KR20100063313A - Display device including sealent guide pattern and method for fabricating the same - Google Patents

Abstract

PURPOSE: A display device and a method for manufacturing the same are provided to prevent the escape of a sealant from the non-display area of a discharge position by forming a pattern for guide the discharge of the sealant. CONSTITUTION: A first substrate(105) and a second substrate(110) include a display region and a non-display region and opposes to each other. A driving unit corresponds to the display region on the first substrate. A display unit corresponds to the display region on the second substrate. Guide patterns(172, 174) are installed in the non-display region of the first substrate or the second substrate. The discharge position of a sealant is guided by the guide patterns. A seal pattern(190) is located on the guide patterns.

Description

Display device including sealent guide pattern and method for fabricating the same}

The present invention relates to a display device including a guide pattern for guiding a sealant and a manufacturing method thereof.

CRT (Cathode Ray Tube), one of the commonly used display devices, is mainly used for monitors such as TVs, measuring devices, and information terminal devices.However, due to the weight and size of the CRT itself, the size and size of electronic products are reduced. Could not respond actively. In order to solve the CRT problem, various flat panel display devices such as liquid crystal display (LCD), plasma display panel (PDP), organic electro-luminescent display (OELD), and vacuum fluorescent display (VFD) have been proposed and utilized. have. Most flat panel displays are manufactured using transparent glass substrates. Among the flat panel display devices, the organic light emitting display device and the liquid crystal display device have the advantages of miniaturization, light weight, thinness, and low power driving.

1 is a circuit diagram of a unit pixel of an organic light emitting diode according to the prior art, FIG. 2 is a cross-sectional view of an organic light emitting diode according to the prior art, and FIG. 3 is a plurality of organic light emitting diodes according to the prior art. 4 is a schematic view showing a seal pattern method using a seal dispenser according to the prior art, and FIG. 5 is a photograph showing a case in which a sealant is discharged to a cutting region of the mother substrate in the prior art. 6 is a photograph illustrating a case in which a sealant is discharged to a display area according to the related art.

As shown in FIG. 1, the unit pixel of the organic light emitting diode includes a switching transistor Ts, a driving transistor Td, a storage capacitor Cst, and an organic light emitting diode E. The pixel region P is defined by the gate line GL and the data line DL perpendicular to the gate line GL, and is separated from the data line DL, and the power line PL for applying a power voltage. ) Is formed. A switching transistor Ts is formed at an intersection point of the gate line GL and the data line DL, and a driving transistor Td electrically connected to the switching transistor Ts is formed. The driving transistor Td is electrically connected to the organic light emitting diode E.

The organic electroluminescent device 1 of the prior art shown in FIG. 2 is manufactured by the bonding of the 1st board | substrate 5 and the 2nd board | substrate 10 which are manufactured separately. In addition, the first substrate 5 or the second substrate 10 of the organic light emitting diode 1 is manufactured in large numbers on the large mother substrate 13 and finished as shown in FIG. After cutting, separate.

Referring to FIGS. 1 and 2, the organic light emitting diode according to the related art will be described below. As shown in FIGS. 1 and 2, the organic light emitting diode 1 is divided into a display area AA in which an image is implemented and a non-display area NAA in which an image is not implemented, and the first substrate is bonded to face each other. And a second substrate 10. The display area AA is formed by the pixel area P defined by the intersection of the gate line GL and the data line DL, the driving region Dr in which the driving transistor Td is formed, and the data line DL. Divided into a data area D.

On the first substrate 5, switching transistors positioned at intersections of the gate line GL, the data line DL, the gate line GL, and the data line DL, which cross each other and define the pixel region P, Ts), the drain contact hole DCH covering the driving transistor Td connected to the switching transistor Ts, the switching transistor Ts and the driving transistor Td, and exposing the drain electrode 34 of the driving transistor Td. A connecting electrode 70 connected to the drain electrode 34 is sequentially formed through the passivation layer 55 and the drain contact hole DCH. The driving transistor Td includes a gate electrode 25, a semiconductor layer 42 formed of an active layer 40 and an ohmic contact layer 41, and a source electrode 32 and a drain electrode 34.

The non-display area is disposed on the second substrate 10 on the plurality of auxiliary electrodes 60, the first electrode 80 covering the auxiliary electrode 60, and the first electrode 80 corresponding to the auxiliary electrode 60. A pixel region between the buffer pattern 62 extended by (AA), a plurality of partitions 64 having an inclined cross section separating the pixel region P on the buffer pattern 62, and the partition wall 164 ( The organic light emitting layer 82 and the organic light emitting layer 82 may be separated on the first electrode 80 and the patterned spacer 50 by separating the patterned spacer 50 and the pixel region P on the buffer pattern 162 from P). On the 82 is formed a second electrode 84 in sequence. The organic light emitting diode E is formed by the first electrode 80, the organic emission layer 82, and the second electrode 84.

A seal pattern 90 made of a thermosetting resin or an ultraviolet curable resin is formed along the non-display area NAA surrounding the display area AA of the first substrate 5, and the first substrate 5 is maintained while maintaining a constant cell gap. ) Is bonded to the second substrate 10. The seal pattern 90 maintains a constant cell gap between the first substrate 5 and the second substrate 10 and maintains a space between the first substrate 5 and the second substrate 10 in a vacuum state. Do it.

3 illustrates a plan view of a mother substrate 13 in which a plurality of first substrates 5 or second substrates 10 of the organic light emitting diode 1 are formed. A cutting lane 14 is defined in the mother substrate 13, and after the seal pattern 90 is formed in the non-display area NAA, the mother substrate 13 is cut along the cutting area 14. Thus, a plurality of first substrates 5 or second substrates 10 are separated.

The seal pattern 90 is formed using the seal dispenser 12. As shown in FIG. 4, the seal dispenser 12 includes a stage 15 in which the mother substrate 13 is placed and driven in the X and Y axes, and a syringe for storing a sealant for printing a seal pattern. (Not shown), a nozzle 16 for discharging the sealant, a pneumatic controller (not shown) providing pressure for discharging the sealant, a syringe mounted and connected to the nozzle 16 The drive unit 17 for moving the 16 to the Z axis, the sensor 18 for setting the gap between the nozzle 16 and the mother substrate 13, and the movement of the stage 15 and the drive unit 17. It is configured to include a control unit (not shown) for controlling the.

The method of forming the seal pattern 90 on the mother substrate 13 includes a first step in which the driving unit 17 on which the nozzle 16 is mounted descends on the Z axis so as to approach the mother substrate 13, and The second step of setting the discharge interval by detecting the distance between the mother substrate 13 and the nozzle 16 by the sensor 18, and when the stage 15 moves in the X-axis and Y-axis, the detection sensor 18 It is composed of a third step of forming a seal pattern 90 by discharging the sealant from the nozzle 16 while continuously detecting the discharge interval.

The seal pattern 90 should be formed only in the non-display area NAA in the first substrate 5 or the second substrate 10 of the organic light emitting diode 1 installed in the mother substrate 13. However, the discharge position of the sealant may deviate from the non-display area NAA of the first substrate 5 by the defect of the equipment including the control error of the controller or the mistake of the operator. An optical sensor is used as the sensor 18 in the seal dispenser 12. The same material as the non-display area NAA is formed on the cutting area 14 and the display area AA of the mother substrate 13 adjacent to the non-display area NAA. The control unit of the cell dispenser 12 receives a program designating the position of the seal pattern 90 formed on the mother substrate 13, and the detection sensor 18 merely includes the mother substrate 13 and the nozzle 16. In order to detect the gap between the detection sensors 18, the non-display area NAA cannot be selectively detected by distinguishing the non-display area NAA from the cutting area 14 and the display area AA.

Therefore, the sealant may be discharged from the non-display area NAA to the cutting area 14 of the mother substrate 13 and the display area AA of the first substrate 5 or the second substrate 10. have. In this case, the discharge position of the sealant is inputted to the control unit, but a program for correcting the seal position of the sealant is input, but when the sealant is discharged to a previous state without recognizing it, or the operator replaces the syringe, Occurs when incorrectly corrected.

Since the seal dispenser 12 performs the process of forming the seal pattern 90 on the mother substrate 13 collectively, the sealant 12 is sealed on all of the plurality of first substrates 5 formed on the mother substrate 13. The discharge position of may be separated. 5 is a photograph showing a case where the sealant is discharged to the cutting region of the mother substrate 13, and FIG. 6 is a sealant on the display area AA of the first substrate 5 or the second substrate 10. FIG. It is a photograph showing the case of discharge. As shown in FIG. 5, when the sealant is discharged to the cutting region 14, a defect occurs in which the mother substrate 13 is damaged due to the sealant during the cutting process. 6, when the sealant is discharged to the display area AA, the first substrate 5 or the second substrate 10 should be discarded.

In order to prevent the sealant from being discharged, the non-display area NAA in which the seal pattern is formed may be set wide to secure a sufficient resonance margin, but the organic field may be formed in the mother substrate 13. Since the number of the first substrate 5 or the second substrate 10 of the light emitting device is reduced, the production cost can be increased.

In order to solve the above problems of the prior art, the present invention forms a guide pattern for guiding the discharge of the sealant in the non-display area of the first substrate or the second substrate, the discharge position of the sealant is non-display area It is an object of the present invention to provide a display device and a method of manufacturing the same that prevent the separation of the device.

According to an aspect of the present invention, there is provided a display device including: a first substrate and a second substrate including a display area and a non-display area and bonded to each other; Driving means on the first substrate corresponding to the display area; Display means on the second substrate corresponding to the display area; A guide pattern disposed in the non-display area of the first substrate or the second substrate and guiding a discharge position of the sealant; And a seal pattern disposed on the guide pattern and interposed between the non-display area of the first substrate and the second substrate.

In the display device as described above, the guide pattern is formed of a material having a reflectance and transmittance different from that of the display area of the first substrate or the second substrate adjacent to the guide pattern.

In the display device as described above, the first substrate and the second substrate are glass substrates, and the guide pattern is formed of a metal material.

In the display device as described above, the first substrate includes a switching transistor, a driving transistor connected to the switching transistor, and a connection electrode connected to a drain electrode of the driving transistor, and the second substrate includes the connection electrode. It characterized in that it comprises an organic light emitting diode electrically connected to.

In the display device as described above, the guide pattern is equal to, or smaller than, the width of the seal pattern.

Method of manufacturing a display device according to the present invention for achieving the above object comprises the steps of preparing a first substrate and a second substrate of the display device having a display area and a non-display area; Forming driving means on the first substrate corresponding to the display area; Forming display means on the second substrate corresponding to the display area; Forming a guide pattern for guiding a discharge position of the sealant in the non-display area of the first substrate or the second substrate; Forming a seal pattern on the guide pattern; And bonding the first substrate and the second substrate through the seal pattern.

In the method of manufacturing the display device as described above, a plurality of the first substrate and the second substrate which are divided into the cutting regions in the first and second mother substrates are formed.

In the method of manufacturing a display device as described above, the seal pattern includes a sensor for setting the position where the seal pattern is formed along the guide pattern, and a seal dispenser including a nozzle for discharging the sealant at the position where the seal pattern is formed. It is characterized by being formed by.

A method of manufacturing a display device as described above, the method comprising: forming a switching transistor and a driving transistor connected to the switching transistor on the first substrate; And forming the guide pattern on the connection electrode connected to the driving transistor and the first substrate corresponding to the non-display area.

A method of manufacturing a display device as described above, the method comprising: forming a protective film on the first substrate including the switching transistor and the driving transistor; Etching the passivation layer to form a drain contact hole exposing the drain electrode of the driving transistor; Forming a metal layer on the passivation layer including the drain contact hole and patterning the metal layer to form the guide pattern on the connection electrode connected to the drain electrode and the non-display area of the first substrate; Characterized in that it comprises a.

In the method of manufacturing the display device as described above, characterized in that it comprises the step of forming an organic light emitting diode on the second substrate.

A method of manufacturing a display device as described above, comprising: forming an organic light emitting layer on a first electrode and on the first electrode on the display area of the second substrate; And simultaneously forming the guide pattern on the organic light emitting layer on the second electrode and the non-display area of the second substrate.

The display device of the present invention and its manufacturing method have the following effects.

The display device divided into the display area and the non-display area is formed by bonding the first and second substrates through a seal pattern formed in the non-display area. When the seal pattern is formed in the non-display area, the guide pattern is formed of a material having a reflectance and transmittance different from that of the cutting area and the display area of the mother substrate adjacent to the non-display area. The detection sensor of the seal dispenser recognizes the guide pattern, and generates an alarm signal when the discharge position of the sealant leaves the non-display area, and stops work and immediately corrects the alarm signal according to the alarm signal. Therefore, the discharge position of the sealant is prevented from being formed out of the non-display area to form a seal pattern in the cutting area or the display area, thereby suppressing the occurrence of defects in the display element.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

7 is a cross-sectional view of an organic light emitting diode according to an embodiment of the present invention, FIGS. 8A to 8D are cross-sectional views of a first substrate of an organic light emitting diode according to an embodiment of the present invention, and FIGS. 9A to 9C 10 is a cross-sectional view of a second substrate of an organic light emitting diode according to an embodiment of the present invention, FIG. 10 is a plan view of a mother substrate according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view of a seal pattern according to an embodiment of the present invention. to be. The circuit diagram of the unit pixel of the organic light emitting device of the present invention is the same as in the prior art, and will be described with reference to FIG. 1.

As illustrated in FIG. 7, the organic light emitting diode 101 according to the present invention is divided into a display area AA that implements an image and a non-display area NAA that does not implement an image, and is bonded to face each other. The substrate 105 and the second substrate 110 is included. The display area AA includes the pixel area P defined by the intersection of the gate line GL and the data line DL, and the drive area Dr in which the driving transistor Td defined inside the pixel area P is formed. ), And the data area D in which the data wiring DL is formed.

On the first substrate 105 including the pixel region P, the driving region Dr, and the data region D, the gate wiring Gl and the data wiring DL which cross each other to define the pixel region P are defined. The switching transistor Ts positioned at the intersection of the gate wiring GL and the data wiring DL, the driving transistor Td connected to the switching transistor Ts, the switching transistor Ts and the driving transistor Td are covered. In addition, the passivation layer 155 having the drain contact hole DCH exposing the drain electrode 134 of the driving transistor Td and the drain electrode 134 through the drain contact hole DCH above the passivation layer 155. Electrically connected connection electrodes 170 are sequentially formed. The gate wiring GL, the data wiring DL, the switching transistor Ts, the driving transistor Td, the connecting electrode 170, and the like formed on the first substrate 105 are referred to as driving means for driving the display element. .

The protective layer 155 may use an inorganic insulator such as silicon oxide (SiO 2) or silicon nitride (SiN x), or an organic insulator including benzocyclobutene or photo acryl, if necessary. . The connection electrode 170 may be formed of a double layer of the first layer 170a and the second layer 170b, and the first layer 170a may be formed of indium tin oxide (ITO) or indium zinc oxide (ITO). Transparent conductive material including IZO), and the second layer 170b uses a metal material including molybdenum or a molybdenum alloy. The driving transistor Td includes a semiconductor layer 142 including a gate electrode 125, an active layer 140, and an ohmic contact layer 141, a source electrode 132, and a drain electrode 134.

By the same process as the connection electrode 170, the first guide pattern 172 is formed on the non-display area NAA of the first substrate 105. The first guide pattern 172 is formed in a continuous pattern without disconnection in the non-display area NAA surrounding the outer periphery of the display area AA of the first substrate 105. The first guide pattern 172 is the same as the connection electrode 170, the first layer 170a using a transparent conductive material including indium tin oxide (ITO) or indium zinc oxide (IZO) and And a second layer 170b using a metal material comprising molybdenum or molybdenum alloy.

The uppermost layer of the first substrate 105 corresponding to the non-display area NAA is the first guide pattern 172 and the first substrate 105 corresponding to the display area AA adjacent to the non-display area NAA. The uppermost layer is the protective film 155. The reflectance and the transmittance of the first guide pattern 172 and the passivation layer 155 are different from each other. Therefore, the value detected by the sensor 18 of the seal dispenser 12 as shown in FIG. 4 is different. The seal pattern 190 is formed on the first guide pattern 172. When the second guide pattern 174 is formed in the non-display area NAA of the second substrate 110, the first guide pattern 172 may be omitted. In addition, when the first guide pattern 172 is omitted, the seal pattern 190 is formed on the second guide pattern 174 of the second substrate 110.

On the second substrate 110, an auxiliary electrode 160 corresponding to the data area D, a first electrode 180 and an auxiliary electrode 180 covering the display area AA corresponding to the auxiliary electrode 160 and A barrier rib 164 having a cross section of an inclined shape on the buffer pattern 162 covering the corresponding first electrode 180 and the non-display area NAA, and the buffer pattern 162 corresponding to the auxiliary electrode 180. ), The organic light emitting layer formed on the first electrode 180 by separating the patterned spacers 150 formed on the buffer pattern 162 and the pixel regions P between the partition walls 164. 182, a second electrode 184 on the organic emission layer 182, a second guide pattern 174 on the buffer pattern 162 corresponding to the non-display area NAA, and a non-display area NAA. The seal pattern 190 is formed on the guide pattern 174 of FIG. The organic light emitting diode E is formed by the first electrode 180, the organic emission layer 182, and the second electrode 184. The organic light emitting diode E is called display means.

The auxiliary electrode 160 uses a metal material including molybdenum or molybdenum alloy, and the first electrode 180 has a relatively high work function such as indium tin oxide (ITO) or indium zinc oxide (IZO). Transparent conductive materials are used. The auxiliary electrode 160 is formed to lower the resistance of the first electrode 180 made of a material having a relatively high resistance, and may be omitted if necessary. The patterned spacer 150 provided on the buffer pattern 162 serves to maintain a constant cell gap between the first substrate 105 and the second substrate 110.

The organic light emitting layer 182 formed in the pixel region P is separated from the adjacent pixel region P by the partition wall 160 having an inclined shape, and is formed on the side and top of the patterned spacer 163 and the first electrode 180. )). The organic emission layer 165 is designed to be made of an organic material that emits red, green, and blue light for each pixel region P to implement full color. The second electrode 184 may have a triple layer structure, wherein the first layer is made of aluminum (Al) or aluminum alloy (AlNd), the second layer is made of silver (Ag), and the third layer is made of calcium (Ca). It can be made of each). The first layer should be configured to be in contact with the organic light emitting layer 182 and the third layer to be connected to the connection electrode 170, respectively.

The second guide pattern 174 is formed by the same process as the second electrode 184, so that one layer of aluminum (Al) or aluminum alloy (AlNd), a second layer of silver (Ag), and calcium (Ca) Consists of a third layer. The second guide pattern 174 is formed on the buffer pattern 162 in the non-display area NAA of the second substrate 110. When the first guide pattern 172 is formed on the non-display area NAA of the first substrate 105, the second guide pattern 174 of the second substrate 110 may be omitted. Therefore, as the second guide pattern 174 is omitted, the seal pattern 190 is not formed on the second substrate 110 but is formed on the first guide pattern 172 of the first substrate 105. .

A hole transporting layer and a hole injection layer are formed between the organic light emitting layer 182 and the first electrode 180 serving as the anode electrode, and serve as the organic light emitting layer 182 and the cathode electrode. An electron injection layer and an electron transporting layer may be further formed between the second electrodes 184.

8A to 8D, a method of manufacturing the first substrate 105 of the organic light emitting diode 101 according to the present invention will be described below.

As shown in FIG. 8A, a first conductive layer (not shown) is formed on the first substrate 105 using the glass substrate and patterned to form the gate electrode 125 and the gate wiring GL. The first conductive layer is formed by selecting one of aluminum, aluminum alloy, molybdenum, chromium, copper, and copper alloy, or uses a double layer structure in which molybdenum or the like is laminated on the aluminum alloy. As shown in FIG. 8B, the gate insulating layer 145 is formed of an inorganic insulating material or an organic insulating material of a silicon oxide film or a silicon nitride film on the first substrate 105 including the gate electrode 125, and on the gate insulating film 145. An impurity semiconductor layer (not shown) doped with impurities is formed on the amorphous silicon layer (not shown) and the amorphous silicon layer. The amorphous silicon layer and the impurity semiconductor layer are patterned to form the semiconductor layer 142 including the active layer 140 and the ohmic contact layer 141.

As shown in FIG. 8C, a metal layer is formed and patterned on the first substrate 105 including the semiconductor layer 142, and the drain is spaced apart from the source electrode 132 and the source electrode 132 connected to the semiconductor layer 142. The electrode 134 and the data wiring DL are formed. As shown in FIG. 8D, a protective layer 155 is formed on the first substrate 105 including the source electrode 132, the drain electrode 134, and the data line DL. The protective layer 155 corresponding to the drain electrode 134 is etched to form a drain contact hole DCH exposing the drain electrode 134. A connecting electrode connected to the drain electrode 134 through the drain contact hole DCH by forming and patterning a second conductive layer (not shown) on the protective layer 155 including the drain contact hole DCH. The first guide pattern 172 is formed on the non-display area NAA of the 170 and the first substrate 105. The first guide pattern 172 may be formed by a separate process from the connection electrode 170.

The first guide pattern 172 is formed on the passivation layer 155. When a plurality of first substrates 105 are formed in the mother substrate 113 as shown in FIG. 10, the first substrate 105 corresponding to the cutting region 114 and the display region AA adjacent to the non-display area NAA. Passivation layer 155 is formed on the uppermost layer. A first layer 170a using a transparent conductive material comprising indium tin oxide (ITO) or indium zinc oxide (IZO) on the non-display area (NAA) and a metal comprising molybdenum or molybdenum alloy Since the first guide pattern 172 formed of the second layer 170b using the material is formed, the first guide pattern 172 is formed in the display area AA adjacent to the non-display area NAA and the cutting area 113 of FIG. 10. The reflectance and transmittance of the protective film 155 made of an inorganic or organic insulator are different.

Therefore, in the seal dispenser 12 using the optical sensor as the sensing sensor 18 of FIG. 4, the nozzle 16 leaves the non-display area NAA, so that the cutting area 113 and the display area AA are separated. When positioned, it is possible to provide an alarm signal in response to the detection sensor 18. When the second guide pattern 174 is formed in the non-display area NAA of the second substrate 110, the first guide pattern 172 may be omitted. When the first guide pattern 172 is omitted, the seal pattern 190 is formed on the second guide pattern 174 of the second substrate 110.

9A to 9C, a method of manufacturing the second substrate 110 of the organic light emitting diode 101 according to the present invention will be described below.

As shown in FIG. 9A, the auxiliary electrode 160 is formed by forming and patterning a metal layer on the second substrate 110 using the glass substrate, and the transparent conductive material is formed on the second substrate 110 including the auxiliary electrode 160. The first electrode 180 is formed by stacking and patterning materials. As shown in FIG. 9B, an insulating material is stacked and patterned on the second substrate 110 including the first electrode 180 to form a buffer pattern 162. The buffer pattern 162 is stacked on the first electrode 180 corresponding to the auxiliary electrode 160 and extends to the second substrate 110 corresponding to the non-display area NAA.

As shown in FIG. 9C, a partition wall 164 for separating each pixel area P and a buffer pattern 162 is disposed on each of the pixel areas P on the buffer pattern 162 corresponding to the auxiliary electrode 160. ) To form a patterned spacer 150. Using a shadow mask, a second electrode 184 including a metal layer on the organic light emitting layer 182 and the organic light emitting layer 182 on the top and side surfaces of the first electrode 180 and the patterned spacer 15. E). While forming the second electrode 184, the second guide pattern 174 is formed on the non-display area NAA of the second substrate 110. The second guide pattern 174 may be formed by a separate process from the second electrode 184. When the first guide pattern 172 is formed on the non-display area NAA of the first substrate 105, the second guide pattern 174 may be omitted.

The second guide pattern 174 is the same as the second electrode 184, one layer of aluminum (Al) or aluminum alloy (AlNd), a second layer of silver (Ag), and a third layer of calcium (Ca) It consists of. The second guide pattern 174 is formed on the buffer pattern 162 in the non-display area NAA of the second substrate 110. When a plurality of second substrates 110 are formed in the mother substrate 113 as shown in FIG. 10, the second substrate 110 corresponding to the cutting region 114 and the display region AA adjacent to the non-display area NAA. The buffer layer 162 of the insulating material is formed on the uppermost layer of the substrate. The second guide pattern 174 including one layer of aluminum (Al) or aluminum alloy (AlNd), a second layer of silver (Ag), and a third layer of calcium (Ca) on the non-display area NAA. Since the second guide pattern 174 is formed, the second guide pattern 174 has a reflectance and transmittance, and a buffer pattern 162 of an insulating material formed in the display area AA adjacent to the non-display area NAA and the cutting area 114 of FIG. 10. This is different.

Therefore, in the seal dispenser 12 using the optical sensor as the sensing sensor 18 of FIG. 4, the nozzle 16 leaves the non-display area NAA, and thus, the cutting area 114 and the display area AA. When positioned, it is possible to provide an alarm signal in response to the detection sensor 18. When the first guide pattern 172 is formed in the non-display area NAA of the first substrate 105, the second guide pattern 174 may be omitted. When the second guide pattern 174 is omitted, the seal pattern 190 is formed on the first guide pattern 172 of the first substrate 105.

As shown in FIG. 10, after the plurality of first or second substrates 105 and 110 are formed in the mother substrate 113, the plurality of first or second substrates 105 and 110 are formed along the cutting region 114. Is cut, and the bonding process of the 1st and 2nd board | substrates 105 and 110 is performed.

The seal pattern 190 is formed using the seal dispenser 12, as shown in FIG. 4. FIG. 10 illustrates a plan view of a mother substrate 113 on which a plurality of first substrates 105 or second substrates 110 of the organic light emitting diode 101 are formed. A cutting lane 114 is defined in the mother substrate 113, and after the seal pattern 190 is formed in the adjacent non-display area NAA along the outer circumference of the display area AA, the cutting area ( The mother substrate 113 is cut along the 114 to separate the plurality of first substrates 105 or the second substrates 110.

The method of forming the seal pattern 190 on the mother substrate 113 may include a first step of lowering the driving unit 17 on which the nozzle 16 is mounted to approach the mother substrate 113, and a detection sensor 118. The second step of setting the discharge interval by detecting the distance between the first guide pattern 172 or the second guide pattern 174 and the nozzle 116 of the mother substrate 113 by using, and the stage 15 is X And a third step of forming a seal pattern 190 on the first or second guide patterns 172 and 174 by discharging the sealant from the nozzle 16 while moving along the axis and the Y axis. The sensor 18 of the seal dispenser 12 uses an optical sensor. The sensor 118 used as the optical sensor generates different sensing data according to reflectivity and transmittance characteristics of the material formed on the mother substrate 113.

When the stage 15 moves along the X and Y axes, and the position of the nozzle 16 deviates from the first or second guide patterns 172 and 174, the first or second guide patterns 172 and 174 Since the reflectance and transmittance of the display area AA and the cutting area 114 adjacent thereto are different, the detection sensor 18 generates different sensing data from the first or second guide patterns 172 and 174, and the seal dispenser. The alarm device (not shown) of (12) operates to provide an alarm signal, and the operator immediately stops work by the alarm signal, and inputs a correction value for correcting the deviation of the discharge position into the seal dispenser 12. Proceed with the work.

The first and second guide patterns 172 and 174 may be formed to have the same width as the seal pattern 190. Of course, it is possible to form smaller or larger than the width of the seal pattern 190. As shown in FIG. 11, when the width of the first or second guide patterns 172 and 174 is smaller than the seal pattern 190, the sensing sensor 18 guides the formation position of the seal pattern 190 more precisely. In addition, the first or second guide patterns 172 and 174 may increase the surface area of the seal pattern 190 in contact with the first or second substrates 105 and 110 to improve adhesion. This can effectively block the inflow of moisture and gas from the outside.

In the present invention, the guide pattern provided in the non-display area of the first or second substrate in the organic light emitting device has been described, but the same applies to all display devices forming the seal pattern. In addition, the present invention is not limited to the above embodiments, and it will be apparent that various modifications and changes can be made without departing from the spirit and the spirit of the present invention.

1 is a circuit diagram of a unit pixel of an organic light emitting diode according to the related art.

2 is a cross-sectional view of an organic light emitting device according to the related art.

3 is a plan view of a mother substrate on which a plurality of organic light emitting diodes are formed according to the related art.

Figure 4 is a schematic diagram showing a seal pattern method using a seal dispenser according to the prior art

Figure 5 is a photograph showing a case in which the sealant is discharged to the cutting region of the mother substrate in the prior art

FIG. 6 is a photo illustrating a case in which a sealant is discharged to a display area in the related art. FIG.

7 is a cross-sectional view of an organic light emitting diode according to an embodiment of the present invention.

8A to 8D are cross-sectional views of a first substrate of an organic light emitting diode according to an exemplary embodiment of the present invention.

9A to 9C are cross-sectional views of a second substrate of an organic light emitting diode according to an exemplary embodiment of the present invention.

10 is a plan view of a mother substrate according to an embodiment of the present invention.

11 is a cross-sectional view of the seal pattern according to an embodiment of the present invention

Claims (12)

A first substrate and a second substrate including a display area and a non-display area and bonded to each other; Driving means on the first substrate corresponding to the display area; Display means on the second substrate corresponding to the display area; A guide pattern disposed in the non-display area of the first substrate or the second substrate and guiding a discharge position of the sealant; A seal pattern disposed on the guide pattern and interposed between the non-display area of the first substrate and the second substrate; Display device comprising a. The method of claim 1, And the guide pattern is formed of a material having a reflectance and transmittance different from that of a display area of the first substrate or the second substrate adjacent to the guide pattern. The method of claim 1, The first substrate and the second substrate is a glass substrate, and the guide pattern is formed of a metal material. The method of claim 1, The first substrate includes a switching transistor, a driving transistor connected to the switching transistor, and a connecting electrode connected to the drain electrode of the driving transistor, and the second substrate is an organic light emitting diode electrically connected to the connecting electrode. Display device comprising a. The method of claim 1, And the guide pattern is equal to, or smaller than, the width of the seal pattern. Preparing a first substrate and a second substrate of a display device having a display area and a non-display area; Forming driving means on the first substrate corresponding to the display area; Forming display means on the second substrate corresponding to the display area; Forming a guide pattern for guiding a discharge position of the sealant in the non-display area of the first substrate or the second substrate; Forming a seal pattern on the guide pattern; Bonding the first substrate and the second substrate through the seal pattern; Method of manufacturing a display device comprising a. The method of claim 6, And a plurality of the first substrate and the second substrate which are divided into the cutting regions in the first and second mother substrates. The method of claim 6, The seal pattern may be formed by a seal dispenser including a sensor configured to set a position at which the seal pattern is formed along the guide pattern, and a nozzle configured to discharge a sealant at a position at which the seal pattern is formed. Manufacturing method. The method of claim 6, Forming a switching transistor and a driving transistor connected to the switching transistor on the first substrate; Forming the guide pattern on the connection electrode connected to the driving transistor and the first substrate corresponding to the non-display area; Method of manufacturing a display device comprising a. The method of claim 9, Forming a protective film on the first substrate including the switching transistor and the driving transistor; Etching the passivation layer to form a drain contact hole exposing the drain electrode of the driving transistor; Forming a metal layer on the passivation layer including the drain contact hole and patterning the metal layer to form the guide pattern on the connection electrode connected to the drain electrode and the non-display area of the first substrate; Method of manufacturing a display device comprising a. The method of claim 6, And forming an organic light emitting diode on the second substrate. The method of claim 11, Forming an organic light emitting layer on the first electrode and the first electrode on the display area of the second substrate; Simultaneously forming the guide pattern on the organic light emitting layer on the second electrode and the non-display area of the second substrate; Method of manufacturing a display device comprising a.

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