KR20100056795A - A robot for transferring wafer - Google Patents

A robot for transferring wafer Download PDF

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Publication number
KR20100056795A
KR20100056795A KR1020080115772A KR20080115772A KR20100056795A KR 20100056795 A KR20100056795 A KR 20100056795A KR 1020080115772 A KR1020080115772 A KR 1020080115772A KR 20080115772 A KR20080115772 A KR 20080115772A KR 20100056795 A KR20100056795 A KR 20100056795A
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KR
South Korea
Prior art keywords
wafer
arm
transfer
actuator
arm member
Prior art date
Application number
KR1020080115772A
Other languages
Korean (ko)
Inventor
김진환
이선우
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080115772A priority Critical patent/KR20100056795A/en
Publication of KR20100056795A publication Critical patent/KR20100056795A/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
    • B25J9/0087—Dual arms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer transfer robot according to the present invention is provided to maximally load four wafers once by comprising a dual double arm. CONSTITUTION: A driving part(10) comprises an actuator(12). A first top arm(20) is installed by linkage in the actuator of the driving part. A second top arm is installed on the upper part of a driving part discrete from the first top arm. A first bottom arm is installed on the upper part of the driving part discrete from the second top arm. A second bottom arm is installed on the upper part of the driving part discrete from the first bottom arm.

Description

Wafer Transfer Robot {A Robot for Transferring Wafer}

The present invention relates to a wafer transfer robot, and more particularly, a wafer having four arms in a dual double method and simultaneously increasing the loading and unloading speed and amount of the wafer, thereby improving workability and productivity. It relates to a transfer robot.

In general, a semiconductor device is manufactured by depositing and patterning various materials on a wafer in a thin film form. To this end, various steps such as a deposition process, an etching process, a cleaning process, and a drying process are required. In each process, the wafer is mounted and processed in a process chamber that provides optimum conditions for the process.

In recent years, with the miniaturization and high integration of semiconductor devices, high precision, complexity, and large diameter of wafers are required, and in view of the improvement of throughput associated with the increase of complex processes and sheeting, A cluster type semiconductor manufacturing apparatus which can batch process a manufacturing process is attracting attention.

Generally, a cluster type semiconductor manufacturing apparatus consists of a process facility and an equipment front end module (EFEM) for carrying in and out of a wafer. The process equipment consists of a transfer chamber, a load lock chamber, and a plurality of process chambers, the load lock chamber and the process chambers being arranged around the transfer chamber.

On the other hand, in the trans chamber of the wafer processing apparatus configured as described above, as shown in Figure 1, the transfer robot 1 for transferring the substrate is installed. The transfer robot 1 has a drive unit 2 fixed to the trans chamber and a plurality of arms 3 operable in three dimensions. Each arm 3 includes a support member 4 rotatably connected to the drive unit 1 and rotatably up and down, and a first arm member 5 rotatably fixed to the support member 4. And a second arm member 6 rotatably fixed to an end of the first arm member 5, and also rotatably or rotatably fixed to an end of the second arm member 6 for loading a wafer. Or a blade 7 for unloading. Of course, the transfer robot 1 as described above may be configured in the form of a double arm by the arm is installed symmetrically.

According to such a configuration, each arm can be processed in such a manner that the wafer is loaded or unloaded into a predetermined chamber while operating up, down, left and right, and the wafer can be processed.

However, this conventional wafer transfer robot appeared to cause some problems. That is, since only two arms are provided in the transfer robot, there are limitations in the transfer and transfer of the wafer, and thus there is a problem in that the throughput and the yield of the wafer are reduced.

Accordingly, the problem to be solved by the present invention is to provide a wafer transfer robot that can increase the amount of transfer and transfer of wafers, and can load and load wafers in various ways, thereby improving throughput and productivity. will be.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A wafer transfer robot according to a preferred embodiment of the present invention for solving the above problems is a drive unit installed in the wafer processing apparatus and having an actuator; A first upper arm installed in association with an actuator of the drive unit and configured to transfer the wafer; A second upper arm installed on an upper portion of the driving part spaced apart from the first upper arm and configured to transfer a wafer; A first lower arm installed on an upper portion of the driving part spaced apart from the second upper arm and configured to transfer the wafer; And a second lower arm installed on an upper portion of the driving part spaced apart from the first lower arm and configured to transfer the wafer.

Other specific details of the invention are included in the detailed description and drawings.

According to the wafer transfer robot according to the present invention, a dual double arm can be loaded with up to four wafers at a time, thereby improving wafer transfer, transfer, loading and processing efficiency, as well as a wafer processing apparatus. The number of process chambers can be increased, so that the applicability is also improved.

Advantages and features of the present invention, and means or method for achieving the same will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout. In addition, "and / or" includes each and all combinations of one or more of the items mentioned.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. In addition, terms that are defined in a commonly used dictionary are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, with reference to the accompanying drawings, a chemical liquid supply apparatus for a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail.

2 is a perspective view showing a wafer transfer robot according to the present invention, Figure 3 is a state diagram showing a state in which the wafer transfer robot according to the present invention is installed in the wafer processing apparatus.

First, referring to FIG. 2, a wafer transfer robot according to a preferred embodiment of the present invention basically includes a driving unit 10 in which a driving motor or an actuator is embedded. The actuator 10 is provided with an actuator 12 for driving each of the arms described later. Since the structure of the driving unit 10 can be easily understood by those skilled in the art, a detailed description thereof will be omitted for clarity.

The first upper arm 20 is rotatably connected to an actuator built into the driving unit 10 at a proper position of the driving unit 10. The first upper arm 20 may be referred to as a left upper arm.

The first upper arm 20 is connected to the actuator 12 of the drive unit 10 and is provided with a rotating shaft 22 rotatably and vertically reciprocated by power generated therefrom, and one end thereof with the rotating shaft 22. A first arm member 24 rotatably fixed to the second arm member, a second arm member 26 also rotatably fixed to an end of the first arm member 24, and an end of the second arm member 26. It is rotatably or rotatably fixed to and articulated with a blade 28 for loading or unloading the wafer (W).

In this embodiment, the support 282 is configured at the end of the blade 28 of the first upper arm 20 so as to stably load or unload the wafer W.

The second upper arm 30 is provided on the other side of the driving unit 10, more specifically, the upper part of the driving unit 10 at a point spaced apart from the first upper arm 20 by a predetermined distance. The second upper arm 30 may be referred to as a right upper arm.

The second upper arm 30 is configured similarly to the first upper arm 20 described above, that is, connected to the actuator 12 of the drive unit 10 and can be rotated and reciprocated up and down by the power generated therefrom. A rotating shaft 32 which is installed to be secured, a first arm member 34 whose one end is rotatably fixed to the rotating shaft 32, and a second which is also rotatably fixed to an end of the first arm member 34. An arm member 36 and a blade 38 for rotatably or rotatably fixed to an end of the second arm member 36 and for loading or unloading the wafer W are articulated.

At the end of the blade 38 of the second upper arm 30, a support 382 for loading or unloading the wafer is formed.

The first lower arm 40 is installed at an appropriate position of the driving unit 10, more specifically, at an upper position of the driving unit 10 spaced apart from the first upper arm 20 by a predetermined distance. The first lower arm 40 may be referred to as the left lower arm,

The first lower arm 40 is also configured similarly to the above-described upper arms, that is, a rotary shaft connected to the actuator 12 of the driving unit 10 so as to be rotatable and vertically reciprocated by the power generated therefrom. (42), the first arm member (44) whose one end is rotatably fixed to the rotary shaft (42), and the second arm member (46) which is also rotatably fixed to the end of the first arm member (44). And a blade 48 rotatably or rotatably fixed to an end of the second arm member 46 and for loading or unloading the wafer W.

At the end of the blade 48 of the first lower arm 40, a support 482 for loading or unloading the wafer is formed.

In addition, a second lower arm 50 is installed at an appropriate position of the driving unit 10, more specifically, at an upper position of the driving unit 10 spaced apart from the first lower arm 20 by a predetermined distance. The second lower arm 50 may be referred to as the lower right arm.

The second lower arm 50 is also configured similarly to the above-described upper arms, that is, a rotary shaft connected to the actuator 12 of the drive unit 10 so as to be rotated and reciprocated up and down by power generated therefrom. 52, a first arm member 54 whose one end is rotatably fixed to the rotary shaft 52, and a second arm member 56 which is also rotatably fixed to an end of the first arm member 54. And a blade 58 rotatably or rotatably fixed to an end of the second arm member 56 and for loading or unloading the wafer W.

At the end of the blade 58 of the second lower arm 50, a support 582 for loading or unloading the wafer is formed.

Hereinafter, the transfer operation of the wafer using the transfer robot configured as described above and its operation mode will be described in detail.

As shown in FIG. 3, a transfer robot is installed in a wafer processing apparatus, and loading and unloading a wafer W between respective transfer chambers 60 and respective process chambers 70 installed in the processing apparatus. Or carry out a return.

At this time, the transfer robot is not only possible to move up and down (Pick / Place) by using two upper arms (20; 30) and two lower arms (40; 50) simultaneously, but also a single transfer.

That is, the loading or unloading of the wafer into the process chamber pairs 71, 72; 73, 74; 75, 76 of the process chambers 70 arranged in pairs in the transfer chamber 60 is simultaneously performed. Or it can be done individually.

Therefore, this, the loading amount and the speed for each chamber of the wafer is increased, the processing speed and the throughput of the wafer can be increased, and productivity and economy can be significantly improved.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a perspective view showing a conventional wafer transfer robot.

Figure 2 is a perspective view showing a wafer transfer robot according to the present invention.

3 is a plan view illustrating a state in which the wafer transfer robot of FIG. 2 is installed in a wafer processing apparatus.

<Description of the symbols for the main parts of the drawings>

10: drive unit 20: first upper arm

30: second upper arm 40: first lower arm

50: second lower arm

Claims (2)

In the wafer transfer robot installed in the wafer processing apparatus, A driving unit installed in the wafer processing apparatus and having an actuator; A first upper arm installed in association with an actuator of the driving unit and configured to transfer a wafer; A second upper arm installed on an upper portion of the driving part spaced apart from the first upper arm and configured to transfer a wafer; A first lower arm installed on an upper portion of the driving part spaced apart from the second upper arm and configured to transfer a wafer; And And a second lower arm installed on an upper portion of the driving part spaced apart from the first lower arm and configured to transfer a wafer. The method of claim 1, wherein each of the arms is A rotating shaft connected to the actuator of the driving unit so as to be rotated and reciprocated vertically, a first arm member whose one end is rotatably fixed to the rotating shaft, and a second rotatably fixed to an end of the first arm member. And an arm member and a blade rotatably fixed to an end of said second arm member, said blade for loading or unloading a wafer.
KR1020080115772A 2008-11-20 2008-11-20 A robot for transferring wafer KR20100056795A (en)

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KR1020080115772A KR20100056795A (en) 2008-11-20 2008-11-20 A robot for transferring wafer

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KR1020080115772A KR20100056795A (en) 2008-11-20 2008-11-20 A robot for transferring wafer

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569140A (en) * 2010-12-17 2012-07-11 北京北方微电子基地设备工艺研究中心有限责任公司 Vacuum manipulator and wafer treatment system
CN103325723A (en) * 2013-06-04 2013-09-25 中国电子科技集团公司第四十五研究所 Wafer transfer device for multi-chamber processing
KR20160063090A (en) 2014-11-26 2016-06-03 주식회사 원익아이피에스 Apparatus for transfering substrate and method for transfering the same
KR20160066824A (en) 2014-12-03 2016-06-13 주식회사 원익아이피에스 Method for transfering substrate
CN112768391A (en) * 2020-12-31 2021-05-07 上海至纯洁净系统科技股份有限公司 Mechanical clamping device is listened in wafer box linkage

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102569140A (en) * 2010-12-17 2012-07-11 北京北方微电子基地设备工艺研究中心有限责任公司 Vacuum manipulator and wafer treatment system
CN103325723A (en) * 2013-06-04 2013-09-25 中国电子科技集团公司第四十五研究所 Wafer transfer device for multi-chamber processing
KR20160063090A (en) 2014-11-26 2016-06-03 주식회사 원익아이피에스 Apparatus for transfering substrate and method for transfering the same
KR20160066824A (en) 2014-12-03 2016-06-13 주식회사 원익아이피에스 Method for transfering substrate
CN112768391A (en) * 2020-12-31 2021-05-07 上海至纯洁净系统科技股份有限公司 Mechanical clamping device is listened in wafer box linkage

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