KR20080053812A - Light emitting diode and light emitting module having the same - Google Patents

Abstract

A light emitting diode and a light emitting module having the same are provided to minimize color distribution according to luminous intensity and to maintain constantly a hue irrespective of electrical and optical characteristics. A light emitting element(100) has two or more kinds of wavelengths to emit light having a single wavelength. The light emitting element is coupled by using a die-bonding method. A gold wire(200) for electrical connection is used for performing a wire-bonding process. A light-transmitting type molding resin includes a photo-luminescence phosphor in order to obtain a hue of 480-490nm. One hue is obtained by molding the light-transmitting type molding resin. The light emitting element has the hue of 610-640nm.

Description

LIGHT EMITTING DIODE AND LIGHT EMITTING MODULE HAVING THE SAME}

1 is a perspective view illustrating a package of a light emitting diode according to an embodiment of the present invention.

2 is a perspective view illustrating a package of a light emitting diode according to another embodiment of the present invention.

3 is an internal circuit diagram of a light emitting module according to an embodiment of the present invention.

4 is a graph illustrating the performance of the LED according to the present invention.

5 is a flowchart illustrating a method of manufacturing a light emitting module according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100, 101: light emitting device 300: die adhesive

200: gold wire 400, 403: lead frame lead

500: transmissive molding encapsulant 600: reflector

The present invention relates to a light emitting diode and a light emitting module having the same, and more particularly, to a light emitting diode emitting white light and having a stable light emitting color reliability, and a light emitting module having the same.

In general, LEDs are manufactured to combine white, red, blue, and green colors, which are three primary colors of light, using the emission wavelength of the device itself to realize white or various colors.

However, the combination of the three colors appear in various ways depending on the unique characteristics of the light emitting device, there is a problem that the manufacturing cost is increased because it does not continuously implement the desired color.

In addition, a white or multi-color LED having a photoluminescent phosphor applied to a blue or ultraviolet light emitting device may have at least two or more kinds of light emitted through the photoluminescence, that is, to express three colors of red, blue, and green. By limiting the characteristics of the photoluminescent phosphor, the color change according to the content of the photoluminescent phosphor is widely distributed to the same level as the tricolor light emitting device, and it emits only a specific wavelength region than the tricolor light emitting device. There is a problem that can not implement the multicolor of the area.

Accordingly, the technical problem of the present invention is to solve such a conventional problem, and an object of the present invention is to provide a light emitting diode that emits white light produced in an improved yield while maintaining a constant color.

Another object of the present invention is to provide a light emitting module having the light emitting diode.

In order to realize the above object of the present invention, a light emitting diode according to an embodiment die-bonds light emitting devices having two or more wavelengths, each of which emits a single wavelength, and is wire-bonded with gold wire for electrical connection. Molding a light-transmitting molding resin containing a photoluminescent phosphor to produce a light emission color (HUE) of ˜490 nm to have one HUE, and one or more light emitting devices are manufactured so that a unique HUE is emitted as it is. It is designed to implement.

In one example, the one or more light emitting devices are configured to have a HUE of 610 ~ 640nm. The at least one light emitting device is characterized in that its own intrinsic wavelength of the at least one light emitting device is non-excitation or less reactive by a photoluminescent phosphor for implementing 480 to 490 nm.

For example, the light emission characteristic of the photoluminescent phosphor is configured to have one peak value and is manufactured to realize a HUE of 480 to 490 nm.

For example, the light emission characteristic of the photoluminescent phosphor is manufactured such that a width of a single wavelength HUE value of the light emitting device and a light emission HUE wavelength of the photoluminescent phosphor is emitted within a range of 85 nm or less.

For example, in the configuration to have two HUE values, each chip has an independent reflector so as to have a light transmissive molding resin containing a photoluminescent phosphor and a light transmissive molding resin not containing a photoluminescent phosphor. It is configured to be filled individually.

For example, the main wavelength region of the light emitting device (chip) used to emit two HUE colors is manufactured by applying a peak interval of at least 140 nm to each wavelength.

In one example, each light emitting device having two HUEs by containing a photoluminescent phosphor in the same package is circuited in series to emit light.

For example, the photoluminescent phosphors are contained in the same package, and have separate terminals to individually drive each light emitting device having two HUEs, and are manufactured to be driven in series in an external circuit.

For example, the white light emission color has a color temperature of 5,500 K or more.

In order to realize the above object of the present invention, a light emitting module according to an embodiment may include one or more single packages having an independent LED to be HUE of 480 to 490 nm, and another one or more single packages having an HUE of 610 to 640 nm. By using the light emitting device of the two HUE made of a white color by the combination of colors to achieve.

According to the light emitting diode and the light emitting module having the same, in overcoming the limitation of color reproduction emitted by the limited wavelength of the light emitting device and in implementing white light, the yield of the light emitting module is improved to maintain a constant color. It is possible to provide a light emitting module with extremely high luminous efficiency to replace next-generation CCFL, EEFL, OLED as well as white light with high color reproducibility.

Hereinafter, with reference to the accompanying drawings, it will be described in detail the present invention.

1 is a perspective view illustrating a package of a light emitting module according to an embodiment of the present invention. In particular, it is a perspective view of the LED which consists of a light emitting element which mixed the photoluminescent fluorescent substance so that light emission color (HUE) might be 480-490 nm, and a red light emitting element.

Referring to FIG. 1, the die adhesive 300 may include a light emitting device 101 having 610 to 640 nm and a photoluminescent phosphor on a semiconductor lead frame pad to emit a HUE of 480 to 490 nm. Dotting, die-bonding, hardening, and seating, and then electrically connecting the electrode to the lead frame leads 400-403 through the gold wire 200 through a wire bonder, and emitting 610-640 nm HUE in the connected state. The light emitting device is molded using a transmissive molding encapsulant, and the light emitting device dissipating 480 to 490 nm HUE is filled with a transmissive molding encapsulant 500 containing a photoluminescent phosphor and then sealed and trimmed and formed. Provided is a light emitting device having two HUEs individualized through a process.

As described above, in the present invention, LEDs are manufactured by die-bonding two or more kinds of light emitting elements in a plurality of rows of lead frames and electrically connecting the light emitting elements through gold wires in order to realize stable colors. Two or more kinds of light emitting devices provide two types of light emitting devices having a HUE of 480 to 490 nm and two types of HUE such that the HUE has a 610 to 640 nm. In implementing the 480-490nm HUE, the chip itself can be manufactured at 480-490nm.

In addition, in implementing a 480-490 nm HUE, a blue light emitting device of 440-470 nm is applied to apply a photoluminescent phosphor having uniform light emission characteristics inside the molding resin, so that the HUE of the light emitting device becomes 480-490 nm. As an LED that can be configured, by adjusting the brightness characteristics of the light emitting device having the HUE having two complementary colors, various colors can be realized as well as white light on a line connecting two HUEs with uniform color variation.

The present invention was invented to express a multi-color, such as white by the mixture of two types of LED, that is, HUE 480 ~ 490nm LED and 610 ~ 640nm LED, the implementation of 480 ~ 490nm LED by applying a photoluminescence phosphor It can be configured to have a wide wavelength band.

Therefore, by mixing and adjusting two types of HUEs in the color distribution of three common types (blue, green, and red), it is possible to provide LEDs with a constant color distribution.

In addition, by using LED chips such as AlInGaN, GaN, and InGaP as light emitting sources, chips having at least two band widths are combined to realize two HUE values. It can be manufactured in a large quantity with a certain color band.

In FIG. 1, the photoluminescent phosphor is applied to a separate reflector 600, but the photoluminescent phosphor may be molded integrally.

2 is a perspective view illustrating a package of a light emitting diode according to another embodiment of the present invention. In particular, it is a perspective view of a light emitting diode invented integrally by coating molding resins of two wavelength bands at a time.

Referring to FIG. 2, the die adhesive 300 combines a light emitting device 101 having a 610 to 640 nm and a photoluminescent phosphor on a semiconductor lead frame pad to emit a HUE of 480 to 490 nm. After bonding, die-bonding, curing, and seated, the light-emitting device electrically connects the electrode to the lead frame leads 400-403 through the wire bonder and emits 610-640 nm HUE in a connected state. The present invention provides a light emitting device having two HUEs, each of which is filled and sealed with a transmissive molding encapsulant 500 containing photoluminescent phosphors to emit 480-490 nm HUE to the package reflector. .

As described above, according to another embodiment of the present invention, by molding the photoluminescence phosphor integrally, it is possible to reduce the cost through the process simplification, and to minimize the ratio of the photoluminescence phosphor, The color deviation according to the content of the photoluminescent phosphor can be minimized.

3 is an internal circuit diagram of a light emitting module according to an embodiment of the present invention.

Referring to FIG. 3, a cathode of the first light emitting device 100 which is mixed with a photoluminescent phosphor and configured to have a HUE of 480 to 490 nm and a second light emitting device 101 that emits a HUE of 610 to 640 nm. It is composed in series by connecting anode to gold wire or external printed circuit board (PCB).

4 is a graph illustrating the performance of the LED according to the present invention. In particular, part of the CIE color coordinate system according to the brightness ratio of red is shown.

Referring to FIG. 4, an example of how much effect the two HUE LEDs provide compared to the tri-color LEDs using the general red, blue, and green colors is shown. When the light quantity of the general red light emitting device is increased by 0 to 20%, the CIE It shows how the color tone is changed in the coordinate system. In the embodiment using the two HUEs of the present invention, the CIE coordinate change is shown when the light quantity of the light emitting device having the HUE of 610 to 640 nm is increased to 0 to 35%. have.

Referring to FIG. 4, even when the amount of red light of the present invention is changed by 35%, the color change is not relatively large, and the same level of dispersion as the 20% light amount change of the method of using a three-color LED of general red, blue, and green colors is obtained. Have

That is, the general red, blue, and green tricolor light emitting devices change color coordinates sensitively to the change in the amount of light of the red light emitting device as shown in this graph, and the variation becomes more severe considering three components.

5 is a flowchart illustrating a method of manufacturing a light emitting diode according to an embodiment of the present invention.

Referring to FIGS. 1 and 5, the light emitting device 100 having 610 to 640 nm and the photoluminescent phosphor combined with the light emitting device 100 having a 610 to 640 nm are formed on the semiconductor lead frame pad. Dotting the adhesive 300 to die bonding (step S110).

Subsequently, the resultant product of step S110 is cured to mount the light emitting devices on the semiconductor lead frame pads (step S120).

Subsequently, the electrode is electrically connected to the lead frame leads 400 to 403 through the gold wire 200 through the wire bonder (step S130).

Subsequently, the light emitting device emitting 610 to 640 nm HUE is molded using a transmissive molding encapsulant, and the light emitting device emitting 480 to 490 nm HUE is filled with a transmissive molding encapsulant 500 containing a photoluminescent phosphor. To be sealed (step S140).

Subsequently, a light emitting device having two HUEs separated through trimming and forming processes is provided (step S150).

Subsequently, an electrical and optical test process of the manufactured light emitting devices is performed (step S150), and a taping and packaging process is performed on normal light emitting devices by the test (step S170).

As described above, according to the light emitting diode and the light emitting module having the same according to the embodiment of the present invention, the color distribution according to the brightness in the combination of the brightness of the light emitting diode and the color of the multicolor light emitting diode according to the change of current and voltage. It can be reduced to a minimum.

In addition, it is possible to maintain a constant color insensitive to the use environment and the light emitting electro-optical characteristics of the light emitting diode. In particular, LED chips such as AlInGaN, GaN, InGaP, etc. are used to combine two chips having at least two band widths to realize two HUE values. It can be manufactured in a large quantity with a certain color band.

In addition, as the color change according to the use environment is also reduced to two from the change factors coming from the three mixtures, the yield can be improved by 30% or more to improve the yield of the desired range by 30% or more. Accordingly, the manufacturing cost can be reduced, and a white LED having high reliability can be provided.

Although described above with reference to the embodiments, those skilled in the art can be variously modified and changed within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. I can understand.

Claims (11)

Light containing photoluminescent phosphors to die-bond light emitting devices having two or more wavelengths, each of which emits a single wavelength, and wire-bond with gold wire for electrical connection, and to emit a light emission color (HUE) of 480 to 490 nm. A process of molding a transmissive molding resin to have one HUE and one or more light emitting devices are manufactured so that a unique HUE is emitted as it is to produce two HUEs. The light emitting diode of claim 1, wherein the at least one light emitting element is configured to have a HUE of 610 nm to 640 nm. The method of claim 2, wherein the at least one light emitting device is characterized in that the non-excitation of the intrinsic wavelength of the at least one light emitting device by the photoluminescent phosphor for implementing 480 ~ 490nm (non-excitation) or less reaction Light Emitting Diode. The light emitting diode of claim 1, wherein the light emitting characteristic of the photoluminescent phosphor is configured to have a single peak value, and is configured to realize a HUE of 480 to 490 nm. The light emitting diode of claim 1, wherein the light emitting characteristic of the photoluminescent phosphor is a light emitting diode manufactured to emit light within a range of 85 nm or less between a single wavelength HUE value of the light emitting device and a light emitting HUE wavelength of the photoluminescent phosphor. . The optical transmissive molding resin containing the photoluminescent phosphor and the optical transmissive phosphor containing no photoluminescent phosphor according to claim 1, wherein each chip has an independent reflector. Light emitting diodes configured to individually fill molding resin. The light emitting diode of claim 1, wherein a main wavelength region of the light emitting device (chip) used to emit two HUE colors is applied by applying a peak spacing of at least 140 nm to each wavelength. The light emitting diode according to claim 1, wherein each light emitting element having two HUEs by containing photoluminescent phosphors in the same package is configured in series and emits light. The light emitting diode of claim 1, wherein photoluminescent phosphors are contained in the same package and have separate terminals to individually drive each light emitting device having two HUEs, and a light emitting diode made to be driven in series in an external circuit. . The light emitting diode of claim 1, wherein the white light emitting color has a color temperature of 5,500 K or more. Emitting white color with light color combinations using LEDs composed of one or more single packages to be HUE of 480 ~ 490nm and light emitting elements of two HUEs made of one or more independent packages with HUE of 610 ~ 640nm module.

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