KR20080074321A

KR20080074321A - White led which is used red, green, blue chip and phosphor

Info

Publication number: KR20080074321A
Application number: KR20070013197A
Authority: KR
Inventors: 정화균
Original assignee: 주식회사 파워라이텍
Priority date: 2007-02-08
Filing date: 2007-02-08
Publication date: 2008-08-13

Abstract

A red, green and blue LED(light emitting diode) chips are provided to reduce fabricating cost and investment by eliminating the necessity of a diffusion agent and a diffusion unit. A leadframe is composed of more than one pair of anode leadframes(51,52,53) and cathode leadframes(41,42,43). Die attach parts(21,22,23) attach an LED chip to the inside of the cathode leadframes. A reflection plate(92) is composed of thermoplastic resin and a leadframe reflection cup(C) for inserting a chip to the upper portion of the die attach part. Red, blue and green LED chips(10a,10b,10c) are attached to a die pad reflection cup of the leadframe. The LED chips are conducted by gold wire. Phosphor-including epoxy resin is formed in the thermoplastic resin reflection cup. The red chip can emit light having a wavelength of 615-635 nm. The green chip can emit light having a wavelength of 515-535 nm. The blue chip can emit light having a wavelength of 430-470 nm. The phosphor-including epoxy rein can emit layer having a wavelength of 560-620 nm.

Description

White LED which is used red, green, blue chip and phosphor}

도 1a,1b는 종래의 적색(Red),, 녹색(Green), 청색(Blue) 파장을 이용한 발광다이오드 소자를 도시한 정면도, 측면도이고,1A and 1B are front and side views of a light emitting diode device using conventional red, green, and blue wavelengths.

도 2a,2b는 본 발명에 의한 발광다이오드의 요부 정면도, 단면도이고,2A and 2B are principal part front and sectional views of a light emitting diode according to the present invention;

도 3a,3b는 본 발명에 의한 다른 실시예의 발광다이오드 요부 정면도, 단면도이고,3A and 3B are front and sectional views of a main part of a light emitting diode of another embodiment according to the present invention;

도 4a,4b는 본 발명에 의한 또 다른 실시예의 발광다이오드 요부 정면도, 단면도이고,4A and 4B are front and cross-sectional views of a main part of a light emitting diode of another embodiment according to the present invention;

도 5a,5b는 본 발명의 또 다른 실시에 따른 발광다이오드 요부 정면도, 단면도이고,5A and 5B are front and sectional views of a main part of a light emitting diode according to still another embodiment of the present invention;

- 도면 중 주요부분에 대한 부호의 설명--Explanation of the codes for the main parts of the drawings-

10a : 녹색(Green)발광 다이오드 칩(Green Chip) 10a: Green light emitting diode chip

10b : 적색(Red)발광다이오드 칩(Red Chip)10b: Red light emitting diode chip

10c : 청색(Blue)발광다이오드 칩(Blue Chip)10c: Blue light emitting diode chip (Blue Chip)

11 : 골드 와이어 11: gold wire

21 : 녹색(Green)발광다이오드 칩접착(Die Attach)부 21: Green light emitting diode chip attach portion

22 : 적색(Red)발광다이오드 칩접착(Die Attach)부22: Red light emitting diode chip attach portion

23 : 청색(Blue)발광다이오드 칩접착(Die Attach)부23: Blue light emitting diode chip attach portion

31 : 녹색(Green) 발광다이오드 골드와이어 접착(Attach)부 31: Green light emitting diode gold wire adhesive part

32 : 적색(Red) 발광다이오드 골드와이어 접착(Attach)부32: red light emitting diode gold wire attachment portion

33 : 청색(Blue) 발광다이오드 골드와이어 접착(Attach)부33: Blue light emitting diode gold wire attachment portion

4 : 음극리드(Cathode Lead)부4: Cathode Lead

41 : 녹색(Green) 발광다이오드 음극리드부41: green light emitting diode cathode lead portion

42 : 적색(Red) 발광다이오드 음극리드부42: red light emitting diode cathode lead portion

43 : 청색(Blue) 발광다이오드 음극리드부43: blue light emitting diode cathode lead portion

5 : 양극리드(Anode Lead)부5: Anode Lead Part

51 : 녹색(Green) 발광다이오드 양극리드(Anode Lead)부51: green light emitting diode anode lead portion

52 : 적색(Red) 발광다이오드 양극리드(Anode Lead)부52: red light emitting diode anode lead portion

53 : 청색(Blue) 발광다이오드 양극리드(Anode Lead)부53: blue light emitting diode anode lead portion

C : 리드프레임컵(Lead Frame Cup)C: Lead Frame Cup

91 : 발광소자의 밑면 사출 수지(열경화성,열가소성수지)91: Injection resin of the bottom of the light emitting device (thermosetting, thermoplastic resin)

92 : 발광소자의 윗면 사출 반사판(Reflector)92: reflector on top of the light emitting device

93 : 형광체 포함한 사출 재질93 injection material including phosphor

15a : 형광체형 에폭시 수지15a: phosphor type epoxy resin

15b : 광투과형 에폭시 수지15b: light transmitting epoxy resin

본 발명은 발광다이오드의 개량에 관한 것으로서, 더욱 상세하게 본 발명은 적색(Red), 녹색(Green), 청색(Blue) 3가지 파장을 갖는 칩(Chip)을 이용하여 고휘도 백색 발광다이오드를 구현하는 것이다.The present invention relates to an improvement of a light emitting diode, and more particularly, to a high brightness white light emitting diode using a chip having three wavelengths of red, green, and blue. will be.

일반적으로 발광다이오드는 전기적인 신호를 받아 광학적 신호로 변경해 주는 역할을 하는데, 이때 전기적 신호가 가해지면 발광다이오드 칩(Chip)은 빛을 발산한다. 칩의 종류에 따라 청색(Blue), 적색(Red), 녹색(Green)의 발광파장을 발산하는데 이 3가지 파장의 빛을 동시에 발광시키면 백색이 구현이 된다. 이때, 3가지의 파장이 골고루 섞이어 순백색의 발광다이오드 구현하기 위해선 발광다이오드 팩키지(Package) 위에 픽싱(Mixing)하는 별도의 기구 또는 렌즈(Lens)을 사용하여야 하는데 이는, 결국 발광다이오드 소자의 가격 및 두께를 상승시키는 문제점을 유발한다.In general, the light emitting diode receives an electric signal and converts the light into an optical signal. When the electric signal is applied, the light emitting diode chip emits light. Depending on the type of chip, blue, red, and green light emitting wavelengths are emitted. When the light of these three wavelengths is emitted at the same time, white is realized. In this case, in order to achieve a pure white light emitting diode by mixing three wavelengths evenly, a separate device or lens for fixing on the light emitting diode package must be used, which means that the price of the light emitting diode device and It causes the problem of raising the thickness.

또한, 레드, 녹색, 청색 발광 파장을 섞어주기 위해선 일반적으로 녹색은 20mA을 인가해주고, 적색은 10mA정도를 인가해주고, 청색은 5mA정도를 인가해 주기에 전체적으로 저 전류로 사용함으로써 백색을 구현할 때 발광효율을 충분히 내주지 못하여 고 휘도를 구현하기 어렵다. In addition, in order to mix red, green, and blue emission wavelengths, green applies 20 mA, red applies about 10 mA, and blue applies about 5 mA. It is difficult to realize high luminance because it does not give enough efficiency.

본 발명은 이와 같은 것을 해결하기 위하여 안출된 것으로서, 적색(Red), 녹색(Green), 청색(Blue) 광자의 효율을 최대한으로 이용하면서 적색, 녹색, 청색광자의 효율적으로 혼합해 주기 위한 별도의 구성장치 없이 고 효율의 적색, 녹색, 청색을 이용한 백색(Flat Lead)발광다이오드 소자를 제공하는데 있다.The present invention has been made to solve such a problem, and a separate configuration for efficiently mixing red, green, and blue photons while maximizing the efficiency of red, green, and blue photons. It is to provide a flat lead light emitting diode device using high efficiency red, green, and blue without a device.

본 발명의 다른 목적은 적색, 녹색, 청색광자를 혼합해 주기 위한 별도의 혼합 기구 부를 삭제함으로써 제조공정을 줄일 수 있는 발광다이오드 소자를 제공할 수 있다. Another object of the present invention can provide a light emitting diode device that can reduce the manufacturing process by eliminating a separate mixing mechanism for mixing red, green, blue photons.

상기 목적을 달성하기 위한 본 발명에서는 먼저 반사시킬 수 있는 열가소성 수지로 반사판(Reflector)을 만들어, 이 반사판 내부의 발광다이오드 다이 패드컵부에 적색, 녹색, 청색의 3개의 파장을 갖는 칩(Chip)을 다이 본딩·와이어본딩하고, 반사판(92) 내부에 형광체형 에폭시 수지(15a)를 채운 후 트리밍 공정을 통하여 개별화 함으로서, 적색, 녹색, 청색의 빛에 3원 색을 발광하고 형광 에폭시 수지 부(15a)를 통과하면서 백색광을 낸다. 이때, 적색, 녹색, 청색을 동일 정격인 20mA씩을 인가해 줌으로서 고 전류에서 백색광을 얻고 별도의 확산기구를 갖지 않아도 되는 고 휘도의 백색 발광다이오드 소자를 제공하려는 것이다. In the present invention for achieving the above object, a reflector is first made of a thermoplastic resin that can be reflected, and a chip having three wavelengths of red, green, and blue is formed in the light emitting diode die pad cup inside the reflector. By die-bonding and wire-bonding and filling the phosphor-type epoxy resin 15a in the reflector plate 92 and then individualizing it through a trimming process, the primary colors are emitted to red, green, and blue light, and the fluorescent epoxy resin portion 15a White light is emitted through). In this case, by applying red, green, and blue, which are equally rated, each 20 mA, a high brightness white light emitting diode device having white light at a high current and having no separate diffusion mechanism is provided.

이때, 적색칩(Red Chip)(10b)은 615nm∼635nm 파장을 발광하고, 녹색칩(Green Chip)(10a)은 515∼535nm 파장을 발광하고, 청색칩(Blue Chip)은 430nm∼470nm 파장을 발광하고, 형광형에폭시수지(15b)는 560nm∼620nm 파장으로 변환해 주는 특징으로 별도의 확산기를 갖지 않고도 고휘도를 실현함과 동시에 제조 수율의 향상으로 생산량 증대를 이룰 수 있도록 한다.At this time, the red chip 10b emits a wavelength of 615nm to 635nm, the green chip 10a emits a wavelength of 515nm to 535nm, and the blue chip emits a wavelength of 430nm to 470nm. It emits light and the fluorescent epoxy resin 15b converts to a wavelength of 560 nm to 620 nm, thereby realizing high brightness without having a separate diffuser and increasing production yield by improving production yield.

이하, 첨부된 도면에 의하여 본 발명을 상세하게 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 2a,2b는 본 발명에 의한 발광다이오드를 요부 정면도, 단면도로써 리드프레임 다이패드부(21,22,23)에 칩(Cup)(C)을 삽입하여 발광다이오드칩(10a,10b,10c)을 부착하여 주고 , 사출 반사판(92)을 만들어 주고 이 사출 반사판(92) 내부에 형광에폭시 수지(15a)로 구성되어 있다.2A and 2B illustrate a front view and a cross-sectional view of a light emitting diode according to the present invention, in which chips C are inserted into lead frame die pad portions 21, 22, and 23, respectively. ), An injection reflection plate 92 is formed, and the injection reflection plate 92 is formed of a fluorescent epoxy resin 15a.

도 3a,3b는 본 발명의 또 다른 실시 예의 요부 정면도, 단면도로서 리드프레임 다이패드부(21,22,23)에 칩(Cup)(C)을 삽입하여 발광다이오드칩(10a,10b,10c)을 부착하여 주고 , 플라스틱으로 사출 반사판(92)을 만들어 주고 이 사출 반사판(92) 내부에 에폭시 수지(15b)와 에폭시 수지부(15b) 상측에 형광 에폭시 수지(15a)로 구성되어 있다.3A and 3B are front and sectional views of still another embodiment of the present invention, wherein the chip C is inserted into the lead frame die pad portions 21, 22, and 23 so that the light emitting diode chips 10a, 10b, and 10c are shown. ), An injection reflection plate 92 is made of plastic, and the injection reflection plate 92 is formed of an epoxy resin 15b and a fluorescent epoxy resin 15a above the epoxy resin portion 15b.

상기, 음극 양극 리드프레임 패드부(21,22,23)(31,32,33)의 상측에 리드프레임 반사컵부(C)와 열가소성수지로 반사판(92)을 만들고 있다.The reflective plate 92 is made of the lead frame reflecting cup portion C and the thermoplastic resin on the cathode anode lead frame pad portions 21, 22, 23, 31, 32, and 33.

또한, 리드프레임 부분의 다이패드반사컵(C) 부분에는 발광다이오드의 칩(10a,10b,10c)를 부착하고 있으며, 상기 양극, 음극 리드프레임 리드부(41,42,43) (51,52,53)와 발광다이오드 칩(10a,10b,10c)의 통전을 위한 통전 와이어(11)와, 열가소성수지, 열경화성수지 반사컵(92) 내부에 투과형 에폭시 수지(15b)와 투과형 에폭시 수지(15b) 상단에 형광형 에폭시 수지(15a)로 발광다이오드 소자를 구비하고 있다.In addition, the chip pads 10a, 10b, and 10c of the light emitting diodes are attached to the die pad reflecting cup C portion of the lead frame portion, and the positive and negative lead frame lead portions 41, 42, 43 (51, 52). 53 and a conducting wire 11 for energizing the LED chips 10a, 10b, and 10c, and a transmissive epoxy resin 15b and a transmissive epoxy resin 15b in the thermoplastic resin and thermosetting resin reflecting cup 92. The light emitting diode element is provided in the upper part with the fluorescent epoxy resin 15a.

여기서 상기 리드프레임 반사컵(C)이 없는 발광다이오드 소자를 구현할 수 있을 것이다.Here, the light emitting diode device without the leadframe reflecting cup C may be implemented.

여기서 상기 열가소성수지, 열경화성수지 반사컵(92) 부분이 없이 형광체형에폭시수지(15a)로 몰드 되어진 발광다이오드 소자를 구현할 수 있을 것이다.Here, the light emitting diode device molded from the phosphor-type epoxy resin 15a without the thermoplastic resin and the thermosetting resin reflection cup 92 may be realized.

도 4a,4b는 본 발명의 또 다른 실시에 따른 도면으로 요부 정면도, 단면도로서 리드프레임다이패드부(21,22,23)에 칩(Cup)(C)을 삽입하여 발광다이오드칩(10a,10b,10c)을 부착하여 주고 , 형광체를 삽입한 플라스틱으로 형광 사출 반사판(93)을 만들어 주고 이 형광 사출 반사판(93) 내부 하측에 형광 에폭시 수지(15a)와 형광에폭시 수지부(15a) 상측에 투과형 에폭시 수지(15b)로 구성되어 있다.4A and 4B illustrate a front view and a cross-sectional view of a main part according to another embodiment of the present invention, in which chips C are inserted into lead frame die pad portions 21, 22, and 23, respectively. 10b and 10c are attached to each other, and a fluorescent injection reflector 93 is made of plastic having phosphors inserted thereon, and a fluorescent epoxy resin 15a and a fluorescent epoxy resin 15a are disposed on the lower side of the fluorescent injection reflector 93. It consists of the transmissive epoxy resin 15b.

도 5a,5b는 본 발명의의 또 다른 실시에 따른 도면으로 리드프레임의 하측면(발광다이오드 칩과 반대 평면상)에 에칭 또는 스탬핑으로 하프 커팅하여 두께를 줄여주고 리드프레임의 상측면(발광다이오드 칩과 동일 평면상)에 발광다이오드 칩(10a,10b,10c)을 부착하여 주고, 칩 간에 골드와이어로 전극을 형성시켜 주고, 형광형 에폭시수지(15a)로 몰드하여 2단자로 적색, 녹색, 청색 칩을 동시 구동하는 백색 발광다이오드를 나타내고 있다.5A and 5B are drawings according to still another embodiment of the present invention to reduce the thickness by half-cutting by etching or stamping the lower side (on the plane opposite to the LED chip) of the lead frame and reducing the thickness of the upper side of the lead frame (LED) Attaching the light emitting diode chips 10a, 10b, 10c to the same plane as the chip, forming electrodes with gold wires between the chips, and molding with fluorescent epoxy resin 15a to red, green, The white light emitting diode which drives blue chips simultaneously is shown.

이와 같은 구성으로 이루어지는 본 발명은 먼저 반사시킬 수 있는 열가소성 수지로 반사판(Reflector)(92)을 만들어, 이 반사판(92) 내부의 발광다이오드 다이 패드컵부(c)에 적색(10b), 녹색(10a), 청색(10c)의 3개의 파장을 갖는 칩을 다이 본딩·와이어본딩을 하고, 반사판(92) 내부에 형광체형 에폭시 수지(15a)를 채 운 후 트리밍 공정을 통하여 개별화 함으로서, 적색, 녹색, 청색의 빛에 3원색을 발광하고 형광 에폭시 수지 부(15a)를 통과하면서 백색광을 낸다. 이때, 적색, 녹색, 청색을 동일 정격인 20mA씩을 인가해 줌으로서 고 휘도를 구현함과 동시에 형광에폭시 수지(15a)가 빛의 삼원색이 골고루 섞이는 확산제 역할을 해 줌으로서 순수한 고 휘도 백색광을 얻을 수 있는 효과가 있다. According to the present invention having such a configuration, a reflector 92 is made of a thermoplastic resin that can be reflected first, and a red (10b) and a green (10a) are formed on the light emitting diode die pad cup part (c) inside the reflector (92). ), Die-bonding and wire-bonding chips having three wavelengths of blue (10c), filling the phosphor-type epoxy resin (15a) inside the reflector plate 92, and then individualizing them through a trimming process. Three primary colors are emitted to blue light and white light is emitted while passing through the fluorescent epoxy resin portion 15a. In this case, high luminance is realized by applying 20 mA of equal ratings to red, green, and blue, and at the same time, the fluorescent epoxy resin 15a serves as a diffuser in which the three primary colors of light are evenly mixed to obtain pure high luminance white light. It can be effective.

이로써 통상적으로 적색, 녹색, 청색(Red, Green, Blue)인 빛의 삼원색으로 구현하는 백색광은 저 전류로 구동함으로써 백색광을 얻으며, 또한 별도의 확산제나 믹싱(Mixing) 해주는 별도기구를 구비하는 단점이 있으나, 본 발명은 이러한 문제를 해결하고자 형광에폭시 수지(15a)를 확산제 역할과 청색, 녹색 광자효율을 증가시켜 고 전류에서 백색광을 얻고 별도의 확산기구를 갖지 않아도 되는 고휘도의 백색 발광다이오드 소자를 제공하게 된다. As a result, the white light, which is usually implemented as three primary colors of red, green, and blue (red, green, and blue), obtains white light by driving with a low current, and also has a disadvantage of having a separate diffuser or a separate device for mixing. However, in order to solve this problem, the present invention uses a fluorescent epoxy resin (15a) as a diffuser and increases the blue and green photon efficiency to obtain white light at a high current and does not have a separate diffuser. Will be provided.

이상에서 설명한 본 발명은 전술한 실시 예와 도면에 의해 한정되는 것은 아니고, 본 발명의 기술적 사상을 벗어나지 않은 범위 내에서 여러 가치 치환, 변형 및 변경 가능함은 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자에게 있어 명백할 것이다.The present invention described above is not limited to the above-described embodiments and drawings, and various value substitutions, modifications, and alterations can be made without departing from the spirit and scope of the present invention. It will be clear to those who have it.

위와 같은 공정으로 제작되어진 적색, 녹색, 청색의 빛을 3원색을 이용하여 만드는 백색 발광다이오드는 별도의 확산제 및 확산기구를 삭제할 수 있어 제조 원가 절감과 공정 투자 비용을 줄여주는 효과가 있다. 또 다른 특징으로는 통상의 적색, 녹색, 청색의 빛을 3원 색을 이용하여 만드는 백색 발광다이오드는 녹색은 20mA을 인가하고, 적색은 10mA를 인가하고, 창색은 5mA를 인가하여 빛의 3원 색을 정적히 혼합하여 백색광을 얻는데, 이때의 적색이나 청색 광자는 효율의 50%이하와 25%이하만을 이용하기에 고휘도를 구현하기 어렵다. 이에 본 발명에서는 형광체형 에폭시 수지를 사출 반사컵 내부 또는 사출반사컵 내부 또는 에폭시 수지 상측면에 형광체 에폭시 수지부를 삽입하는 공정을 통하여 청색 광자를 부루쉬화이트(Bluish White) 광자로 변환해 주고 녹색 광자는 그린쉬화이트(Greenish White) 광자로 변환해주고, 적색광자는 앰버(Amber) 광자로 변환해 줌과 동시에 적색이나 청색을 녹색과 같이 20mA까지 인가하여 줌으로서 발광효율을 극대화할 수 있는 효과가 있다.The white light emitting diodes using the three primary colors of red, green, and blue light produced by the above process can eliminate additional diffusion agents and diffusion mechanisms, thereby reducing manufacturing costs and reducing process investment costs. Another feature is that the white light-emitting diodes that make up the normal red, green, and blue light using the three-element color apply 20 mA for green, 10 mA for red, and 5 mA for the window color. Static light is mixed to obtain white light. In this case, red or blue photons use only 50% or less of efficiency and 25% or less of efficiency, so it is difficult to realize high brightness. Accordingly, the present invention converts the blue photon into a bluish white photon through the process of inserting the phosphor epoxy resin into the inside of the injection reflection cup, the inside of the injection reflection cup, or the upper surface of the epoxy resin. Photons are converted to Greenish White photons, and red photons are converted to amber photons, while red or blue is applied up to 20mA like green to maximize luminous efficiency. .

Claims

A lead frame including one or more pairs of anode lead frames 51, 52, and 53 and cathode lead frames 41, 42, and 43, and the cathode anode lead frames 41, 42, 43, a die attach portion 21, 22, 23 (31, 32, 33) for attaching a light emitting diode chip inside the 51, 52, 53, and the chip adhesive portion 21, 22, 23, the lead frame reflecting cup portion (C) to insert the chip on the upper side, the reflector plate 92 made of thermoplastic resin, and the red, blue, green attached to the die pad reflecting cup (C) portion of the lead frame portion (Red, Blue, Green) inside the chip 10a, 10b, 10c of the light emitting diode, the gold wire 11 for energizing the light emitting diode chip 10a, 10b, 10c, and the thermoplastic reflector cup 92 A white light emitting diode device using red, green, and blue chips made of a fluorescent epoxy resin (15a) containing phosphors and a fluorescent epoxy resin.

The method according to claim 1,

The white light emitting diode device using the red, green, blue chip and the fluorescent epoxy resin without the lead frame reflection cup (C).

The method according to claim 1,

The red chip 10b emits a wavelength of 615nm and 635nm, the green chip 10a emits a wavelength of 515-535nm, and the blue chip emits a wavelength of 430nm-470nm, and the fluorescent type Epoxy resin (15b) is a white light emitting diode device using a red, green, blue chip and a fluorescent epoxy resin characterized in that the conversion to the wavelength of 560nm ~ 620nm.

A lead frame including one or more pairs of anode lead frames 51, 52, and 53 and cathode lead frames 41, 42, and 43, and the cathode anode lead frames 41, 42, 43) (Die Attach) 21, 22, 23 (31, 32, 33) for attaching the light emitting diode chip to the inside of (51, 52, 53), and the chip adhesive (21, 22, 23). Red and blue attached to the lead frame reflecting cup portion (C) and the reflector plate (92) made of thermoplastic resin, and the die pad reflecting cup (C) portion of the lead frame portion to insert a chip on the upper side of the And the gold wires 11 for energizing the chips 10a, 10b and 10c of the green light emitting diodes, the anode and cathode lead frames 5 and 4 and the light emitting diode chips 10a, 10b and 10c. The red, green, and blue chips and molds are made of an epoxy resin 15b in the resin reflecting cup 92 and a fluorescent epoxy resin 15a including phosphors on the upper side of the epoxy resin 15b. White light emitting diode device using optical epoxy resin.

The method according to claim 4,

The red chip 10b emits a wavelength of 615 nm to 635 nm, the green chip 10a emits a wavelength of 515 nm to 535 nm, and the blue chip emits a wavelength of 430 nm to 470 nm. The fluorescent epoxy resin (15b) is a white light emitting diode device using a red, green, blue chip and a fluorescent epoxy resin, characterized in that the conversion to a wavelength of 560nm to 620nm.

A lead frame including one or more pairs of anode lead frames 51, 52, and 53 and cathode lead frames 41, 42, and 43, and the cathode anode lead frames 41, 42, 43 chip bonding portions 21, 22, 23 (31, 32, 33) for attaching the light emitting diode chip inside the 51, 52, 53, and chips above the chip bonding portions 21, 22, 23; Red, blue, and green light emitted from the lead frame reflecting cup portion (C) to be inserted and the reflecting plate 93 made of a phosphor-type thermoplastic resin containing phosphor, and the die pad reflecting cup (C) portion of the lead frame portion. Gold wires 11 for energizing the diode chips 10a, 10b and 10c, the anode and cathode lead frames 5 and 4 and the light emitting diode chips 10a, 10b and 10c, and phosphor-type thermoplastic resins. A red and green color comprising a fluorescent epoxy resin 15a inside the reflecting cup 93 and an epoxy resin 15b on the upper side of the fluorescent epoxy resin 15a. , White light-emitting diode device using a blue chip and fluorescent-type epoxy resin.

The method according to claim 6,

The red chip 10b emits a wavelength of 615 nm to 635 nm, the green chip 10a emits a wavelength of 515 nm to 535 nm, and the blue chip emits a wavelength of 430 nm to 470 nm. And the fluorescent injection material (93) and the fluorescent epoxy resin (15a) are replaced with a wavelength of 560 nm to 620 nm. A white light emitting diode device using red, green, blue chips and fluorescent epoxy resins.

A lead frame including at least one pair of anode lead frame 5 and cathode lead frame 4, and a light emitting diode chip inside the cathode anode lead frame 4 and 5. Chip bonding portions 2 and 3 to be attached, chips 10a, 10b and 10c of red, blue and green light emitting diodes attached to the chip bonding portions 2 and 3, and the positive and negative lead frames (5) Red, green, and blue chips and fluorescent lamps, which are formed of gold wires 11 for energizing the light emitting diode chips 10a, 10b, and 10c, and a fluorescent epoxy resin 15a. White light emitting diode device using a type epoxy resin.

The method according to claim 8,

The red chip 10b emits a wavelength of 615nm to 635nm, the green chip 10a emits a wavelength of 515nm to 535nm, and the blue chip 10c emits a wavelength of 430nm to 470nm. A white light emitting diode device using red, green and blue chips and a fluorescent epoxy resin, wherein the wavelength is emitted and the fluorescent epoxy resin (15b) is converted to a wavelength of 560 nm to 620 nm.

The method according to claim 8,

Electrode formation of the light emitting diode chip is a red, green, blue chip and a white using a fluorescent epoxy resin, characterized in that the red, green, and blue chips simultaneously emit light with two terminals by connecting in series with a gold wire between red, blue, green chips Light emitting diode device.