CN107359270A - A kind of encapsulating structure of AMOLED devices - Google Patents
A kind of encapsulating structure of AMOLED devices Download PDFInfo
- Publication number
- CN107359270A CN107359270A CN201710468002.7A CN201710468002A CN107359270A CN 107359270 A CN107359270 A CN 107359270A CN 201710468002 A CN201710468002 A CN 201710468002A CN 107359270 A CN107359270 A CN 107359270A
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- CN
- China
- Prior art keywords
- protecting frame
- inorganic protecting
- layer
- frame
- amoled devices
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to display technology field, more particularly to a kind of encapsulating structure of AMOLED devices.A kind of encapsulating structure of AMOLED devices of the present invention, including：Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, the first inorganic protecting frame, the second inorganic protecting frame, frame glue and desiccant layer；Solid-state glued membrane is arranged on substrate and is covered in AMOLED device exteriors; desiccant layer is arranged at solid-state glued membrane periphery; first inorganic protecting frame is arranged on encapsulation cover plate and positioned at desiccant layer periphery; second inorganic protecting frame is arranged on substrate and positioned at the first inorganic protecting frame periphery; frame glue is provided between first inorganic protecting frame and the second inorganic protecting frame, frame glue is bonded between the first inorganic protecting frame and the second inorganic protecting frame；Encapsulation cover plate bonds with solid-state glued membrane；Simple in construction, packaging effect is good, can significantly extend the service life of AMOLED devices.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of encapsulating structure of AMOLED devices.
Background technology
AMOLED is writing a Chinese character in simplified form for English Active-matrix organic light emitting diode, Chinese full name
It is active matrix organic light-emitting diode or active-matrix organic light emitting diode.Present AMOLED encapsulating structures generally encapsulate
Effect is limited.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of encapsulating structure of AMOLED devices, to solve present AMOLED
The usual packaging effect of encapsulating structure is limited.
In order to solve the above technical problems, the technical solution adopted by the present invention is：
A kind of encapsulating structure of AMOLED devices, including：Substrate, encapsulation cover plate, AMOLED devices, solid-state glued membrane, first
Inorganic protecting frame, the second inorganic protecting frame, frame glue and desiccant layer；
The AMOLED devices are arranged on the substrate, and the AMOLED devices include what is set gradually from the bottom to top
TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and cathode layer；
The solid-state glued membrane is arranged on the substrate and is covered in the AMOLED device exteriors, and the desiccant layer is set
The solid-state glued membrane periphery is placed in, the first inorganic protecting frame is arranged on the encapsulation cover plate and is located at the desiccant layer
Periphery, the second inorganic protecting frame are arranged on the substrate and are located at the described first inorganic protecting frame periphery, and described first
Frame glue is provided between inorganic protecting frame and the second inorganic protecting frame, the frame glue is bonded in the described first inorganic protecting frame
Between the second inorganic protecting frame；The encapsulation cover plate bonds with the solid-state glued membrane.
The encapsulation cover plate is glass plate or metallic plate.
Protective clear layer is covered with above the AMOLED devices, is set between the protective clear layer and the encapsulation cover plate
It is equipped with bearing rib.
Advantage for present invention is with effect：
A kind of encapsulating structure of AMOLED devices of the present invention, including：Substrate, encapsulation cover plate, AMOLED devices, solid-state glue
Film, the first inorganic protecting frame, the second inorganic protecting frame, frame glue and desiccant layer；AMOLED devices are arranged on substrate,
AMOLED devices include TFT layer, anode layer, cavitation layer, luminescent layer, electronic shell and the cathode layer set gradually from the bottom to top；Gu
State glued membrane is arranged on substrate and is covered in AMOLED device exteriors, and desiccant layer is arranged at solid-state glued membrane periphery, and first is inorganic
Protecting frame is arranged on encapsulation cover plate and positioned at desiccant layer periphery, and the second inorganic protecting frame is arranged on substrate and positioned at first
Inorganic protecting frame periphery, is provided with frame glue, frame glue is bonded in the first nothing between the first inorganic protecting frame and the second inorganic protecting frame
Between machine protecting frame and the second inorganic protecting frame；Encapsulation cover plate bonds with solid-state glued membrane；Simple in construction, packaging effect is good, can show
Write the service life for extending AMOLED devices.
Brief description of the drawings
The invention will be further described below in conjunction with the accompanying drawings：
Fig. 1 is a kind of sectional view of the encapsulating structure of AMOLED devices of the present invention.
Fig. 2 is the sectional view of the AMOLED devices in Fig. 1.
Embodiment
As depicted in figs. 1 and 2, the encapsulating structure of a kind of AMOLED devices of the invention, including：Substrate 1, encapsulation cover plate 2,
AMOLED devices 3, solid-state glued membrane 4, the first inorganic protecting frame 5, the second inorganic protecting frame 6, frame glue 7 and desiccant layer 8；It is described
AMOLED devices 3 are arranged on the substrate 1, and the AMOLED devices 3 include TFT layer 31, the sun set gradually from the bottom to top
Pole layer 32, cavitation layer 33, luminescent layer 34, electronic shell 35 and cathode layer 36；The solid-state glued membrane 4 is arranged on the substrate 1 simultaneously
It is covered in outside the AMOLED devices 3, the desiccant layer 8 is arranged at the periphery of solid-state glued membrane 4, the first inorganic guarantor
Shield frame 5 is arranged on the encapsulation cover plate 2 and is arranged at institute positioned at the periphery of desiccant layer 8, the second inorganic protecting frame 6
State on substrate 1 and positioned at the described first inorganic periphery of protecting frame 5, the first inorganic protecting frame 5 and the second inorganic protection
Be provided with frame glue 7 between frame 6, the frame glue 7 be bonded in the described first inorganic protecting frame 5 and the second inorganic protecting frame 6 it
Between；The encapsulation cover plate 2 bonds with the solid-state glued membrane 4.The encapsulation cover plate 2 is glass plate or metallic plate.It is described
The top of AMOLED devices 3 is covered with protective clear layer 10, and branch is provided between the protective clear layer 10 and the encapsulation cover plate 2
Support gusset 9.A kind of encapsulating structure of AMOLED devices of the present invention, encapsulation cover plate bond with solid-state glued membrane；It is simple in construction, encapsulation
Effect is good, can significantly extend the service life of AMOLED devices.
The present invention is not limited to above-described embodiment, and embodiment is exemplary, it is intended to for explaining the present invention, and can not
It is interpreted as limitation of the present invention.
Claims (3)
- A kind of 1. encapsulating structure of AMOLED devices, it is characterised in that including：Substrate (1), encapsulation cover plate (2), AMOLED devices (3), solid-state glued membrane (4), the first inorganic protecting frame (5), the second inorganic protecting frame (6), frame glue (7) and desiccant layer (8)；The AMOLED devices (3) are arranged on the substrate (1), and the AMOLED devices (3) include setting successively from the bottom to top TFT layer (31), anode layer (32), cavitation layer (33), luminescent layer (34), electronic shell (35) and the cathode layer (36) put；The solid-state glued membrane (4) is arranged on the substrate (1) and is covered in AMOLED devices (3) outside, the drying Oxidant layer (8) is arranged at solid-state glued membrane (4) periphery, and the first inorganic protecting frame (5) is arranged on the encapsulation cover plate (2) And positioned at the desiccant layer (8) periphery, the second inorganic protecting frame (6) is arranged on the substrate (1) and positioned at described First inorganic protecting frame (5) periphery, is provided between the first inorganic protecting frame (5) and the second inorganic protecting frame (6) Frame glue (7), the frame glue (7) are bonded between the described first inorganic protecting frame (5) and the second inorganic protecting frame (6)；Institute Encapsulation cover plate (2) is stated to bond with the solid-state glued membrane (4).
- A kind of 2. encapsulating structure of AMOLED devices according to claim 1, it is characterised in that the encapsulation cover plate (2) For glass plate or metallic plate.
- A kind of 3. encapsulating structure of AMOLED devices according to claim 1, it is characterised in that the AMOLED devices (3) top is covered with protective clear layer (10), and support is provided between the protective clear layer (10) and the encapsulation cover plate (2) Gusset (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710468002.7A CN107359270A (en) | 2017-06-20 | 2017-06-20 | A kind of encapsulating structure of AMOLED devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710468002.7A CN107359270A (en) | 2017-06-20 | 2017-06-20 | A kind of encapsulating structure of AMOLED devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107359270A true CN107359270A (en) | 2017-11-17 |
Family
ID=60272416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710468002.7A Pending CN107359270A (en) | 2017-06-20 | 2017-06-20 | A kind of encapsulating structure of AMOLED devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107359270A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172606A (en) * | 2018-01-08 | 2018-06-15 | 固安翌光科技有限公司 | A kind of ultra-thin OLED screen body and its manufacture craft |
| CN109817821A (en) * | 2019-01-03 | 2019-05-28 | 福建华佳彩有限公司 | A kind of UV glue encapsulating structure and its packaging method |
| WO2020248786A1 (en) * | 2019-06-14 | 2020-12-17 | 京东方科技集团股份有限公司 | Oled packaging structure and packaging method, and display apparatus |
| US11394003B2 (en) * | 2019-08-07 | 2022-07-19 | Boe Technology Group Co., Ltd. | Cover plate, display panel, display device and method for encapsulating display panel |
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| CN104505465A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED packaging structure and packaging method thereof |
| CN104617234A (en) * | 2015-02-13 | 2015-05-13 | 京东方科技集团股份有限公司 | Spacer, organic light emitting display panel, manufacturing method and display device |
| CN105576154A (en) * | 2007-11-30 | 2016-05-11 | 康宁股份有限公司 | Packages for elements |
-
2017
- 2017-06-20 CN CN201710468002.7A patent/CN107359270A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105576154A (en) * | 2007-11-30 | 2016-05-11 | 康宁股份有限公司 | Packages for elements |
| CN104505465A (en) * | 2014-12-04 | 2015-04-08 | 深圳市华星光电技术有限公司 | OLED packaging structure and packaging method thereof |
| CN104617234A (en) * | 2015-02-13 | 2015-05-13 | 京东方科技集团股份有限公司 | Spacer, organic light emitting display panel, manufacturing method and display device |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108172606A (en) * | 2018-01-08 | 2018-06-15 | 固安翌光科技有限公司 | A kind of ultra-thin OLED screen body and its manufacture craft |
| CN108172606B (en) * | 2018-01-08 | 2020-09-22 | 固安翌光科技有限公司 | Ultrathin OLED screen body and manufacturing process thereof |
| CN109817821A (en) * | 2019-01-03 | 2019-05-28 | 福建华佳彩有限公司 | A kind of UV glue encapsulating structure and its packaging method |
| WO2020248786A1 (en) * | 2019-06-14 | 2020-12-17 | 京东方科技集团股份有限公司 | Oled packaging structure and packaging method, and display apparatus |
| US20210351372A1 (en) * | 2019-06-14 | 2021-11-11 | Boe Technology Group Co., Ltd. | Oled packaging structure and packaging method, and display apparatus |
| US11793018B2 (en) * | 2019-06-14 | 2023-10-17 | Boe Technology Group Co., Ltd. | OLED packaging structure and packaging method, and display apparatus |
| US11394003B2 (en) * | 2019-08-07 | 2022-07-19 | Boe Technology Group Co., Ltd. | Cover plate, display panel, display device and method for encapsulating display panel |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20171117 |
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