KR20100124268A - 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 - Google Patents

표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 Download PDF

Info

Publication number
KR20100124268A
KR20100124268A KR1020107019664A KR20107019664A KR20100124268A KR 20100124268 A KR20100124268 A KR 20100124268A KR 1020107019664 A KR1020107019664 A KR 1020107019664A KR 20107019664 A KR20107019664 A KR 20107019664A KR 20100124268 A KR20100124268 A KR 20100124268A
Authority
KR
South Korea
Prior art keywords
substrate
stencil
elastomeric
elastomeric material
lateral dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020107019664A
Other languages
English (en)
Korean (ko)
Inventor
카란 차우한
조셉 엠. 멕렐란
산디프 아가왈
브라이언 티. 마이어스
제프리 카벡
랄프 쿠글러
모니카 쿠르자베
Original Assignee
나노 테라 인코포레이티드
메르크 파텐트 게엠베하
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나노 테라 인코포레이티드, 메르크 파텐트 게엠베하 filed Critical 나노 테라 인코포레이티드
Publication of KR20100124268A publication Critical patent/KR20100124268A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1225—Screens or stencils; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B41M3/003—Printing processes to produce particular kinds of printed work, e.g. patterns on optical devices, e.g. lens elements; for the production of optical devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Weting (AREA)
  • Printing Plates And Materials Therefor (AREA)
KR1020107019664A 2008-02-06 2008-09-25 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법 Ceased KR20100124268A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US2659108P 2008-02-06 2008-02-06
US61/026,591 2008-02-06

Publications (1)

Publication Number Publication Date
KR20100124268A true KR20100124268A (ko) 2010-11-26

Family

ID=40139579

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107019664A Ceased KR20100124268A (ko) 2008-02-06 2008-09-25 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법

Country Status (7)

Country Link
US (1) US20090197054A1 (https=)
EP (1) EP2252467A1 (https=)
JP (1) JP2011517058A (https=)
KR (1) KR20100124268A (https=)
CN (1) CN101983131B (https=)
TW (1) TW200934635A (https=)
WO (1) WO2009099417A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080271625A1 (en) * 2007-01-22 2008-11-06 Nano Terra Inc. High-Throughput Apparatus for Patterning Flexible Substrates and Method of Using the Same
WO2011017487A2 (en) * 2009-08-05 2011-02-10 Cornell University Methods and apparatus for high-throughput formation of nano-scale arrays
TW201128301A (en) * 2009-08-21 2011-08-16 Nano Terra Inc Methods for patterning substrates using heterogeneous stamps and stencils and methods of making the stamps and stencils
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same
US20120048133A1 (en) * 2010-08-25 2012-03-01 Burberry Mitchell S Flexographic printing members
GR1008100B (el) * 2012-12-06 2014-02-04 Παναγιωτης Ανδρεα Καρυδοπουλος Stencil για εξαρτηματα τυπου bga (ball grid array) μονιμης τοποθετησης απο ελαστομερη υλικα και μεθοδος εφαρμογης τους για επεξεργασια εξαρτηματων bga
EP3394672B1 (de) * 2015-12-21 2020-02-05 Flint Group Germany GmbH Verfahren zur generativen herstellung von reliefdruckformen mittels monomerdiffusion durch eine integrale maskenschicht
KR102698580B1 (ko) 2016-09-27 2024-08-23 일루미나, 인코포레이티드 임프린팅된 기판
CN106994817B (zh) * 2017-03-30 2019-03-15 绍兴青运激光制版有限公司 一种版辊的制作方法
US11399618B2 (en) * 2018-04-27 2022-08-02 L'oreal Methods and applicators for applying skin-tightening film products
WO2020021884A1 (ja) * 2018-07-26 2020-01-30 富士フイルム株式会社 画像記録方法及び画像記録システム
EP3917761A4 (en) * 2019-01-29 2023-05-10 Henkel AG & Co. KGaA CONTROLLED PRINT SURFACE AND METHOD OF CREATING TOPOGRAPHIC FEATURES ON A CONTROLLED PRINT SURFACE
US12600159B2 (en) * 2022-02-25 2026-04-14 Intel Corporation Reusable composite stencil for spray processes

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52148305A (en) * 1976-06-04 1977-12-09 Tanazawa Hakkosha Kk Etching method
JPS5363573A (en) * 1976-11-19 1978-06-07 Toray Industries Method of forming resist pattern
JPS6020919B2 (ja) * 1981-09-18 1985-05-24 住友電気工業株式会社 印刷配線板の製造方法
US4378953A (en) * 1981-12-02 1983-04-05 Advanced Semiconductor Products Thin, optical membranes and methods and apparatus for making them
US4802945A (en) * 1986-10-09 1989-02-07 Hughes Aircraft Company Via filling of green ceramic tape
US5147397A (en) * 1990-07-03 1992-09-15 Allergan, Inc. Intraocular lens and method for making same
JPH04202677A (ja) * 1990-11-30 1992-07-23 Dainippon Printing Co Ltd レジストパターンの形成方法
CA2090579A1 (en) * 1992-02-27 1993-08-28 John T. Jarvie Stencil for use in the application of a viscous substance to a printed circuit board or the like
US6776094B1 (en) * 1993-10-04 2004-08-17 President & Fellows Of Harvard College Kit For Microcontact Printing
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
US5900160A (en) * 1993-10-04 1999-05-04 President And Fellows Of Harvard College Methods of etching articles via microcontact printing
US7282240B1 (en) * 1998-04-21 2007-10-16 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices
EP1080394A1 (en) 1998-04-21 2001-03-07 President And Fellows of Harvard College Elastomeric mask and use in fabrication of devices, inlcuding pixelated electroluminescent displays
US6250219B1 (en) * 1999-08-09 2001-06-26 Glenn Garvin System for applying embossed patterns on textured ceilings
DE10104726A1 (de) * 2001-02-02 2002-08-08 Siemens Solar Gmbh Verfahren zur Strukturierung einer auf einem Trägermaterial aufgebrachten Oxidschicht
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
US20030070569A1 (en) * 2001-10-11 2003-04-17 Colin Bulthaup Micro-stencil
US6833040B2 (en) * 2001-12-19 2004-12-21 Surface Logix Inc. Apparatus and method for handling membranes
US6805809B2 (en) * 2002-08-28 2004-10-19 Board Of Trustees Of University Of Illinois Decal transfer microfabrication
WO2006121906A1 (en) * 2005-05-10 2006-11-16 Dow Corning Corporation Sub-micron decal transfer lithography
KR20090107494A (ko) * 2006-12-05 2009-10-13 나노 테라 인코포레이티드 표면을 패턴화하는 방법
US20120097329A1 (en) * 2010-05-21 2012-04-26 Merck Patent Gesellschaft Stencils for High-Throughput Micron-Scale Etching of Substrates and Processes of Making and Using the Same

Also Published As

Publication number Publication date
TW200934635A (en) 2009-08-16
CN101983131A (zh) 2011-03-02
US20090197054A1 (en) 2009-08-06
CN101983131B (zh) 2013-05-01
JP2011517058A (ja) 2011-05-26
WO2009099417A1 (en) 2009-08-13
EP2252467A1 (en) 2010-11-24

Similar Documents

Publication Publication Date Title
KR20100124268A (ko) 표면에 미크론 크기의 특징형상을 형성하기 위한 제거가능 뒷댐재를 가지는 스텐실 및 그의 제조 및 사용 방법
Jeong et al. High-resolution nanotransfer printing applicable to diverse surfaces via interface-targeted adhesion switching
CN100413778C (zh) 微结构及其制造方法
US20110076448A1 (en) Methods for Patterning Substrates Using Heterogeneous Stamps and Stencils and Methods of Making the Stamps and Stencils
CN101755237B (zh) 使表面形成图案的方法
US20080230773A1 (en) Polymer Composition for Preparing Electronic Devices by Microcontact Printing Processes and Products Prepared by the Processes
US20090025595A1 (en) Contact Printing Method Using an Elastomeric Stamp Having a Variable Surface Area and Variable Shape
CN101627336B (zh) 使用具有表面改性材料的印模在基底上形成功能性材料的图案的方法
US8608972B2 (en) Method for patterning a surface
CN101884255B (zh) 将两种物质有选择地配置于基板的表面的方法
JP2001504043A (ja) 多機能ミクロ構造およびその作製
TW200848956A (en) Devices and methods for pattern generation by ink lithography
Seo et al. Direct graphene transfer and its application to transfer printing using mechanically controlled, large area graphene/copper freestanding layer
CN1843768A (zh) 纳米印刷模具、其制造方法及纳米印刷装置和方法
TW201132256A (en) Formation of electrically conductive pattern by surface energy modification
TW201039297A (en) Method for isolating a flexible substrate from a carrier and method for fabricating an electric device
JP5361011B2 (ja) ナノメタルインクを用いる導体パターンの形成方法
US20140283982A1 (en) Universal nanopatternable interfacial bonding
TW201105727A (en) Methods of patterning substrates using microcontact printed polymer resists and articles prepared therefrom
KR101636450B1 (ko) 전도성 접착제 필름의 제조방법 및 이에 따라 제조되는 전도성 접착제 필름
Jung et al. Dual-layer thermal nanoimprint lithography without dry etching
CN103492947A (zh) 在pet 上的聚合物基质的选择性蚀刻
Grolman et al. Dual imprinted polymer thin films via pattern directed self-organization
Suh et al. A graphene pH sensor fabrication process for a nanotechnology laboratory course
KR20140082439A (ko) 그래핀 패턴의 형성방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E601 Decision to refuse application
PE0601 Decision on rejection of patent

St.27 status event code: N-2-6-B10-B15-exm-PE0601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000