KR100610272B1 - Multi Color LED With Wide Directivity Structure - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a white light emitting diode combining multi colors, and more particularly, to a multi calor light emitting diode structure having a constant wavelength conversion efficiency and having a wide direct angle. The multi-color light emitting diode structure includes a pair of red (Red) attached to each of the die pad portions 10a and 10b with adhesive on both ends of a lead frame having a reflective reflector structure, Or Yellow (Amber Color) LED chip (1) (1a), between the red (Red) or Amber (Amber Color) LED chip (1) (1a) Blue LED chip (2) (2a) ) And InGaN, GaN-based green (Cure Green Color) LED chip (515nm ~ 535nm) (3) bonded to the center and the blue LED chip (2) (2a) and green (Pure) Green: A light emitting diode having a common anode pad portion 11a for attaching the LED chip 3 to the sides of the green chip 3, blue and green. InGaN and GaN blue color LED chips (450 nm to 470 nm) (2) (2a) bonded to a common anode pad portion (11a) of Green, and their respective chips (1) (1a). (2) (2a) (3) to connect the gold wire (Gold Wire) (5) to form an electrode, Blue, Common Anode Pad part 11a of Pure Green and Common Anode Lead part of Red or Amber, Pure Green, and Blue chips ( 11) is composed of a gold wire (Gold Wire) (5a) for connecting, and a light transmissive epoxy (14) filled to allow light to pass through the reflective plastic reflector (13).

Accordingly, the present invention improves the constant wavelength conversion efficiency and forms a wide direct angle structure, thereby achieving economical use with low cost production, and improving the color diversity of the LED used as an auxiliary light source of BLU. While implementing, it improves productivity with simple structure.

Multi-Color, Light Emitting Diode, GaAs, AlGaAs, AlGaAsP-based Red (Red), Amber (Amber Color) LED Chip

Description

Multi Color LED With Wide Directivity Structure

1 is a planar cross-sectional view of a multi color side light light emitting diode according to the present invention;

2 is a front longitudinal cross-sectional view of a multi color side light light emitting diode according to the present invention;

3 is a side longitudinal sectional view of a multi-color side light light emitting diode according to the present invention;

4 is a bottom cross-sectional view of a multi color side light light emitting diode according to the present invention;

5 is a longitudinal cross-sectional view of main parts of a multi-color side light light emitting diode according to the present invention.

* Explanation of symbols for the main parts of the drawings *

1,1a: GaAs, AlGaAs, AlGaAsP-based red (Red), yellow (Amber Color) LED chip (605nm-640nm)

2,2a: InGaN, GaN-based Blue Color LED Chip (450nm ~ 470nm)

3: InGaN, GaN Pure Green Color LED Chip (515nm ~ 535nm)

5,5a, 51: Gold Wire

6: Common Cathode Lead of Red or Amber Color LED1, 2

7: Cathode lead of blue color LED 2

8: Lead part of Pure Green Color LED

9: Cathode lead of Blue Color LED 1

10: Cathode Lead of Red or Amber Color LED 1

10a: Anode Pad of Red or Amber Color LED 2

10b: Common Cathode Pad of Red or Amber Color LED 1

11,11a: Common Anode Lead of Red, Amber, Green, and Blue Chips

12: Jump Lead of Red or Amber Color LEDs 1 and 2

13: plastic

13a: plastic reflector

14: light transmissive epoxy resin

15: epoxy resin containing heat dissipation resin (SiO ₂ , TiO ₂ )

The present invention relates to a white light emitting diode in which multi colors are combined. More particularly, the present invention relates to a multi-color light emitting diode structure having a structure having a wide direct angle to improve a constant wavelength conversion efficiency and obtain a wide direct angle. It is about.

In general, a related art related to a method of manufacturing a white light emitting diode includes mounting an InGaN, GaN-based light emitting diode chip (430 nm to 470 nm, Blue LED) in a reflecting cup part, and then absorbing a part of the light to reflect the part of the reflecting cup part so that The method of obtaining white light by potting a photoluminescent phosphor having a wavelength and combining each of red, green, and blue LEDs is the most commonly used white light emission. Diode manufacturing method.

However, the method of obtaining white light by potting photoluminescent phosphors is very complicated. If the mixing ratio of the phosphors is not constant, staining occurs due to wavelength mismatch, and visibility is also reduced. The manufacturing process is very complicated and difficult because the products of different wavelengths are produced every time according to the ratio. In addition, there is a limitation that it is impossible to implement a variety of colors used as an auxiliary light source of the backlight unit (Back light Units) by implementing a single color.

In addition, the method of combining the red, green, and blue LEDs has a problem in that the assembly cost is high, the angle of inclination is very narrow, and the area is large when the set is applied. There is a limit in obtaining pure white light as a problem that cannot be precisely combined.

The present invention is to solve the problems of the conventional method of manufacturing a white light emitting diode, and to provide a multi-color light emitting diode structure having a structure of a wide direct angle to improve the constant wavelength conversion efficiency and obtain a wide direct angle. .

Another object of the present invention is to mount a low-cost light emitting diode chip on a reflector cup-shaped reflector lead frame pad surface, and then connect each electrode with a gold wire and mold with broad epoxy to drive high brightness and multicolor. The present invention provides a multicolor light emitting diode structure having a structure having a wide direct angle.

Technical features of the multi-color light emitting diode structure having a wide direct angle structure of the present invention for achieving this purpose, each die pad portion at both ends of the lead frame having a reflective reflector structure It consists of a pair of red and yellow color LED chips attached with adhesive to each other, and between the red and yellow color LED chips with a blue LED chip and an adhesive in the center Composed of bonded InGaN and GaN-based Pure Green Color LED chips (515nm to 535nm), common anode pads for attaching the Blue LED chip and the Pure Green LED chip In the light emitting diode having a portion, InGaN, GaN-based Blue Color LEDs adhered to anode pad portions for blue and green green on both sides of the green chip. Chips (450nm ~ 470nm) and Gold Wires that form electrodes for each chip Common Anode Pad for Blue, Green Green Chip and Common Anode with Red or Amber, Pure Green, and Blue Chip It is composed of gold wire connected to the lead part and light transmitting epoxy filled in the reflective plastic reflector part to transmit light.

According to another technical feature of the present invention, two red or yellow LED chips, two blue LED chips, and one green green LED chip may be packaged in the same planar package. And red or yellow LED chips, blue LED chips, and green green chips are applied to emit light at the same time with respect to the green green chip.

Another technical feature of the present invention is the cathode lead of each of the red or yellow LED chips 1 or the anode lead of the red or yellow chip 2. It is made by connecting jump lead to cathode lead or anode lead with plastic injection outer wall.

Another technical feature of the present invention is to expose the lower part of the injection plastic to the air in order to effectively disperse the heat generated by operating five or more chips in the same package (Package).

According to another technical feature of the present invention, an inside of a jump lead with an epoxy resin containing a heat dissipating resin (SiO ₂ , TiO ₂ ) to effectively dissipate heat generated by operating five or more chips in the same package. It is made up by filling the groove of.

Hereinafter, with reference to the accompanying drawings, the present invention will be described in detail.

1 is a planar cross-sectional view showing a multi color side light light emitting diode according to the present invention, FIG. 2 is a front longitudinal cross-sectional view of a multi color side light light emitting diode according to the present invention. 3 is a side cross-sectional view of a multi color side light light emitting diode according to the present invention, FIG. 4 is a bottom cross-sectional view of a multi color side light light emitting diode according to the present invention. FIG. 5 shows a main portion longitudinal cross-sectional view of a multi-color side light light emitting diode according to the present invention.

As shown in FIGS. 1 to 5, the present invention provides a pair of adhesives attached to respective die pad portions 10a and 10b at both ends of a lead frame having a reflective reflector structure. InGaN, GaN-based green (Pure Green Color) bonded with a blue LED chip (2) (2a) and the center of the center between the red (Red) or yellow (Amber Color) LED chip (1) (1a) It consists of an LED chip (515 nm-535 nm) (3).

In addition, as a light emitting diode having a common anode pad portion 11a for attaching the blue LED chip 2 and 2a and the green LED chip 3, Green InGaN, GaN-based Blue Color LED Chips (450nm to 470nm) bonded to Blue and Pure Green Common Anode Pads 11a on Both Sides of Chip 3 (2) (2a) and each of these chips (1) (1a) (2) (2a) (3) with gold wires (5) (5a) 51 forming electrodes Common anode pad part 11a for blue, green, and common anode leads for red, yellow, pure green, and blue chips It consists of a gold wire (5a) connecting the common anode (11) part 11 and a light transmissive epoxy (14) filled to allow light to pass through the reflective plastic reflector (13a). have.

Here, two red or yellow LED chips (1) (1a), two blue (LED) chips (2) (2a), and green (green) LED chips (3). One is attached to the package on the same plane, and the red LED chip (1) (1a) and the blue (LED) chip (2) (2a) are centered around the green LED chip (3). By applying current or voltage simultaneously to the Pure Green LED chip 3, a full color and a white light emitting diode can be obtained.

The cathode lead 10 of the red or yellow LED chip 1 and the cathode lead of the red or yellow LED chip 2 are connected to each other. To make the electrical connection, a jump lead (12) is made of an outer wall of plastic (13) and made to bend, and the cathode lead (8) and 9 are connected to the cathode lead (Cathode). It is made to create a lead.

In addition, in order to effectively dissipate heat generated by operating five or more chips in the same package, the lower portion of the injection-plastic 13 is exposed to the air to increase the heat dissipation effect.

Meanwhile, in order to effectively disperse heat generated by operating five or more chips in the same package, a groove inside the jump lead 12 is filled with an epoxy resin 15 containing a heat-resistant resin (SiO ₂ , TiO ₂ ). Is done.

As described above, the present invention provides a relatively low-cost GaAs, AlGaAs, AlGaAsP-based red (Red) or yellow (Amber Color) (605nm-640nm) light emitting diodes of at least one chip, InGaN, GaN-based green (Pure Green Color) Reflector leadframe with at least one LED chip (515nm to 535nm) and one or more InGaN and GaN blue color LED chips (450nm to 470nm). After mounting on the pad surface, each electrode is formed of gold wire, and then the white light emitting diode and multi color of the structure obtained by molding with a light-transmissive epoxy are driven to back light units. It can realize the color variety of LED used as an auxiliary light source.

As described above, the present invention improves the wavelength conversion efficiency and forms a wide direct angle structure having a wide direct angle, thereby achieving economical use with low cost production, and being used as an auxiliary light source for back light units. It is possible to improve productivity with a simple structure while implementing a variety of colors, and the effect of simultaneously implementing multi-color and white light emitting diodes that can realize various colors in one package can be obtained.

Claims (5)

     One red or yellow color LED chip 1 attached to each die pad portion 10a by an adhesive to a lead frame having a reflective reflector structure, and the red InGaN, GaN-based green (Pure) bonded with a blue LED chip (2) next to a (Red) or Amber Color LED chip (1) and an adhesive next to the blue LED chip (2) Green Color) LED chip (515nm to 535nm) (3), common anode pad part 11a and red or yellow, for blue, pure green chip, In the multi-color or white light emitting diode which is composed of a gold wire (5a) that connects the green and blue chips to the common anode lead portion 11, ,       One red (Amber Color) LED chip (1), another red (Red) or yellow (Amber Color) LED chip (1a) and a blue (Blue) LED chip (2) and another Consists of an InGaN, GaN-based Pure Green LED chip (515 nm to 535 nm) (3) bonded with an adhesive between a blue LED chip (2a) and the blue LED chip (2) (2a). And the common anode pad portion 11a for attaching the blue color LED chip 2 and the green LED chip 3 to the green color. (Pure Green) InGaN, GaN-based Blue Color LEDs bonded to both sides of the common anode lead portion 11a for blue and green green on both sides of the LED chip 3 Gold Wire (5) (5a) to form electrodes on chips (450 nm to 470 nm) (2) (2a) and their respective chips (1) (1a) (2) (2a) (3) And a light-transmitting epoxy 14 filled with a reflective plastic reflector portion 13a to allow light to pass therethrough. Multicolor light emitting diode structure having a group. (delete) The method of claim 1, Cathode leads 10 of the respective red or yellow LED chips 1 or anode leads of red or yellow LED chips 2 Jump lead (12) is made of plastic (13) ejection outer wall to connect with 10a), which is one of cathode lead (8) (9) and anode lead (Anode lead). A multicolored light emitting diode structure having a structure of a wide directing angle, characterized in that the connection is made to. The method of claim 1, In order to effectively dissipate the heat generated by operating five or more chips in the same package, the lower portion of the injection plastic 13 is exposed to the atmosphere. Having a multicolor light emitting diode structure. The method of claim 4, In order to effectively disperse heat generated by operating five or more chips in the same package, the internal grooves of the jump leads 12 are formed by epoxy resins 15 containing heat-resistant resins (SiO ₂ , TiO ₂ ). A multicolor light emitting diode structure having a structure having a wide direct angle, characterized in that the filling.

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