KR100776630B1 - Resin compression molding system for semiconductor device and method for molding semiconductor device with resin using the same - Google Patents

Abstract

A resin compression molding system for a semiconductor device and a method for molding the semiconductor device are provided to mold a plurality of products simultaneously or sequentially by controlling the number of molding blocks or molds. A resin compression molding system for a semiconductor device includes a material supply block, a molding block, and an inspection/ejection block. The material supply block transfers a frame in a length direction and measures a thickness of the semiconductor device. The material supply block rotates the frame by 90 degrees and delivers the frame in a width direction. The molding block is removably arranged on the material supply block and places the frame on a mold. The frame is molded. The inspection/ejection block is removably arranged on the molding block and inspects the molded frame. The inspection/ejection block rotates the frame by 90 degrees and ejects the frame in the length direction.

Description

Resin compression molding system for semiconductor device and method for molding semiconductor device with resin using the same}

1 is a conceptual diagram schematically showing a material supply block of a resin compression molding apparatus for a semiconductor device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a molded article supply apparatus of a material supply block of the resin compression molding apparatus for a semiconductor device of FIG. 1.

3 is a perspective view of a picker portion of the resin compression molding apparatus for semiconductor device of FIG. 1.

FIG. 4 schematically shows the configuration of the resin supply portion of the resin compression device for semiconductor element of FIG. 1.

FIG. 5 is a perspective view of a resin supply part of the resin compression device for semiconductor elements of FIG. 1. FIG.

6 is a conceptual view schematically illustrating a molding block of a resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present disclosure.

7 is a conceptual view schematically illustrating an inspection / ejection block of a resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present disclosure.

8 is a conceptual view schematically showing a resin compression molding apparatus for semiconductor holding according to an embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

100: material supply block, 110: magazine stage

120: magazine elevator, 130: sensor

140: preheating unit, # 145: picker unit

150: resin supply unit, # 200: molding block

210: loading picker, 220: mold

230: film supply unit, # 240: unloading picker

300: inspection / ejection block, # 310: picker portion

320: cooling unit, 330: sensor unit

340: magazine elevator, 350: magazine stage

The present invention relates to a resin compression molding device for semiconductor devices and a semiconductor device resin molding method using the same. In particular, the present invention relates to a resin compression molding apparatus for semiconductor devices and a semiconductor device resin molding method for compression molding a semiconductor device using a resin powder.

In the semiconductor manufacturing process, there is a process of molding with a resin in order to protect the semiconductor device, and the apparatus used at this time is called a resin molding apparatus.

In general, a resin molding apparatus employs an injection molding method of placing a semiconductor element in a cavity in which molding is performed, and supplying molten resin to the space to mold the semiconductor element into the resin.

Since the resin molding apparatus for injection molding needs to supply resin to the space in which the molding is performed, a passage for supplying the resin is required, and thus there is a problem in that the resin is filled and molded to the passage. Since the resin molded in the passage shape should be cut and discarded through a subsequent process, it causes a waste of the resin.

In addition, the resin molding apparatus for injection molding needs to supply the resin using the passage to fill the space with the resin, so that the resin must be supplied at a predetermined pressure or higher, so that the speed or pressure of the resin introduced into the passage is increased. It must be large. Therefore, the resin supplied at such a high pressure may apply strong pressure to the semiconductor device and the wiring connected to the semiconductor device. Therefore, when the conventional resin molding apparatus for injection molding is used, the semiconductor element and the wiring may be deformed. This is especially a problem when molding a semiconductor device which is highly integrated and has a complicated internal circuit configuration.

On the other hand, when the injection pressure of the resin is reduced in order to prevent such deformation in the resin molding apparatus for injection molding, the resin may not be able to sufficiently fill the space, thereby forming bubbles or voids in the space, poor quality May cause.

SUMMARY OF THE INVENTION An object of the present invention is to provide a resin compression molding apparatus for a semiconductor device which can reduce the effect on the semiconductor device and the wiring of the semiconductor device to be molded.

It is still another object of the present invention to provide a semiconductor device resin molding method capable of reducing the effect on the semiconductor device and the wiring of the semiconductor device to be molded.

It is still another object of the present invention to provide a semiconductor device resin molding method capable of quickly and automatically supplying an appropriate amount of resin to a semiconductor device to be molded.

In order to solve the above technical problem, the resin compression molding apparatus for a semiconductor device according to an aspect of the present invention measures the thickness of the semiconductor device while moving the frame in which the semiconductor device is mounted in the longitudinal direction, and measures the frame 90. A material supply block which rotates and delivers in the width direction; A molding block detachably provided at the material supply block and configured to mold the frame by placing the frame transferred in the width direction in a mold; And an inspection / ejection block detachably provided at the molding block, inspecting the frame molded in the molding block, and discharging the frame in a longitudinal direction by rotating the frame by 90 degrees.

According to another aspect of the present invention, there is provided a semiconductor device resin compression method comprising: measuring a thickness of the semiconductor device while moving a frame in which the semiconductor device is mounted in a longitudinal direction; Preparing an amount of resin corresponding to a thickness measurement result of the semiconductor device; Rotating the frame 90 degrees to a width direction and transferring the frame together with the resin; Molding the frame with the resin; And inspecting the molded frame and rotating it 90 degrees to discharge it in the longitudinal direction.

Resin compression molding apparatus for a semiconductor device according to another aspect of the present invention includes a sensor for measuring the thickness of the semiconductor device mounted on the frame; At least one preheater to preheat the frame; A picker unit which picks up the frame and sequentially transfers the sensor and the preheater to a length direction of the frame, and rotates the frame picked up from the preheater by 90 degrees to a loading picker in a width direction; A resin feeder for supplying resin to the conveying tray; A resin metering control unit for calculating an amount of resin suitable for the frame from the thickness measurement result of the semiconductor element, and controlling the resin supply speed and amount of the resin feeder accordingly; And an elevator for raising the conveying tray supplied with the resin to the loading picker, and lowering the empty conveying tray for delivering the resin to the resin feeder.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention.

Hereinafter, a resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present invention will be described in detail with reference to FIGS. 1 to 8.

The resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present invention includes three blocks, such as a material supply block 100, a molding block 200, and an inspection / ejection block 300.

The material supply block 100 calculates the amount of resin powder necessary for molding the frame on which the semiconductor device is mounted, when the frame on which the semiconductor device is to be molded is mounted is introduced, and the frame on which the semiconductor device is mounted is 90 degrees. After rotation, it is fed to the molding block 200 together with the calculated amount of resin powder. Here, the frame on which the semiconductor element is mounted is manufactured by mounting a semiconductor element on the frame, and then wiring the element and the frame by wire bonding.

The molding block 200 is detachably provided in the material supply block 100, supplies the frame on which the semiconductor element is mounted and the resin to a mold, and applies a pressure to the frame on which the semiconductor element is mounted to the resin powder. Mold with.

The inspection / ejection block 300 is detachably provided in the molding block 200, and inspects a frame in which the semiconductor element molded of resin is mounted in the molding block 200 and rotates 90 degrees when properly molded. After that, it is discharged in a subsequent process.

Here, each block such as the material supply block 100, the molding block 200 and the inspection / discharge block 300 is configured independently of each other and can be separated and managed according to the needs of the operator.

In addition, when each block is configured independently of each other as in the embodiment of the present invention, the number of the molding block 200 can be selected and arranged appropriately according to the purpose. In addition, according to an embodiment of the present invention, the molds included in the molding block 200 may also be configured independently of each other. Therefore, when the resin compression molding apparatus for semiconductor devices of the present invention is used, the number of molds can be properly adjusted according to the purpose, and accordingly, a plurality of molds can be molded simultaneously or sequentially in a plurality of molds. Suitable for production

Hereinafter, the material supply block 100 will be described in more detail with reference to FIGS. 1 to 5.

As shown in FIGS. 1 to 5, the material supply block 100 includes a magazine stage 110, a magazine elevator 120, a sensor 130, a preheating unit 140, a picker unit 145, and a resin supply unit ( 150).

The magazine stage 110 supplies a magazine into which a frame on which a semiconductor device as a molded product is mounted is introduced. To this end, the magazine stage 110 includes a plurality of stages capable of storing a plurality of magazines, and supplies the magazine using the magazine elevator 120 and the magazine gripper.

The magazine elevator 120 receives the magazine from the magazine stage 110 and raises the magazine to a predetermined height. The magazine gripper then also grips and transports the magazine, which also functions to match the magazine to the transfer line.

The magazine raised to a predetermined height is moved to a position where the frame pusher 111 is provided, and the frame pusher 111 pushes the frames on which the semiconductor elements stored in the magazine are mounted, respectively, and the sensor 130. To pass). In this case, a frame guide unit may be further provided between the sensor and the frame pusher in order to accurately deliver the frame to the sensor 130.

As shown in FIG. 2, the magazine stage 110, the magazine elevator 120, the magazine gripper, the frame pusher 111, and the frame guide as a whole constitute a molded object supply device. The molded article supply device shown in FIG. 2 is only one example, and if it is possible to supply a frame equipped with a semiconductor element as a molded article and supply the same to a sensor, it is interpreted that it belongs to the protection scope of the molded article supply device of the present invention. Do.

The sensor 130 receives the frame on which the semiconductor device is mounted from the molded object supply device, measures the thickness of the semiconductor device mounted on the frame and the size of the semiconductor device, and transmits the measured frame to the resin supply unit 150.

The preheater 140 receives the frame located in the sensor 130 through the picker unit 145, and preheats the transferred frame and the mounted semiconductor device to a predetermined temperature. The preheating temperature is preferably between room temperature and the molding temperature of the mold. As described above, in the present invention, the semiconductor device and the frame to be molded are preheated to a predetermined temperature in advance to shorten the process time during the molding process in the mold. On the other hand, if the preheating of the semiconductor device and the frame in the preheating unit 140 is not properly performed, a sudden temperature change occurs in the semiconductor device and the frame during the molding process may cause deformation or the like in the semiconductor device or the frame may cause a defect. It becomes possible.

In the exemplary embodiment of the present invention, the preheating unit 140 is provided as a plurality as shown in FIG. 1, thereby preheating the semiconductor device and the frame as a whole by allowing the plurality of frames to be preheated in the preheating step that takes a relatively long time. It can be shortened.

The picker unit 145 picks up the frame on which the semiconductor element is mounted from the sensor 130 and lowers it to an empty position among the plurality of preheating units 140, and picks up the preheated frame sufficiently to load the molding block 200. Transfer to a frame housing (not shown) of the picker 210.

At this time, the picker unit 145 rotates the frame by 90 degrees and delivers the preheated frame to the loading picker 210. Since the frame is rotated by 90 degrees by the picker unit 145 as described above, the loading picker 210 can supply the frame to the mold in the molding block 200 without the need to rotate the frame separately. In addition, the molding block 200 may be disposed vertically with respect to the direction of the frame on the material supply block 100 to effectively utilize the space for the mold arrangement in the molding block 200.

To this end, the picker unit 145 has a structure that can be moved in one direction to the sensor 130, the preheater 140, and the loading picker 120, as shown in FIG. It is composed of a structure that can be.

The resin supply unit 150 receives the thickness of the semiconductor device and the size measurement of the semiconductor device from the sensor 130, calculates the amount of resin necessary for the frame on which the semiconductor device is mounted, and calculates the amount of resin powder. Is spread evenly in the transport groove of the transport tray, and the transport tray is transferred to the transport tray receiving portion of the loading picker 210 of the molding block 200.

Hereinafter, the resin supply unit 150 of the present invention will be described in more detail with reference to FIGS. 4 and 5.

4 and 5, the resin supply unit 150 according to an embodiment of the present invention is a loader buffer 151, buffer picker 158, elevator 152, cleaner buffer 153, tray three A government unit 154, a tray transfer unit 155, a resin supply unit 156, a cooling unit 157, and a resin metering control unit 159 are included.

Here, the loader buffer 151 receives the empty transport tray from the loading picker 210.

The elevator 152 raises or lowers the transport tray to the top, the middle, and the bottom, raises the transport tray from the bottom to the top when the transport tray supplied with the resin by the resin feeder 156 is transferred to the bottom, and the loader When the empty transport tray T of the buffer 151 is delivered to the top through the buffer picker 158, the transport tray is lowered from the top to the stop.

The cleaner buffer 153 receives the empty transport tray from the stop of the elevator 152 and delivers the empty transport tray to the tray cleaning unit 154.

The tray cleaner 154 cleans the empty transport tray received from the cleaner buffer 153.

The tray transporter 155 transfers the empty transport tray cleaned from the tray cleaner 154 to the resin feeder 156.

Here, the loader buffer 151, the cleaner buffer 153, the tray cleaning unit 154, and the tray transfer unit 155 is disposed in the vertical direction so as to correspond to the top, middle, and bottom of the elevator 152, respectively.

The resin feeder 156 supplies resin to the empty conveyance tray delivered from the tray conveying unit 155.

The resin metering control unit 159 calculates the amount of resin suitable for the frame from the thickness measurement result of the semiconductor element, and controls the resin supply speed and amount of the resin feeder 156 accordingly.

Such, the material supply block 100 according to an embodiment of the present invention, as shown in Figure 1, the resin supply unit 150, the magazine stage 110, the magazine elevator 120, and the frame pusher The 111 is positioned to be arranged side by side, and the sensor 130 and the preheater 140 are positioned next to each other. Therefore, the frame introduced into the material supply block 100 is transferred along the U-shaped transfer line.

As such, the material supply block 100 may be disposed in a U-shape in a narrow space of the configuration to increase space utilization.

Hereinafter, the molding block 200 will be described in more detail with reference to FIG. 6.

As shown in FIG. 6, the molding block 200 includes a loading picker 210, molds 220-1, 220-2, 220-3, and 220-4, a film supply unit 230, and an unloading picker ( 240).

The loading picker 210 transfers, from the picker unit 145 and the resin supply unit 150, a frame on which semiconductor elements are mounted, and a transport tray on which resin powder is loaded, to a frame storage unit and a transport tray storage unit respectively positioned at upper and lower portions thereof. After receiving, the frame and the resin powder is delivered to one of the mold (220-1, 220-2, 220-3, 220-4). At this time, the loading picker 210 delivers the resin powder to the lower mold of the mold (220-1, 220-2, 220-3, 220-4), and delivers the frame to the upper mold. At this time, the lower mold of the mold (220-1, 220-2, 220-3, 220-4) is provided with a film, the resin powder is to be delivered to the upper film.

In the molds 220-1, 220-2, 220-3, and 220-4, a frame in which a semiconductor element is mounted is transferred to the upper mold, and when resin powder is transferred to the lower mold, the upper mold is brought into contact with the lower mold and a constant temperature and pressure are applied. Is applied for a predetermined time to melt the resin powder to mold the frame.

In the exemplary embodiment of the present invention, as shown in FIG. 6, a plurality of molds 220-1, 220-2, 220-3, and 220-4 are installed, and thus, a molding process that takes time is performed through a plurality of molds ( 220-1, 220-2, 220-3, 220-4) to shorten the time of the molding process as a whole. Accordingly, the loading picker 210 may use the frame and the resin on which the semiconductor element is mounted on the frame on which the semiconductor element is mounted and the resin powder is not transferred, among the molds 220-1, 220-2, 220-3, and 220-4. Will be supplied.

The film supply unit 230 is positioned around the molds 220-1, 220-2, 220-3, and 220-4 and on the molds 220-1, 220-2, 220-3 and 220-4. Feed the film. After that, the film supply unit 230 is molded in the mold (220-1, 220-2, 220-3, 220-4), the frame molded by the unloading picker 240 is transferred, the mold Remove the film at (220-1, 220-2, 220-3, 220-4).

Thus, in the embodiment of the present invention by supplying a film between the mold (220-1, 220-2, 220-3, 220-4) and the resin powder, the frame can be easily separated from the mold, and also molding Residual resin can be suppressed in a metal mold | die after a process. Therefore, it is possible to prevent defects that may occur due to residual resin powder in the mold.

The unloading picker 240 picks up a molded frame located in the molds 220-1, 220-2, 220-3, and 220-4 where the molding process is completed, and transfers the molded frames to the inspection / ejection block 300. In this case, the unloading picker 240 may further include a washing unit for washing the molds 220-1, 220-2, 220-3, and 220-4.

Hereinafter, the inspection / ejection block 300 will be described in more detail with reference to FIG. 7.

As shown in FIG. 7, the inspection / ejection block 300 includes a picker unit 310, a cooling unit 320, a sensor unit 330, a magazine elevator 340, and a magazine stage 350.

The picker unit 310 picks up the molded frame from the unloading picker 240 of the molding block 200 and transfers the molded frame to the cooling unit 320. In addition, the picker unit 310 transmits the frame cooled by the cooling unit 320 to the sensor unit 330. At this time, when the picker unit 310 transmits the cooled frame to the sensor unit 330, the picker unit 310 rotates the frame by 90 degrees and transmits it.

Since the frame is rotated by 90 degrees by the picker unit 310 as described above, the sensor unit 330 can transmit the frame to the magazine stage 350 without having to rotate the frame separately. In addition, the magazine stage 350 can arrange the magazine perpendicularly to the direction of the frame in the cooling unit 320 to efficiently utilize the space in the inspection / discharge block 300. To this end, the picker unit 310 may be configured in a structure similar to the picker unit 145.

The cooling unit 320 cools the molded frame transferred from the picker unit 310 to a predetermined temperature. At this time, the cooling unit 320 may be configured to cool the molded frame using a heat sink of air or low temperature. In FIG. 7, one cooling unit 320 is illustrated, but a plurality of cooling units 320 may be provided as necessary.

The sensor unit 330 measures the thickness of the molded frame transferred from the picker unit 310 to evaluate whether molding of the semiconductor device is performed properly. In this case, the molding frame is properly delivered to the magazine stage 350, and in the case of a defective product that is not molded properly, the frame is distinguished from the good product and transferred to a separate inspection stage (not shown).

Inspection / discharge block 300 according to an embodiment of the present invention, as shown in Figure 7, the picker unit 310, the cooling unit 320, the sensor unit 330 is positioned to be arranged side by side, next to The magazine elevator 340 and magazine stage 350 are positioned to be arranged side by side. Therefore, the molded frame introduced into the inspection / ejection block 300 is transported along the U-shaped transfer line, inspected and discharged.

As such, the inspection / discharge block 300 may be disposed in a U-shape in a narrow space of the configuration to increase space utilization.

As described above, in the resin compression molding apparatus for a semiconductor device according to the exemplary embodiment of the present invention, the material supply block 100, the molding block 200, and the inspection / ejection block 300 are independently configured. 8 shows the material supply block 100, the molding block 200, and the inspection / discharge block 300 connected to each other.

Hereinafter, a semiconductor element resin molding method using the resin compression molding apparatus for semiconductor elements shown in FIGS. 1 to 8 will be described in detail.

First, the operation in the material supply block 100 is as follows.

When the magazine stage 110 is positioned to face the frame pusher 111 through the magazine elevator 120, the magazine equipped with a frame on which the semiconductor element is mounted, the frame pusher 111 pushes the frames in the magazine one by one to the sensor ( 130).

Then, the sensor 130 measures the thickness of the semiconductor device mounted on the frame and the size of the semiconductor device and transmits the measured thickness to the resin metering control unit 159 of the resin supply unit 150.

Thereafter, the picker unit 145 picks up the frame from the sensor 130 and lowers it to an empty position among the plurality of preheaters 140, and the preheater 140 preheats the frame and the mounted semiconductor element to a predetermined temperature. do. The preheating temperature is preferably between room temperature and the molding temperature of the mold.

Meanwhile, the picker unit 145 lowers the frame to an empty position among the plurality of preheaters 140, and simultaneously picks up a frame that is sufficiently preheated by the preheater 140 to load the picker 210 of the molding block 200. To the frame housing (not shown).

On the other hand, the resin metering control unit 159 receives the thickness or size value of the frame on which the semiconductor element is measured from the sensor 130, and controls the resin feeder 156 to load an appropriate amount of resin in the transport tray.

The transport tray loaded with the resin is transferred to the lower end of the elevator 152 through the tray transfer unit 155.

The elevator 152 raises the transport tray loaded with the resin to the upper end, and the transport tray thus raised is picked up by the loading picker 120 and transferred to the mold of the molding block 200.

Meanwhile, before the pickup picker 120 picks up the transport tray loaded with resin, the loading picker 120 transfers the resin loaded in the mold of the molding block 200 to lower the transport tray emptied to the loader buffer 151.

The empty transport tray delivered by the loading picker 120 is transferred to the top of the elevator 152 after the picker 120 picks up the transport tray loaded with the resin placed on the top of the elevator 152. The elevator 152 then lowers the delivered transport tray from the top to the stop.

Then, the cleaner buffer 153 receives the transport tray from the stop of the elevator 152 and delivers it to the tray cleaning unit 154, and the tray cleaning unit 154 cleans both the upper and lower surfaces of the transport tray.

The transport tray cleaned in the tray cleaning unit 154 is transferred back to the resin feeder 156 through the tray transfer unit 155 to receive the resin.

As such, the resin supply unit 150 according to the exemplary embodiment of the present invention may continuously transfer a transport tray for transporting the resin to the resin feeder 156, and correspond to the semiconductor element corresponding to the continuously transferred transport tray. The amount of resin to be added can be continuously and accurately fed quickly. In addition, the resin supply unit 150 recovers the transport trays used for molding the semiconductor elements from the molding block 200, and uses them by quickly cleaning the transport trays while transferring the recovered transport trays to the resin feeder 156. The total number of conveying trays to be reduced can be reduced, and the resin supply speed can be improved because the supply of resin is not interrupted for cleaning of the conveying trays.

As described above, the material supply block 100 measures the thickness and size of the semiconductor device through the sensor 130 and the preheater 140 disposed along the moving path of the frame, and the frame and While preheating the semiconductor element, not only the amount of resin corresponding to the semiconductor element can be supplied to the resin transport tray using the measured thickness and size, but also the used transport tray can be cleaned. Therefore, the material supply block 100 according to an embodiment of the present invention can continuously and quickly supply the frame on which the semiconductor element is mounted and the resin transport tray loaded with the resin corresponding to the frame to the molding block 200. It is particularly suitable for mass production equipment.

Next, the operation in the molding block 200 will be described.

The loading picker 210 picks up a plurality of molds 220-1, 220-2, and 220 from the material supply block 100 by picking up a frame on which the semiconductor element is mounted and a resin carrying tray loaded with a resin corresponding to the frame. -3, 220-4) to the available mold to deliver.

At this time, the film supply unit 230 installs a film so that the film is positioned on the upper upper mold before the resin is transferred to the lower mold. At this time, the film may be adsorbed and fixed by using a vacuum hole (not shown) provided in the lower mold lower part of the mold.

Then, the loading picker 210 delivers the resin loaded in the resin transport tray to the film of the upper upper mold.

On the other hand, the loading picker 210 delivers the frame to the upper mold of the mold.

Then, the molds 220-1, 220-2, 220-3, and 220-4 contact the upper mold with the lower mold, and apply a constant temperature and pressure for a predetermined time to melt the resin powder to mold the frame. .

Then, when molding is completed, the molds 220-1, 220-2, 220-3, and 220-4 separate the upper and lower molds, and the unloading picker 240 picks up the molded frame. . At this time, the film installed on the lower mold allows the molded frame to be easily separated from the lower mold of the mold.

Meanwhile, the unloading picker 240 picks up the molded frame and simultaneously washes the upper and lower molds of the molds 220-1, 220-2, 220-3, and 220-4 using a washing unit.

The unloading picker 240 then delivers the picked up frame to the inspection / ejection block 300.

Next, the operation in the inspection / ejection block 300 will be described.

The unloading picker 240 transmits the molded frame to the picker unit 310, and the picker unit 310 delivers the transferred frame to the cooling unit 320. The cooling unit 320 cools the transmitted frame to a predetermined temperature or less.

Then, the picker unit 310 picks up the cooled frame again and transfers the cooled frame to the sensor unit 330, and the sensor unit 330 measures the thickness of the transferred frame to evaluate the molding of the semiconductor device.

Then, the picker unit 310 picks up the frame evaluated by the sensor unit 330, rotates it 90 degrees, and transmits the frame to the magazine stage 350. At this time, the magazine stage 350 separately loads the frame in which the molding is performed properly and the defective product which is not.

As described above, in the resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present invention, each block, such as a material supply block, a molding block, and an inspection / ejection block, may be independently configured and separately managed according to a worker's needs. Therefore, the resin compression molding apparatus for semiconductor elements of the present invention can appropriately adjust the number of molding blocks or the number of molds in the molding block according to the purpose. Therefore, when the resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present invention is used, a plurality of desired molded articles may be simultaneously or sequentially molded in a plurality of molds, thereby facilitating a large amount of molded articles.

In addition, in the resin compression molding apparatus for a semiconductor device according to an exemplary embodiment of the present disclosure, the inspection / ejection unit may be separated into blocks. Therefore, the inspection / ejection block may be easily replaced with a new block according to the purpose of the inspection method.

In addition, in the resin compression molding apparatus for a semiconductor device according to an embodiment of the present invention, by using only an amount of resin suitable for a semiconductor device to be molded, the waste of resin can be improved, and since only an appropriate amount of resin is used, molding When the pressure applied to the semiconductor device and the wire is not excessive, the deformation of the semiconductor device and the wire can be prevented, and voids can be prevented inside and outside after molding, thereby greatly reducing the defect rate of the semiconductor device.

Although the preferred embodiments of the present invention have been described above, the present invention is not limited thereto, and various modifications and changes can be made within the scope of the claims and the detailed description of the invention and the accompanying drawings. Naturally, it belongs to the range of.

Claims (8)

A material supply block which measures the thickness of the semiconductor element while moving the frame on which the semiconductor element is mounted in the longitudinal direction, and rotates the frame by 90 degrees to transfer it in the width direction; A molding block detachably provided at the material supply block and configured to mold the frame by placing the frame transferred in the width direction in a mold; And Removably provided in the molding block, and the resin compression for semiconductor device comprising a test / discharge block for inspecting the frame molded in the molding block, and rotates the frame 90 degrees to discharge in the longitudinal direction Molding device. The method of claim 1, The material supply block is And a resin corresponding to a result of the thickness measurement of the semiconductor element at the same time as the frame. The method of claim 1, The molding block is a resin compression molding apparatus for the semiconductor device, characterized in that it comprises one or more molds detachable from each other. Measuring the thickness of the semiconductor device while moving the frame on which the semiconductor device is mounted in the longitudinal direction; Preparing an amount of resin corresponding to a thickness measurement result of the semiconductor device; Rotating the frame by 90 degrees to a width direction and transferring it with the resin; Molding the frame with the resin; And Inspecting the molded frame, rotating it 90 degrees and discharging it in the longitudinal direction; Semiconductor device resin molding method comprising a. A sensor for measuring a thickness of the semiconductor device mounted on the frame; At least one preheater to preheat the frame; A picker unit which picks up the frame and sequentially transfers the sensor and the preheater to a length direction of the frame, and rotates the frame picked up from the preheater by 90 degrees to a loading picker in a width direction; A resin feeder for supplying resin to the conveying tray; A resin metering control unit for calculating an amount of resin suitable for the frame from the thickness measurement result of the semiconductor element, and controlling the resin supply speed and amount of the resin feeder accordingly; And An elevator which raises the conveying tray supplied with the resin to the loading picker and lowers the empty conveying tray to the resin feeder; Resin compression molding device for a semiconductor device comprising a. The method of claim 5, A magazine stage for supplying a magazine into which the frame is introduced; And A frame pusher for pushing the frame in the magazine and discharged to the sensor; The magazine stage and the frame pusher are disposed in parallel with the sensor and the preheating unit. The method of claim 5, A loader buffer receiving the empty transport tray to the loading picker; A tray cleaning unit for cleaning the empty transport tray; And A tray conveying unit for transferring the cleaned empty conveying tray to the resin feeder; Include more, And said loader buffer, said tray cleaning section, and said tray conveying section are arranged in a vertical direction so as to correspond to the top, middle, and bottom of said elevator, respectively. The method of claim 7, wherein And a cleaner buffer which receives the empty transport tray from the elevator and transfers the empty transport tray to the tray cleaning unit, above the tray cleaning unit.

Images