KR20100048400A - Substrate breaking device, substrate cutting system having the same, and method of cutting substrate using the same - Google Patents

Substrate breaking device, substrate cutting system having the same, and method of cutting substrate using the same Download PDF

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Publication number
KR20100048400A
KR20100048400A KR1020080107530A KR20080107530A KR20100048400A KR 20100048400 A KR20100048400 A KR 20100048400A KR 1020080107530 A KR1020080107530 A KR 1020080107530A KR 20080107530 A KR20080107530 A KR 20080107530A KR 20100048400 A KR20100048400 A KR 20100048400A
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KR
South Korea
Prior art keywords
mother substrate
substrate
cells
cell
separating
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KR1020080107530A
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Korean (ko)
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KR101052817B1 (en
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양진혁
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세메스 주식회사
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Priority to KR1020080107530A priority Critical patent/KR101052817B1/en
Publication of KR20100048400A publication Critical patent/KR20100048400A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Liquid Crystal (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)

Abstract

A substrate separation apparatus for separating a mother substrate having a plurality of cells formed in a cell unit and transferring the same to a subsequent process includes a pressing member, a primary and a secondary separation member. The pressing member presses the peripheral region adjacent to the first portion of the corresponding cell to be separated among the cells in the first direction. In the state where the peripheral region is pressed by the pressing member, the primary separating member grips the first portion of the cell and lifts it in the second direction opposite to the first direction to separate the first portion from the mother substrate. Thereafter, the secondary separating member grips the remaining second portion of the cell and lifts it in the second direction to separate the second portion from the mother substrate. Therefore, the braking failure of the mother substrate can be prevented.

Description

SUBSTRATE BREAKING DEVICE, SUBSTRATE CUTTING SYSTEM HAVING THE SAME, AND METHOD OF CUTTING SUBSTRATE USING THE SAME}

The present invention relates to a substrate separating apparatus, a substrate cutting system having the same, and a substrate cutting method using the same. More particularly, a substrate separating apparatus for separating a mother substrate for a flat panel display into cell units, a substrate cutting system having the same, and a substrate using the same. It relates to a cutting method.

Generally, the display panel used for a flat panel display device is provided. In order to improve the productivity of the display panel, a manufacturing process is performed using a large mother substrate in which a plurality of cells formed in a size corresponding to the display panel is formed, and then the finished mother substrate is cut into cells and used as a display panel.

As a method of cutting the mother substrate in units of cells, there is a method of cutting using a laser beam or a method of cutting using a scribe wheel embedded with fine diamond.

In general, a method of cutting a mother substrate by using a scribe wheel is to contact the scribe wheel to the mother substrate and then move along the cut line to form a scribe line having a predetermined depth groove on the surface of the mother substrate. In a method of cutting a mother substrate using a laser beam, a scribe line is formed by irradiating a laser beam along a cutting target line on an upper surface of the mother substrate.

When the scribing process is completed using this method, a braking process for separating the mother substrate in units of cells along the scribe line is required. In general, in the braking process, a braking bar is disposed on an upper surface of a mother substrate on which a scribe line is formed, and then a physical shock is applied by pressing the mother substrate using the braking bar. Then, cracks propagate along the scribe line by the physical impact and the mother substrate is separated by cells. The separated cells are transported outwards.

However, in this braking process, a region in which a cell is not formed, that is, a cullet region and a cell region is not normally separated from the mother substrate, and thus a breaking failure occurs.

Accordingly, it is an object of the present invention to provide a substrate separation apparatus which can improve the breaking failure.

Another object of the present invention is to provide a substrate cutting system having the substrate separation apparatus described above.

Still another object of the present invention is to provide a substrate cutting method using the substrate separation apparatus described above.

The substrate separating apparatus according to the present invention includes a pressing member, a primary and a secondary separating member in order to separate the mother substrate on which a plurality of cells are formed in units of cells and transfer them to a subsequent process.

The pressing member presses the peripheral area adjacent to the first portion of the corresponding cell to be separated from the cells in the first direction. The primary separating member grips the first portion of the corresponding cell and lifts it in a second direction opposite to the first direction to separate the first portion from the mother substrate. The secondary separating member grasps the remaining second portion of the corresponding cell and lifts it in the second direction to separate the second portion from the mother substrate.

The pressing member presses the peripheral area in the first direction when the first portion is raised in the second direction by the primary separating member.

The primary separating member may include a first vacuum pad that grips the first portion by a vacuum suction method, a first support having the first vacuum pad coupled to one end thereof, and a first support pad coupled to the first support. It includes a first fixing plate for moving the.

The second separating member may include a second vacuum pad that grips the second portion by a vacuum suction method, a second support having the second vacuum pad coupled to one end thereof, and a second support pad coupled to the second support. It includes a second fixing plate for moving the.

Each of the first and second vacuum pads may be made of a rubber pad.

In addition, one end of each of the first and second supports may be rounded or hemispherical so that the first and second vacuum pads are swingable.

According to the present invention, a substrate cutting system includes a loading unit in which a mother substrate on which a plurality of cells are formed is loaded, a scribing unit generating a scribe line in the mother substrate received from the loading unit, and a scribe line generated in the mother substrate. The mother substrate is divided into cells and includes a breaking part for unloading the separated cells.

The breaking part includes a pressing member, a primary and a secondary separating member.

The pressing member presses the peripheral area adjacent to the first portion of the corresponding cell to be separated from the cells in the first direction. The primary separating member grips the first portion of the corresponding cell and lifts it in a second direction opposite to the first direction to separate the first portion from the mother substrate. The secondary separating member grasps the remaining second portion of the corresponding cell and lifts it in the second direction to separate the second portion from the mother substrate.

The pressing member presses the peripheral area in the first direction when the first portion is raised in the second direction by the primary separating member. The primary separating member may include a first vacuum pad that grips the first portion by a vacuum suction method, a first support having the first vacuum pad coupled to one end thereof, and a first support pad coupled to the first support. It includes a first fixing plate for moving the. The secondary separating member may include a second vacuum pad that grips the second portion by a vacuum suction method, a second support coupled to the second vacuum pad at one end, and a second support coupled to the second support. And a second fixed plate for moving.

The substrate cutting method according to the present invention comprises the steps of loading a mother substrate formed with a plurality of cells, generating a scribe line on the loaded mother substrate, separating the mother substrate in units of cells along the scribe line generated in the mother substrate And unloading the separated cells.

The separating of the mother substrate in units of cells may include pressing a peripheral area adjacent to a first portion of a corresponding cell to be separated from the cells in a first direction, and holding the first portion of the corresponding cell by holding the first portion. Lifting the first portion from the mother substrate by lifting in a second direction opposite to the direction; and holding the remaining portion of the cell to lift in the second direction to separate the second portion from the mother substrate. It comprises the step of.

According to such a substrate separating apparatus, a substrate cutting system having the same, and a substrate cutting method using the same, in a state in which the peripheral region of the cell to be separated is pressed through the pressing member, the first portion of the cell is first removed from the mother substrate. It is possible to prevent the breaking failure of the cell by separating the secondary and then separating the remaining second portion secondary.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel, and FIG. 2 is a perspective view illustrating a liquid crystal display panel.

Referring to FIG. 1, the mother substrate 100 has a structure in which first and second large substrates 110 and 120 are combined, and the plurality of cells 101 arranged in a matrix form on the mother substrate 100. This is provided. The mother substrate 100 is cut in units of the plurality of cells 101, and each of the cut cells is provided as a liquid crystal display panel.

As shown in FIG. 2, the liquid crystal display panel 105 has a structure in which a lower substrate 105a and an upper substrate 105b are combined. In the cutting process, the upper substrate 105b is cut into a smaller size than the lower substrate 105a to expose the source side end and the gate side end of the lower substrate 105a to the outside. A data pad portion for receiving a data signal from a source driver is provided at a source side end of the lower substrate 105a, and a gate pad portion for receiving a gate signal from a gate driver is provided at a gate side end.

Although the liquid crystal display panel 105 shown in FIG. 2 has a structure in which both the gate end and the source end are exposed, the liquid crystal display panel 105 may have a structure in which only the source end is exposed.

3 is a schematic view of a substrate cutting system according to an embodiment of the present invention.

Referring to FIG. 3, the substrate cutting system 500 includes a loading unit 200, a scribing unit 300, and a breaking unit 400. The loading unit 200, the scribing unit 300, and the breaking unit 400 may be sequentially arranged in a line.

The mother substrate 100 (shown in FIG. 1) transferred from the outside is loaded in the loading unit 200, and the mother substrate 100 transferred to the loading unit 200 is transferred to the scribing unit 300. do.

The scribing unit 300 forms a scribe line on the surface of the mother substrate 100 along the arrangement direction of the cells 101 using the scribing device 320 to be described later. The substrate separating apparatus 420 which applies the force to the scribe line portion formed on the mother substrate 100 to separate the cells 101 from the mother substrate 100 and grips the separated cells for subsequent processing. ) Is provided.

4 is a side view schematically showing the scribing unit shown in FIG. 3.

3 and 4, the scribing unit 300 is a scribing unit that forms a scribe line on the first support member 310 and the mother substrate 100 on which the mother substrate 100 is seated. 320 may be included.

The first supporting member 310 may include two first rotating rollers 311 and 312 spaced apart from each other, and a first belt 313 connecting the first rotating rollers 311 and 312. The first rotating rollers 311 and 312 are disposed parallel to the ground and rotate about the central axis. As the first rotating rollers 311 and 312 rotate, the first belt 313 rotates. The mother substrate 100 transferred from the loading unit 200 is seated on the first belt 313, and the mother substrate 100 moves horizontally by the rotation of the first belt 313.

The scribing unit 320 is provided on the first support member 310. The scribing unit 320 may include a head 321, a scribe wheel 322, and a wheel shaft 323 connecting the head 321 and the scribe wheel 322. The scribe wheel 322 is provided below the head 321, the head 321 is moved horizontally in one direction while pressing the scribe wheel 322 in the vertical direction.

The scribe wheel 322 is rotated by the horizontal movement of the head 321. The scribe wheel 322 has a generally disc shape. When the scribe wheel 322 is rotated in contact with the mother substrate 100 to etch the mother substrate 100 to a predetermined depth, a scribe line is formed on the mother substrate 100.

The scribe wheel 322 is connected to the head 321 through the wheel shaft 323, one end of the wheel shaft 323 is inserted into the connector formed in the center of the scribe wheel 322, the scribe When the wheel 322 is rotated serves as a rotation axis of the scribe wheel 322.

In this embodiment, the scribing unit 300 includes a scribing unit 320 for scribing the mother substrate 100 using a scribe wheel 322, but using a laser beam A scribing unit for scribing the plate 100 may be provided.

The mother substrate 100 in which the scribing process is completed in the scribing unit 300 is transferred to the breaking unit 400.

FIG. 5 is a side view schematically showing the breaking part shown in FIG. 3.

Referring to FIG. 5, the breaking part 400 includes a second support member 410 on which the mother substrate 100 is seated, and the mother substrate 100 in units of cells 101 (see FIG. 1). And a substrate separation device 420 for cutting and receiving.

The second supporting member 410 may include two second rotating rollers 411 and 412 spaced apart from each other, and a second belt 413 connecting the second rotating rollers 411 and 412. The second rotating rollers 411 and 412 are disposed parallel to the ground and rotate about the central axis. As the second rotating rollers 411 and 412 rotate, the second belt 413 rotates. The mother substrate 100 transferred from the scribing unit 300 is seated on the second belt 413, and the mother substrate 100 moves in the horizontal direction by the rotation of the second belt 413. .

The substrate separating apparatus 420 is provided on an upper portion of the second supporting member 410 and includes a pressing member 421, a primary separating member 423, a secondary separating member 425, and a driving unit 427. Include.

The pressing member 421 is disposed in the mother substrate 100 corresponding to the peripheral area of the cells. In particular, the first portion A1 facing the primary separation member 423 and the second portion facing the secondary separation member 425 are the cells 101 to be separated from the mother substrate 100. When divided into (A2), the pressing member 421 is provided correspondingly on the peripheral region adjacent to the first portion (A1). Accordingly, the driving unit 427 presses the pressing member 421 on the peripheral area adjacent to the first portion A1 and presses the first member D421 in the first direction D1 during the cell separation process.

The primary separating member 423 includes a first fixing plate 423a, a first support 423b, and a first vacuum pad 423c, and includes a first part of the corresponding cell 101 in a vacuum suction method. Gripping A1).

The first fixing plate 423a is connected to the driving unit 427 and moved by the driving unit 427, and the first support 423b is coupled to the first fixing plate 423a. The first vacuum pad 423c is connected to one end of the first support 423b, and the first vacuum pad 423c vacuum-adsorbs the first portion A1 of the corresponding cell 101. As an example of the present invention, the first vacuum pad 423c may be formed of a rubber pad.

In addition, one end of the first support 423b may be processed in a round shape or may be processed in a hemispherical shape so that the first vacuum pad 423c to which it is coupled is swingable.

The secondary separating member 425 is composed of a second fixing plate 425a, a second support 425b, and a second vacuum pad 425c, so that the second portion A2 of the corresponding cell 101 is vacuum-adsorbed. G)).

The second fixing plate 425a is connected to the driving unit 427 and moved by the driving unit 427. Here, since the second fixing plate 425a has a structure separated from the first fixing plate 423a, the second fixing plate 425a is driven independently of the first fixing plate 423a.

The second support 425b is coupled to the second fixing plate 425a. The second vacuum pad 425c is connected to one end of the second support 425b, and the one end is processed in a round shape or in a hemispherical shape. The second vacuum pad 425c is swingable in a state of being coupled to the second support 425b, and vacuum-adsorbs the second portion A2 of the corresponding cell 101. As an example of the present invention, the second vacuum pad 425c may be formed of a rubber pad.

6A through 6C are cross-sectional views illustrating a cell separation process.

Referring to FIG. 6A, in the cell separation process, the pressing member 421 is seated on the peripheral region adjacent to the first portion A1 to press the peripheral region of the mother substrate 100 in the first direction D1. do.

In the state where the peripheral region is being pressed by the pressing member 421, the primary separating member 423 provided on the first portion A1 of the corresponding cell 101 is the first portion A1. ) Is lifted in the second direction D2 opposite to the first direction D1. Therefore, when the first portion A1 of the corresponding cell 101 is lifted by the primary separating member 423, the pressing member 421 may move together with the corresponding cell 101 to the mother substrate ( It is possible to prevent the cullet of 100) from coming up.

As shown in FIG. 6B, when the first portion A1 of the corresponding cell 101 is lifted by the primary separating member 423, the first portion A1 of the corresponding cell 101 is removed. It is completely separated from the cullet of the mother substrate 100, and the corresponding cell 101 is inclined diagonally.

6C, the secondary separating member 425 grips the second portion A2 of the cell 101 in the second direction while the cell 101 is inclined diagonally. Lift to (D2). Then, the collet of the corresponding cell 10 and the mother substrate 100 is completely separated. The separated cells 105 held by the primary and secondary separation members 423 and 425 are transferred for subsequent processing.

Meanwhile, when the secondary separating member 425 is moved in the second direction D2, the pressing member 421 and the primary separating member 423 may be moved in the second direction D2. .

As such, the breaking part 400 is provided with a substrate separation device 420 for diagonally separating the cell 101 from the mother substrate 100 using the primary separation member 423 and the secondary separation member 425. When the cell 101 is separated from the mother substrate 100, the cullet may be prevented from rising up, and as a result, the breaking failure may be prevented.

In addition, the primary and secondary separation members 423 and 425 not only separate the corresponding cells 101, but also serve to transfer the separated cells to subsequent processes, thereby improving the efficiency of the substrate cutting process. have.

FIG. 7 is a flowchart illustrating a process of cutting a substrate using the substrate cutting system shown in FIG. 3.

3 and 7, the mother substrate 100 having a plurality of cells formed thereon is loaded into the substrate cutting apparatus 500 through the loading unit 200 (S10), and the loaded mother substrate 100 is swapped. The scribe line 300 is moved to form a scribe line on the surface of the mother substrate 100 (S20).

Thereafter, the mother substrate 100 is transferred to the breaking unit 400, and the breaking unit 400 separates the mother substrate 100 in units of cells along a scribe line generated in the mother substrate 100. (S30). Next, the cells separated in the breaking unit 400 are unloaded to the outside (S40).

8 is a flowchart illustrating the braking process illustrated in FIG. 7.

5 and 8, the braking process S30 is performed through the following process.

First, the peripheral region adjacent to the first portion A1 of the cell 101 is pressed in the first direction D1 using the pressing member 421 (S31).

In a state in which the peripheral region is being pressed by the pressing member 421, a second portion facing the first direction D1 by holding the first portion A1 using the primary separating member 423. It raises in the direction D2 (S32). In this case, the pressing member 421 may prevent the cullet of the mother substrate 100 from rising along with the corresponding cell 101.

When the first portion A1 of the corresponding cell 101 is lifted by the primary separating member 423, the first portion A1 of the corresponding cell 101 is the cullet of the mother substrate 100. Completely separated from, the corresponding cell 101 is inclined diagonally.

Thereafter, in the state in which the corresponding cell 101 is inclined diagonally, the second part A2 of the corresponding cell 101 is gripped using the secondary separating member 425 in the second direction D2. Lift (S33).

Then, the collet of the corresponding cell 10 and the mother substrate 100 is completely separated. Next, the primary and secondary separation members 423 and 425 transfer the separated cell 105 to a subsequent process (S34).

As such, when the cell 101 to be separated is separated from the mother substrate 100 by a diagonal line, breaking failure can be prevented.

In this embodiment, the mother substrate for the liquid crystal display panel is described as an example of the cutting object.

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a plan view illustrating a mother substrate for a liquid crystal display panel.

2 is a perspective view illustrating a liquid crystal display panel.

3 is a schematic view of a substrate cutting system according to an embodiment of the present invention.

4 is a side view schematically showing the scribing unit shown in FIG. 3.

FIG. 5 is a side view schematically showing the breaking part shown in FIG. 3.

6A through 6C are cross-sectional views illustrating a cell separation process.

FIG. 7 is a flowchart illustrating a process of cutting a substrate using the substrate cutting system shown in FIG. 3.

8 is a flowchart illustrating the braking process illustrated in FIG. 7.

* Description of the symbols for the main parts of the drawings *

100: the mother substrate 200: loading unit

300: scribing part 400: breaking part

420: substrate separating apparatus 421: pressing member

423: primary separation member 425: secondary separation member

500: Substrate Cutting System

Claims (9)

In a substrate separation apparatus for separating a mother substrate having a plurality of cells formed in units of cells and transported to a subsequent process, A pressing member for urging a peripheral region adjacent to the first portion of the cell to be separated among the cells in a first direction; A primary separation member that grasps the first portion of the cell and lifts it in a second direction opposite to the first direction to separate the first portion from the mother substrate; And And a secondary separation member that grips the remaining second portion of the cell and lifts it in the second direction to separate the second portion from the mother substrate. The substrate separating apparatus of claim 1, wherein the pressing member presses the peripheral region in the first direction when the first portion is raised in the second direction by the primary separating member. The method of claim 1, wherein the primary separating member, A first vacuum pad holding the first portion by a vacuum suction method; A first support having one end coupled to the first vacuum pad; And A first fixed plate coupled to the first support to move the first vacuum pad, The secondary separation member, A second vacuum pad which grips the second portion by a vacuum suction method; A second support having one end coupled to the second vacuum pad; And And a second fixing plate coupled to the second support to move the second vacuum pad. 4. The substrate separation apparatus of claim 3, wherein each of the first and second vacuum pads is made of a rubber pad. 4. The substrate separating apparatus of claim 3, wherein one end of each of the first and second supports is processed in a round or hemispherical shape so that the first and second vacuum pads are swingable. A loading unit to which a mother substrate on which a plurality of cells are formed is loaded; A scribing unit generating a scribe line on the mother substrate received from the loading unit; And A breaking part for separating the mother substrate in units of cells along the scribe line generated in the mother substrate and unloading the separated cells; The breaking part, A pressing member for urging a peripheral region adjacent to the first portion of the cell to be separated among the cells in a first direction; And A primary separation member that grasps the first portion of the cell and lifts it in a second direction opposite to the first direction to separate the first portion from the mother substrate; And And a secondary separation member that grips the remaining second portion of the cell and lifts it in the second direction to separate the second portion from the mother substrate. The substrate cutting system of claim 6, wherein the pressing member presses the peripheral area in the first direction when the first portion is raised in the second direction by the primary separation member. The method of claim 6, wherein the primary separating member, A first vacuum pad holding the first portion by a vacuum suction method; A first support having one end coupled to the first vacuum pad; And A first fixing plate coupled to the first support to move the first vacuum pad, The secondary separation member, A second vacuum pad which grips the second portion by a vacuum suction method; A second support having one end coupled to the second vacuum pad; And And a second fixing plate coupled to the second support to move the second vacuum pad. Loading a mother substrate on which a plurality of cells are formed; Generating a scribe line on the loaded mother substrate; Separating the mother substrate in units of cells along a scribe line generated in the mother substrate; And Unloading the separated cells; Separating the mother substrate in cell units, Pressing a peripheral region adjacent to a first portion of the corresponding cell to be separated among the cells in a first direction; Holding the first portion of the cell and lifting it in a second direction opposite the first direction to separate the first portion from the mother substrate; And Holding the remaining portion of said cell and lifting it in said second direction to separate said second portion from said mother substrate.
KR1020080107530A 2008-10-31 2008-10-31 Substrate separation apparatus, substrate cutting system having same and substrate cutting method using same KR101052817B1 (en)

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KR101052817B1 KR101052817B1 (en) 2011-07-29

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101290102B1 (en) * 2012-02-17 2013-07-26 주식회사 엘티에스 Apparatus for manufacturing flat display panel
KR20180032648A (en) * 2015-08-11 2018-03-30 도오꾜오까고오교 가부시끼가이샤 Support Separation Device and Support Separation Method
CN108947228A (en) * 2018-07-24 2018-12-07 蚌埠淮畔精密机械有限公司 A kind of float glass slicing apparatus
KR20190037830A (en) * 2017-09-29 2019-04-08 주식회사 탑 엔지니어링 Substrate cutting apparatus
KR20210045117A (en) * 2019-10-16 2021-04-26 주성엔지니어링(주) Apparatus for Splitting Substrate

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050054336A (en) * 2003-12-04 2005-06-10 엘지.필립스 엘시디 주식회사 Apparatus and method of breaking liquid crystal display panel
KR100660796B1 (en) 2005-12-29 2006-12-26 주식회사 탑 엔지니어링 Apparatus for cutting substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101290102B1 (en) * 2012-02-17 2013-07-26 주식회사 엘티에스 Apparatus for manufacturing flat display panel
KR20180032648A (en) * 2015-08-11 2018-03-30 도오꾜오까고오교 가부시끼가이샤 Support Separation Device and Support Separation Method
KR20190037830A (en) * 2017-09-29 2019-04-08 주식회사 탑 엔지니어링 Substrate cutting apparatus
CN108947228A (en) * 2018-07-24 2018-12-07 蚌埠淮畔精密机械有限公司 A kind of float glass slicing apparatus
CN108947228B (en) * 2018-07-24 2021-04-02 宿迁市恒胜装饰工程有限公司 Float glass slicing device
KR20210045117A (en) * 2019-10-16 2021-04-26 주성엔지니어링(주) Apparatus for Splitting Substrate

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