KR20110002921A - Apparatus for injecting melted solder into cavities of template - Google Patents

Apparatus for injecting melted solder into cavities of template Download PDF

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Publication number
KR20110002921A
KR20110002921A KR1020090060451A KR20090060451A KR20110002921A KR 20110002921 A KR20110002921 A KR 20110002921A KR 1020090060451 A KR1020090060451 A KR 1020090060451A KR 20090060451 A KR20090060451 A KR 20090060451A KR 20110002921 A KR20110002921 A KR 20110002921A
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KR
South Korea
Prior art keywords
solder
template
injection nozzle
solder injection
space
Prior art date
Application number
KR1020090060451A
Other languages
Korean (ko)
Inventor
엄기상
임정호
Original Assignee
세크론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Priority to KR1020090060451A priority Critical patent/KR20110002921A/en
Priority to PCT/KR2010/002954 priority patent/WO2011002156A2/en
Publication of KR20110002921A publication Critical patent/KR20110002921A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The disclosed apparatus is used to inject molten solder into cavities formed on the surface of a template. The template is supported by the chuck and a solder injection nozzle is placed on the template to inject molten solder into the cavities. The solder injection nozzle is formed between the space and the bottom surface for injecting the molten solder material into the cavities and the flat bottom surface and the flat surface to be in surface contact with the template and the space for receiving the solid or molten solder material It has an injection port, and a valve for opening and closing the injection port is disposed in the injection port. A drive unit is in surface contact with the template and the lower surface of the solder injection nozzle and provides a sliding motion between the template and the solder injection nozzle. A heater is thermally connected with the chuck to heat the template supported by the chuck. In addition, the solder injection nozzle in surface contact with the template is heated by the heat transferred through the template, thereby melting the solid solder material.

Description

Apparatus for injecting melted solder into cavities of template

The present invention relates to an apparatus for injecting molten solder into cavities of a template. More particularly, the present invention relates to a solder injection apparatus for injecting molten solder into cavities formed in the surface portion of a template to form solder bumps in microelectronic packaging technology.

Recently, microelectronic packaging technology is changing from wire bonding to solder bumps in the connection method. Techniques for using solder bumps are variously known. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.

In particular, C4NP (controlled collapse chip connection new process) technology has attracted much attention due to the advantages that can realize a fine pitch at a low cost and improve the reliability of the semiconductor device. Examples of such C4NP technology are disclosed in US Pat. Nos. 5,607,099, 5,775,569, 6,025,258, and the like.

According to the C4NP technique, spherical solder bumps are formed in the cavities of the template and the solder bumps are thermocompressed onto bump pads formed on the wafer. The bump pads are connected to metal wires of a semiconductor chip formed on a wafer, and under bump metallurgy (UBM) pads may be provided on the bump pads. The UBM pads may be provided to improve adhesion between the solder bumps and bump pads.

As described above, the semiconductor chips of the wafer to which the solder bumps are transferred may be individualized by a dicing process. The individualized semiconductor chip may be bonded onto a substrate through a thermocompression process and an under fill process, whereby a flip chip may be manufactured.

Molten solder may be injected into the cavities of the template to form the solder bumps. An example of an apparatus for injection of the molten solder is disclosed in US Pat. No. 6,231,333.

In the prior art, an injection head for injecting molten solder has a flat bottom surface and slides on a mold plate on which a plurality of cells are formed. An injection slot for injecting the molten solder, a vacuum slot for providing a vacuum pressure, and a recess connecting the injection slot and the vacuum slot are formed in a portion of the lower surface of the injection head. The molten solder is sequentially filled in the cells by the vacuum pressure during the sliding movement of the injection head.

According to the conventional technology as described above, since the nozzle is always open, the molten solder may leak from the nozzle during the ejection of the template from the process chamber and the introduction of the new template after the injection of the molten solder. To solve this problem, the temperature of the nozzle may be lowered so that the solder may be solidified at the nozzle end to allow the template to be taken out and brought in. However, since it takes considerable time to adjust the temperature of the nozzle, the overall process time required for the injection of the molten solder can be increased.

An object of the present invention is to be able to open and close the nozzle for injecting molten solder into the cavities of the template.

Solder injection apparatus according to embodiments of the present invention for achieving the above object, a chuck for supporting a template having a surface portion formed with a plurality of cavities, and disposed on top of the chuck, and receives a solid or molten solder material And an injection port formed between the space and the bottom surface for injecting the molten solder material into the cavities, the bottom surface being flat so as to be in surface contact with the template and disposed in the injection port. A solder injection nozzle including a valve for opening and closing an injection port, a driving part for making a surface contact between the template and a lower surface of the solder injection nozzle, and generating a sliding motion between the template and the solder injection nozzle, and thermally with the chuck Connected to the template supported by the chuck and the solder injection nozzle in surface contact with the template It can be opened by a heater for melting the solder material of the solid phase.

According to embodiments of the present invention, the injection port may have a second space for embedding the valve, an inlet connecting the space and the second space, and an outlet formed through the flat bottom surface.

According to the embodiments of the present invention, the injection port has a second space in the form of a cylinder extending in the horizontal direction, a slit shape formed through the inlet and the flat lower surface connecting the space and the second space. May have an exit of

According to embodiments of the present invention, the valve may have a cylindrical shape corresponding to the second space, may have a slit-shaped flow path for selectively connecting the inlet and the outlet, and rotate in the second space It may be configured to enable.

According to embodiments of the present invention, the solder injection device may further include a valve driver for rotating the valve.

According to embodiments of the present invention, a channel extending in the horizontal direction and connected to the outlet may be formed on the flat lower surface.

According to embodiments of the present invention, the solder injection device may further include a pressure control unit connected to the channel to maintain the inside of the channel at a pressure lower than atmospheric pressure.

According to embodiments of the present invention, the space accommodating the solder material may be opened upward.

According to embodiments of the present invention, the driving unit is provided by a vertical driving unit for providing a relative vertical movement between the chuck and the solder injection nozzle to make a surface contact between the template and the lower surface of the solder injection nozzle, by the vertical drive unit And a horizontal drive to provide relative horizontal motion between the face contacted template and the solder injection nozzle.

According to embodiments of the present invention, the solder injection device may further include a support bracket for supporting both side portions of the solder injection nozzle upwards, wherein the vertical drive unit is connected to the support bracket to connect the solder injection nozzle. The support bracket can be moved in the vertical direction so as to be placed on the template.

According to embodiments of the present invention, the solder injection nozzle may further include an elastic member for pressing the solder injection nozzle downward so that the solder injection nozzle placed on the template is in close contact with the template.

According to embodiments of the present invention, the support bracket may have a rectangular ring shape with an open bottom and lower ends facing each other to support both side portions of the solder injection nozzle, and both side portions of the solder injection nozzle. Steps may be provided with stepped portions placed on the lower ends of the support bracket.

According to embodiments of the present invention, the support bracket may further include a stopper for preventing the solder injection nozzle from moving in the relative horizontal movement direction.

According to embodiments of the present invention as described above, the solder injection nozzle for injecting molten solder into the cavities of the template may include a valve that can open and close the injection port.

Thus, it is possible to prevent the molten solder from leaking through the nozzle while bringing the template into the process chamber and bringing out the processed template. In addition, since it is not necessary to adjust the temperature of the nozzle to prevent the molten solder from leaking during the loading and unloading of the template, the time required for the injection process of the molten solder can be greatly shortened.

In addition, the solder material may be melted in the solder injection nozzle by heat transferred through the template from the chuck. That is, since a separate heater is not required to melt the solder material, the cost for manufacturing the solder injection nozzle may be reduced.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the terms are defined by these terms. It won't be. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.

1 is a schematic diagram illustrating a solder injection apparatus for injecting molten solder according to an embodiment of the present invention.

Referring to FIG. 1, the injection device 100 of molten solder may include a process chamber 102 in which an injection process of molten solder 20 is performed. The process chamber 102 provides an enclosed space, and within the process chamber 102 a chuck 104 supporting a template 40 having a plurality of cavities 60 (see FIG. 4) formed at a surface portion thereof. This can be arranged. The template 40 may be fixed on the chuck 104 by vacuum pressure or electrostatic force. Alternatively, the template 40 may be secured by a plurality of clamps (not shown) or holder on the chuck 104.

A solder injection nozzle 110 may be disposed in the process chamber 102 to provide molten solder 20. The solder injection nozzle 110 may be in surface contact with the upper surface of the template 40 fixed by the chuck 104, and the template 40 and the solder injection may be in contact with the template 40. Relative sliding motion may occur between the nozzles 110. The relative sliding motion may be provided to sequentially inject molten solder into the cavities 60.

The molten solder 20 may include tin (Sn), silver (Ag), copper (Cu), bismuth (Bi), indium (In), and the like, which may be used alone or in combination. .

2 and 3 are schematic perspective views illustrating the template and the solder injection nozzle shown in FIG. 1.

2 and 3, the template 40 may have a flat upper surface, and the cavities 60 may be formed at an upper surface portion of the template 40. In addition, the template 40 may have a mold region 40a having a shape similar to that of a semiconductor wafer and a peripheral region 40b surrounding the mold region 40a, and the cavities 60 have the mold region. It may be disposed in 40a.

The solder injection nozzle 110 may have a larger width than the mold region 40a as shown in FIG. 2. In this case, molten solder may be injected into all cavities 60 by one relative sliding motion between the solder injection nozzle 110 and the template 40. Alternatively, however, the solder injection nozzle 110 may have a smaller width than the mold region 40a as shown in FIG. 3, in which case injecting molten solder into all cavities 60. To this end, a plurality of relative sliding motions may be provided between the solder injection nozzle 110 and the template 40. For example, as shown in FIG. 3, the solder injection nozzle 110 may be moved in a zigzag form on the template 40.

4 to 6 are schematic cross-sectional views for describing the solder injection nozzle shown in FIG. 1.

4 to 6, the solder injection nozzle 110 has a first space 112 for accommodating a solid or molten solder material, and a lower portion configured to be in surface contact with the template 40. A surface and an injection port 114 formed between the first space 112 and the lower surface to inject the molten solder 20 into the cavities 60. The injection port 114 may be provided with a valve 116 for opening and closing the injection port 114. That is, the molten solder 20 may be injected into the cavities 60 through the valve 116 in the injection port 114.

The injection port 114 may have a second space 114a for embedding the valve 116, and the second space 114a may be connected to the first space 112 through an inlet 114b. Can be. In addition, an outlet 114c connected to the second space 114a may be formed through the flat lower surface, and the molten solder 20 may be formed in the cavities 60 through the outlet 114c. May be injected.

In particular, the solder injection nozzle 110 may extend in a direction parallel to the flat lower surface, for example, in a horizontal direction, and the second space 114a may extend in an extension direction of the solder injection nozzle 110. It may have a cylindrical shape extending along. In this case, the inlet 114b and the outlet 114c may each have a slit shape extending along the second space 114a. For example, the solder injection nozzle 110 may extend in a horizontal direction perpendicular to the relative sliding movement direction.

FIG. 7 is a perspective view illustrating the valve illustrated in FIGS. 4 to 6.

Referring to FIG. 7, the valve 116 may have a cylindrical shape corresponding to the second space 114a of the solder injection nozzle 110, and may have a flow path 116a formed in a radial direction.

In addition, unlike the above, the valve 116 may have a cylindrical shape. In this case, the valve 116 may have an inlet and an outlet respectively corresponding to the inlet 114b and the outlet 114c of the solder injection nozzle 110 and functioning as the flow path 116a.

6 and 7, cover plates 118 defining the second space 114a may be disposed at lower ends of both sides of the solder injection nozzle 110, and the valve 116 may be disposed. At both ends of the support), support shafts 120 extending through the cover plates 118 may be provided.

The valve 116 is rotatable in the second space 114a as shown in FIGS. 4 and 5, and may open and close the injection port 114 of the solder injection nozzle 110 by rotation. Rotation of the valve 116 may be implemented by a valve driver 122 mounted to one of the cover plates 118. For example, the valve driver 122 may include a motor connected to one of the support shafts 120.

In addition, grooves 116b may be formed at circumferential portions of both ends of the valve 116, and sealing members for preventing leakage of the molten solder 20 in the grooves 116b. 124, for example, O-rings may be mounted respectively.

According to the exemplary embodiment of the present invention as described above, the cylindrical valve 116 and the valve driving unit 122 for rotating the valve 116 are exemplarily described, but the configuration thereof is variously changed. Can be. For example, a nozzle having a spherical valve and a spherical internal space may be used in place of the cylindrical valve 116. In addition, the valve driving unit 122 may be configured using a hydraulic or pneumatic cylinder and a link mechanism, a rack and a pinion, etc. in place of the motor.

The valve 116 may be closed by the valve driver 122 after injecting molten solder 20 into the cavities 60 of the template 40. Therefore, when the template 40 is taken out of the chamber 102 after the injection process of the molten solder 20 is completed, the molten solder 20 may not leak from the nozzle 110. have. After the valve 116 is closed, a small amount of molten solder 20a may remain in the outlet 114c of the solder injection nozzle 110, but the residual amount may be retained by the surface tension of the molten solder 20. The solder 20a may not fall down.

In addition, the template 40 may be unloaded from the chamber 102 after adjusting the temperature of the solder injection nozzle 110 to solidify the remaining solder 20a. Also in this case, since only the trace amount of the residual solder 20a needs to be solidified as compared with the conventional technique, the time required for unloading the template 40 can be shortened.

As described above, since the injection port 114 of the solder injection nozzle 110 may be opened and closed in response to the steps of the injection process of the molten solder 20, the chamber may be caused by leakage of the molten solder 20. (102) Since the internal contamination can be prevented, and it is not necessary to adjust the temperature of the entire solder injection nozzle 110 in order to prevent leakage of the molten solder 20, the injection process of the molten solder 20 This can greatly reduce the time required.

Referring back to FIG. 1, the molten solder injection device 100 makes surface contact between the solder injection nozzle 110 and the template 40 supported by the chuck 104 and then generates a relative sliding motion. It may include a drive for. For example, the driving unit may include a vertical driving unit 130 for moving the solder injection nozzle 110 in a vertical direction such that the lower surface of the solder injection nozzle 110 contacts the surface portion of the template 40, and the Relative between the solder injection nozzle 110 and the template 40 such that the molten solder 20 is sequentially injected into the cavities 60 from the solder injection nozzle 110 in contact with the template 40. It may include a horizontal drive unit 132 for moving the chuck 104 in the horizontal direction to generate a sliding motion. For example, the drive may be constructed using common mechanical components such as hydraulic or pneumatic cylinders, motors, linear motors, linear motion guides, and the like.

However, unlike the above, the driving unit may be configured to move the solder injection nozzle 110 in the vertical and horizontal directions, or may be configured to move the chuck 104 in the vertical and horizontal directions. In addition, the driving unit may include a vertical driving unit for moving the chuck 104 in the vertical direction, and a horizontal driving unit for moving the solder injection nozzle 110 in the horizontal direction.

The genital chuck 104 may be thermally connected with the heater 106. The chuck 104 may be used to heat the template 40 and may also be used to heat the solder injection nozzle 110 in surface contact with the template 40. That is, the solder injection nozzle 110 which is in surface contact with the template 40 may be heated by the heat transferred through the template 40, and thus, the first space 112 of the solder injection nozzle 110 may be heated. The solder material 20 accommodated in may be melted. For example, the heater 106 may be embedded in the chuck 104 and may include an electric resistance heating wire. In particular, the heater 106 may heat the template 40 and the solder injection nozzle 110 at a temperature higher than the melting point of the solder material 20.

8 and 9 are schematic views and a bottom view for explaining the solder injection nozzle shown in FIG.

8 and 9, a channel 126 connected to the outlet 114c of the injection port 114 may be formed at a flat lower surface portion of the solder injection nozzle 110. The channel 126 may extend forward of the solder injection nozzle 110 in the relative sliding motion.

An exhaust port 127 connected to the channel 126 may be formed in the solder injection nozzle 110, and the exhaust port 127 may be connected to the pressure control unit 128. The pressure regulator 128 may maintain the pressure inside the channel 126 below atmospheric pressure in order to inject molten solder 20 into the cavities 60 of the template 40. That is, air in the cavities 60 may be discharged by evacuating the inside of the channel 126, and thus the molten solder 20 may be easily injected into the cavities 60. have.

The first space 112 of the solder injection nozzle 110 may be opened upward. In this case, the pressure inside the chamber 102 may be maintained at atmospheric pressure, and thus the pressure in the first space 112 may also be maintained at atmospheric pressure. The pressure adjusting unit 128 may adjust the pressure inside the channel 126 so that the pressure difference between the pressure inside the chamber 102 and the inside of the channel 126 is kept constant. In particular, the pressure inside the channel 126 may be adjusted appropriately such that the molten solder 20 is not sucked into the exhaust port 127 through the channel 126. As a result, the molten solder 20 may be injected into the cavities 60 by the pressure difference between the inside of the chamber 102 and the inside of the channel 126. However, unlike the above, the pressure inside the chamber 102 may be controlled to be lower than atmospheric pressure. In this case, the pressure inside the channel 126 may be kept lower than the pressure inside the chamber 102.

Although not shown in detail, the pressure adjusting unit 128 may include a vacuum pump, a valve, a pressure sensor, and the like. A differential pressure sensor may also be used to measure the differential pressure between the interior of the chamber 102 and the interior of the channel 126 in place of the pressure sensor.

Referring back to FIG. 1, the process chamber 102 may have a gate door 108 for loading and unloading the template 40. The template 40 carried into the process chamber 102 through the gate door 108 may be supported by the chuck 104.

Although not shown, the molten solder injection device 100 may further include a lifting unit for loading and unloading the template 40. For example, the lifting unit may include a plurality of lift pins arranged to be movable in the vertical direction through the chuck 104 and a driving unit providing a driving force to the lift pins. However, the configuration of the lifting unit can be variously changed, and the scope of the present invention will not be limited by the configuration of the lifting unit.

In addition, although the gate door 108 is provided on the upper panel of the process chamber 102 as shown, the gate door 108 may be provided on the sidewall of the process chamber 102. .

10 to 12 are side and front views illustrating a structure for supporting the solder injection nozzle shown in FIG. 1 in the process chamber.

10 to 12, a support bracket 140 for supporting the solder injection nozzle 110 may be installed in the chamber 102. In detail, the support bracket 140 may support both side portions of the solder injection nozzle 110 and may be connected to the vertical driver 130. That is, the support bracket 140 connects between the vertical driver 130 and the solder injection nozzle 110 and the solder injection nozzle 110 is placed on the template 40. Both side portions of) can be supported upward.

According to an embodiment of the present invention, the support bracket 140 may have a rectangular ring shape with an open lower portion, and lower ends 142 facing each other to support side portions of the solder injection nozzle 110. May have In this case, both side portions of the solder injection nozzle 110 may be provided with stepped portions 129 disposed on the lower ends 142 of the support bracket 140, respectively. In particular, the stepped portion 129 may be provided at the upper end portion of the side of the solder injection nozzle 110 so that the lower surface of the solder injection nozzle 110 is placed on the template 40.

An elastic member 144 may be installed on the support bracket 140 to press the solder injection nozzle 110 downward in order to stably support the placed solder injection nozzle 110. As the elastic member 144, a spring plunger, a ball plunger, or the like may be used.

In particular, the solder injection nozzle 110 may be stably supported by the elastic member 144 on the lower ends 142 of the support bracket 140 when the solder injection process is not performed. While this is being performed, it may be elastically pressed by the elastic member 144 on the template 40. That is, the elastic member 144 may stably support the solder injection nozzle 110 on the support bracket 140, and the solder injection nozzle 110 may be in surface contact with the template 40. It can be used to make it possible.

In addition, the support bracket 40 further includes a stopper 146 supporting the rear surface of the solder injection nozzle 110 to prevent the solder injection nozzle 110 from moving in the horizontal direction by the relative horizontal movement. It may include.

Next, a method of injecting the molten solder 20 into the cavities 60 of the template 40 by using the molten solder injection apparatus 100 will be described in detail with reference to the accompanying drawings.

First, a template 40 having a surface portion where a plurality of cavities 60 is formed is introduced into the process chamber 102 through the gate door 108 of the process chamber 102. The template 40 is loaded onto the chuck 104 inside the process chamber 102 by a lifting unit. Here, the template 40 may be carried into the process chamber 102 by an external transfer module (not shown), and the template 40 loaded on the chuck 104 may be transferred to the heater 106. As a result, the solder 20 may be heated to a temperature higher than the melting point or melting point of the solder 20.

The horizontal driver 132 moves the template 40 supported by the chuck 104 below the solder injection nozzle 110, and then the vertical drive 130 is disposed below the solder injection nozzle 110. The solder injection nozzle 110 is moved downward so that the surface is in surface contact with the surface portion of the peripheral area 40b of the template 40. In this case, the stepped portions 129 of the solder injection nozzle 110 may be spaced upwardly from the lower ends 142 of the support bracket 140, and the solder injection nozzle 110 placed on the template 40. May be in close contact with the template 40 by the elastic member 144.

As described above, the solder material 20 in the solder injection nozzle 110 may be melted by the heat transferred through the template 40 while the solder injection nozzle 110 is placed on the template 40. Subsequently, the valve 116 may be rotated by the valve driver 122 to open the injection port 114 of the solder injection nozzle 110.

The horizontal driver 132 may move the chuck 104 in a horizontal direction to generate a relative sliding motion between the solder injection nozzle 110 and the template 40. Accordingly, the molten solder 20 may be sequentially injected into the cavities 60 of the template 40. In this case, the inside of the channel 126 may be evacuated by the pressure adjusting unit 128 so that the molten solder 20 can be easily injected into the cavities 60.

After the injection of the molten solder 20 is completed, when the solder injection nozzle 110 is positioned on the peripheral region 40b of the template 40, the valve driver 122 may be connected to the solder injection nozzle 110. The valve 116 can be rotated to close its injection port 114. Subsequently, the temperature of the chuck 104, the template 40, and the solder injection nozzle 110 may be controlled to lower the melting jumbo of the solder 20, and thus the outlet 114c of the injection port 114 may be adjusted. The trace amount of solder 20a remaining in it can quickly solidify. Subsequently, the template 40 may be separated from the solder injection nozzle 110 by the horizontal driver 132.

However, unlike the above, the solder injection nozzle 110 may be detached from the template 40 without solidifying a small amount of the solder 20a remaining in the outlet 114c of the injection port 114. have. In this case, the trace amount of residual solder 20a may remain in the outlet 114c of the injection port 114 by surface tension.

Subsequently, the vertical driver 130 may move the solder injection nozzle 110 vertically upward, and the horizontal driver 132 may move the chuck 104 to a position adjacent to the gate door 108. Can be.

Subsequently, the template 40 may be unloaded from the chuck 104 by the lifting unit, and may be taken out of the process chamber 102 by the transfer module.

According to the embodiments of the present invention as described above, a valve for opening and closing the nozzle may be disposed inside the nozzle for injecting molten solder into the cavities of the template.

Thus, it is possible to prevent the molten solder from leaking through the nozzle while bringing the template into the process chamber and bringing out the processed template. In addition, in order to prevent the molten solder from leaking during loading and unloading of the template, it is not necessary to adjust the temperature of the nozzle or even if the temperature is adjusted, a small amount of solder remaining at the outlet of the nozzle can be solidified quickly. The time required for the injection process of molten solder can be greatly shortened.

As a result, the productivity of the semiconductor device manufactured using the solder bumps formed through the template can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic diagram illustrating a solder injection apparatus for injecting molten solder according to an embodiment of the present invention.

2 and 3 are schematic perspective views illustrating the template and the solder injection nozzle shown in FIG. 1.

4 to 6 are schematic cross-sectional views for describing the solder injection nozzle shown in FIG. 1.

FIG. 7 is a perspective view illustrating the valve illustrated in FIGS. 4 to 6.

8 and 9 are schematic perspective and bottom views illustrating the solder injection nozzle shown in FIG. 1.

10 to 12 are side and front views illustrating a structure for supporting the solder injection nozzle shown in FIG. 1 in the process chamber.

Explanation of symbols on the main parts of the drawings

20: solder 40: template

60: cavity 100: solder injection device

102 chamber 104 chuck

106: heater 110: solder injection nozzle

112: first space 114: injection port

116 valve 122 valve driving unit

126: channel 128: pressure regulator

130: vertical drive unit 132: horizontal drive unit

140: support bracket 144: elastic member

146: Stopper

Claims (13)

A chuck supporting a template having a surface portion where a plurality of cavities are formed; A space disposed above the chuck and containing a solid or molten solder material and a flat lower surface to allow surface contact with the template and between the space and the lower surface for injecting the molten solder material into the cavities. A solder injection nozzle having an injection port formed through and including a valve disposed in the injection port to open and close the injection port; A driving unit which makes surface contact between the template and the lower surface of the solder injection nozzle and generates a sliding motion between the template and the solder injection nozzle; And Apparatus for injecting molten solder into the cavities, the molten solder comprising a template thermally connected with the chuck and a heater for heating the solder injection nozzle in surface contact with the template to melt the solid solder material. . The solder injection apparatus of claim 1, wherein the injection port has a second space for embedding the valve, an inlet connecting the space and the second space, and an outlet formed through the flat bottom surface. According to claim 1, wherein the injection port is a second space in the form of a cylinder extending in the horizontal direction, the slit-shaped inlet connecting the space and the second space and the slit-shaped outlet formed through the flat lower surface Solder injection apparatus characterized by having. The valve of claim 3, wherein the valve has a cylindrical shape corresponding to the second space, has a slit-shaped flow path for selectively connecting the inlet and the outlet, and is configured to be rotatable in the second space. Solder injection device. 5. The solder injector of claim 4, further comprising a valve driver for rotating the valve. The solder injection apparatus of claim 3, wherein a channel is formed on the flat lower surface and extends in a horizontal direction and is connected to the outlet. The solder injection device of claim 6, further comprising a pressure regulator connected to the channel to maintain the inside of the channel at a pressure lower than atmospheric pressure. The solder injection device of claim 1, wherein a space for accommodating the solder material is open upward. The method of claim 1, wherein the driving unit, A vertical drive providing a relative vertical motion between the chuck and the solder injection nozzle to make surface contact between the template and the lower surface of the solder injection nozzle; And And a horizontal drive for providing a relative horizontal motion between the template and the solder injection nozzle that are in surface contact by the vertical drive. The method of claim 9, further comprising a support bracket for supporting both side portions of the solder injection nozzle upwards, And the vertical drive unit is connected to the support bracket to move the support bracket in a vertical direction so that the solder injection nozzle is placed on the template. The solder injection nozzle of claim 10, further comprising an elastic member configured to press the solder injection nozzle downward to closely contact the solder injection nozzle on the template. The support bracket of claim 10, wherein the support bracket has a rectangular ring shape with an open bottom and lower ends facing each other to support both side portions of the solder injection nozzle, and the support brackets are provided at both side portions of the solder injection nozzle. Solder injection nozzles characterized in that the steps are provided on the lower ends of the bracket. The solder injection nozzle of claim 12, wherein the support bracket further comprises a stopper for preventing the solder injection nozzle from moving in the relative horizontal movement direction.
KR1020090060451A 2009-07-03 2009-07-03 Apparatus for injecting melted solder into cavities of template KR20110002921A (en)

Priority Applications (2)

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KR1020090060451A KR20110002921A (en) 2009-07-03 2009-07-03 Apparatus for injecting melted solder into cavities of template
PCT/KR2010/002954 WO2011002156A2 (en) 2009-07-03 2010-05-10 Apparatus for injecting melted solder into template cavities

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090060451A KR20110002921A (en) 2009-07-03 2009-07-03 Apparatus for injecting melted solder into cavities of template

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US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head

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JP3565128B2 (en) * 2000-02-29 2004-09-15 松下電器産業株式会社 Paste application device and application method for die bonding
JP2008296145A (en) * 2007-05-31 2008-12-11 Toshiba Corp Paste feeding device and manufacturing method of mounted substrate
KR101408729B1 (en) * 2007-12-20 2014-07-02 세메스 주식회사 Method of injecting melted solder including ferromagnetic material into cavities of template and apparatus for performing the same
KR100925171B1 (en) * 2007-12-26 2009-11-05 주식회사 에이디피엔지니어링 Apparatus for pouring solder in template for forming solder bump, and method for pouring solder

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WO2011002156A3 (en) 2011-02-24

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