KR20100047464A - Apparatus for processing a substrate and method for processing a substrate using the same - Google Patents

Apparatus for processing a substrate and method for processing a substrate using the same Download PDF

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Publication number
KR20100047464A
KR20100047464A KR1020080106368A KR20080106368A KR20100047464A KR 20100047464 A KR20100047464 A KR 20100047464A KR 1020080106368 A KR1020080106368 A KR 1020080106368A KR 20080106368 A KR20080106368 A KR 20080106368A KR 20100047464 A KR20100047464 A KR 20100047464A
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KR
South Korea
Prior art keywords
recovery
substrate
processing
processing liquid
liquid
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Application number
KR1020080106368A
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Korean (ko)
Inventor
박정선
서재희
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세메스 주식회사
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Priority to KR1020080106368A priority Critical patent/KR20100047464A/en
Publication of KR20100047464A publication Critical patent/KR20100047464A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The substrate processing apparatus according to the present invention provides a spin chuck for supporting and rotating a substrate, a processing liquid supply part for supplying processing liquids to the substrate during the process, and a side portion of the spin chuck, which is supplied to the substrate and then scattered from the substrate. And a plurality of recovery bins for recovering the processing liquids, and recovery lines connected to each recovery container for discharging the processing liquids. The substrate processing method according to the present invention includes the steps of: loading a substrate; Arranging an inlet position of any one of a plurality of recovery containers so as to correspond to the substrate according to the type of processing liquid, supplying the processing liquid to the substrate, and causing the processing liquid to be scattered in the recovery container; and Reusing each of the treatment liquid of the recovery container or disposal of the waste liquid.

Description

Substrate processing apparatus and substrate processing method {APPARATUS FOR PROCESSING A SUBSTRATE AND METHOD FOR PROCESSING A SUBSTRATE USING THE SAME}

The present invention relates to an apparatus and method for processing a semiconductor substrate, and more particularly to a substrate processing apparatus and method comprising a separate recovery line for recovering deionized water in the treatment liquid used in the process.

In a process of processing a substrate such as a wafer, a series of unit processes are continuously and repeatedly performed, and thus, a semiconductor integrated circuit, a display device, or the like can be manufactured. This unit process has a number of stages, typically an etching process and a cleaning process. The etching process and the cleaning process are processes for removing foreign substances remaining on the substrate.

In general, an apparatus for performing a substrate treatment process such as an etching process and a cleaning process is divided into a dry apparatus and a wet apparatus. Among these, the wet apparatus is an apparatus for treating a substrate using a plurality of treatment liquids, for example, an etchant, a cleaning liquid, and a rinse liquid. Such a substrate processing apparatus includes a process of etching an unnecessary portion of a thin film formed on a substrate, and a process of cleaning foreign matter remaining on a processing surface of the substrate.

For example, after a photoresist film is formed on a substrate during a semiconductor manufacturing process, a process of removing an unnecessary photoresist film on a bevel (hereinafter, referred to as an “edge”) region of the substrate is performed. In the edge etching process of the substrate, a treatment solution such as hydrofluoric acid (HF) solution is sprayed on the edge of the substrate to remove unnecessary photoresist film at the edge of the substrate. After performing the edge etching process of the substrate, a cleaning and rinsing process for removing foreign substances, such as etching liquid, particles, and other contaminants remaining on the processing surface of the substrate is performed. The treatment liquids used in this process are discarded or recovered and reused.

However, since the deionized water used most in the above-described process is mixed with other treatment liquids, the volume of treatment liquids disposed of or recovered becomes large, and the process of purifying to reuse such a large amount of treatment liquids requires a lot of effort. And cost.

An object of the present invention is to provide a substrate processing apparatus and a substrate processing method that can improve the processing efficiency and productivity of the substrate.

The substrate processing apparatus according to the present invention provides a spin chuck for supporting and rotating a substrate, a processing liquid supply part for supplying processing liquids to the substrate during a process, and a side portion of the spin chuck, which is supplied to the substrate and then supplied to the substrate. And a plurality of recovery bins for recovering the processing liquids scattered from the plurality of recovery bins, and recovery lines connected to the respective recovery bins to discharge the processing liquids.

The recovery line includes at least one deionized water recovery line, wherein the recovery bin has a first recovery bin having a first recovery line for discharging the first treatment liquid and a second recovery line for discharging the second treatment liquid. And a third recovery bin having a second recovery bin and a third recovery line for discharging the third processing liquid.

Here, at least one of the first to third recovery lines may be branched such that the treatment liquid is discharged through the first path and the second path. A divert valve is provided at the branched portion of the pipe. The direction switching valve is redirected such that the treatment liquid is discharged only in one of the first path and the second path, respectively.

The direction change valve of the treatment liquid supply part, the recovery part and the recovery line may be controlled by a controller, and the control part adjusts the direction of the direction change valve according to the type of the treatment liquid injected from the treatment liquid supply part.

The present invention includes a method for processing a substrate using the substrate processing apparatus, and the substrate processing method according to the present invention includes loading a substrate and a plurality of recovery containers depending on the type of processing liquid for processing the substrate. Disposing any one of the inlet positions on the substrate, supplying the processing liquid to the substrate to collect scattered processing liquid in the collecting container, and reusing each processing liquid in the collecting container; Waste liquid disposal.

Here, the recovery container may include a first recovery container having a first recovery line for discharging the first treatment liquid, a second recovery container having a second recovery line for discharging the second treatment liquid and a third discharge liquid for discharging the third treatment liquid; A third recovery container having three recovery lines may be included, and different treatment solutions may be used for the first to third treatment solutions.

In this case, the first treatment liquid is deionized water and the first recovery line may be used as a deionized water recovery line in which deionized water is discharged and recovered.

At least one of the first to third recovery lines may be branched into a first path and a second path, in which case the treatment liquid is discharged through the first path and the second path. In this case, the treatment liquid includes two different treatment liquids, and the recovery line further includes a diverter valve where the pipe is branched, and the divert valve has two different treatment liquids, respectively. The direction is diverted so that only one of the first path and the second path is discharged. One of the different treatment liquids discharged into the first and second passages may be discharged and discarded, and the other one of the different treatment liquids may be discharged and recovered.

According to an embodiment of the present invention, a separate recovery line for discharging deionized water is provided so that the deionized water and the other treatment liquid are not mixed. This not only simplifies the treatment process but also facilitates reuse of the deionized water because the volume of the treatment liquid other than the deionized water is drastically reduced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments presented herein are provided so that the disclosure will be thorough and complete, and will fully convey the spirit of the invention to those skilled in the art. Portions denoted by like reference numerals denote like elements throughout the specification.

In addition, in the present embodiment, the apparatus for cleaning the semiconductor substrate by a single sheet was described as an example, but the present invention can be applied to any apparatus for processing the substrate.

 (Example)

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention. Referring to FIG. 1, a substrate processing apparatus 100 according to an embodiment of the present invention may be used to process etching, cleaning, rinsing, drying, and the like of a substrate 10 such as a silicon substrate by a single-leaf spin method. Can be.

The substrate processing apparatus 100 according to the present invention includes a spin chuck 110 for supporting and rotating the substrate 10, and at least one processing liquid supply unit supplying the processing liquids to the substrate 10 through a nozzle during the process. 120 and an annular number 140 provided in an annular shape to surround the side of the spin chuck 110.

The spin chuck 110 supports and rotates the substrate 10 during the process. The spin chuck 110 is rotatably disposed on the spin head 112 and the edge portion of the spin head 112 so that the substrate 10 is not separated from the spin head 112. It may include a number of holders 114 gripping the edges. In addition, the spin chuck 110 is disposed below the center of the spin head 112 to provide a rotational force for rotating the spin head 112, the spin head 112, the spin head 112 and the It may include a rotation shaft 118 connecting between the rotation drive unit 116.

For example, six holders 114 may be disposed at an upper edge portion of the spin head 112. Although not shown in detail, each of the holders 114 is disposed to be rotatable by itself, lower support members for supporting the edge of the substrate 10, and are eccentrically disposed on the lower support members. It may include upper support members for holding the substrate 10 by being in close contact with the side of the substrate 10 by the rotation.

The rotation driver 116 may include a motor that provides a rotational force, and the rotation shaft 118 may extend downward from the center portion of the spin head 112 for connection with the rotation driver 116.

The processing liquid supply unit 120 may include a plurality of nozzles, and each nozzle may supply various types of processing liquids to the substrate in a predetermined order or in any order. In one embodiment, the treatment liquid supply unit 120 is provided with four nozzles (not shown), and each nozzle may provide the same or different treatment liquid on the substrate, and may be ultrapure or ultrapure. It may be a mixture of other treatment liquids or the treatment liquid itself.

In another embodiment, three of four nozzles may be supplied with a cleaning liquid for removing foreign matter and unnecessary film remaining on the processing surface of the substrate 10, and the other nozzle may be supplied with a rinse liquid as the processing liquid. Can be. The rinse liquid is a treatment liquid for removing the washing liquid. For example, the treatment liquids supplied from the three nozzles are hydrofluoric acid (HF), sulfuric acid (H 3 SO 4 ), nitric acid (HNO 3 ), phosphoric acid (H 3 PO 4 ), and SC-1 (standard clean-1) solution. At least one selected from the group consisting of. Purified water may be used as the rinse liquid. Here, pure water means purified pure water with minimal impurities, and includes distilled water or deionized water.

The combination of such treatment liquids may vary depending on the type of process, and the type and order of the treatment solutions are not limited.

The return number 140 is provided in an annular shape surrounding the side of the spin chuck 110, and the return number 140 is recovered from the processing liquid supply unit 120, which will be described later, to the substrate 10 to recover the processing liquids scattered. It is to. The treatment liquid injected from the treatment liquid supply unit 120 to the substrate 10 may vary depending on the process. Therefore, the recovery part 140 has internal spaces partitioned by at least one recovery container 142 to accommodate the treatment liquid separated from the substrate 10 by the rotation of the substrate 10.

As shown, the recovery unit 140 includes first to third recovery bins 142a , 142b, and 142c forming three internal spaces, and each recovery bin 142a and 142b. , 142c may be disposed concentrically with respect to the central axis of the spin chuck 110.

In the present embodiment, the recovery bins 142a, 142b, and 142c are sequentially disposed from the farthest distance from the spin chuck to the first recovery bin 142a, the second recovery bin 142b, and the third recovery bin 142c. Although referred to as, the order of the recovery container may be arranged randomly. For example, the third recovery container, the first recovery container, and the second recovery container may be disposed from the distance from the spin chuck.

Each of the recovery bins 142 includes a cylindrical body 144 extending vertically upward and a cover 146a and 146b extending upward from the top of the body 144 toward the central axis of the spin chuck 110. , 146c, and the plurality of recovery bins 142 are disposed such that an inlet through which the processing liquid enters the recovery bin 142 is stacked up and down.

Each of the collecting vessels 142a, 142b, and 142c is open at an upper portion thereof so that the processing liquids supplied to the processing surface of the substrate 10 flow in, so that the processing liquids may enter the different collecting containers 142 according to the type of the processing liquid. can do. The processing liquid provided on the substrate from the nozzle and collected in the first recovery container 142a is called a first processing liquid, and the processing liquid collected in the second recovery container 142b is called a second processing liquid, and a third recovery container When the processing liquid collected at 142c is referred to as a third processing liquid, the first recovery container 142a is the first processing liquid, the second recovery container 142b is the second processing liquid, and the third recovery container 142c is The third treatment liquid is recovered. In this case, when the processing liquid is collected into the collecting container 142, the same processing liquid may be introduced into the same collecting container, and thus, the first processing liquid 142a, the second processing liquid 142b, and the third processing liquid 142c. ) May correspond to different kinds of materials.

A vertical driver 170 for moving the recovery part 140 in the vertical direction is disposed outside the number of times 120, and the vertical driver 170 is structurally connected to the recovery part 140. The vertical driving unit 170 may be a hydraulic or pneumatic cylinder, it is provided to adjust the height of the recovery unit 140 according to the type of processing liquid provided on the substrate 10.

Meanwhile, cylinder-shaped protective covers 172 and 174 for protecting the rotary driver 116 and the rotary shaft 118 from the processing liquid are disposed to surround the rotary driver 116 and the rotary shaft 118, respectively. Can be.

Internal spaces between the recovery containers 142 may be connected to recovery lines 180 for discharging the treatment liquid. The recovery lines 180 connect the interior spaces with containers (not shown) for accommodating the treatment liquid by type. At this time, each of the first to third recovery containers 142a, 142b, and 142c is provided with the first to third recovery lines 180a, 180b, and 180c. The first recovery line 180a discharges the first treatment liquid in the first recovery container 142a, and the second recovery line 180b discharges the second treatment liquid in the second recovery container 142b. Then, the third recovery line 180c discharges the third processing liquid in the third recovery container 142c.

Here, the first recovery line 180a is provided as a deionized water recovery line. The other two recovery lines 180b and 180c may be used to recover various kinds of washing liquids, including deionized water.

Here, the first to third recovery lines 180a, 180b, and 180c may further include a processing liquid regeneration unit (not shown) for regenerating the first to third processing liquids for reuse. The treatment liquid regeneration unit regenerates the first and second treatment liquids and the third treatment liquid and recovers them to the treatment fluid supply member 150.

Discharge holes are provided in each of the first to third recovery containers 142a, 142b, and 142c. Each discharge hole communicates with the first to third recovery lines 180a, 180b, and 180c. The deionized water or the deionized water, the treatment liquid or the mixture of the deionized water and the treatment liquid of the recovery vessels 142a, 142b, and 142c is discharged to the first to third recovery lines 180a, 180b, and 180c through the discharge hole. do.

The first recovery line 180a is a pipe for recovering only deionized water as described above. Deionized water is one of the most frequently and most commonly used treatment solutions in the processing of semiconductor substrates. In particular, since the deionized water is used as a cleaning liquid in various processes, it belongs to the largest volume of treatment liquid discharged through the recovery line. As a result, when mixed with other treatment liquids and deionized water to proceed with the process, the amount of sewage to be cleaned up afterwards is greatly increased, and time and cost are greatly increased during the subsequent treatment. Therefore, in one embodiment of the present invention is provided with a separate recovery line for discharging the deionized water so that the deionized water and the other treatment liquid is not mixed. This not only simplifies the treatment process but also facilitates reuse of the deionized water because the volume of the treatment liquid other than the deionized water is drastically reduced.

The deionized water recovery line may further include a collecting vessel for collecting deionized water collected with deionized water, and the deionized water collected in the collecting vessel may be reused or transported to a purification facility.

Each of the first to third recovery lines 180a, 180b, and 180c controls first or third discharge of the treatment liquid discharged through the first to third recovery lines 180a, 180b, and 180c. Valves 182a, 182b, and 183c may be provided.

In addition, the first to third recovery lines 180a, 180b, and 180c may be branched at a predetermined point so that a plurality of discharge paths of the treatment liquid may be formed. Preferably, the first recovery line 180a having the highest throughput, that is, the deionized water recovery line, is maintained in a single pipe and includes a second recovery line 180b or a third recovery line 180c in a branched form. For example, as illustrated, the second recovery line 180b may be divided into two branches, and the discharge path may be divided into the first path 182b 'and the second path 182b ″.

The second valve 182b of the two branched portions 182b 'and 182b "may be provided with a directional valve, that is, a three-way valve. It is controlled by the control unit 190 to adjust the direction of the valve according to the direction change valve is one of the first path (182b ') and the second path (182b ") to the processing liquid which is different from the recovery container. It leads to That is, the processing liquid is discharged to the first path 182b ', or the processing liquid is discharged to the second path 182b ", and both the first path 182b' and the second path 182b" are discharged. It is not intended to be discharged.

The reason for discharging only one of the plurality of paths is that even if the treatment liquid is discharged through the same discharge hole, different treatment liquids may be discharged, and the discharge path may be discharged differently according to the type of treatment liquid. . Thus, by using only one recovery line as the deionized water recovery line, it is possible to further secure a recovery line for treating a separate treatment liquid rather than deionized water.

For example, when the substrate 10 is treated with the A treatment liquid for a first period in a second recovery container, and the substrate 1 is treated with the B treatment liquid for the next second period, A treatment liquid recovered in the second recovery container 142b in the period is discharged through the first path 182b ', and B treatment liquid recovered in the second recovery container 142b in the second period is second. Can be discharged through the path 182b ". Accordingly, the direction switching valve redirects the valve, which has been fitted to the first path 182b 'between the first and second periods, to the second path 182b". To

In the drawings, only the case where the direction switching valve is provided in the second recovery line 180b is not limited thereto. For example, when the first recovery line 180a is a deionized water recovery line, the remaining recovery lines 180b and 180c except for the deionized water recovery line may be provided with a direction switching valve, and the first recovery line 180a may be provided. ) Can also be branched to have more than one path. However, since the amount of deionized water is large, it can be set so that only deionized water can be discharged without installing a directional valve.

When the directional valve is provided, the connection section from the discharge hole to the directional valve is preferably as short as possible. Looking at the path of the processing liquid when treating the substrate using different processing liquids, before the separation into the first path (182b ') and the second path (182b "), including the discharge hole and the discharge hole 142b Since the recovery line 180b is jointly used, there is a problem that different treatment liquids are mixed in the recovery container 142b, the discharge hole, and the recovery line 180b. The shorter the value is, the less the mixing of the treatment liquid, and accordingly, the reuse of the treatment liquid is easy.

The treatment liquid may be discharged by treating the waste liquid, but may be reused. In one embodiment, the use of the first to third recovery lines 180a, 180b, and 180c may be determined differently. For example, as illustrated, the first recovery line 180a is a deionized water recovery line, and the second recovery line 180b is a branched recovery having a first path 182b 'and a third path 182b ". In this case, the first path 182b 'may be a waste liquid discharge line and the second path 182b "may be used as a treatment liquid reuse line. In this case, the third recovery line 180c may also be used as the treatment liquid reuse line.

In such a configuration, the deionized water may be separately collected and reused, and the treatment liquid may be efficiently managed by separating the treatment liquid for reuse and the waste liquid discharge.

The controller 190 controls the process of the substrate processing apparatus 100 described above. That is, the controller 190 controls the processing liquid supply unit 120 to control the support and rotational speed of the substrate 10 of the spin chuck 110, and adjust the height of the recovery unit 142 through the vertical driver 170. To control. The controller 190 may control the opening and closing of the valve 182 to control the supply of the processing fluid.

Hereinafter, the process of the substrate processing apparatus 100 having the above-described structure will be described in detail. Here, the same reference numerals for the same components as the above-described components are the same, and detailed description of the components is omitted.

When the process of the substrate processing apparatus 10 according to the present invention is started, the substrate 10 is loaded on the spin chuck 110 (S110). When the substrate 10 is fixed, a process of treating the substrate 10, for example, an etching process or a cleaning process, is performed. An example of the cleaning process is as follows.

When the substrate 10 is loaded, any one of the first to third recovery containers 142a, 142b, and 142c is adjusted by adjusting the vertical position of the recovery part 140 through the vertical driving part 170 according to the type of processing liquid. The inlet is positioned to coincide with the substrate 10. The position of the recovery container 142 is controlled by the control unit.

Next, the processing liquid is supplied to the substrate 10 through the nozzle of the processing liquid supplying part 120 so that the processing liquid is collected in the recovery container 142. When the type of the processing liquid is changed, the position of the recovery container 142 is reset to recover the processing liquid into the recovery container 142. Accordingly, the first processing liquid collected in the first collecting container 142a, the second processing liquid collected in the second collecting container 142b and the third processing liquid collected in the third collecting container 142c according to the position of the collecting container. You get

At this time, when the treatment liquid is deionized water, it is set to be collected in the first recovery container 142a, and when the other treatment liquid is used or when the other treatment liquid and deionized water are mixed with the other treatment liquid, the second or third recovery container is used. The liquid is recovered to 142b and 142c.

The first to third treatment liquids are reused or disposed of through the first to third recovery lines 182a, 182b, and 182c, respectively.

When the second recovery line 182b or the third recovery line 182c is branched into the first path 182b 'and the second path 182b ", the first recovery line 182b or the second recovery line 182c may be a first direction switching valve according to the type of the treatment liquid. The treatment liquid is recovered separately by selecting and communicating one of the path 182b 'and the second path 182b ".

The substrate processing apparatus 100 and the method described above can separate and recover the treatment liquids used in the process, and can separately recover the deionized water, thereby remarkably reducing the time and cost in the reuse of the treatment liquid including the deionized water and the waste liquid treatment. Decrease.

The foregoing detailed description illustrates the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications may be made within the scope of the concept of the invention disclosed in this specification, the scope equivalent to the disclosed contents, and / or the skill or knowledge in the art. The above-described embodiments are for explaining the best state in carrying out the present invention, the use of other inventions such as the present invention in other state known in the art, and the specific fields of application and uses of the present invention. Various changes are also possible. Accordingly, the detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to include other embodiments.

1 is a cross-sectional view illustrating a substrate processing apparatus according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

10 substrate 110 spin chuck

112: spin head 120: processing liquid supply unit

140: recovery unit

142a, 142b, 142c: first to third recovery containers

180a, 180b, 180c: first to third recovery lines

182a, 182b, and 183c: first to third valves

182b ', 182b ": first to second paths

Claims (10)

A spin chuck supporting and rotating the substrate; A processing liquid supply unit supplying processing liquids to the substrate during a process; A plurality of collecting vessels provided to surround the side portions of the spin chuck and collecting the processing liquids scattered from the substrate after being supplied to the substrate; And A recovery line connected to each recovery container for discharging the treatment liquids, And the recovery line includes at least one deionized water recovery line. The method of claim 1, The recovery container has a first recovery container having a first recovery line for discharging the first processing liquid, a second recovery container having a second recovery line for discharging the second processing liquid, and a third recovery container discharging the third processing liquid. A third recovery bin having a line, At least one of the first to the third recovery line is a substrate processing apparatus, characterized in that the processing liquid is discharged through the first path and the second path. The method of claim 2, The recovery line is further provided with a diverter valve in the branched portion of the pipe, the diverter valve is characterized in that the direction is switched so that the treatment liquid is discharged to only one of the first path and the second path, respectively Processing unit. The method of claim 1, Further comprising a control unit for controlling the direction change valve of the processing liquid supply unit, recovery unit and recovery line, The control unit is a substrate processing apparatus, characterized in that the direction of the direction change valve is adjusted in accordance with the type of processing liquid injected from the processing liquid supply unit. Loading a substrate; Arranging an inlet position of any one of the plurality of recovery containers so as to correspond to the substrate according to a type of processing liquid for processing the substrate; Supplying the processing liquid to the substrate so that the scattered processing liquid is collected in the collecting container; And Reusing each of the treatment liquid of the recovery container or disposal of the waste liquid, One of the said collection container is a substrate processing method characterized by recovering deionized water. The method of claim 1, The recovery container has a first recovery container having a first recovery line for discharging the first processing liquid, a second recovery container having a second recovery line for discharging the second processing liquid, and a third recovery container discharging the third processing liquid. A third recovery bin having a line, And the first processing liquid and the third processing liquid are different processing liquids. The method of claim 6, And the first treatment liquid is deionized water and the first recovery line is a deionized water recovery line from which deionized water is discharged and recovered. The method of claim 5, At least one of the first to third recovery lines is branched into a first path and a second path, and the processing liquid is discharged through the first path and the second path. The method of claim 8, The treatment liquid includes two different treatment liquids, The recovery line further includes a diverter valve where the pipe is branched, wherein the diverter valve is redirected such that the two different treatment liquids are discharged only in one of the first path and the second path, respectively. Substrate processing method. 10. The method of claim 9, And one of the different processing liquids discharged into the first and second paths is discharged and discarded, and the other of the different processing liquids is discharged and recovered.
KR1020080106368A 2008-10-29 2008-10-29 Apparatus for processing a substrate and method for processing a substrate using the same KR20100047464A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150078631A (en) * 2013-12-31 2015-07-08 세메스 주식회사 Apparatus for Processing Substrate
KR20150139018A (en) * 2014-05-30 2015-12-11 세메스 주식회사 Apparatus and method for treating a substrate
CN111146074A (en) * 2018-11-06 2020-05-12 细美事有限公司 Substrate processing method and substrate processing apparatus

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150078631A (en) * 2013-12-31 2015-07-08 세메스 주식회사 Apparatus for Processing Substrate
KR20150139018A (en) * 2014-05-30 2015-12-11 세메스 주식회사 Apparatus and method for treating a substrate
CN111146074A (en) * 2018-11-06 2020-05-12 细美事有限公司 Substrate processing method and substrate processing apparatus
CN111146074B (en) * 2018-11-06 2023-08-04 细美事有限公司 Substrate processing method and substrate processing apparatus

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