CN107359269A - A kind of new A MOLE structures - Google Patents
A kind of new A MOLE structures Download PDFInfo
- Publication number
- CN107359269A CN107359269A CN201710467974.4A CN201710467974A CN107359269A CN 107359269 A CN107359269 A CN 107359269A CN 201710467974 A CN201710467974 A CN 201710467974A CN 107359269 A CN107359269 A CN 107359269A
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- China
- Prior art keywords
- layer
- silicon nitride
- frame glue
- cover plate
- solid
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8423—Metallic sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to display technology field, more particularly to a kind of new A MOLED structures.A kind of new A MOLE structures of the present invention, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, silicon nitride layer, frame glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;A solid-state glued membranes are arranged on substrate and are covered in AMOLED device exteriors, desiccant layer is arranged at solid-state glued membrane periphery, silicon nitride layer is arranged on encapsulation cover plate and positioned at desiccant layer periphery, frame glue is arranged on substrate and is oppositely arranged with silicon nitride layer, silicon nitride layer is connected with frame glue opposing end surface, encapsulation cover plate bonds with solid-state glued membrane, has space between silicon nitride layer, frame glue and desiccant layer;There is space between silicon nitride layer, frame glue and desiccant layer;Simple in construction, packaging effect is good, can significantly extend the service life of AMOLED devices.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of new A MOLE structures.
Background technology
AMOLED is writing a Chinese character in simplified form for English Active-matrix organic light emitting diode, Chinese full name
It is active matrix organic light-emitting diode or active-matrix organic light emitting diode.Present AMOLED display device generally encapsulates
Effect is limited.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of new A MOLE structures, and dress is shown to solve present AMOLED
Put the problem of usual packaging effect is limited.
In order to solve the above technical problems, the technical solution adopted by the present invention is:
A kind of new A MOLE structures, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, silicon nitride layer, frame
Glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;
The AMOLED devices are arranged on the substrate, and the AMOLED devices include what is set gradually from the bottom to top
TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and cathode layer;
The solid-state glued membrane is arranged on the substrate and is covered in the AMOLED device exteriors, and the desiccant layer is set
The solid-state glued membrane periphery is placed in, the silicon nitride layer is arranged on the encapsulation cover plate and is located at desiccant layer periphery,
The frame glue is arranged on the substrate and is oppositely arranged with the silicon nitride layer, the silicon nitride layer and the frame glue opposite end
Face is connected, and the encapsulation cover plate bonds with the solid-state glued membrane, has between the silicon nitride layer, frame glue and the desiccant layer
Space;First barrier layer, cushion and the second barrier layer are disposed with from the bottom to top above the AMOLED devices.
The encapsulation cover plate is glass plate or metallic plate.
Protective clear layer, the protective clear layer are covered with below first barrier layer above the AMOLED devices
Bearing rib is provided between the encapsulation cover plate.
Advantage for present invention is with effect:
A kind of new A MOLE structures of the present invention, including:Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, nitridation
Silicon layer, frame glue, the first barrier layer, cushion, the second barrier layer and desiccant layer;AMOLED devices are arranged on substrate,
AMOLED devices include TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and the cathode layer set gradually from the bottom to top;Gu
State glued membrane is arranged on substrate and is covered in AMOLED device exteriors, and desiccant layer is arranged at solid-state glued membrane periphery, silicon nitride layer
It is arranged on encapsulation cover plate and is arranged on substrate and is oppositely arranged with silicon nitride layer positioned at desiccant layer periphery, frame glue, nitrogenizes
Silicon layer is connected with frame glue opposing end surface, and encapsulation cover plate bonds with solid-state glued membrane, has between silicon nitride layer, frame glue and desiccant layer
Space;The first barrier layer, cushion and the second barrier layer are disposed with from the bottom to top above AMOLED devices;Structure letter
Single, packaging effect is good, can significantly extend the service life of AMOLED devices.
Brief description of the drawings
The invention will be further described below in conjunction with the accompanying drawings:
Fig. 1 is a kind of sectional view of new A MOLE structures of the present invention.
Fig. 2 is the sectional view of the AMOLED devices in Fig. 1.
Embodiment
As depicted in figs. 1 and 2, a kind of new A MOLE structures of the invention, including:Substrate 1, encapsulation cover plate 2, AMOLED
Device 3, solid-state glued membrane 4, silicon nitride layer 5, frame glue 6, the first barrier layer 71, cushion 72, the second barrier layer 73 and drier
Layer 8;The AMOLED devices 3 are arranged on the substrate 1, and the AMOLED devices 3 include the TFT set gradually from the bottom to top
Layer 31, anode layer 32, cavitation layer 33, luminescent layer 34, electronic shell 35 and cathode layer 36;The solid-state glued membrane 4 is arranged at the base
On plate 1 and it is covered in outside the AMOLED devices 3, the desiccant layer 8 is arranged at the periphery of solid-state glued membrane 4, the nitrogen
SiClx layer 5 is arranged on the encapsulation cover plate 2 and is arranged at the substrate 1 positioned at the periphery of desiccant layer 8, the frame glue 6
Above and with the silicon nitride layer 5 it is oppositely arranged, the silicon nitride layer 5 is connected with the opposing end surface of frame glue 6, the cap
Plate 2 bonds with the solid-state glued membrane 4, has space between the silicon nitride layer 5, frame glue 6 and the desiccant layer 8;It is described
The top of AMOLED devices 3 is disposed with first barrier layer 71, the barrier layer 73 of cushion 72 and second from the bottom to top.Institute
It is glass plate or metallic plate to state encapsulation cover plate 2.The top of AMOLED devices 3 is covered with below first barrier layer 71
Protective clear layer 10, bearing rib 9 is provided between the protective clear layer 10 and the encapsulation cover plate 2.One kind of the present invention
New A MOLE structures, encapsulation cover plate bond with solid-state glued membrane;Simple in construction, packaging effect is good, can significantly extend AMOLED devices
Service life.
The present invention is not limited to above-described embodiment, and embodiment is exemplary, it is intended to for explaining the present invention, and can not
It is interpreted as limitation of the present invention.
Claims (3)
- A kind of 1. new A MOLE structures, it is characterised in that including:It is substrate (1), encapsulation cover plate (2), AMOLED devices (3), solid State glued membrane (4), silicon nitride layer (5), frame glue (6), the first barrier layer (71), cushion (72), the second barrier layer (73) and dry Drying prescription layer (8);The AMOLED devices (3) are arranged on the substrate (1), and the AMOLED devices (3) include setting successively from the bottom to top TFT layer (31), anode layer (32), cavitation layer (33), luminescent layer (34), electronic shell (35) and the cathode layer (36) put;The solid-state glued membrane (4) is arranged on the substrate (1) and is covered in AMOLED devices (3) outside, the drying Oxidant layer (8) is arranged at solid-state glued membrane (4) periphery, and the silicon nitride layer (5) is arranged on the encapsulation cover plate (2) and is located at Desiccant layer (8) periphery, the frame glue (6) are arranged on the substrate (1) and set relatively with the silicon nitride layer (5) Put, the silicon nitride layer (5) is connected with the frame glue (6) opposing end surface, the encapsulation cover plate (2) and the solid-state glued membrane (4) bond, have space between the silicon nitride layer (5), frame glue (6) and the desiccant layer (8);The AMOLED devices (3) Top is disposed with first barrier layer (71), cushion (72) and the second barrier layer (73) from the bottom to top.
- 2. a kind of new A MOLE structures according to claim 1, it is characterised in that the encapsulation cover plate (2) is glass plate Or metallic plate.
- 3. a kind of new A MOLE structures according to claim 1, it is characterised in that AMOLED devices (3) top exists Protective clear layer (10), the protective clear layer (10) and the encapsulation cover plate are covered with below first barrier layer (71) (2) bearing rib (9) is provided between.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201710467974.4A CN107359269A (en) | 2017-06-20 | 2017-06-20 | A kind of new A MOLE structures |
Applications Claiming Priority (1)
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CN201710467974.4A CN107359269A (en) | 2017-06-20 | 2017-06-20 | A kind of new A MOLE structures |
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CN107359269A true CN107359269A (en) | 2017-11-17 |
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CN201710467974.4A Pending CN107359269A (en) | 2017-06-20 | 2017-06-20 | A kind of new A MOLE structures |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019205434A1 (en) * | 2018-04-27 | 2019-10-31 | 武汉华星光电技术有限公司 | Oled display device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104505465A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED packaging structure and packaging method thereof |
CN104617234A (en) * | 2015-02-13 | 2015-05-13 | 京东方科技集团股份有限公司 | Spacer, organic light emitting display panel, manufacturing method and display device |
CN105633296A (en) * | 2014-11-07 | 2016-06-01 | 昆山国显光电有限公司 | Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof |
-
2017
- 2017-06-20 CN CN201710467974.4A patent/CN107359269A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105633296A (en) * | 2014-11-07 | 2016-06-01 | 昆山国显光电有限公司 | Frit sealing device used for organic light emitting diode (OLED) display and preparation method thereof |
CN104505465A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED packaging structure and packaging method thereof |
CN104617234A (en) * | 2015-02-13 | 2015-05-13 | 京东方科技集团股份有限公司 | Spacer, organic light emitting display panel, manufacturing method and display device |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019205434A1 (en) * | 2018-04-27 | 2019-10-31 | 武汉华星光电技术有限公司 | Oled display device |
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Application publication date: 20171117 |