KR20100052805A - Organic light emitting display device - Google Patents

Abstract

PURPOSE: An organic electroluminescent display device is provided to prevent particles like a floating matter from adhering or depositing in a partition wall when an organic light emitting layer and an upper electrode is deposited on a lower electrode by changing a structure of a partition wall. CONSTITUTION: A partition wall(125) is formed into a reverse tapered shape which has a broad upper area than a lower area. The partition wall comprises a depressed first patterned part(P1) and a second patterned part(P2) in order to isolate the inside of a center region. The second patterned part is patterned in order to expose a part of a base part(123a) located in the lower part of the partition wall. The partition wall has the shape classified into a first partition wall(125a) and a second partition wall(125b). A width formed by the first patterned part is larger than the width formed by the second patterned part.

Description

Organic Light Emitting Display Device

The present invention relates to an organic light emitting display device.

An organic light emitting display device used in an organic light emitting display device is a self-light emitting device having a light emitting layer formed between two electrodes positioned on a substrate.

The organic light emitting display includes a top emission type, a bottom emission type, or a dual emission type according to a direction in which light is emitted. According to the driving method, it is divided into a passive matrix type and an active matrix type.

When the scan signal, the data signal, and the power are supplied to the plurality of subpixels arranged in a matrix form, the organic light emitting display device may display an image by emitting light of the selected subpixel.

Meanwhile, some of the conventional organic light emitting display devices have a structure in which a transistor and an organic light emitting diode are formed on a first substrate and a second substrate, and the first substrate and the second substrate are adhesively sealed with an adhesive member. This structure uses spacers for electrical connection between the transistor formed on the first substrate and the organic light emitting diode located on the second substrate. In the region adjacent to the spacer, a partition wall is used so that electrodes formed on the organic emission layer may be separately formed for each subpixel. On the other hand, in the conventional organic light emitting display device having such a structure, when forming an electrode on the organic light emitting layer, microparticles such as floating foreign matters are adhered or deposited on the partition wall, causing short or light emitting defects between adjacent subpixels. There is a problem that needs to be improved.

Embodiments of the present invention to solve the above-described problems of the background, a problem that microparticles such as floating foreign matters are adhered or deposited on the partition wall causing dark spots of the subpixels or short or light emitting defects between adjacent subpixels. It is to provide an organic light emitting display device that can prevent the. In addition, an embodiment of the present invention to provide an organic light emitting display device that can improve the reliability and life of the device.

Embodiments of the present invention as a means for solving the above problems, the first substrate and the second substrate facing the first substrate; A transistor positioned on the first substrate; A contact electrode on the transistor and connected to a source or a drain included in the transistor; A light emitting part on the second substrate; A spacer disposed between the lower electrode and the upper electrode included in the light emitting part, the spacer including a base part for distinguishing an area between the light emitting parts and a protrusion to help electrical contact between the upper electrode and the contact electrode; And a partition wall disposed on the base part and having a pattern part recessed so that the inside of the central area is spaced apart from the organic light emitting display device.

The partition wall includes a first pattern portion and a second pattern portion recessed so that the inside of the central region is spaced apart from each other, and the inside of the central region is wider than the width formed by the second pattern portion. Can be.

The partition wall may have an inverse taper shape in which the upper area is wider than the lower area.

At least one of the first pattern portion and the second pattern portion may be patterned such that the lower surface is drawn inward than the upper surface.

The second pattern portion may be patterned to expose a portion of the base portion positioned below the partition wall.

The partition wall may be divided into a first partition wall and a second partition wall by patterning the inner portion of the central area to expose a portion of the base part.

The protruding portion may be an trapezoid having a wider lower area than the upper area.

The light emitting unit may include a lower electrode positioned on the second substrate, an organic emission layer positioned on the lower electrode, and an upper electrode positioned on the organic emission layer.

The light emitting unit may further include an auxiliary electrode formed in a region where the base is located and positioned between the second substrate and the lower electrode.

The partition wall may be any one of an organic material, an inorganic material, and an organic / inorganic composite.

According to an exemplary embodiment of the present invention, an organic light emitting display device capable of preventing a problem that microparticles, such as floating foreign matters, are adhered or deposited on a partition wall to cause dark spots of subpixels or short or light emission defects between adjacent subpixels. Has the effect of providing. In addition, the embodiment of the present invention has the effect of providing an organic light emitting display device that can improve the reliability and life of the device.

Hereinafter, with reference to the accompanying drawings, the specific content for the practice of the present invention will be described.

1 is a schematic plan view of an organic light emitting display device according to an embodiment of the present invention.

As shown in FIG. 1, an organic light emitting display device according to an exemplary embodiment of the present invention may include a first substrate 110 including a transistor and a second substrate 180 including a light emitting unit. In addition, the driving unit 160 may supply a driving signal to elements positioned on the first substrate 110. In addition, it may include a pad unit 170 connected to the external circuit board to transmit various signals supplied from the outside.

The first and second substrates 110 and 180 may be formed of a light transmissive or non-transparent material. Materials of the first and second substrates 110 and 180 may include glass, metal, ceramic, or plastic (polycarbonate resin, acrylic resin, vinyl chloride resin, polyethylene terephthalate resin, polyimide resin, polyester resin, epoxy resin, Silicone resins, fluorocarbon resins, and the like).

The display unit AA may include a plurality of sub pixels SP arranged in a matrix form. Each of the plurality of sub-pixels SP may include a transistor positioned on the first substrate 110 and a light emitting unit positioned on the second substrate 180. The transistor located on the first substrate 110 and the light emitting part positioned on the second substrate 180 are electrically connected to each other when the first substrate 110 and the second substrate 180 are bonded and sealed. Meanwhile, a capacitor as well as a transistor including a switching transistor and a driving transistor are positioned on the first substrate 110, and a plurality of wirings including scan wirings, data wirings, first power wirings, and second power wirings electrically connected thereto. Are located. In addition, a light emitting unit including a lower electrode, an organic light emitting layer, and an upper electrode is disposed on the second substrate 180, as well as a spacer to assist electrical connection between the upper electrode and the lower electrode.

The driver 160 may include a data driver and a scan driver for supplying a data signal and a scan signal to the plurality of sub-pixels SP included in the display unit AA. The data driver may receive a horizontal synchronization signal and an image data signal from an external source and generate a data signal by referring to the horizontal synchronization signal. The scan driver may receive a vertical synchronization signal from an external source and generate a scan signal and a control signal to be supplied to the plurality of subpixels SP with reference to the vertical synchronization signal. Here, the data driver and the scan driver included in the driver 160 may be separately located on the first substrate 110.

Hereinafter, an organic light emitting display device according to an exemplary embodiment of the present invention will be described in detail with reference to the cross-sectional view.

2 is a cross-sectional view of the region X-X of FIG. 1 in accordance with an embodiment of the present invention.

Referring to FIG. 2, a gate 102 may be located on the first substrate 110. Gate 102 is any one selected from the group consisting of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) It may be made of one or an alloy thereof. In addition, the gate 102 is composed of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). It may be a multilayer formed of any one or an alloy thereof. In addition, the gate 102 may be a bilayer of molybdenum / aluminum-neodymium or molybdenum / aluminum.

The first insulating layer 103 may be positioned on the gate 102. The first insulating layer 103 may be, but is not limited to, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof.

The active layer 104 may be positioned on the first insulating layer 103. The active layer 104 may include amorphous silicon or polycrystalline silicon crystallized therefrom. Although not shown, the active layer 104 may include a channel region, a source region, and a drain region, and the source region and the drain region may be doped with P-type or N-type impurities. In addition, the active layer 104 may include an ohmic contact layer to lower the contact resistance.

The source 105a and the drain 105b may be positioned on the active layer 104 in contact with the active layer 104. The source 105a and drain 105b may be made of a single layer or multiple layers. Molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper when the source 105a and drain 105b are single layers It may be made of any one or an alloy thereof selected from the group consisting of (Cu). In contrast, when the source 105a and the drain 105b are multiple layers, a double layer of molybdenum / aluminum-neodymium and a triple layer of molybdenum / aluminum / molybdenum or molybdenum / aluminum-neodymium / molybdenum may be used.

The second insulating layer 106 may be positioned on the source 105a and the drain 105b. The second insulating layer 106 may be, but is not limited to, a silicon oxide layer (SiOx), a silicon nitride layer (SiNx), or a multilayer thereof. The second insulating layer 106 may be a passivation layer or a planarization layer.

Contact electrodes 107a and 107b connected to the source 105a or the drain 105b may be disposed on the second insulating layer 106. The contact electrodes 107a and 107b may be formed in a multilayer or a single layer as shown.

As described above, the transistor DT positioned on the first substrate 110 has a batam gate type as an example. However, the structure of the transistor DT disposed on the first substrate 110 is not limited thereto and may be formed in a top gate type.

The lower electrode 122 may be positioned on the second substrate 180. The lower electrode 122 may be selected as an anode or a cathode. When the lower electrode 122 is selected as the anode, the anode material may be formed of any one of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), and znO doped al 2 oxide (AZO). However, the present invention is not limited thereto.

The lower electrode 122 may include a spacer 123a and 123b including a base portion 123a exposing a portion of the lower electrode 122 and a protrusion 123b protruding from the base portion 123a. The spacers 123a and 123b may be formed of any one of an organic material, an inorganic material, and an organic / inorganic composite.

On the base portion 123a, a partition wall 125 having a pattern portion recessed to space the inside of the central region may be located. The partition wall 125 may be formed of any one of an organic material, an inorganic material, and an organic / inorganic composite.

The organic emission layer 126 separated by the partition wall 125 may be positioned on the lower electrode 122. The organic light emitting layer 126 may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer.

The upper electrode 127 separated by the partition wall 125 may be positioned on the organic emission layer 126. The upper electrode 127 may be selected as an anode or a cathode. When the lower electrode 127 is selected as the cathode, the material of the cathode may be formed of any one of aluminum (Al), aluminum alloy (Al alloy), and Almind (AlNd), but is not limited thereto. In addition, when the lower electrode 127 is selected as the cathode, it is advantageous to form a material having high reflectivity as the material of the cathode.

Meanwhile, the light emitting part EL formed on the second substrate 180 is formed in a region where the base portion 123a is positioned, and the auxiliary electrode 121 positioned between the second substrate 180 and the lower electrode 122. It may further include. The auxiliary electrode 121 may be formed of a metal material in contact with the lower electrode 122 so that the power supplied through the lower electrode 122 does not fall. The auxiliary electrode 121 may be formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu). However, the present invention is not limited thereto.

The first substrate 110 including the abnormal transistor DT and the second substrate 180 including the light emitting part EL are bonded and sealed by an adhesive member or the like. Here, when the first substrate 110 and the second substrate 180 are bonded and sealed, the contact electrodes 197a and 107b positioned on the first substrate 110 and the upper electrode positioned on the second substrate 180 are sealed. 127 has a structure that is electrically connected by the protrusion 123b disposed below the upper electrode 127. That is, the protrusion 123b serves as a structure to help electrical contact between the contact electrodes 197a and 107b and the upper electrode 127. Here, the transistor DT shown on the first substrate 110 represents a driving transistor.

In the case of the protrusion 123b disposed on the second substrate 180, the organic emission layer 126 and the upper electrode 127 formed on the second substrate 180 are separated in a region defining one subpixel. It may be formed in an isosceles form having a lower area than the upper area so that it can be deposited without being. On the other hand, in the case of the partition wall 125, the organic light emitting layer 126 and the upper electrode 127 formed on the second substrate 180 may have a pattern portion recessed so as to be formed separately by regions defining one sub-pixel. Can be. The structure of the partition wall 125 will be described in more detail below.

Meanwhile, when the first substrate 110 and the second substrate 180 are bonded and sealed, the first power wiring and the lower electrode 122 positioned on the second substrate 180 are positioned on the first substrate 110. ) May be electrically connected, and the first power line and the lower electrode 122 may also be electrically connected to each other with the help of a structure such as the protrusion 123b.

Hereinafter, the light emitting unit EL will be described in more detail with reference to FIG. 3.

3 is a diagram illustrating a hierarchical structure of a light emitting unit.

As shown in FIG. 3, the light emitting unit includes a lower electrode 122, a hole injection layer 126a, a hole transport layer 126b, a light emitting layer 126c, an electron transport layer 126d, an electron injection layer 126e, and an upper electrode ( 127).

The hole injection layer 126a may play a role of smoothly injecting holes, including cupper phthalocyanine (CuPc), poly (3,4) -ethylenedioxythiophene (PEDOT), polyaniline (PANI), and NPD (N, N-dinaphthyl). -N, N'-diphenyl benzidine) may be composed of any one or more selected from the group consisting of, but is not limited thereto.

The hole transport layer 126b serves to facilitate the transport of holes, NPD (N, N-dinaphthyl-N, N'-diphenyl benzidine), TPD (N, N'-bis- (3-methylphenyl) -N , N'-bis- (phenyl) -benzidine), s-TAD and MTDATA (4,4 ', 4 "-Tris (N-3-methylphenyl-N-phenyl-amino) -triphenylamine) It may be made of one or more, but is not limited thereto.

The emission layer 126c may include a material emitting red, green, blue, and white light, and may be formed using phosphorescent or fluorescent materials.

When the light emitting layer 126c is red, it includes a host material including CBP (carbazole biphenyl) or mCP (1,3-bis (carbazol-9-yl), and PIQIr (acac) (bis (1-phenylisoquinoline) acetylacetonate Phosphorescent light containing a dopant including any one or more selected from the group consisting of iridium), PQIr (acac) (bis (1-phenylquinoline) acetylacetonate iridium), PQIr (tris (1-phenylquinoline) iridium) and PtOEP (octaethylporphyrin platinum) It may be made of a material, alternatively may be made of a fluorescent material including PBD: Eu (DBM) 3 (Phen) or perylene, but is not limited thereto.

When the light emitting layer 126c is green, it may include a host material including CBP or mCP, and may be made of a phosphor including a dopant material including Ir (ppy) 3 (fac tris (2-phenylpyridine) iridium). Alternatively, the composition may be made of a fluorescent material including Alq3 (tris (8-hydroxyquinolino) aluminum), but is not limited thereto.

When the light emitting layer 126c is blue, the light emitting layer 126c may include a host material including CBP or mCP, and may be made of a phosphor including a dopant material including (4,6-F2ppy) 2Irpic. Alternatively, it may be made of a fluorescent material including any one selected from the group consisting of spiro-DPVBi, spiro-6P, distilbenzene (DSB), distriarylene (DSA), PFO-based polymer and PPV-based polymer, but It is not limited.

The electron transport layer 126d serves to facilitate electron transport, and may be made of any one or more selected from the group consisting of Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq, and SAlq. However, the present invention is not limited thereto.

The electron injection layer 126e serves to facilitate the injection of electrons, and may be Alq3 (tris (8-hydroxyquinolino) aluminum), PBD, TAZ, spiro-PBD, BAlq or SAlq, but is not limited thereto.

Here, the embodiment of the present invention is not limited to FIG. 3, and at least one of the hole injection layer 126a, the hole transport layer 126b, the electron transport layer 126d, and the electron injection layer 126e may be omitted. .

Hereinafter, the partition wall 125 will be described in more detail with reference to FIG. 4.

4 is a cross-sectional view of a partition wall according to an embodiment.

Referring to FIG. 4, the partition wall 125 may have an inverse taper shape in which an upper area is wider than a lower area, as shown. The first pattern part P1 and the second pattern part P2 recessed so that the inside of the central area of the partition 125 may be spaced apart from each other. The second pattern portion P2 may be patterned to expose a portion of the base portion 123a positioned below the barrier rib 125. In this case, the partition wall 125 may be patterned to expose a portion of the base portion 123a so that the inside of the central area is spaced apart to have a shape divided into the first partition wall 125a and the second partition wall 125b. Accordingly, the inside of the central region of the partition wall 125 is formed to have a wider width formed by the first pattern portion P1 than the width formed by the second pattern portion P2.

When the barrier rib 125 having the structure described above is used, when the organic light emitting layer 126 and the upper electrode 127 are deposited on the lower electrode 122, fine particles such as floating foreign matters adhere to the barrier 125. Alternatively, it is possible to prevent a problem of being deposited and causing short or emission defects between adjacent sub-pixels.

Hereinafter, a process of forming the partition wall 125 on the spacers 123a and 123b positioned on the second substrate 180 will be described in more detail.

5 to 10 are flowcharts illustrating a method of forming a partition wall according to an embodiment.

First, as shown in FIGS. 5 and 6, the auxiliary electrode 121 is formed on the second substrate 180, and the lower electrode 122 is formed on the auxiliary electrode 121.

Next, as shown in FIGS. 7 and 8, the thin film 124 is formed on the second substrate 180 to cover the lower electrode 122, and the halftone mask is spaced apart from the second substrate 180. 150 is aligned and the thin film 124 is patterned using the same. Here, in the case of the halftone mask 150, a metal film 151 suitable for the pattern to be patterned is attached to the bottom. When patterning using the halftone mask 150, the “F” region is full exposure, the “H” region is half exposure, and the “D” region is blocked by the metal film 151 having the shape as shown. The thin film 124 is formed of spacers 123a and 123b having a base 123a and a protrusion 123b.

Next, as shown in FIG. 9, when the thin film is formed on the base portion 123a and the thin film is patterned using the halftone mask 150, the partition wall 125 having the pattern portion recessed so that the inside of the central region is spaced apart. ) Is formed. However, in the case of the halftone mask 150 used to form the partition wall 125, the partition wall 125 may be formed in another shape by using other than the structure of the metal film 151 as shown in FIG. 9. Can be.

Next, as shown in FIG. 10, when the aforementioned partition wall 125 is formed, when the organic light emitting layer 126 and the upper electrode 127 are sequentially deposited on the second substrate 180, the organic light emitting layer 126 and the upper portion are deposited. The electrode 127 is deposited on the surface of the lower electrode 122 exposed by the base 123a and the surface of the protrusion 123b, but separated from the portions where the partition wall 125 is formed.

According to another embodiment, the partition wall 125 may be formed in various shapes according to the shape of the metal film 151 attached to the halftone mask 150 and the degree of exposure.

11 and 12 are views illustrating a structure of a partition wall according to another embodiment.

First, referring to FIG. 11, the shape of the partition wall 125 may be patterned such that only a portion of the bottom portion 123a is recessed without exposing a part of the base portion 123a according to the exposure degree performed in the process of FIG. 9 described above.

Next, referring to FIG. 12, the shape of the partition wall 125 may expose a part of the base 123a according to the shape of the metal film 151 of the halftone mask 150 used in the process of FIG. 9 described above. It may be patterned to be divided into a first partition and a second partition.

According to another embodiment, the partition wall 125 may be formed in various shapes even by a pattern method other than the halftone mask.

13 and 14 are views illustrating a structure of a partition wall according to still another embodiment.

Referring to FIG. 13A, the partition wall 225 is patterned such that the lower surface of the first pattern portion P1 is drawn inward from the upper surface, and a portion of the base portion 223a of the second pattern portion P2. It may be patterned so as to expose the first partition 225a and the second partition 225b.

On the contrary, referring to FIG. 13B, the partition wall 225 is patterned such that the lower surface of the first pattern portion P1 is drawn inward from the upper surface, and the base portion (2) of the second pattern portion P2. It may have a patterned shape to be recessed without exposing a portion of 223a).

Referring to FIG. 14A, the partition wall 325 is formed in a quadrangle rather than an inverted taper shape and exposes a part of the base portion 323a by the first pattern portion P1 and the second pattern portion P2. The pattern may have a shape divided into a first partition 325a and a second partition 325b.

On the contrary, referring to FIG. 14B, the partition wall 325 is formed in a quadrangular shape, but in the case of the first pattern portion P1, the bottom surface is patterned to be drawn inward from the upper surface, and the second pattern portion P2 may be formed. In this case, the base portion 323a may be patterned to expose a portion to have a shape divided into the first partition 325a and the second partition 325b.

On the contrary, referring to FIG. 14C, the partition wall 325 is formed in a quadrangular shape, but in the case of the first pattern portion P1, the bottom surface is patterned to be drawn inward from the upper surface, and the second pattern portion P2 is formed. In this case, it may have a patterned shape so as to be recessed without exposing a part of the base portion 323a.

In FIGS. 14B and 14C, the first pattern portion P1 is patterned such that the lower surface is drawn inward from the upper surface, but at least one of the first pattern portion P1 and the second pattern portion P2 is illustrated. One lower surface may be patterned to be drawn inwardly than the upper surface.

As described above, an embodiment of the present invention changes the structure of a partition wall used in an organic light emitting display device including a transistor formed on a first substrate and a light emitting portion formed on a second substrate to form an electrode on the organic light emitting layer. Microparticles, such as oily foreign matter, are adhered to or deposited on the partition wall, thereby preventing the problem of generating dark spots of the subpixels or shorting or emission defects between adjacent subpixels. In addition, the embodiment of the present invention has the effect of improving the reliability and life of the device.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 is a schematic plan view of an organic light emitting display device according to an embodiment of the present invention;

2 is a cross-sectional view of region X-X of FIG. 1 in accordance with an embodiment of the invention.

3 is a diagram illustrating a hierarchical structure of a light emitting unit.

4 is an exemplary cross-sectional view of a partition wall according to the embodiment.

5 to 10 are process flowcharts for explaining a partition formation method according to an embodiment.

11 and 12 are views showing the structure of a partition wall according to another embodiment.

13 and 14 illustrate a structure of a partition wall according to still another embodiment.

<Explanation of symbols on main parts of the drawings>

110: first substrate 102: gate

107a and 107b: contact electrode 122: lower electrode

123a and 123b: spacer 125: partition wall

126: organic light emitting layer 127: upper electrode

160: drive unit 170: pad unit

180: second substrate

Claims (10)

A first substrate and a second substrate facing the first substrate; A transistor positioned on the first substrate; A contact electrode on the transistor and connected to a source or a drain included in the transistor; A light emitting part on the second substrate; A spacer disposed between the lower electrode and the upper electrode included in the light emitting part, the spacer including a base part for separating an area between the light emitting parts, and a protrusion to assist electrical contact between the upper electrode and the contact electrode; And An organic light emitting display device comprising: a partition wall disposed on the base part and having a pattern part recessed so as to be spaced apart from the inside of the central area. The method of claim 1, The partition wall, A first pattern part and a second pattern part recessed to be spaced apart from the inside of the central area, The inside of the central area is an organic light emitting display device, characterized in that the width formed by the first pattern portion is wider than the width formed by the second pattern portion. The method of claim 2, The partition wall, An organic light emitting display device, characterized in that the upper area is larger than the lower area and has an inverse taper shape. The method of claim 2, At least one of the first pattern portion and the second pattern portion, An organic light emitting display device characterized in that the lower surface is patterned to be drawn inwardly than the upper surface. The method of claim 2, The second pattern portion, The organic light emitting display device of claim 1, wherein a portion of the bottom portion positioned under the barrier is exposed. The method of claim 1, The partition wall, The organic light emitting display device of claim 1, wherein the center region is spaced apart from each other to expose a portion of the base portion, and the first and second partitions are separated. The method of claim 1, The spacer, An organic light emitting display device, characterized in that the lower area is wider than the upper area. The method of claim 1, The light emitting unit, And a lower electrode disposed on the second substrate, an organic emission layer positioned on the lower electrode, and the upper electrode positioned on the organic emission layer. The method of claim 1, The light emitting unit, And an auxiliary electrode formed in a region where the base is located and positioned between the second substrate and the lower electrode. The method of claim 1, The partition wall, An organic light emitting display device, characterized in that any one of an organic material, an inorganic material, or an organic / inorganic composite.

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