KR20150127368A - Organic light emitting display device and method of manufacturing the same - Google Patents

Abstract

An organic light-emitting display device and a method of manufacturing the same are provided. The organic light-emitting display device includes an over-coating layer. An auxiliary wiring is formed on the over-coating layer and has a structure in which one or more layers are stacked. A reflector is formed to be separated from the auxiliary wiring on a partition wall formed on the auxiliary wiring and the over-coating layer. An anode is formed on the reflector. A bank layer is formed to cover one side of the auxiliary wiring and one side of the anode. An organic light-emitting layer is formed on the bank layer, the anode, and the partition wall. A cathode is formed on the organic light-emitting layer. A connection electrode electrically connects the auxiliary wiring and the cathode. A reflectivity of the top layer of the auxiliary wiring is less than that of the reflector. In the organic light-emitting display device according to an embodiment of the present invention, partition walls on the auxiliary wiring are formed into reversely tapered shapes with different inclination angles, thereby increasing the probability of electrical connection between the auxiliary wiring and the cathode.

Description

Technical Field [0001] The present invention relates to an organic light emitting diode (OLED) display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic light emitting diode (OLED) display and a method of manufacturing the same, and more particularly, Emitting display device and a method of manufacturing the organic light-emitting display device.

The organic light emitting diode (OLED) is a self-emissive type display device, and unlike a liquid crystal display (LCD), a separate light source is not required, so that it can be manufactured in a light and thin shape. Further, the organic light emitting display device is not only advantageous from the viewpoint of power consumption by low voltage driving, but also excellent in color implementation, response speed, viewing angle, and contrast ratio (CR), and is being studied as a next generation display.

 The top emission type organic light emitting display device refers to an organic light emitting display device in which light emitted from an organic light emitting device is emitted to an upper portion of the organic light emitting display device, Refers to an organic light emitting display device which emits in the direction of the top surface of a substrate on which a thin film transistor for driving an apparatus is formed. In the case of the top emission type organic light emitting display, a transparent electrode or a transflective electrode is used as a cathode to emit light emitted from the organic light emitting layer. In the case of using the electrode of the transparent characteristic as the cathode and the case of using the electrode of the transflective characteristic, the thickness of the cathode is made thin to improve the transmittance, but the decrease of the cathode thickness increases the electrical resistance of the cathode. In particular, in the case of a large-area organic light emitting display device, the voltage drop becomes more serious as the distance from the voltage supply pad portion increases, and thus the problem of luminance non-uniformity of the organic light emitting display device may arise. In this specification, the voltage drop means a phenomenon in which the potential difference formed in the organic light emitting element decreases, specifically, a phenomenon in which the potential difference between the anode and the cathode of the organic light emitting element decreases.

A method using an auxiliary wiring is used to solve the voltage drop as described above. That is, a method of electrically connecting a separate auxiliary wiring to the cathode is used to prevent the electrical resistance of the cathode from increasing.

A method of forming a reverse tapered barrier rib on the auxiliary wiring for electrically connecting the auxiliary wiring and the cathode is used. Since the step coverage of the material used as the organic light emitting layer and the material used as the cathode is not excellent, when the organic light emitting layer and the cathode are deposited after forming the reverse tapered barrier ribs, The material used as the organic light emitting layer and the material used as the cathode are not formed. Subsequently, a material having excellent step coverage can be deposited to electrically connect the auxiliary wiring and the cathode. If the side surface of the barrier rib is not formed deeply in the center of the barrier rib in the reverse tapered shape of the barrier rib, that is, if a sufficient space is not secured for the conductive material for electrically connecting the auxiliary wiring and the cathode to contact the auxiliary wiring, There is a high probability that the connection is not connected.

Accordingly, there is a need for a method of increasing the electrical connection probability between the auxiliary wiring and the cathode in order to minimize the voltage drop due to the resistance of the cathode in the top emission type organic light emitting display.

[Related Technical Literature]

One. Organic light emitting device, method of manufacturing the same, organic display panel, organic display device (Patent Application No. 10-2011-7017455)

2. Organic electroluminescent device (Patent Application No. 10-2008-0087882)

The inventors of the present invention have found that in order to solve the problem of the voltage drop due to the resistance of the cathode in the organic EL display device of the top emission type and the luminance lowering due to the resistance of the organic EL display device of the top emission type, And a new structure capable of increasing the electrical connection probability of the cathode.

Accordingly, it is an object of the present invention to provide an organic light emitting display device and a method of manufacturing an organic light emitting display device, which can increase the electrical connection probability between the auxiliary wiring and the cathode.

Another problem to be solved by the present invention is to provide an organic light emitting display and a method of manufacturing an organic light emitting display capable of suppressing a voltage drop due to a resistance of a cathode through connection of an auxiliary wiring and a cathode to ensure a uniform image quality will be.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

An organic light emitting display according to an exemplary embodiment of the present invention includes an overcoat layer. The auxiliary wiring is formed on the overcoat layer, and has a structure in which one or more layers are laminated. The reflector is formed on the overcoat layer and the barrier ribs formed on the auxiliary wiring, spaced apart from the auxiliary wiring. The anode is formed on the reflector. The bank layer is formed so as to cover one side of the auxiliary wiring and one side of the anode. The organic light emitting layer is formed on the bank layer, the anode, and the barrier ribs. The cathode is formed on the organic light emitting layer. The connecting electrode electrically connects the auxiliary wiring to the cathode. The reflectance of the uppermost layer of the auxiliary wiring is smaller than that of the reflector. In the organic light emitting display according to an embodiment of the present invention, the barrier ribs on the auxiliary wiring may be formed in an inverted taper shape having different inclination angles to increase the electrical connection probability between the auxiliary wiring and the cathode.

According to another aspect of the present invention, there is further provided an additional conductive layer formed between the reflection plate and the overcoat layer and made of the same material as the auxiliary wiring.

According to still another aspect of the present invention, the auxiliary wiring includes a first auxiliary wiring, a second auxiliary wiring, and a third auxiliary wiring that are sequentially stacked from the overcoat layer, and the reflectance of the third auxiliary wiring is smaller than the reflectance of the reflector .

According to another aspect of the present invention, the first auxiliary wiring is formed of the same material as the reflection plate, and the second auxiliary wiring is formed of the same material as the anode.

According to still another aspect of the present invention, the auxiliary wiring is formed of a single layer.

According to still another aspect of the present invention, the uppermost layer of the auxiliary wiring is formed of a material having a reflectance of 70% or less.

According to another aspect of the present invention, the uppermost layer of the auxiliary wiring is formed of at least one of chromium (Cr), chromium alloy, copper (Cu), copper alloy, molybdenum (Mo), molybdenum alloy, titanium (Ti) , And the reflector is made of at least one of silver (Ag), aluminum (Al), silver and an alloy of aluminum.

According to another aspect of the present invention, the side surface of the barrier rib has a plurality of inclined surfaces having different inclination angles, and the area of the upper surface of the barrier rib is larger than the area of the lower surface of the barrier rib.

The organic light emitting display according to an embodiment of the present invention has a first sub pixel region, a second sub pixel region, and an auxiliary wiring region between the first sub pixel region and the second sub pixel region. The first reflective plate, the first anode, the first organic emission layer, and the first cathode are sequentially stacked on the first sub pixel region. The second reflective plate, the second anode, the second organic light emitting layer, and the second cathode are sequentially stacked on the second sub pixel region. The auxiliary wiring is formed in the auxiliary wiring region. The barrier ribs are formed on the auxiliary wiring. The connection electrode is disposed in the first sub pixel region, the second sub pixel region, and the auxiliary wiring region, and includes a connection electrode contacting the auxiliary wiring, the first cathode, and the second cathode. The reflectance of the upper surface of the auxiliary wiring is smaller than the reflectance of the upper surface of the first reflector and the reflectance of the upper surface of the second reflector. In the organic light emitting display according to an embodiment of the present invention, the auxiliary wiring and the barrier rib are formed in the auxiliary wiring region between the sub pixel regions, and the reflectivity of the auxiliary wiring is reduced to increase the electrical connection probability, Can be adjusted.

According to another aspect of the present invention, the barrier rib is formed in a reverse tapered shape.

According to another aspect of the present invention, the barrier rib has a first inclined surface and a second inclined surface with different inclination angles with respect to the upper surface of the auxiliary wiring.

According to another aspect of the present invention, the first inclined surface extends from the lower surface of the partition, the second inclined surface extends from the upper surface of the partition, and the inclination angle of the first inclined surface is smaller than the inclination angle of the second inclined surface.

According to still another aspect of the present invention, the width or depth of the first inclined surface is determined based on the reflectance of the upper surface of the auxiliary wiring.

According to still another aspect of the present invention, there is provided a plasma display panel further comprising a first additional conductive layer formed on a lower portion of the first reflector and a second additional conductive layer formed on a lower portion of the second reflector, And is made of the same material as the wiring.

According to still another aspect of the present invention, the auxiliary wiring includes a plurality of conductive layers which are sequentially stacked.

There is provided a method of manufacturing an organic light emitting display having a first sub pixel region, a second sub pixel region, and an auxiliary wiring region between a first sub pixel region and a second sub pixel region according to an embodiment of the present invention. A method of manufacturing an organic light emitting display device includes sequentially forming an auxiliary wiring material layer, a reflective plate material layer, and an anode material layer over a first sub pixel region, a second sub pixel region, and an auxiliary wiring region, A wiring layer is formed and a first reflector and a first anode are formed in the first sub pixel area and a second reflector and a second anode are formed in the second sub pixel area, Patterning the material layer, forming barrier ribs on the auxiliary wiring, forming a first organic light emitting layer and a second organic light emitting layer in each of the first sub pixel region and the second sub pixel region, Forming a first cathode and a second cathode on each of the first and second organic light-emitting layers, and forming a connection electrode in contact with the auxiliary wiring, the first cathode, and the second cathode And the reflectance of the upper surface of the auxiliary wiring is smaller than the reflectance of the upper surface of the first reflector and the reflectance of the upper surface of the second reflector. The barrier ribs are formed in an inverted tapered shape on the auxiliary wirings and the reflectance of the upper surface of the auxiliary wirings is reduced to increase the electrical connection probability between the auxiliary wirings and the cathode along the barrier ribs.

According to another aspect of the present invention, the step of patterning comprises the steps of forming a photoresist on the material layer for the anode, partially and entirely exposing the photoresist using a half tone mask, Removing the sub-wiring material layer, the reflective plate material layer and the anode material layer in the entire exposed area, and removing some exposed portions of the photoresist through ashing, And removing the reflective plate material layer and the anode material layer of the removed area.

There is provided a method of manufacturing an organic light emitting display having a first sub pixel region, a second sub pixel region, and an auxiliary wiring region between a first sub pixel region and a second sub pixel region according to an embodiment of the present invention. A method of manufacturing an organic light emitting display device includes sequentially forming a reflective plate material layer and an anode material layer over a first sub pixel region, a second sub pixel region, and an auxiliary wiring region, 2 auxiliary wiring and forming a first reflector and a first anode in the first sub pixel region and a second reflector and a second anode in the second sub pixel region, Patterning the first auxiliary wiring, forming a third auxiliary wiring on the first auxiliary wiring or the second auxiliary wiring, forming a partition on the third auxiliary wiring, Forming an organic light emitting layer and a second organic light emitting layer on the first organic light emitting layer and the second organic light emitting layer, forming a first cathode and a second cathode on each of the first organic light emitting layer and the second organic light emitting layer, And forming a connection electrode in contact with the cathode, wherein the reflectance of the third auxiliary wiring is smaller than the reflectance of the first reflector and the reflectivity of the second reflector. According to the organic light emitting display device manufacturing method, the probability of electrical connection between the auxiliary wiring and the cathode is increased through the inversely tapered barrier ribs to reduce the resistance of the cathode, and even in the top emission organic light emitting display device, .

The details of other embodiments are included in the detailed description and drawings.

The auxiliary wiring may be formed of a material having a reflectance smaller than that of the reflection plate to deeply form the inverse taper of the barrier rib, thereby increasing the electrical connection probability between the auxiliary wiring and the cathode.

Further, the present invention can reduce the resistance of the cathode through the auxiliary wiring by increasing the electrical connection probability between the auxiliary wiring and the cathode, and accordingly, even in the large-area top emission organic light emitting display, uniform luminance and picture quality .

The effects according to the present invention are not limited by the contents exemplified above, and more various effects are included in the specification.

FIG. 1A is a cross-sectional view illustrating an organic light emitting diode display including an auxiliary wiring and a barrier rib having a reflectance lower than that of a reflector according to an exemplary embodiment of the present invention.
1B is an enlarged cross-sectional view of the X region of FIG. 1A.
2 is a cross-sectional view illustrating an organic light emitting diode display including an auxiliary wiring formed of a plurality of layers according to another embodiment of the present invention.
3 is a cross-sectional view illustrating an organic light emitting display device that does not include a single layer of auxiliary wiring and a single-layer reflector according to another embodiment of the present invention.
4 is a flowchart illustrating a method of manufacturing an organic light emitting display including an auxiliary wiring formed into a single layer according to an embodiment of the present invention.
FIGS. 5A to 5E are cross-sectional views illustrating a method of manufacturing an organic light emitting display including a sub-wiring formed in a single layer according to an embodiment of the present invention.
FIG. 6 is a flowchart illustrating a method of manufacturing an organic light emitting display including an auxiliary wiring formed of a plurality of layers according to another embodiment of the present invention. Referring to FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The advantages and features of the present invention, and the manner of achieving them, will be apparent from and elucidated with reference to the embodiments described hereinafter in conjunction with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

The shapes, sizes, ratios, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the present invention are illustrative, and thus the present invention is not limited thereto. In the following description, well-known functions or constructions are not described in detail since they would obscure the invention in unnecessary detail. Where the terms "comprises", "having", "done", and the like are used in this specification, other portions may be added unless "only" is used. Unless the context clearly dictates otherwise, including the plural unless the context clearly dictates otherwise.

In interpreting the constituent elements, it is construed to include the error range even if there is no separate description.

In the case of a description of the positional relationship, for example, if the positional relationship between two parts is described as 'on', 'on top', 'under', and 'next to' Or " direct " is not used, one or more other portions may be located between the two portions.

An element or layer is referred to as being another element or layer "on ", including both intervening layers or other elements directly on or in between.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, the first component mentioned below may be the second component within the technical spirit of the present invention.

Like reference numerals refer to like elements throughout the specification.

The sizes and thicknesses of the individual components shown in the figures are shown for convenience of explanation and the present invention is not necessarily limited to the size and thickness of the components shown.

It is to be understood that each of the features of the various embodiments of the present invention may be combined or combined with each other partially or entirely and technically various interlocking and driving is possible as will be appreciated by those skilled in the art, It may be possible to cooperate with each other in association.

Various embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

FIG. 1A is a cross-sectional view illustrating an organic light emitting diode display including an auxiliary wiring and a barrier rib having a reflectance lower than that of a reflector according to an exemplary embodiment of the present invention. 1B is an enlarged cross-sectional view of the X region of FIG. 1A. The organic light emitting display 100 shown in FIGS. 1A and 1B is a top emission organic light emitting display.

1A, the OLED display 100 includes a first sub pixel region PA1, a second sub pixel region PA2, and a first sub pixel region PA1 and a second sub pixel region PA2 between the first and second sub pixel regions PA1 and PA2. And an auxiliary wiring region (SA). The number of sub-pixel regions included in the organic light emitting diode display 100 and the number of sub-wiring regions may be limited to a certain number of sub-pixel regions PA1, PA2 and one auxiliary wiring region SA, It does not.

The "first sub pixel region PA1" and the "second sub pixel region PA2" refer to any one sub pixel region in the pixel region. For example, the first sub pixel region PA1 and the second sub pixel region PA2 may be any one of a red sub pixel region, a green sub pixel region, a blue sub pixel region, and a white sub pixel region. The first sub pixel area PA1 and the second sub pixel area PA2 may be sub pixel areas of the same color or sub pixel areas of different colors.

The " auxiliary wiring region SA " is an area where an auxiliary wiring is formed, which means an area between the first sub pixel area PA1 and the second sub pixel area PA2.

The organic light emitting display includes an overcoat layer 110. Although not shown in FIG. 1A, the overcoat layer 110 has a contact hole for exposing the source electrode or the drain electrode of the thin film transistor, which is a layer for planarizing an upper portion of the thin film transistor for driving the organic light emitting devices 130A and 130B .

Reflecting plates 120A and 120B are formed on the overcoat layer 110. Specifically, the first reflection plate 120A is formed in the first sub pixel area PA1, and the second reflection plate is formed in the second sub pixel area PA2. The reflection plates 120A and 120B are made of a conductive material having a high reflectance so as to reflect the light emitted from the organic light emitting layers 132A and 132B upward. Specifically, the reflectors 120A and 120B may be made of a conductive material having a reflectivity of greater than 70%. For example, the reflectors 120A and 120B may be made of aluminum (Al), an aluminum alloy, silver (Ag), or a silver alloy, but are not limited thereto. Here, the reflectance of the silver alloy is about 96%, and the reflectance of aluminum is about 91%.

Additional conductive layers 169A and 169B are formed between the overcoat layer 110 and the reflection plates 120A and 120B, respectively. Specifically, the first additional conductive layer 169A is formed between the overcoat layer 110 and the first reflective plate 120A in the first sub pixel area PA1, and the second additional conductive layer 169B is formed between the overcoat layer 110 and the first reflective plate 120A. And is formed between the overcoat layer 110 and the second reflection plate 120B in the pixel region. The additional conductive layers 169A and 169B are formed in the contact holes of the overcoat layer 110 and are electrically connected to the thin film transistors. The additional conductive layers 169A and 169B are formed of the same material as the auxiliary wiring 160. [ The constituent materials of the additional conductive layers 169A and 169B will be described later together with the constituent materials of the auxiliary wiring 160.

Each of the first organic light emitting device 130A and the second organic light emitting device 130B is formed in the first sub pixel area PA1 and the second sub pixel area PA2. The first organic light emitting device 130A includes a first anode 131A, a first organic emission layer 132A and a first cathode 133A disposed in the first sub pixel area PA1, The organic light emitting layer 130B includes a second anode 131B, a second organic light emitting layer 132B and a second cathode 133B disposed in the second sub pixel area PA2.

The anodes 131A and 131B are formed on the reflectors 120A and 120B, respectively. Specifically, the first anode 131A is formed on the first reflective plate 120A in the first sub pixel area PA1 and the second anode 131B is formed on the second reflective plate 120B in the second sub pixel area PA2. 120B. The anode 131A and the anode 131B are made of a conductive material having a high work function in order to supply holes to the organic light emitting layers 132A and 132B. For example, the anodes 131A and 131B may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide, tin oxide, But are not limited to, a transparent conductive oxide (TCO) comprising a combination of the above.

Each of the organic light emitting layers 132A and 132B is formed on the bank layers 150A and 150B and the anodes 131A and 131B. The first organic emission layer 132A is formed on the first anode 131A in the first sub pixel area PA1 and on a part of the bank layers 150A and 150B in the auxiliary wiring area SA . The second organic light emitting layer 132B is formed on the second anode 131B in the second sub pixel area PA2 and formed on a part of the bank layers 150A and 150B in the auxiliary wiring area SA . The organic light emitting layers 132A and 132B are generally made of a material having a low step coverage. The organic light emitting layers 132A and 132B are formed only on a part of the bank layers 150A and 150B not covered by the barrier ribs 170 in the auxiliary wiring region SA.

The cathodes 133A and 133B are formed on the organic light emitting layers 132A and 132B, respectively. Specifically, the first cathode 133A is formed on the first organic light emitting layer 132A in a part of the first sub pixel area PA1 and the auxiliary wiring area SA, and the second cathode 133B is formed on the second sub pixel Is formed on the second organic light emitting layer 132B in a part of the area PA2 and the auxiliary wiring area SA. The cathodes 133A and 133B are made of a conductive material having a low work function to supply electrons to the organic light emitting layers 132A and 132B. For example, the cathodes 133A and 133B may be formed of an alloy of Ag, Ti, Al, Mo, or Ag and Mg, Nanotubes (CNTs) and / or graphene-based compositions. The cathodes 133A and 133b may be made of a material having low step coverage.

When the cathodes 133A and 133B are formed to have a sufficiently thin thickness, the light is emitted from the cathodes 133A and 133B through the cathodes 133A and 133B even if the materials forming the cathodes 133A and 133B have opaque characteristics and reflect light to some extent. Can be transmitted. As described above, since the organic light emitting display 100 is a top emission type organic light emitting display, the cathodes 133A and 133B may be formed to have a thickness of several hundreds A or less. However, as the cathodes 133A and 133B are formed thin, the resistance of the cathodes 133A and 133B also increases.

The auxiliary wiring 160 is formed on the overcoat layer 110 of the auxiliary wiring region SA. The auxiliary wiring 160 may be formed as a single layer as shown in Figs. 1A and 1B. In this case, the auxiliary wiring 160, which is a single layer, is assumed to be the top layer of the auxiliary wiring 160. The auxiliary wiring 160 may be formed only in a part of the auxiliary wiring region SA. That is, the auxiliary wiring 160 is spaced apart from the first sub pixel area PA1 and the second sub pixel area PA2 with a predetermined gap therebetween. The auxiliary wiring 160 does not contact the first additional conductive layer 169A of the first sub pixel area PA1 and the second additional conductive layer 169B of the second sub pixel area PA2. The auxiliary wiring 160 extends in one direction on the overcoat layer 110 and one end of the auxiliary wiring 160 is electrically connected to the pad portion formed in the non-display region to receive a predetermined voltage from the outside. The predetermined voltage may be, for example, a ground (GND) voltage.

The auxiliary wiring 160 is formed to reduce the increasing resistance of the cathodes 133A and 133B as the cathodes 133A and 133B are made thin. Accordingly, the auxiliary wiring 160 is made of a material capable of reducing the resistance of the cathodes 133A and 133B. That is, the auxiliary wiring 160 is made of a material having a small electrical resistance and a high conductivity. The auxiliary wiring 160 is made of a material having a low reflectance. Specifically, the auxiliary wiring 160 is made of a conductive material having a smaller reflectivity than the reflectors 120A and 120B. That is, the reflectors 120A and 120B may be made of a material having a reflectivity higher than 70%, while the auxiliary wiring 160 may be made of a conductive material having a reflectance lower than 70%. For example, the auxiliary wiring 160 may be made of a conductive material such as molybdenum (Mo), molybdenum alloy, titanium (Ti), titanium alloy, copper (Cu), copper alloy, chromium (Cr) Here, the reflectance of molybdenum is about 55%, the reflectance of titanium is about 50%, the reflectance of copper is about 59%, and the reflectance of chrome is about 66%.

The auxiliary wiring 160 may be formed on the same layer with the same material as the additional conductive layers 169A and 169B. That is, the auxiliary wiring 160 and the additional conductive layers 169A and 169B may be formed at the same time in the same process and formed of the same material. The manufacturing process of the auxiliary wiring 160 and the additional conductive layers 169A and 169B will be described later with reference to Figs. 4 to 5E.

The bank layers 150A and 150B are formed on the overcoat layer 110. The bank layers 150A and 150B are disposed between the sub pixel regions PA1 and PA2 and the auxiliary wiring region SA to separate the sub pixel regions PA1 and PA2 from the auxiliary wiring region SA.

The bank layers 150A and 150B are formed to cover one side of the auxiliary wiring 160 and one side of the anodes 131A and 131B. 1A and 1B, the bank layers 150A and 150B are formed on one side of the auxiliary electrode 160 and on one side of the first anode 131A of the first sub pixel area PA1 One bank layer 150A and a second bank layer 150B covering one side of the auxiliary electrode 160 and one side of the second anode 131B of the second sub pixel area PA2.

The barrier ribs 170 are formed on the auxiliary wiring lines 160 in the auxiliary wiring region SA. The barrier rib 170 separates the first organic emission layer 132A of the first sub pixel area PA1 and the second organic emission layer 132B of the second sub pixel area PA2.

The barrier rib 170 is made of a photoresist material which is an insulating material. Particularly, the barrier ribs 170 may be made of a negative photoresist material. The portion of the negative photoresist to which the light is irradiated is cured while the portion to which the light is not irradiated is not cured so that it can be removed in the development process of the photoresist. The barrier rib 170 has a shape that can cut off the organic light emitting layers 132A and 132B of the first sub pixel area PA1 and the second sub pixel area PA2. For example, the barrier ribs 170 may be formed in a reverse taper shape as shown in FIGS. 1A and 1B. The width of the cross section of the partition 170 increases with distance from the overcoat layer 110 so that the upper portion of the partition 170 is wider and the lower portion opposite to the upper portion becomes narrower. Referring to FIG. 1B, the barrier ribs 170 are formed in a second-order reverse tapered shape having a first inclined surface 172 and a second inclined surface 174 different in inclination angle with respect to the upper surface of the auxiliary wiring line 160. 1 of the first inclined surface 172 extending from the lower surface of the partition wall 170 is smaller than the inclination angle 2 of the second inclined surface 174 extending from the upper surface of the partition wall 170. [ The inclination angle? 1 of the first inclined face 172 is an angle formed by the upper face of the auxiliary wiring 160 and the first inclined face 172 of the partition 170 and the inclination angle? 2 of the second inclined face 174 is Refers to an angle formed by a plane parallel to the upper surface of the auxiliary wiring 160 and the second inclined surface 174 of the barrier rib 170. [

The width L or the depth D of the first inclined surface 172 of the partition 170 may be determined based on the reflectance of the upper surface of the auxiliary wiring 160. 1B, the width L of the first inclined surface 172 is equal to the width L of the first inclined surface 172 from the contact point between the first inclined surface 172 and the second inclined surface 174 to the contact point between the first inclined surface 172 and the auxiliary wiring 160 Is defined as the shortest distance. The depth D of the first inclined surface 172 is set such that the contact point between the first inclined surface 172 and the second inclined surface 174 is perpendicular to the auxiliary wiring 160 from the first inclined surface 172 to the auxiliary wiring 160 ) Is the shortest distance to the contact point.

As described above, since the barrier rib 170 is made of a negative photoresist material, the shape of the lower portion of the barrier rib 170 is determined based on the amount of light reflected by the auxiliary wiring 160 during exposure of the negative photoresist material. The lower portion of the barrier rib 170 absorbs light less by the auxiliary wiring 160 made of a material having a low reflectivity and the photoresist material under the barrier rib 170 is deeply formed as the center of the auxiliary wiring region SA Removed. That is, the lower portion of the barrier rib 170 is formed by being deeply cut toward the center of the auxiliary wiring region SA, so that the width of the first inclined surface 172 of the barrier rib 170 L) or the depth (D).

The dummy organic light emitting layer 171 is formed on the partition wall 170 in the auxiliary wiring region SA and the dummy cathode 173 is formed on the dummy organic light emitting layer 171. [ Since the dummy organic light emitting layer 171 is formed simultaneously with the formation of the organic light emitting layers 132A and 132B, the material of the organic light emitting layers 132A and 132B is low in step coverage, And the second organic light emitting layer 132B. The dummy cathode 173 is formed at the same time when the cathodes 133A and 133B are formed but the material of the cathodes 133A and 133B is low in step coverage so that the dummy cathode 173 is formed by the first cathode 133A and the second And is formed on the barrier rib 170 separately from the cathode 133B.

The connection electrode 140 is formed over the entire area of the first sub pixel area PA1, the second sub pixel area PA2, and the auxiliary wiring area SA. The connection electrode 140 is made of a material having high step coverage. The connection electrode 140 is formed in accordance with the shape of the bank layers 150A and 150B and the shape of the barrier rib 170 and is formed on the auxiliary wiring 160 exposed on the lower portion of the first inclined surface 172 of the barrier rib 170 As shown in FIG. In addition, the connection electrode 140 is conformally formed to have a substantially constant thickness according to the secondary inverse taper shape of the partition wall 170. Accordingly, the connection electrode 140, which is a conductive material, is formed on the auxiliary wiring 160 and the cathodes 133A and 133B to electrically connect the auxiliary wiring 160 and the cathodes 133A and 133B.

As described above, since the organic light emitting diode display 100 is a top emission type organic light emitting display, the connection electrode 140 is formed to have a high light transmittance so as to allow light emitted from the organic light emitting devices 130A and 130B to pass therethrough. Conductive material. Accordingly, the connection electrode 140 may be formed of any one of indium zinc oxide (IZO), indium tin oxide (ITO), indium tin zinc oxide (ITZO), zinc oxide, tin oxide, But it is not limited thereto.

When the auxiliary wiring 160 is formed of a material having a high reflectivity such as the reflectors 120A and 120B, the lower portion of the barrier rib 170 is hardened relatively in the exposure process for the photoresist used in manufacturing the barrier ribs 170, The width L or the depth D of the first inclined surface 172 of the first inclined surface 170 may be narrow and short. As a result, the area A where the auxiliary wiring 160 contacts the connecting electrode 140 is reduced or eliminated, and the auxiliary wiring 160 and the cathodes 133A and 133B are not electrically connected.

In the OLED display 100 according to the embodiment of the present invention, the reflectance of the upper surface of the auxiliary wiring 160 is smaller than that of the reflectors 120A and 120B. Therefore, when the negative photoresist material is exposed, the lower portion of the barrier rib 170 absorbs light less by the auxiliary wiring 160 made of a material having a low reflectance, and when the negative photoresist material is developed, And is deeply removed toward the center of the auxiliary wiring region SA. The lower portion of the barrier rib 170 is formed by being cut away toward the center of the auxiliary wiring region SA as compared with the case where the reflectance on the upper surface of the auxiliary wiring 160 is equal to or larger than the reflectance of the reflectors 120A and 120B . Accordingly, the area A in which the auxiliary wiring 160 and the connecting electrode 140 can contact each other is also widened. This increases the probability that the auxiliary wiring 160 and the cathodes 133A and 133B are electrically connected to each other and reduces the resistance of the cathodes 133A and 133B by stably connecting the auxiliary wiring 160 with the cathodes 133A and 133B Uniform luminance and image quality can be ensured even in a large-area top emission organic light emitting display.

1A and 1B, the step coverage of the cathodes 133A and 133B is low and the step coverage of the connection electrode 140 is high. However, if the cathodes 133A and 133B are formed of a material having high step coverage The cathodes 133A and 133B may be formed so as to be in direct contact with the auxiliary wiring 160 without a separate connecting electrode 140. [

2 is a cross-sectional view illustrating an organic light emitting diode display including an auxiliary wiring formed of a plurality of layers according to another embodiment of the present invention. The organic light emitting diode display 200 of FIG. 2 is different from the OLED display 100 of FIGS. 1A and 1B in that the auxiliary wiring 260 is different in configuration and the additional conductive layer 169B, but the other configurations are substantially the same, and redundant explanations are omitted.

The auxiliary wiring 260 is formed on the overcoat layer 110, and has a structure in which one or more layers are stacked. The auxiliary wiring 260 includes a first auxiliary wiring 261, a second auxiliary wiring 263 and a third auxiliary wiring 265 which are sequentially stacked from the overcoat layer 110. The first auxiliary wiring 261 may be formed of the same material as the reflectors 220A and 220B and the second auxiliary wiring 263 may be formed of the same material as the first and second electrodes 131A and 131B. Accordingly, since the first auxiliary wiring 261, the second auxiliary wiring 263, and the third auxiliary wiring 265 are both made of a conductive material, the resistance of the auxiliary wiring 260 can be very low. Further, when the auxiliary wiring 260 is formed of a plurality of conductive layers, the resistance of the cathodes 133A and 133B can be significantly lowered when the auxiliary wiring 260 is electrically connected to the cathodes 133A and 133B.

The third auxiliary wiring 265 formed on the uppermost layer among the auxiliary wirings 260 is made of a material having a lower reflectivity than the reflectors 220A and 220B. Specifically, the third auxiliary wiring 265 may be made of a conductive material having a reflectance smaller than 70%. For example, the third auxiliary wiring 265 may be made of molybdenum having a reflectance of about 55%, titanium having a reflectance of about 50%, copper having a reflectance of about 59% or chromium having a reflectance of about 66% The material of the third auxiliary wiring 265 is not limited thereto.

A barrier rib 170 is formed on the third auxiliary wiring 265. The barrier ribs 170 are made of a negative photoresist material, and the barrier ribs 170 have a secondary reverse taper shape. The secondary tapered shape is a shape in which the inclination angle 1 of the first inclined surface 172 extending from the lower surface of the partition wall 170 is smaller than the inclination angle 2 of the second inclined surface 174 extending from the upper surface of the partition wall 170 Respectively. Since the third auxiliary wiring 265 is disposed on the first auxiliary wiring 261 in the manufacturing process of the barrier rib 170, the first auxiliary wiring 261 having a high reflectance is disposed on the lower portion of the barrier rib 170. However, 170 are influenced by the reflectivity of the third auxiliary wiring 265, so that the lower portion of the barrier rib 170 is formed so as to be deeper at the center of the auxiliary wiring region SA.

Referring to FIG. 2, reflection plates 220A and 220B are formed on the overcoat layer 110. FIG. Therefore, the reflection plates 220A and 220B are electrically connected to the thin film transistors through the contact holes of the overcoat layer 110. [

Since the auxiliary wiring 260 is formed of a plurality of layers made of a conductive material in the OLED display 200 according to another embodiment of the present invention, the cathodes 133A and 133B electrically connected to the auxiliary wiring 260, Can be greatly reduced. The third auxiliary wiring 265 which is the uppermost layer of the auxiliary wiring 260 is made of a material having a low reflectance so that the contact area between the auxiliary wiring 160 and the connecting electrode 140 is widened. A reverse tapered shape can be formed.

3 is a cross-sectional view illustrating an organic light emitting display device that does not include a single layer of auxiliary wiring and a single-layer reflector according to another embodiment of the present invention. The organic light emitting diode display 300 of FIG. 3 is different from the organic light emitting diode display 200 of FIG. 2 only in the structure of the auxiliary wiring 160, and the other structures are substantially the same.

The auxiliary wiring 160 is formed on the overcoat layer 110 in the auxiliary wiring region. The auxiliary wiring 160 may be formed as a single layer, in which case the auxiliary wiring 160, which is a single layer, is assumed to be the top layer. The auxiliary wiring 160 is made of a conductive material having a lower reflectance than the reflectors 220A and 220B so that the lower portion of the barrier rib 170 is formed by being deeply cut off at the center of the auxiliary wiring region SA. The lower portion of the partition wall 170 is formed deeply at the center of the auxiliary wiring region SA and the contact area between the connection electrode 140 and the auxiliary wiring 160 is widened as the reflectance of the upper surface of the auxiliary wiring 160 becomes smaller All.

Since the auxiliary wiring 160 is formed as a single layer in the auxiliary wiring region SA and no additional conductive layer is present in the sub pixel regions PA1 and PA2, the auxiliary wiring 160 and the connecting electrode 140, The thickness of the organic light emitting display device may be reduced.

4 is a flowchart illustrating a method of manufacturing an organic light emitting display including an auxiliary wiring formed into a single layer according to an embodiment of the present invention. FIGS. 5A to 5E are cross-sectional views illustrating a method of manufacturing an organic light emitting display including a sub-wiring formed in a single layer according to an embodiment of the present invention.

4 and 5A, an auxiliary wiring material layer 571, a reflective plate material layer 572, and an anode material layer 573 are sequentially formed on the overcoat layer 110 (S41). The photoresist 580 is formed on the anode material layer 573 so that the sub pixel regions PA1 and PA2 and the auxiliary wiring region SA can be separately patterned. The photoresist 580 is a positive photoresist, and the region irradiated with light is removed by the developer in the developing process.

4, an auxiliary wiring line 160 is formed in the auxiliary wiring region SA to form a first reflective plate 120A and a first anode 131A in the first sub pixel region PA1, The auxiliary wiring material layer 571, the reflective plate material layer 572 and the anode material layer 573 are patterned to form the second reflective plate 120B and the second anode 131B in the sub pixel area PA2. (S42).

5B, a half tone mask 590 is disposed on the photoresist 580, and then light is irradiated on the halftone mask 590 to expose the photoresist 580. The halftone mask 590 is formed in a region where the auxiliary wiring 160 is to be formed in the blocking region 591 and the auxiliary wiring region SA corresponding to the first sub pixel region PA1 and the second sub pixel region PA2 And has a transmissive region 592 corresponding to a region where the auxiliary wiring 160 is not formed in the corresponding semi-transmissive region 593 and the auxiliary wiring region SA. Therefore, when the developing process is performed after the exposure process, the photoresists 581 and 583 of the unexposed sub pixel areas PA1 and PA2 are maintained through the halftone mask 590, Only a portion of the photoresist 582 is retained, and no photoresist is present in the fully exposed region. Subsequently, the auxiliary wiring material layer 571, the reflective plate material layer 572 and the anode material layer 573 in the entirely exposed area are removed by etching. Thus, the additional conductive layers 169A and 169B, the reflection plates 120A and 120B and the anodes 131A and 131B are formed in the sub pixel areas PA1 and PA2 and the auxiliary wiring 160 A dummy reflection plate 575, and a dummy anode 574 are formed.

5B and 5C, photoresist 582 of the auxiliary wiring region SA is completely removed through photoresist ashing, while portions of the photoresist of the sub pixel regions PA1 and PA2 are removed (585, 587) still remain on the anode (131A, 131B). After the photoresist ashing, the dummy reflector 575 and the dummy reflector 574 are formed in such a manner that the dummy reflector 575 and the dummy anodes 574 on the auxiliary wiring area SA are etched using the remaining portions 585 and 587 of the photoresist as a mask. The anode 574 can be removed, and only the auxiliary wiring 160 is left on the auxiliary wiring area SA.

4 and 5D, a barrier rib 170 is formed on the auxiliary wiring 160 (S43), and one side of the auxiliary wiring 160 and the other side of each of the anode 131A and 131B are covered So that the bank layers 150A and 150B are formed.

The barrier ribs 170 may be formed through a process of coating, exposing, and developing a negative photoresist. The barrier ribs 170 are formed in a second tapered shape by the auxiliary wirings 160 formed on the lower portion of the barrier ribs 170 during exposure. Here, the reflectance of the upper surface of the auxiliary wiring 160 is smaller than the reflectance of the upper surface of the reflectors 120A and 120B. Thus, the lower portion of the auxiliary wiring partition wall 170 is formed so as to be deeper toward the center of the auxiliary wiring region SA due to the small reflectance of the auxiliary wiring 160.

4 and 5E, a second organic emission layer 132B is formed in the first organic emission layer 132A in the first sub pixel area PA1 and the second organic emission layer 132B in the second sub pixel area PA2 in step S44. A first cathode 133A is formed on the first organic emission layer 132A and a second cathode 133B is formed on the second emission layer 132B in step S45. A connection electrode 140 is formed so as to be in contact with the auxiliary wiring 160 and the cathodes 133A and 133B so as to be electrically connected to each other (S46). When the organic light emitting layers 132A and 132B and the cathodes 133A and 133B are formed in the sub pixel regions PA1 and PA2, a dummy organic light emitting layer 171 and a dummy cathode 173 are simultaneously formed on the barrier ribs 170 . The connecting electrode 140 may be formed of a material having a high step coverage and may be formed as a uniform layer along the inclined surface of the barrier ribs 170. Accordingly, the connection electrode 140 can reduce the resistance of the cathodes 133A and 133B by connecting the auxiliary wiring 160 and the cathodes 133A and 133B.

FIG. 6 is a flowchart illustrating a method of manufacturing an organic light emitting display including an auxiliary wiring formed of a plurality of layers according to another embodiment of the present invention. Referring to FIG. The method of manufacturing the organic light emitting diode display device of FIG. 6 is different from the method of manufacturing the organic light emitting display device of FIG. 4 except for the method and sequence for forming the auxiliary wiring, and the other steps are substantially the same.

First, a reflective plate material layer and an anode material layer are sequentially formed over the sub pixel area and the sub pixel area (S61).

Subsequently, the reflection plate material layer and the anode material layer are patterned to form a first reflector and a first anode in the first sub pixel region, a second reflector and a second anode in the second sub pixel region, The first auxiliary wiring and the second auxiliary wiring are formed (S62).

Subsequently, a third auxiliary wiring is formed on the first auxiliary wiring or the second auxiliary wiring (S63), and a partition is formed on the third auxiliary wiring (S64).

That is, only the reflection plate and the anode are formed in each sub pixel region, and the auxiliary wiring is formed in a plurality of layers only in the auxiliary wiring region. The first auxiliary wiring formed in the auxiliary wiring region is made of the same material as the reflection plate of the sub pixel region and the second auxiliary wiring is made of the same material as the anode of the sub pixel region. The lower portion of the barrier rib is in contact with the third auxiliary wiring having a reflectance smaller than the reflectance of the reflector so as to form a secondary reverse taper shape of the barrier rib so that the lower portion of the barrier rib is deeper at the center of the auxiliary wiring region.

Subsequently, a first organic emission layer and a second organic emission layer are formed in the first sub pixel region and the second sub pixel region, respectively (S65), and a first cathode and a second cathode (S66), and a connection electrode that is in contact with the auxiliary wiring, the first cathode, and the second cathode is formed (S67).

6, auxiliary wirings made of a material having a reflectance lower than that of the reflection plate can be formed only in the auxiliary wiring region without using an expensive mask such as a halftone mask, and the auxiliary wiring can be formed of a plurality of conductive When formed as a material layer and connected to the cathode through the connecting electrode, the resistance of the cathode can be greatly reduced.

Although the embodiments of the present invention have been described in detail with reference to the accompanying drawings, it is to be understood that the present invention is not limited to those embodiments and various changes and modifications may be made without departing from the scope of the present invention. . Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the scope of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed according to the following claims, and all technical ideas within the scope of equivalents should be construed as falling within the scope of the present invention.

100, 200, 300: organic light emitting display
110: overcoat layer
120A and 220A: a first reflector
120B and 220B: a second reflector
130A: a first organic light emitting element
130B: a second organic light emitting element
131A: a first anode
131B: Second anode
132A: a first organic light emitting layer
132B: a second organic light emitting layer
133A: first cathode
133B: Second cathode
140: connecting electrode
150A: first bank layer
150B: second bank layer
160, 260: auxiliary wiring
169A: first additional conductive layer
169B: second additional conductive layer
170:
171: dummy organic light emitting layer
172: first inclined surface
173: Dummy cathode
174: second inclined surface
261: first auxiliary wiring
263: Second auxiliary wiring
265: Third auxiliary wiring
571 Substrate material layer
572: Material layer for reflector
573: Material layer for anode
574: Dummy anode
575: Dummy reflector
580: Photoresist
581 and 583: photoresist in the sub pixel region
582: Photoresist in the auxiliary wiring region
585, 587: a part of the photoresist in the sub pixel region
590: Halftone mask
591: Blocking area
592:
593: Semitransparent area

Claims (18)

An overcoat layer;
An auxiliary wiring formed on the overcoat layer and having a structure in which one or more layers are stacked;
Barrier ribs formed on the auxiliary wiring;
A reflection plate formed on the overcoat layer so as to be spaced apart from the auxiliary wiring;
An anode formed on the reflection plate;
A bank layer formed to cover one side of the auxiliary wiring and one side of the anode;
An organic light emitting layer formed on the bank layer, the anode, and the barrier rib;
A cathode formed on the organic light emitting layer; And
And a connection electrode electrically connecting the auxiliary wiring to the cathode,
Wherein the reflectance of the uppermost layer of the auxiliary wiring is smaller than the reflectance of the reflective plate. The method according to claim 1,
Further comprising an additional conductive layer formed between the reflection plate and the overcoat layer and made of the same material as the auxiliary wiring. The method according to claim 1,
The auxiliary wiring includes a first auxiliary wiring, a second auxiliary wiring, and a third auxiliary wiring which are sequentially stacked from the overcoat layer,
And the reflectance of the third auxiliary wiring is smaller than the reflectance of the reflection plate. The method of claim 3,
The first auxiliary wiring is formed of the same material as the reflection plate,
And the second auxiliary wiring is formed of the same material as the anode. The method according to claim 1,
Wherein the auxiliary wiring is made of a single layer. The method according to claim 1,
Wherein the uppermost layer of the auxiliary wiring is made of a material having a reflectance of 70% or less. The method according to claim 1,
The uppermost layer of the auxiliary wiring is made of at least one of chromium (Cr), chromium alloy, copper (Cu), copper alloy, molybdenum (Mo), molybdenum alloy, titanium (Ti)
Wherein the reflection plate is made of at least one of silver (Ag), aluminum (Al), silver and an alloy of aluminum. The method according to claim 1,
Wherein a side surface of the partition wall has a plurality of inclined surfaces having different inclination angles,
Wherein an area of an upper surface of the barrier rib is larger than an area of a lower surface of the barrier rib. A first sub pixel region, a second sub pixel region, and an auxiliary wiring region between the first sub pixel region and the second sub pixel region,
A first anode, a first organic emission layer, and a first cathode stacked sequentially on the first sub pixel region;
A second anode, a second organic emission layer, and a second cathode sequentially stacked on the second sub pixel region;
An auxiliary wiring formed in the auxiliary wiring region;
Barrier ribs formed on the auxiliary wiring; And
And a connection electrode disposed in the first sub pixel region, the second sub pixel region, and the auxiliary wiring region and in contact with the auxiliary wiring, the first cathode, and the second cathode,
Wherein the reflectance of the upper surface of the auxiliary wiring is smaller than the reflectance of the upper surface of the first reflector and the reflectance of the upper surface of the second reflector. 10. The method of claim 9,
Wherein the barrier ribs are formed in a reverse taper shape. 11. The method of claim 10,
Wherein the barrier ribs have a first inclined surface and a second inclined surface with different inclination angles with respect to the upper surface of the auxiliary wiring. 12. The method of claim 11,
Wherein the first inclined surface extends from a lower surface of the partition wall,
The second inclined surface extending from the upper surface of the partition,
Wherein the inclination angle of the first inclined surface is smaller than the inclination angle of the second inclined surface. 13. The method of claim 12,
Wherein the width or depth of the first inclined surface is determined based on the reflectance of the upper surface of the auxiliary wiring. 10. The method of claim 9,
A first additional conductive layer formed under the first reflector; And
And a second additional conductive layer formed under the second reflector,
Wherein the first additional conductive layer and the second additional conductive layer are made of the same material as the auxiliary wiring. 10. The method of claim 9,
Wherein the auxiliary wiring includes a plurality of conductive layers which are sequentially stacked. A second sub pixel region, and an auxiliary wiring region between the first sub pixel region and the second sub pixel region,
Sequentially forming an auxiliary wiring material layer, a reflective plate material layer, and an anode material layer over the first sub pixel region, the second sub pixel region, and the auxiliary wiring region;
Pixel electrode, a second wiring line is formed in the first sub-pixel region, a second wiring line is formed in the auxiliary wiring region, and a first reflector and a first anode are formed in the first sub-pixel region and a second reflector and a second anode are formed in the second sub- Patterning the reflective layer material layer and the anode material layer;
Forming a barrier rib on the auxiliary wiring;
Forming a first organic emission layer and a second organic emission layer in the first sub pixel region and the second sub pixel region, respectively;
Forming a first cathode and a second cathode on the first organic light emitting layer and the second organic light emitting layer, respectively; And
And forming a connection electrode in contact with the auxiliary wiring, the first cathode, and the second cathode,
Wherein the reflectance of the upper surface of the auxiliary wiring is smaller than the reflectance of the upper surface of the first reflector and the reflectance of the upper surface of the second reflector. 17. The method of claim 16,
Wherein the patterning comprises:
Forming a photoresist on the anode material layer;
Partially and half exposing the photoresist using a half tone mask;
Removing the auxiliary wiring material layer, the reflection plate material layer and the anode material layer in the entire exposed region of the photoresist; And
Removing the partially exposed portions of the photoresist through ashing and removing the reflective plate material layer and the anode material layer of the region from which some exposed portions of the photoresist have been removed Wherein the organic light emitting display device has a plurality of pixels. A second sub pixel region, and an auxiliary wiring region between the first sub pixel region and the second sub pixel region,
Sequentially forming a reflective plate material layer and an anode material layer over the first sub pixel region, the second sub pixel region, and the auxiliary wiring region;
A first auxiliary wiring and a second auxiliary wiring are formed in the auxiliary wiring region and a first reflector and a first anode are formed in the first sub pixel region and a second reflector and a second anode are formed in the second sub pixel region Patterning the reflective layer material layer and the anode material layer;
Forming a third auxiliary wiring on the first auxiliary wiring or the second auxiliary wiring;
Forming a barrier rib on the third auxiliary wiring;
Forming a first organic emission layer and a second organic emission layer in the first sub pixel region and the second sub pixel region, respectively;
Forming a first cathode and a second cathode on the first organic light emitting layer and the second organic light emitting layer, respectively; And
And forming a connection electrode in contact with the auxiliary wiring, the first cathode, and the second cathode,
Wherein the reflectance of the third auxiliary wiring is smaller than the reflectance of the first reflector and the reflectance of the second reflector.

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