KR20100071714A - Organic electro-luminescence display and method of manufacturing the same - Google Patents

Abstract

PURPOSE: An organic electro-luminescence display and a method of manufacturing the same are provided to improve a non-emitting failure by easily separating a second electrode from the organic electroluminescent panel. CONSTITUTION: A pixel region and a non-pixel region is defined on a substrate(200). An auxiliary electrode(210) is formed in the non-pixel region. The first electrode(220) is contacted with the auxiliary electrode. An insulating layer is formed on the first electrode. A partition wall(240) is formed in domain on the insulating layer. The partition wall has a first incline(240a) and a second incline(240b). A light-emitting layer is formed on the first electrode. A second electrode is separated by the partition wall.

Description

Organic electroluminescent display device and its manufacturing method {ORGANIC ELECTRO-LUMINESCENCE DISPLAY AND METHOD OF MANUFACTURING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display and a method of manufacturing the same, and more particularly, to an organic electroluminescent display and a method of manufacturing the organic electroluminescent display, in which an electrode patterning defect is eliminated by forming a double inclined surface of a partition wall.

Recently, various flat panel display devices that can reduce weight and volume, which are disadvantages of cathode ray tubes, have been developed. In particular, studies are being actively conducted to improve display quality and large screens. Such flat panel displays include liquid crystal displays, field emission displays, plasma display panels, and electroluminescence displays.

Among them, the electroluminescent display device used in the electroluminescent display device is a self-luminous device having a light emitting layer formed between two electrodes, and is an inorganic light emitting device and an organic electroluminescent device depending on the material of the light emitting layer. Therefore, the top emission type, the bottom emission type and the dual emission typy, and the passive matrix type and the active matrix type depending on the driving method Are separated by).

Since the electroluminescent display device is a self light-emitting type, the viewing angle is wider, the contrast is higher, and the visibility is superior to other display devices. In addition, since the backlight is unnecessary, the thin and light weight can be realized, and since the current needs to be supplied only to the pixel that needs light emission, power consumption is greatly reduced.

On the other hand, among the electroluminescent display devices according to the material of the light emitting layer, the inorganic electroluminescent display device requires a high voltage of 100 to 200V, while the organic electroluminescent display device is about 5-20V lower than that of the inorganic electroluminescent display device. Since it is driven by voltage, there is an advantage that DC low voltage driving is possible.

In addition, the passive matrix type electroluminescent display device of the electroluminescent display device according to the driving method is simple in its configuration, but the manufacturing method is simple, but it is difficult to increase the power consumption and the display area, and the opening ratio decreases as the number of wiring increases. On the other hand, an active matrix type electroluminescent display device has an advantage of providing high luminous efficiency and high image quality. Therefore, the passive matrix type electroluminescent display device is applied to the small display device, and the active matrix type electroluminescent display device is applied to the large display device.

The active matrix type organic light emitting display device displays an image by controlling a current flowing through the organic light emitting display device (hereinafter referred to as "OLED") using a thin film transistor (hereinafter referred to as "TFT"). . Such an organic light emitting display device displays an image in a form of a top emission method or a bottom emission method according to an OLED structure including an anode electrode, a cathode electrode, and an organic compound layer. While the bottom emission method displays visible light generated in the organic compound layer toward the lower side of the substrate on which the TFT is formed, the top emission method displays visible light generated in the organic compound layer toward the upper part of the substrate on which the TFT is formed. Recently, an organic light emitting diode display having a top emission type has been developed in various directions. One example is a dual plate organic light emitting display device having a structure in which a TFT array is formed on a lower substrate, an OLED array is formed on an upper substrate, and an OLED array and a TFT array are electrically connected through contact spacers. The dual plate organic light emitting display device has higher yield, higher color reproducibility, and higher brightness than other organic light emitting display devices having other structures.

In the conventional passive matrix organic electroluminescent display and the active matrix dual plate organic electroluminescent display, barrier ribs are formed due to the convenience in electrode manufacturing process. Such barrier ribs typically have a reverse taper shape, and form a first electrode on the substrate, an auxiliary electrode on the first electrode on the substrate corresponding to the non-pixel region, and an interlayer insulating layer to surround the auxiliary electrode. After forming, the barrier material is spin-coated on the interlayer insulating film and then formed on the interlayer insulating film on the auxiliary electrode through exposure, development, and heat treatment using a contact mask.

However, when the barrier rib is formed using the contact mask in this manner, since the taper of the barrier rib is not large, the second electrode which is not separated by the barrier rib when the electrode material is deposited to form the second electrode thereafter is connected. Defects could occur. In particular, when there is an auxiliary electrode under the partition wall, since the light from the exposure machine is reflected by the auxiliary electrode in the exposure process and irradiated below the partition wall, the taper of the partition wall becomes more gentle, so that the electrode material is not sufficiently separated by the partition wall. There was a problem.

The reason why the cathode electrode defect is caused is that there is a characteristic of the partition material itself, but the contact type exposure machine has a limitation in increasing the taper of the partition wall. As described above, the light reflected by the auxiliary electrode existing under the partition wall This is because the taper of the partition wall is made smaller. In order to solve this problem, the exposure machine may be contactless. However, since the exposure machine used in most semiconductor and display manufacturing processes currently used is a contact type, there is another problem that requires additional investment for the process equipment. there was.

Accordingly, it is an object of the present invention to provide an organic light emitting display device and a method of manufacturing the same, which can solve the above problems while using a conventional contact exposure device and a partition material.

In the organic electroluminescent display device according to the object of the present invention described above, the cathode electrode of each pixel region can be formed more reliably by differently forming the pattern of the auxiliary electrode and varying the amount of light irradiated from the exposure machine according to the position of the partition wall. It is characterized by what made it possible.

An organic electroluminescent display device according to a first embodiment of the present invention for achieving the above object comprises: a substrate in which a pixel region and a non-pixel region are defined; An auxiliary electrode formed in the non-pixel region on the substrate and separated from each other at a predetermined interval; A first electrode formed on the substrate to be in contact with the auxiliary electrode; An insulating layer formed on the first electrode at a position corresponding to the auxiliary electrode; A partition wall formed in a region on the insulating layer corresponding to the auxiliary electrode and having a first inclined surface and a second inclined surface having different inclination angles; An emission layer formed on the first electrode in the pixel region; And a second electrode formed to be separated from each other by the partition wall on the light emitting layer.

An organic electroluminescent display device according to a second embodiment of the present invention for achieving the above object comprises: a substrate in which a pixel region and a non-pixel region are defined; A first electrode formed on an entire surface of the substrate; An auxiliary electrode formed on the first electrode corresponding to the non-pixel area on the substrate and separated from each other at a predetermined interval; An insulating layer formed to surround the auxiliary electrode to electrically insulate the auxiliary electrode; A partition wall formed in a region on the insulating layer corresponding to the auxiliary electrode and having a first inclined surface and a second inclined surface having different inclination angles; An emission layer formed on the first electrode in the pixel region; And a second electrode formed to be separated from each other by the partition wall on the light emitting layer.

 According to a first aspect of the present invention, there is provided a method of manufacturing an organic electroluminescent display device, comprising: preparing a substrate in which pixel regions and non-pixel regions are defined; Forming a separate auxiliary electrode at a predetermined interval in the non-pixel region on the substrate; Forming a first electrode on the substrate to be in contact with the auxiliary electrode; Forming an insulating layer on the first electrode at a position corresponding to the auxiliary electrode; Forming a partition having a first inclined surface and a second inclined surface having different inclination angles in a region on the insulating layer corresponding to the auxiliary electrode; Forming a light emitting layer on the first electrode in the pixel region; And forming a second electrode on the light emitting layer to be separated from each other by the partition wall.

According to a second aspect of the present invention, there is provided a method of manufacturing an organic light emitting display device, comprising: preparing a substrate in which pixel regions and non-pixel regions are defined; A first electrode formed on an entire surface of the substrate; Forming an auxiliary electrode on the first electrode corresponding to the non-pixel area on the substrate to be separated at a predetermined interval; Forming an insulating layer surrounding the auxiliary electrode to electrically insulate the auxiliary electrode; Forming a partition having a first inclined surface and a second inclined surface having different inclination angles in a region on the insulating layer corresponding to the auxiliary electrode; Forming a light emitting layer on the first electrode in the pixel region; And forming a second electrode on the light emitting layer to be separated from each other by the partition wall.

According to the organic electroluminescent display device according to the present invention, since the auxiliary electrode is formed in a plurality of patterns, the taper of the partition wall is formed in double, so that the separation of the second electrode is easier than in the case of the partition wall having a conventional single slope. . Therefore, it is possible to obtain the effect of being able to improve the non-luminous poor phenomenon caused by not separating the second electrode.

Hereinafter, with reference to the accompanying drawings will be described a preferred embodiment according to the present invention. Hereinafter, the same components will be given the same reference numerals to clarify the description.

<First Embodiment>

An organic electroluminescent display device according to a first embodiment of the present invention will be described in detail. 1 is a cross-sectional view schematically illustrating an organic electroluminescent display device according to a first exemplary embodiment of the present invention, and FIGS. 2A to 2D illustrate an auxiliary electrode 210 and a second electrode on a second substrate 200 shown in FIG. 1. It is sectional drawing which shows the formation process of the 1 electrode 220, the partition 240, the organic light emitting layer 260, the 2nd electrode 270, etc.

As shown in FIG. 1, the organic electroluminescent display device according to the first embodiment of the present invention includes a transparent first substrate 100 on which a thin film transistor array is formed, an auxiliary electrode 210, first and second electrodes ( 220 and 270, the transparent second substrate 200 on which the organic light emitting layer 260 and the column spacer 250 are formed, face each other. Although not shown, the first substrate 100 and the second substrate 200 are bonded by a sealant.

In the first substrate 100, a pixel region P and a non-pixel region NP defined by the intersection of the gate line (not shown) and the data line 160 are formed, and the gate line and the data line 160 are formed. At the intersection, a switching thin film transistor (not shown) as a switching element and a driving thin film transistor DTr electrically connected to the switching thin film transistor are formed. The driving thin film transistor DTr includes a gate electrode 110, a gate insulating layer 120, a semiconductor layer 130, a source electrode 140, and a drain electrode 150. The semiconductor layer 130 includes an active layer 130a of pure amorphous silicon and an ohmic layer 130b of impurity amorphous silicon. Although the switching and driving thin film transistor DTr includes a bottom gate type transistor made of pure and impurity amorphous silicon in the embodiment of the present invention, a top gate type thin film transistor including a polysilicon semiconductor layer may be used. . A protective layer 170 having a contact hole 180 exposing the drain electrode 150 of the driving thin film transistor DTr is formed on the switching and driving thin film transistor, and is formed on the protective layer 170 through the contact hole 180. The connection electrode 190 is formed in contact with the drain electrode 150.

The auxiliary electrode 210 is formed on the second substrate 200 to correspond to the non-pixel region NP of the first substrate 100, and the work function value is formed on the entire surface of the auxiliary electrode 210 and the second substrate 200. A first electrode 220 made of relatively high indium tin oxide (ITO) or indium zinc oxide (IZO) is formed. The auxiliary electrode 210 is used to eliminate the problem that the signal delay value increases as the area of the ITO or IZO electrode forming the first electrode 220 increases, and the first pattern 210a is formed at a predetermined distance. ), The second pattern 210b and the third pattern 210c. The auxiliary electrode 210 is formed of a conductive metal material having a lower resistance value than the first electrode 220. When using ITO or IZO material as the first electrode 220, it is preferable to use chromium (Cr), molybdenum (Mo), aluminum (Al), aluminum alloy (AlNd), or the like as the auxiliary electrode 210. .

In addition, a column spacer 250 is formed on the first electrode 250 to correspond to a part of the connection electrode 190 formed on the first substrate 100, and the first electrode 200 corresponding to the auxiliary electrode 210. ) Is formed on the insulating film 230. On the other hand, an inverse tapered partition wall 240 having a first inclined surface 240a and a second inclined surface 240b is formed on the insulating film 230. The first inclined surface 240a of the partition wall 240 has a larger inclination angle than the second inclined surface 240b of the partition wall 240.

An organic light emitting layer 260 emitting red, green, and blue light is formed in the pixel region P defined by the partition 240, and the second electrode 370 is disposed on the partition 240 and the organic light emitting layer 260, respectively. Is formed. The organic light emitting layer 260 may be formed in a single layer or a multilayer structure, and the multilayer structure has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed from the first electrode 220 side. It is preferable.

On the other hand, since the partition wall 240 has two inclined surfaces having different inclinations, the second electrode 270 formed on the organic light emitting layer 260 and the partition wall 240 when the second electrode 270 is formed has a single inclined surface. It becomes possible to separate more reliably than the case of the partition which has. Therefore, it is possible to obtain an effect that can reliably improve the non-luminescence failure caused by the separation of the second electrode 270.

Hereinafter, a method of manufacturing an organic electroluminescent device according to a first embodiment of the present invention will be described with reference to FIGS. 2A to 2D. For convenience of description, the drawings will be described based on the side of the second substrate on which the partition wall 240 is formed.

2a to 2d are related to a method of manufacturing an organic electroluminescent device according to a first embodiment of the present invention.

First, as shown in FIG. 2A, a low resistance metal layer is deposited on the transparent insulating substrate 200 and patterned to be separated into a first pattern 210a, a second pattern 210b, and a third pattern 210c. The auxiliary electrode 210 is formed. In this case, the width of the first pattern 210a is equal to the width of the third pattern 210c, and the width of the second pattern 210b is larger than the width of the first pattern 210a or the third pattern 210c. It is preferable to form. However, embodiments of the present invention are not limited thereto. The auxiliary electrode 210 may be formed of any metal having a lower resistance than that of the material forming the first electrode 220, and may be formed of an opaque conductive film. When ITO or IZO is used as the first electrode 220, it is preferable to use chromium (Cr), molybdenum (Mo), aluminum (Al), aluminum alloy (AlNd), or the like as the first electrode 220.

Next, the first electrode 220 is formed on the entire surface of the substrate 200 on which the auxiliary electrode 210 is formed. The first electrode 220 is used as a hole injection electrode for injecting holes into the organic light emitting layer formed in a subsequent process, it is preferable that the material is ITO or IZO transparent and high work function.

An insulating material 230 is formed by depositing an insulating material on the first electrode 4 and then patterning the insulating material. As the insulating film, an inorganic insulating material containing silicon nitride and silicon oxide or an organic insulating material such as polyimide or photoacryl may be used.

FIG. 2B is a diagram illustrating a process of forming the partition wall 240 using a negative photoresist (hereinafter, referred to as PR). As shown in FIG. 2B, the first PR layer 233 is formed by depositing a negative photoresist covering the first electrode 220 and the insulating film 230 on the entire substrate 200 on which the insulating film 230 is formed. The contact mask M having an opening formed in a region corresponding to the auxiliary electrode 210 is positioned on the first PR layer 233. In addition, the partition wall 240 is formed by exposing and developing the lower first PR layer 233 by irradiating light from the upper portion of the mask M. At this time, the light energy applied to each region of the first PR layer 233 varies depending on the periods E1 to E5, which are the first to third patterns 210a to the auxiliary electrodes 210 formed on the substrate 200. 210c). That is, in regions E21, E22, E3, E41, and E42, which are sections to which light energy is irradiated, the first PR layer corresponding to the region where the first to third patterns 210a to 210c of the auxiliary electrode 210 are formed ( The first PR layer 233 corresponding to the region where the first to third patterns 210a to 210c of the auxiliary electrode 210 are not formed is the amount of light energy irradiated to the E21 region, the E3 region, and the E42 region of the 233. Will be more than the light energy irradiated to the E22 and E41 areas. This is due to the light reflected by the first to third patterns 210a of the auxiliary electrode 210. Therefore, when the first PR layer 233 is developed after the exposure process, more regions of the first PR layer 233 corresponding to regions where the patterns 210a to 210c of the auxiliary electrode 210 are not formed are removed more. Therefore, as shown in FIG. 2C, the partition wall 240 having the first inclined surface 240a and the second inclined surface 240b is formed.

In the above description, an example of forming a partition wall using a negative photoresist has been described. However, a person skilled in the art will use a positive photoresist based on the technical idea of the present invention to have two inclined walls having different inclined angles. Therefore, these examples also naturally belong to the present invention.

FIG. 2C illustrates a cross-sectional view of the partition wall 240 formed through the partition wall forming process of FIG. 2B. As shown in FIG. 2C, the first inclined surface 240a of the partition wall 240 has a steeper slope than the second inclined surface 240b. The reason is that the first patterns 210a to the third patterns of the auxiliary electrodes 210 are formed. This is because the energy supplied to each region of the first and second PR layers 233 and 235 is changed due to the amount of light reflected by 210c, so that the thickness of the PR layer removed in the subsequent development process is changed. As a result, as shown in FIG. 2C, the first inclination angle θ1 formed by the line (dotted line) extending perpendicular to the first inclined plane 240a and the substrate 200 plane is the second inclined plane 240b and the substrate ( It is formed larger than the second inclination angle θ2 formed by the line (dotted line) extending perpendicular to the plane.

2D is a cross-sectional view illustrating a configuration of the organic light emitting layer 260 and the second electrode 270 formed to be separated by the partition wall 240 according to the exemplary embodiment of the present invention.

An organic light emitting layer 260 is formed in each pixel region P (refer to FIG. 1) separated by the partition wall 240. The organic light emitting layer 260 may be configured as a single layer or a multilayer, and when configured as a multilayer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and an electron injection layer are sequentially formed from the first electrode 220 side. do.

Next, a second electrode 270 is deposited on the partition wall 240 and the organic light emitting layer 260, respectively, by the step difference between the partition wall 240 and the organic light emitting layer 260. The second electrodes 270 on 260 are separated from each other. As the second electrode 270, it is preferable to use a conductive film having excellent reflection characteristics such as aluminum (Al), magnesium (Mg), or the like. In the partition wall 240 according to the embodiment of the present invention, since the inclination angle θ1 of the first inclined surface 240a is greater than the second inclination angle θ2 of the second inclined surface 240b, the second electrode on the partition 240 and the organic light emitting layer 260 is used. It is possible to obtain an effect that the 270 can be more surely separated, thereby improving the non-luminescence failure caused by the second electrode 270 not being separated.

&Lt; Embodiment 2 >

Hereinafter, an organic electroluminescent display device according to a second embodiment of the present invention will be described in detail. 3 is a cross-sectional view schematically illustrating an organic electroluminescent display device according to a second exemplary embodiment of the present invention, and FIGS. 4A to 4D illustrate a first electrode 310 on a second substrate 300 shown in FIG. FIG. 3 is a cross-sectional view illustrating a process of forming the auxiliary electrode 320, the partition wall 340, the organic light emitting layer 360, and the second electrode 370.

As shown in FIG. 3, the organic electroluminescent display device according to the second embodiment of the present invention is substantially the same as the organic electroluminescent display device of the first embodiment except that the formation positions of the auxiliary electrode and the first electrode are different. Same as That is, in the organic electroluminescent display device according to the second embodiment of the present invention, the auxiliary electrode 320 is formed on the first electrode 310, but in the organic electroluminescent display device according to the first embodiment of the present invention, The first electrode 220 is formed on the electrode 210 is different.

Hereinafter, an organic electroluminescent display device according to a second embodiment of the present invention will be described with reference to FIGS. 3 and 4A to 4D. Since the components formed on the first substrate 100 are exactly the same as in the first embodiment, description thereof will be omitted to avoid overlapping descriptions.

As shown in FIG. 3, a first electrode 310 made of indium tin oxide (ITO) or indium zinc oxide (IZO) having a relatively high work function value is formed on an entire surface of the second substrate 300. An auxiliary electrode 320 is formed in a region on the first electrode 310 corresponding to the non-pixel region NP of the substrate 100. The auxiliary electrode 320 is used to eliminate a problem in which the signal delay value increases as the resistance of the ITO or IZO electrode forming the first electrode 310 increases, and the first pattern 320a is formed at a predetermined distance. ), A second pattern 320b and a third pattern 320c. The auxiliary electrode 320 is formed of a conductive metal material having a lower resistance value than the first electrode 310. When using ITO or IZO material as the first electrode 310, it is preferable that chromium (Cr), molybdenum (Mo), aluminum (Al), aluminum alloy (AlNd), or the like be used as the auxiliary electrode 320. .

In addition, a column spacer 350 is formed on the first electrode 310 to correspond to a part of the connection electrode 190 formed on the first substrate 100, and an insulating film 330 is formed on the auxiliary electrode 320. . An inverse tapered partition wall 340 having a first inclined surface 340a and a second inclined surface 340b is formed on the insulating layer 330 formed on the auxiliary electrode 320 of the second substrate 300. The first inclined surface 340a of the partition 340 has a larger inclination angle than the second inclined surface 340b of the partition 340.

An organic light emitting layer 360 emitting red, green, and blue light is formed in the pixel region P defined by the partition 340, and a second electrode 370 is formed on the partition 340 and the organic light emitting layer 360. Is formed. The organic light emitting layer 360 may be formed in a single layer or a multilayer structure, and the multilayer structure has a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed from the first electrode 310 side. It is preferable.

On the other hand, since the second electrode 370 formed on the organic light emitting layer 360 and the partition wall 340 has two inclined surfaces with different inclinations, the second electrode 370 is separated more reliably than a single inclined surface. It becomes possible. Therefore, the effect which can reliably improve the non-light emission defect which arises by not isolate | separating the 2nd electrode 370 can be acquired.

Hereinafter, a method of manufacturing an organic electroluminescent device according to a second embodiment of the present invention will be described with reference to FIGS. 4A to 4D. For convenience of description, the drawings will be described based on the portion where the partition wall 340 is formed.

4A to 4D are related to a method of manufacturing an organic electroluminescent device according to a second embodiment of the present invention.

First, as shown in FIG. 4A, the first electrode 310 is formed on the front surface of the transparent insulating substrate 300. Next, a low resistance metal layer is deposited on the first electrode 310, and the auxiliary electrode 320 patterned to be separated into the first pattern 320a, the second pattern 320b, and the third pattern 320c is formed. . In this case, the width of the first pattern 320a is equal to the width of the third pattern 320c, and the width of the second pattern 320b is larger than the width of the first pattern 320a or the third pattern 320c. It is preferable to form. However, the present invention is not limited thereto. The auxiliary electrode 320 may be any metal having a lower resistance than the material forming the first electrode 310, and may be formed of an opaque conductive film. When ITO or IZO is used as the first electrode 310, it is preferable to use chromium (Cr), molybdenum (Mo), aluminum (Al), aluminum alloy (AlNd), or the like as the auxiliary electrode 320.

The insulating layer 330 is formed by depositing and patterning an insulating material surrounding the auxiliary electrode to electrically insulate the auxiliary electrode on the auxiliary electrode 320. As the insulating film, an inorganic insulating material containing silicon nitride and silicon oxide or an organic insulating material such as polyimide or photoacryl may be used.

4B is a diagram illustrating a process of forming the barrier rib 340 using a negative photoresist. As shown in FIG. 4B, the first PR layer 333 is formed by depositing negative PR covering the first electrode 310 and the insulating film 330 on the entire substrate 300 on which the insulating film 330 is formed. The contact mask M having an opening formed in a region corresponding to the auxiliary electrode 320 is positioned on the first PR layer 333. In addition, the barrier 340 is formed by exposing and developing the lower first PR layer 333 by irradiating light from the upper portion of the mask M. FIG. In this case, the light energy applied to each region of the first PR layer 333 varies depending on the periods E1 to E5, which are the first to third patterns 320a to ˜ of the auxiliary electrode 320 formed on the substrate 300. 320c). That is, in the areas E21, E22, E3, E41, and E42 of the first PR layer 333, which is a section to which light energy is irradiated, the areas in which the first to third patterns 320a to 320c of the auxiliary electrode 320 are formed. The amount of light energy irradiated to the E21 region, the E3 region, and the E42 region of the first PR layer 333 corresponding to the region of the first to third patterns 320a to 320c of the auxiliary electrode 320 is not formed. The light energy irradiated to the areas E22 and E41 of the corresponding first PR layer 333 becomes larger. This is due to the light reflected by the first to third patterns 320a to 320c of the auxiliary electrode 320. Therefore, when the first PR layer 333 is developed after the exposure process, more regions of the first PR layer 333 corresponding to regions where the patterns 320a to 320c of the auxiliary electrode 320 are not formed are removed more. Therefore, as shown in FIG. 4C, the partition wall 340 having the first inclined surface 340a and the second inclined surface 340b is formed.

In the above description, an example of forming a partition wall using a negative photoresist has been described. However, a person skilled in the art will use a positive photoresist based on the technical idea of the present invention to have two inclined walls having different inclined angles. Since this may also be formed, these examples also naturally belong to the present invention.

4C illustrates a cross-sectional view of the partition wall 340 formed through the partition wall forming process of FIG. 4B. As shown in FIG. 4C, the first inclined surface 340a of the partition 340 is steeply inclined than the second inclined surface 340b because of the first pattern 320a to the third pattern of the auxiliary electrode 320. This is because the energy supplied to each region of the first and second PR layers 333 and 335 is changed due to the amount of light reflected by 320c, so that the thickness of the PR layer removed in the subsequent development process is changed. As a result, as shown in FIG. 4D, the first inclination angle θ1 formed by the line (dotted line) extending perpendicular to the first inclined surface 340a and the surface of the substrate 300 is the second inclined surface 340b and the substrate ( It is formed larger than the second inclination angle θ2 formed by a line (dotted line) extending perpendicular to the plane.

4D is a cross-sectional view illustrating a configuration of the organic light emitting layer 360 and the second electrode 370 formed to be separated by the partition wall 240 according to the exemplary embodiment of the present invention.

An organic light emitting layer 360 is formed in each pixel region P (refer to FIG. 3) separated by the partition wall 340. The organic emission layer 360 may be configured as a single layer or a multilayer, and when configured as a multilayer, a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer are sequentially formed from the first electrode 320 side. do.

Next, a second electrode 370 is deposited on the barrier rib 340 and the organic light emitting layer 360, respectively. The barrier rib 340 and the organic light emitting layer are formed by a step between the barrier rib 240 and the organic light emitting layer 360. The second electrodes 370 on 360 are separated from each other. As the second electrode 370, it is preferable to use a conductive film having excellent reflection characteristics such as aluminum (Al), magnesium (Mg), or the like. In the partition wall 340 according to the embodiment, the inclination angle θ1 of the first inclined surface 340a is greater than the second inclination angle θ2 of the second inclined surface 340b, and thus the second electrode 370 and the organic light emitting layer on the partition 340. The second electrode 370 on the 360 can be more reliably separated, thereby obtaining an effect of improving the non-luminescence failure caused by the second electrode 270 not being separated.

Although the preferred embodiments of the present invention have been described in detail above, the scope of the present invention is not limited thereto, and various modifications and improvements of those skilled in the art using the basic concepts of the present invention defined in the following claims are also provided. It belongs to the scope of the invention.

1 is a cross-sectional view of an organic electroluminescent display device according to a first embodiment of the present invention;

2A to 2D are cross-sectional views illustrating a process of forming a first electrode, an auxiliary electrode, a partition, an organic light emitting layer, and a second electrode on the second substrate illustrated in FIG. 1;

3 is a cross-sectional view of an organic electroluminescent display device according to a second embodiment of the present invention;

4A to 4D are cross-sectional views illustrating a process of forming a first electrode, an auxiliary electrode, a partition, an organic light emitting layer, and a second electrode on the second substrate illustrated in FIG. 3.

Claims (9)

A substrate in which pixel regions and non-pixel regions are defined; An auxiliary electrode formed in the non-pixel region on the substrate and separated from each other at a predetermined interval; A first electrode formed on the substrate to be in contact with the auxiliary electrode; An insulating layer formed on the first electrode at a position corresponding to the auxiliary electrode; A partition wall formed in a region on the insulating layer corresponding to the auxiliary electrode and having a first inclined surface and a second inclined surface having different inclination angles; An emission layer formed on the first electrode in the pixel region; And And a second electrode formed on the light emitting layer so as to be separated from each other by the partition wall. A substrate in which pixel regions and non-pixel regions are defined; A first electrode formed on an entire surface of the substrate; An auxiliary electrode formed on the first electrode corresponding to the non-pixel area on the substrate and separated from each other at a predetermined interval; An insulating layer formed to surround the auxiliary electrode to electrically insulate the auxiliary electrode; A partition wall formed in a region on the insulating layer corresponding to the auxiliary electrode and having a first inclined surface and a second inclined surface having different inclination angles; An emission layer formed on the first electrode in the pixel region; And And a second electrode formed on the light emitting layer so as to be separated from each other by the partition wall. The method according to claim 1 or 2, The auxiliary electrode may include a first pattern, a second pattern, and a third pattern formed at predetermined intervals, and the width of the second pattern is larger than that of the first and third patterns. device. The method according to claim 1 or 2, The partition wall has an inverse taper shape that becomes wider as it moves away from the substrate side, and a first inclination angle formed by the first inclined plane and the extension line perpendicular to the substrate is formed on the second inclined plane and the extension line perpendicular to the substrate. And a second inclined surface extending outward from the first inclined surface to the outside of the substrate. Preparing a substrate in which pixel regions and non-pixel regions are defined; Forming a separate auxiliary electrode at a predetermined interval in the non-pixel region on the substrate; Forming a first electrode on the substrate to be in contact with the auxiliary electrode; Forming an insulating layer on the first electrode at a position corresponding to the auxiliary electrode; Forming a partition having a first inclined surface and a second inclined surface having different inclination angles in a region on the insulating layer corresponding to the auxiliary electrode; Forming a light emitting layer on the first electrode in the pixel region; And And forming a second electrode on the light emitting layer to be separated from each other by the partition wall. Preparing a substrate in which pixel regions and non-pixel regions are defined; A first electrode formed on an entire surface of the substrate; Forming an auxiliary electrode on the first electrode corresponding to the non-pixel area on the substrate to be separated at a predetermined interval; Forming an insulating layer surrounding the auxiliary electrode to electrically insulate the auxiliary electrode; Forming a partition having a first inclined surface and a second inclined surface having different inclination angles in a region on the insulating layer corresponding to the auxiliary electrode; Forming a light emitting layer on the first electrode in the pixel region; And And forming a second electrode on the light emitting layer to be separated from each other by the partition wall. The method according to claim 5 or 6, The auxiliary electrode may include a first pattern, a second pattern, and a third pattern formed at predetermined intervals, and the width of the second pattern is larger than that of the first and third patterns. Method of manufacturing the device. The method according to claim 5 or 6, The partition wall has an inverse taper shape that becomes wider as it moves away from the substrate side, and a first inclination angle formed by the first inclined plane and the extension line perpendicular to the substrate is formed on the second inclined plane and the extension line perpendicular to the substrate. The second inclined surface is formed larger than the second inclined angle formed by the second inclined surface extending from the first inclined surface to the outside of the substrate. The method according to claim 5 or 6, The partitioning step may include depositing a negative photoresist layer on the first electrode and the insulating layer; And irradiating the negative photoresist with light using a photomask having an opening formed in a region corresponding to the auxiliary electrode, and then developing the negative photoresist.

Images