KR20100070866A - Method of supplying epoxy molding compound into tray - Google Patents

Method of supplying epoxy molding compound into tray Download PDF

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Publication number
KR20100070866A
KR20100070866A KR1020080129598A KR20080129598A KR20100070866A KR 20100070866 A KR20100070866 A KR 20100070866A KR 1020080129598 A KR1020080129598 A KR 1020080129598A KR 20080129598 A KR20080129598 A KR 20080129598A KR 20100070866 A KR20100070866 A KR 20100070866A
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KR
South Korea
Prior art keywords
emc
semiconductor chip
tray
powder
weight
Prior art date
Application number
KR1020080129598A
Other languages
Korean (ko)
Other versions
KR101042692B1 (en
Inventor
김선오
이상수
Original Assignee
세크론 주식회사
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Priority to KR1020080129598A priority Critical patent/KR101042692B1/en
Publication of KR20100070866A publication Critical patent/KR20100070866A/en
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Publication of KR101042692B1 publication Critical patent/KR101042692B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Engineering & Computer Science (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

In the method for supplying the epoxy molding compound powder for molding the semiconductor chip, the first weight of the epoxy molding compound powder may be supplied to the tray in advance. The substrate on which the semiconductor chip is mounted is transferred to a loader by a pickup unit and then to a mold by the loader. The volume of the semiconductor chip is calculated using a three-dimensional image obtained while the substrate is transferred to the loader, and a second weight of the EMC powder required for molding the semiconductor chip is calculated from the calculated volume. Subsequently, the second weight EMC powder is supplied to the tray, and the tray supplied with the EMC powder is transferred to the mold by the loader.

Description

Method of supplying epoxy molding compound into tray

The present invention relates to a method for supplying an epoxy molding compound (EMC). More particularly, the present invention relates to a method of supplying a powdered epoxy molding compound into a mold using a tray for molding semiconductor chips mounted on a substrate in the manufacture of a semiconductor device.

In general, in the manufacture of a semiconductor device, a molding process may be performed to package semiconductor chips mounted on a substrate using an epoxy resin. The molding process may be performed by a molding apparatus including a mold that provides a space for molding the semiconductor chips.

The mold may include an upper mold and a lower mold, and a substrate in which the semiconductor chips are mounted and an epoxy molding compound in powder form may be supplied to the mold by a loader. have. At this time, the EMC powder may be carried by the tray.

The device for supplying the EMC feeds the EMC powder to the tray, which can be transported into the mold by the loader.

The substrate on which the semiconductor chips are mounted may be transferred to a loader from a magazine in which the substrates are accommodated by a pickup unit, and may be transferred into the mold together with the tray by the loader. The thickness and area of the semiconductor chips may be measured by a vision inspection unit while the substrate is transferred by the pickup unit, and volume information of the semiconductor chips may be obtained from the thickness and area of the semiconductor chips.

The volume information of the semiconductor chips obtained as described above may be transmitted to the controller, and the controller calculates the weight or supply amount of the EMC powder to be supplied to the tray using the volume information of the semiconductor chips.

The EMC supply device includes a storage container for storing the EMC in a powder state, a storage container for storing the EMC powder supplied from the storage container, and a delivery passage extending from the storage container and for transporting the EMC powder to the tray. It may include a trench member to perform a function and a vibration generator for vibrating the trench member to move the EMC powder through the trench member.

The controller may control the operation of the vibration generator so that the EMC powder may be supplied to the tray by the calculated weight, and the tray on which the EMC powder is loaded may be transferred to the mold by the loader.

In the conventional EMC supply method as described above, the EMC powder may be supplied to the tray after the weight of the EMC powder is calculated by the control unit. As a result, the supply of the EMC powder is started at a point in time after the inspection step by the vision inspection unit and the weight calculation step by the controller are performed, so that the EMC supply may take a relatively long time, This can be a factor in increasing the overall process time for molding.

An object of the present invention for solving the above problems is to provide an EMC supply method that can shorten the EMC powder supply time.

According to embodiments of the present invention for achieving the above object, the EMC supply method, the step of supplying a first weight of the EMC powder for molding the semiconductor chip to the tray, measuring the volume of the semiconductor chip and The method may include calculating a second weight of the EMC powder required for molding the semiconductor chip from the calculated volume, and supplying the second weight EMC powder to the tray.

According to an embodiment of the present disclosure, the measuring of the volume of the semiconductor chip may include transferring the substrate on which the semiconductor chip is mounted to a mold for molding the semiconductor chip, and while the substrate is transferred. Acquiring a three-dimensional image of the semiconductor chip; measuring a thickness and an area of the semiconductor chip from the three-dimensional image; and calculating a volume of the semiconductor chip from the thickness and the area of the semiconductor chip. .

According to embodiments of the present invention, the step of supplying the first weight of the EMC powder may be performed during the transfer of the substrate.

According to the embodiments of the present invention as described above, the total weight of the EMC powder required for molding the semiconductor chip can be calculated during the transfer of the substrate, the first weight before the total weight of the EMC powder is calculated Since the EMC powder can be supplied to the tray in advance, the time required for supplying the EMC powder can be greatly shortened.

The invention is now described in more detail with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below and may be embodied in various other forms. The following examples are provided to fully convey the scope of the invention to those skilled in the art, rather than to allow the invention to be fully completed.

When an element is described as being disposed or connected on another element or layer, the element may be placed or connected directly on the other element, and other elements or layers may be placed therebetween. It may be. Alternatively, where one element is described as being directly disposed or connected on another element, there may be no other element between them. Similar reference numerals will be used throughout for similar elements, and the term “and / or” includes any one or more combinations of related items.

Terms such as first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or parts, but the items are not limited by these terms. Will not. These terms are only used to distinguish one element from another. Accordingly, the first element, composition, region, layer or portion described below may be represented by the second element, composition, region, layer or portion without departing from the scope of the invention.

Spatially relative terms such as "bottom" or "bottom" and "top" or "top" may be used to describe the relationship of one element to other elements as described in the figures. Can be. Relative terms may include other orientations of the device in addition to the orientation shown in the figures. For example, if the device is reversed in one of the figures, the elements described as being on the lower side of the other elements will be tailored to being on the upper side of the other elements. Thus, the typical term "bottom" may include both "bottom" and "top" orientations for a particular orientation in the figures. Similarly, if the device is reversed in one of the figures, the elements described as "below" or "below" of the other elements will be fitted "above" of the other elements. Thus, a typical term "below" or "below" may encompass both orientations of "below" and "above."

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used below, what is shown in the singular also includes the plural unless specifically indicated otherwise. In addition, where the terms “comprises” and / or “comprising” are used, they are characterized by the presence of the forms, regions, integrals, steps, actions, elements and / or components mentioned. It is not intended to exclude the addition of one or more other forms, regions, integrals, steps, actions, elements, components, and / or groups.

Unless defined otherwise, all terms including technical and scientific terms have the same meaning as would be understood by one of ordinary skill in the art having ordinary skill in the art. Such terms, such as those defined in conventional dictionaries, will be construed as having meanings consistent with their meanings in the context of the related art and description of the invention, and ideally or excessively intuitional unless otherwise specified. It will not be interpreted.

Embodiments of the invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, embodiments of the present invention are not to be described as limited to the particular shapes of the areas described as the illustrations but to include deviations in the shapes. For example, a region described as flat may generally have roughness and / or nonlinear shapes. Also, the sharp edges described as illustrations may be rounded. Accordingly, the regions described in the figures are entirely schematic and their shapes are not intended to describe the precise shape of the regions nor are they intended to limit the scope of the invention.

Hereinafter, an EMC supply method according to an embodiment of the present invention will be described in detail.

1 is a schematic view for explaining a pickup unit for transferring a substrate on which the semiconductor chip is mounted.

First, the EMC supply method according to an embodiment of the present invention is the EMC powder (2) for molding the semiconductor chip 10 in the molding process for the substrate 12 on which at least one semiconductor chip 10 is mounted; 3) can be used to supply using the tray 20. In particular, it may be used to supply the EMC powder 2 to the tray 20.

The substrate 12 may be withdrawn from a magazine (not shown) in which a plurality of substrates are stored, and then transferred by the pickup unit 30.

Referring to FIG. 1, the pickup unit 30 may be configured to be movable along a rail 32 extending in a horizontal direction, and the substrate 12 may be gripped using a vacuum pressure. One side of the rail 32 may be a loader 50 for transferring the substrate 12 to a mold 40 (see FIG. 2) for molding.

Meanwhile, a vision inspection unit 60 may be disposed below the pickup unit 30 to measure the thickness and area of the semiconductor chip 10 mounted on the substrate 12 transferred by the pickup unit 30. have.

The vision inspection unit 60 may obtain a 3D image of the semiconductor chip 10, and the thickness and area of the semiconductor chip 10 may be measured from the 3D image. The thickness and area of the semiconductor chip 10 may be calculated from the three-dimensional image by the vision inspection unit 60. Alternatively, the three-dimensional image measured by the vision inspection unit 60 may be transmitted to the control unit 62 for controlling the EMC supply, the thickness and area of the semiconductor chip 10 by the control unit 62. This may be calculated.

2 is a schematic view for explaining a loader for transferring the substrate and the tray to a mold for molding and an elevator for transferring the tray in a vertical direction.

Referring to FIG. 2, the substrate 12 may be supported on an upper surface of the loader 50, and a gripper for holding the tray 20 on the lower surface of the loader 50. ) May be provided. That is, the loader 50 may simultaneously transport the substrate 12 and the tray 20 into the mold 40.

The EMC powder 2 may be supplied to the tray 20 by an EMC supply apparatus 100 (see FIG. 3), which will be described later, and the tray 20 to which the EMC powder 2 is supplied is a loading elevator 70. Can be raised by The raised tray 20 may be transferred to the mold 40 by the loader 50 as described above. After supplying the EMC powder 2 into the mold 40, the tray 20 may be taken out of the mold 40 by the loader 50 and lowered by the unload elevator 80. Can be.

A cleaning device (not shown) for removing residual EMC powder 2 in the lowered tray 20 may be disposed below the EMC supply device 100. The tray 20 cleaned by the cleaning device may be lifted by the load elevator 70. Subsequently, the tray 20 may be supported by a tray transfer device 90 (see FIG. 3) disposed below the EMC supply device 100, for example, a Cartesian robot, and the EMC supply device ( 100 may supply the EMC powder 2 into the tray 20. The EMC supply method will be described later.

Although not shown in detail, the tray 20 may include sidewalls defining a space for loading the EMC powder 2 and lower shutters slidably disposed in a horizontal direction under the sidewalls. have. The lower shutters may be opened and closed in a slide manner to supply the EMC powder 2 into the mold 40.

3 is a schematic view for explaining the EMC supply device.

Referring to FIG. 3, the EMC supply apparatus 100 may be used to supply the EMC powder 2 to the tray 20 from a storage container 92 for storing the EMC powder 2. An opening for supplying the EMC powder 2 may be formed in the lower panel of the storage container 92, and is formed by a screw 94 extending in a horizontal direction through the lower space of the storage container 92. EMC powder 2 may fall through the opening in the vertical direction. The screw 94 may extend outward through one sidewall of the storage container 92, and may be connected to a rotation driver 96 for rotating the screw 94. That is, the amount of the EMC powder 2 set by the rotation of the rotary driver 96 may be delivered to the EMC supply device 100.

The EMC supply device 100 may be disposed under the storage container 92. For example, the EMC supply device 100 is disposed below the storage container 92 and includes a container 102 for receiving the EMC powder 2 falling from the storage container 92, and the container ( A trench member 104 extending from one side 102 in one direction, a vibration generator 110 for moving the EMC powder 2 by vibrating the trench member 104, and the like.

Specifically, the container 102 may be disposed below the opening of the storage container 92 to receive the EMC powder 2 and may be open at the top to receive the EMC powder 2. have.

The trench member 104 may be referred to as a trough and may extend horizontally from the front sidewall of the container 102. However, if desired, the trench member 104 may have some downward inclination angle.

The trench member 104 may have a trench used as a passage for carrying the EMC powder 2. The trench may have a shape that gradually narrows downward, that is, a width gradually narrowing downward to reduce the width of the falling EMC powder 2 while the EMC powder 2 falls. For example, the trench member 104 may have a trench having a 'V' shape or a triangular shape, and the container 102 may have an opening connected to the trench.

Although not shown in detail, the tray 20 may include sidewalls defining a space for loading the EMC powder 2 and lower shutters slidably disposed in a horizontal direction under the sidewalls. The lower shutters may be opened and closed in a slide manner to supply the EMC powder 2 into the mold.

The vibration generator 110 is disposed below the vessel 102 and the EMC powder 2 moves in the trench member 104 from the vessel 102 toward the end of the trench member 104. The container 102 and the trench member 104 may be vibrated. Although not shown in detail, the vibration generator 110 may include a piezoelectric element or a rotating body connected to a motor, and may vibrate the container 102 and the trench member 104 at a frequency of about 100 to 400 Hz. Can be.

The EMC powder supply device 100 may include a disturbance blocker 120 for preventing external disturbance, ie, disturbance, from being directly applied to the container 102 and the trench member 104. The disturbance blocking unit 120 may be disposed below the vibration generator 110, and the disturbance is directly applied to the container 102 and the trench member 104 through the vibration generator 110. Can be used to prevent. That is, external disturbances, for example, vibrations or shocks, are directly transmitted to the container 102 and the trench member 104, thereby sufficiently preventing the EMC powder 2 from falling off irregularly. In addition, the vibration generated by the vibration generator 110 may be prevented from being directly transmitted to the molding facility including the EMC powder supply device 100.

The disturbance blocking unit 120 includes an upper plate 122 supporting the vibration generator 110, a lower plate 124 disposed below the upper plate 122, and an upper plate 122 and a lower plate 124. And a damping member 126 for absorbing the disturbance and the vibration. For example, the damping member 126 may include a plurality of coil springs. Although not shown, a pneumatic or hydraulic shock absorber may be additionally disposed in the plurality of coil springs, respectively.

According to one embodiment of the present invention, the EMC supply device 100 may include a weight sensor 130 for measuring the weight of the EMC powder (2) supplied into the container (102). A load cell may be used as the weight sensor 130, and may be disposed to support the disturbance blocking unit 120 under the disturbance blocking unit 120. That is, the weight of the EMC powder 2 introduced into the container 102 may be sensed by the weight sensor 130, and the injected EMC powder 2 may be in the trench by vibration by the vibration generator 110. The weight loss of the EMC powder 2 can be monitored in the course of being fed to the lower EMC tray 20 via the end of the member 104. The controller 62 may control the amount of the EMC powder 2 supplied to the EMC tray 20 using data on the weight change of the EMC powder 2 transmitted from the weight sensor 130.

The EMC supply apparatus 100 according to the present invention is disposed between the end of the trench member 104 and the tray 20 to guide the EMC powder 2 dropped from the trench member 104 to the tray 10. It may include a chute (140). The chute 140 may extend in the vertical direction and have an internal passage for guiding the EMC powder 2. As a result, the EMC powder 2 can be prevented from scattering laterally while the EMC powder 2 is dropped.

The lower end of the chute 140 may be positioned above the tray 20, and the tray 20 may move the tray transfer device 90 while the EMC powder 2 is supplied through the chute 140. It can be moved in the horizontal direction by. In particular, the tray 20 may be moved in a zigzag form by the tray transfer device 90, and thus the EMC powder 2 may be uniformly loaded in the tray 20.

Hereinafter, a method of molding the semiconductor chip 10 and a method of supplying the EMC powder 2 using the molding equipment as described above will be described in detail.

4 is a flowchart illustrating an EMC supply method according to an exemplary embodiment of the present invention, and FIG. 5 is a flowchart illustrating an operation of measuring a volume of a semiconductor chip.

Referring to FIG. 4, in step S100, the EMC powder 2 having a first weight may be supplied to the tray 20 for molding the semiconductor chip 10. Here, one or a plurality of semiconductor chips 10 may be mounted on the substrate 12, wherein the first weight is about 70 to 90 weight based on the total weight of the EMC powder 2 supplied in the previous molding process. It may be about%.

In operation S200, the volume of the semiconductor chip 10 may be measured. In particular, the volume of the semiconductor chip 10 may be obtained by using the three-dimensional image acquired by the vision inspection unit 60 while the substrate 12 is transferred to the loader 50 by the pickup unit 30. Can be measured. The step of measuring the volume of the semiconductor chip 10 will be described in more detail as follows.

Referring to FIG. 5, in operation S210, the substrate 12 on which the semiconductor chip 10 is mounted may be transferred to a mold 40 for molding the semiconductor chip 10. In particular, the substrate 12 may be transported by the pickup unit 30 and the loader 50.

In operation S220, a three-dimensional image of the semiconductor chip 10 may be acquired while the substrate 12 is transferred. In particular, the three-dimensional image may be obtained by the vision inspection unit 60 while the substrate 12 is transferred to the loader 50 by the pickup unit 30.

In operation S230, the thickness and area of the semiconductor chip 10 may be measured from the three-dimensional image. The thickness and area of the semiconductor chip 10 may be measured using the three-dimensional image. It may be calculated by the control unit, or alternatively by the control unit 62 for controlling the EMC supply.

In operation S240, the volume of the semiconductor chip 10 may be calculated from the thickness and the area of the semiconductor chip 10. In particular, the volume of the semiconductor chip 10 may be calculated by the controller 62 using the thickness and area of the semiconductor chip 10.

Referring back to FIG. 4, in operation S300, a second weight of the EMC powder 2 required for molding the semiconductor chip 10 may be calculated from the calculated volume of the semiconductor chip 10. Specifically, the total weight of the EMC powder 2 necessary for molding the semiconductor chip 10 may be calculated from the volume of the semiconductor chip 10, and the EMC powder may be subtracted from the total weight by subtracting the first weight. The second weight of (2) can be calculated.

In step S400, the EMC powder 2 of the second weight may be supplied to the tray 20.

According to one embodiment of the invention, the first weight of the EMC powder 2 may be supplied while the substrate 12 is transferred to the loader 50. That is, since the first powder of EMC powder 2 is supplied in advance of the volume calculation of the semiconductor chip 10, the time required for supplying the EMC powder 2 to the tray 20 is greatly increased. Can be shortened. As a result, after the total weight of the EMC powder 2 required for molding the semiconductor chip 10 is calculated, the EMC powder 2 of the second weight is supplied to the tray 20. The time required for the supply of can be shortened by about 10 to 30% compared to the conventional case.

Meanwhile, the tray 20 to which the EMC powder 2 is supplied as described above may be transferred to the loader 50 through the loading elevator 70, and the substrate 12 may be transferred by the loader 50. Together with the mold 40 can be transferred.

According to the embodiments of the present invention as described above, by supplying the EMC powder required for molding the semiconductor chip to the tray in advance before the volume of the semiconductor chip is calculated can greatly shorten the time required to supply the EMC powder have. As a result, the overall time required for molding the semiconductor chip can be shortened, and accordingly, the productivity of the semiconductor device can be greatly improved.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims It can be understood that

1 is a schematic view for explaining a pickup unit for transferring a substrate on which a semiconductor chip is mounted.

2 is a schematic view for explaining a loader for transferring the substrate and the tray to a mold for molding and an elevator for transferring the tray in a vertical direction.

3 is a schematic view for explaining an EMC supply device.

4 is a flowchart illustrating an EMC supply method according to an embodiment of the present invention.

5 is a flowchart for explaining a step of measuring a volume of a semiconductor chip.

Explanation of symbols on the main parts of the drawings

2: EMC powder 10: semiconductor chip

12: substrate 20: tray

30: pickup unit 40: mold

50: loader 60: vision inspection unit

62: control unit 70: loading elevator

80: unloading elevator 90: tray transfer device

100: EMC supply

Claims (3)

Supplying a first weight of epoxy molding compound powder for molding of a semiconductor chip to a tray; Measuring a volume of the semiconductor chip; Calculating a second weight of the epoxy molding compound powder required for molding the semiconductor chip from the calculated volume; And Supplying said second weight of epoxy molding compound powder to said tray. The method of claim 1, wherein the measuring of the volume of the semiconductor chip comprises: Transferring a substrate on which the semiconductor chip is mounted to a mold for molding the semiconductor chip; Acquiring a three-dimensional image of the semiconductor chip while the substrate is transferred; Measuring a thickness and an area of the semiconductor chip from the three-dimensional image; And And calculating a volume of the semiconductor chip from the thickness and the area of the semiconductor chip. 3. The method of claim 2, wherein the step of supplying the first weight of epoxy molding compound powder is carried out while transferring the substrate.
KR1020080129598A 2008-12-18 2008-12-18 Method of supplying epoxy molding compound into tray KR101042692B1 (en)

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Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020080129598A KR101042692B1 (en) 2008-12-18 2008-12-18 Method of supplying epoxy molding compound into tray

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KR20100070866A true KR20100070866A (en) 2010-06-28
KR101042692B1 KR101042692B1 (en) 2011-06-20

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Publication number Priority date Publication date Assignee Title
JP4373237B2 (en) * 2004-02-13 2009-11-25 Ｔｏｗａ株式会社 Semiconductor chip resin sealing molding method and resin sealing molding die
KR101303856B1 (en) * 2007-05-25 2013-09-04 세메스 주식회사 Apparatus of aligning an epoxy molding compound and auto molding system having the same

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