KR101117984B1 - manufacturing device and method for manufacturing liquid crystal display device - Google Patents

Abstract

The present invention relates to a liquid crystal display device, wherein the solvent is smoothly volatilized from the photoresist formed on the TFT substrate, so that the photoresist is formed to be inclined in the reverse direction at the site where the transparent conductive film is deposited on each pad portion, so that the protective film is also inclined in the reverse direction. An object of the present invention is to provide a manufacturing apparatus for a liquid crystal display device and a method for manufacturing a liquid crystal display device, and a substrate drying unit for a liquid crystal display device manufacturing device having a new structure.

To this end, the present invention, the photoresist forming unit for forming a photoresist on a substrate; A curing unit configured to receive a substrate on which the photoresist is formed from the photoresist forming unit and to cure the photoresist in a vacuum state; An exposure unit provided at a post-processing position of the curing unit and receiving a substrate on which the photoresist is cured and exposing the substrate to a desired pattern; A substrate drying unit provided at a process position between the photoresist forming unit and the curing unit and configured to dry the substrate; And at least one loader unit for importing and / or transporting the substrate into components such as the photoresist forming unit, the curing unit, the exposure unit, and the substrate drying unit. Provide manufacturing equipment.

Manufacturing Equipment for Liquid Crystal Display Devices, Substrate Drying Section, Photoresist, Reverse Slope

Description

Manufacturing apparatus for liquid crystal display device and manufacturing method for substrate drying unit and liquid crystal display device for liquid crystal display device manufacturing equipment

1 is a state diagram schematically showing the structure of a conventional general TFT substrate

Figure 2 is an enlarged cross-sectional view of the main portion for explaining the problem caused by not completely solvent volatilization from a conventional photoresist

3 is a block diagram schematically illustrating a layout structure for a process of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention.

4 is a perspective view showing a substrate drying unit in a layout structure for a liquid crystal display device manufacturing process according to an exemplary embodiment of the present invention.

5 is a flowchart illustrating a method of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention.

6 is an enlarged cross-sectional view illustrating main parts for explaining a state in which a solvent is volatilized smoothly from a photoresist in each portion of a TFT substrate manufactured by a method of manufacturing a liquid crystal display device according to a preferred embodiment of the present invention;

7A to 7C are enlarged cross-sectional views illustrating main parts for explaining a thin film transistor, a data pad part, and a gate pad part of a TFT substrate manufactured by a liquid crystal display device manufacturing method according to an exemplary embodiment of the present invention.

8 is an enlarged state diagram illustrating an actual state of a pad portion in an outer portion of a TFT substrate manufactured by a liquid crystal display device manufacturing method according to an exemplary embodiment of the present invention.

Explanation of symbols for the main parts of the drawings

100. Substrate 610. Photoresist forming portion

620. Curing Part 630. Solvent Removal Part

640. Exposure part 650. Substrate drying part

651. Chamber 652. Seating Pin

653. Exhaust hose 660. Hard bake section

700. Developing unit 810. Loader

910. Photoresist 920. Protective Film

930. Contact Hole 940. Transparent Conductive Film

The present invention relates to a liquid crystal display device manufacturing equipment, and more particularly to a layout, manufacturing method and manufacturing equipment for a display device such as a liquid crystal display device.

In general, liquid crystal display devices (LCDs) receive and display broadcast signals in addition to the use of mobile image display devices such as monitors of notebook computers due to their excellent image quality and light weight, thinness, and low power consumption. Various developments are made for televisions and computer monitors.

The liquid crystal display device includes a pair of substrates bonded to each other with a predetermined space and a liquid crystal layer injected between the substrates.

At this time, the pair of substrates includes a thin film transistor panel (hereinafter referred to as a TFT substrate) and a color filter panel.

Here, the TFT substrate includes a plurality of gate lines 10 arranged in one direction at regular intervals as shown in FIG. 1 and at regular intervals in a direction perpendicular to the gate lines 10. A plurality of pixel electrodes formed in a matrix form in a plurality of data lines 20 arranged therein and each pixel region defined by crossing the gate lines 10 and the data lines 20. 30 and a plurality of thin film transistors 40 that are switched by signals of the gate line 10 to transfer the signals of the data line 20 to the pixel electrodes 30.

The manufacturing process of the above-described TFT substrate will be briefly described as follows.

First, a photoresist (PR; PhotoResist) is formed on the upper surface of the TFT substrate while the surface thereof is cleaned through the cleaning process.

Subsequently, the TFT substrate is exposed to the photoresist in a desired pattern while passing through an exposure apparatus (not shown), and developing into a desired pattern while passing through a developing apparatus (not shown). The TFT substrate to be used for manufacturing the liquid crystal display device is provided.

On the other hand, in recent years, due to the gradual enlargement of LCD, the method of coating a photoresist on a TFT substrate has been changed from a spin coating method to a spinless coating method. This is because when the photoresist is coated on the TFT substrate by the conventional spin coating method, the TFT substrate is broken. However, when the spinless coating method is used, an open defect occurs due to breakage of the transparent conductive film during formation of an indium tin oxide (ITO) formed later on the protective film.

At this time, the reference numeral D of FIG. 1 attached to the transparent conductive film formed on the protective film is a data pad part, and G is a gate pad part.

Of course, in order to solve the above problems, the VCD process, that is, the curing process is performed for a long time in a low vacuum state of about 3 Torr (Torr) for a long time to prevent the surface over-curing of the photoresist 91 to the photoresist The reverse taper phenomenon of 91 can also be improved.

However, in this case, as the tact time required for the hardening process becomes considerably long, the operation time required for the entire process becomes long and the workability is poor.

The present invention relates to a method for forming a seamless pattern of layers formed on a TFT substrate in order to solve the various problems described above.

In recent years, when the photoresist is formed on the TFT substrate due to the gradual enlargement of the LCD, the solvent content in the photoresist increases, and a VCD (Vacuum Dry) process for smoothly volatilizing the solvent is required.

Then, the TFT substrate coated with the photoresist is cured to a desired degree while passing through the VCD (Vacuum Dry) process, and then the solvent contained in the photoresist is removed while passing through a SHP (Soft Bake Hot Plate) process .

However, when the VCD process is used to forcibly volatilize the solvent in a high vacuum state, as shown in FIG. 2, the surface (s) of the photoresist 91 is excessively volatilized due to the rapid volatilization of the solvent contained therein On the other hand, the interior (i) of the photoresist 91 has a problem that the solvent was not volatilized smoothly due to the surface (s) of the excessively cured photoresist (91).

Accordingly, as described above, if the photoresist 91 is subjected to the post-exposure exposure and development without smooth curing and solvent removal, the photoresist 91 gradually moves from the surface s toward the bottom. There was a problem that gradually formed inclined in the reverse direction.

This is because the amount of the remaining solvent cannot be volatilized toward the bottom of the photoresist 91 increases.

The portion where the contact hole 93 of the passivation layer 92 is formed is formed to have a substantially same shape as that of the bottom side portion of the photoresist 91 and to be sloped in a reverse direction toward the opposite direction.

Accordingly, an object of the present invention is to allow the smooth curing of the photoresist coated on the TFT substrate and the smooth volatilization of the solvent, so that the protective film is gentle in the forward direction at the portion where the transparent conductive film such as the data pad portion, the thin film transistor, and the gate pad portion is formed. A TFT substrate for a liquid crystal display element having a new structure formed so as to have an inclination angle, a manufacturing apparatus for a liquid crystal display element for manufacturing such a TFT substrate, and a method for manufacturing a liquid crystal display element.

In addition, another object of the present invention is to provide a substrate drying unit for a liquid crystal display device manufacturing equipment having a new structure to prevent the sudden inclination and the inclination of the photoresist in the reverse direction without increasing the tack time for the entire process It is.

In order to achieve the above object, the liquid crystal display device manufacturing apparatus of the present invention, the photoresist forming unit for forming a photoresist on a substrate; A curing unit configured to receive a substrate on which the photoresist is formed from the photoresist forming unit and to cure the photoresist in a vacuum state; An exposure unit provided at a post-processing position of the curing unit and receiving a substrate on which the photoresist is cured and exposing the substrate to a desired pattern; A substrate drying unit provided at a process position between the photoresist forming unit and the curing unit and configured to dry the substrate; And at least one loader portion for carrying in and / or out the substrate from the photoresist forming portion, the hardening portion, the exposure portion, and the substrate drying portion.

In addition, the liquid crystal display device manufacturing method of the present invention for achieving the above object, (A) forming a photoresist on a substrate; (B) receiving a substrate on which the photoresist is formed and drying it to volatilize the solvent contained in the photoresist; (C) receiving the substrate on which the solvent volatilization is completed and curing in a vacuum state; And (d) receiving the cured substrate and exposing and developing the substrate in a desired pattern.

In addition, the TFT substrate for a liquid crystal display device of the present invention for achieving the above object, the step of forming a photoresist on the substrate, and receiving the substrate on which the photoresist is formed and dried for a set time at a set temperature the photoresist Volatilizing a solvent contained in the solvent, receiving a substrate on which the solvent volatilization is completed, curing in a vacuum state, and receiving and curing the photoresist-cured substrate in a desired pattern. After the development, the inclination of the photoresist during the hard bake process is characterized in that it is formed to maintain an angle of about 0.1 ° or more and less than 45 °, preferably 15 ° or more and 30 ° or less.

In addition, the substrate drying unit for the liquid crystal display device manufacturing equipment of the present invention for achieving the other object includes a chamber formed to enable the inflow and outflow of the substrate, and a seating portion is provided on the inner bottom of the chamber to seat the substrate Characterized in that configured.

Hereinafter, a preferred embodiment of a TFT substrate for a liquid crystal display element, a layout and manufacturing method thereof, and a substrate drying unit for a liquid crystal display device manufacturing apparatus according to the present invention will be described in detail with reference to FIGS. 3 to 8 The explanation is as follows.

First, in FIG. 3, a layout of a manufacturing apparatus for a liquid crystal display device according to an exemplary embodiment of the present invention is shown.

That is, the layout of the manufacturing equipment for a liquid crystal display device according to the embodiment of the present invention includes a photoresist forming portion 610, a hardening portion 620, an exposure portion 640, a loader portion 810, and a substrate drying portion 650 It is configured to include).

At this time, the above-described layout is a layout constituting the exposure apparatus, and the layout constituting the cleaning apparatus and the layout constituting the developing apparatus are the same as in the conventional structure.

The photoresist forming unit 610 serves to coat the photoresist 910 shown in FIG. 6 on the substrate 100.

In addition, the curing unit (VCD; Vacuum Dry) 620 receives the substrate 100 on which the photoresist 910 is formed from the photoresist forming unit 610 to cure the photoresist 910 in a vacuum state. Play a role.

At this time, the curing unit 620 is preferably set to proceed the curing for a short time in a low vacuum state of about 3 Torr (Torr). Of course, the curing unit 620 may be set so that the curing proceeds in a high vacuum state of about 0.2 Torr.

The vacuum state is set to shorten the tack time (time for the curing process for one substrate) as much as possible, but is set to proceed to a vacuum enough to complete curing during the tack time. Most preferred. In other words, it is preferable to set the process to proceed in a vacuum state in the range of 3 to 0.2 Torr.

The exposure unit 640 is disposed at a post-process position of the curing unit 620 and receives the substrate 100 on which the photoresist 910 is cured from the curing unit 620 and exposes the substrate 100 in a desired pattern Play a role.

At this time, it is preferable that a developing part 700 is provided at a post-processing position of the exposure part 640, and in the developing part 700, the substrate 100 exposed by the exposure part 640. ) Serves to develop the photoresist 910 of the desired portion.

In addition, the loader 810 may carry the substrate 100 into each of components such as the photoresist forming unit 610, the curing unit 620, the exposure unit 640, and the substrate drying unit 650. / Or, it performs the role of carrying out, at least one is provided.

In this case, the loader unit 810 includes a robot arm and a conveyor. In particular, in the embodiment of the present invention, the loader unit 810 is disposed between the photoresist forming unit 610 and the substrate drying unit 650. It is provided, the loader portion 810 suggests that made of a robot arm having one or more fingers.

The substrate drying unit 650 is provided at a process position between the photoresist forming unit 610 and the curing unit 620 to cure the substrate 100 on which the photoresist 910 is formed in a vacuum state. By allowing it to dry before, the solvent can be completely volatilized.

In FIG. 4, the substrate drying unit 650 is illustrated. Hereinafter, the structure of the substrate drying unit 650 for LCD manufacturing device manufacturing apparatus according to an embodiment of the present invention will be described in detail with reference to the following. same.

First, the substrate drying unit 650 according to the embodiment of the present invention includes a chamber 651 and a seating unit.

At this time, the chamber 651 is formed so that the front side is opened to allow the inflow and outflow of the substrate 100 while at the same time forming the appearance of the substrate drying unit 650.

The chamber 651 is preferably made of a rectangular box shape formed so that the upper surface is closed.

In addition, the seating portion is provided on the inner bottom surface of the chamber 651 is a portion on which the substrate 100 is seated.

In this case, the seating portion includes a plurality of seating pins 652 provided to protrude from the bottom surface of the chamber 651.

Each of the seating pins 652 may be a pin that is thin enough to allow the substrate 100 to be seated but minimize contact area with the substrate 100.

This configuration is to minimize stains that may occur due to contact with the substrate 100.

Of course, the location of each seating pin 652 is preferably disposed so as to support a dummy portion (not shown) of each portion of the substrate 100.

In particular, each of the seating pins 652 is preferably formed to have an appropriate protrusion height and is arranged to have a suitable distance from each other.

At this time, the protruding height of each of the seating pins 652 is an air flow between the bottom of the substrate 100 and the bottom of the chamber 651 when the substrate 100 is placed on the top of the seating pins 652. It is preferable that the substrate 100 is formed at a height and an interval at which the warpage does not occur when the substrate 100 is seated at the same time or more.

That is, by allowing air to flow smoothly to the bottom of the substrate 100, the solvent volatilization in the photoresist 910 may be more smoothly performed.

Of course, the protruding height of each seating pin 652 is formed higher than the thickness of each finger (not shown) of the robot arm constituting the loader portion 810.

In addition, the spacing between each of the seating pins 652 is configured to be positioned wider than the width formed by each finger of the robot arm, which is the loader unit 810, so that the robot arm is brought into and / or out of the chamber 651. It is preferable not to interfere with each of the seating pins 652.

In addition, the substrate drying unit 650 according to the embodiment of the present invention described above is preferably further provided with an exhaust hose (653).

In this case, the exhaust hose 653 may be connected to at least one of the peripheral surfaces of the chamber 651 so that the exhaust hose 653 may communicate with an internal space of the chamber 651. It is more preferable to provide at least one or more in both sides of the peripheral surface of the 651).

The other end of the exhaust hose 653 is preferably connected to a space in a low pressure state than the inside of the chamber 651 so that the air in the chamber 651 can be naturally exhausted as much as possible.

To this end, an embodiment of the present invention proposes that the other end of the exhaust hose 653 is connected to an exhaust passage (not shown) for exhausting air inside the factory to the outside.

That is, the negative pressure is applied to the exhaust passage so that the air in the chamber can flow into the exhaust passage through the exhaust hose 653.

Of course, a separate fan may be installed in the exhaust hose 653 so that the air in the chamber 651 may be forcibly evacuated. In this case, the photoresist 910 may be deformed due to air suction force or defective due to contaminants. It is not desirable because generation can occur.

In the meantime, when the substrate drying unit 650 according to the embodiment of the present invention configured as described above is applied to the layout of the manufacturing equipment for a liquid crystal display device according to the embodiment of the present invention, .

At this time, each of the substrate drying units 650 may perform a process of the tact time Tact having the longest working time among other components for a period of time in which the volatilization of the solvent contained in the photoresist 910 is substantially completed It is preferable that the number is set to have a tack time not exceeding Time).

For example, when the time to complete the volatilization of the solvent is about 300 seconds or more, and the tack time of the longest time is 73 seconds, each substrate drying unit 650 is preferably provided with five units.

That is, if the substrate 100 is introduced into the five substrate drying units 650 at intervals of about 73 seconds, the time between the first substrate 100 and the last substrate 100 is about 365 seconds.

Of course, the tack time of 73 seconds may be set to be longer or shorter (preferably shorter) than the corresponding time, but in this case, there may be a change in the number of substrate drying units 650 according to the tack time. have.

Therefore, since the first time the substrate 100 is dried before being taken out in a post process exceeds 300 seconds, most of the solvent contained in the photoresist 910 may be volatilized. This is considered to be suitable for example between 300 and 450 seconds.

In particular, the above-described substrate drying unit 650 is preferably provided to be stacked on each other.

This is to minimize the length of the overall layout, that is, the footprint, despite the addition of each substrate drying unit.

In addition, it is most preferable that a layout structure of a manufacturing equipment for a liquid crystal display device according to an embodiment of the present invention further includes a softbake hot plate (SHP) 630.

At this time, the solvent removing unit 630 is disposed between the substrate drying unit 650 and the hardening unit 620 to completely remove the solvent that has not been volatilized through the substrate drying unit 650 To perform.

The working temperature of the solvent removing unit 630 is more preferably set to proceed at about 110 ℃.

In addition, a separate hard bake portion (HHP) is further provided in the layout structure of the manufacturing apparatus for a liquid crystal display device according to the embodiment of the present invention.

At this time, the hard bake unit 660 is provided at a post-process position of the developing unit to perform a process of improving adhesion between the transparent conductive film 940 and the photoresist 910.

The working temperature of the hard bake unit 660 is more preferably set to proceed at about 130 ℃.

A method of manufacturing a TFT substrate (Thin Film Trangent Panel) 100 for a liquid crystal display device according to an embodiment of the present invention having the above- With reference to the flowchart of the more specifically described as follows.

First, a method of manufacturing a liquid crystal display device according to an exemplary embodiment of the present invention includes a photoresist forming step, a drying step, a curing step, an exposure step, and a developing step.

Here, the photoresist forming step is a series of processes for coating the photoresist 910 on the surface of the TFT substrate 100 using the photoresist forming unit 610.

That is, when the cleaning apparatus is cleaned after the initial TFT substrate 100 is transferred to the photoresist forming unit 610, the photoresist-forming unit 610 receives the cleaned TFT substrate 100, The photoresist 910 is formed (S110).

At this time, the photoresist 910 formed on the TFT substrate 100 contains a large amount of solvent. Therefore, before curing the photoresist 910, a series of processes for removing the large amount of solvent should be performed, which is accomplished by a drying step described below.

That is, in the drying step, each substrate drying unit 650 receives the substrate 100 on which the photoresist is formed by the photoresist forming unit 610 from the loader unit 810, and then dries the substrate 100 to dry the substrate 100. The solvent contained in the photoresist 910 is volatilized. (S120)

At this time, the temperature when the substrate 100 on which the photoresist is formed is dried is a temperature range such that expansion and / or condensation of the substrate 100 does not occur.

In the embodiment of the present invention, it is suggested that the temperature is maintained at a temperature that is the same as the temperature inside the factory where the LCD device manufacturing equipment is installed, that is, the temperature inside the clean room. This is because the chamber 651 This is possible by allowing the interior to communicate with the interior of the clean room.

Here, the temperature inside the clean room is preferably maintained at approximately 23 ° C., which is an optimum temperature at which expansion or condensation of the substrate 100 does not occur.

In addition, the time for drying the substrate 100 on which the photoresist is formed is a time that is large enough to evaporate the solvent contained in the photoresist 910 of the substrate 100 is approximately 300 seconds.

At this time, the volatilization amount of the solvent means most of about 85% of the total amount of the solvent contained in the photoresist 910.

For example, after drying a photoresist having a thickness of 10 micrometers using a drying stage for 300 seconds, the thickness of the photoresist was reduced to 1.5 micrometers, and the volatilization of the solvent was found to be 85% volatilized.

In other words, since the substrate drying unit 650 is provided in a logarithm of a number of other processes, for example, a curing process or an exposure process, the time required until the substrate 100, Since the time exceeds 300 seconds, most of the solvent contained in the photoresist 910 of the substrate 100 may be volatilized.

For example, when a substrate (hereinafter referred to as " first substrate ") is placed on a substrate drying section located at the lowermost stage (hereinafter referred to as a " first substrate drying section "), After the tack time (Tact Time) is to be seated in another substrate drying unit located on the top of the first substrate drying unit.

The above process is performed sequentially until a new substrate 100 is brought into the substrate drying unit located at the top of each substrate drying unit configured to be stacked.

If the new substrate 100 is carried in after all the substrate 100 has been placed in the substrate drying unit 650, the first substrate, which has been placed in the first substrate drying unit 650 and has undergone solvent volatilization, In addition, a new substrate 100 is brought into the corresponding position.

At this time, the first substrate is approximately 365 seconds considering that each tack time is approximately 73 seconds after approximately five tack times have elapsed from the time when they are brought into the first substrate drying unit 650 to the time when the export is performed. Since the solvent is naturally dried, the solvent contained in the photoresist of the first substrate 100 may be completely volatilized.

In addition, during the series of natural drying processes described above, the solvent volatilized from the photoresist of each substrate 100 flows in the chamber 651 of the substrate drying unit 650.

However, at this time, considering that the exhaust flow of the fine air is made through the exhaust hose 653 connected in communication with the chamber 651, the volatilized solvent component is piggybacked on the exhaust flow of the air and the exhaust hose ( 653).

Thus, the problem that the volatilized solvent component recontaminates the substrate 100 seated in the substrate drying unit 650 can be prevented in advance.

The substrate 100 carried out from the substrate drying unit 650 by the above-described series of processes is carried out by the loader unit 810 to the hardening unit 620 which is a post-process.

At this time, a VCD (Vacuum Dry) process for curing the photoresist 910 of the substrate 100 in a vacuum state is performed in the curing unit 620 (S130)

Here, the VCD process is performed for a short time in a low vacuum state.

This is because the curing of the photoresist 910 is made as uniform as possible, but the tack time of the process can be shortened.

Of course, since most of the volatilization of the solvent from the photoresist 910 in the drying step of the previous process may be performed in a high vacuum state for a short time to reduce the tack time of the process as much as possible.

However, if the VCD process is performed in a high vacuum state, the photoresist 910 may not be uniformly cured, and the end tilt of the photoresist 910 may be rapidly formed.

After the hardening of the substrate 100 with respect to the photoresist 910 is completed by the above-described process, the substrate 100 is subjected to the SHP (Soft Bake Hot Plate) process by the solvent removing unit 630. S140)

Subsequently, the substrate 100 is sequentially provided to the exposure unit 640 and the developing unit 700, and a photolithography process for exposing and developing the substrate in a desired pattern is performed (S150) The manufacture of is completed.

Due to the advantages described above, the TFT substrate 100 according to the embodiment of the present invention can be manufactured by a process using a hard-baking plate (HHP) 660 after the development process, that is, The inclination is preferably inclined while maintaining a gentle angle of about 15 ° to 30 °. (S160)

Of course, in this case, the lower side of the photoresist 910 is prevented from inclining in the reverse direction.

In addition, due to the above-described phenomenon, the portion where the contact hole 930 of the passivation layer 920 is formed is also formed so as to be gently inclined in the forward direction substantially the same as the bottom portion of the photoresist 910. This is the same as the state of Figure 6 attached.

Thus, when the ITO (Indium Tin Oxide) 940 is deposited after removing the photoresist 910, the transparent conductive layer 940 is prevented from being broken at the corresponding portion.

7A to 7C are cross-sectional views of a data pad portion of a TFT substrate 100 for a liquid crystal display fabricated using the method for manufacturing a liquid crystal display element according to an embodiment of the present invention, A cross section of the portion where the conductive film 940 is deposited is shown.

8 is a photograph showing an actual state of a pad portion in an outer portion of a TFT substrate 100 for a liquid crystal display device manufactured by using the method for manufacturing a liquid crystal display device according to an embodiment of the present invention described above. .

In this case, the pad part includes a data pad part, a gate pad part, and an electrostatic pad part.

That is, portions of the data pad portion, the thin film transistor, and the gate pad portion of the TFT substrate 100 for a liquid crystal display according to the embodiment of the present invention are formed such that the photoresist 910 does not tilt in the reverse direction, It can be seen that it is formed to be inclined) at an angle of 15 ° ~ 30 °.

In addition, due to the above-described features, it is possible to prevent breakage of the ITO (Indium Tin Oxide) 940 deposited on the corresponding portion, thereby preventing an open defect, ) Is prevented. In addition to the transparent conductive film, TO, ITZO, IZO and the like are also possible.

 At this time, reference numeral 1 is a gate electrode, 2 is an insulating film, 3 is an active layer, 4 is a source drain layer, 5 is a gate pad, and 6 is a data pad.

On the other hand, the layout structure of the manufacturing equipment for the liquid crystal display device and the manufacturing method using the same of the present invention is not limited to the above-described embodiment is applicable to all modes using a transparent conductive film, such as TN, VA, IPS, FFS mode. Thus, as can be seen in the appended claims, modifications are possible by those skilled in the art to which the invention pertains and such modifications are within the scope of the invention.

In particular, the substrate drying unit of the present invention can also be modified in various forms, not the structure according to the above-described embodiment, such modifications also belong to the scope of the present invention.

As described above, the layout structure and manufacturing method of the manufacturing equipment for the liquid crystal display device according to the embodiment of the present invention have various effects as follows.

First, the substrate drying unit for drying the substrate in a natural state in the layout of the manufacturing equipment for the liquid crystal display device is further provided, so that the solvent is removed before the curing step by configuring the substrate drying unit to be disposed in the process position before the curing unit In the photolithography process, it is possible to prevent the problem that the photoresist is tapered in reverse.

Second, the substrate drying unit constituting the layout of the manufacturing equipment for the liquid crystal display device according to the embodiment of the present invention is configured to be stacked in plurality so that the process can proceed without increasing the tack time for the process and the footprint of the layout. The effect is that the increase can be minimized.

Third, since most of the solvent contained in the photoresist of the substrate is removed before the curing step, the curing step may be performed in a low vacuum state for only a short time, thereby reducing the tack time for the curing step. This has the effect that the tack time of the entire layout can be shortened.

Fourth, the problem that the photoresist is reversely tapered at the site where the transparent conductive film is deposited on each pad part is eliminated, thereby preventing breakage of the transparent conductive film (ITO; Indium Tin Oxide) and thus preventing open defects. It has the effect of eliminating the cause of the gate dim (Gate Dim) occurs in.

Claims (18)

A photoresist forming unit forming a photoresist on the substrate; A curing unit configured to receive a substrate on which the photoresist is formed from the photoresist forming unit and to cure the photoresist in a vacuum state; An exposure unit provided at a post-processing position of the curing unit and receiving a substrate on which the photoresist is cured and exposing the substrate to a desired pattern; A substrate drying unit provided at a process position between the photoresist forming unit and the curing unit and configured to dry the substrate; And, And at least one loader unit for importing and / or transporting the substrate into components such as the photoresist forming unit, the hardening unit, the exposure unit, and the substrate drying unit. . The method of claim 1, The substrate drying unit A chamber configured to allow inflow and outflow of the substrate, It is provided on the inner bottom surface of the chamber manufacturing apparatus for a liquid crystal display device, characterized in that it comprises a seating portion for mounting the substrate. The method of claim 2, The substrate drying unit One end is connected to at least one of the circumferential surface of the chamber, the other end is connected to the space of the low-pressure state than the inside of the chamber further comprises an exhaust hose for exhausting the air in the chamber further comprises a liquid crystal display device Manufacturing equipment. The method of claim 2, The upper surface of the chamber is formed to be closed liquid crystal display device, characterized in that the equipment. The method of claim 2, The seating portion And a plurality of seating pins protruding upwardly from the bottom surface of the chamber. The method of claim 2, The substrate drying unit At least one manufacturing equipment for a liquid crystal display device, characterized in that provided. The method of claim 6, Wherein each of the substrate drying units is provided to be stacked on each other. In the layout equipment for manufacturing a liquid crystal display device, A chamber configured to allow inflow and outflow of the substrate, The substrate drying unit for a liquid crystal display device manufacturing equipment, characterized in that it comprises a seating portion is provided on the inner bottom surface of the chamber on which the substrate is seated. The method of claim 8, One end is connected to at least one of the circumferential surface of the chamber, the other end is connected to the space of the low-pressure state than the inside of the chamber further comprises an exhaust hose for exhausting the air in the chamber further comprises a liquid crystal display device Substrate drying unit for manufacturing equipment. The method of claim 8, The substrate drying unit for the liquid crystal display device manufacturing equipment, characterized in that the upper surface of the chamber is formed to be closed. delete (A) forming a photoresist on the substrate; (B) receiving a substrate on which the photoresist is formed and drying it to volatilize the solvent contained in the photoresist; (C) receiving the substrate on which the solvent volatilization is completed and curing in a vacuum state; And, (D) receiving the substrate on which the photoresist is cured and exposing and developing the substrate in a desired pattern. 13. The method of claim 12, Each of these steps is carried out inside a clean room, And the temperature set for drying in the step (b) is the same temperature as the temperature inside the clean room. 13. The method of claim 12, The set time for drying in the step (b) is Method of manufacturing a liquid crystal display device, characterized in that the time that the solvent contained in the photoresist of the substrate is mostly volatilized. The method of claim 14, The set time is 300 seconds or more, 450 seconds or less characterized in that the manufacturing method. 13. The method of claim 12, The (c) step is A process for manufacturing a liquid crystal display device, characterized in that the process is set to proceed in a vacuum state according to the range of 3 to 0.2 Torr. 13. The method of claim 12, A method of manufacturing a liquid crystal display device comprising the step of performing a hard bake process after the development. The method of claim 17, The range of the photoresist inclined surface formed after the hard bake has a range of 0.1 ° or more and less than 45 °.

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