KR20110061705A - Nozzle assembly for injecting melted solder into cavities of a template and apparatus for injecting melted solder including the same - Google Patents

Abstract

PURPOSE: A nozzle assembly for injecting melted solder into cavities of a template and a melted solder injecting apparatus including the same are provided to uniformly inject solder melted in mold cavities, thereby increasing the quality of a semiconductor device using solder bumps. CONSTITUTION: A body(210) includes an internal space whose top is opened. The internal space contains solder materials. A body includes a heater for melting the solder materials. A nozzle(220) includes a slit penetrating the flat bottom and the internal space and the bottom of the body. A slit injects solder melted by a heater into mold cavities formed on the surface of the template. A door(230) opens/closes the opened top of the body. A sealing member is arranged between the door and the body.

Description

Nozzle assembly for injecting melted solder into cavities of a template and apparatus for injecting melted solder including the same}

Embodiments of the present invention relate to a nozzle assembly for injecting molten solder into cavities of a template and a solder injection apparatus comprising the same. More specifically, in a microelectronic packaging technique, a nozzle assembly for injecting molten solder into cavities formed in a surface portion of a template to form solder bumps and solder injection including the same Relates to a device.

Recently, microelectronic packaging technology is changing from wire bonding to solder bumps in the connection method. Techniques for using solder bumps are variously known. For example, electroplating, solder paste printing, evaporative dehydration, direct attachment of solder balls, and the like are known.

In particular, C4NP (controlled collapse chip connection new process) technology has attracted much attention due to the advantages that can realize a fine pitch at a low cost and improve the reliability of the semiconductor device. Examples of such C4NP technology are disclosed in US Pat. Nos. 5,607,099, 5,775,569, 6,025,258, and the like.

According to the C4NP technology, spherical solder bumps are formed in mold cavities of a template and the solder bumps can be transferred through a reflow process onto bump pads formed on a wafer. The bump pads are connected to metal wires of a semiconductor chip formed on a wafer, and under bump metallurgy (UBM) pads may be provided on the bump pads. The UBM pads may be provided to improve adhesion between the solder bumps and bump pads.

As described above, the semiconductor chips of the wafer to which the solder bumps are transferred may be individualized by a dicing process. The individualized semiconductor chip may be bonded onto the substrate through a reflow process and an underfill process, whereby a flip chip may be manufactured.

Molten solder may be injected into the mold cavities of the template to form the solder bumps. An example of an apparatus for injection of the molten solder is disclosed in US Pat. No. 6,231,333.

The injection nozzle for injecting molten solder in the prior art has a flat bottom surface and slides on a template on which a plurality of mold cavities are formed. An injection slot for injecting the molten solder, a vacuum slot for providing a vacuum pressure, and a recess connecting the injection slot and the vacuum slot are formed in a portion of the lower surface of the injection nozzle. The molten solder is sequentially filled with the mold cavities by the vacuum pressure while the injection nozzle is sliding.

In the solder injection process as described above, it may take a long time to adjust the temperature of the nozzle. For example, when the nozzle is separated from the template after the solder injection process is completed, the molten solder may leak through the injection slot. In order to prevent this, the temperature of the solder is lower than the melting point of the solder. I can regulate it. As a result, the time required for the solder injection process can be increased. In addition, the solder injected into the mold cavities may rapidly solidify due to the temperature difference between the nozzle and the template, and thus the molten solder may not be uniformly injected into the mold cavities. .

One object of the present invention is to provide an improved nozzle assembly to solve the problems in the solder injection process as described above.

Another object of the present invention is to provide a solder injection device comprising the improved nozzle assembly.

The nozzle assembly for solder injection in accordance with embodiments of the present invention for achieving the above object has a body having an inner space open to receive the solder material and a heater for melting the solder material; A nozzle having a flat lower surface and a slit for injecting molten solder by the heater into mold cavities penetrating between the inner space of the body and the lower surface and formed on the surface of the template, and an open upper portion of the body It may include a door for opening and closing the.

According to embodiments of the present invention, a sealing member may be disposed between the door and the body to seal the internal space.

According to embodiments of the present invention, the door may be driven by a door driver.

According to embodiments of the invention, the body may have an air port for communicating the internal space with the outside, the air port may be opened and closed by a valve. The valve may include a valve disc for opening and closing the air port and a valve driver for driving the valve disc.

According to embodiments of the present invention, the valve may be a check valve that allows only air flow from the inner space to the outside.

According to embodiments of the present invention, the nozzle may have a vacuum channel formed on a lower surface of the nozzle to be connected to the slit and a vacuum port connected to the vacuum channel, wherein the vacuum port is configured to mold the molten solder into the mold. It may be connected to a pressure regulator for maintaining the inside of the vacuum channel at a pressure lower than atmospheric pressure during injection into the cavities. The vacuum port may be opened and closed by a valve, and the valve may include a valve disc for opening and closing the vacuum port and a valve driver for driving the valve disc.

According to embodiments of the present invention, the nozzle may have an air port connecting the vacuum port and the outside, and the air port may be opened and closed by a valve.

According to embodiments of the present invention, the molten solder may be injected into the mold cavities by a relative sliding motion between the nozzle and the template, the nozzle assembly being forward relative to the relative sliding direction of movement. It may further comprise a heating block connected to the side of the nozzle is located and for preheating the template.

According to embodiments of the present invention, the molten solder may be injected into the mold cavities by a relative sliding motion between the nozzle and the template, and the nozzle assembly may be rearward with respect to the relative sliding direction. It may further comprise a cooling block connected to the side of the nozzle located and for cooling the template.

According to embodiments of the present invention, an insulating member may be disposed between the nozzle, the heating block, and the cooling block, respectively.

Solder injection apparatus according to embodiments of the present invention for achieving the above another object is a chuck for supporting a template formed on the surface of the plurality of mold cavities, and disposed on top of the chuck and molten solder in the mold cavities A nozzle assembly for injecting and a drive for contacting the nozzle assembly and the template with each other for injecting the molten solder into the mold cavities and providing a relative sliding motion between the contacted nozzle assembly and the template. Can be. Here, the nozzle assembly has a body having an internal space open at the top for accommodating the solder material, the body including a heater for melting the solder material, a flat lower surface and a space between the inner space of the body and the lower surface And a nozzle having a slit for injecting the molten solder into the mold cavities, and a door for opening and closing an open upper portion of the body.

According to embodiments of the present invention, the driving unit may include a first driving unit for contacting the nozzle assembly and the template and a second driving unit providing a relative sliding motion between the nozzle assembly and the template.

According to embodiments of the present invention, the door may be driven by a door driver. The body may have an air port for communicating the internal space with the outside, and the air port may be opened and closed by a valve. The valve may include a valve disc for opening and closing the air port and a valve driver for driving the valve disc. The nozzle assembly may further include a controller, wherein the controller opens the door to form the pressure of the internal space at atmospheric pressure before injecting the molten solder from the nozzle assembly to the mold cavities, After the injection of the molten solder is completed, the door is closed, and after closing the door to open the air port to form the pressure of the internal space to atmospheric pressure, and then to close the air port so that the internal space is sealed An operation of the door driver and the valve driver may be controlled.

According to the embodiments of the present invention as described above, when the nozzle assembly is separated from the template after the solder injection process is completed, the internal space of the nozzle assembly may be closed by the door. Thus, leakage of molten solder through the slit of the nozzle from the inner space can be sufficiently reduced or prevented. Therefore, it is not necessary to change the temperature of the nozzle in the solder injection process, and thus the time required for the solder injection process can be greatly shortened.

In addition, since the template may be preheated to a temperature close to the temperature of the nozzle by the heating block of the nozzle assembly, the molten solder may be more uniformly injected into the mold cavities. Therefore, the size of the solder bumps formed in the mold cavities can be more uniform, and thus the performance and quality of the semiconductor device using the solder bumps can be greatly improved.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Also, unless stated otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the invention are not to be described as limited to the particular shapes of the areas described as the illustrations, but include deviations in the shapes, and the areas described in the figures are entirely schematic and their shapes. Are not intended to describe the precise shape of the region nor are they intended to limit the scope of the invention.

1 is a schematic side view illustrating a solder injection apparatus including a nozzle assembly for solder injection according to an embodiment of the present invention, and FIG. 2 is a schematic front view illustrating the solder injection apparatus illustrated in FIG. 1. to be.

1 and 2, a solder injection apparatus 100 according to an embodiment of the present invention is solder bumps on bump pads of semiconductor devices formed on a silicon wafer used as a semiconductor substrate in a semiconductor device manufacturing process. Can be used to form them. In particular, the solder injection apparatus 100 may be used to inject molten solder into mold cavities 12 (see FIG. 3) formed on the surface of the template 10 for forming the solder bumps.

After being injected into the mold cavities 12 of the template 10, the solidified solders may be formed into spherical solder bumps through a subsequent reflow process, and then transferred to bump pads on the semiconductor substrate. Can be.

The solder injection apparatus 100 may include a chuck 110 for supporting a template 10 having a surface on which the mold cavities 12 are formed, and disposed on the chuck 110, and disposed on the mold cavities. A nozzle assembly 200 for injecting molten solder into 12 and contacting the nozzle assembly 200 with the template 10 for injecting the molten solder into the mold cavities 12 It may include a drive for providing a relative sliding movement between the contacted nozzle assembly 200 and the template 10.

Although not shown, the solder injection apparatus 100 may include a process chamber (not shown) in which the injection process of the molten solder is performed. The chuck 110 may be disposed in the process chamber, and the template 10 may be fixed on the chuck 110 by vacuum pressure or electrostatic force. Alternatively, the template 10 may be fixed by a plurality of clamps (not shown) or a holder on the chuck 110.

The nozzle assembly 200 may be disposed above the chuck 110 in the process chamber and may be in surface contact with the upper surface of the template 10 by the driving unit. The nozzle assembly 200 sequentially injects the molten solder into the mold cavities 12 of the template 10 by the relative sliding motion provided by the drive unit in contact with the template 10. can do. The molten solder may include tin (Sn), silver (Ag), copper (Cu), bismuth (Bi), indium (In), and the like, which may be used alone or in combination.

FIG. 3 is a schematic plan view for describing the template illustrated in FIG. 1.

Referring to FIG. 3, the template 10 may have a flat upper surface, and the mold cavities 12 may be formed at an upper surface portion of the template 10. In addition, the template 10 may have a mold region 10A having a shape similar to that of a semiconductor substrate and a peripheral region 10B surrounding the mold region 10A, and the cavities 12 may have the mold region. May be disposed within 10A.

The nozzle assembly 200 may have a larger width than the mold region 10A. In this case, molten solder may be injected into all mold cavities 12 by one relative sliding motion between the nozzle assembly 200 and the template 10. Alternatively, however, the nozzle assembly 200 may have a smaller width than the mold region 10A, in which case the nozzle assembly 200 is for injecting molten solder into all mold cavities 12. Multiple relative sliding motions may be provided between the and the template 10. For example, the nozzle assembly 200 may be moved in a zigzag form on the template 10.

Referring again to FIGS. 1 and 2, the driving unit includes a first driving unit 120 for contacting the nozzle assembly 200 and the template 10 with each other, and between the nozzle assembly 200 and the template 10. The second driving unit 130 may be provided to provide a relative sliding motion. For example, the first driver 120 may be connected to the nozzle assembly 200 to move the nozzle assembly 200 in a vertical direction, and the second driver 130 may be the chuck 110. It is connected to the chuck 110 can move in the horizontal direction. As an example, a hydraulic or pneumatic cylinder may be used as the first driving unit 120, and a single axis robot including a motor, a ball screw, a ball block, etc. may be used as the second driving unit 130.

However, unlike the above, the solder injection apparatus 100 may include a drive unit for moving the nozzle assembly 200 in the vertical and horizontal directions or a drive unit for moving the chuck 110 in the vertical and horizontal directions. It may be. In addition, the solder injection apparatus 100 may include a first driver for moving the chuck 110 in a vertical direction and a second driver for moving the nozzle assembly 200 in a horizontal direction. As described above, the configuration of the driving unit may be variously changed, whereby the scope of the present invention is not limited.

4 is a schematic cross-sectional view for describing a nozzle assembly for solder injection shown in FIG. 1.

Referring to FIG. 4, the nozzle assembly 200 has an internal space 212 for accommodating solder material, and is connected to a body 210 and a lower portion of the body 210 for melting the solder material. It may include a nozzle 220 having a flat lower surface for surface contact with the upper surface of the (10).

The nozzle 220 is a slit penetrating between the inner space 212 of the body 210 and the flat lower surface to inject the molten solder into the mold cavities 12 of the template 10. 222).

The body 210 and the nozzle 220 may extend in another relative direction perpendicular to the relative sliding motion, that is, the horizontal direction of movement of the chuck 110, and the slit 222 may be formed in the nozzle 220. It can extend together along the direction of extension. Therefore, the molten solder may be sequentially injected into the mold cavities 12 in the region through which the slit 222 passes by the horizontal movement of the chuck 110.

The solder material may be melted in the inner space 212 of the body 210, and a heater 214 may be disposed around the inner space 212 to melt the solder material. For example, as illustrated, an electric resistance heating wire may be used as the heater 214, and the electric resistance heating wire may be embedded in the body 210 to surround the internal space 212.

An upper portion of the internal space 212 may be opened, and the opened upper portion may be opened and closed by a door 230. In particular, the door 230 may be opened to proceed with the solder injection process, and may be closed after the solder injection process is completed to prevent leakage of the molten solder. That is, while the solder injection process is performed, the door 230 may be opened so that the pressure in the internal space 212 may be maintained at atmospheric pressure. Accordingly, the molten solder may be transferred to the mold cavities 12. It can be easily injected. After the solder injection process is completed, the door 230 may be closed to seal the internal space 212, and when the nozzle assembly 200 is separated from the template 10, the molten solder may have a weight of itself. As a result, a negative pressure may be generated in the internal space 212, and thus leakage of the molten solder through the slit 222 may be sufficiently reduced or prevented.

A sealing member 232 may be disposed between the door 230 and the body 210 to seal the internal space 212. For example, the door 230 may be inserted into the interior space 212, and a groove on which the sealing member 232, for example, an O-ring may be mounted, is provided at a side of the door 230. Can be. That is, the inner space 212 may be sealed by the O-ring mounted to the groove, and thus leakage of the molten solder through the slit 222 may be sufficiently reduced or prevented.

The door 230 may be opened and closed by a door driver 234 provided at one side of the body 210. For example, as shown, the door driver 234 may include a motor that can rotate the door 230. However, unlike the above, the door driver 234 may move the door 230 in a vertical direction, in which case the door driver 234 is a single-axis driver including a hydraulic or pneumatic cylinder or a motor and a ball screw It may include.

Meanwhile, the body 210 may have an air port 216 that communicates the internal space 212 with the outside, and the air port 216 may be opened and closed by the first valve 240. For example, the first valve 240 may include a valve disc 242 for opening and closing the air port 216 and a valve driver 244 for driving the valve disc 242.

The operation of the door driver 234 and the valve driver 244 of the first valve 240 may be controlled by the controller 250. For example, the controller 250 may open the door 230 to perform the solder injection process after the nozzle assembly 200 is in surface contact with the template 10, and the solder injection process may be performed. After this is completed, the door 230 may be closed to separate the nozzle assembly 200 from the template 10.

When the door 230 is closed, the pressure of the internal space 212 may be higher than atmospheric pressure as the door 230 is closed, and the control unit 250 is in the state in which the door 230 is closed as described above. The air port 216 may be opened to form the pressure of the internal space 212 at atmospheric pressure. Subsequently, after the pressure of the internal space 212 is formed to atmospheric pressure, the internal space 212 may be sealed by closing the air port 216.

According to another embodiment of the present invention, the door 230 may be kept closed at all times except when the solder material is supplied to the internal space 212, in which case the controller 250 is the solder. The valve driver 244 of the first valve 240 may be controlled to perform the injection process. For example, the controller 250 may open the air port 216 to perform the solder injection process, and to separate the nozzle assembly 200 from the template 10. 216) can be closed.

According to another embodiment of the present invention, although not shown, the air port 216 has a check valve (not shown) to allow only the air flow outward from the internal space 212 in place of the first valve 240. May be installed. That is, when the solder injection process is performed in the state in which the door 230 is opened, and the door 230 is closed after the solder injection process is completed, the check valve receives the pressure of the internal space 212 at atmospheric pressure. It may allow the flow of air from the inner space 212 to the outside to form a. However, the flow of air from the outside into the internal space 212 is blocked by the check valve, so that the molten solder is passed through the slit 222 when the nozzle assembly 200 is separated from the template 10. Leakage can be sufficiently reduced or prevented.

Referring back to FIG. 4, a vacuum channel 224 connected to the slit 222 may be formed on a lower surface of the nozzle 220. In particular, the vacuum channel 224 may be provided in front of the slit 222 with respect to the relative sliding direction, and extend in a direction perpendicular to the extension direction of the nozzle 220, that is, the relative sliding direction. can do.

In addition, the nozzle 220 may have a vacuum port 226 connected to the vacuum channel 224. In particular, as shown, the slit 222 may be connected to the rear end of the vacuum channel 224, and the vacuum port 226 may be connected to the front end of the vacuum channel 224. The vacuum port 226 may be connected to a pressure regulator 260 to maintain the inside of the vacuum channel 224 in a vacuum state, that is, a pressure lower than atmospheric pressure, while injecting the molten solder into the mold cavities 12. Can be connected.

The pressure regulator 260 may include a vacuum pipe 262, a pressure control valve 264, and a vacuum pump 266. The pressure adjusting unit 260 may evacuate the inside of the vacuum channel 224 to allow the molten solder to be more easily injected into the mold cavities 12 positioned in the vacuum channel 224. .

According to one embodiment of the invention, the nozzle assembly 200 may further include a second valve 270 for opening and closing the vacuum port 226, the second valve 270 is the vacuum port A valve disc 272 for opening and closing 226 and a valve driver 274 for driving the valve disc 272 may be included. The second valve 270 may be used to block the vacuum pressure applied to the vacuum channel 224 after the solder injection process is completed.

Although the signal line is not shown, the operation of the second valve 270 may be controlled by the controller 250. That is, the controller 250 may block the vacuum port 226 by operating the second valve 270 after the solder injection process is completed.

On the other hand, it is preferable that the molten solder is not sucked into the vacuum channel 224 by the vacuum pressure. For this purpose, the vacuum channel 224 preferably has a depth of about several micrometers, for example, about 2 to 4㎛.

FIG. 5 is a schematic cross-sectional view for describing another example of the nozzle and the second valve illustrated in FIG. 4.

Referring to FIG. 5, the nozzle 320 is branched from the vacuum port 326 and the vacuum port 326 connected to the pressure regulating unit 360 to penetrate the outer surface of the nozzle 320. It may have a second air port 328 connecting the vacuum port 326 and the outside. The second air port 328 may be opened and closed by the second valve 370. The second valve 370 may include a valve disk 372 for opening and closing the second air port 328 and a valve driver 374 for driving the valve disk 372.

The second valve 370 may be controlled by the controller 350. In particular, the control unit 350 may close the pressure control valve 364 of the pressure adjusting unit 360 and open the second valve 370 after the solder injection process is completed. Thus, the pressure inside the vacuum channel 224 may be raised to atmospheric pressure, thereby making it easier to separate the nozzle assembly 200 from the template 10.

Referring back to FIG. 4, a front side of the nozzle 220, that is, one side of the nozzle located forward with respect to the relative sliding direction, contacts the surface of the template 10 and preheats the template 10. A heating block 280 may be provided. The heating block 280 may have a flat lower surface in surface contact with the template 10, and a heater 282 for controlling a temperature of the heating block 280 in the heating block 280. May be provided. As an example, an electric resistance heating wire may be used as the heater 282.

However, unlike the above, the heating block 280 may be spaced apart from the surface of the template 10 by a predetermined distance. For example, the distance between the bottom surface of the heating block 280 and the surface of the template 10 may be maintained about 0.1 mm to 2.0 mm.

The heating block 280 preheats the template 10 to a temperature close to the temperature of the nozzle 220 to reduce the rate at which the molten solder is injected into the mold cavities 12 and then solidifies. The molten solder can be injected into the mold cavities 12 more uniformly.

In addition, a cooling block for cooling the template 10 in contact with the surface of the template 10 may be provided at the rear side of the nozzle 220, that is, the other side of the nozzle located rearward with respect to the relative sliding direction. 284 may be provided. The cooling block 284 may have a flat lower surface in surface contact with the template 10, and a heater 286 for adjusting a temperature of the cooling block 284 in the cooling block 284. May be provided. As an example, an electric resistance heating wire may be used as the heater 286.

However, unlike the above, the cooling block 284 may be spaced apart from the surface of the template 10 by a predetermined distance. For example, the distance between the bottom surface of the cooling block 284 and the surface of the template 10 may be maintained about 0.1 mm to 2.0 mm.

The cooling block 284 may be in contact with the template 10 to lower the temperature of the template 10, thereby allowing the molten solder injected into the mold cavities 12 to sufficiently solidify. .

For example, the body 210 and the nozzle 220 may be heated to a first temperature above the melting point of the solder, and the heating block 280 may be heated to a second temperature lower than the first temperature. . Here, the template 10 may also be heated by the chuck 110. If the temperature of the template 10 is excessively low, the temperature of the nozzle 220 may be lowered, and thus the solder may solidify in the slit 222. Thus, the chuck 110 may include a heater 112 for heating the template 10. As an example, an electric resistance heating wire may be embedded in the chuck 110 as the heater 112 as shown.

In particular, the temperature of the chuck 110 and the temperature of the cooling block 284 is preferably the same. The chuck 110 and the cooling block 284 may be heated to a third temperature lower than the second temperature, and the third temperature may be set to sufficiently solidify the molten solder. As an example, the first temperature may be about 230 ° C to 250 ° C, the second temperature may be about 200 ° C to 200 ° C, and the third temperature may be about 170 ° C to 190 ° C. However, since the temperature ranges may vary depending on the melting point of the solder, the scope of the present invention will not be limited by the temperature ranges.

The nozzle assembly 200 may further include insulation members 290 to maintain the nozzle 220, the heating block 280, and the cooling block 284 at respective temperatures. The heat insulating members 290 may be disposed between the nozzle 220 and the heating block 280 and between the nozzle 220 and the cooling block 284, respectively. As an example, the insulating members 290 may include glass fibers.

6 through 10 are schematic cross-sectional views illustrating a method of injecting molten solder into mold cavities of a template using the nozzle assembly shown in FIG. 4.

A method of injecting molten solder into the mold cavities 12 of the template 10 will be described in detail with reference to FIGS. 6 to 10.

First, solder material may be supplied to the internal space 212 of the body 210 of the nozzle assembly 200, and the solder material may be melted by the heater 214 inside the body 210. In addition, the template 10 on which the mold cavities 12 are formed may be loaded on the chuck 110, and may be heated to a predetermined temperature by the chuck 110.

The nozzle assembly 200 may be moved downward by the first driving unit 120, whereby the lower surface of the nozzle assembly 200 may be in surface contact with the upper surface of the template 10. In this case, the nozzle assembly 200 may contact the peripheral area 10B of the template 10. The inner space 212 is sealed by the door 230 and the first valve 240 before the nozzle assembly 200 is in surface contact with the template 10, and the nozzle assembly 200 is closed. The door 230 may be opened after surface contact with the template 10. In addition, a vacuum pressure may be provided to the vacuum channel 224 by the pressure adjusting unit 260, and the vacuum port 226 may be opened by the second valve 270.

In the state where the nozzle assembly 200 and the template 10 are in surface contact, the chuck 110 may be moved in the horizontal direction by the second driving unit 130, whereby the nozzle assembly 200 may be moved. It may be slid in a horizontal direction on the template 10. As a result, the molten solder may be sequentially injected into the mold cavities 12 by the sliding motion. In this case, the door 230 may be maintained in an open state, and thus the pressure of the internal space 212 may be maintained at atmospheric pressure.

The mold cavities 12 may be preheated to approach the temperature of the nozzle 220 by the heating block 280 before entering below the slit 222 of the nozzle assembly 200 and thus the The molten solder may be injected into the mold cavities 12 more uniformly. In addition, the injected solder may be solidified by the cooling block 284 maintained at a temperature similar to that of the chuck 110.

After the injection of the molten solder into the mold cavities 12 is completed, the door 230 may be closed, and then the first valve 240 may be opened. The first valve 240 may be closed after the pressure of the internal space 212 is formed at atmospheric pressure. In addition, the second valve 270 may block the vacuum port 226. Subsequently, the nozzle assembly 200 may be lifted by the first driver 120, and thus the nozzle assembly 200 may be separated from the template 10. In this case, since the inner space 212 is sealed by the door 230 and the first valve 240, the molten solder does not leak through the slit 222. That is, the pressure of the inner space 212 may be lower than atmospheric pressure due to the weight of the molten solder, but since the inner space 212 is sealed, the pressure difference between the inner space 212 and the outside is kept constant. This may prevent leakage of the molten solder.

The solder injected as described above may be formed of spherical solder bumps in a subsequent reflow process, and then transferred onto bump pads of the semiconductor substrate.

According to the embodiments of the present invention as described above, when the nozzle assembly is separated from the template after the solder injection process is completed, the internal space of the nozzle assembly may be closed by the door. Thus, leakage of molten solder through the slit of the nozzle from the inner space can be sufficiently reduced or prevented. Therefore, it is not necessary to change the temperature of the nozzle in the solder injection process, and thus the time required for the solder injection process can be greatly shortened.

In addition, since the template may be preheated to a temperature close to the temperature of the nozzle by the heating block of the nozzle assembly, the molten solder may be more uniformly injected into the mold cavities. Therefore, the size of the solder bumps formed in the mold cavities can be more uniform, and thus the performance and quality of the semiconductor device using the solder bumps can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic side view for explaining a solder injection apparatus including a nozzle assembly for solder injection according to an embodiment of the present invention.

FIG. 2 is a schematic front view for describing the solder injection apparatus illustrated in FIG. 1.

FIG. 3 is a schematic plan view for describing the template illustrated in FIG. 1.

4 is a schematic cross-sectional view for describing a nozzle assembly for solder injection shown in FIG. 1.

FIG. 5 is a schematic cross-sectional view for describing another example of the nozzle and the second valve illustrated in FIG. 4.

6 through 10 are schematic cross-sectional views illustrating a method of injecting molten solder into mold cavities of a template using the nozzle assembly shown in FIG. 4.

Explanation of symbols on the main parts of the drawings

10: Template 12: Mold Cavity

100: solder injection device 110: chuck

120: first driver 130: second driver

200 nozzle assembly 210 body

212: internal space 216: air port

220: nozzle 222: slit

224: vacuum channel 226: vacuum port

230: door 232: sealing member

234: door driving unit 240: first valve

242: valve disc 244: valve drive unit

250: control unit 260: pressure control unit

170: second valve 272: valve disc

274: valve driving unit 280: heating block

284 cooling block 290 insulation member

Claims (19)

A body including a heater for melting the solder material and having an internal space open at the top to receive the solder material; A nozzle having a flat lower surface and a slit penetrating between an inner space of the body and the lower surface to inject molten solder by the heater into mold cavities formed on a surface of a template; And And a door for opening and closing an open top of the body. The nozzle assembly of claim 1, further comprising a sealing member disposed between the door and the body. 2. The nozzle assembly of claim 1, further comprising a door driver for driving the door. According to claim 1, The body has an air port for communicating the interior space with the outside, And a valve for opening and closing the air port. 5. The nozzle assembly of claim 4, wherein the valve comprises a valve disc for opening and closing the air port and a valve drive for driving the valve disc. 5. The nozzle assembly of claim 4, wherein the valve is a check valve that only permits outward air flow from the inner space. The method of claim 1, wherein the nozzle has a vacuum channel formed on the lower surface of the nozzle to be connected to the slit and a vacuum port connected to the vacuum channel, And the vacuum port is connected to a pressure regulator for maintaining the inside of the vacuum channel at a pressure lower than atmospheric pressure while injecting the molten solder into the mold cavities. 8. The nozzle assembly of claim 7, further comprising a valve for opening and closing the vacuum port. 10. The nozzle assembly of claim 8, wherein the valve includes a valve disc for opening and closing the vacuum port and a valve drive for driving the valve disc. The method of claim 7, wherein the nozzle has an air port connecting the vacuum port and the outside, And a valve for opening and closing the air port. The method of claim 1, wherein the molten solder is injected into the mold cavities by a relative sliding motion between the nozzle and the template, And a heating block connected to a side of the nozzle positioned forward with respect to the relative sliding direction and for preheating the template. The method of claim 1, wherein the molten solder is injected into the mold cavities by a relative sliding motion between the nozzle and the template, And a cooling block connected to a side of the nozzle located rearward with respect to the relative sliding direction and cooling the template. 13. The nozzle assembly of claim 11 or 12, further comprising a heat insulating member disposed between the nozzle and the heating block or the cooling block. A chuck supporting a template on which a plurality of mold cavities are formed; A nozzle assembly disposed above the chuck and for injecting molten solder into the mold cavities; A drive for contacting the nozzle assembly and the template with each other to inject the molten solder into the mold cavities and providing a relative sliding motion between the contacted nozzle assembly and the template, The nozzle assembly has a body having an internal space open at the top for accommodating solder material, the body including a heater for melting the solder material, a flat lower surface and a space between the inner space of the body and the lower surface; And a door having a slit for injecting the molten solder into mold cavities and a door for opening and closing an open top of the body. 15. The solder injection device of claim 14, wherein the drive portion comprises a first drive portion for contacting the nozzle assembly and the template and a second drive portion providing a relative sliding motion between the nozzle assembly and the template. . 15. The solder injection device of claim 14, further comprising a door driver for driving the door. The method of claim 16, wherein the body has an air port for communicating the interior space with the outside, Solder injection device further comprises a valve for opening and closing the air port. 18. The solder injection device of claim 17, wherein the valve includes a valve disc for opening and closing the air port and a valve driver for driving the valve disc. 19. The method of claim 18, wherein the door is opened to form a pressure in the interior space to atmospheric pressure before injecting the molten solder from the nozzle assembly to the mold cavities, Closing the door after the injection of the molten solder is completed; After closing the door to open the air port to form the pressure of the internal space to atmospheric pressure, And a controller for controlling the operation of the door driver and the valve driver to close the air port so that the internal space is sealed.

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