KR20100079945A - Pick-and-place apparatus of test handler - Google Patents

Abstract

PURPOSE: A pick and place system of a test handler is provided to control interval between the line spacing and heat of the pickers by using the device for controlling the width between the line spacing device for controlling the width and heat. CONSTITUTION: A Picker(320) is arranged as the NXM array form. A line spacing device for controlling the width(330) guides the column direction movement of pickers. The line spacing device for controlling the width controls the line spacing interval of pickers. A device for controlling the width(340) guides the line writing direction movement of pickers between the heat. The device for controlling the width controls interval between the heat between the heat of pickers. The line spacing device for controlling the width comprises a plurality of column direction guide members(331), and the driving source(335) for a cam member(332) for the line spacing gaping and line spacing gaping. The device for controlling the width between the heat comprises a plurality of line writing direction guide members(341), and the driving source(345) for gaping between the cam member(342) for gaping between the heat and the heat.

Description

Pick and place device for test handlers {PICK-AND-PLACE APPARATUS OF TEST HANDLER}

The present invention relates to a pick and place device of a test handler.

The test handler is a device that supports semiconductor devices manufactured through a predetermined manufacturing process to be tested by a tester. The test handlers load semiconductor devices loaded in a customer tray into a test tray to test semiconductor devices loaded in a test tray. And unload the tested semiconductor devices from the test tray to the customer tray.

As shown in FIG. 1, since the general customer tray 100 is intended to store the semiconductor devices SC, the space between the semiconductor devices SC may be arranged so that the semiconductor devices SC can be loaded as much as possible. And the hot gap b is provided to be minimum.

As shown in FIG. 2, the general test tray 200 may achieve a line spacing c and a column spacing d between the semiconductor devices SC required for testing the semiconductor devices SC. In general, the distances c and d between the semiconductor devices SC in the test tray 200 are wider than the gaps a and b between the semiconductor devices SC in the customer tray 100. .

Therefore, when loading the semiconductor devices (SC) from the customer tray 100 to the test tray 200, or unloaded from the test tray 200 to the customer tray 100, the interval between the lines and the space between the semiconductor devices (SC) The spacing must be adjusted, for which a pick and place device is used.

The pick-and-place apparatus includes a plurality of pickers for adsorbing and detaching semiconductor elements, and has a function of adjusting the interval between pickers.

The number of pickers included in the pick and place device is increasing in order to increase the speed of the test handler.

That is, in the past, 8 pickers were arranged to form one row, but the number of rows gradually increased to 2 rows and 3 rows, and recently, 4 pickers, that is, 32 pickers were used in one pick and place device. to be.

As such, as the number of pickers arranged in the pick-and-place device increases, various techniques for adjusting the X-axis spacing and the Y-axis spacing of pickers when moving from the customer tray to the test tray have been introduced.

As such technology, Korean Patent No. 0800312 filed by the present applicant (name of the invention: a test handler and a loading method of the test handler, hereinafter referred to as 'Background art 1').

Background art 1 is a movable loading table which can reciprocate between a loading position and a loading position, and has a front and rear pitch having device seats having the same front and rear pitch between device seats of a test tray, and semiconductor devices by holding semiconductor devices from a customer tray. A first picking device which loads with a startable loading table positioned at a loading position while adjusting the pitch of the front and rear of the body, and adjusts the left and right pitch between semiconductor elements while transferring and loading the semiconductor elements with a test tray from the starting loading table positioned at the loading position A second picking device is provided.

However, since Background 1 uses two picking devices and a movable loading table, its configuration becomes more complicated than using one picking apparatus, and there is a problem in that a space for moving the movable loading table must be secured.

In addition, Korean Patent No. 0553989 filed by the present applicant (name of the invention: a loader handler of the test handler, hereinafter referred to as 'Background Art 2') is disclosed. The shaft spacing is adjusted, and the Y-axis spacing is adjusted using a cylinder.

However, Background 2 shows an example in which the pickers are arranged in two rows, and when the pickers are implemented in three or more rows using Background 2, a cam board is installed in each row in which the pickers are arranged to adjust the X-axis spacing. Should be. In addition, since an additional cylinder device is required in addition to a pair of cylinder devices to adjust the Y-axis spacing, there is a problem in that the configuration becomes very complicated.

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a pick and place apparatus capable of simultaneously holding semiconductor devices from a customer tray and simultaneously loading them into a test tray or vice versa through a simpler mechanical configuration. To provide technology.

Pick and place apparatus of the test handler according to the present invention for achieving the above object, Pickers arranged in the form of N ㅧ M (N, M is two or more natural numbers) matrix; An interlining device for guiding columnar movements of the pickers and adjusting interlining of the pickers; And a hot spacing device for guiding the row movement of the pickers and adjusting hot spacing of the pickers.

In addition, the line spacing device, a plurality of column guide members for guiding the column movement of the pickers; An interline space adjusting cam member for adjusting an interline space between the column guide members; And a driving source for adjusting an interval between the lines for driving the interval-adjusting cam member, wherein the interval adjustment apparatus comprises: a plurality of row-direction guide members for guiding row movement of the pickers; A hot spacing cam member for adjusting hot spacing between the row guide members; And a hot spacing driving source for driving the hot spacing cam member.

In addition, the pickers are positioned at a point where the column guide member and the row guide member intersect.

In addition, the row spacing adjusting cam member is slidably coupled to the column guide members, respectively, to adjust the line spacing between the column guide members, thereby providing a plurality of row spacing guide grooves for varying the spacing between the pickers. And a plurality of thermal intervals for adjusting the intervals between the pickers by adjusting the intervals between the row guide members, the cam members for sliding intervals being slidably coupled to the row direction guide members, respectively. It is characterized by having a guide groove.

In addition, the interline space adjusting cam member has a vertical plate shape, and the line space adjusting drive source provides power for translating the interline space adjusting cam member, and the hot space adjusting cam member has a vertical plate shape. The hot spacing drive source is characterized in that to provide power for translating the hot spacing cam member.

In addition, the line spacing device, a plurality of column guide members for guiding the column movement of the pickers; An interline space adjusting cam member for adjusting an interline space between the column guide members; And a driving source for adjusting the space between the lines for driving the space between the cam members for adjusting the space between the lines. Cam member; A hot spacing drive source for driving the hot spacing cam member; And a row guide member configured to guide the pickers disposed in the same column as the pickers having the guide protrusions to move in the row direction.

In addition, the cam member for adjusting the spacing between the rows is characterized in that the row guide member coupled to the pickers provided with the guide projection is constrained to move in the row direction.

Here, the device according to the present invention is further characterized by adjusting the column and line spacing of the pickers during transfer of the semiconductor device from the customer tray to the test tray using the pick and place device according to the present invention.

According to the present invention, a picker is used to guide the column movement of the pickers and adjust the interval between the pickers, and a picker using the interval adjustment device to guide the movement of the pickers and adjust the interval between the pickers. By adjusting the spacing between the rows and columns of the two, the following effects are obtained.

First, since the cam member for adjusting the spacing between rows is smaller than the number of rows of pickers, and the cam member for adjusting the spacing is less than the number of rows of pickers, there is an effect that can simplify the configuration of the pick and place device.

Second, since only a driving source for driving the space between the cam member for adjusting the interval and the cam member for adjusting the gap between the gap, it is possible to reduce the manufacturing cost by minimizing the driving source.

Third, when moving the semiconductor device from the customer tray to the test tray by using the inter-gap cam member and the hot-gap cam member, the row and column spacing is adjusted from the customer tray to the test tray by using one pick and place device. There is an effect that can improve the speed to move the semiconductor device.

Hereinafter, one preferred embodiment according to the present invention will be described in detail with reference to the accompanying drawings, description of overlapping description or obvious matters will be omitted or compressed as possible.

3 is a perspective view showing a pick and place device according to a first embodiment of the present invention, Figure 4 is an exploded perspective view showing the main configuration of the pick and place device according to a first embodiment of the present invention.

3 and 4, the pick and place apparatus 300 according to the present embodiment includes a housing 310, pickers 320, a space spacing device 330, and a space spacing device 340. It is configured to include).

The pickers 320 are for holding a semiconductor device. The pickers 320 form a vacuum in the air hole 321 through which air is supplied to suck the semiconductor device, and supply air to the air hole 321 to hold the semiconductor device. Release it.

The pickers 320 may be arranged in the form of an N ㅧ M matrix, where N is a natural number of 2 or more and M is a natural number of 2 or more.

In the present embodiment, a case in which the pickers 320 are arranged in a matrix form of 4 × 8 will be described as an example.

The interline space adjusting device 330 is to adjust the space between the pickers 320, the column guide member 331, the space between the space adjusting cam member 332, the space between the space between the guide rail 333, A sliding member 334 for adjusting the space between the lines is provided, a driving source 335 for adjusting the space between the lines, and a row LM guide rail 336. (The spacing between the pickers is the spacing between the centers of each picker, and the spacing between the pickers is the spacing between the centers of each picker.)

The column guide member 331 guides the column movement of the pickers 320 and is arranged in each row of the pickers 320 to guide the column movement of the pickers 320 arranged in the same row.

The picker 320 is slidably coupled to the column guide member 331 so that the picker 320 has a column passing hole 322 through which the column guide member 331 passes, and a column guide member ( Both ends of the 331 are formed to extend a predetermined length to the outside of the pickers 320 disposed at the outer side in the column direction. At this time, the ball bushing 350 is installed in the column through-hole 322, as shown in Figure 5, the ball bush 350 is the insertion hole 351 is inserted into the column guide member 331, A plurality of ball bearings 352 are installed in the insertion hole 351 to minimize the friction generated when the pickers 320 move along the column guide member 331.

The interlining gap adjusting cam member 332 is provided in a plate shape and is installed at the front opening 311 of the housing 310. The interline space adjusting cam member 332 is slidably coupled to the column guide members 331, respectively, and includes a plurality of line space guide grooves 332a for adjusting the space between the column guide members 331. do. (Line spacing between the column guide members refers to the space between the center of each column guide member.)

That is, by moving the column guide member 331 corresponding thereto along the row spacing guide grooves 332a, the spacing between the pickers 320 coupled with the column guide member 331 is adjusted. In this case, the bearing 360 is installed at the end of the column guide member 331 to minimize the friction generated when the column guide member 331 moves along the row spacing guide groove 332a.

Interline spacing adjusting guide rail 333 is installed on the front of the housing 310 to guide the vertical movement of the interlining spacing sliding member 334, interlining spacing sliding member 334 is interlining spacing adjusting cam member 332 Is fixed to.

The interlining space adjusting drive source 335 is for providing power for moving the interlining space adjusting cam member 332 in the up and down direction, and the interlining space adjusting piston 335a coupled with the interlining space adjusting sliding member 334; It is fixed to the housing 310 is provided with a cylinder 335b for raising and lowering the piston 335a for interlining spacing.

The row LM guide rail 336 is fixed to the housing 310 to support the column guide member 331 so as to be movable in the row direction. To this end, a row LM guide block 337 is provided on the lower surface of the column guide member 331, and a row direction guide in which the row LM guide rail 336 is fitted to the bottom of the row LM guide block 337. Grooves 337a are formed.

The hot spacing device 340 is for adjusting the spacing of the pickers 320, the row direction guide member 341, the hot spacing cam member 342, the hot spacing guide rails 343, The sliding member 344 for adjusting the hot spacing, the driving source 345 for adjusting the hot spacing, and the heat LM guide rail 346 are provided.

The row guide member 341 is for guiding the row movement of the pickers 320, and is arranged in each column of the pickers 320 to guide the column movement of the pickers 320 arranged in the same column.

The picker 320 is slidably coupled to the row guide member 341 so that the picker 320 has a row direction through hole 323 through which the row guide member 341 passes, and the row guide member ( Both ends of the 341 are formed to extend a predetermined length to the outside of the pickers 320 arranged outside the row direction. In this case, a ball bush 350 is installed in the row through hole 323 to minimize the friction generated when the pickers 320 move along the row guide member 341.

The hot gap adjusting cam member 342 is provided in a plate shape and is installed in the side opening 312 of the housing 310. The hot spacing cam member 342 is slidably coupled to the row guide members 341, respectively, and includes a plurality of row spacing guide grooves 342a for adjusting hot spacing between the row guide members 341. do. (The spacing between the row guide members is the spacing between the centers of the row guide members.)

That is, by moving the row guide member 341 corresponding thereto along the column spacing guide grooves 342a, the gap between the pickers 320 coupled to the row guide member 341 is adjusted.

At this time, the bearing 360 is installed at the end of the row guide member 331 to minimize the friction generated when the column guide member 331 moves along the row spacing guide groove 332a.

The hot spacing guide rail 343 is installed on the side of the housing 310 to guide the vertical movement of the hot spacing sliding member 344, and the hot spacing sliding member 344 is the hot spacing cam member 342. Is fixed to.

The hot spacing driving source 345 is to provide power for moving the hot spacing cam member 342 in the vertical direction, and a hot spacing piston 345a coupled with the hot spacing sliding member 344; It is fixed to the housing 310 is provided with a hot spacing cylinder 345b for raising and lowering the hot spacing piston 345a.

The column LM guide rail 346 is fixed to the housing 310 to support the row direction guide member 341 so as to be movable in the column direction. To this end, a column LM guide block 347 is installed on the bottom surface of the row direction member 341, and a column guide 345 is fitted on the bottom surface of the column LM guide block 347. Grooves 347a are formed.

Through such a configuration, the pickers 320 may move in the column direction and the row direction while being positioned at the point where the column direction guide member 331 and the row direction guide member 341 cross each other.

On the other hand, in the present embodiment, it is described that each of the line spacing cam member 332 and the hot spacing cam member 342 are provided one by one.

However, a pair of the spaced gap adjusting cam member 332 and the hot spaced adjustment cam member 342 may be installed in pairs, and through this, the movement of the column guide member 331 and the row guide member 341 may be prevented. It can achieve more stable.

6 is a front view of the pick and place apparatus shown in FIG. 4, and FIG. 7 is a side view of the pick and place apparatus of FIG. 4.

6 and 7, the interval between the rows of the column guide members 331 constitutes the interval of a, and thus the interval between the pickers 320 also forms the interval of a.

In addition, since the spacing between the row guide members 341 constitutes the spacing of b, the spacing between the pickers 320 also forms the spacing of b.

In this state, the pick and place device 300 grips the semiconductor device SC from the customer tray 100 shown in FIG. 1 and transfers the semiconductor device SC to the test tray 200 shown in FIG. 2.

The interval between rows of the semiconductor devices SC loaded in the test tray 200 forms an interval of c, and the interval between columns of the semiconductor devices SC forms an interval of d.

The pick and place device 300 according to the present invention operates as shown in FIGS. 8 to 10 while moving to the test tray 200 of FIG. 2.

Referring to FIGS. 8 to 10, when the leading gap adjusting cam member 332 is moved upward by the leading gap adjusting drive source 335, the column guide member 331 positioned on the line A1 of FIG. 6. Is moved on the A2 line, the line spacing of the pickers 320 is changed to the interval of c.

When the hot spacing cam member 342 is moved upward by the hot spacing driving source 345, the row guide member 341 positioned on the line B1 of FIG. 7 is moved on the line B2 and the picker 320 is moved. The spacing between the columns is varied with the spacing of d.

As such, when the line spacing and the column spacing of the pickers 320 are adjusted, the pick and place device 300 loads the semiconductor device SC into the test tray 200 shown in FIG. 2.

11 is a perspective view showing a pick and place device according to a second embodiment of the present invention, Figure 12 is an exploded perspective view showing the main configuration of the pick and place device according to a second embodiment of the present invention.

Referring to FIGS. 11 and 12, the pick and place apparatus 1100 according to the second embodiment includes a housing 1110, pickers 1120, a space spacing device 1130, and a space spacing adjustment. It comprises a device 1140.

The inter-gap adjusting device 1130 is for adjusting the inter-gap spacing of the pickers 1120, the column guide member 1131, the inter-gap adjusting cam member 1132, the inter-gap spacing guide rail 1133, A sliding member 1134 for adjusting the space between the lines is provided, a driving source 1135 for adjusting the space between the lines, a row LM guide rail 1136, and a row LM guide block 1137.

The hot spacing device 1140 is for adjusting the spacing of the pickers 1120, the row direction guide member 1141, the hot spacing cam member 1142, the hot spacing guide rail 1143, The sliding member 1144 for adjusting the hot spacing, the driving source 1145 for adjusting the hot spacing, the thermal LM guide rail 1146 and the thermal LM guide block 1147 are provided.

The pick and place apparatus 1100 according to the present exemplary embodiment may include the pickers 1120, a column guide member 1131 for guiding the column directions of the pickers 1120, and guides the row directions of the pickers 1120. Except for the structure of the row direction guide member 1141, since it is substantially the same as the structure of 1st Embodiment, description of the overlapping structure is abbreviate | omitted.

The column guide member 1131 according to the present embodiment is disposed in each row of the pickers 1520 to guide columnar movement of the pickers 1520 arranged in the same row, and is disposed above the pickers 1520. do.

One end of the column guide member 1131 is formed with a column guide projection (1131a) is slidably coupled to the row interval guide groove (1132a) of the interline space adjusting cam member (1132). That is, by moving the column guide protrusions 1131a corresponding to each of the row interval guide grooves 1132a, the space between the pickers 1120 coupled with the column guide members 1131 is adjusted.

The row guide member 1141 is disposed in each column of the pickers 1520 to guide the row movement of the pickers 1520 arranged in the same column, and is disposed on the side surfaces of the pickers 1520.

 One end of the row guide member 1141 is provided with a row guide protrusion 1141a slidably coupled to the column spacing guide groove 1142a of the hot spacing cam member 1142. Accordingly, the row guide protrusions 1141a corresponding to the column guide grooves 1142a are moved to adjust the gaps between the pickers 1120 coupled with the row guide members 1141.

In this case, bearings 1150 are installed at the ends of the column guide protrusions 1131 a and the row guide protrusions 1141 a to minimize friction generated when the column guide members 1131 and the row guide members 1141 move. You can do it.

Referring to FIG. 13, the coupling structure of the column guide member 1131 and the row guide member 1141 and the pickers 1120 will be described. A column sliding protrusion 1121 is provided on the pickers 1120. In the lower portion of the column guide member 1131, a column sliding groove 1131b having a shape corresponding to the column sliding protrusion 1121 is formed. Here, the thermal sliding protrusion 1121 is formed so that both sides are inclined to prevent the thermal sliding projection 1121b from being separated from the thermal sliding groove 1131b.

A row sliding protrusion 1122 is provided at a side of each picker 1120, and a row sliding groove 1141b having a shape corresponding to the row sliding protrusion 1122 is provided at a side of the row guide member 1141. Is formed.

Meanwhile, as shown in FIG. 14, the column guide member 1131 ′, the row guide member 1141 ′, and the pickers 1120 may be coupled to each other, and the top of each picker 1120 may be a column LM guide. A block 1123 is provided, and a column guide groove having a shape corresponding to the column guide member 1131 'is slidably inserted into the top surface of the column LM guide block 1123. 1123a is formed. At this time, the column guide member 1131 ′ is formed to be inclined at both sides thereof, thereby preventing the column guide member 1131 ′ from being separated from the column guide groove 1123a.

In addition, a row direction LM guide block 1124 is provided on the side of each picker 1120, and a row direction guide in which a row guide member 1141 'is slidably inserted into a side of the row LM guide block 1124. Grooves 1124a are formed.

Since the pick and place device 1100 according to the present embodiment operates substantially the same as the pick and place device 300 according to the first embodiment, description thereof will be omitted.

15 is a perspective view illustrating a pick and place device according to a third embodiment of the present invention, and FIG. 16 is an exploded perspective view showing a main configuration of a pick and place device according to a third embodiment of the present invention.

15 and 16, the pick and place apparatus 1500 according to the present embodiment includes a housing 1510, pickers 1520, an interline space adjusting device 1530, and a space spacing device 1540. It is configured to include).

The inter-gap adjusting device 1530 is for adjusting the inter-gap spacing of the pickers 1520, the column guide member 1531, the inter-gap adjusting cam member 1532, the inter-gap adjusting guide rail 1533, A sliding member 1534 for adjusting the space between the lines is provided, a driving source 1535 for adjusting the space between the lines, a row LM guide rail 1536, and a row LM guide block 1537.

The column guide member 1531 is disposed for each row of the pickers 1520 to guide the column movement of the pickers 1520 arranged in the same row, between the column guide member 1153 and the picker 1520. Since the coupling structure is the same as in the second embodiment, detailed description thereof will be omitted.

One end of the column guide member (1531) is formed with a column guide protrusion (1531a) is coupled to the interline space adjusting cam member (1532).

The interlining gap adjusting cam member 1532 is provided in a plate shape and is installed at the front opening 1511 of the housing 1510. The inter-gap adjusting cam member 1432 is slidably coupled to the column guide protrusions 1531a of the column guide member 1431, respectively, to adjust the line spacing between the column guide members 1531. A guide groove 1532a is provided.

Accordingly, by moving the column guide protrusions 1531a corresponding to the row interval guide grooves 1532a, the space between the pickers 1520 coupled with the column guide members 1531 is adjusted.

At this time, the interval gap adjusting cam member 1532, the row interval guide groove 1532a of the shape that can restrain the movement of the column guide member (1531) coupled to the pickers (1520) arranged in four rows in the row direction Should be provided. This is to prevent the guide protrusion 1521, which will be described later, from being separated from the hot gap adjusting cam member 1542.

The guide gap 1533 for adjusting the gap between the lines, the sliding member 1534 for adjusting the gap, the driving source 1535 for adjusting the gap between the gaps, the LM guide rail 1536 for the column, and the LM guide block 1537 for the column, Since it is the same as the structure of an Example, detailed description is abbreviate | omitted.

The hot spacing device 1540 is for adjusting the spacing of the pickers 1520, the row direction guide member 1541, the hot spacing cam member 1542, the hot spacing guide rail 1543, The sliding member 1544 for adjusting the hot spacing, the driving source 1545 for adjusting the hot spacing, the thermal LM guide rail 1546 and the thermal LM guide block 1547 are provided.

The row guide member 1541 is disposed in each column of the pickers 1520 to guide the row movement of the pickers 1520 arranged in the same row, and is coupled between the row guide member 1541 and the picker 1520. Since the structure is the same as in the second embodiment, detailed description thereof will be omitted.

The hot gap adjusting cam member 1542 is provided in a vertical plate shape and is installed in the side opening 1512 of the housing 1510.

Here, the pickers 1520 arranged in four rows have guide protrusions 1521 protruding toward the hot spacing cam members 1542, and the hot spacing cam members 1542 are respectively slid with the guide protrusions 1521. A plurality of column spacing guide grooves 1542a may be provided to change the spacing between the pickers 1520 arranged in four rows by possibly adjusting the spacing between the guide protrusions 1521.

When the pickers 1520 arranged in four rows move in the column direction, the pickers 1520 arranged in the same row as the pickers 1520 arranged in four rows are moved by the hot gap adjusting cam members 1542. Since it is coupled to the row guide member 1541, the picker 1520 disposed in four rows is moved in the column direction.

In this case, a bearing 1550 is installed at the end of the guide protrusion 1521 to minimize the friction generated when the guide protrusion 1521 moves along the thermal space guide groove 1542a.

The hot spacing guide rail 1543, the hot spacing sliding member 1544, the hot spacing drive source 1545, the hot LM guide rails 1546, and the hot LM guide block 1547 are provided in a first manner. Since it is the same as the structure of an Example, detailed description is abbreviate | omitted.

Meanwhile, in the present exemplary embodiment, the guide protrusions 1521 are formed on the pickers 1520 arranged in four rows, but the guide protrusions 1521 may be formed on the pickers 1520 arranged in one row. In this case, the hot spacing cam member 1442 should be installed at a position that can be combined with the guide protrusion 1521.

17 is a front view of the pick and place apparatus shown in FIG. 16, and FIG. 18 is a side view of the pick and place apparatus shown in FIG. 16.

Referring to FIGS. 17 and 18, since the space between the column guide members 1531 forms a space, the space between the pickers 1520 may also be spaced between a.

In addition, since the spacing between the row guide members 1541 constitutes the spacing of b, the spacing between the pickers 1520 also forms the spacing of b.

In this state, the pick and place apparatus 1500 grips the semiconductor device SC from the customer tray 100 shown in FIG. 1 and transfers the semiconductor device SC to the test tray 200 shown in FIG. It works like 21.

Referring to FIGS. 19 to 21, when the inter-gap adjusting cam member 1532 is moved upward by the inter-gap driving source 1535, the column guide member 1531 positioned on the line C1 of FIG. 16 is moved. As the column guide protrusion 1531a of) moves along the C2 line, the interval between rows of the pickers 1520 is varied by the interval of c.

When the hot spacing cam member 1542 is moved upward by the hot spacing driving source 1545, the guide protrusions 1521 positioned on the line D1 of FIG. 17 are moved on the line D2, and the pickers 1520 of the pickers 1520 are moved. The hot spacing is varied by the spacing of d.

As such, when the line and column spacings of the pickers 1520 are adjusted, the pick and place device 1500 loads the semiconductor device SC into the test tray 200 shown in FIG. 2.

FIG. 22 is a perspective view illustrating a pick and place device according to a fourth embodiment of the present invention, and FIG. 23 is an exploded perspective view showing a main configuration of the pick and place device according to a fourth embodiment of the present invention.

Referring to FIGS. 22 and 23, the pick and place apparatus 2200 according to the fourth embodiment of the present invention includes a housing 2210, pickers 2220, an interline spacing device 2230, It comprises a hot spacing device 2240.

The interlining device 2230 is for adjusting the interlining of the pickers 2220, the column guide member 2231, the interlining adjusting cam member 2232, the interlining adjusting guide rail 2333, A sliding member 2234 for adjusting the space between the lines is provided, a driving source 2235 for adjusting the space between the lines, a row LM guide rail 2236, and a row LM guide block 2237.

The hot spacing adjusting device 2240 is for adjusting the hot spacing of the pickers 2120, and includes guide guides 2221 formed on the pickers 2220 arranged in four rows, a row guiding device 2241, and hot spacing. A gap adjusting cam member 2242, a hot gap adjusting guide rail 2243, a hot gap adjusting sliding member 2244, and a hot gap adjusting drive source 2245 are provided.

Since the pick-and-place device 2200 according to the present embodiment is the same as the configuration of the third embodiment except for the configuration of the row guiding device 2241, the description of the overlapping configuration will be omitted.

Referring to FIG. 24, the row guiding apparatus 2241 according to the present exemplary embodiment is for guiding row movement of the pickers 2220 disposed in each column of the pickers 2220 and arranged in the same column. It comprises a guiding bar (2241a) and a guiding block (2241b).

The guiding bar 2241a is provided on one side of the pickers 2220 arranged in two to four rows in a bar shape.

The guiding block 2241b is provided on the other side of the pickers 2220 disposed in one to three rows, and has an insertion groove 2241c in which the guiding bar 2241a is inserted to be slidable.

Through this configuration, the guiding bars 2241a provided in the pickers 2220 arranged in two rows are slidably coupled to the guiding blocks 2241b provided in the pickers 2220 arranged in one row. The guiding bars 2241a provided in the pickers 2220 arranged in three rows are slidably coupled to the guiding blocks 2241b provided in the pickers 2220 arranged in two rows, and the pickers disposed in four rows. The guiding bar 2241a provided at 2220 is slidably coupled to the guiding block 2241b provided at the pickers 2220 disposed in three rows.

Since the pick and place device 2200 according to the present embodiment operates substantially the same as the pick and place device 1500 according to the third embodiment, except for the operation of the guiding device 2241, the operation of the pick and place device 2200 is described. Is omitted.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred examples of the present invention, the present invention is limited to the above embodiments. It is not to be understood that the scope of the invention should be understood by the claims and equivalent concepts described below.

1 is a plan view of a typical customer tray loaded with semiconductor devices.

2 is a plan view of a general test tray loaded with semiconductor devices.

3 is a perspective view showing a pick and place device according to a first embodiment of the present invention.

4 is an exploded perspective view showing the main configuration of the pick and place device according to the first embodiment of the present invention.

5 is a perspective view showing a ball bush applied to the pick and place device according to the first embodiment of the present invention.

FIG. 6 is a front view of the pick and place apparatus shown in FIG. 4. FIG.

FIG. 7 is a side view of the pick and place apparatus shown in FIG. 4. FIG.

8 is a perspective view showing an operating state of the pick and place device according to the first embodiment of the present invention.

9 is a front view of the pick and place device shown in FIG. 8.

10 is a side view of the pick and place device shown in FIG. 9.

11 is a perspective view showing a pick and place device according to a second embodiment of the present invention.

12 is an exploded perspective view showing the main configuration of a pick and place device according to a second embodiment of the present invention.

FIG. 13 is a partial perspective view illustrating a coupling structure of a column guide member and a row guide member and pickers in the pick and place device according to the second embodiment of the present invention.

FIG. 14 is a partial perspective view illustrating a pick-and-place device according to a second embodiment of the present invention by applying a coupling structure of a column guide member and a row guide member and pickers. FIG.

15 is a perspective view showing a pick and place device according to a third embodiment of the present invention.

16 is an exploded perspective view showing the main configuration of a pick and place device according to a third embodiment of the present invention.

17 is a front view of the pick and place device shown in FIG. 15.

18 is a side view of the pick and place device shown in FIG. 15.

19 is a perspective view showing an operating state of the pick and place device according to the third embodiment of the present invention.

20 is a front view of the pick and place device shown in FIG. 19.

21 is a side view of the pick and place device shown in FIG. 19.

22 is a perspective view showing a pick and place device according to a fourth embodiment of the present invention.

23 is an exploded perspective view showing the main configuration of the pick and place device according to the fourth embodiment of the present invention.

24 is a schematic diagram showing a row guiding apparatus of the pick and place apparatus according to the fourth embodiment of the present invention.

* Description of the code for the main parts of the drawings *

300, 1100, 1500, 2200: Pick and place device

310, 1110, 1510, 2210: housing

320, 1120, 1520, 2220: Picker

330, 1130, 1530, 2230: line spacing device

331, 1131, 1531, 2231: thermal direction guide member

332, 1132, 1532, 2232: cam member for adjusting the space between lines

335, 1135, 1535, 2235: Driving source for adjusting the space between lines

340, 1140, 1540, 2240: hot spacing device

341, 1141, 1541: row direction guide member

342, 1142, 1542, 2242: cam member for hot spacing

345, 1145, 1545, 2245: driving source for hot spacing

2241: row guiding device

Claims (8)

Pickers arranged in the form of N ㅧ M (N, M is a natural number of two or more); An interlining device for guiding columnar movements of the pickers and adjusting interlining of the pickers; And And a hot spacing device for guiding the row movement of the pickers and adjusting hot spacing of the pickers. Pick and place device for test handlers. The method of claim 1, The interline space adjusting device, A plurality of thermal guide members for guiding thermal movement of the pickers; An interline space adjusting cam member for adjusting an interline space between the column guide members; And And a driving source for adjusting the space between the lines for driving the space between the cam members. The hot spacing device, A plurality of row guide members for guiding row movement of the pickers; A hot spacing cam member for adjusting hot spacing between the row guide members; And It characterized in that it comprises a hot spacing drive source for driving the hot spacing cam member; Pick and place device for test handlers. 3. The method of claim 2, The pickers are positioned at the point where the column guide member and the row guide member intersect. Pick and place device for test handlers. 3. The method of claim 2, The cam member for adjusting the space between the lines, And a plurality of row spacing guide grooves that are slidably coupled to the column guide members, respectively, to change the spacing between the pickers by adjusting the spacing between the column guide members. The hot spacing cam member, And a plurality of column spacing guide grooves which are slidably coupled to the row guide members, respectively, to adjust the spacing between the row guide members to vary the spacing of the pickers. Pick and place device for test handlers. The method of claim 4, wherein The interlining gap adjusting cam member is a vertical plate shape, The driving space for adjusting the space between the lines provides power for translating the space between the cams for adjusting the space between lines. The hot spacing cam member is a vertical plate shape, The hot spacing driving source provides power for translating the hot spacing cam member. Pick and place device for test handlers. The method of claim 1, The interline space adjusting device, A plurality of thermal guide members for guiding thermal movement of the pickers; An interline space adjusting cam member for adjusting an interline space between the column guide members; And And a driving source for adjusting the space between the lines for driving the space between the cam members. The hot spacing device, A hot spacing cam member for varying the spacing between guide protrusions provided in the pickers arranged in one or N rows; A hot spacing driving circle for driving the hot spacing cam member; And And a row direction guide member configured to guide the pickers disposed in the same column as the pickers having the guide protrusions to move in the row direction. Pick and place device for test handlers. The method of claim 6, The cam member for adjusting the space between the lines, Characterized in that the row guide member coupled to the pickers provided with the guide projection to restrain the movement in the row direction Pick and place device for test handlers. An apparatus for adjusting the column and line spacing of pickers during transfer of semiconductor devices from a customer tray to a test tray using the pick and place device of claim 1.

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