CN105633296A - Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof - Google Patents
Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof Download PDFInfo
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- CN105633296A CN105633296A CN201410623657.3A CN201410623657A CN105633296A CN 105633296 A CN105633296 A CN 105633296A CN 201410623657 A CN201410623657 A CN 201410623657A CN 105633296 A CN105633296 A CN 105633296A
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Abstract
The present invention relates to a frit sealing device used for an OLED display. The frit sealing device comprises a substrate and a packaging cover plate, the substrate and the packaging cover plate are in sealing connection via a frit sealing frame, and an OLED device is accommodated in an enclosed space formed by the packaging cover plate and the substrate. A buffer layer is arranged between the frit sealing frame and the packaging cover plate, and a contact surface of the buffer layer and the frit sealing frame is equipped with a concave-convex structure. The sealing device enables the joint intensity of the frit and a glass substrate to be improved greatly and an anti-transverse impact force to be enhanced, and effectively prevents the phenomena of cracking, peeling, etc., thereby realizing the higher sealing reliability and mechanical reliability.
Description
Technical field
The present invention relates to the field of sealing technology of a kind of organic electroluminescence device, specifically a kind of organic electroluminescence device glass frit sealing equipment, the invention still further relates to this preparation method for the glass frit sealing equipment of OLED display.
Background technology
As the display device of a new generation, OLED and OLED have the advantage that traditional monitor is incomparable, such as self-luminous, do not need backlight, can realize ultra-thin display and Flexible Displays, driving voltage are low, power saving, response speed are fast etc. But OLED is very sensitive to oxygen and dampness, it is subject to oxygen and dampness invasion and attack can performance degradation ultimate failure. Therefore packaging technology is very big on the impact in OLED life-span. The frit method for packing encapsulation OLED adopted at present is widely used. Existing frit method for packing is as shown in Figure 1; periphery at encapsulation cover plate 302 arranges frit-sealed frame 303; frit-sealed frame 303 is fitted encapsulation cover plate 302 and oled substrate 301; wherein frit-sealed frame 303 directly contacts with encapsulation cover plate 302; and generally have protecting film layer 305 between oled substrate 301; such as SiOx, SiNx, the frit-sealed frame 303 of laser curing completes encapsulation. OLED 304 is sealed in the confined space that encapsulation cover plate 302, oled substrate 301 and frit-sealed frame 303 are formed. The method for packing of this structure, encapsulation cover plate 302 surface owing to generally adopting has the smooth surface that nanoscale is even more excellent, and the surface of frit-sealed frame 303 is micron-level particle size, has therebetween unmatched contact surface, and effective contact area is low. After laser sealing glass material sealing frame 303, the cohesive force between itself and encapsulation cover plate 302 falls flat, and can cause that the phenomenon such as crack, stripping occur in frit and encapsulation cover plate 303, cause package failure under external impacts power.
In order to solve the problems referred to above, proposing a kind of method for packing in prior art, as in figure 2 it is shown, 307 be packing material (seal material) in figure, 303 is frit-sealed frame. After cell cuts (screen body cutting), packing material 307 is set in frit-sealed frame 303 periphery and makes it solidify, reinforcing glass material adhesion strength laterally outside, plays reinforcing effect. But the contact area between frit-sealed frame 303 and encapsulation cover plate 302 does not improve, external impacts power lower-glass material and encapsulation cover plate 302 still there will be the phenomenon such as crack, stripping, ultimately cause package failure.
CN102255056A discloses the encapsulating method that a kind of reinforcing glass material seals the sealing property of OLED, it is to etch one or multi-channel groove or etching tank before glass packages the first glass substrate edge printed deposit frit, then printed glass material on groove, and adopt laser package method the first glass substrate and the second glass substrate to be bonded. Such scheme is at the encapsulation cover plate frit predetermined printing zone one or multi-channel groove of surface etch or etching tank, increases the contact area of frit and cover-plate glass. The lithographic method cost that it adopts is high, and cover-plate glass intensity reduces, and the depositing operation of frit is difficult to.
ZL201320093028 discloses the OLED display and special encapsulation cover plate thereof that between a kind of encapsulation cover plate and substrate, sticking effect is good. OLED display of the present utility model, including the encapsulation cover plate of substrate, the OLED being positioned on substrate and this OLED, the attachment mask described encapsulation cover plate carrying out with substrate paste has the concaveconvex structure formed through surface roughness increase process. Process owing to having carried out surface roughness increase in attachment face, therefore increasing the bonding area between encapsulation cover plate and substrate, thus improving sticking strength, effectively improving sticking effect between encapsulation cover plate and substrate. The structure that this utility model is set forth adopts the method for adhesive bond and the structure of formation thereof, and for known a kind of conventional packaging techniques, encapsulation cover plate is slotted, and places desiccant in groove. The method cost that etching forms relief pattern is high, and cover-plate glass intensity reduces; Binding agent is generally Organic substance, and its water oxygen obstructing capacity is poor, and packaging effect and life-span are poor; It is only used for the bottom emitting type OLED of low side.
Summary of the invention
The technical problem to be solved is in that between existing frit-sealed frame and encapsulation cover plate the problem such as crack, stripping occur, thus providing a kind of glass frit sealing equipment for OLED display, this sealing device greatly improves the bond strength of frit and glass substrate, enhance anti-lateral impact forces, effectively prevent the phenomenon such as crack, stripping, thus realizing higher sealing reliability and Mechanical Reliability.
For solving above-mentioned technical problem, the present invention is achieved by the following technical solutions:
A kind of glass frit sealing equipment for OLED display, including substrate and encapsulation cover plate, described substrate and described encapsulation cover plate are tightly connected by frit-sealed frame, OLED is held in the confined space that described encapsulation cover plate and described substrate are formed, being provided with cushion between described frit-sealed frame and described encapsulation cover plate, the one side that described cushion contacts with described frit-sealed frame has concaveconvex structure.
Described cushion is SiOx��SiNx��AlO��In one or its combination.
Described cushion has multilamellar concaveconvex structure, it is preferable that have 1-2 layer concaveconvex structure.
The thickness h of described cushion is 0 < h��0.2um, and width is 300um-1000um.
It is provided with protection rete between described frit-sealed frame and described substrate.
The preparation method of a kind of glass frit sealing equipment for OLED display, comprises the steps:
S1: buffer layer on encapsulation cover plate, described cushion has concaveconvex structure away from the side of described encapsulation cover plate;
S2: have the surface coated glass material sealing frame graph layer of concaveconvex structure at described cushion, solidifies through predrying, high temperature sintering and obtains described frit-sealed frame;
S3: adhesive substrates and encapsulation cover plate, frit package frame between encapsulation cover plate and substrate described in sealing by fusing, complete the encapsulation to OLED.
Described step S1 is: the cushion away from the side of described encapsulation cover plate with concaveconvex structure can be prepared by vapour deposition process.
As another embodiment, described step S1 is, has the cushion of concaveconvex structure away from the side of described encapsulation cover plate and can control the method for shape by mask plate and prepare.
Described step S1 is, adopts the mask plate of high temperature resistant material to control the shape of deposition material; Described mask plate is provided with Emulsion coating zone, the SUS netting twine of mask plate and opening area;
Described Emulsion coating zone is coated with Emulsion and does not need deposition region to cover;
The wire diameter of the SUS netting twine of mask plate is 15-30um, can deposit relatively thin padded coaming on encapsulation cover plate 302 surface in its upright projection direction due to the barrier effect of netting twine;
Opening area fine particle of padded coaming when vapour deposition is deposited on encapsulation cover plate 302 surface through it, and the rete deposited at this correspondence position is thicker, has island or shape for lugs.
Described step S1 is: obtains smooth face in encapsulation cover plate deposition, then is formed the cushion with concaveconvex structure by exposure or engraving method.
The technique scheme of the present invention has the advantage that compared to existing technology
(1) a kind of glass frit sealing equipment for OLED display provided by the invention, it is provided with cushion between frit-sealed frame and described encapsulation cover plate, the one side that described cushion contacts with described frit-sealed frame has concaveconvex structure, this concaveconvex structure can effectively increase interfacial contact area, and the material that cushion adopts is SiOx��SiNx��AlO��In one or its combination, its chemical composition and frit have the good compatibility, it is possible to increase substantially the bonding force of frit.
(2) a kind of glass frit sealing equipment for OLED display provided by the invention, the frit-sealed frame adopted has sealing by fusing interface unanimous between the higher and lower levels, when package sealing with laser, improve package sealing with laser uniformity, strengthen its anti-lateral impact forces, thus realizing sealing reliability and Mechanical Reliability, it is prevented that the phenomenon such as crack, stripping occurs, being effectively improved OLED and encapsulating the life-span.
(3) present invention adopts the structure of frit method for packing and formation thereof, frit not only as binding agent but also as sealant by laser technology welding encapsulation cover plate and oled substrate, water, oxygen obstructing capacity are better than 3-4 order of magnitude of binding agent; Vapour deposition mode has cushion that is that match and that have convex-concave surface with frit compositions in encapsulation cover plate surface deposition, can greatly improve the bonding strength of frit and substrate; Encapsulation cover plate is without fluting, without desiccant. Can be used for pushing up/bottom emitting type OLED, be especially more suitable for high-end top-emitting OLED device.
Accompanying drawing explanation
In order to make present disclosure be more likely to be clearly understood, below in conjunction with accompanying drawing, the present invention is further detailed explanation, wherein,
Fig. 1 is the schematic diagram of prior art top light-emitting organic electroluminescent device;
Fig. 2 is the schematic diagram of prior art top light-emitting organic electroluminescent device;
Fig. 3 A is the figure on encapsulation cover plate 302 and partial enlarged drawing;
Fig. 3 A1 is the structural representation of a kind of embodiment of encapsulation cover plate;
Fig. 3 A2 is the structural representation of encapsulation cover plate another embodiment;
Fig. 3 A3 is the structural representation of encapsulation cover plate another embodiment;
Fig. 3 B1 is the structural representation of a kind of embodiment that frit-sealed frame is combined with encapsulation cover plate;
Fig. 3 B2 is the another embodiment structural representation that frit-sealed frame is combined with encapsulation cover plate;
Fig. 3 B3 be frit-sealed frame be combined with encapsulation cover plate solidification after structure sectional view;
Fig. 3 C is the top light-emitting organic electroluminescent device structural representation of the present invention.
In figure, accompanying drawing labelling is expressed as:
301-substrate, 302-encapsulation cover plate, the frit-sealed frame of 303-, 304-OLED device; 305-protects rete, 306-cushion, 3061-SiNx rete, 3062-SiOx rete; 311-Emulsion coating zone, the netting twine of 312-SUS, the white spaces region that 313-represents is mask plate position of opening.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
The present invention can be embodied in many different forms, and should not be construed as limited to embodiment set forth herein. On the contrary, it is provided that these embodiments so that the disclosure will be thorough and complete, and the design of the present invention being fully conveyed to those skilled in the art, the present invention will only be defined by the appended claims. In the accompanying drawings, for clarity, the size in layer and region and relative size can be exaggerated. It should be appreciated that when element such as layer, region or substrate be referred to as " formed exist " or " being arranged on " another element " on " time, this element can be arranged directly on another element described, or can also there is intermediary element. On the contrary, when element is referred to as on " being formed directly into " or " being set directly at " another element, it is absent from intermediary element.
As shown in Figure 3 C, a kind of glass frit sealing equipment for OLED display provided by the invention, including substrate 301 and encapsulation cover plate 302, described substrate 301 is tightly connected by frit-sealed frame 303 with described encapsulation cover plate 302, OLED 304 is held in the confined space that described encapsulation cover plate 302 and described substrate 301 are formed, being provided with cushion 306 between described frit-sealed frame 303 and described encapsulation cover plate 302, the one side that described cushion 306 contacts with described frit-sealed frame 303 has concaveconvex structure.
Described substrate 301: substrate can be known soda-lime glass or alkaline earth borosilicate glass, and thickness is 0.3-0.7mm, it is preferable that thickness is 0.4mm or 0.5mm.
Encapsulation cover plate 302: encapsulation cover plate can be known soda-lime glass or alkaline earth borosilicate glass, and thickness is 0.3-0.7mm, it is preferable that thickness is 0.4mm or 0.5mm.
Frit-sealed frame 303: the material used includes at least V2O5And P2O5��BaO��SiO2��B2O3��Al2O3��SnO��TeO2��MgO��CaO��ZnO��TiO2��WO3��Bi2O3��Fe2O3��CuO��Sb2O3��Ru2O��Rb2Any one or multiple combination in O, lead borate glass, tin-fluorophosphate glasses, vanadate glass and borosilicate, it is highly 3um-30um, width 300um-1000um;
Described cushion 306 is SiOx��SiNx��AlO��In one or its combination, it is preferred that compound is SiO2��Si3N4��Al2O3In any one, or the compound of they any one non-stoichiometric, described cushion 306 has multilamellar concaveconvex structure, it is preferable that 1-5 layer concaveconvex structure, it is preferred that 1-2 layer concaveconvex structure. The gross thickness h of described cushion 306 is 0 < h��0.2um, and width is 300um-1000um. Protection rete 305 it is provided with between described frit-sealed frame 303 and described substrate 301.
Being preferably carried out mode as one, as shown in Fig. 3 A1, the material that cushion 306 uses is Si3N4And SiO2(compound of their non-stoichiometric), cushion 306 is two-layer, and its gross thickness can be controlled between 0.1um, between width 300um; 3061 is Si3N4Rete, 3062 is rete SiO2Layer; Can certainly be arranged as required to 3061 is SiO2Rete, 3062 is Si3N4Rete.
The described typical structure of OLED 304 includes an anode layer, one or more organic layers, a cathode layer, it is possible to set up other auxiliary layer as required.
The preparation method of the above-mentioned glass frit sealing equipment for OLED display, comprises the steps:
S1: the cushion 306 (bufferlayer layer) of depositing and setting shape on encapsulation cover plate 302, can by vapour deposition such as PVD (physical vapour deposition (PVD), or CVD (chemical vapour deposition (CVD) Physicalvapordeposition), ChemicalVaporDeposition) directly obtain, described cushion 306 has concaveconvex structure away from the side of described encapsulation cover plate 302, is deposited on the figure on encapsulation cover plate 302 and partial enlarged drawing as shown in Figure 3A;
Described buffer layer 306 (bufferlayer layer) specifically can adopt vapour deposition process to have the cushion 306 of concaveconvex structure in the side away from described encapsulation cover plate 302, the mask plate adopting high temperature resistant material (such as the combination of SUS+ Emulsion) controls the shape of deposition material, and the shape of mask plate is as shown in figure 3 a 2; Fig. 3 A3 has the single cell area mask version enlarged drawing that the realized bufferlayer layer given shape mated with frit 303 controls. Described mask plate is provided with Emulsion coating zone 311, the SUS netting twine 312 of mask plate and opening area 313; Described Emulsion coating zone 311 is coated with Emulsion, for instance diazonium emulsion (diazo sensitizer agent), does not need deposition region to cover; The wire diameter of the SUS netting twine 312 of mask plate is 15-30um, and encapsulation cover plate 302 surface in its upright projection direction can deposit relatively thin padded coaming due to the barrier effect of netting twine; The opening area 313 of white spaces Regional Representative fine particle of padded coaming when vapour deposition is deposited on encapsulation cover plate 302 surface through it, and the rete deposited at this correspondence position is thicker, has island or shape for lugs. By mask plate control, can depositing the bufferlayer layer with concavo-convex undulations on encapsulation cover plate 302, surface amplification view is as shown in Figure 3A.
Described buffer layer can also obtain smooth face in encapsulation cover plate 302 deposition, then is formed the cushion 306 with concaveconvex structure by exposure or engraving method.
S2: be there is at the cushion 306 (bufferlayer layer) of encapsulation cover plate 302 graph layer of the surface coated glass material sealing frame 303 of concaveconvex structure by screen printing mode. Frit-sealed frame 303 width can be arranged as required to less than cushion 306 (bufferlayer layer) width, as shown in Fig. 3 B1; Or can be arranged as required to bigger than cushion 306 (bufferlayer layer) width, no longer illustrate; Can also be arranged as required to, with cushion 306 (bufferlayer layer), there is identical width, as shown in Fig. 3 B2. Solidify through predrying, high temperature sintering and obtain schematic cross sectional views after described frit-sealed frame 303, Fig. 3 B3 is to solidify:
S3: laminating oled substrate 301 and encapsulation cover plate 302, by frit package frame 303 between encapsulation cover plate 302 and oled substrate 301 described in the sealing by fusing of radium-shine source, completing the encapsulation to OLED, it is prevented that OLED 304 is subject to the infringement of water, oxygen, final effect is as shown in Figure 3 C.
As another embodiment, as shown in Fig. 3 A1, in its step S1, the preparation method of cushion 306 is: adopt common PVD or CVD method deposition SiOx and SiNx rete, setting shape is formed again by exposure, engraving method, namely there is the cushion 306 (bufferlayer layer) of concavo-convex undulations, a kind of embodiment as shown in Fig. 3 A1,3061 is SiO2Rete, 3062 is Si3N4Rete, it is also possible to be arranged as required to a kind of single-layer membrane structure or the multi-layer film structure of their combination in any. The wire diameter of the SUS netting twine 312 of the mask plate adopted is 30um.
As selectable material, frit used by described frit-sealed frame 303 can also be BaO, SiO2��B2O3��Al2O3��SnO��TeO2��MgO��CaO��ZnO��TiO2��WO3��Fe2O3��CuO��Sb2O3��Ru2O��Rb2At least any two or multiple combination in O, lead borate glass, tin-fluorophosphate glasses, vanadate glass and borosilicate. Wherein the size of frit glass particles is within the scope of 0.1um-10um. Above-mentioned glass material can meet many-sided requirements such as package temperature, thermal coefficient of expansion, heat stability and chemical stability simultaneously. The height of described frit-sealed frame 303 is between 3um-30um, and width is between 300um-1000um. Cushion 306 is SiOx��SiNx��AlO��In one or its combination, it is preferred that compound is SiO2��Si3N4��Al2O3In any one, or the compound of they any one non-stoichiometric, the thickness of cushion 306 can be controlled between 0-0.2um, and width can be controlled between 300um-1000um.
Preferably, the material that frit-sealed frame 303 uses comprises SiO2��B2O3��Al2O3��MgO��ZnO��Bi2O3��Fe2O3��MnOCuO��R2O (R is Na or K), the preferred molar percentage of described glass frit powder is as shown in table 1:
Table 1
| Component | Mole % |
| Bi2O3 | 30-60 |
| SiO2 | 0-10 |
| B2O3 | 0-10 |
| Al2O3 | 0-5 |
| MgO | 0-10 |
| ZnO | 0-20 |
| Fe2O3 | 0-5 |
| CuO | 0-5 |
| MnO | 0-5 |
| R2O (R is Na or K) | 0-5 |
As another kind of optimal way, frit-sealed frame 303: the material used comprises V2O5��P2O5��B2O3��Al2O3��ZrO2��TeO2��ZnO��TiO2��WO3��BaO��R2O (R is Na or K), the preferred molar percentage of described glass frit powder is as shown in table 2:
Table 2
| Component | Mole % |
| V2O5 | 30-60 |
| P2O5 | 0-10 |
| B2O3 | 0-10 |
| Al2O3 | 0-5 |
| ZrO2 | 0-10 |
| TeO2 | 0-20 |
| ZnO | 0-20 |
| WO3 | 0-5 |
| BaO | 0-5 |
| TiO2 | 0-5 |
| R2O (R is Na or K) | 0-5 |
As another optimal way, the material that described frit-sealed frame 303 uses comprises V2O5��P2O5��B2O3��Al2O3��ZrO2��TeO2��ZnO��TiO2��WO3, BaO, CoO, the preferred molar percentage of described glass frit powder is as shown in table 3:
Table 3
| Component | Mole % |
| V2O5 | 30-60 |
| P2O5 | 0-10 |
| B2O3 | 0-10 |
| Al2O3 | 0-5 |
| ZrO2 | 0-10 |
| TeO2 | 0-20 |
| ZnO | 0-20 |
| WO3 | 0-5 |
| BaO | 0-5 |
| CoO | 0-5 |
| TiO2 | 0-5 |
Obviously, above-described embodiment is only for clearly demonstrating example, and is not the restriction to embodiment. For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description. Here without also cannot all of embodiment be given exhaustive. And the apparent change thus extended out or variation are still among the protection domain of the invention.
Claims (10)
1. the glass frit sealing equipment for OLED display, including substrate (301) and encapsulation cover plate (302), described substrate (301) and described encapsulation cover plate (302) are tightly connected by frit-sealed frame (303), OLED (304) is held in the confined space that described encapsulation cover plate (302) and described substrate (301) are formed, it is characterized in that, cushion (306) it is provided with between described frit-sealed frame (303) and described encapsulation cover plate (302), the one side that described cushion (306) contacts with described frit-sealed frame (303) has concaveconvex structure.
2. according to claim 1 for the glass frit sealing equipment of OLED display, it is characterised in that: described cushion (306) is SiOx��SiNx��AlO��In one or its combination.
3. the glass frit sealing equipment for OLED display according to claim 1 or claim 2, it is characterised in that: described cushion (306) has multilamellar concaveconvex structure.
4. according to claim 3 for the glass frit sealing equipment of OLED display, it is characterised in that: described cushion (306) has 1-2 layer concaveconvex structure.
5. according to claim 3 for the glass frit sealing equipment of OLED display, it is characterised in that: the thickness h of described cushion (306) is 0 < h��0.2um, and width is 300um-1000um.
6. the glass frit sealing equipment for OLED display according to claim 1 or claim 2, it is characterised in that: it is provided with protection rete (305) between described frit-sealed frame (303) and described substrate (301).
7. the preparation method for the glass frit sealing equipment of OLED display, it is characterised in that comprise the steps:
S1: at the upper buffer layer (306) of encapsulation cover plate (302), described cushion (306) has concaveconvex structure away from the side of described encapsulation cover plate (302);
S2: have the surface coated glass material sealing frame graph layer of concaveconvex structure at described cushion (306), solidifies through predrying, high temperature sintering and obtains described frit-sealed frame (303);
S3: adhesive substrates (301) and encapsulation cover plate (302), the frit package frame (303) between encapsulation cover plate described in sealing by fusing (302) and substrate (301), completes the encapsulation to OLED.
8. the preparation method of a kind of glass frit sealing equipment for OLED display according to claim 7, it is characterized in that, described step S1 is: the cushion (306) away from the side of described encapsulation cover plate (302) with concaveconvex structure can be prepared by vapour deposition process.
9. the preparation method of a kind of glass frit sealing equipment for OLED display according to claim 8, it is characterized in that, described step S1 is, has the cushion (306) of concaveconvex structure away from the side of described encapsulation cover plate (302) and can control the method for shape by mask plate and prepare.
10. the preparation method of a kind of glass frit sealing equipment for OLED display according to claim 9, it is characterized in that, described step S1 is: obtains smooth face in encapsulation cover plate (302) deposition, then is formed the cushion (306) with concaveconvex structure by exposure or engraving method.
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Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281256A (en) * | 2003-03-17 | 2004-10-07 | Nippon Sheet Glass Co Ltd | Display panel |
| CN1578553A (en) * | 2003-07-19 | 2005-02-09 | 三星Sdi株式会社 | Encapsulated organic electroluminescent display |
| CN101218692A (en) * | 2005-06-10 | 2008-07-09 | 通用电气公司 | Hermetically sealed package and methods of making the same |
| CN101711438A (en) * | 2007-02-23 | 2010-05-19 | 康宁股份有限公司 | Improve the method and apparatus of clinkering sealed glass package body |
| KR20100063313A (en) * | 2008-12-03 | 2010-06-11 | 엘지디스플레이 주식회사 | Display device including sealent guide pattern and method for fabricating the same |
| KR20110035444A (en) * | 2009-09-30 | 2011-04-06 | 엘지디스플레이 주식회사 | Method of fabricating for dual panel type organic electro-luminescent device |
| US20110122633A1 (en) * | 2009-11-20 | 2011-05-26 | Samsung Mobile Display Co., Ltd. | Organic light emitting diode display and method of manufacturing the same |
| CN102484216A (en) * | 2009-07-15 | 2012-05-30 | 苹果公司 | Display modules |
| CN103779503A (en) * | 2012-10-17 | 2014-05-07 | 奇美电子股份有限公司 | Organic light emitting diode display and manufacturing method thereof |
| CN103885249A (en) * | 2012-12-19 | 2014-06-25 | 索尼公司 | Moisture-proof structure and display device |
-
2014
- 2014-11-07 CN CN201410623657.3A patent/CN105633296A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281256A (en) * | 2003-03-17 | 2004-10-07 | Nippon Sheet Glass Co Ltd | Display panel |
| CN1578553A (en) * | 2003-07-19 | 2005-02-09 | 三星Sdi株式会社 | Encapsulated organic electroluminescent display |
| CN101218692A (en) * | 2005-06-10 | 2008-07-09 | 通用电气公司 | Hermetically sealed package and methods of making the same |
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