KR20100125487A - Mask structure electrode plate box for pcb of plating equipment - Google Patents

Mask structure electrode plate box for pcb of plating equipment Download PDF

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Publication number
KR20100125487A
KR20100125487A KR1020090044234A KR20090044234A KR20100125487A KR 20100125487 A KR20100125487 A KR 20100125487A KR 1020090044234 A KR1020090044234 A KR 1020090044234A KR 20090044234 A KR20090044234 A KR 20090044234A KR 20100125487 A KR20100125487 A KR 20100125487A
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South Korea
Prior art keywords
plate
printed circuit
circuit board
plating
shielding
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KR1020090044234A
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Korean (ko)
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박용순
서운호
나남균
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주식회사 티케이씨
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Priority to KR1020090044234A priority Critical patent/KR20100125487A/en
Publication of KR20100125487A publication Critical patent/KR20100125487A/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: An electrode plate shielding box structure for a printed circuit board of plating equipment is provided to implement uniform plating because upper and lower shield plates are installed on the front side of a shielding box. CONSTITUTION: An electrode plate shielding box(4) for a printed circuit board of plating equipment is installed in the front and rear of a printed circuit board(2) within a plating bath(1). Side plates and a bottom plate are welded to the rear plate of the shielding box so as to form a closed structure. The side plates are formed with rectangular grooves at regular intervals in which a barrier plate(5) is inserted. An electrode plate(6) is installed between the barrier plate and the rear plate, and a shielding plate(7) is installed in front of the barrier plate to move up and down. A nozzle pipe(13) is installed in the front side of the shielding box and fixed with a bracket. The top of the shielding box is opened.

Description

도금설비의 인쇄회로기판용 전극판 차폐박스 구조{Mask Structure Electrode Plate BOX for PCB of plating equipment}Mask Structure Electrode Plate BOX for PCB of plating equipment

본 고안은 인쇄회로기판 도금작업시 이 인쇄회로기판에 전기 전도성 저하로 야기되는 도금편차를 줄이면서 도금되는 인쇄회로기판의 전류 흐름을 일정하게 유지 시킴에 따라 양질의 도금이 얻어지고 생산성 향상을 도모하는 도금설비의 인쇄회로기판용 차폐구조에 관한 것이다. The present invention maintains the current flow of the printed circuit board to be plated while reducing the plating deviation caused by lowering the electrical conductivity of the printed circuit board, thereby achieving high quality plating and improving productivity. It relates to a shielding structure for a printed circuit board of the plating equipment.

주지된 바와 같이 인쇄회로기판 도금 공정시 행거의 클램프에 물리어 도금조로 이송 운반되는 인쇄회로 기판은 도금액이 담겨진 도금조에 침지되어 금,은,동,니켈 등이 도금되어 지는데, 행거의 클램프를 매개로 통전되는 전류가 인쇄회로기판에 고루 전도되지 않고 고전류와 저전류 전기 전도성의 편차를 갖게 되며, 이러한 전기 전도성 편차는 도금되는 인쇄회로기판의 도금편차를 발생하게 된다 또한 도금시 전극 PLATE에서 발생하는 GAS도 제품의 불량을 만들어낸다. 이러한 문제를 해결 하고자 차폐 구조 형태를 가지는 차폐박스를 제작 했다.As is well known, a printed circuit board, which is clamped to a hanger clamp and transported to a plating bath during a printed circuit board plating process, is immersed in a plating bath containing a plating solution, and gold, silver, copper, and nickel are plated. The current supplied to the PCB is not evenly conducted on the printed circuit board, and there is a deviation between the high current and the low current electrical conductivity, which causes the plating deviation of the printed circuit board to be plated. GAS also produces product defects. In order to solve this problem, a shielding box having a shielding structure was manufactured.

본 고안은 상기와 같은 종래 문제점을 감안하여 제안된 것으로, 인쇄회로기판 도금시 도금편차 및 도금시 전극PLATE에서 발생하는 GAS가 제품에 문제되는 것을 줄이기 위해 고안한 차폐박스 구조형으로 도금시 전극PLATE에서 발생되는 GAS가차폐박스차폐박스 차폐박스 안에서 밀폐되도록 하는 차폐구조이며 인쇄회로 기판에 일정한 전류를 공급하도록 함에 그 목적이 있다. The present invention has been proposed in view of the above-mentioned conventional problems, and is a shielding box structure type designed to reduce the problem of the product, which occurs in the plating plate during plating of the printed circuit board and in the electrode plate during plating. It is a shielding structure that allows the generated GAS to be sealed in a shielding box shielding box shielding box and has a purpose to supply a constant current to a printed circuit board.

상기와 같은 목적을 달성하기 위한 본 고안은 BUS-BAR를 따라 행거의 클램프에 물려 있는 인쇄회로기판이 도금액에 침지되어 통전되는 전류에 의해 금속도금이 이루어질때 발생되는 GAS를 밀폐 함에 기존 OPEN 형태의 구조에서 밀폐구조 차폐박스 형태를 가지고 차폐형태 구조는 후면판에 양쪽 측면판 으로 폐쇄 시키고 저면판또한 후면판과 고정하여 밀폐 구조를 가진다. 이에 양쪽 측면판과 저면판에 일정한 간격으로 사각 홈을 내어 격막PLATE를 삽입 시켜 상부를 제외한 사방을 폐쇠 하는 구조로 되어있다. 격막PLATE에 설치한 차폐판은 상/하 조정이 가능하며 NOZZLE PIPE를설치하여 일정한 전류가 흐르게 유도한다. The present invention for achieving the above object is to seal the GAS generated when the metal plate is made by the current flowing through the printed circuit board is immersed in the plating liquid by the clamp of the hanger along the bus-bar of the existing OPEN type In the structure, it has the closed structure shielding box type, and the shielding structure is closed by both side plates on the back plate, and the bottom plate is also fixed with the back plate to have a sealed structure. Thus, it has a structure that closes all sides except the upper part by inserting the diaphragm plate at regular intervals on both side plates and the bottom plate. The shield plate installed in the diaphragm plate can be adjusted up and down and install a nozzle pipe to induce a constant current to flow.

도금시 발생하는 GAS를 차폐 박스로 흐름을 외부로 부터 차단해주는 역활을 한다 차폐박스 전면의 상부와 하부에 차폐판이 설치하여 전류의 흐름을 일정한 방향성을 같게 하고 전류량에 영양이 미치지 않아 인쇄회로 기판 도금시 도금편차의 균일성을 증대시키는 구조 이다. It acts as a shielding box to block the flow generated from the outside from the outside. A shielding plate is installed on the upper and lower sides of the front of the shielding box to make the current flow in the same direction. It is the structure to increase the uniformity of plating deviation.

이하 본 고안을 첨부된 예시도면에 의거 상세히 설명한다. Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 고안에 따른 인쇄회로기판용 차폐차폐박스가 도금조에 설치된 상태를 보여주는 설치 상태 사시도이고, 도2는 도 1의 I-I선 단면도 이며, 도 3은 본 고안에 따른 인쇄회로기판용 차폐박스의 분리 사시도 이다.1 is a perspective view showing an installation state of a shielding box for a printed circuit board according to the present invention is installed in the plating bath, Figure 2 is a cross-sectional view taken along line II of Figure 1, Figure 3 is a shielding box for a printed circuit board according to the present invention Is an isolated perspective view.

본 고안은 인쇄회로기판(2) 도금작업시 행거(3)에 고정된 인쇄회로기판(2)에 전기 전도성 저하 및 도금시 발생하는 GAS 를 처리 하기 위한 장치로 도금편차를 줄이면서 도금되는 인쇄회로기판(2)의 전류 흐름을 일정하게 유지 시킴에 따라 양질의 도금이 얻어지고 생산성 향상을 도모하는 도금설비의 인쇄회로기판(2)용 차폐구조로써 인쇄회로기판(2)에 전/후면에 밀폐구조 차폐박스 형태를 가지고 있다 차폐박스(4) 구조는 후면판(15)에 양쪽 측면판(10a,10b) 으로 폐쇄 시키고 저면판(8) 또한 후면판(15)과 고정하여 폐쇄 시킨다 이에 양쪽 측면판(10a,10b)과 저면판(8)에 일정한 간격으로 사각 홈을 내어 격막PLATE(5) 가 삽입되어 고정되며 격막 PLATE(5) 와 후면판 사이에 전극PLATE(6)가 설치된다. 이때 도금시 전극 PLATE(6)에서 발생하는 GAS를 차폐 박스(4) 에서 밖으로 빠져나가는 것을 차단해주는 역활을 한다 차폐박스 격막PLATE(5) 상부와 하부에 차폐판(7)이 설치되며 상/하 조절이 가능하여 전류의 흐름을 일정한 방향성을 같게 하고 전류량에 제품 영양이 미치지 않아 인쇄회로 기판(2) 도금시 도금편차의 균일성을 증대시키는 구조이다. 차폐(4)와 제품 사이에 NOZZLE PIPE(13)가 설치되며 이를 고정 시시키 위하 여 NOZZLE PIPE고정BRACKET(14)를 설치한다.고정된 NOZZLE PIPE(13)를 통하여 인쇄회로기판(2) 표면에 액을 분사하면 인쇄회로기판(2)에 미리 가공되어 있는 홀 속 까지 도금액이 침투하여 도금의 효율이 높아 지고 보다 좋은 질의 제품을 만들어 낸다.  The present invention is a device for processing the GAS generated during the electrical conductivity deterioration and plating on the printed circuit board (2) fixed to the hanger (3) during the plating operation of the printed circuit board (2) printed circuit plate while reducing the plating deviation As the current flow of the substrate 2 is kept constant, high quality plating is obtained, and the shielding structure for the printed circuit board 2 of the plating equipment which improves productivity is sealed on the front and rear surfaces of the printed circuit board 2. Structure The shielding box (4) structure is closed on both sides of the back plate (15) with both side plates (10a, 10b), and the bottom plate (8) is also fixed with the back plate (15). The diaphragm plate (5) is inserted into the plate (10a, 10b) and the bottom plate 8 at regular intervals to be inserted and fixed, and the electrode plate (6) is installed between the diaphragm plate (5) and the back plate. At this time, the plating serves to block the gas generated from the electrode plate (6) from escaping out of the shielding box (4). The shielding plate (7) is installed on the upper and lower portions of the shielding box diaphragm (upper and lower). It is possible to adjust the flow of current to the same direction, and the product amount does not have the product nutrition to the current amount, so that the uniformity of the plating deviation when plating the printed circuit board (2). Nozzle pipe (13) is installed between the shield (4) and the product, and to fix it, a nozzle pipe fixing bracket (14) is installed on the surface of the printed circuit board (2) through the fixed nozzle pipe (13). When the liquid is sprayed, the plating liquid penetrates into the hole previously processed in the printed circuit board 2, thereby increasing the plating efficiency and producing a better quality product.

즉, 본 고안에 따른 인쇄회로기판(2)용 차폐박스(4)구조는 도 3에 도시된 바와 같이 도금조(1)내 제품의 앞,뒤로 설치 되고 차폐박스(4)의 구조는 후면판(15)에 측면판(10a,10b)과 저면판(8)이 고정 용접되어 폐쇄 구조를 가진다. 측면판(10a,10b)에 일정한 간격으로 사각 홈을내어 격막PLATE(5)가 삽입 설치 되며 격막PLATE(5)와 후면판 사이에 전극 PLATE(6)가 설치 된다. 격막 PLATE(5) 전면에 차폐판(7)이 상부와 하부에 설치되며 설치된 차폐판(7)은 상/하 이동 조정이 가능하다. 차폐박스(4)전면에 NOZZLE PIPE(13)가 설치되며 이를 고정 함에 NOZZLE PIPE 고정 BRACKET(14)가 설치된다. That is, the shielding box 4 structure for the printed circuit board 2 according to the present invention is installed in front of, behind the product in the plating bath (1) as shown in Figure 3 and the structure of the shielding box (4) is the back plate Side plates 10a and 10b and bottom plate 8 are fixedly welded to 15 to have a closed structure. The diaphragm plate (5) is inserted into the side plates (10a, 10b) at regular intervals, and the electrode plate (6) is installed between the diaphragm plate (5) and the back plate. The shield plate 7 is installed on the upper and lower portions in front of the diaphragm plate 5, and the shield plate 7 installed is adjustable in up / down movement. The nozzle pipe 13 is installed on the front of the shield box 4, and the nozzle pipe fixing bracket 14 is installed to fix it.

이에 차폐박스(4)에서는 도금시 발생하는 GAS를 차단할 뿐만 아니라, 차폐판 설치가 전류의 흐름을 일정하게 유지 시키며 NOZZLE PIPE(13)에서 분사되는 도금액으로 제품의 효율이 증대되며 양질의 도금이 이루어 지도록 작용하게 된다. In this case, the shield box 4 not only blocks the GAS generated during plating, but also the shielding plate maintains a constant current flow, and the efficiency of the product is increased by the plating liquid sprayed from the nozzle pipe 13, and high-quality plating is performed. To work.

도 1은 본 고안에 따른 인쇄회로기판용 차폐차폐박스가 처리조에 설치된 상태를 보여주는 설치상태 사시도,1 is a perspective view showing an installation state showing a shielding box for a printed circuit board according to the present invention is installed in a treatment tank;

도 2는 도 1의 I-I 선 단면도,2 is a cross-sectional view taken along line II of FIG. 1;

도 3은 본 고안에 따른 인쇄회로기판용 차폐차폐박스의 분리 사시도, 3 is an exploded perspective view of a shield shield box for a printed circuit board according to the present invention;

- 도면의 주요 부분에 대한 부호 설명 --Explanation of symbols on the main parts of the drawing-

1: 처리조 2: 인쇄회로기판1: treatment tank 2: printed circuit board

3: 행거 4: 차폐차폐박스3: hanger 4: shielded shield box

5: 격막PLATE 6: 전극PLATE5: diaphragm plate 6: electrode plate

7: 차폐판 8: 저면판7: shield plate 8: bottom plate

9: 탈부착 가능 차폐고정 BRACKET 10a,10b: 측면판9: Removable shield fixing BRACKET 10a, 10b: Side plate

11: 측면판 사각홈 12: 저면판11: side plate square groove 12: bottom plate

13: Nozzle Pipe 14:Nozzle Pipe 고정 bracket13: Nozzle Pipe 14: Nozzle Pipe Fixing Bracket

15: 후면판15: Backplane

Claims (3)

도금조(1)내 인쇄회로기판(2)의 앞,뒤로 설치 되고 차폐박스(4)의 구조는 후면판(15)에 측면판(10a,10b)과 저면판(8)이 고정 용접되어 폐쇄 구조를 가진다. 측면판(10a,10b)에 일정한 간격으로 사각 홈을내어 격막PLATE(5)가 삽입 설치 되며 격막PLATE(5)와 후면판 사이에 전극 PLATE(6)가 설치 된다. 격막 PLATE(5)전면에 차폐판(7)이 상부와 하부에 설치되며 설치된 차폐판(7)은 상/하 이동 조정이 가능하다. 차폐박스(4)전면에 NOZZLE PIPE(13)가 설치되며 이를 고정 함에 NOZZLE PIPE 고정 BRACKET(14)가 설치된다. 상부가 개방된 차폐박스(4) 형태로 이루어진 것을 특징으로 하는 도금설비의 인쇄회로기판용(2) 차폐구조.It is installed in front of and behind the printed circuit board 2 in the plating bath 1, and the structure of the shield box 4 is closed by fixed welding of the side plates 10a, 10b and the bottom plate 8 to the rear plate 15. Has a structure. The diaphragm plate (5) is inserted into the side plates (10a, 10b) at regular intervals, and the electrode plate (6) is installed between the diaphragm plate (5) and the back plate. The shield plate 7 is installed on the upper and lower sides of the diaphragm plate 5, and the shield plate 7 installed can be adjusted up and down. The nozzle pipe 13 is installed on the front of the shield box 4, and the nozzle pipe fixing bracket 14 is installed to fix it. Shielding structure for a printed circuit board (2) of the plating equipment, characterized in that the upper portion is formed in the form of a shield box (4). 제 1항에 있어서 차폐박스(4)의 전면에 설치된 격막PLATE(5)는 착/탈이 용이 하게 사각 홈을 이용한 착/탈 구조로 이루어진 것이 특징으로 하는 도금설비의 인쇄회로 기판용 차폐 구조The shielding structure for a printed circuit board of a plating apparatus according to claim 1, wherein the diaphragm plate (5) installed on the front surface of the shielding box (4) has an attachment / detachment structure using square grooves for easy attachment / detachment. 제 1항에 있어서 차폐박스(4) 설치된 격막PLATE의 격막 고정 방식에 대한 것으로 볼트를 사용 하지 않고 일정한 사각 홈을 이용한 고정 방식 구조로 이루어진 것이 특징으로 차폐PLATE의 격막 설치 및 분해가 간단한 구조The method of claim 1, wherein the diaphragm fixing method of the diaphragm plate installed in the shielding box (4) is a fixed structure using a constant square groove without using bolts.
KR1020090044234A 2009-05-21 2009-05-21 Mask structure electrode plate box for pcb of plating equipment KR20100125487A (en)

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101226663B1 (en) * 2012-08-09 2013-01-25 (주) 탑스 Anode module and electroplating apparatus having it
KR101295339B1 (en) * 2011-06-09 2013-08-09 박경이 plating apparatus
KR101316727B1 (en) * 2013-04-01 2013-10-10 주식회사 티케이씨 Plating system of printed circuit board
KR101451483B1 (en) * 2012-12-28 2014-10-15 삼성전기주식회사 Electro Plating Device
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
KR101485030B1 (en) * 2013-05-22 2015-01-21 (주)포인텍 apparatus for measuring pressure of injection nozzle
KR102101590B1 (en) * 2020-02-10 2020-04-17 (주)선명하이테크 Apparatus for plating printed circuit board

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295339B1 (en) * 2011-06-09 2013-08-09 박경이 plating apparatus
KR101226663B1 (en) * 2012-08-09 2013-01-25 (주) 탑스 Anode module and electroplating apparatus having it
KR101472637B1 (en) * 2012-12-27 2014-12-15 삼성전기주식회사 Electro Plating Cover Plate and Electro Plating Device having it
KR101451483B1 (en) * 2012-12-28 2014-10-15 삼성전기주식회사 Electro Plating Device
KR101316727B1 (en) * 2013-04-01 2013-10-10 주식회사 티케이씨 Plating system of printed circuit board
KR101485030B1 (en) * 2013-05-22 2015-01-21 (주)포인텍 apparatus for measuring pressure of injection nozzle
KR102101590B1 (en) * 2020-02-10 2020-04-17 (주)선명하이테크 Apparatus for plating printed circuit board

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