KR20100121055A - Nozzle assemble for injecting melted solder into cavities of template and apparatus having the same - Google Patents

Abstract

PURPOSE: A nozzle assembly and a device thereof are provided to remarkably reduce time for an injection process by removing a process of controlling the temperature of a nozzle in order to prevent a solder fused during the carrying in/out process of template from being leaked. CONSTITUTION: A heating vessel(14) stores a solder material(2). The heating vessel is connected to a heater(12) for fusing the solder material. A nozzle(20) injects the solder fused with the heating vessel into a cavity. A valve(30) opens and closes the nozzle. The nozzle has an exit part(24) formed through an entrance part which connects the vessel to the space.

Description

Nozzle assembly for injecting melted solder into cavities of template and apparatus having the same

The present invention relates to a nozzle assembly for injecting molten solder into cavities of a template and an apparatus having the same. More specifically, in a microelectronic packaging technique, a nozzle assembly for injecting molten solder into cavities formed in a surface portion of a template to form solder bumps and a molten solder having the same It relates to an injection device.

Recently, microelectronic packaging technology is changing from wire bonding to solder bumps in the connection method. Techniques for using solder bumps are variously known. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.

In particular, C4NP (controlled collapse chip connection new process) technology has attracted much attention due to the advantages that can realize a fine pitch at a low cost and improve the reliability of the semiconductor device. Examples of such C4NP technology are disclosed in US Pat. Nos. 5,607,099, 5,775,569, 6,025,258, and the like.

According to the C4NP technique, spherical solder bumps are formed in the cavities of the template and the solder bumps are thermocompressed onto bump pads formed on the wafer. The bump pads are connected to metal wires of a semiconductor chip formed on a wafer, and under bump metallurgy (UBM) pads may be provided on the bump pads. The UBM pads may be provided to improve adhesion between the solder bumps and bump pads.

As described above, the semiconductor chips of the wafer to which the solder bumps are transferred may be individualized by a dicing process. The individualized semiconductor chip may be bonded onto a substrate through a thermocompression process and an under fill process, whereby a flip chip may be manufactured.

Molten solder may be injected into the cavities of the template to form the solder bumps. An example of an apparatus for injection of the molten solder is disclosed in US Pat. No. 6,231,333.

In the prior art, an injection head for injecting molten solder has a flat bottom surface and slides on a mold plate on which a plurality of cells are formed. An injection slot for injecting the molten solder, a vacuum slot for providing a vacuum pressure, and a recess connecting the injection slot and the vacuum slot are formed in a portion of the lower surface of the injection head. The molten solder is sequentially filled in the cells by the vacuum pressure during the sliding movement of the injection head.

According to the conventional technology as described above, since the nozzle is always open, the molten solder may leak from the nozzle during the ejection of the molten solder and the ejection of the template from the process chamber and the introduction of the new template. To solve this problem, the temperature of the nozzle may be lowered so that the solder may be solidified at the nozzle end to allow the template to be taken out and brought in. However, since it takes considerable time to adjust the temperature of the nozzle, the overall process time required for the injection of the molten solder can be increased.

A first object of the present invention is to be able to open and close the nozzle of the nozzle assembly for injecting molten solder into the cavities of the template.

A second object of the present invention is to provide a molten solder injection apparatus having a nozzle assembly capable of opening and closing the nozzle as described above.

A nozzle assembly for injecting molten solder according to an aspect of the present invention for achieving the first object is connected to the heating container and a heating container connected to the heater for receiving the solder material and melting the solder material; A nozzle having a flat surface in surface contact with a surface portion of a template in which a plurality of cavities are formed, a nozzle for injecting molten solder into the cavities, and a valve disposed in the nozzle to open and close the nozzle It may include.

According to an embodiment of the present invention, the nozzle may have a space for embedding the valve, an inlet connecting the heating vessel and the space, and an outlet formed through the flat surface. For example, the nozzle may extend in a direction parallel to the flat surface, and may extend through a cylindrical inner space extending along the direction, an inlet connecting the heating vessel and the inner space, and the flat surface portion. It may have an outlet formed.

According to an embodiment of the present invention, the valve may have a cylinder shape corresponding to the inner space, and may have a flow path for selectively connecting the inlet and the outlet. In addition, the valve may be configured to be rotatable in the internal space.

According to one embodiment of the invention, the nozzle assembly may further comprise a valve drive for rotating the valve.

According to an embodiment of the present invention, a channel may be formed at a flat surface portion of the nozzle extending in a direction perpendicular to the extending direction of the internal space and connected to the outlet.

According to one embodiment of the invention, the channel may extend to the side of the nozzle adjacent the flat surface.

According to an embodiment of the present invention, the heating vessel may have a vent for maintaining the internal pressure of the heating vessel at atmospheric pressure, and in the vent to prevent foreign substances from entering the internal space of the heating vessel. Filters may be installed.

According to an embodiment of the present invention, the nozzle assembly may further include a pressure control unit connected to the heating vessel to maintain the internal pressure of the heating vessel at atmospheric pressure or higher than atmospheric pressure.

According to another aspect of the present invention for achieving the second object, an apparatus for injecting molten solder includes a chamber containing a template having a surface portion in which a plurality of cavities are formed, and disposed within the chamber; A nozzle assembly for injecting molten solder into the field, and a drive for contacting the nozzle assembly to a surface portion of the template and for generating a relative sliding motion between the template and the nozzle assembly. The nozzle assembly contains a heating vessel containing solder material and connected with a heater for melting the solder material, the solder melted by the heating vessel having a flat surface connected to the heating vessel and in surface contact with a surface portion of the template. And a valve for injecting the cavities into the cavities, and a valve disposed in the nozzle to open and close the nozzle.

According to an embodiment of the present invention, the nozzle may extend in a direction parallel to the flat surface, the inner space in the form of a cylinder extending along the direction, the inlet connecting the heating vessel and the inner space and the It may have an outlet formed through a flat surface portion.

According to an embodiment of the present invention, a channel may be formed at a flat surface portion of the nozzle extending in a direction perpendicular to the extending direction of the internal space and connected to the outlet.

According to an embodiment of the present invention, the valve may have a cylindrical shape corresponding to the inner space, and may have a flow path for selectively connecting the inlet and the outlet. In addition, the valve may be configured to be rotatable in the internal space.

According to one embodiment of the invention, the nozzle assembly may further comprise a valve drive for rotating the valve.

According to an embodiment of the present invention, the molten solder injection device may further include a pressure control unit connected to the channel to maintain the internal pressure of the channel lower than the internal pressure of the heating vessel.

According to an embodiment of the present invention, the heating vessel may have a vent for maintaining the internal pressure of the heating vessel at atmospheric pressure, and in the vent to prevent foreign substances from entering the internal space of the heating vessel. Filters may be installed.

According to one embodiment of the invention, the channel may extend to the side of the nozzle adjacent the flat surface.

According to an embodiment of the present invention, the molten solder injection device may further include a pressure control unit connected to the chamber to maintain the internal pressure of the chamber lower than the internal pressure of the heating vessel.

According to one embodiment of the invention, the molten solder injection device may further include a chuck heater connected to the chuck to maintain the temperature of the template at a temperature of 1 ° C to 10 ° C lower than the melting point of the solder.

According to an embodiment of the present invention, the driving unit may move one of the nozzle and the chuck in a vertical direction, and may move the other of the nozzle and the chuck in a horizontal direction.

According to an embodiment of the present invention, the driving unit may move the nozzle or the chuck in the vertical and horizontal directions.

According to embodiments of the present invention as described above, the nozzle assembly for injecting molten solder into the cavities of the template may include a valve capable of opening and closing the nozzle.

Thus, it is possible to prevent the molten solder from leaking through the nozzle while bringing the template into the process chamber and bringing out the processed template. In addition, since it is not necessary to adjust the temperature of the nozzle to prevent the molten solder from leaking during the loading and unloading of the template, the time required for the injection process of the molten solder can be greatly shortened.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, if one element is described as being directly placed on or connected to another element, there can be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.

1 is a schematic diagram illustrating a nozzle assembly for injecting molten solder and a molten solder injecting apparatus including the same according to an embodiment of the present invention.

Referring to FIG. 1, the injection device 100 of molten solder may include a process chamber 102 in which an injection process of molten solder 2 is performed. The process chamber 102 provides an enclosed space, and within the process chamber 102 a chuck 104 supporting a template 4 having a plurality of cavities 6 (see FIG. 4) formed on a surface portion thereof. This can be arranged. The template 4 may be fixed on the chuck 104 by vacuum or electrostatic force. Alternatively, the template 4 may be secured by a plurality of clamps (not shown) or holder on the chuck 104.

A nozzle assembly 10 may be disposed in the process chamber 102 to provide molten solder 2. Alternatively, however, the nozzle assembly 10 may extend upward through the top panel of the process chamber 102. The nozzle assembly 10 may be in surface contact with the upper surface of the template 4 secured by the chuck 104, and the template 4 and the nozzle assembly in contact with the template 4. Relative sliding movements may occur between 10). The relative sliding motion may be provided for sequentially injecting molten solder into the cavities 6.

The molten solder 2 may include tin (Sn), silver (Ag), copper (Cu), bismuth (Bi), indium (In), and the like, which may be used alone or in combination. have.

2 and 3 are schematic perspective views illustrating the template and nozzle assembly shown in FIG. 1.

2 and 3, the template 4 may have a flat upper surface, and the cavities 6 may be formed at the upper surface portion of the template 4. In addition, the template 4 may have a mold region 4a having a shape similar to that of a semiconductor wafer, and a peripheral region 4b surrounding the mold region 4a, and the cavities 6 may have the mold region. It can be arranged in 4a.

The nozzle assembly 10 may have a larger width than the mold region 4a as shown in FIG. 2. In this case, molten solder can be injected into all cavities 6 by one relative sliding movement between the nozzle assembly 10 and the template 4. Alternatively, however, the nozzle assembly 10 may have a smaller width than the mold region 4a as shown in FIG. 3, in which case to inject molten solder into all cavities 6. Multiple relative sliding motions may be provided between the nozzle assembly 10 and the template 4. For example, as shown in FIG. 3, the nozzle assembly 10 may be moved in a zigzag fashion between the templates 4.

4 to 6 are schematic cross-sectional views for describing the nozzle assembly shown in FIG. 1.

4 to 6, the nozzle assembly 10 includes a heating container 14 having an internal space for accommodating solder material and connected to a nozzle heater 12 for melting the solder material, and the heating It may include a nozzle 20 connected to the lower portion of the container 14 and a valve 30 disposed in the nozzle 20 to open and close the nozzle 20. For example, an electric resistance heating wire may be used as the nozzle heater 12, and the electric resistance heating wire may be disposed outside the heating container 14, as shown in the drawings. It can also be built into.

The nozzle 20 may have a flat lower surface formed in surface contact with the upper surface of the template 4 on which the cavities 6 are formed, and the solder 2 melted by the heating container 14. May be provided to inject into the cavities (6).

The nozzle 20 is formed by an internal space 22 for embedding the valve 30, an inlet 24 connecting the heating container 14 and the internal space 22, and the nozzle heater 12. It may have an outlet 26 formed through the flat lower surface portion for injecting molten solder 2 into the cavities 6. In particular, the nozzle 20 may extend in a direction parallel to the flat lower surface, for example, in a horizontal direction, and the internal space 22 of the nozzle 20 may be in the nozzle 20. It may have a cylindrical shape extending along the extending direction of the (20). In this case, the inlet 24 and the outlet 26 may each have a slit shape extending along the inner space 24 of the nozzle 20. For example, the nozzle 20 may extend in a direction perpendicular to the relative sliding motion.

An opening 16 may be provided at a lower portion of the heating container 14 to provide the nozzle 20 with the solder 2 melted by the nozzle heater 12, and the inlet of the nozzle 20 may be provided. 24 may be connected to the opening 16.

FIG. 7 is a perspective view illustrating the valve illustrated in FIGS. 4 to 6.

Referring to FIG. 7, the valve 30 may have a cylindrical shape corresponding to the internal space 22 of the nozzle 20, and extend along a central axis and formed in a direction perpendicular to the central axis. ) However, the shape of the flow path 32 may vary depending on the connection relationship between the heating container 14 and the nozzle 20.

In addition, unlike the above, the valve 30 may have a cylindrical shape. In this case, the valve 30 may have an inlet and an outlet corresponding to the inlet 24 and the outlet 26 of the nozzle 20 and functioning as the flow path 32.

6 and 7, cover plates 28 defining the inner space 22 of the nozzle 20 may be disposed at both ends of the nozzle 20, and the valve 30 may be disposed. At both ends of the support), support shafts 34 extending through the cover plates 28 may be provided.

The valve 30 is rotatable in the internal space 22 of the nozzle 20 as shown in FIGS. 4 and 5, and may open and close the nozzle 20 by rotation. Rotation of the valve 30 may be implemented by a valve drive 40 mounted to one of the cover plates 28. For example, the valve driver 40 may include a motor connected to one of the support shafts 34.

In addition, grooves 36 may be formed at circumferential portions of both ends of the valve 30, respectively, and sealing members for preventing leakage of the molten solder 2 in the grooves 36. 38, for example, O-rings may be mounted respectively.

According to one embodiment of the present invention as described above, the cylindrical valve 30 and the nozzle 20 and the valve drive unit 40 for rotating the valve 30 is described, but the configuration thereof is various can be changed. For example, a nozzle having a spherical valve and a spherical inner space may be used in place of the valve 30 in the form of a cylinder. In addition, the valve drive unit 40 may be configured using a hydraulic or pneumatic cylinder and link mechanism, a rack and a pinion, etc. in place of the motor.

The valve 30 may be closed by the valve driver 40 after injecting molten solder 2 into the cavities 6 of the template 4. Therefore, when the template 4 is taken out of the chamber 102 after the injection process of the molten solder 2 is completed, the molten solder 2 may not leak from the nozzle 20. . After the nozzle 20 is closed, a small amount of molten solder 2a may remain in the outlet 26 of the nozzle 20, but the residual solder may be retained by the surface tension of the molten solder 2. 2a) may not fall down.

As described above, the nozzle 20 may be opened and closed in response to the steps of the injection process of the molten solder 2, thereby preventing contamination of the interior of the chamber 102 due to leakage of the molten solder 2. In addition, since it is not necessary to adjust the temperature of the heating container 14 and the nozzle 20 in order to prevent leakage of the molten solder (2) time required for the injection process of the molten solder (2) Can be greatly shortened.

Referring again to FIG. 1, the molten solder injection device 100 includes a sliding drive for generating relative sliding motion between the nozzle assembly 10 and the template 4 supported by the chuck 104. can do. For example, the sliding drive unit includes a vertical drive unit 120 for moving the nozzle assembly 10 in a vertical direction such that the lower surface portion of the nozzle 20 contacts the surface portion of the template 4, and the template Relative sliding motion is generated between the nozzle assembly 10 and the template 4 such that the molten solder 2 is sequentially injected into the cavities 6 from the nozzle 20 in contact with (4). It may include a horizontal drive unit 122 for moving the chuck 104 in the horizontal direction. For example, the sliding drive can be constructed using common mechanical components such as hydraulic or pneumatic cylinders, motors, linear motors, linear motion guides, and the like.

However, unlike the above, the sliding drive may be configured to move the nozzle assembly 10 in the vertical and horizontal directions, or may be configured to move the chuck 104 in the vertical and horizontal directions. In addition, the sliding drive may include a vertical drive for moving the chuck 104 in a vertical direction and a horizontal drive for moving the nozzle assembly 10 in a horizontal direction.

The genital chuck 104 may be connected to the chuck heater 114, which may be provided to adjust the temperature of the template 4. For example, the chuck heater 114 may be embedded in the chuck 104 and may include an electric resistance heating wire.

In particular, the chuck heater 114 may be provided to maintain the temperature of the template 4 fixed by the chuck 104 at a temperature below the melting point of the solder. For example, the chuck heater 114 may maintain the temperature of the template 4 at a temperature about 1 ° C. to 10 ° C. below the melting point of the solder. At this time, when the temperature of the template 4 is excessively low, the temperature of the nozzle 20 may be lowered, and solder may solidify in the nozzle 20, and the temperature of the template 4 may be at the melting point of the solder. If higher, the solder 2b injected into the cavities 6 may not solidify.

The molten solder 2 in the nozzle assembly 10 may be injected into the cavities 6 by the pressure difference between the pressure inside the heating vessel 14 and the pressure inside the chamber 102. For example, when the pressure inside the heating vessel 14 is maintained at atmospheric pressure or higher than atmospheric pressure, and the pressure inside the chamber 102 is maintained at a pressure lower than atmospheric pressure, Since the internal pressure is the same as the internal pressure of the chamber 102, the molten solder 2 in the heating container 14 may be injected into the cavities 6 by the differential pressure.

The molten solder injection apparatus 100 may include a process control unit 130 for controlling the solder injection process in order to maintain the differential pressure constant and control the relative sliding motion.

FIG. 8 is a schematic diagram illustrating the process control unit illustrated in FIG. 1.

Referring to FIG. 3, the process controller 130 may include a temperature controller 140 and a pressure controller 150.

The temperature controller 140 is connected to the first temperature sensor 142 connected to the heating vessel 14, the second temperature sensor 144 connected to the chuck 104, and the first and second temperature sensors. The temperature controller 146 may be included. The temperature controller 146 controls a temperature of the heating vessel 14 and the chuck 104 based on temperature signals provided from the first and second temperature sensors 142 and 144. Can raise them. That is, the nozzle heater 12 and the chuck heater 114 may be controlled by the control signals of the temperature control unit 146.

The pressure regulator 150 may include a first pressure sensor 152 for measuring the pressure in the process chamber 102 and a second pressure sensor 154 for measuring the pressure in the heating vessel 14. And a pressure control unit 156 for generating control signals according to a differential pressure between the internal pressure of the process chamber 102 and the internal pressure of the heating vessel 14, the pressure control unit 156 being connected to the process chamber ( 102 and a gas providing unit 160 for providing an inert gas into the heating container 14 and a vacuum providing unit 170 for evacuating the process chamber 102 and the inside of the heating container 14. Can be.

According to another embodiment of the present invention, a differential pressure sensor may be used instead of the first and second pressure sensors 152 and 154.

The gas providing unit 160 may include a gas storage container 162 for storing an inert gas, and the gas storage container 162 may be connected to the process chamber 102 and the heating container by gas supply lines. 14). Each of the gas supply lines may be provided with an on / off valve 164 and a mass flow controller 166, and the process chamber may be provided by the on / off valves 164 and the mass flow controllers 166. The flow rates of the inert gas supplied to the 102 and the heating vessel 14, respectively, can be controlled. Meanwhile, nitrogen (N ₂ ), argon (Ar), helium (He), or the like may be used as the inert gas. Therefore, it is possible to prevent contamination of the molten solder 2 inside the heating container 14 and the molten solder 2b or the solidified solder 2b injected into the cavities 6.

The vacuum providing unit 170 may include a vacuum pump 172 and a buffer tank 174, the vacuum pump 172 may be connected to the buffer tank 174 by a first vacuum line, The buffer tank 174 may be connected with the heating vessel 14 and the process chamber 102 by second vacuum lines. Each of the second vacuum lines may be provided with an on / off valve 176 and a mass flow controller 178.

The on / off valves 164 and 176 and the mass flow controllers 166 and 178 of the gas providing unit 160 and the vacuum providing unit 170 are connected to the pressure control unit 156, and the pressure control unit ( 156, respectively, by the control signals.

The internal pressure of the process chamber 102 may be maintained lower than the internal pressure of the heating vessel 14 by the pressure control unit 156. For example, the pressure inside the process chamber 102 may be maintained below atmospheric pressure, and the pressure inside the heating vessel 14 may be maintained at atmospheric pressure or above atmospheric pressure.

As a result, the molten solder 2 inside the heating vessel 14 causes the differential pressure between the process chamber 102 and the heating vessel 14 and the relative slippage between the template 4 and the nozzle 200. It can be sequentially injected into the cavities 6 of the template 4 by the movement.

Referring back to FIG. 1, the process chamber 102 may have a gate door 106 for loading and unloading the template 4. The template 4 carried into the process chamber 102 through the gate door 106 may be supported by the chuck 104.

Although not shown, the molten solder injection device 100 may further include a lifting unit for loading and unloading the template 4. For example, the lifting unit may include a plurality of lift pins arranged to be movable in the vertical direction through the chuck 104 and a driving unit providing a driving force to the lift pins. However, the configuration of the lifting unit can be variously changed, and the scope of the present invention will not be limited by the configuration of the lifting unit.

In addition, although the gate door 106 is provided on the upper panel of the process chamber 102 as shown, the gate door 106 may be provided on the sidewall of the process chamber 102. .

Next, a method of injecting the molten solder 2 into the cavities 6 of the template 4 using the molten solder injection apparatus 100 will be described in detail with reference to the accompanying drawings.

First, a template 4 having a surface portion in which a plurality of cavities 6 is formed is introduced into the process chamber 102 through the gate door 106 of the process chamber 102. The template 4 is loaded onto the chuck 104 inside the process chamber 102 by a lifting unit. Here, the template 4 may be carried into the process chamber 102 by an external transfer module (not shown).

After the template 4 is loaded, the inside of the process chamber 102 may be adjusted to a pressure lower than atmospheric pressure. In this case, the gas providing unit 160 may supply an inert gas into the process chamber 102, and the vacuum providing unit 170 may evacuate the gas inside the process chamber 102. On the other hand, the heating vessel 14 is heated to a temperature above the melting point of the solder by the nozzle heater 12, whereby the solder can be melted inside the heating vessel (14). In addition, the pressure inside the heating vessel 14 may be maintained at an atmospheric pressure or a pressure higher than the atmospheric pressure. At this time, the nozzle 20 is in a closed state by the valve 30, and thus, the molten solder 2 inside the heating container 14 may not leak.

Meanwhile, the template 4 may be heated to a temperature lower than the melting point of the solder by the chuck heater 114. In particular, the template 4 may be maintained at a temperature about 1 ° C. to about 10 ° C. below the melting point of the solder, for example, about 5 ° C. below.

After the internal pressure regulation of the process chamber 102 is completed, the horizontal drive 122 moves the template 4 supported by the chuck 104 under the nozzle assembly 10, and then the vertical drive ( 120 moves the nozzle assembly 10 downward so that the bottom surface of the nozzle 20 is in surface contact with the surface portion of the peripheral region 4b of the template 4.

After the lower surface of the nozzle 20 is in surface contact with the template 4, the valve 30 may be rotated by the valve driver 40 to open the nozzle 20.

The horizontal driver 122 moves the chuck 104 in a horizontal direction to generate a relative sliding motion between the nozzle 20 and the template 4. Accordingly, the molten solder 2 may be sequentially injected into the cavities 6 of the template 4. Here, the internal pressure of the heating container 14 and the internal pressure of the chamber 102 may be kept constant while the molten solder 2 is injected into the cavities 6.

Meanwhile, the molten solder 2 injected into the cavities 6 may be solidified by the temperature difference between the nozzle 20 and the template 4.

After the injection of the molten solder 2 is completed, if the nozzle 20 is positioned on the peripheral region 4b of the template 4, the valve driver 40 may close the nozzle 20 to close the nozzle 20. The valve 30 can be rotated. Subsequently, the template 4 may be separated from the nozzle 20 by the horizontal driver 122. In this case, a small amount of molten solder 2a may remain in the outlet 26 of the nozzle 20, but the residual solder 2a may remain in the outlet 26 of the nozzle 20 by surface tension. May remain continuously.

Subsequently, the vertical driver 120 may move the nozzle assembly 10 vertically upward, and the horizontal driver 122 may move the chuck 104 to a position adjacent to the gate door 106. have.

Subsequently, the template 4 is unloaded from the chuck 104 by the lifting unit and can be taken out of the process chamber 102 by the transfer module.

According to one embodiment of the present invention as described above, the nozzle 20 can be closed by the valve 30 can prevent the molten solder 2 leak through the nozzle 20 and In addition, since it is not necessary to additionally adjust the temperature of the nozzle 20 for loading and unloading of the template 4, the time required for injection of the molten solder 2 can be greatly shortened.

9 is a schematic diagram illustrating a nozzle assembly according to another embodiment of the present invention.

9, a nozzle assembly 200 according to another embodiment of the present invention may include a heating container 214 connected to a nozzle heater 212, a nozzle 220 connected to the heating container 214, and the nozzle 220. It may include a valve 230 for opening and closing the nozzle 220 is disposed within.

The nozzle assembly 200 may extend upwardly through the upper panel 102a of the process chamber 102 for performing the injection process of the molten solder 2, and thus the upper portion of the heating vessel 214. May be located outside the chamber 102. Ventilation openings 216 are formed at an upper portion of the heating vessel 214 to maintain the internal pressure of the heating vessel 214 at atmospheric pressure. Filter 218 may be disposed to prevent ingress. In this case, the nozzle heater 212 may be embedded in the side wall of the heating container 214 as shown.

Thus, the interior of the heating vessel 214 can be constantly maintained at atmospheric pressure at all times. As a result, when the molten solder 2 is injected into the cavities 6 of the template 4 by using the nozzle assembly 200, it is not necessary to control the pressure inside the heating container 214. Configuration of the pressure control unit may be simpler, and manufacturing cost of the molten solder injection apparatus including the nozzle assembly 200 may be reduced.

On the other hand, in the case of using the nozzle assembly 200 as described above, the sliding drive is the chuck 104 to generate a relative sliding motion between the nozzle assembly 200 and the chuck 104 supporting the template (4). It can be configured to be able to move in the vertical and horizontal directions.

Meanwhile, further detailed descriptions of the above-mentioned elements will be omitted since they are similar to those described above with reference to FIGS. 1 to 8.

10 is a schematic diagram illustrating a nozzle assembly according to another embodiment of the present invention.

Referring to FIG. 10, a nozzle assembly 300 according to another embodiment of the present invention may include a heating container 314 connected to a nozzle heater 312, a nozzle 320 connected to the heating container 314, and the nozzle ( It may be disposed in the 320 may include a valve 330 for opening and closing the nozzle 320.

The nozzle 320 may extend in a horizontal direction, for example, a direction perpendicular to the relative sliding direction between the template 4 and the nozzle assembly 300, and may have a cylindrical inner space 322 and an inlet. 324 and outlet 326. In addition, the valve 330 may have a cylinder shape corresponding to the inner space 322 of the cylinder shape, the flow path 332 for connecting the inlet 324 and the outlet 326 of the nozzle 320. It can have

Meanwhile, a channel 328 connected to the outlet 326 and extending in a direction perpendicular to the extending direction of the nozzle 320 may be formed at a flat lower surface portion of the nozzle 320. The channel 328 may extend forward of the nozzle 320 in the relative sliding motion and may extend to the side portion of the nozzle 320 adjacent to the flat lower surface. That is, the channel 328 may be formed such that the cavities 6 of the template 4 positioned under the nozzle 320 communicate with the interior of the process chamber 102.

As a result, the internal pressure of the cavities 6 of the template 4 located below the nozzle 320, in particular below the channel 328, is equal to the internal pressure of the process chamber 102. Can be. That is, the outlet of the nozzle 320 by making the internal pressure of the cavities 6 of the template 4 equal to the internal pressure of the process chamber 102 maintained at a lower pressure than the heating vessel 314. Molten solder 2 supplied through 326 may be sufficiently injected into the cavities 6. At this time, the inside of the heating vessel 314 may be maintained at an atmospheric pressure or a pressure higher than the atmospheric pressure.

Meanwhile, further detailed descriptions of the above-mentioned elements will be omitted since they are similar to those described above with reference to FIGS. 1 to 8.

11 is a schematic diagram illustrating a nozzle assembly according to another embodiment of the present invention.

Referring to FIG. 11, a nozzle assembly 400 according to another embodiment of the present invention may include a heating container 414 connected to a nozzle heater 412, a nozzle 420 connected to the heating container 414, and the nozzle ( It may include a valve 430 disposed in the 420 for opening and closing the nozzle 420.

The nozzle 420 may extend in a horizontal direction, for example, in a direction perpendicular to the relative sliding direction between the template 4 and the nozzle assembly 400, and may have a cylindrical inner space 422 and an inlet. 424 and outlet 426. In addition, the valve 430 may have a cylinder shape corresponding to the inner space 422 of the cylinder shape, the flow path 432 for connecting the inlet 424 and the outlet 426 of the nozzle 420. It can have

Meanwhile, a channel 428 connected to the outlet 426 and extending in a direction perpendicular to the extending direction of the nozzle 420 may be formed at a flat lower surface portion of the nozzle 420. The channel 428 may extend forward of the nozzle 420 with respect to the relative sliding motion.

The channel 428 may be connected to the pressure regulator 450, which is inside the channel for injecting molten solder 2 into the cavities 6 of the template 4. The pressure of 428 may be maintained lower than the internal pressure of the heating vessel 414. Although not shown in detail, the pressure adjusting unit 450 may control not only the pressure inside the channel 428 but also the pressure inside the heating container 414 and the pressure inside the process chamber 102. Detailed description of the pressure regulator 450 will be omitted since it is similar to that described above with reference to FIG. 8.

The pressure inside the channel 428 may be controlled to be the same as the pressure inside the process chamber 102. That is, the channel 428 may be provided to precisely adjust the internal pressure of the cavities 6 located below the lower surface of the nozzle 420 to the desired pressure. By precisely adjusting the pressure in the channel 428 as described above, the quality of the injection process of the molten solder 2 may be greatly improved.

However, unlike the above, the heating vessel 414 may be provided with a vent and a filter as shown in FIG. That is, the structure of the pressure regulator 450 can be made simpler by keeping the pressure inside the heating vessel 414 constant at atmospheric pressure.

Meanwhile, further detailed descriptions of the above-mentioned elements will be omitted since they are similar to those described above with reference to FIGS. 1 to 8.

According to the embodiments of the present invention as described above, in the nozzle assembly for injecting molten solder into the cavities of the template, a valve for opening and closing the nozzle may be disposed inside the nozzle.

Thus, it is possible to prevent the molten solder from leaking through the nozzle while bringing the template into the process chamber and bringing out the processed template. In addition, since it is not necessary to adjust the temperature of the nozzle to prevent the molten solder from leaking during the loading and unloading of the template, the time required for the injection process of the molten solder can be greatly shortened.

As a result, the productivity of the semiconductor device manufactured using the solder bumps formed through the template can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic diagram illustrating a nozzle assembly for injecting molten solder and a molten solder injecting apparatus including the same according to an embodiment of the present invention.

2 and 3 are schematic perspective views illustrating the template and nozzle assembly shown in FIG. 1.

4 to 6 are schematic cross-sectional views for describing the nozzle assembly shown in FIG. 1.

FIG. 7 is a perspective view illustrating the valve illustrated in FIGS. 4 to 6.

FIG. 8 is a schematic diagram illustrating the process control unit illustrated in FIG. 1.

9 is a schematic diagram illustrating a nozzle assembly according to another embodiment of the present invention.

10 and 11 are schematic configuration diagrams for describing nozzle assemblies according to still other embodiments of the present invention.

Explanation of symbols on the main parts of the drawings

2: molten solder 4: template

6: cavity 10: nozzle assembly

12: nozzle heater 14: heating vessel

20: nozzle 22: cylindrical inner space

24: entrance 26: exit

28: cover plate 30: valve

32: Euro 34: support shaft

36 groove 38 seal member

40 valve driving unit 100 molten solder injection device

102 process chamber 104 chuck

106: gate door 114: chuck heater

120: vertical drive unit 122: horizontal drive unit

130: process control unit 140: temperature control unit

150: pressure regulator

Claims (21)

A heating vessel containing a solder material and connected with a heater for melting the solder material; A nozzle connected to the heating vessel and having a flat surface in surface contact with a surface portion of the template having a plurality of cavities formed therein, the nozzle for injecting molten solder into the cavities by the heating vessel; And And a valve disposed in the nozzle to open and close the nozzle. The nozzle assembly of claim 1, wherein the nozzle has a space for embedding the valve, an inlet connecting the heating vessel and the space, and an outlet formed through the flat surface. The nozzle of claim 1, wherein the nozzle extends in a direction parallel to the flat surface, and extends in a cylindrical shape extending along the direction, through an inlet connecting the heating vessel and the internal space, and the flat surface portion. And an outlet formed. 4. The nozzle assembly of claim 3, wherein the valve has a cylindrical shape corresponding to the inner space, has a flow path for selectively connecting the inlet and the outlet, and is configured to be rotatable in the inner space. 5. The nozzle assembly of claim 4, further comprising a drive for rotating the valve. 4. The nozzle assembly of claim 3, wherein the flat surface portion has a channel extending in a direction perpendicular to an extending direction of the internal space and connected to the outlet. 7. The nozzle assembly of claim 6, wherein the channel extends to the side of the nozzle adjacent the flat surface. The method of claim 1, wherein the heating vessel has a vent for maintaining the internal pressure of the heating vessel at atmospheric pressure, the vent is provided with a filter to prevent foreign matter from entering the internal space of the heating vessel. Characterized by a nozzle assembly. The nozzle assembly of claim 1, further comprising a pressure regulator connected to the heating vessel to maintain an internal pressure of the heating vessel at atmospheric pressure or a pressure higher than atmospheric pressure. A chamber containing a template having a surface portion where a plurality of cavities are formed; A heating vessel disposed in the chamber, the heating vessel receiving solder material and connected to a heater for melting the solder material, and having a flat surface connected to the heating vessel and in surface contact with a surface portion of the template and melting by the heating vessel. A nozzle assembly including a nozzle for injecting the solder into the cavities and a valve disposed in the nozzle to open and close the nozzle; And And a drive for contacting a flat surface of the nozzle to a surface portion of the template and for generating a relative sliding motion between the template and the nozzle assembly. The method of claim 10, wherein the nozzle extends in a direction parallel to the flat surface, and through the inner space of the cylindrical form extending along the direction, the inlet connecting the heating vessel and the inner space and the flat surface portion And an outlet formed. 12. The apparatus of claim 11, wherein the flat surface portion has a channel extending in a direction perpendicular to the extending direction of the inner space and connected to the outlet. 13. The apparatus of claim 12, wherein the valve has a cylindrical shape corresponding to the inner space, has a flow path for selectively connecting the inlet and the outlet, and is configured to be rotatable in the inner space. The apparatus of claim 13, wherein the nozzle assembly further comprises a second drive for rotating the valve. 13. The apparatus of claim 12, further comprising a pressure regulator connected with the channel to maintain the internal pressure of the channel below the internal pressure of the heating vessel. 16. The method of claim 15, wherein the heating vessel has a vent for maintaining the internal pressure of the heating vessel at atmospheric pressure, wherein the vent is provided with a filter to prevent foreign matter from entering the internal space of the heating vessel; Characterized in that the device. 13. The apparatus of claim 12, wherein the channel extends to the side of the nozzle adjacent the flat surface. 18. The apparatus of claim 17, further comprising a pressure regulator coupled with the chamber to maintain the internal pressure of the chamber below the internal pressure of the heating vessel. 11. The apparatus of claim 10, further comprising a second heater connected to the chuck to maintain the temperature of the template at a temperature between 1 ° C and 10 ° C below the melting point of the solder. The apparatus of claim 10, wherein the driving unit moves one of the nozzle and the chuck in a vertical direction and moves the other of the nozzle and the chuck in a horizontal direction. The apparatus of claim 10, wherein the driving unit moves the nozzle or the chuck in the vertical and horizontal directions.

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