CN105633296A - Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof - Google Patents

Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof Download PDF

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CN105633296A
CN105633296A CN 201410623657 CN201410623657A CN105633296A CN 105633296 A CN105633296 A CN 105633296A CN 201410623657 CN201410623657 CN 201410623657 CN 201410623657 A CN201410623657 A CN 201410623657A CN 105633296 A CN105633296 A CN 105633296A
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cover plate
frit
buffer layer
substrate
package
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CN 201410623657
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Chinese (zh)
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刘建立
李露露
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昆山国显光电有限公司
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Abstract

The present invention relates to a frit sealing device used for an OLED display. The frit sealing device comprises a substrate and a packaging cover plate, the substrate and the packaging cover plate are in sealing connection via a frit sealing frame, and an OLED device is accommodated in an enclosed space formed by the packaging cover plate and the substrate. A buffer layer is arranged between the frit sealing frame and the packaging cover plate, and a contact surface of the buffer layer and the frit sealing frame is equipped with a concave-convex structure. The sealing device enables the joint intensity of the frit and a glass substrate to be improved greatly and an anti-transverse impact force to be enhanced, and effectively prevents the phenomena of cracking, peeling, etc., thereby realizing the higher sealing reliability and mechanical reliability.

Description

-种用于OLED显示器的玻璃料密封装置及其制备方法 - frit sealing the OLED display device and a method of producing an

技术领域 FIELD

[0001] 本发明涉及一种有机电致发光器件的密封领域,具体是一种有机电致发光器件玻璃料密封装置,本发明还涉及该用于OL邸显示器的玻璃料密封装置的制备方法。 [0001] The present invention relates to the field of sealing the organic electroluminescent device, in particular an organic electroluminescent device frit sealing apparatus according to the present invention further relates to a method for preparing the frit seal means for OL Di display.

背景技术 Background technique

[0002] 作为新一代的显示器件,有机发光显示器即OL邸器件有着传统显示器不可比拟的优势,如自发光、不需要背光源、可实现超薄显示和柔性显示、驱动电压低、省电、反应速度快等等。 [0002] As a next-generation display device, i.e., an organic light emitting display device with a traditional display OL Di incomparable advantages, such as self-luminous, no backlight, the display can be thin and to achieve a flexible display, a low driving voltage, power, The reaction speed and the like. 但是OL邸器件对氧气和湿气非常敏感,受到氧气和湿气侵袭会性能劣化最终失效。 However OL Di device is very sensitive to oxygen and moisture, oxygen and moisture invasion would be performance degradation eventually fail. 因此封装工艺对OLED器件寿命的影响很大。 Thus a great influence on the packaging process OLED device lifetime. 目前采用的玻璃料封装方法封装OLED 器件被广泛使用。 The currently used method of packaging glass frit encapsulating the OLED device is widely used. 现有的玻璃料封装方法如图1所示,在封装盖板302的周缘设置玻璃料密封框303,玻璃料密封框303贴合封装盖板302和OLED基板301,其中玻璃料密封框303 与封装盖板302直接接触,与OLED基板301之间通常会有保护膜层305,例如SiOx、Si化, 激光固化玻璃料密封框303完成封装。 The conventional method of packaging glass frit shown in Figure 1, the periphery of the package cover 302 is provided frit seal block 303, the frit seal housing cover plate 303 bonded to the package substrate 302 and the OLED 301, wherein the frit seal block 303 and package cover plate 302 in direct contact with the substrate between the OLED 301 and 305 typically have a protective film layer, for example SiOx, Si, laser curing the frit seal block 303 to complete the package. OLED器件304密封在封装盖板302、OLED基板301 和玻璃料密封框303形成的密闭空间内。 OLED device 304 in the closed space sealed package cover plate 302, OLED substrate 301 and the frit seal block 303 is formed. 送种结构的封装方法,由于通常采用的封装盖板302表面具有纳米级甚至更优的平滑表面,玻璃料密封框303的表面为微米级粒径,二者之间具有不匹配的接触面,有效接触面积低。 Feeding packaging method such structure, since the surface of the package cover 302 generally employed with nanoscale even more preferably a smooth surface, the surface of the frit seal to block 303 micron particle size, the contact surface having a mismatch therebetween, low effective contact area. 激光烙封玻璃料密封框303后,其与封装盖板302之间的粘结力达不到预期效果,外力冲击力下会导致玻璃料与封装盖板303出现裂缝、 剥离等现象,造成封装失效。 After laser branded sealing frit seal block 303 between the package 302 and the cover plate adhesion achieving the desired effects, the external impact force can cause the cap plate 303 and the encapsulation glass frit phenomenon of cracks, peeling and the like, resulting in the package failure.

[0003] 为了解决上述问题,现有技术中提出了一种封装方法,如图2所示,图中307为填充材料(seal材料),303为玻璃料密封框。 [0003] In order to solve the above problems, the prior art proposes a method of packaging, as shown in FIG. 2, FIG. 307 is a filler (Seal materials), sealing frame 303 to the glass frit. 在cell切割(屏体切割)后,在玻璃料密封框303外周设置填充材料307并使其固化,增强玻璃料外侧横向粘着力,起到补强效果。 After the cell cutting (dicing screen body), the outer periphery of the frit 303 in the sealing material 307 and the filling frame disposed cured, reinforced laterally outside of the glass frit adhesion, play a reinforcing effect. 但是玻璃料密封框303与封装盖板302之间的接触面积并没有得到改善,外力冲击力下玻璃料与封装盖板302仍然会出现裂缝、剥离等现象,最终造成封装失效。 However, the contact area between the frit seal and the package frame 303 and cover plate 302 is not improved, the external impact plate 302 and the encapsulation glass frit phenomenon still crack, peeling or the like, eventually resulting in failure of the package.

[0004] CN102255056A公开了一种增强玻璃料密封OLED器件的密封性能的密封方法,其是在玻璃封装体第一玻璃基板边缘印刷沉积玻璃料前刻蚀一道或多道沟槽或腐蚀槽,然后在沟槽上印刷玻璃料,并采用激光封装方法将第一玻璃基板与第二玻璃基板键合。 [0004] CN102255056A discloses a method of enhancing the sealing performance of the sealing glass frit sealing an OLED device, which is deposited before the edge of the printed first glass frit glass substrate or a package runner trench etching or etching bath, then printing frit glass in the trench, and the method of packaging a first laser and the second glass substrate bonded to the glass substrate. 上述方案是在封装盖板玻璃料预定印刷区域表面刻蚀一道或多道沟槽或腐蚀槽,增大玻璃料与盖板玻璃的接触面积。 Etching the above-described embodiment is a predetermined surface of a groove or a runner trench etching or printing areas in the package cover glass frit, the glass frit increase the contact area with the glass cover. 其采用的刻蚀方法成本高,盖板玻璃强度降低,玻璃料的沉积工艺难W实现。 Etching method which uses high-cost, lower strength glass plate, the glass frit deposition process W difficult to achieve.

[0005] 化201320093028公开了一种封装盖板与基板之间粘贴效果好的OL邸显示器及其专用封装盖板。 [0005] 201 320 093 028 discloses a paste of a packaging effect between the cover plate and the substrate and good display OL Di dedicated package cover plate. 本实用新型的OL邸显示器,包括基板、位于基板上的OL邸器件W及该OL邸器件的封装盖板,所述封装盖板上与基板进行粘贴的贴装面具有经表面粗糖度增大处理所形成的凹凸结构。 Di OL present invention display including a substrate, a cover plate of the package and the wafer W OL OL Di Di device on the substrate, the package mounting surface affixed to the cover plate for the substrate having a surface roughness by increasing the sugar content processing the formed concavo-convex structure. 由于在贴装面进行了表面粗糖度增大处理,因此增大了封装盖板与基板之间的粘贴面积,从而提高粘贴强度,有效改善了封装盖板与基板之间粘贴效果。 As a result of the rough surface processing is increased sugar content in the surface mounting, thus increasing the adhesion area between the cover and the package substrate, thereby improving the adhesive strength, improve the adhesive effect of the package between the cover plate and the substrate. 该实用新型阐述的结构采用粘结剂粘合的方法及其形成的结构,为公知的一种传统封装技术,封装盖板开槽,槽内放置干燥剂。 The invention set forth in the structure and method of adhesive bonding structure formed of a conventional packaging techniques are well known, slotted plate package, the desiccant vessel is placed. 刻蚀形成凹凸图案的方法成本高,盖板玻璃强度降低;粘结剂一般为有机物,其水氧阻隔能力差,封装效果及寿命差;只能用于低端的底发射型OL邸器件。 The method of forming the high cost of the concavo-convex pattern is etched, reducing the strength of the glass plate; organic binder is typically a water poor oxygen barrier, sealing effectiveness and the life of the difference; only for low-end OL Di bottom emission type device.

发明内容 SUMMARY

[0006] 本发明所要解决的技术问题在于现有的玻璃料密封框与封装盖板之间出现裂缝、 剥离等问题,从而提供一种用于OL邸显示器的玻璃料密封装置,该密封装置极大的提高了玻璃料与玻璃基板的接合强度,增强了抗横向冲击力,有效防止出现裂缝、剥离等现象,从而实现较高的密封可靠性和机械可靠性。 [0006] The present invention solves the technical problem issues cracks, peeling occurs between the existing frame and the frit seal the package cover plate, thereby providing a frit sealing apparatus OL Di display, the electrode sealing means big increase bonding strength glass frit and the glass substrate, to enhance the anti-lateral impact, effectively preventing the phenomenon of cracks, peeling and the like in order to achieve high sealing reliability and mechanical reliability.

[0007] 为解决上述技术问题,本发明是通过W下技术方案实现的: [0007] To solve the above problems, the present invention is achieved by the technical solution of W:

[0008] -种用于OL邸显示器的玻璃料密封装置,包括基板和封装盖板,所述基板与所述封装盖板通过玻璃料密封框密封连接,所述封装盖板与所述基板形成的密闭空间内容纳OL邸器件,所述玻璃料密封框与所述封装盖板之间设置有缓冲层,所述缓冲层与所述玻璃料密封框相接触的一面具有凹凸结构。 [0008] - a frit seal species OL Di display device, comprising a substrate and package cover plate, the cover plate substrate and the package are connected by sealing the frit sealing frame, the encapsulation substrate formed with the cover plate the contents of the sealed space is provided with a buffer layer between the admittance OL Di device, the frit sealing frame and the encapsulation cover plate, one surface of the buffer layer having a concavo-convex structure of the glass frit sealing contact with the frame.

[0009] 所述缓冲层为Si〇x、SiNx、A10、中的一种或其组合。 [0009] The buffer layer Si〇x, SiNx, A10, one or a combination thereof.

[0010] 所述缓冲层具有多层凹凸结构,优选具有1-2层凹凸结构。 [0010] The buffer layer has a multilayer structure irregularities, preferably 1-2 layers having irregular structures.

[0011] 所述缓冲层的厚度h为0<h《0. 2um,宽度为300um-1000um。 [0011] The buffer layer has a thickness h is 0 < "0 h. 2um, a width of 300um-1000um.

[0012] 所述玻璃料密封框与所述基板之间设有保护膜层。 [0012] The sealing glass frit is provided between the frame and the substrate protective layer.

[0013] 一种用于OL邸显示器的玻璃料密封装置的制备方法,包括下述步骤: [0013] A method for preparing a glass frit OL Di sealing device for a display, comprising the steps of:

[0014] Sl ;在封装盖板上沉积缓冲层,所述缓冲层远离所述封装盖板的一侧具有凹凸结构; [0014] Sl; depositing a buffer layer on the encapsulation cover plate, the buffer layer side away from the plate package having a concavo-convex structure;

[0015] S2;在所述缓冲层具有凹凸结构的表面涂布玻璃料密封框图形层,经过预干燥、高温烧结固化获得所述玻璃料密封框; [0015] S2; buffer layer applied to the surface of the glass frit sealing frame layer having a textured structure pattern, pre-drying, high temperature sintering obtained by curing the frit sealing frame;

[0016] S3 ;贴合基板与封装盖板,烙封所述封装盖板与基板之间的玻璃料封装框,完成对OLED器件的封装。 [0016] S3; bonded to the substrate and the encapsulation cover plate, a glass frit baked sealed package box between the cover plate and the substrate package, complete encapsulation of the OLED device.

[0017] 所述步骤Sl为;远离所述封装盖板的一侧具有凹凸结构的缓冲层可通过气相沉积法制备。 [0017] Step Sl is the; package side facing away from the cover plate having a concave-convex structure of the buffer layer by vapor growth method.

[0018] 作为另一种实施方式,所述步骤Sl为,远离所述封装盖板的一侧具有凹凸结构的缓冲层可通过掩膜板控制形状的方法制备。 [0018] As another embodiment, the step Sl is, away from the cover plate side of the package production method of the buffer layer uneven structure can be controlled through a mask plate having a shape.

[0019] 所述步骤Sl为,采用耐高温材质的掩膜版来控制沉积材料的形状;所述掩膜版设有乳剂涂覆区域、掩膜版的SUS网线和开孔区域; [0019] The step Sl is, the mask material with high temperature to control the shape of the deposition material; the emulsion is coated with the mask region, the mask region and SUS cable opening;

[0020] 所述乳剂涂覆区域涂覆有乳剂W掩盖不需要沉积区域; [0020] The emulsion is coated region coated with an emulsion W need not cover the deposition area;

[0021] 掩膜版的SUS网线的线径为15-30um,在其垂直投影方向的封装盖板302表面由于网线的阻挡作用可沉积较薄的缓冲材料; [0021] The diameter of the SUS mesh mask line is 15-30um, in which the surface of the package cover plate 302 due to the projection direction perpendicular to the blocking action of the cable can be deposited a thin cushioning material;

[0022] 开孔区域在气相沉积时缓冲材料的微小粒子透过其沉积在封装盖板302表面,在此对应位置沉积的膜层较厚,具有岛状或突起形状。 [0022] When opening the vapor deposition area the fine particles through the cushioning material 302 deposited on the surface of the package lid, in positions corresponding to the deposition of this thick film, having an island or a projection shape.

[0023] 所述步骤Sl为:在封装盖板沉积得到平坦膜面,再由曝光或蚀刻方法形成具有凹凸结构的缓冲层。 [0023] Step Sl is said: in the package cover film is deposited to obtain a flat surface, then forming a buffer layer having a textured structure by the exposure or etching process.

[0024] 本发明的上述技术方案相比现有技术具有W下优点: [0024] The technical solution of the present invention over the prior art has the following advantages W:

[00巧](1)本发明提供的一种用于OL邸显示器的玻璃料密封装置,在玻璃料密封框与所述封装盖板之间设置有缓冲层,所述缓冲层与所述玻璃料密封框相接触的一面具有凹凸结构,该凹凸结构可有效增大界面接触面积,且缓冲层采用的材料为SiOx、SiNx、A10、中的一种或其组合,其化学成分与玻璃料具有很好的相容性,可W大幅度提高玻璃料的粘合力。 [Qiao 00] (1) The present invention provides a frit sealing apparatus OL Di display, is provided with a buffer layer between the glass frit sealing frame and the encapsulation cover plate, the buffer layer and the glass a sealing material having one surface in contact with the frame structure of the concavo-convex, concave-convex structure which can effectively increase the interfacial contact area, and the buffer material layer is employed as SiOx, SiNx, A10, one or a combination thereof, having the chemical composition of the glass frit good compatibility, W can greatly improve the adhesion of the glass frit.

[0026] (2)本发明提供的一种用于OL邸显示器的玻璃料密封装置,采用的玻璃料密封框具有上下一致的烙封界面,在激光密封时,提高激光密封均匀性,增强其抗横向冲击力,从而实现密封可靠性和机械可靠性,防止出现裂缝、剥离等现象,有效提高OL邸封装寿命。 [0026] (2) The present invention provides a frit sealing apparatus OL Di display, using the frit seal has a uniform vertical frame branded seal interface, at the time of laser sealing, laser sealing to improve uniformity, increase its anti lateral impact forces, in order to achieve reliable sealing and mechanical reliability, to prevent the phenomenon of cracks, peeling, effectively improving the life of the package Di OL.

[0027] (3)本发明采用玻璃料封装方法及其形成的结构,玻璃料既作为粘结剂又作为密封剂通过激光工艺烙接封装盖板与OL邸基板,水、氧阻隔能力优于粘结剂3-4个数量级;气相沉积方式在封装盖板表面沉积具有与玻璃料成分相匹配的且具有凹凸表面的缓冲层,可极大提高玻璃料与基板的粘合强度;封装盖板无需开槽,也无需干燥剂。 [0027] (3) of the present invention, glass frit and method of packaging structure is formed, both as a binder and glass frit as a sealing agent is then baked by a laser process OL package cover plate and the substrate Di, water, oxygen barrier capability than binders 3-4 orders of magnitude; vapor deposition method having a buffer layer having an uneven surface and frit components in a package that matches the deposition surface of the cover, can greatly improve the adhesive strength of the glass frit and the substrate; package cover plate without slotting, and without desiccant. 可用于顶/底发射型OL邸器件,尤其更适合于高端的顶发射型OL邸器件。 May be a top / bottom emission type OL Di device, in particular more suitable for high-end top-emitting device Di OL.

附图说明 BRIEF DESCRIPTION

[0028] 为了使本发明的内容更容易被清楚的理解,下面结合附图,对本发明作进一步详细的说明,其中, [0028] In order to make the present invention understood more readily apparent below in connection with the accompanying drawings, the present invention will be further described in detail, wherein

[0029] 图1为现有技术顶发光有机电致发光器件的示意图; [0029] Figure 1 is a schematic view of the prior art top emission organic electroluminescent device;

[0030] 图2为现有技术顶发光有机电致发光器件的示意图; [0030] Figure 2 is a schematic view of the prior art top-emitting organic electroluminescent device;

[0031] 图3A为在封装盖板302上的图形及局部放大图; [0031] Figure 3A is an enlarged view of a partial pattern and on the cover plate 302 of the package;

[0032] 图3A1为封装盖板一种实施方式的结构示意图; [0032] FIG. 3A1 is a schematic structural diagram of an embodiment of the package cover;

[0033] 图3A2为封装盖板另一种实施方式的结构示意图; [0033] FIG. 3A2 is a schematic structural diagram of another embodiment of the package of the cover plate;

[0034] 图3A3为封装盖板再一种实施方式的结构示意图; [0034] FIG. 3A3 is a schematic structural view of still another package cover plate embodiment;

[0035] 图3B1为玻璃料密封框与封装盖板结合的一种实施方式的结构示意图; [0035] FIG. 3B1 is a schematic view of an embodiment of the structure of the frit seal of the frame and the cover of the package;

[0036] 图3B2为玻璃料密封框与封装盖板结合的另一种实施方式结构示意图; [0036] FIG. 3B2 is a frit seal the cover of the package frame and a schematic view of another embodiment of the structure;

[0037] 图3B3为玻璃料密封框与封装盖板结合固化后结构剖视图; [0037] FIG. 3B3 is a frit seal housing cover and the package structure after curing binding cross-sectional view;

[0038] 图3C为本发明的顶发光有机电致发光器件结构示意图。 [0038] FIG 3C a top emitting a schematic diagram of the present invention is an organic electroluminescence light emitting device structure.

[0039] 图中附图标记表示为: [0039] reference numerals as in FIG:

[0040] 301-基板,302-封装盖板,303-玻璃料密封框,304-0LED器件,305-保护膜层, 306-缓冲层,3061-Si化膜层,3062-SiOx膜层,311-乳剂涂覆区域,312-SUS的网线, 313-代表的白色空格区域是掩膜版开孔位置。 [0040] The substrate 301, the package cover plate 302, the frit seal block 303, 304-0LED device, the protection layer 305, the buffer layer 306-, 3061-Si film layer, 3062-SiOx layer, 311 - the emulsion is coated region, 312-SUS network cable, the white space area 313- represents the mask opening position.

具体实施方式 detailed description

[0041] 为使本发明的目的、技术方案和优点更加清楚,下面将结合附图对本发明实施方式作进一步地详细描述。 [0041] To make the objectives, technical solutions, and advantages of the present invention will become apparent in conjunction with the accompanying drawings of the following embodiments of the present invention will be described in further detail.

[0042] 本发明可WW许多不同的形式实施,而不应该被理解为限于在此阐述的实施例。 [0042] The present invention may be WW embodiments in many different forms and should not be construed as limited to the embodiments set forth herein. 相反,提供送些实施例,使得本公开将是彻底和完整的,并且将把本发明的构思充分传达给本领域技术人员,本发明将仅由权利要求来限定。 Rather, send some embodiments so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art, the present invention will be limited only by the claims. 在附图中,为了清晰起见,会夸大层和区域的尺寸和相对尺寸。 In the drawings, for clarity, it may be exaggerated size and relative sizes of layers and regions. 应当理解的是,当元件例如层、区域或基板被称作"形成在"或"设置在"另一元件"上"时,该元件可W直接设置在所述另一元件上,或者也可W存在中间元件。 It should be understood that when an element such as a layer, region or substrate is referred to as being "formed on" or "disposed on", "on" another element, the element W may be disposed directly on the other element, or may be W intervening elements. 相反,当元件被称作"直接形成在"或"直接设置在"另一元件上时,不存在中间元件。 In contrast, when an element is referred to as being "directly formed on" or "disposed directly on" another element, no intervening elements present.

[0043] 如图3C所示,本发明提供的一种用于OL邸显示器的玻璃料密封装置,包括基板301和封装盖板302,所述基板301与所述封装盖板302通过玻璃料密封框303密封连接, 所述封装盖板302与所述基板301形成的密闭空间内容纳OL邸器件304,所述玻璃料密封框303与所述封装盖板302之间设置有缓冲层306,所述缓冲层306与所述玻璃料密封框303相接触的一面具有凹凸结构。 [0043] As shown in FIG. 3C, the present invention provides a frit sealing apparatus for a display OL Di, comprising a cover plate 302 and the encapsulation substrate 301, the substrate 301 and the encapsulation cover plate 302 are sealed by glass frit sealed connection block 303, the package sealed space accommodated OL Di device 302 and the cap plate 304 of the substrate 301 is formed, a buffer layer 306 is provided with a frit seal between the frame 303 and cover plate 302 of the package, the 306 concavo-convex structure having one surface in contact with the frit sealing frame buffer layer 303 described later.

[0044] 所述基板301 ;基板可W是公知的钢巧玻璃或碱±金属测娃酸盐玻璃,厚度为0. 3-0. 7mm,优选厚度为0. 4mm 或0. 5mm。 [0044] The substrate 301; the substrate W may be well known glass or steel Qiao ± alkali metal salt of glass baby measuring a thickness of 0. 3-0 7mm, preferably a thickness of 0. 4mm or 0. 5mm..

[0045] 封装盖板302 ;封装盖板可W是公知的钢巧玻璃或碱±金属测娃酸盐玻璃,厚度为0. 3-0. 7mm,优选厚度为0. 4mm或0. 5mm。 [0045] The package cover plate 302; W is a package cover plate can be known glass or steel Qiao alkali metal ± baby GLASSES measured thickness of 0. 3-0 7mm, preferably a thickness of 0. 4mm or 0. 5mm..

[004引玻璃料密封框303 ;所使用的材料至少包含V205及口205、BaO、Si化、Bz化、Al203、 SnO、Te02、MgO、CaO、化0、Ti02、W03、Bi203、化203、化0、訊203、脚20、化20、测酸铅玻璃、磯酸锡玻璃、饥酸盐玻璃和测娃酸盐中的任意一种或多种的组合,其高度为3um-30um,宽度300um-1000um ; [004 cited frit seal block 303; materials used comprise at least V205 and port 205, BaO, Si technology, Bz of, Al203, SnO, Te02, MgO, CaO, of 0, Ti02, W03, Bi203, of 203, of 0, information 203, pin 20, of 20, an acid test lead glass, glass Angeles of tin, and glass hunger acid salts baby measured in any one or more thereof, a height of 3um-30um, a width 300um-1000um;

[0047] 所述缓冲层306为SiO,、SiN,、A10、中的一种或其组合,优选的化合物为Si〇2、 Si3N4、Al2〇3中的任意一种,或它们任意一种的非化学计量比的化合物,所述缓冲层306具有多层凹凸结构,优选1-5层凹凸结构,进一步优选1-2层凹凸结构。 [0047] The buffer layer 306 is a SiO ,, SiN ,, A10, one or a combination of compounds is preferably Si〇2, Si3N4, Al2〇3 in any one, or any one thereof non-stoichiometric compound, the buffer layer 306 has a multi-layer structure convex, concave-convex structure layer is preferably 1-5, more preferably 1-2 uneven structure. 所述缓冲层306的总厚度h为0<h《0. 2um,宽度为300um-1000um。 The total thickness of the buffer layer is h 306 0 < "0 h. 2um, a width of 300um-1000um. 所述玻璃料密封框303与所述基板301之间设有保护膜层305。 The glass frit 305 is provided between the protective layer 303 and the substrate 301 sealing frame.

[0048] 作为一种优选地实施方式,如图3A1所示,缓冲层306所使用的材料为SIsNa和Si化(它们的非化学计量比的化合物),缓冲层306为两层,其总厚度可控制在0.1 um之间, 宽度300um之间;3061是SisNA膜层,3062是膜层Si〇2层;当然也可W根据需要设置3061 是Si〇2膜层,3062是SIsNa膜层。 [0048] As a preferred embodiment, as shown in FIG 3A1 buffer layer 306 is a material used (Compound their non-stoichiometric) SIsNa of Si and the buffer layer 306 into two layers, the total thickness can be controlled between 0.1 um, the width between 300um; 3061 is SisNA film layer 3062 is Si〇2 film layer; W may of course be provided as necessary is Si〇2 film 3061, film 3062 is SIsNa.

[0049] 所述OLED器件304典型的结构包括一个阳极层,一个或多个有机层,一个阴极层, 也可根据需要增设其它辅助层。 [0049] The typical structure of an OLED device 304 includes an anode layer, or a plurality of organic layers, a cathode layer, other additional auxiliary layers may be needed.

[0050] 上述用于OL邸显示器的玻璃料密封装置的制备方法,包括下述步骤: [0050] The preparation method of the frit seal means for OL Di display, comprising the steps of:

[0051] Sl ;在封装盖板302上沉积设定形状的缓冲层306 (buffer layer层),可由气相沉积如PVD (物理气相沉积,Physical vapor deposition)或CVD (化学气相沉积,Qiemical Vapor D巧osition)直接获得,所述缓冲层306远离所述封装盖板302的一侧具有凹凸结构,沉积在封装盖板302上的图形及局部放大图如图3A所示; [0051] Sl; buffer layer 306 (buffer layer layer) with a set shape on the package cover 302 is deposited, by vapor deposition such as PVD (physical vapor deposition, Physical vapor deposition) or CVD (chemical vapor deposition, Qiemical Vapor D Qiao osition) directly, one side of the package away from the cover plate 306 of the buffer layer 302 having a concavo-convex structure, the deposition pattern on the package and cover plate 302 partially enlarged view of FIG. 3A;

[0052] 所述沉积缓冲层306 (buffer layer层)具体可W采用气相沉积法在远离所述封装盖板302的一侧具有凹凸结构的缓冲层306,采用耐高温材质(比如SUS+乳剂组合)的掩膜版来控制沉积材料的形状,掩膜版的形状如图3A2所示;图3A3是具有与玻璃料303匹配的可实现buffer layer层特定形状控制的单个cell区域掩膜版放大图。 [0052] The deposited buffer layer 306 (buffer layer layer) Specific W vapor deposition process on one side of the package away from the cover plate 302 of buffer layer 306 having the concavo-convex structure, high temperature resistant material (such as SUS + emulsion composition) mask to control the shape of the deposition material, the shape of the mask shown in FIG. 3A2; FIG. 3A3 is a frit glass 303 may be implemented to match the particular shape of the control layer buffer layer of single cell mask region enlarged in FIG. 所述掩膜版设有乳剂涂覆区域311、掩膜版的SUS网线312和开孔区域313 ;所述乳剂涂覆区域311涂覆有乳剂,例如重氮感光乳剂(重氮敏化剂),W掩盖不需要沉积区域;掩膜版的SUS网线312 的线径为15-30um,其垂直投影方向的封装盖板302表面由于网线的阻挡作用可沉积较薄的缓冲材料;白色空格区域代表的开孔区域313在气相沉积时缓冲材料的微小粒子透过其沉积在封装盖板302表面,在此对应位置沉积的膜层较厚,具有岛状或突起形状。 The emulsion is coated with the mask area 311, the mask line 312 and SUS mesh open area 313; the emulsion coating region 311 is coated with an emulsion, for example, diazo photosensitive emulsion (diazo sensitizer) , W need not cover the deposition area; diameter SUS mask of the network cable 312 is 15-30um, the package surface of the cover 302 due to the projection direction perpendicular to the blocking action of the cable can be deposited a thin cushioning material; white areas represent spaces the open areas 313 at the vapor deposition of fine particles through the cushioning material 302 deposited on the surface of the package lid, in positions corresponding thereto thicker deposited layer having an island or a projection shape. 通过掩膜版控制,即可在封装盖板302上沉积出具有凹凸起伏形状的buffer layer层,表面放大剖视图如图3A所示。 By controlling the mask, the package can be deposited on the buffer layer 302 cover layer having an undulating shape, enlarged sectional view of the surface shown in Figure 3A.

[0053] 所述沉积缓冲层也可W在封装盖板302沉积得到平坦膜面,再由曝光或蚀刻方法形成具有凹凸结构的缓冲层306。 [0053] The buffer layer may be deposited to obtain a flat film surface W in the package cover 302 is deposited, the buffer layer 306 has an uneven structure is then formed by the exposure or etching process.

[0054] S2 ;通过丝网印刷方式在封装盖板302的缓冲层306 (buffer layer层)具有凹凸结构的表面涂布玻璃料密封框303的图形层。 [0054] S2; glass frit applied to the surface having the uneven structure of the sealing frame pattern layer 303 by screen printing on the cover encapsulating the buffer layer 306 (buffer layer layer) 302. 玻璃料密封框303宽度可W根据需要设置比缓冲层306 (buffer layer层)宽度小,如图3B1所示;或者可W根据需要设置比缓冲层306 (buffer layer层)宽度大,不再图示说明;还可W根据需要设置与缓冲层306 (buffer layer层)具有相同的宽度,如图3B2所示。 Glass frit sealing frame 303 need to set the width W may be smaller than the buffer layer 306 (buffer layer layer) width, shown in FIG. 3B1; or a large width W can be set according to the ratio of the buffer layer 306 (buffer layer layer), not FIG. DESCRIPTION shown; have the same width W may be set in accordance with the buffer layer 306 (buffer layer layer), as shown in FIG 3B2. 经过预干燥、高温烧结固化获得所述玻璃料密封框303,图3B3是固化后示意性剖视图: After pre-drying, high temperature sintering obtained by curing the frit sealing block 303, FIG. 3B3 is a schematic sectional view after curing:

[00巧]S3 ;贴合OLED基板301与封装盖板302,用错射源烙封所述封装盖板302与OLED 基板301之间的玻璃料封装框303,完成对OLED器件的封装,防止OLED器件304受到水、氧气的损害,最终效果如图3C所示。 [00 Qiao] S3; OLED bonded substrate 301 and the encapsulation cover plate 302, the glass frit baked package box between the cover plate 302 seals the encapsulation substrate 301 and the OLED 303 of wrong radiation source, to complete the encapsulation of the OLED device, to prevent OLED device 304 by the water, oxygen damage, the final results shown in Figure 3C.

[0056] 作为另一种实施方式,如图3A1所示,其步骤Sl中缓冲层306的制备方法为:采用普通的PVD或CVD方法沉积Si化和Si化膜层,再由曝光、蚀刻方法形成设定形状,即具有凹凸起伏形状的缓冲层306 (buffer layer层),如图3A1所示一种实施例,3061是Si化膜层,3062是SisNA膜层,还可W根据需要设置一种单层膜结构或他们的任意组合的多层膜结构。 [0056] As another embodiment, as shown in FIG. 3A1, steps Sl buffer layer 306 is prepared as follows: using a conventional PVD or CVD process for depositing Si and Si film layer, and then by the exposure, etching process form the defined shape, i.e., a buffer layer having an undulating shape 306 (buffer layer layer), one kind shown in FIG. 3A1 embodiment, a Si film layer 3061, film layer 3062 is SisNA, W may be set in accordance with a single-layer film structure or multilayer film structure of any combination of them. 所采用的掩膜版的SUS网线312的线径为30um。 We used a SUS mask 312 is the cable diameter 30um.

[0057] 作为可选择的材料,所述玻璃料密封框303所用玻璃料还可W为BaO、Si化、Bz化、 AI2O3、SnO、Te〇2、MgO、CaO、ZnO、Ti〇2、W〇3、Fe2〇3、CuO、Sb2〇3、脚2〇、抓2〇、测酸铅玻璃、磯酸锡玻璃、饥酸盐玻璃和测娃酸盐中的至少任意二种或者多种的组合。 [0057] As an alternative material, the frit sealing frit frame 303 may be W is BaO, Si technology, Bz of, AI2O3, SnO, Te〇2, MgO, CaO, ZnO, Ti〇2, W 〇3, Fe2〇3, CuO, Sb2〇3 foot 2〇, grasping 2〇, any measurement of at least two glass acids lead, tin Rocky acid glass, a glass and a measured baby hunger acid or more acid salts combination. 其中玻璃料颗粒的尺寸在0.1 um-IOum范围内。 Wherein the glass frit particles in the size range of 0.1 um-IOum. 上述玻璃材料能够同时满足封装温度、热膨胀系数、热稳定性和化学稳定性等多方面的要求。 The glass material can meet various requirements package temperature, coefficient of thermal expansion, thermal stability, and chemical stability. 所述玻璃料密封框303的高度在3um-30um之间,宽度在300um-1000um之间。 The height of the frit seal block 303 between 3um-30um, a width between 300um-1000um. 缓冲层306为SiOy、SiNy、A10、中的一种或其组合,优选的化合物为Si化、Si3N4、Al2〇3中的任意一种,或它们任意一种的非化学计量比的化合物,缓冲层306的厚度可控制在〇-〇. 2um之间,宽度可控制在300um-1000um之间。 The buffer layer 306 as a SiOy, SiNy, A10, or a combination thereof, preferably the compound is of Si, Si3N4, Al2〇3 compound in any one of any one thereof or non-stoichiometric ratio, a buffer the thickness of layer 306 may be controlled square-square. between 2um, the width can be controlled between 300um-1000um.

[0058] 优选地,玻璃料密封框303所使用的材料包含Si化、Bz化、Alz化、MgO、化0、Biz化、 化2〇3、MnO化0、RzO巧为化或K)、,所述玻璃料粉末优选的摩尔百分比如表1所示: [0058] Preferably, the frit seal materials used in block 303 of Si contained, Bz oriented, oriented Alz, MgO, of 0, Biz technology, of 2〇3, MnO of 0, RzO is clever or K), , mole percent of the frit glass powder is preferably as shown in table 1:

[0059] 表1 [0059] TABLE 1

[0060] [0060]

Figure CN105633296AD00071

Figure CN105633296AD00081

[0061] 作为另一种优选方式,玻璃料密封框303 ;所使用的材料包含V2〇5、P2〇5、B2〇3、Al2〇3、 Zr〇2、Te〇2、化0、Ti〇2、W〇3、BaO、R2O巧为化或K),所述玻璃料粉末优选的摩尔百分比如表2 所示: [0061] As another preferred embodiment, the glass frit sealing frame 303; V2〇5 containing material used, P2〇5, B2〇3, Al2〇3, Zr〇2, Te〇2, of 0, Ti〇 2, W〇3, BaO, R2O is a coincidence or K), the mole percent of the glass frit powder preferably as shown in table 2:

[0062] 表2 [0062] TABLE 2

Figure CN105633296AD00082

[0063] [0063]

[0064] [0064]

[0065] 作为再一种优选方式,所述玻璃料密封框303所使用的材料包含V205、P2〇e、B203、 AI2O3、Zr〇2、Te〇2、ZnO、Ti〇2、WO3、BaO、CoO,所述玻璃料粉末优选的摩尔百分比如表3所示: [0065] As a further preferred embodiment, the frit sealing material used comprises block 303 V205, P2〇e, B203, AI2O3, Zr〇2, Te〇2, ZnO, Ti〇2, WO3, BaO, CoO, the glass frit powder preferably mole percent as shown in table 3:

[0066] 表3 [0066] TABLE 3

[0067] [0067]

Figure CN105633296AD00091

[0068] 显然,上述实施例仅仅是为清楚地说明所作的举例,而并非对实施方式的限定。 [0068] Clearly, the above-described embodiments are merely made to clearly illustrate example, and not limited to the embodiment. 对于所属领域的普通技术人员来说,在上述说明的基础上还可W做出其它不同形式的变化或变动。 Those of ordinary skill in the art, on the basis of the above described W may vary or be made of other different forms. 送里无需也无法对所有的实施方式予W穷举。 No need to send in W can not be exhaustive of all embodiments. 而由此所引伸出的显而易见的变化或变动仍处于本发明创造的保护范围之中。 The obvious changes or variations therefrom corollary is still in the scope of the inventions.

Claims (10)

  1. 1. 一种用于OLED显示器的玻璃料密封装置,包括基板(301)和封装盖板(302),所述基板(301)与所述封装盖板(302)通过玻璃料密封框(303)密封连接,所述封装盖板(302) 与所述基板(301)形成的密闭空间内容纳0LED器件(304),其特征在于,所述玻璃料密封框(303)与所述封装盖板(302)之间设置有缓冲层(306),所述缓冲层(306)与所述玻璃料密封框(303)相接触的一面具有凹凸结构。 A frit seal for an OLED display device, comprising a substrate (301) and package cover plate (302), said substrate (301) and the encapsulation cover plate (302) through a glass frit sealing frame (303) sealed connection, the package cover plate (302) and the substrate (301) form a sealed space accommodated 0LED device (304), wherein the frit sealing frame (303) and the encapsulation cover plate ( 302 disposed between) a buffer layer (306), the buffer layer (306) has an uneven structure on one side of the glass frit sealing frame (303) contact.
  2. 2. 根据权利要求1所述用于0LED显示器的玻璃料密封装置,其特征在于:所述缓冲层(306)为Si0x、SiN x、A10x中的一种或其组合。 The frit seal means for 0LED display according to claim 1, wherein: the buffer layer (306) is Si0x, SiN x, A10x one or a combination thereof.
  3. 3. 根据权利要求1或2所述用于0LED显示器的玻璃料密封装置,其特征在于:所述缓冲层(306)具有多层凹凸结构。 The frit seal means for display of the 0LED claim 1 or 2, characterized in that: said buffer layer (306) has a multilayer structure uneven.
  4. 4. 根据权利要求3所述用于0LED显示器的玻璃料密封装置,其特征在于:所述缓冲层(306)具有1-2层凹凸结构。 The frit seal device for a display 0LED claim 3, wherein: the buffer layer (306) having a concavo-convex structure layer 1-2.
  5. 5. 根据权利要求3所述用于0LED显示器的玻璃料密封装置,其特征在于:所述缓冲层(306)的厚度h 为0〈h 彡0· 2um,宽度为300um-1000um。 The frit seal means for the 0LED display according to claim 3, wherein: the buffer layer (306) has a thickness h is 0 <h San 0 · 2um, a width of 300um-1000um.
  6. 6. 根据权利要求1或2所述用于OLED显示器的玻璃料密封装置,其特征在于:所述玻璃料密封框(303)与所述基板(301)之间设有保护膜层(305)。 The frit seal means for OLED display as claimed in claim 1 or 2, wherein: a protective layer (305) between the frit sealing frame (303) of the substrate (301) .
  7. 7. -种用于OLED显示器的玻璃料密封装置的制备方法,其特征在于,包括下述步骤: 51 :在封装盖板(302)上沉积缓冲层(306),所述缓冲层(306)远离所述封装盖板(302)的一侧具有凹凸结构; 52 :在所述缓冲层(306)具有凹凸结构的表面涂布玻璃料密封框图形层,经过预干燥、 高温烧结固化获得所述玻璃料密封框(303); 53 :贴合基板(301)与封装盖板(302),熔封所述封装盖板(302)与基板(301)之间的玻璃料封装框(303),完成对OLED器件的封装。 7. - preparation methods for the frit seal the OLED display device, comprising the steps of: 51: depositing a buffer layer (306) on a package cover plate (302), the buffer layer (306) side facing away from the package cover plate (302) having a convex structure; 52: the buffer layer (306) having a surface coated with frit seal layer pattern block uneven structure, pre-drying, high temperature sintering the obtained cured glass frit sealing frame (303); 53: bonded to the substrate (301) and packaging the cover (302), fusion sealing said package cover plate (302) and the substrate (301) between the encapsulation glass frit frame (303), complete encapsulation of the OLED device.
  8. 8. 根据权利要求7所述一种用于OLED显示器的玻璃料密封装置的制备方法,其特征在于,所述步骤S1为:远离所述封装盖板(302)的一侧具有凹凸结构的缓冲层(306)可通过气相沉积法制备。 8. A method for preparing a glass frit sealing an OLED display device according to claim 7, wherein said step S1: one side of the package away from the cover plate (302) having a buffering uneven structure layer (306) can be prepared by vapor deposition.
  9. 9. 根据权利要求8所述一种用于OLED显示器的玻璃料密封装置的制备方法,其特征在于,所述步骤S1为,远离所述封装盖板(302)的一侧具有凹凸结构的缓冲层(306)可通过掩膜板控制形状的方法制备。 According to claim 8 A process for preparing a glass frit seal for an OLED display device, wherein said step S1, a side of the package away from the cover plate (302) having a buffering uneven structure It may be prepared by the method of controlling the shape of the mask layer (306).
  10. 10. 根据权利要求9所述一种用于OLED显示器的玻璃料密封装置的制备方法,其特征在于,所述步骤S1为:在封装盖板(302)沉积得到平坦膜面,再由曝光或蚀刻方法形成具有凹凸结构的缓冲层(306)。 10. The method of claim 9 Preparation frit seal for an OLED display apparatus as claimed in claim, wherein said step S1: In the package cover plate (302) is deposited to obtain a flat film surface, and then by the exposure or forming a buffer layer etching method (306) having a textured structure.
CN 201410623657 2014-11-07 2014-11-07 Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof CN105633296A (en)

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