KR20100037896A - Mask structure for pcb of plating equipment - Google Patents

Mask structure for pcb of plating equipment Download PDF

Info

Publication number
KR20100037896A
KR20100037896A KR1020080097233A KR20080097233A KR20100037896A KR 20100037896 A KR20100037896 A KR 20100037896A KR 1020080097233 A KR1020080097233 A KR 1020080097233A KR 20080097233 A KR20080097233 A KR 20080097233A KR 20100037896 A KR20100037896 A KR 20100037896A
Authority
KR
South Korea
Prior art keywords
plate
printed circuit
plating
circuit board
shielding
Prior art date
Application number
KR1020080097233A
Other languages
Korean (ko)
Other versions
KR101135955B1 (en
Inventor
박용순
Original Assignee
주식회사 티케이씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 티케이씨 filed Critical 주식회사 티케이씨
Priority to KR1020080097233A priority Critical patent/KR101135955B1/en
Publication of KR20100037896A publication Critical patent/KR20100037896A/en
Application granted granted Critical
Publication of KR101135955B1 publication Critical patent/KR101135955B1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C25D17/04—External supporting frames or structures
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE: A shield structure for a printed circuit plate of plating equipment is provided to improve plating quality by applying pneumatic stirring and plating liquid on a printed circuit plate. CONSTITUTION: A shield structure for a printed circuit plate of plating equipment comprises a front shielding plate(4), a back shielding plate(5), a front plate(16), a back plate(17), a side plate(6a), a plating liquid circulating pipe, a plating liquid discharging pipe(9), a bottom plate, and a shielding box(12). A collaboration square aperture(15) is formed on the front plate and the back plate. The both sides of the back plate and the front plate are closed to the side plate.

Description

도금설비의 인쇄회로기판용 차폐구조{Mask structure for PCB of plating equipment}Mask structure for PCB of plating equipment

본 발명은 인쇄회로기판 도금 작업시 이 인쇄회로기판에 전기 전도성 저하로 야기되는 도금편차를 줄이면서 도금되는 인쇄회로기판의 전류 흐름을 일정하게 유지시킴에 따라 양질의 도금이 얻어지고 생산성 향상을 도모하는 도금설비의 인쇄회로기판용 차폐구조에 관한 것이다.The present invention maintains the current flow of the printed circuit board to be plated while reducing the plating deviation caused by lowering the electrical conductivity in the printed circuit board plating operation, thereby achieving high quality plating and improving productivity. It relates to a shielding structure for a printed circuit board of the plating equipment.

주지된 바와 같이 인쇄회로기판 도금 공정시 행거의 클램프에 물리어 도금조로 이송 운반되는 인쇄회로기판은 도금액이 담겨진 도금조에 침지되어 금, 은, 동, 니켈 등이 도금되어 지는데, 행거의 클램프를 매개로 통전되는 전류가 인쇄회로기판에 고루 전도되지 않고 고전류와 저전류 전기 전도성의 편차를 갖게 되며, 이러한 전기 전도성 편차는 도금되는 인쇄회로기판의 도금편차를 야기하게 된다.As is well known, a printed circuit board, which is clamped to a hanger clamp and transported to a plating bath during a printed circuit board plating process, is immersed in a plating bath containing a plating solution and plated with gold, silver, copper, nickel, and the like. The current supplied to the circuit board does not conduct evenly to the printed circuit board, and there is a deviation between the high current and the low current electrical conductivity, which causes the plating deviation of the printed circuit board to be plated.

한편, 종래에도 상기와 같이 도금액에 침지되어 도금되는 인쇄회로기판의 통전되는 전기 전도성 편차를 제거하여 균일한 도금이 이루어지도록 본 출원인에 의해 등록실용신안 제389,466호로 제안되었는바, 즉 도 4와 같은 차폐판(4, 5 ; Mask plate)을 도금하는 인쇄회로기판의 전후면에 각각 설치하였는바, 이러한 종래 차폐 판(4,5)은 인쇄회로기판 보다 약간 큰 사각형 판으로서 주변 테두리(3)는 막혀있고 중앙부분 쪽으로 도금액 안내구멍(2)들이 반복적으로 다수 개 형성되어 있었다.On the other hand, conventionally proposed by the applicant of the Utility Model No. 389,466 to remove the electrical conductivity deviation of the printed circuit board immersed in the plating solution as described above to achieve uniform plating, that is, as shown in FIG. Barrier plates (4, 5; mask plates) are respectively installed on the front and rear surfaces of the printed circuit board, the conventional shield plate (4, 5) is a slightly larger rectangular plate than the printed circuit board, the peripheral edge (3) It was clogged and many plating liquid guide holes 2 were repeatedly formed toward the center part.

그러나 종래 차폐판(4,5)은 전류의 흐름을 일정한 방향성으로 부여하지 않을 뿐만 아니라, 전류제어도 이루어지지 않아서 결국 인쇄회로기판 도금시 도금편차를 야기하여 도금 균일성을 악화시키면서 생산성을 저하시키는 문제점을 지니고 있었다.However, the conventional shielding plates 4 and 5 not only impart a current flow in a constant direction, but also do not control current, resulting in plating deviation when plating a printed circuit board, thereby degrading plating uniformity and degrading productivity. Had.

이에 본 발명은 상기와 같은 종래 문제점을 감안하여 제안된 것으로, 인쇄회로기판 도금시 도금편차를 줄이기 위해 도금액에서 인쇄회로기판을 박스형으로 감싸고 인쇄회로기판에 도금액 토출과 공기교환이 이루어지는 도금설비의 인쇄회로기판용 차폐구조를 제공함에 그 목적이 있다.Accordingly, the present invention has been proposed in view of the above-described conventional problems, and in order to reduce the plating deviation during plating of a printed circuit board, the printed circuit board is wrapped in a plating solution in a plating solution and the plating equipment is discharged and air exchanged is printed on the printed circuit board. It is an object of the present invention to provide a shield structure for a circuit board.

상기와 같은 목적을 달성하기 위한 본 발명은 캐리어 바아를 따라 현가 설치되는 행거의 클램프에 물려 있는 인쇄회로기판이 도금액에 침지되어 통전되는 전류에 의해 금속도금이 이루어질 때 이 인쇄회로기판의 전기 전도성 균일화를 위해 인쇄회로기판의 전후면에는 다수의 도금액 안내구멍들을 갖추고 이 다수의 도금액 안내구멍들을 감싸는 주변 테두리가 막혀 있는 전후면 차폐판들이 이격 설치되는 도금설비의 인쇄회로기판용 차페구조에 있어서, 상기 인쇄회로기판의 전후면에 이격 배치되는 전면 차폐판과 후면 차폐판 앞에는 공동 사각구멍을 갖춘 전면판과 후면판이 배치되고, 이 전면판과 후면판의 양쪽 측면을 측면판으로 폐쇄시키고, 이 전면판과 후면판 및 양쪽 측면판의 저면에는 도금액 순환배관과 공기배관에 각각 연결되는 도금액 토출관과 공개배출관을 갖춘 하부판이 설치되어 상부가 개방된 박스형 형태로 되어 있다.The present invention for achieving the above object is the uniformity of the electrical conductivity of the printed circuit board when the metal plate is made by a current that is immersed in the plating solution is energized by the clamp of the hanger is installed along the carrier bar In the shielding structure for the printed circuit board of the plating equipment in which the front and rear surfaces of the printed circuit board is provided with a plurality of plating solution guide holes are spaced apart from the front and rear shielding shields surrounding the plurality of plating solution guide holes. In front of the front and rear shields, which are spaced apart from the front and rear sides of the printed circuit board, front and rear panels with a common square hole are disposed, and both sides of the front and rear panels are closed by side plates. The plating liquid connected to the plating liquid circulation pipe and the air pipe at the bottom of the rear plate and the side plates. The lower plate equipped with the public chulgwan discharge pipe is provided is in the open top box-shaped form.

상기와 같이 본 발명에 따른 도금설비의 인쇄회로기판용 차폐구조는 종래 판 형태의 차폐구조에 비하여 통전되는 전류의 흐름을 일정하게 유지시킬 수 있어서 도금되는 인쇄회로기판의 도금품질을 향상시키고, 인쇄회로기판 쪽으로 도금액과 공기교반이 집중으로 작용하여 보다 양호한 도금품질을 얻을 수 있는 효과를 지닌다.As described above, the shielding structure for a printed circuit board of a plating apparatus according to the present invention can maintain a constant current flow as compared with the shielding structure of a conventional plate form to improve the plating quality of the printed circuit board to be plated, and to print The plating solution and air agitation are concentrated toward the circuit board, and thus the plating quality is better.

이하, 본 발명을 첨부된 예시도면에 의거 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명에 따른 인쇄회로기판용 차폐박스가 요동바에 설치된 상태를 보여주는 설치상태 사시도이고, 도 2는 도 1의 Ⅰ-Ⅰ 단면도이며, 도 3은 본 발명에 따른 인쇄회로기판용 차폐구조의 분리 사시도이다.1 is a perspective view showing a state in which a shielding box for a printed circuit board according to the present invention is installed on a rocking bar, Figure 2 is a cross-sectional view of the I-I of Figure 1, Figure 3 is a shielding structure for a printed circuit board according to the present invention Is a perspective view of the separation.

본 발명은 인쇄회로기판(1)을 도금조의 도금액에 침지시키고 도금액에 침지된 인쇄회로기판(1)에 전류를 통전시키어 금, 은, 구리, 니켈 같은 금속으로 도금시킬 때 도금액에 침지된 인쇄회로기판(1)의 전반으로 전류흐름 전도성을 균일하게 유지시키어 도금편차를 감소시키는 인쇄회로기판용 차폐박스로서, 인쇄회로기판(1)의 전후면에는 다수의 도금액 안내구멍(2)을 갖추고 이 다수의 도금액 안내구멍(2)들을 감싸는 주변 테두리(3)가 막혀 있는 전후면 차폐판(4,5)들이 이격 배치되는 도금설비의 인쇄회로기판용 차폐구조에 있어서, 상기 인쇄회로기판(1)의 전후면에 이격 배치되는 전면 차폐판(4)과 후면 차폐판(5) 앞에는 공동 사각구멍(15)을 갖춘 전면판(16)과 후면판(17)이 배치되고, 이 전면판(16)과 후면판(17)의 양쪽 측면을 측면판(6a,6b)으로 폐쇄시키고, 이 전후면 차폐판(4,5)들과 양쪽 측면판(6a,6b)들의 저면에는 도금액 순환배관(7)과 공기배관(8)에 각각 연결되는 도금액 토출관(9) 과 공기 배출관(10)을 갖춘 하부판(11)이 설치되어 상부가 개방된 차폐박스(12) 형태로 이루어진 차폐구조를 갖는다.The present invention is a printed circuit immersed in the plating solution when the printed circuit board 1 is immersed in the plating solution of the plating bath and the current is supplied to the printed circuit board 1 immersed in the plating solution to plate with a metal such as gold, silver, copper, nickel A shielding box for a printed circuit board which reduces the plating deviation by maintaining the current flow conductivity uniformly throughout the substrate 1, wherein the front and rear surfaces of the printed circuit board 1 include a plurality of plating solution guide holes 2 In a shielding structure for a printed circuit board of a plating facility, in which the front and rear shield plates 4 and 5 with the peripheral edges 3 surrounding the plating liquid guide holes 2 are blocked, are disposed. In front of the front shielding plate 4 and the rear shielding plate 5 which are spaced apart from the front and rear surfaces, a front plate 16 and a rear plate 17 having a common square hole 15 are disposed, and the front plate 16 and Close both sides of the backplane 17 with side panels 6a, 6b, Plating liquid discharge pipes 9 and air discharge pipes 10 connected to the plating liquid circulation pipes 7 and the air pipes 8 are respectively disposed on the bottom surfaces of the front and rear shield plates 4 and 5 and both side plates 6a and 6b. Has a shielding structure formed in the form of a shielding box 12 having an upper portion open to the lower plate 11.

즉, 본 발명에 따른 인쇄회로기판용 차폐구조는 상부가 개방되고 전후면 쪽으로는 공동 사각구멍(15)을 갖춘 전후면판(4,5)들로 개방되어 있으면서 좌우측과 저면은 양쪽 측면판(6a,6b)들과 하부판(11)으로 폐쇄되어 있다.That is, the shielding structure for a printed circuit board according to the present invention is open to the front and rear face plates (4, 5) having an open top and a common square hole (15) toward the front and rear sides, while the left and right sides and the bottom face are both side plates (6a). 6b) and the lower plate 11 are closed.

이와 같이 상부와 전후면이 개방된 박스형 차폐구조는 도 1에 도시된 바와 같이 요동바 새들(13)을 갖춘 양쪽 요동바(14a,14b)에 본 발명에 따른 박스형 차폐구조체의 양쪽 측면판(6a,6b)이 연결되어 횡방향(화살표 방향)으로 요동되는데, 상기 요동바(14a,14b)들은 도면에 도시하지 않은 공지의 요동 구동수단에 의해 요동된다.As described above, the box-shaped shield structure having the upper and front and rear surfaces is open to both side bars 6a of the box-shaped shield structure according to the present invention on both rocking bars 14a and 14b having rocking bar saddles 13 as shown in FIG. And 6b) are coupled and oscillated in the lateral direction (arrow direction), wherein the oscillation bars 14a and 14b are oscillated by a known oscillation drive means not shown in the drawing.

이어 본 발명의 작용을 설명하면, 공지의 도금액이 담겨진 도금조에 도금할 인쇄회로기판(1)들이 공지의 행거에 현가되어 이동 침지될 때 상기 차폐박스(12)의 개방된 상부를 통하여 침지되며, 각각의 인쇄회로기판(1)들은, 예를 들어 도 1에서 4개가 일렬로 배치되어 침지되는데, 차폐박스(12)의 전후면에 배치되는 전후면판(4,5)들에 형성된 다수 개의 공동 사각구멍(15)들이 4개로 분리되어 형성되어 있지만, 필요에 따라 이를 복수 개 이상 분리시키어 형성시킬 수 있으며, 이때에는 복수 개로 분리된 공동 사각구멍(15)들에 맞추어 도금할 인쇄회로기판(1)들의 개수를 맞출 수 있음은 물론이다.Next, when explaining the operation of the present invention, the printed circuit board 1 to be plated in the plating bath containing the known plating solution is immersed through the open upper portion of the shielding box 12 when the suspension is moved and immersed in a known hanger, Each of the printed circuit boards 1 is, for example, immersed in four in a row arranged in Figure 1, a plurality of common square formed on the front and back plates (4, 5) arranged on the front and rear surfaces of the shield box 12 Although the holes 15 are separated into four, they can be formed by separating a plurality of them as necessary, and in this case, the printed circuit board 1 to be plated in accordance with the plurality of divided hollow square holes 15. Of course, the number of them can be adjusted.

이어 상기 차폐박스(12) 내부로 투입된 인쇄회로기판(1)은 도 2에 도시된 바와 같이 전후면 차폐판(4,5)들과 전후면판(16,17) 하부판(11) 사이에 이격되어 도 금액에 침지된 상태를 유지하게 되면서 행거를 통해 통전되는 전류에 의해 금속도금이 이루어질 때 이 하부판(11)에 설치된 도금액 토출관(9)과 공기 배출관(10)을 통하여 배출되는 도금액과 공기교반으로 인하여 순환되는 도금액에 의해 원활한 도금이 이루어질 뿐만 아니라, 상기 차폐박스(12)가 요동바(14a,14b)들에 의해 횡방향으로, 즉 배치되는 인쇄회로기판들(1)의 폭방향으로 요동됨으로써 공기교반과 도금액 순환을 도와 양질의 도금이 이루어지도록 작용하게 된다.Subsequently, the printed circuit board 1 introduced into the shielding box 12 is spaced apart between the front and rear shielding plates 4 and 5 and the lower plate 11 of the front and rear plates 16 and 17 as shown in FIG. 2. The plating liquid and air agitated through the plating liquid discharge pipe 9 and the air discharge pipe 10 installed in the lower plate 11 when the metal plating is made by the electric current flowing through the hanger while maintaining the state immersed in the liquid drawing amount Not only smooth plating is performed by the plating liquid circulated due to this, but the shielding box 12 is swinged in the transverse direction by the swing bars 14a and 14b, that is, in the width direction of the printed circuit boards 1. By doing so, the air stirring and the circulation of the plating solution are helped to achieve high quality plating.

도 1은 본 발명에 따른 인쇄회로기판용 차폐박스가 요동바에 설치된 상태를 보여주는 설치상태 사시도,1 is a perspective view showing a state in which a shielding box for a printed circuit board according to the present invention is installed in a rocking bar;

도 2는 도 1의 -선 단면도,FIG. 2 is a cross-sectional view of FIG. 1;

도 3은 본 발명에 따른 인쇄회로기판용 차폐박스의 분리 사시도,3 is an exploded perspective view of a shielding box for a printed circuit board according to the present invention;

도 4는 종래 인쇄회로기판용 차폐판의 정면도이다.4 is a front view of a conventional shield for a printed circuit board.

- 도면의 주요부분에 대한 부호의 설명 --Explanation of symbols for the main parts of the drawings-

1 : 인쇄회로기판, 2 : 도금액 안내구멍,1: printed circuit board, 2: plating solution guide hole,

3 : 테두리, 4 : 전면 차폐판,3: border, 4: front shield,

5 : 후면 차폐판, 6a,6b : 측면판,5: rear shield, 6a, 6b: side panel,

7 : 도금액 순환배관, 8 : 공기배관,7: plating solution circulation piping, 8: air piping,

9 : 도금액 토출관, 10 : 공기 배출관,9: plating liquid discharge tube, 10: air discharge tube,

11 : 하부판, 12 : 차폐박스,11: lower plate, 12: shielding box,

13 : 요동바 새들, 14a,14b : 요동바,13: rocking bar birds, 14a, 14b: rocking bar,

15 : 공동 사각구멍, 16 : 전면판,15: cavity square hole, 16: front panel,

17 : 후면판.17: Backplane.

Claims (2)

인쇄회로기판(1)의 전후면에는 다수의 도금액 안내구멍(2)을 갖추고 이 다수의 도금액 안내구멍(2)들을 감싸는 주변 테두리(3)와 막혀 있는 전후면 차폐판(4,5)들이 이격 배치되는 도금설비의 인쇄회로기판용 차폐구조에 있어서,The front and rear surfaces of the printed circuit board 1 are provided with a plurality of plating liquid guide holes 2, and the peripheral edge 3 surrounding the plurality of plating liquid guide holes 2 and the closed front and rear shield plates 4 and 5 are separated from each other. In the shielding structure for the printed circuit board of the plating equipment arranged, 상기 인쇄회로기판(1)의 전후면에 이격 배치되는 전면 차폐판(4)과 후면 차폐판(5) 앞에서 공동 사각구멍(15)을 갖춘 전면판(16)과 후면판(17)이 배치되고, 이 전면판(16)과 후면판(17)의 양쪽 측면을 측면판(6a,6b)으로 폐쇄시키고, 이 전후면 차폐판(4,5)들과 양쪽 측면판(6a,6b)들의 저면에는 도금액 순환배관(7)과 공기배관(8)에 각각 연결되는 도금액 토출관(9)과 공기 배출관(10)을 갖춘 하부판(11)이 설치되어 상부가 개방된 차폐박스(12) 형태로 이루어진 것을 특징으로 하는 도금설비의 인쇄회로기판용 차폐구조.The front plate 16 and the rear plate 17 having the common square hole 15 are disposed in front of the front shielding plate 4 and the rear shielding plate 5 which are spaced apart from the front and rear surfaces of the printed circuit board 1. Both sides of the front plate 16 and the rear plate 17 are closed by side plates 6a and 6b, and the front and rear shield plates 4 and 5 and the bottom surfaces of both side plates 6a and 6b. The lower plate 11 is provided with a plating liquid discharge pipe 9 and an air discharge pipe 10 connected to the plating liquid circulation pipe 7 and the air pipe 8, respectively, and formed in the form of a shield box 12 having an open top. Shielding structure for a printed circuit board of the plating equipment, characterized in that. 제 1항에 있어서,The method of claim 1, 상기 차폐박스(12)의 양쪽 측면판(6a,6b)에는 요동바 새들(13)을 갖춘 요동바(14a,14b)가 연결되어 이루어진 것을 특징으로 하는 도금설비의 인쇄회로기판용 차폐구조.Shielding structure for a printed circuit board of a plating facility, characterized in that the side bars (6a, 6b) of the shielding box 12 is connected to the swing bar (14a, 14b) having a rocking bar saddle (13).
KR1020080097233A 2008-10-02 2008-10-02 Mask box structure for PCB of plating equipment KR101135955B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020080097233A KR101135955B1 (en) 2008-10-02 2008-10-02 Mask box structure for PCB of plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080097233A KR101135955B1 (en) 2008-10-02 2008-10-02 Mask box structure for PCB of plating equipment

Publications (2)

Publication Number Publication Date
KR20100037896A true KR20100037896A (en) 2010-04-12
KR101135955B1 KR101135955B1 (en) 2012-04-18

Family

ID=42214947

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080097233A KR101135955B1 (en) 2008-10-02 2008-10-02 Mask box structure for PCB of plating equipment

Country Status (1)

Country Link
KR (1) KR101135955B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102383169A (en) * 2011-10-31 2012-03-21 东莞生益电子有限公司 Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate
EP3929332A1 (en) * 2020-06-25 2021-12-29 Semsysco GmbH Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62175075U (en) * 1986-04-28 1987-11-06
JP2000064088A (en) * 1998-08-11 2000-02-29 Ebara Yuujiraito Kk Plating device of printed circuit board
JP3543737B2 (en) * 2000-06-27 2004-07-21 松下電工株式会社 Plating system for plate-shaped parts

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102383169A (en) * 2011-10-31 2012-03-21 东莞生益电子有限公司 Assistant plate bar of vertical plating line and method for vertical electroplating of PCB plate
EP3929332A1 (en) * 2020-06-25 2021-12-29 Semsysco GmbH Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
WO2021259528A1 (en) * 2020-06-25 2021-12-30 Semsysco Gmbh Shield body system for a process fluid for chemical and/or electrolytic surface treatment of a substrate

Also Published As

Publication number Publication date
KR101135955B1 (en) 2012-04-18

Similar Documents

Publication Publication Date Title
JP6448494B2 (en) Suction plating equipment
JP4700396B2 (en) Printed circuit board plating method
KR20100125487A (en) Mask structure electrode plate box for pcb of plating equipment
JP2009249659A (en) Electroplating device and electroplating method
KR101569185B1 (en) An insoluble anode and apparatus for producing electrolytic copperfoil having the same
KR101135955B1 (en) Mask box structure for PCB of plating equipment
CN105063730A (en) Electroplating roller
EP1438446B1 (en) System and method for electrolytic plating
CN208071833U (en) A kind of Novel electric copper plating groove pontoon bridge
KR101603503B1 (en) Apparatus for Plating using Flood Box in Perpendicular Type coating Printed Circuit Board of Roll to Roll Processing
KR20080111205A (en) Pcb jig-set structure for plating equipment of transfer type
JP6737527B2 (en) Surface treatment equipment
CN203007458U (en) PCB (Printed Circuit Board) electroplating bath with movable cathode
JP2004339590A (en) Surface treatment device
JP2003013291A (en) Plating apparatus
KR20020064483A (en) Continuous horizontal plating line with roller type cathodes
JPH0354887A (en) Method and apparatus for treatment of fine hole in printed board
TWI615510B (en) Suction plating apparatus
TWI404833B (en) Electroplate system and method for using the same
KR200389466Y1 (en) PCB mask structure of plating equipment
KR20200030651A (en) Apparatus For Individual Electroplating For PCB
CN207713852U (en) Controllable screening arrangement for galvanic anode
JP4177902B2 (en) Apparatus for electrolytically treating a plate-shaped workpiece and method for electrically shielding the edge range of the workpiece during electrolytic treatment
CN219342373U (en) Experimental device for simulating PCB electrotinning
JP5279810B2 (en) Flat surface treatment equipment

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20160330

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20170405

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20180405

Year of fee payment: 7