WO2011002156A3 - Apparatus for injecting melted solder into template cavities - Google Patents

Apparatus for injecting melted solder into template cavities Download PDF

Info

Publication number
WO2011002156A3
WO2011002156A3 PCT/KR2010/002954 KR2010002954W WO2011002156A3 WO 2011002156 A3 WO2011002156 A3 WO 2011002156A3 KR 2010002954 W KR2010002954 W KR 2010002954W WO 2011002156 A3 WO2011002156 A3 WO 2011002156A3
Authority
WO
WIPO (PCT)
Prior art keywords
template
solder
injection nozzle
cavities
chuck
Prior art date
Application number
PCT/KR2010/002954
Other languages
French (fr)
Korean (ko)
Other versions
WO2011002156A2 (en
Inventor
엄기상
임정호
Original Assignee
세크론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세크론 주식회사 filed Critical 세크론 주식회사
Publication of WO2011002156A2 publication Critical patent/WO2011002156A2/en
Publication of WO2011002156A3 publication Critical patent/WO2011002156A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11003—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for holding or transferring the bump preform
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

The disclosed apparatus is used to inject melted solder into cavities formed in the surface of a template. The template is supported by a chuck, and a solder injection nozzle is positioned on the template to inject melted solder into the cavities. The solder injection nozzle includes a space for containing a solid phase or molten solder material, a flat lower surface capable of surface contact with the template, and an injection port formed between the space and the lower surface to inject the molten solder material into the cavities, wherein a valve is disposed in the injection port to open and close the injection port. A driving unit puts the template and the lower surface of the solder injection nozzle into surface contact, and provides a sliding movement between the template and the solder injection nozzle. A heater is thermally connected to the chuck to heat the template supported by the chuck. Also, when the solder injection nozzle put into surface contact with the template is heated by heat transferred through the template, the solid phase solder material is thereby molten.
PCT/KR2010/002954 2009-07-03 2010-05-10 Apparatus for injecting melted solder into template cavities WO2011002156A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020090060451A KR20110002921A (en) 2009-07-03 2009-07-03 Apparatus for injecting melted solder into cavities of template
KR10-2009-0060451 2009-07-03

Publications (2)

Publication Number Publication Date
WO2011002156A2 WO2011002156A2 (en) 2011-01-06
WO2011002156A3 true WO2011002156A3 (en) 2011-02-24

Family

ID=43411546

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/002954 WO2011002156A2 (en) 2009-07-03 2010-05-10 Apparatus for injecting melted solder into template cavities

Country Status (2)

Country Link
KR (1) KR20110002921A (en)
WO (1) WO2011002156A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8740040B2 (en) * 2012-07-31 2014-06-03 Samsung Electro-Mechanics Co., Ltd. Solder injection head

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001239196A (en) * 2000-02-29 2001-09-04 Matsushita Electric Ind Co Ltd Paste applying device for die bonding and paste applying method
JP2008296145A (en) * 2007-05-31 2008-12-11 Toshiba Corp Paste feeding device and manufacturing method of mounted substrate
KR20090066452A (en) * 2007-12-20 2009-06-24 세크론 주식회사 Method of injecting melted solder including ferromagnetic material into cavities of template and apparatus for performing the same
KR100925171B1 (en) * 2007-12-26 2009-11-05 주식회사 에이디피엔지니어링 Apparatus for pouring solder in template for forming solder bump, and method for pouring solder

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001239196A (en) * 2000-02-29 2001-09-04 Matsushita Electric Ind Co Ltd Paste applying device for die bonding and paste applying method
JP2008296145A (en) * 2007-05-31 2008-12-11 Toshiba Corp Paste feeding device and manufacturing method of mounted substrate
KR20090066452A (en) * 2007-12-20 2009-06-24 세크론 주식회사 Method of injecting melted solder including ferromagnetic material into cavities of template and apparatus for performing the same
KR100925171B1 (en) * 2007-12-26 2009-11-05 주식회사 에이디피엔지니어링 Apparatus for pouring solder in template for forming solder bump, and method for pouring solder

Also Published As

Publication number Publication date
WO2011002156A2 (en) 2011-01-06
KR20110002921A (en) 2011-01-11

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