CN112768391A - Mechanical clamping device is listened in wafer box linkage - Google Patents
Mechanical clamping device is listened in wafer box linkage Download PDFInfo
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- CN112768391A CN112768391A CN202011636137.8A CN202011636137A CN112768391A CN 112768391 A CN112768391 A CN 112768391A CN 202011636137 A CN202011636137 A CN 202011636137A CN 112768391 A CN112768391 A CN 112768391A
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- arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0052—Gripping heads and other end effectors multiple gripper units or multiple end effectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/0084—Programme-controlled manipulators comprising a plurality of manipulators
- B25J9/0087—Dual arms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The invention discloses a mechanical clamping device for linkage detection of a wafer box, which comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack; the transverse moving mechanism comprises a rotating cylinder, a driving gear and a driven gear, the rotating cylinder is mounted on the rack, the output end of the rotating cylinder is connected with the driving gear, the driving gear is connected with the driven gear through a conveyor belt, each process area of the wafer cleaning equipment is connected through a rack, and the driven gear is meshed with the rack; the lifting mechanism comprises a lifting cylinder, the lifting cylinder is installed on the rack, and the output end of the lifting mechanism is connected with the clamping mechanism. The wafer clamping device is provided with the symmetrical U-shaped clamping hands, the clamping hands are driven by the driving mechanism to open and close, the opening and closing distance of the clamping hands is correspondingly adjusted according to the sizes of different wafer boxes, and the integrity and the stability of the clamping actions are guaranteed.
Description
Technical Field
The invention belongs to the technical field of semiconductor production equipment, and particularly relates to a mechanical clamping device for linkage detection of a wafer box.
Background
In the configuration of semiconductor wet process equipment, a complete process path is required to be established, which includes a wafer bearing area, a wafer cleaning process area, a wafer drying process area and a wafer unloading area, and the wafer transfer is required to be realized in the complete process cleaning process, and the wafer transfer is required to be performed through a well-planned mechanical arm device or a wafer box for loading the wafer. The wafer is required to be combined with various devices and accessories in the transfer process, and the wafer is arranged on the wet process equipment, so that various undesirable phenomena such as stress concentration, vibration, shaking, deviation and deflection can be generated due to the vibration of the wet process equipment in the transfer process, and the wafer can be broken due to unexpected adverse effects on the wafer, so that the wafer product can be monitored in position by establishing the high-stability clamping hand device for clamping on the mechanical arm device module, and the wafer product transfer device has important significance.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a mechanical clamping device for linkage detection of a wafer box, which can realize the movement among process areas, ensure the smooth loading and unloading of wafers in the periodic transfer process of the wafers and avoid the damage of the surfaces of the wafers caused by unexpected movement.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides a mechanical clamping device for linkage detection of a wafer box, which comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack;
the transverse moving mechanism comprises a rotating cylinder, a driving gear and a driven gear, the rotating cylinder is mounted on the rack, the output end of the rotating cylinder is connected with the driving gear, the driving gear is connected with the driven gear through a conveyor belt, each process area of the wafer cleaning equipment is connected through a rack, and the driven gear is meshed with the rack;
the lifting mechanism comprises a lifting cylinder, the lifting cylinder is arranged on the rack, and the output end of the lifting mechanism is connected with the clamping mechanism;
the clamping mechanism comprises a first clamping hand, a second clamping hand, a first clamping arm, a second clamping arm, an installation base, a cylinder installation base, a driving cylinder and a driving mechanism, the driving mechanism is installed on the installation base, the installation base is installed at the output end of the lifting cylinder, the driving cylinder is installed on the cylinder installation base, the first clamping hand is installed at one end of the first clamping arm, and the second clamping hand is installed at one end of the second clamping arm;
the driving mechanism comprises a first driving arm, a second driving arm, a first moving arm, a second moving arm, a first driving block, a second driving block, a first rotating block, a second rotating block, a first limiting block, a second limiting block and a limiting spring, one end of the first driving arm and one end of the second driving arm are respectively connected with the output end of the driving cylinder, the other ends of the first driving arm and the second driving arm are in an elliptical cone shape, one end of the first moving arm is connected with the other end of the first clamping arm, one end of the second moving arm is connected with the other end of the second clamping arm, the first rotating block is installed at the other end of the first moving arm, the second rotating block is installed at the other end of the second moving arm, the first driving block is installed on the first rotating block, and the second driving block is installed on the second rotating block, the other end of the first driving arm is located below the first driving block and is in contact with the first driving block, the other end of the second driving arm is located below the second driving block and is in contact with the second driving block, the first limiting block is installed on the first rotating block, the second limiting block is installed on the second rotating block, the limiting spring is connected with the first limiting block and the second limiting block, and the limiting spring is located below the first driving arm and the second driving arm.
As a preferred technical scheme, a first proximity switch is installed on the first rotating block, a second proximity switch is installed on the second rotating block, a first inductor is arranged below the first proximity switch, and a second inductor is arranged below the second proximity switch.
As a preferable technical solution, the first rotating block is provided coaxially with the first moving arm, and the second rotating block is provided coaxially with the second moving arm.
Preferably, the first rotation block and the shaft are attached to an end of the first moving arm, and the second rotation block is attached to an end of the second moving arm.
According to the preferable technical scheme, the first clamping glove is arranged at one end of the first clamping arm, and the second clamping glove is arranged at one end of the second clamping arm.
As a preferable technical solution, the movement angle of the first rotation block and the second rotation block is 1 to 3 degrees, and the relative movement distance of the first clamping arm and the second clamping arm is 16 to 25 mm.
According to the preferable technical scheme, the clamping device further comprises a fixed seat, the fixed seat and the air cylinder installation seat are of an integrated structure, a limiting groove is formed in the fixed seat, the first clamping arm is connected with the first moving arm through a first connecting external member, the second clamping arm is connected with the second moving arm through a second connecting external member, and the first connecting external member and the second connecting external member are arranged in the limiting groove and can move left and right in the limiting groove.
Preferably, the first and second rotating blocks have an octagonal transverse cross section.
Compared with the prior art, the invention has the beneficial effects that:
(1) the wafer clamping device is provided with the symmetrical U-shaped clamping hands, the U-shaped clamping hands are driven by the driving mechanism to open and close, the wafer boxes are clamped, the opening and closing distances of the clamping hands are correspondingly adjusted according to the sizes of different wafer boxes, and the integrity and the stability of the clamping actions are guaranteed.
(2) The driving mechanism realizes the accurate opening and closing control of the clamping arm through the linkage of the driving arm, the driving block, the rotating block and the limiting block, only one driving cylinder needs to be controlled, the space occupied by the driving mechanism is greatly reduced, and the smooth operation of loading and unloading the wafers is met.
(3) According to the invention, through the limiting spring, the reset process of the clamping arm is realized, the use of a power device is reduced, the stability of the action process is ensured, and the clamping efficiency of the wafer is improved.
(3) The wafer box clamping device has the advantages that the transverse moving mechanism is arranged, so that the transfer of the mechanical arm among different process areas is realized, the lifting mechanism is arranged, the clamping mechanism is driven to move up and down, and the effective clamping of the wafer box is realized.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer cassette linkage detection mechanical clamping device according to the present invention.
FIG. 2 is a second schematic structural diagram of the wafer cassette linkage detection mechanical clamping device of the present invention.
FIG. 3 is a partially enlarged view of the linkage detecting mechanical clamping device for wafer cassettes according to the present invention.
FIG. 4 is a second enlarged view of the linkage detecting mechanical clamping device for wafer cassettes according to the present invention.
FIG. 5 is a third enlarged view of a third embodiment of the apparatus for detecting the linkage of the wafer cassette.
Wherein the reference numerals are as follows: the clamping device comprises a first clamping arm 1, a second clamping arm 2, a first clamping hand 3, a second clamping hand 4, a first moving arm 5, a second moving arm 6, a mounting base 7, a cylinder mounting seat 8, a driving cylinder 9, a first driving arm 10, a second driving arm 11, a first rotating block 12, a second rotating block 13, a first driving block 14, a second driving block 15, a first limiting block 16, a second limiting block 17, a limiting spring 18, a first proximity switch 19, a second proximity switch 20, a first inductor 21, a second inductor 22, a fixing seat 23, a rotating cylinder 24, a driving gear 25, a driven gear 26 and a lifting cylinder 27.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive effort based on the embodiments of the present invention, are within the scope of the present invention.
In the description of the present invention, it is to be understood that the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
The embodiment provides a mechanical clamping device for linkage detection of a wafer cassette, which is used for clamping and transferring the wafer cassette. The mechanical clamping device for linkage detection of the wafer box comprises a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack.
The transverse moving mechanism comprises a rotary cylinder 24, a driving gear 25 and a driven gear 26, wherein the rotary cylinder 24 is installed on the rack, the output end of the rotary cylinder 24 is connected with the driving gear 25, the driving gear 25 is connected with the driven gear 26 through a conveyor belt, all process areas of the wafer cleaning equipment are connected through a rack, and the driven gear 26 is meshed with the rack.
The lifting mechanism comprises a lifting cylinder 27, the lifting cylinder 27 is installed on the rack, and the output end of the lifting mechanism 27 is connected with the clamping mechanism.
The clamping mechanism comprises a first clamping hand 3, a second clamping hand 4, a first clamping arm 1, a second clamping arm 2, a mounting base 7, a cylinder mounting base 8, a fixing base 23, a driving cylinder 9 and a driving mechanism. The first clamping hand 3 and the second clamping hand 4 are symmetrically arranged in a U-shaped structure and can be clamped at the edge positions of two sides of the wafer box, so that the wafer box can be clamped. The first clamping hand 3 is arranged at one end of the first clamping arm 1, the second clamping hand 4 is arranged at one end of the second clamping arm 2, and the first clamping hand 3 and the second clamping hand 4 are driven to open and close through the movement of the first clamping arm 1 and the second clamping arm 2. More preferably, the first clamping arm 3 is sleeved at one end of the first clamping arm 1, the second clamping arm 4 is sleeved at one end of the second clamping arm 2, and the first clamping arm 3 and the second clamping arm 4 can be opened and closed only along with the first clamping arm 1 and the second clamping arm 2 without rotating in a sleeved installation mode.
The driving mechanism is installed on the installation base 7, the installation base 7 is installed at the output end of the lifting cylinder 27, the driving cylinder 9 is installed on the cylinder installation base 8, the driving mechanism comprises a first driving arm 10, a second driving arm 11, a first moving arm 5, a second moving arm 6, a first driving block 14, a second driving block 15, a first rotating block 12, a second rotating block 13, a first limiting block 16, a second limiting block 17, a limiting spring 18, a first proximity switch 19, a second proximity switch 20, a first inductor 21 and a second inductor 22, wherein one end of the first driving arm 10 and one end of the second driving arm 11 are respectively connected with the output end of the driving cylinder 9 and extend out or retract under the action of the driving cylinder 9, the other ends of the first driving arm 10 and the second driving arm 11 are in an elliptical cone shape, the radius of the two ends changes along the length direction, one end of the first moving arm 5 is connected with the other end of the first clamping arm 1, one end of the second moving arm 6 is connected with the other end of the second clamping arm 2, the first rotating block 12 is axially installed at the other end of the first moving arm 5, the second rotating block 13 is axially installed at the other end of the second moving arm 6, the first rotating block 12 and the first moving arm 5 are coaxially arranged, and the second rotating block 13 and the second moving arm 6 are coaxially arranged. The first and second rotating blocks 12 and 13 have octagonal transverse cross sections. The first driving block 14 is mounted on a side of the first rotating block 12 facing the second rotating block 13, and the second driving block 15 is mounted on a side of the second rotating block 13 facing the first rotating block 12. The other end of the first driving arm 10 is positioned below the first driving block 14 and is always in contact with the first driving block 14; the other end of the second drive arm 11 is located below the second drive block 15 and always abuts against the second drive block 15. The first limiting block 16 is mounted on the first rotating block 12, the second limiting block 17 is mounted on the second rotating block 13, the limiting spring 18 is connected with the first limiting block 16 and the second limiting block 17, the limiting spring 18 is located below the first driving arm 10 and the second driving arm 11, the limiting spring 18 is used for ensuring that the first driving arm 10 and the first driving block 14 are always in a contact state, and the second driving arm 11 and the second driving block 15 are always in a contact state. The first rotating block 12 is provided with a first proximity switch 19, the second rotating block 13 is provided with a second proximity switch 20, a first inductor 21 is arranged below the first proximity switch 19, and a second inductor 22 is arranged below the second proximity switch 20. The movement angle of the first rotating block 12 and the second rotating block 13 is 1-3 degrees, and the relative movement distance of the first clamping arm 1 and the second clamping arm 2 is 16-25 mm. Fixing base 23 and 8 formula structures as an organic whole of cylinder mount pad, seted up the spacing groove on the fixing base 23, first centre gripping arm 1 is connected through first connecting external member with first moving arm 5, and second centre gripping arm 2 is connected through second connecting external member with second moving arm 6, and first connecting external member, second connecting external member set up in the spacing inslot and can control about the spacing inslot.
The working process is as follows:
in an initial state, the driving cylinder 9 is in a retraction state, the first clamping arm 1 and the second clamping arm 2 are in a close state, when a wafer box needs to be clamped, the driving cylinder 9 acts to push the first driving arm 10 and the second driving arm 11, the first driving arm 10 and the second driving arm 11 push the first driving block 14 and the second driving block 15, the first driving block 14 and the second driving block 15 drive the first rotating block 12 and the second rotating block 13 to rotate, the first rotating block 12 and the second rotating block 13 rotate to drive the first limiting block 16 and the second limiting block 17 to be far away, so that the first moving arm 5 and the second moving arm 6 are driven to be far away, and the first moving arm 5 and the second moving arm 6 drive the first clamping arm 1 and the second clamping arm 2 to be opened. When the first clamping arm 1 and the second clamping arm 2 need to be folded, the driving cylinder 9 retracts, and the first rotating block 12 and the second rotating block 13 reset under the action of the limiting spring 18.
When the wafer box needs to be clamped, the first clamping arm 1 and the second clamping arm 2 are opened, the lifting cylinder 27 controls the clamping mechanism to move downwards, so that the first clamping hand 3 and the second clamping hand 4 reach the clamping position, the first clamping hand 3 and the second clamping hand 4 are closed to clamp the wafer box, and then the lifting cylinder 23 drives the clamping mechanism to move upwards and move among the process areas under the drive of the transverse moving mechanism.
Although the present invention has been described in detail with respect to the above embodiments, it will be understood by those skilled in the art that modifications or improvements based on the disclosure of the present invention may be made without departing from the spirit and scope of the invention, and these modifications and improvements are within the spirit and scope of the invention.
Claims (8)
1. A mechanical clamping device for linkage detection of a wafer cassette is characterized by comprising a transverse moving mechanism, a lifting mechanism, a clamping mechanism and a rack, wherein the transverse moving mechanism and the lifting mechanism are both arranged on the rack;
the transverse moving mechanism comprises a rotating cylinder, a driving gear and a driven gear, the rotating cylinder is mounted on the rack, the output end of the rotating cylinder is connected with the driving gear, the driving gear is connected with the driven gear through a conveyor belt, each process area of the wafer cleaning equipment is connected through a rack, and the driven gear is meshed with the rack;
the lifting mechanism comprises a lifting cylinder, the lifting cylinder is arranged on the rack, and the output end of the lifting mechanism is connected with the clamping mechanism;
the clamping mechanism comprises a first clamping hand, a second clamping hand, a first clamping arm, a second clamping arm, an installation base, a cylinder installation base, a driving cylinder and a driving mechanism, the driving mechanism is installed on the installation base, the installation base is installed at the output end of the lifting cylinder, the driving cylinder is installed on the cylinder installation base, the first clamping hand is installed at one end of the first clamping arm, and the second clamping hand is installed at one end of the second clamping arm;
the driving mechanism comprises a first driving arm, a second driving arm, a first moving arm, a second moving arm, a first driving block, a second driving block, a first rotating block, a second rotating block, a first limiting block, a second limiting block and a limiting spring, one end of the first driving arm and one end of the second driving arm are respectively connected with the output end of the driving cylinder, the other ends of the first driving arm and the second driving arm are in an elliptical cone shape, one end of the first moving arm is connected with the other end of the first clamping arm, one end of the second moving arm is connected with the other end of the second clamping arm, the first rotating block is installed at the other end of the first moving arm, the second rotating block is installed at the other end of the second moving arm, the first driving block is installed on the first rotating block, and the second driving block is installed on the second rotating block, the other end of the first driving arm is located below the first driving block and is in contact with the first driving block, the other end of the second driving arm is located below the second driving block and is in contact with the second driving block, the first limiting block is installed on the first rotating block, the second limiting block is installed on the second rotating block, the limiting spring is connected with the first limiting block and the second limiting block, and the limiting spring is located below the first driving arm and the second driving arm.
2. The apparatus as claimed in claim 1, wherein the first rotating block is provided with a first proximity switch, the second rotating block is provided with a second proximity switch, a first sensor is disposed below the first proximity switch, and a second sensor is disposed below the second proximity switch.
3. The apparatus as claimed in claim 1, wherein the first rotating block is disposed coaxially with the first moving arm, and the second rotating block is disposed coaxially with the second moving arm.
4. The apparatus as claimed in claim 3, wherein the first rotary block and the shaft are mounted on an end of the first moving arm, and the second rotary block is mounted on an end of the second moving arm.
5. The apparatus as claimed in claim 1, wherein the first clamping glove is disposed at one end of the first clamping arm, and the second clamping glove is disposed at one end of the second clamping arm.
6. The apparatus as claimed in claim 1, wherein the first and second rotary blocks are moved at an angle of 1-3 degrees, and the first and second clamp arms are moved at a distance of 16-25 mm relative to each other.
7. The mechanical clamping device for linkage detection of a wafer cassette of claim 1, further comprising a fixing base, wherein the fixing base and the cylinder mounting base are of an integral structure, the fixing base is provided with a limiting groove, the first clamping arm is connected with the first moving arm through a first connecting sleeve, the second clamping arm is connected with the second moving arm through a second connecting sleeve, and the first connecting sleeve and the second connecting sleeve are disposed in the limiting groove and can move left and right in the limiting groove.
8. The apparatus as claimed in claim 1, wherein the first and second rotating blocks have an octagonal cross-section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636137.8A CN112768391B (en) | 2020-12-31 | 2020-12-31 | Mechanical clamping device is listened in wafer box linkage |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011636137.8A CN112768391B (en) | 2020-12-31 | 2020-12-31 | Mechanical clamping device is listened in wafer box linkage |
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| CN112768391A true CN112768391A (en) | 2021-05-07 |
| CN112768391B CN112768391B (en) | 2022-12-20 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113910273A (en) * | 2021-10-25 | 2022-01-11 | 苏州灵猴机器人有限公司 | Terminal protective structure of robot and robot |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234395A (en) * | 2003-01-31 | 2003-08-22 | Dainippon Screen Mfg Co Ltd | Method and apparatus for detecting substrate, and substrate handling |
| KR20100056795A (en) * | 2008-11-20 | 2010-05-28 | 세메스 주식회사 | A robot for transferring wafer |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN110931407A (en) * | 2019-11-20 | 2020-03-27 | 上海至纯洁净系统科技股份有限公司 | Lifting module for holding wafer box |
| CN110993547A (en) * | 2019-11-12 | 2020-04-10 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN210339565U (en) * | 2019-07-02 | 2020-04-17 | 库卡机器人制造（上海）有限公司 | Automatic guide transport vechicle, robot and clamping device thereof |
| CN111244022A (en) * | 2020-01-22 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Wafer box clamping device and wafer cleaning machine |
| CN111312639A (en) * | 2020-02-27 | 2020-06-19 | 至微半导体(上海)有限公司 | Mechanical arm device and method for reducing shaking and vibration of mechanical arm device |
| CN211879336U (en) * | 2020-01-08 | 2020-11-06 | 江苏启微半导体设备有限公司 | Wafer conveying device of BOE wet processing equipment |
| CN111941415A (en) * | 2020-08-07 | 2020-11-17 | 江苏昱博自动化设备有限公司 | Clamping type clamp for power-assisted manipulator |
-
2020
- 2020-12-31 CN CN202011636137.8A patent/CN112768391B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003234395A (en) * | 2003-01-31 | 2003-08-22 | Dainippon Screen Mfg Co Ltd | Method and apparatus for detecting substrate, and substrate handling |
| KR20100056795A (en) * | 2008-11-20 | 2010-05-28 | 세메스 주식회사 | A robot for transferring wafer |
| CN110155721A (en) * | 2019-06-06 | 2019-08-23 | 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） | Transmission machine arm |
| CN210339565U (en) * | 2019-07-02 | 2020-04-17 | 库卡机器人制造（上海）有限公司 | Automatic guide transport vechicle, robot and clamping device thereof |
| CN110993547A (en) * | 2019-11-12 | 2020-04-10 | 至微半导体(上海)有限公司 | Wafer basket changing device |
| CN110931407A (en) * | 2019-11-20 | 2020-03-27 | 上海至纯洁净系统科技股份有限公司 | Lifting module for holding wafer box |
| CN211879336U (en) * | 2020-01-08 | 2020-11-06 | 江苏启微半导体设备有限公司 | Wafer conveying device of BOE wet processing equipment |
| CN111244022A (en) * | 2020-01-22 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Wafer box clamping device and wafer cleaning machine |
| CN111312639A (en) * | 2020-02-27 | 2020-06-19 | 至微半导体(上海)有限公司 | Mechanical arm device and method for reducing shaking and vibration of mechanical arm device |
| CN111941415A (en) * | 2020-08-07 | 2020-11-17 | 江苏昱博自动化设备有限公司 | Clamping type clamp for power-assisted manipulator |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113910273A (en) * | 2021-10-25 | 2022-01-11 | 苏州灵猴机器人有限公司 | Terminal protective structure of robot and robot |
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