KR20100058984A - A robot for transferring wafer - Google Patents

A robot for transferring wafer Download PDF

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Publication number
KR20100058984A
KR20100058984A KR1020080117589A KR20080117589A KR20100058984A KR 20100058984 A KR20100058984 A KR 20100058984A KR 1020080117589 A KR1020080117589 A KR 1020080117589A KR 20080117589 A KR20080117589 A KR 20080117589A KR 20100058984 A KR20100058984 A KR 20100058984A
Authority
KR
South Korea
Prior art keywords
wafer
arm
arm member
transfer robot
blade
Prior art date
Application number
KR1020080117589A
Other languages
Korean (ko)
Inventor
이선우
Original Assignee
세메스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세메스 주식회사 filed Critical 세메스 주식회사
Priority to KR1020080117589A priority Critical patent/KR20100058984A/en
Publication of KR20100058984A publication Critical patent/KR20100058984A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

PURPOSE: A wafer transfer robot is provided to completely prevent the error on determining a loading status of the wafer by installing only one wafer detecting apparatus near the wafer. CONSTITUTION: A driving part(10) comprises the actuator. A rotary shaft(22) is connected to the actuator of the driving part. A first arm member(24) is fixed to be rotatable on the rotary shaft. A second arm member(26) is fixed to be rotatable on the end part of the first arm member. An arm(20) is fixed to be rotatable on the end of the second arm member. A wafer sensing apparatus(30) detects the loading status of the wafer.

Description

Wafer Transfer Robot {A Robot for Transferring Wafer}

The present invention relates to a wafer transfer robot, and more particularly, by installing a sensing device on a blade on which a wafer is loaded, it is always possible to accurately determine whether a wafer is loaded, and only a single sensing device is required to reduce costs. The present invention relates to a wafer transfer robot.

In general, a semiconductor device is manufactured by depositing and patterning various materials on a wafer in a thin film form. To this end, various steps such as a deposition process, an etching process, a cleaning process, and a drying process are required. In each process, the wafer is mounted and processed in a process chamber that provides optimum conditions for the process.

In recent years, with the miniaturization and high integration of semiconductor devices, high precision, complexity, and large diameter of wafers are required, and in view of the improvement of throughput associated with the increase of complex processes and sheeting, A cluster type semiconductor manufacturing apparatus which can batch process a manufacturing process is attracting attention.

Generally, a cluster type semiconductor manufacturing apparatus consists of a process facility and an equipment front end module (EFEM) for carrying in and out of a wafer. The process equipment consists of a transfer chamber, a load lock chamber, and a plurality of process chambers, the load lock chamber and the process chambers being arranged around the transfer chamber.

Meanwhile, as illustrated in FIG. 1, a transfer robot 1 for transferring a substrate is installed in the trans chamber of the wafer processing apparatus configured as described above. The transfer robot 1 has a drive unit 2 fixed to the trans chamber and a plurality of arms 3 operable in three dimensions. Each arm 3 includes a support member 4 rotatably connected to the drive unit 1 and rotatably up and down, and a first arm member 5 rotatably fixed to the support member 4. And a second arm member 6 rotatably fixed to an end of the first arm member 5, and also rotatably or rotatably fixed to an end of the second arm member 6 for loading a wafer. Or a blade 7 for unloading. Of course, the transfer robot 1 as described above may be configured in the form of a double arm arm is installed symmetrically.

According to such a configuration, each arm can be processed in such a manner that the wafer is loaded or unloaded into a predetermined chamber while operating up, down, left and right, and the wafer can be processed.

On the other hand, whether the wafer (W) is loaded on the blade of the transfer robot is installed by the sensor (S) in the upper or lower structure of the processing apparatus or chamber in which the transfer robot is installed to identify whether the wafer is loaded.

However, in order to detect whether the wafer is loaded on the blade of the transfer robot, a hole must be installed in the structure corresponding to that direction in each transfer direction of the transfer robot, and then a sensor must be installed in the hole. If the structure of the device is changed, the number and cost of the sensor may be increased because the sensor must be re-machined to install the sensor. In addition, there are cases where it is impossible to accurately detect whether a wafer is loaded despite the installation of a plurality of such sensors.

The problem to be solved by the present invention is to provide a wafer transfer robot that can easily and accurately detect whether the wafer is loaded.

In addition, another object of the present invention is to provide a wafer transfer robot that can reduce the cost by installing only one detection device in the transfer robot itself.

Problems to be solved by the present invention are not limited to the above-mentioned problems, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

A wafer transfer robot according to a preferred embodiment of the present invention for solving the above problems, the drive unit is installed in the wafer processing apparatus having an actuator; A rotating shaft connected to the actuator of the driving unit so as to rotate and reciprocate vertically, a first arm member whose one end is rotatably fixed to the rotating shaft, and a second arm rotatably fixed to an end of the first arm member. An arm, the arm rotatably fixed to an end of the second arm member, the arm comprising a blade for loading or unloading a wafer; And a wafer sensing device installed on the blade to detect whether the wafer is loaded on the blade of the arm.

Other specific details of the invention are included in the detailed description and drawings.

According to the wafer transfer robot according to the present invention, it is possible to easily and accurately detect whether the wafer is loaded by installing a wafer loading detection device in the transfer robot itself, and by installing only one wafer detection device at a position close to the wafer, It is possible to reduce the cost, and to completely prevent errors in the determination of wafer loading.

Advantages and features of the present invention, and means or method for achieving the same will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention, and the general knowledge in the art to which the present invention pertains. It is provided to fully convey the scope of the invention to those skilled in the art, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout. In addition, "and / or" includes each and all combinations of one or more of the items mentioned.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprises” and / or “comprising” refers to the presence of one or more other components, steps, operations and / or elements. Or does not exclude additions.

Unless otherwise defined, all terms used in the present specification (including technical and scientific terms) may be used in a sense that can be commonly understood by those skilled in the art. In addition, the terms defined in the commonly used dictionaries are not ideally or excessively interpreted unless they are specifically defined clearly.

Hereinafter, with reference to the accompanying drawings, a chemical liquid supply apparatus for a substrate processing apparatus according to a preferred embodiment of the present invention will be described in detail.

Figure 2 is a perspective view showing a wafer transfer robot according to the invention, Figure 3 is a longitudinal sectional view of the arm of the wafer transfer robot according to the invention, Figure 4 is a plan view of the transfer robot of FIG.

2 to 4, the wafer transfer robot according to the preferred embodiment of the present invention basically includes a driving unit 10 installed in the wafer processing apparatus. The actuator 10 is provided with an actuator 12 for driving each of the arms described later. Since the structure of the driving unit 10 can be easily understood by those skilled in the art, a detailed description thereof will be omitted for clarity.

The drive unit 10 has an arm 20 connected to an actuator built in the drive unit 10 and configured to load the weniper W into each process chamber (not shown) or processing chamber (not shown). This is installed. In the present embodiment, the transfer robot is illustrated as having two arms, but it will be understood by those skilled in the art that the arm may be installed one or more than two.

The arm 20 is connected to the actuator 12 of the drive unit 10, the rotary shaft 22 is installed so as to rotate and reciprocate up and down by the power generated therefrom, and one end is rotated to the rotary shaft 22 On the first arm member 24, which is securely fixed, on the end of the second arm member 26, which is also rotatably fixed to the end of the first arm member 24, and on the end of the second arm member 26. It is rotatably or rotatably fixed and articulately comprises a blade 28 for loading or unloading the wafer W.

In this embodiment, the blade 28 of the arm 20 is formed integrally with the body portion 282 and the body portion 282 that is rotatably fixed to the end of the second arm member 26, and actually the wafer It is integrally provided with a support 284 formed to be seated. Here, the boundary between the body portion 282 and the support portion 284 is preferably formed in a step shape for stable support of the wafer (W).

In particular, the wafer transfer robot according to the present invention is provided with a wafer sensing device 30 capable of detecting whether or not the wafer is actually loaded on the arm 20. The wafer sensing device 30 is preferably formed of a proximity sensor.

In more detail, it is preferable that the wafer W is constituted at the blade 28 to be loaded, which constitutes the most tip of the arm 20 and is actually loaded.

In particular, the wafer sensing device 30 provides a support portion 284 at the boundary between the body portion 282 of the blade 28 and the support portion 284 on which the wafer is actually loaded, and more particularly at the boundary end thereof. It is preferable to be installed toward.

As such, the wafer sensing device 30 is installed at the boundary between the body portion 282 and the support portion 284 of the blade 28, so that even if each component of the arm 20 is articulated, the wafer can be accurately and without error. It can detect whether or not (W) is loaded.

Hereinafter, the operation of the wafer transfer robot configured as described above and its operation mode will be described in detail.

As shown in FIG. 3, a transfer robot is installed in the wafer processing apparatus, and the wafer W is loaded and unloaded between the transfer chambers (not shown) and the respective process chambers (not shown) installed in the processing apparatus. Or carry out a return.

At this time, the wafer 28 is loaded on the blade 28 of the arm 20 of the transfer robot and transferred to a set chamber among the chambers, and the first arm member constituting the arm 20 for such transfer ( 24, the second arm member 26 and the blade 28 are jointed to each other.

In particular, during any movement or movement of the arm 20, the wafer sensing device 30 can accurately detect whether or not the wafer W is loaded on the support 284 of the blade 28 at a position proximate the wafer W. It can be.

Therefore, it is possible to detect whether or not the wafer is loaded simply and accurately by using one wafer sensing device.

Although embodiments of the present invention have been described above with reference to the accompanying drawings, those skilled in the art to which the present invention pertains may implement the present invention in other specific forms without changing the technical spirit or essential features thereof. You will understand that. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

1 is a perspective view showing a conventional wafer transfer robot.

Figure 2 is a perspective view showing a wafer transfer robot according to the present invention.

3 is a longitudinal sectional view of the blade of the arm of the wafer transfer robot of FIG.

4 is an enlarged plan view of the blade of the arm of the wafer transfer robot of FIG.

Explanation of symbols on main parts of drawing

10: drive unit 20: arm

30: wafer detection device

Claims (2)

In the wafer transfer robot installed in the wafer processing apparatus, A driving unit installed in the wafer processing apparatus and having an actuator; A rotating shaft connected to the actuator of the driving unit so as to be rotated and reciprocated vertically, a first arm member whose one end is rotatably fixed to the rotating shaft, and a second rotatably fixed to an end of the first arm member. An arm comprising a arm member and a blade rotatably fixed to an end of the second arm member, the blade for loading or unloading a wafer; And And a wafer sensing device installed on the blade to detect whether the wafer is loaded on the blade of the arm. The method of claim 1, The blade comprises a body portion rotatably fixed to an end of the second arm member, and a support portion integrally formed with the body portion so that the wafer can be seated; The wafer sensing device is a wafer transfer robot which is formed by a sensing device installed toward the support at a short boundary formed between the body and the support.
KR1020080117589A 2008-11-25 2008-11-25 A robot for transferring wafer KR20100058984A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080117589A KR20100058984A (en) 2008-11-25 2008-11-25 A robot for transferring wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080117589A KR20100058984A (en) 2008-11-25 2008-11-25 A robot for transferring wafer

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KR20100058984A true KR20100058984A (en) 2010-06-04

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022000915A (en) * 2011-03-11 2022-01-04 ブルックス オートメーション インコーポレイテッド Substrate processing tool

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022000915A (en) * 2011-03-11 2022-01-04 ブルックス オートメーション インコーポレイテッド Substrate processing tool
US11978649B2 (en) 2011-03-11 2024-05-07 Brooks Automation Us, Llc Substrate processing apparatus

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