KR20100120520A - Apparatus and method for cutting a glass - Google Patents

Abstract

PURPOSE: An apparatus and a method for cutting glass are provided to reduce the contamination due to foreign materials such as cullet by performing the cutting of a substrate in a vertical direction. CONSTITUTION: An upper plane of a substrate(G) is scribed at a predetermined depth along one axis, and the substrate is divided into first and second regions(A1,A2). In the second region of the substrate, the lower plane of the substrate is held through a first absorbing plate(400). The held second region is moved in a first horizontal direction, and the substrate is cut into first and second regions so that the cut surface of the substrate is uniform.

Description

Substrate cutting method and apparatus {APPARATUS AND METHOD FOR CUTTING A GLASS}

The present invention relates to a method and an apparatus for cutting a substrate, and more particularly, to a method and an apparatus for cutting a glass substrate for manufacturing a display panel in accordance with the size of the display panel.

In general, a display panel used to display an image is manufactured by performing a deposition process, an etching process, a photolithography process, a cleaning process, and the like similar to a semiconductor device manufacturing process, based on a glass substrate. The substrate which has been subjected to these processes is subjected to a cutting process for cutting to match the size of the display panel.

Here, the cutting process is performed by the substrate cutting device during the transfer of the substrate. The substrate cutting apparatus includes a scriber unit for scribing to a predetermined size on a top surface of the substrate and a breaking unit for removing an unnecessary edge portion from the scribed substrate.

However, the braking unit has a configuration in which the edge portion is hit and broken, so that not only the surface to be cut is uneven but also a lot of foreign matters such as chipping or cullet are generated.

Accordingly, the present invention has been made in view of such problems, and an object of the present invention is to provide a substrate cutting method capable of making the cut surface uniform and smooth.

Another object of the present invention is to provide a substrate cutting apparatus to which the above-described substrate cutting method is applied.

In order to achieve the above object of the present invention, a substrate cutting method according to one aspect is disclosed.

The upper surface of the substrate is scribed along a first axis to a predetermined depth to divide the substrate into a first region and at least one second region. Next, the second region portion of the substrate is held. Subsequently, the second area of the held substrate is moved in the horizontal direction away from the first area to cut the substrate into the first area and the second area.

Here, the holding of the substrate is performed by absorbing the lower surface of the substrate.

In addition, scribing the substrate and holding the substrate may be performed at the same place.

Meanwhile, in the scribing of the substrate on the uniaxial axis, scribing may be performed twice so that each of the two second regions is formed on both sides of the first region.

Accordingly, the holding of the substrate may simultaneously hold portions of the second regions of the substrate, and in the cutting of the substrate, substrate portions of each of the second regions of the substrate may be moved in a horizontal direction away from the first region. Can move at the same time.

The substrate cutting method may further include: scribing an upper surface of the first region portion of the substrate to a predetermined depth along a second axis perpendicular to the first axis, thereby forming at least one first region portion of the substrate with the third region. Dividing into a fourth region of the substrate; holding a fourth region portion of the substrate; and moving the fourth region portion of the held substrate in a second horizontal direction away from the third region. Cutting a portion of the substrate into the third region and the fourth region may be further included.

In this case, the step of holding the second area of the substrate, the holding of the fourth area of the substrate, the moving of the second area of the substrate in the horizontal direction, and the fourth area of the substrate Each of the steps of moving in the second horizontal direction may proceed simultaneously with each other.

In order to achieve the above object of the present invention, a substrate cutting apparatus according to one aspect includes a first scriber, a first suction plate and a first horizontal transfer part.

The first scriber scribes an upper surface of the substrate to a predetermined depth along a first axis to divide the substrate into a first region and at least one second region. The first adsorption plate is disposed in the second region below the substrate facing the first scriber, and has a vacuum hole for adsorbing a lower surface of the substrate to hold a portion of the second region of the substrate.

The first horizontal transfer part is connected to the first suction plate, and moves the first suction plate in a horizontal direction away from the first area of the substrate to cut the substrate into the first area and the second area.

Accordingly, the first scriber may include first and second wheels scribing boundaries of the first region and the second regions such that two second regions are located at both sides of the first region. have.

Meanwhile, the substrate cutting apparatus may scribe the upper surface of the substrate to a predetermined depth along a second axis perpendicular to the first axis in the first region of the substrate, thereby forming a portion of the first region of the substrate as a third region and at least one first portion. A second scriber divided into four regions, and a vacuum pressure that is disposed in the fourth region below the substrate facing the second scriber and adsorbs a lower surface of the substrate to hold a portion of the fourth region of the substrate. A second adsorption plate having a second adsorption plate and connected to the second adsorption plate and moving the second adsorption plate in a second horizontal direction away from a third area of the substrate, thereby moving the first region of the substrate to the third region and the second adsorption plate. The apparatus may further include a second horizontal transfer unit cutting into four areas.

In addition, the substrate cutting device is a roller having a plurality of shafts arranged in parallel to each other below the substrate and a plurality of rollers coupled to each of the shafts to transfer the substrate and the suction plate is disposed therebetween A unit may further include a vertical transfer part connected to the suction plate from between the rollers and configured to lift the suction plate such that the suction plate sucks the substrate.

According to the substrate cutting method and apparatus, the substrate is divided into first and second regions by scribing the upper surface of the substrate, and the lower surface is adsorbed and held at the second region of the substrate, By cutting the substrate into first and second regions by moving the substrate in a horizontal direction away from the first region, the cut surface of the substrate may be smooth and uniform. As a result, it is possible to reduce the occurrence of foreign matter such as chipping or cullets at the cut surface of the substrate.

Therefore, by preventing the substrate from being contaminated again by the foreign matter, it is possible to expect an improvement in the quality of the substrate.

In addition, by breaking the scriber for scribing the substrate and the adsorption plate for the adsorption of the substrate facing each other on the upper and lower sides with respect to the substrate, a breaking unit for hitting the cutting of the substrate in the background technology Can remove the installation space.

That is, the substrate cutting apparatus according to the present invention can improve the spatial utilization by reducing the overall installation space.

Hereinafter, a method and apparatus for cutting a substrate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a configuration diagram schematically showing a substrate cutting apparatus according to an embodiment of the present invention.

Referring to FIG. 1, a substrate cutting apparatus 1000 according to an exemplary embodiment may include a roller unit 100, a first scriber 200, a second scriber 300, and a first suction plate 400. , A second adsorption plate 500, a first horizontal transfer part 700, and a second horizontal transfer part 800.

The roller unit 100 includes a plurality of shafts 110 and a plurality of rollers 120. The shafts 110 are disposed parallel to each other under the substrate (G).

Here, the substrate G is a liquid crystal display panel in which a thin film transistor (TFT) substrate and a color filter (CF) substrate are combined to fill a liquid crystal between the substrate. It may be a substrate to prepare. Such a substrate (G) has recently been thinned to about 0.3 to 2 mm due to the thinning of the liquid crystal display panel.

The shafts 110 are arranged parallel to each other in a second axis y direction. The rollers 120 are coupled to each of the shafts 110 at regular intervals from each other. The rollers 120 contact the bottom surface of the substrate G. These rollers 120 are configured to rotate together with the shafts 110. Accordingly, when a rotational force is transmitted to the shafts 110 from the outside, the rollers 120 may have the first axis x substantially perpendicular to the second axis y direction by the rotational force. Direction.

At this time, the rollers 120 transfer the substrate G and stop the rotation operation so that the substrate G stops at a position for cutting the substrate G.

Each of the first and second scribers 200 and 300 may be disposed on the stationary substrate G so as to be movable in the first axis x and the second axis y directions.

Hereinafter, an operation and configuration of scribing the substrate G through the first and second scribers 200 and 300 will be described in more detail with reference to FIGS. 2 and 3. .

2 and 3 illustrate substrates scribed by each of the first and second scribers in the substrate cutting apparatus shown in FIG. 1.

2 and 3, the first scriber 200 scribes the upper surface of the stationary substrate G to a predetermined depth along the first axis x, thereby providing the substrate G. Is divided into a first region A1 and two second regions A2.

Here, the second areas A2 are substantially located at both sides of the first area A1. Thus, a portion of the first region A1 of the substrate G is a region used by a user for a specific purpose such as a display, and portions of the second region A2 of the substrate G are substantially unnecessary.

The first scriber 200 has two cutting lines CL along the first axis x between the first region A1 and the second region A2 of the substrate G. ) Two first and second wheels 210, 220 moving on the first axis x to scribe one at a time.

In this case, the substrate cutting apparatus 1000 further includes first and second guide bars 350 and 360 to operate the first and second wheels 210 and 220. The first guide bar 350 is disposed on at least one side portion of the substrate G to be parallel to the first axis x. For example, two first guide bars 350 may be disposed at both sides of the substrate G.

The second guide bar 360 is coupled to the first guide bar 350 to be movable on the first axis x. Thus, the second guide bar 360 is coupled to the first guide bar 350 in a second axis (y) perpendicular to the first axis (x).

As a result, the first and second wheels 210 and 220 are fixed to the second guide bar 360 to scribe the upper surface of the substrate G while moving in the first axis x. In this case, the first and second wheels 210 and 220 are adjusted to fit the cutting lines CL along the first axis x and are fixed to the second guide bar 360.

The second scriber 300 scribes the upper surface of the stationary substrate G to a predetermined depth along the second axis y to remove a portion of the first region A1 of the substrate G. It is divided into three regions A3 and two fourth regions A4.

Here, the fourth regions A4 are substantially positioned at both sides of the third region A3. Thus, the third area A3 of the substrate G is an area used by the user, and the fourth area A4 of the substrate G is an area that is substantially unnecessary. That is, the user may later use only the third region A3 except for the second region A2 and the fourth region A4 along four sides of the substrate G for a specific use. do.

The second scriber 300 has two cutting lines CL along the second axis y between the third region A3 and the fourth region A4 of the substrate G. ) And two third and fourth wheels 310, 320 moving in the second axis y to scribe one at a time.

In this case, the substrate cutting apparatus 1000 further includes a third guide bar 370 for the operation of the first and second wheels 210 and 220. The third guide bar 370 is coupled to the first guide bar 350 so as to be movable in the first axis x while being parallel to the second guide bar 360.

Each of the third and fourth wheels 310 and 320 is coupled to each of the second and third guide bars 370 to be movable on the second axis y. Thus, each of the third and fourth wheels 310 and 320 may be aligned with each of the cutting lines CL along the second axis y of the second and third guide bars 370. The distance between the two is adjusted while moving along the first guide bar 350. Accordingly, the third and fourth wheels 310 and 320 move along the second axis y in each of the second and third guide bars 370 to scribe the top surface of the substrate G. Ice.

According to the configuration as described above, the upper surface of the substrate (G) by the first, second, third and fourth wheels (210, 220, 310, 320) are scribed along the cutting lines (CL) The glacier simply describes the process. First, the second guide bar (1) is adapted to fit the gap between the first and second wheels 210 and 220 to the cutting lines CL along the first axis x. 360).

Subsequently, the first and second wheels 210 and 220 are moved by the first guide bar 350 in the direction of the first axis x by the first guide bar 350. The substrate G is scribed along the cutting lines CL according to x).

Subsequently, the distance between the second and third guide bars 370 is adjusted so that the third and fourth wheels 310 and 320 are aligned with the cutting lines CL along the second axis y. .

Subsequently, the third and fourth wheels 310 and 320 are moved along the second axis y in the second and third guide bars 370 to cut the line along the second axis y. The substrate G is scribed along the CLs.

The first and second suction plates 400 and 500 are disposed between the rollers 120 at the bottom of the stationary substrate G. Specifically, two first adsorption plates 400 are disposed corresponding to the second regions A2 of the substrate G, and the second adsorption plates 500 are fourth of the substrate G. Two may be disposed corresponding to the regions A4.

Each of the first and second adsorption plates 400 and 500 may hold the substrate G to hold portions of the second region A2 and the fourth region A4 of the substrate G, respectively. It is configured to adsorb the lower surfaces of.

Hereinafter, referring to FIGS. 4 and 5, the first adsorption plate 400 of the first and second adsorption plates 400 and 500 adsorbs the second regions A2 of the substrate G. It will be described in more detail with respect to.

4 is a side view of the substrate and the first adsorption plate scribed in FIG. 1, and FIG. 5 is a view illustrating a state in which the first adsorption plate adsorbs the lower surface in the second region of the substrate in FIG. 4.

4 and 5, the first adsorption plate 400 may have a lower surface of the second area A2 of the substrate G while the substrate G is being transferred by the rollers 120. Spaced apart from the distance.

Thus, the substrate cutting device 1000 further includes a vertical transfer part 600 connected to the first adsorption plate 400 to lift the first adsorption plate 400 between the rollers 120. .

The vertical transfer part 600 raises the first adsorption plate 400 to contact the bottom surface of the substrate G when the substrate G stops for cutting.

In this case, the vertical transfer unit 600 may include a cylinder. In contrast, the vertical transfer part 600 may be formed of a coupling structure of a ball screw and a motor, or may be formed of a coupling structure of rack and pinion gears and a motor.

The first adsorption plate 400 has a vacuum hole 410 in which a vacuum pressure VP is provided from the outside to a portion in contact with the lower surface of the substrate G to adsorb the lower surface of the substrate G. In addition, the first adsorption plate 400 may include an O-ring 420 around the vacuum hole 410 to prevent the vacuum pressure from being lowered so that the adsorption force is reduced.

On the other hand, when the first adsorption plate 400 is lifted by the vertical transfer unit 600 to adsorb the lower surface of the substrate (G), the vacuum pressure (VP) is the first adsorption plate (400) After contact with the lower surface of the substrate (G) is provided to the vacuum hole 410.

This is because the thickness of the substrate G is about 0.3 to 2 mm, so that when the vacuum pressure VP is continuously provided to the vacuum hole 410, the first adsorption plate 400 is connected to the substrate. This is because the substrate G may be broken along the scribed groove by the vacuum pressure VP while approaching the lower surface of the G. As shown in FIG.

On the contrary, even when the vertical transfer part 600 further raises the lower surface of the substrate G while the roller 120 supports the substrate G to the first adsorption plate 400. ) May be broken, so that the vertical movement distance of the vertical transfer part 600 may be precisely so that the first adsorption plate 400 may adsorb the substrate G as supported by the rollers 120. Need to be controlled.

Since the two first adsorption plates 400 are disposed in the second regions A2 of the substrate G, the two adsorption plates substantially simultaneously adsorb the lower surface of the substrate G to shorten the process time. You can.

In addition, the second adsorption plate 500 also adsorbs the lower surface of the substrate G in the same manner as the first adsorption plate 400, thereby operating the second adsorption plate 500. Simultaneous with the plate 400 may further contribute to the shortening of the process time. That is, bottom surfaces of the second and fourth regions A2 and A4 of the substrate G may be simultaneously adsorbed by the first and second adsorption plates 400 and 500.

Each of the first and second horizontal transfer parts 700 and 800 is connected to each of the first and second suction plates 400 and 500. The first horizontal transfer part 700 moves the first suction plate 400 in a first horizontal direction a away from the first area A1, and the second horizontal transfer part 800 moves the second horizontal transfer part 800. The suction plate 500 is moved in the second horizontal direction b away from the third region A3.

The first and second horizontal transfer parts 700 and 800 may have the same configuration except that the driving direction of the vertical transfer part 600 is perpendicular to each other.

Hereinafter, referring to FIG. 6, the first horizontal transfer unit 700 of the first and second horizontal transfer units 700 and 800 may transfer the first adsorption plate 400 in the first horizontal direction a. It will be described in detail with respect to the configuration.

6 is a view illustrating a state in which the second region of the substrate adsorbed in FIG. 5 is cut from the first region through the first horizontal transfer part.

Referring to FIG. 6, the first horizontal transfer part 700 moves the first adsorption plate 400, which adsorbs the lower surface of the substrate G, in the first horizontal direction a, thereby providing the substrate G. ) Is cut into the first and second regions A1 and A2.

This cutting is due to the grooves scribed along the cutting line CL between the first and second regions A1 and A2 of the substrate G by the first scriber 200.

As such, the upper surface of the substrate G is scribed to divide the substrate G into the first and second regions A1 and A2, and in the second region A2 of the substrate G. The lower surface is adsorbed and held through the first adsorption plate 400, and then the adsorbed substrate G is moved in the first horizontal direction a to move the substrate G to the first and second regions. By cutting into A1 and A2, the cut surface of the substrate G can be made smooth and uniform. As a result, it is possible to reduce the occurrence of foreign matter such as chipping or cullet at the cut surface of the substrate G.

Therefore, by preventing the substrate G from being contaminated again by the foreign matter, it is possible to expect an improvement in the quality of the substrate G.

In addition, since the vertical transfer unit 600 is also connected to the first suction plate 400 in a direction perpendicular to each other, like the first horizontal transfer unit 700, the substrate cutting device 1000 may have the vertical transfer unit 600. A second guide for guiding the vertical transfer unit 600 with respect to the operation of the first guide rail 900 and the first horizontal transfer unit 700 for the operation of the first horizontal transfer unit 700 for the operation of It may further include a rail 950.

On the other hand, when the first adsorption plate 400 is two, as described above, the first horizontal transfer unit 700 is also made of two as well, these two can also proceed simultaneously to shorten the process time .

In addition, similar to the second adsorption plate 500 that operates simultaneously with the first adsorption plate 400, the second horizontal transporter 800 may be simultaneously with the first horizontal transporter 700. 500 may be moved in the second horizontal direction b. That is, the second regions A2 and the fourth regions A4 of the substrate G may be simultaneously cut by the first and second horizontal transfer parts 700 and 800.

Meanwhile, the first and second scribers 200 and 300 for scribing the substrate G and the first and second adsorption plates 400 and 500 for holding the substrate G are provided. By arranging the top and bottom facing each other with respect to the stationary substrate G, the installation space of the breaking unit hitting to cut the substrate G in the background art can be removed. That is, the substrate cutting apparatus 1000 according to the present invention can improve the spatial utilization by reducing the overall installation space.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

The present invention described above can reduce the occurrence of foreign matter such as chipping or cullet in the cutting plane by performing the actual cutting in the horizontal direction when the user wants to cut the substrate to a desired size. It can be used in a substrate cutting device.

1 is a configuration diagram schematically showing a substrate cutting apparatus according to an embodiment of the present invention.

2 and 3 illustrate substrates scribed by each of the first and second scribers in the substrate cutting apparatus shown in FIG. 1.

4 is a side view of the substrate and the first adsorption plate scribed in FIG.

FIG. 5 is a view illustrating a state in which the first adsorption plate adsorbs the lower surface in the second region of the substrate in FIG. 4.

6 is a view illustrating a state in which the second region of the substrate adsorbed in FIG. 5 is cut from the first region through the first horizontal transfer part.

<Explanation of symbols for the main parts of the drawings>

G: Substrate CL: Cutting Line

100: roller unit 110: shaft

120: roller 200: first scriber

300: second scriber 350: first guide bar

360: second guide bar 370: third guide bar

400: first adsorption plate 410: vacuum hole

420: O-ring 500: second adsorption plate

600: vertical transfer unit 700: first horizontal transfer unit

800: second horizontal feeder 900: first guide rail

950: second guide rail 1000: substrate cutting device

Claims (11)

Scribing an upper surface of the substrate to a predetermined depth along one axis to divide the substrate into a first region and at least one second region; Holding a second region portion of the substrate; And Cutting the substrate into the first region and the second region by moving the second region of the held substrate in a horizontal direction away from the first region. The method of claim 1, wherein the holding of the substrate comprises adsorbing a lower surface of the substrate. The method of claim 1, wherein scribing the substrate and holding the substrate are performed at the same location. The method of claim 1, wherein the scribing of the substrate in the uniaxial direction comprises scribing twice so that each of the two second regions is formed on both sides of the first region. The method of claim 4, wherein the holding of the substrate simultaneously holds the second area portions of the substrate. And cutting the substrate, simultaneously moving substrate portions of each of the second regions in a horizontal direction away from the first region. The first region of the substrate is scribed to a predetermined depth along a second axis perpendicular to the one axis in the first region of the substrate so that the first region of the substrate is the third region and at least one fourth region. Dividing into; Holding a fourth region of the substrate; And Moving the fourth region portion of the held substrate in a second horizontal direction away from the third region to cut the substrate portion of the first region into the third region and the fourth region. Substrate cutting method. The method of claim 6, further comprising: holding a second region portion of the substrate, holding a fourth region portion of the substrate, and moving the second region portion of the substrate in the horizontal direction; And moving each of the four region portions in the second horizontal direction proceeds simultaneously with each other. A scriber for scribing the upper surface of the substrate to a predetermined depth along one axis to divide the substrate into a first region and at least one second region; An adsorption plate disposed in a second region below the substrate facing the scriber and having a vacuum hole for adsorbing a lower surface of the substrate to hold a portion of the second region of the substrate; And And a horizontal transfer part connected to the suction plate and moving the suction plate in a horizontal direction away from the first area of the substrate to cut the substrate into the first area and the second area. 9. The scriber of claim 8, wherein the scriber comprises first and second wheels for scribing boundaries of the first region and the second regions such that two second regions are located on either side of the first region. Substrate cutting device, characterized in that. The method of claim 8, A second scriber that scribes an upper surface of the first region of the substrate to a predetermined depth along a second axis perpendicular to the one axis to divide the first region portion of the substrate into a third region and at least one fourth region ; A second adsorption plate disposed in the fourth region below the substrate facing the second scriber and having a second vacuum hole for adsorbing a lower surface of the substrate to hold a portion of the fourth region of the substrate; And A first area portion of the substrate is cut into the third area and the fourth area by moving the second adsorption plate in a second horizontal direction away from the third area of the substrate. Substrate cutting device further comprises a second horizontal transfer unit. The method of claim 8, A roller unit having a plurality of shafts disposed parallel to each other at a lower portion of the substrate and a plurality of rollers coupled to each of the shafts to transfer the substrate, and the suction plate disposed therebetween; And And a vertical transfer portion connected to the suction plate from between the rollers and configured to raise the suction plate so that the suction plate sucks the substrate.

Images