KR20100109176A

KR20100109176A - Light emitting package

Info

Publication number: KR20100109176A
Application number: KR1020090027641A
Authority: KR
Inventors: 이도광; 최재영
Original assignee: 서울반도체 주식회사
Priority date: 2009-03-31
Filing date: 2009-03-31
Publication date: 2010-10-08
Also published as: KR101537796B1

Abstract

The present invention provides a plurality of first lead frames spaced apart from each other in one direction, a plurality of second lead frames spaced apart from each other in another direction crossing the one direction, and insulation formed between the first and second lead frames. At least one light emitting chip connected to each of the first and second lead frames and the first and second lead frames and the light emitting chips integrally molded and fixed at a cross point between the layer and the first and second lead frames. It includes a molding part.

As described above, the present invention constitutes a matrix circuit for driving a plurality of light emitting chips by crossing the lead frames used as terminals for applying external power to the light emitting chips. Therefore, it is not necessary to use a separate circuit board, and the device can be miniaturized and slimmed.

Circuit Boards, Matrix, Light Emitting Diodes, Leadframes

Description

Light emitting device {LIGHT EMITTING PACKAGE}

The present invention relates to a light emitting device, and more particularly, to a light emitting device packaged by mounting a plurality of light emitting chips in a matrix circuit.

In general, a variety of light emitting chips are used in the light emitting device. For example, a light emitting diode (LED) generates a small number of carriers (electrons or holes) injected using a semiconductor pn junction structure, and is used to recombine them. It is an element using the phenomenon which emits light. Such light emitting diodes consume less power and have a lifetime of several to several tens of times compared to conventional light bulbs or fluorescent lamps, and are superior in terms of power consumption reduction and durability. In addition, it can be installed in a narrow space and has a strong resistance to vibration.

Since such light emitting diodes can irradiate light with high efficiency at low voltage, they are used in home appliances, electronic displays, display papers, and various automation devices. Recently, in accordance with the trend toward miniaturization and slimming of devices, light emitting diodes are also manufactured in a surface mount device (SMD) type to be directly mounted on a printed circuit board.

Typically, a light emitting device for a display is manufactured by packaging a plurality of light emitting diodes. In this case, in a packaging process using a plurality of light emitting diodes, a matrix-shaped driving circuit is formed on a printed circuit board, and then the light emitting diodes are mounted at their intersections. Thereafter, a cover having a plurality of light emitting holes corresponding to each light emitting diode is assembled, and then a molding liquid is injected into the inner space of the cover to integrally mold the printed circuit board, the light emitting chip, and the cover.

However, when the printed circuit board is used, molding holes for improving injection property and adhesion of the molding liquid must be formed in various places, thereby limiting the space for forming the matrix circuit. In addition, since the lead frame must be soldered to a part of the printed circuit board for the application of an external driving power source, the space for forming the matrix circuit is further limited. For this reason, there is a problem in that manufacturing costs are increased by using a multilayer printed circuit board, and it is difficult to miniaturize and slim the device.

The present invention has been made to solve the above problems, the light emitting device that can replace the conventional circuit board used for implementing the matrix circuit by configuring a matrix circuit for driving control of the light emitting elements in a lead frame To provide.

In addition, the present invention not only can reduce the cost by replacing the conventional circuit board with a lead frame, but also provides various types of packaging, and provides a light emitting device that is advantageous in miniaturization and slimming of the device.

A light emitting device according to an aspect of the present invention, a plurality of first lead frames spaced apart from each other in one direction; A plurality of second lead frames spaced apart from each other in another direction crossing the one direction; An insulating layer formed between the first and second lead frames; At least one light emitting chip connected to each of the first and second lead frames at an intersection point of the first and second lead frames; And a molding part for molding and fixing the first and second lead frames and the light emitting chip integrally. It includes.

The molding unit preferably includes a phosphor for converting the wavelength of light emitted from the light emitting chip.

At least one side of both ends of the first and second lead frames may extend outwardly of the molding part.

At least one side of both ends of the first and second lead frames may be extended vertically bent downward based on a horizontal plane on which the light emitting chip is mounted.

The light emitting device may further include a cover part having a plurality of light emitting holes corresponding to the plurality of light emitting chips.

The first lead frame may be disposed below the second lead frame, and a plurality of protrusions spaced apart from each other along a length direction may be formed on an upper surface of the first lead frame.

The upper surface of the protruding end may preferably have the same height as the upper surface of the second lead frame.

The present invention constitutes a matrix circuit for driving a plurality of light emitting chips by crossing the lead frames used as terminals for applying external power to the light emitting chips. Therefore, it is not necessary to use a circuit board separately to construct a matrix circuit, thereby reducing manufacturing costs.

Further, in the present invention, since the matrix circuit formed by crossing the lead frames with each other has an empty space between adjacent lead frames, the molding resin can be easily injected through the space. Therefore, the design of the matrix circuit can be simplified and the size can be further reduced, making the device smaller and slimmer.

Hereinafter, with reference to the accompanying drawings will be described an embodiment according to the present invention in more detail. It will be apparent to those skilled in the art that the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, It is provided to let you know. Like reference numerals in the drawings refer to like elements.

1 is a perspective view showing a light emitting device according to a first embodiment of the present invention, Figure 2 is an equivalent circuit diagram of a light emitting device according to a first embodiment of the present invention. 3 is a perspective view showing a frame portion of the light emitting device according to the first embodiment of the present invention, and FIG. 4 is a partial perspective view showing a light emitting chip mounted in region A of FIG.

1 to 4, the light emitting device includes a lead frame unit 100 constituting a matrix circuit M, a plurality of light emitting chips 200 connected to intersection points of the matrix circuit M, It includes a molding unit 400 for integrally molding the matrix circuit (M) and the light emitting chip (200). In addition, the light emitting device may further include a cover part 300 covering the outside of the matrix circuit M, the light emitting chip 200 and the molding part 400.

The lead frame unit 100 is a means for applying external power to each of the plurality of light emitting chips 200 as the plurality of light emitting chips 200 is mounted or electrically connected through the wires 210 and 220. A matrix circuit M for driving the 200 and a plurality of lead terminals T1 and T1 connected thereto are provided.

For example, the lead frame part 100 may be spaced apart from each other in one direction, for example, a plurality of first lead frames 110 spaced apart from each other in a lateral direction, and in another direction intersecting with the plurality of first lead frames 110. And a plurality of second leadframes 120. The first lead frame 110 is disposed to intersect the upper portion of the second lead frame 120, and each cross point constitutes a dot type matrix circuit (M). In this embodiment, the first and second lead frames 110 and 120 in a straight line are vertically intersected, and their spacings are equally arranged. Accordingly, each of the intersection regions P of the matrix circuit M defined by the two adjacent first lead frames 110a and 110b and the two adjacent second lead frames 120a and 120b has a rectangular shape. Is formed. Of course, the intersection area P is not limited to a quadrangular shape, and partially bends the first and second lead frames 110 and 120 and adjusts the crossing angle and the separation interval thereof, such as a rhombus, a pentagon, a hexagon, and the like. It can be formed in various shapes.

In addition, one end of each of the first and second lead frames 110 and 120 extending outward from the matrix circuit M is used as the lead terminals T1 and T2 for the application of external power. According to the present exemplary embodiment, one side of the first and second lead frames 110 and 120 is vertically bent downward based on a horizontal plane on which the light emitting chip 200 is mounted, and the bent end extends to a predetermined length to lead terminals T1. , T2).

Meanwhile, at least one surface of an upper surface of the first lead frame 110 and a lower surface of the second lead frame 120 which are in contact with each other is coated with an insulating layer (not shown), thereby crossing the first and second lead frames up and down. 110 and 120 are electrically insulated.

The light emitting chip 200 is a means for generating light by application of an external power source, and may be selectively selected from chips that emit light in the infrared region from the infrared region. The light emitting chip of this embodiment is manufactured in a chip on board (COB) type. Accordingly, the light emitting chip is mounted on the top surface of the first lead frame 110 and electrically connected to the first and second lead frames 110 and 120 through the first and second wires 210 and 220, respectively. The first and second wires 210 and 220 are formed of gold (Au) or aluminum (Al) through a process such as a wire bonding process. Of course, when one side electrode is formed on the bottom surface of the light emitting chip 200, and the one side electrode is electrically connected directly to the top surface of the first lead frame 110, only the other side electrode is formed through the second wire 220. 2 may be electrically connected to the lead frame 120.

Meanwhile, although the light emitting chips 200 of the present embodiment are mounted at all intersection points of the matrix circuit M, alternatively, the light emitting chips 200 may be selectively mounted only at some intersection points. For example, the light emitting chips 200 may be mounted in a zigzag form along a row or column direction so that a segment such as a letter may be easily displayed.

The cover part 300 includes a side wall part 310 and a front part 320 that cover the side and front surfaces of the lead frame part 100 forming the matrix circuit M, and has a box shape having a bottom surface open. type). In this case, the front part 320 is provided with a plurality of light emitting holes 321 for outputting light generated from each of the plurality of light emitting chips 200 to the outside. The light exit hole 321 may be formed such that the lower inlet is narrower than the upper inlet, and a reflective film (not shown) formed of a material having a high light reflectivity such as Ag or Al may be formed on the inner sidewall surface. Therefore, the light generated by the light emitting chip 200 may be controlled in the light collecting direction by the inner sidewall surface of the light exit hole 321, and the light emission efficiency may be further improved by the reflective film formed on the inner sidewall surface. Of course, the cover part 300 may be formed of a color material having a high light reflectance such as silver and white, thereby replacing the above reflective film.

The molding part 400 integrally molds the light emitting chip 200, the wires 210 and 220, and the lead frame part 100 assembled in the inner space of the cover part 300, thereby molding them into the inner space of the cover part 300. At the same time, the light emitting chip 200 and the peripheral spaces of the wires 210 and 220 are sealed to prevent disconnection and short-circuit of the wires 210 and 220 due to external contact, and the breakage of the light emitting chip 200 and deterioration of reliability. In the present exemplary embodiment, each of the light emitting chips 200 is mounted at respective intersections formed by the first and second lead frames 110 and 120, and then the cover part 300 is opened to cover the upper region. Subsequently, the molding resin is filled and cured in the inner space of the cover part 300 through the open lower surface of the cover part 300. In this case, the molding process is performed by blocking the light exit hole 321 of the cover part 300 using an adhesive tape or the like before filling the molding resin, and removing the adhesive tape after the molding resin is filled and cured. can do. In this case, the molding resin for forming the molding part 400 may be formed of a relatively high hardness and a transparent silicone resin or an epoxy resin. However, the present invention is not limited thereto, and any material may be used as long as the resin is transparent enough to transmit light depending on the use of the light emitting device. In addition, various types of phosphors (not shown) may be mixed with the molding resin to realize various colors by switching wavelengths of light emitted from the light emitting chip 200.

On the other hand, when the cover part 300 is unnecessary, in addition to the above-described molding method, the molding part 400 may be formed by a general molding method, for example, a transfer molding method or a dotting method, thereby forming a light emitting chip ( 200, the wires 210 and 220 and the lead frame unit 100 may be integrally fixed.

The lead frame unit 100 used in the light emitting chip package having such a configuration typically crosses the lead frames 110 and 120 used as lead terminals for applying external power to the light emitting chip 200 in different directions. The matrix circuit for driving the plurality of light emitting chips 200 is configured. Therefore, it is not necessary to use a circuit board separately to construct a matrix circuit, thereby reducing the manufacturing cost and making the device slim. In addition, since the matrix circuit formed by crossing the lead frames 110 and 120 cross each other, an empty space exists between adjacent lead frames 110 and 120, and thus molding resin can be easily injected through the space. Therefore, since it is not necessary to form a separate molding hole for injecting the molding resin into the circuit board as in the prior art, the design of the matrix circuit can be simplified. Therefore, the design of the matrix circuit can be simplified, and the size of the matrix circuit is small, which makes it easy to downsize the device.

&Lt; Embodiment 2 >

On the other hand, the lead frame portion used in the light emitting device according to the present invention is not limited to the above-described configuration, various embodiments are possible. Hereinafter, a light emitting chip package according to a second embodiment of the present invention will be described as an example of such a possibility. In this case, a description overlapping with the above-described embodiment will be omitted or briefly described.

5 is a perspective view illustrating a frame portion of a light emitting device according to a second exemplary embodiment of the present invention, and FIG. 6 is a partial perspective view illustrating a light emitting chip mounted in region B of FIG. 5.

5 and 6, a light emitting device according to a second exemplary embodiment of the present invention includes a lead frame unit 500 constituting a matrix circuit and a plurality of light emitting chips 600 connected to intersection points of the matrix circuit. It includes. Here, the light emitting chip 600 is manufactured in a COB type.

The lead frame unit 500 is a means for mounting a plurality of light emitting chips 600 and applying an external power to each light emitting chip 600, and a matrix circuit for driving the plurality of light emitting chips 600 and connected thereto. A plurality of lead terminals is provided. For example, the lead frame part 500 includes a plurality of first lead frames 510 spaced apart from each other in one direction, and a plurality of second lead frames 520 spaced apart from each other in another direction crossing the lead frames. . In this case, a plurality of protrusions 511 spaced apart from each other in the longitudinal direction are formed on the upper surface of the first lead frame 510. Each of the plurality of protruding ends 511 is provided between adjacent second lead frames 520a and 520b, and each of the plurality of protruding ends 511 has an upper surface thereof and an upper surface of the second lead frame 520. It is preferably formed to achieve the same height. As a result, horizontal steps between the top surface of the first lead frame 510 and the top surface of the second lead frame 520 are eliminated in the region where the light emitting chip 600 is to be mounted, so that the SMD type light emitting chip 600 may be easily mounted. Can be. That is, one electrode of the light emitting chip 600 is mounted on an upper surface of the protruding end 511 of the first lead frame 510, and the other electrode is mounted on an upper surface of the second lead frame 520. In this case, since the upper surface of the protruding end of the first lead frame 510 and the upper surface of the second lead frame 520 on which the two electrodes of the light emitting chip 600 are mounted are substantially the same, the two electrodes of the light emitting chip 600 are the same. The first and second leadframes 510 and 520 can make a smooth electrical connection.

As described above, the lead frame unit 500 used in the light emitting device according to the present invention crosses a plurality of lead frames 510 and 520 for applying external power to the plurality of light emitting chips 600 up and down to form a dot matrix circuit. Since it is configured as a conventional circuit board does not need a separate. In addition, since the protruding end 511 is formed on the upper surface of the lower lead frame 520, the horizontal step of the upper and lower lead frames 510 and 520 can be eliminated, so that not only the general COB type light emitting chip but also the SMD type light emitting chip can be easily Can be mounted

Meanwhile, in the above-described embodiments, the structure in which the lead frames are arranged to be bonded to the monochromatic dot matrix circuit is illustrated, but the present invention is not limited thereto, and the arrangement of the lead frames may vary depending on the use of the light emitting device. The arrangement structure can be variously changed. For example, a plurality of monochromatic dot matrix circuits may be composed of leadframes, and then, they may be superimposed up and down to form a full color dot matrix circuit, and image display instead of a matrix type suitable for character display. It is also possible to change the arrangement of the leadframes to a graphic type suitable for.

The present invention has been described above with reference to the foregoing embodiments and the accompanying drawings, but the present invention is not limited thereto, and is defined by the following claims. Therefore, it will be apparent to those skilled in the art that the present invention may be variously modified and modified without departing from the technical spirit of the following claims.

1 is a perspective view showing a light emitting device according to a first embodiment of the present invention;

2 is an equivalent circuit diagram of a light emitting device according to a first embodiment of the present invention.

3 is a perspective view showing a frame portion of the light emitting device according to the first embodiment of the present invention;

4 is a partial perspective view illustrating a light emitting chip mounted in region A of FIG. 3.

5 is a perspective view showing a frame portion of a light emitting device according to a second embodiment of the present invention;

100, 500: lead frame portion 110, 510: first lead frame

120, 520: second lead frame 200, 600: light emitting chip

300: cover 321: light exit hole

400: molding part M: matrix circuit

T1, T2: Lead terminal

Claims

A plurality of first lead frames spaced apart from each other in one direction;

A plurality of second lead frames spaced apart from each other in another direction crossing the one direction;

An insulating layer formed between the first and second lead frames;

At least one light emitting chip connected to each of the first and second lead frames at an intersection point of the first and second lead frames; And

A molding part which integrally molds and fixes the first and second lead frames and the light emitting chip; Light emitting device comprising a.

The method according to claim 1,

The molding unit includes a phosphor for converting the wavelength of the light emitted from the light emitting chip.

The method according to claim 1,

At least one side of both ends of the first and second lead frame extends to the outside of the molding portion.

The method according to claim 3,

At least one side of both ends of the first and second lead frames extends vertically bent downward based on a plurality of planes on which the light emitting chips are mounted.

The method according to claim 1,

And a cover part having a plurality of light emitting holes corresponding to the plurality of light emitting chips.

The method according to claim 1,

The first lead frame is disposed below the second lead frame,

And a plurality of protrusions spaced apart from each other along a longitudinal direction on an upper surface of the first lead frame.

The method according to claim 6,

The upper surface of the protruding end has the same height as the upper surface of the second lead frame.