CN107359269A - A kind of new A MOLE structures - Google Patents

A kind of new A MOLE structures Download PDF

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Publication number
CN107359269A
CN107359269A CN201710467974.4A CN201710467974A CN107359269A CN 107359269 A CN107359269 A CN 107359269A CN 201710467974 A CN201710467974 A CN 201710467974A CN 107359269 A CN107359269 A CN 107359269A
Authority
CN
China
Prior art keywords
layer
silicon nitride
frame glue
cover plate
solid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201710467974.4A
Other languages
Chinese (zh)
Inventor
白航空
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Huike Precision Mould Co Ltd
Original Assignee
Hefei Huike Precision Mould Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Huike Precision Mould Co Ltd filed Critical Hefei Huike Precision Mould Co Ltd
Priority to CN201710467974.4A priority Critical patent/CN107359269A/en
Publication of CN107359269A publication Critical patent/CN107359269A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8423Metallic sealing arrangements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/842Containers
    • H10K50/8426Peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

The present invention relates to display technology field, more particularly to a kind of new A MOLED structures.A kind of new A MOLE structures of the present invention, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, silicon nitride layer, frame glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;A solid-state glued membranes are arranged on substrate and are covered in AMOLED device exteriors, desiccant layer is arranged at solid-state glued membrane periphery, silicon nitride layer is arranged on encapsulation cover plate and positioned at desiccant layer periphery, frame glue is arranged on substrate and is oppositely arranged with silicon nitride layer, silicon nitride layer is connected with frame glue opposing end surface, encapsulation cover plate bonds with solid-state glued membrane, has space between silicon nitride layer, frame glue and desiccant layer;There is space between silicon nitride layer, frame glue and desiccant layer;Simple in construction, packaging effect is good, can significantly extend the service life of AMOLED devices.

Description

A kind of new A MOLE structures
Technical field
The present invention relates to display technology field, more particularly to a kind of new A MOLE structures.
Background technology
AMOLED is writing a Chinese character in simplified form for English Active-matrix organic light emitting diode, Chinese full name It is active matrix organic light-emitting diode or active-matrix organic light emitting diode.Present AMOLED display device generally encapsulates Effect is limited.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of new A MOLE structures, and dress is shown to solve present AMOLED Put the problem of usual packaging effect is limited.
In order to solve the above technical problems, the technical solution adopted by the present invention is:
A kind of new A MOLE structures, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, silicon nitride layer, frame Glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;
The AMOLED devices are arranged on the substrate, and the AMOLED devices include what is set gradually from the bottom to top TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and cathode layer;
The solid-state glued membrane is arranged on the substrate and is covered in the AMOLED device exteriors, and the desiccant layer is set The solid-state glued membrane periphery is placed in, the silicon nitride layer is arranged on the encapsulation cover plate and is located at desiccant layer periphery, The frame glue is arranged on the substrate and is oppositely arranged with the silicon nitride layer, the silicon nitride layer and the frame glue opposite end Face is connected, and the encapsulation cover plate bonds with the solid-state glued membrane, has between the silicon nitride layer, frame glue and the desiccant layer Space;First barrier layer, cushion and the second barrier layer are disposed with from the bottom to top above the AMOLED devices.
The encapsulation cover plate is glass plate or metallic plate.
Protective clear layer, the protective clear layer are covered with below first barrier layer above the AMOLED devices Bearing rib is provided between the encapsulation cover plate.
Advantage for present invention is with effect:
A kind of new A MOLE structures of the present invention, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, nitridation Silicon layer, frame glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;AMOLED devices are arranged on substrate, AMOLED devices include TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and the cathode layer set gradually from the bottom to top;Gu State glued membrane is arranged on substrate and is covered in AMOLED device exteriors, and desiccant layer is arranged at solid-state glued membrane periphery, silicon nitride layer It is arranged on encapsulation cover plate and is arranged on substrate and is oppositely arranged with silicon nitride layer positioned at desiccant layer periphery, frame glue, nitrogenizes Silicon layer is connected with frame glue opposing end surface, and encapsulation cover plate bonds with solid-state glued membrane, has between silicon nitride layer, frame glue and desiccant layer Space;The first barrier layer, cushion and the second barrier layer are disposed with from the bottom to top above AMOLED devices;Structure letter Single, packaging effect is good, can significantly extend the service life of AMOLED devices.
Brief description of the drawings
The invention will be further described below in conjunction with the accompanying drawings:
Fig. 1 is a kind of sectional view of new A MOLE structures of the present invention.
Fig. 2 is the sectional view of the AMOLED devices in Fig. 1.
Embodiment
As depicted in figs. 1 and 2, a kind of new A MOLE structures of the invention, including:Substrate 1, encapsulation cover plate 2, AMOLED Device 3, solid-state glued membrane 4, silicon nitride layer 5, frame glue 6, the first barrier layer 71, cushion 72, the second barrier layer 73 and drier Layer 8;The AMOLED devices 3 are arranged on the substrate 1, and the AMOLED devices 3 include the TFT set gradually from the bottom to top Layer 31, anode layer 32, cavitation layer 33, luminescent layer 34, electronic shell 35 and cathode layer 36;The solid-state glued membrane 4 is arranged at the base On plate 1 and it is covered in outside the AMOLED devices 3, the desiccant layer 8 is arranged at the periphery of solid-state glued membrane 4, the nitrogen SiClx layer 5 is arranged on the encapsulation cover plate 2 and is arranged at the substrate 1 positioned at the periphery of desiccant layer 8, the frame glue 6 Above and with the silicon nitride layer 5 it is oppositely arranged, the silicon nitride layer 5 is connected with the opposing end surface of frame glue 6, the cap Plate 2 bonds with the solid-state glued membrane 4, has space between the silicon nitride layer 5, frame glue 6 and the desiccant layer 8;It is described The top of AMOLED devices 3 is disposed with first barrier layer 71, the barrier layer 73 of cushion 72 and second from the bottom to top.Institute It is glass plate or metallic plate to state encapsulation cover plate 2.The top of AMOLED devices 3 is covered with below first barrier layer 71 Protective clear layer 10, bearing rib 9 is provided between the protective clear layer 10 and the encapsulation cover plate 2.One kind of the present invention New A MOLE structures, encapsulation cover plate bond with solid-state glued membrane;Simple in construction, packaging effect is good, can significantly extend AMOLED devices Service life.
The present invention is not limited to above-described embodiment, and embodiment is exemplary, it is intended to for explaining the present invention, and can not It is interpreted as limitation of the present invention.

Claims (3)

  1. A kind of 1. new A MOLE structures, it is characterised in that including:It is substrate (1), encapsulation cover plate (2), AMOLED devices (3), solid State glued membrane (4), silicon nitride layer (5), frame glue (6), the first barrier layer (71), cushion (72), the second barrier layer (73) and dry Drying prescription layer (8);
    The AMOLED devices (3) are arranged on the substrate (1), and the AMOLED devices (3) include setting successively from the bottom to top TFT layer (31), anode layer (32), cavitation layer (33), luminescent layer (34), electronic shell (35) and the cathode layer (36) put;
    The solid-state glued membrane (4) is arranged on the substrate (1) and is covered in AMOLED devices (3) outside, the drying Oxidant layer (8) is arranged at solid-state glued membrane (4) periphery, and the silicon nitride layer (5) is arranged on the encapsulation cover plate (2) and is located at Desiccant layer (8) periphery, the frame glue (6) are arranged on the substrate (1) and set relatively with the silicon nitride layer (5) Put, the silicon nitride layer (5) is connected with the frame glue (6) opposing end surface, the encapsulation cover plate (2) and the solid-state glued membrane (4) bond, have space between the silicon nitride layer (5), frame glue (6) and the desiccant layer (8);The AMOLED devices (3) Top is disposed with first barrier layer (71), cushion (72) and the second barrier layer (73) from the bottom to top.
  2. 2. a kind of new A MOLE structures according to claim 1, it is characterised in that the encapsulation cover plate (2) is glass plate Or metallic plate.
  3. 3. a kind of new A MOLE structures according to claim 1, it is characterised in that AMOLED devices (3) top exists Protective clear layer (10), the protective clear layer (10) and the encapsulation cover plate are covered with below first barrier layer (71) (2) bearing rib (9) is provided between.
CN201710467974.4A 2017-06-20 2017-06-20 A kind of new A MOLE structures Pending CN107359269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201710467974.4A CN107359269A (en) 2017-06-20 2017-06-20 A kind of new A MOLE structures

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201710467974.4A CN107359269A (en) 2017-06-20 2017-06-20 A kind of new A MOLE structures

Publications (1)

Publication Number Publication Date
CN107359269A true CN107359269A (en) 2017-11-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201710467974.4A Pending CN107359269A (en) 2017-06-20 2017-06-20 A kind of new A MOLE structures

Country Status (1)

Country Link
CN (1) CN107359269A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019205434A1 (en) * 2018-04-27 2019-10-31 武汉华星光电技术有限公司 Oled display device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104505465A (en) * 2014-12-04 2015-04-08 深圳市华星光电技术有限公司 OLED packaging structure and packaging method thereof
CN104617234A (en) * 2015-02-13 2015-05-13 京东方科技集团股份有限公司 Spacer, organic light emitting display panel, manufacturing method and display device
CN105633296A (en) * 2014-11-07 2016-06-01 昆山国显光电有限公司 Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105633296A (en) * 2014-11-07 2016-06-01 昆山国显光电有限公司 Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof
CN104505465A (en) * 2014-12-04 2015-04-08 深圳市华星光电技术有限公司 OLED packaging structure and packaging method thereof
CN104617234A (en) * 2015-02-13 2015-05-13 京东方科技集团股份有限公司 Spacer, organic light emitting display panel, manufacturing method and display device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019205434A1 (en) * 2018-04-27 2019-10-31 武汉华星光电技术有限公司 Oled display device

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Application publication date: 20171117