferred embodiment of the present invention, those skilled in the art or those skilled in the art having ordinary knowledge of the present invention described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the spirit and scope of the art.

Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a block diagram illustrating a layout structure for a manufacturing process of a flat panel display device according to an exemplary embodiment of the present invention.

FIG. 2 is a schematic perspective view of the solvent removal unit shown in FIG. 1; FIG.

3 is a cross-sectional view illustrating the solvent removing unit shown in FIG. 2 in more detail.

4 is a flowchart illustrating a method of manufacturing a flat panel display device according to an exemplary embodiment of the present invention.

* Brief description of symbols for the main parts of the drawings.

2: chamber 4: substrate plate

6: mounting pin 8: vacuum tube

10: vacuum pump 12: exhaust piping

14: radiant heat application plate 16: plate drive unit

T1: washing part T2: PR forming part

T3: Solvent Removal Part T4: Temperature Reduction CP

T5: buffer portion T6: exposure portion

T7: developing part T8: hard baking part

Claims (8)

A cleaning unit for cleaning the substrate from the outside; A PR forming unit for forming a photoresist on the cleaned substrate; Solvent removal unit for removing the solvent of the photoresist by curing and drying the photoresist formed on the substrate using a radiant heat in a vacuum pressurization in a single process; An exposure unit performing an exposure process on the photoresist formation substrate; And And a developing unit configured to receive the exposed substrate and perform a developing process. The method of claim 1, A temperature control CP for reducing the temperature of the photoresist formation substrate; A buffer unit for temporarily storing a photoresist forming substrate before the exposure process is performed; A hard bake portion for curing the photoresist patterned through the developing process to improve its adhesion and durability, and At least one of the cleaning unit, the PR forming unit, the solvent removing unit, the temperature control CP, the exposure unit, the buffer unit, the developing unit and the hard bake unit to be movable to transfer the substrate to the respective components Equipment for manufacturing a flat panel display further comprising a transfer loader. The method of claim 2, The solvent removal unit Vacuum capable chamber, A plurality of mounting pins on which the photoresist forming substrate is mounted; A substrate plate provided below the chamber to allow the plurality of seating pins to pass therethrough so that the substrate is loaded or unloaded according to the vertical movement of the seating pins; A radiant heat applying plate provided on an upper portion of the chamber so as to face the substrate plate and applying radiant heat to a substrate on which the photoresist is formed; A vacuum pump configured to achieve a vacuum state inside the chamber through at least one vacuum tube connected to the chamber, A pressure control unit for adjusting the pressure in the chamber, and And an exhaust pipe for discharging the solvent extracted from the photoresist to the outside of the chamber. The method of claim 3, wherein The radiant heat applying plate is The solvent of the photoresist is first removed by applying radiant heat at any temperature of 80 ° C to 120 ° C to the photoresist in a vacuum state of any one of 2 to 3 torr, And again removing solvents of the photoresist by applying radiant heat at a temperature of 150 ° C to 150 ° C in a vacuum state of any one of 0.2 Torr and 1.5 Torr. Cleaning the substrate from the outside; Forming a photoresist on the cleaned substrate; Removing the solvent of the photoresist by curing and drying the photoresist formed on the substrate using radiant heat under vacuum pressurization in a single process; Performing an exposure process on the photoresist forming substrate; And And receiving the exposed substrate to perform a developing process. The method of claim 5, Reducing the temperature of the photoresist forming substrate, Temporarily storing the photoresist forming substrate before the exposure process is performed, and And curing the patterned photoresist through the developing process to improve its adhesion and durability. The method of claim 6, Removing the solvent A plurality of seating pins on which the photoresist forming substrate is seated in the vacuum-capable chamber, and a lower portion of the chamber through which the plurality of seating pins pass, so that the substrate is loaded or unloaded according to the vertical movement of the seating pins. A substrate plate being provided to face the substrate plate at an upper portion of the chamber, the radiating heat applying plate configured to apply radiant heat to a substrate on which the photoresist is formed, and through the at least one vacuum tube connected to the chamber; Of the photoresist using a solvent removal unit including a vacuum pump to achieve a vacuum state, a pressure control unit for adjusting the pressure inside the chamber, and an exhaust pipe for discharging the solvent extracted from the photoresist to the outside of the chamber. Curing Solvents in a Single Process And drying the flat panel display. The method of claim 7, wherein The solvent removal step is By using the radiant heat applying plate The solvent of the photoresist is first removed by applying radiant heat at any temperature of 80 ° C to 120 ° C to the photoresist in a vacuum state of any one of 2 to 3 torr, And again removing solvents of the photoresist by applying radiant heat at a temperature of 150 ° C to 150 ° C in a vacuum state of any one of 0.2 Torr and 1.5 Torr.

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