KR20100036192A - Method for producing mold and method for producing anti-glare film - Google Patents

Abstract

PURPOSE: A manufacturing method of a mold and a manufacturing method of a glare-proof film are provided to prevent the degradation of contrast and the generation of glittering by forming a minute concavo-convex shape on the surface of a mold. CONSTITUTION: A copper electroplating or a nickel-plating is executed on the surface(2) of a material(1) for a mold. The surface plated is ground. A light resinous film(3) is formed by spreading a photosensitive resin on the ground side. A pattern is exposed to the light resinous film. The light resinous film exposing the pattern is developed. A concavo-convex is formed in the ground plating surface by etching using the developed film as the mask.

Description

Manufacturing method of mold and manufacturing method of anti-glare film {METHOD FOR PRODUCING MOLD AND METHOD FOR PRODUCING ANTI-GLARE FILM}

TECHNICAL FIELD This invention relates to the manufacturing method of the metal mold | die which has a fine uneven | corrugated shape on the surface, and the method of manufacturing the anti-glare film which is low haze and excellent in anti-glare property using the metal mold | die obtained by the said method.

Image display apparatuses such as a liquid crystal display, a plasma display panel, a cathode ray tube (cathode ray tube: CRT) display, an organic electroluminescence (EL) display, and the like, when the external light is projected on the display surface, visibility is remarkably impaired. In order to prevent such projection of external light, the surface of an image display device has conventionally been used in televisions, personal computers, which focus on image quality, video cameras and digital cameras used outdoors with strong external light, and mobile phones which display using reflected light. The film layer which prevents projection of external light is provided in the inside. This film layer is largely classified into a film made of an antireflective treatment using interference by an optical multilayer film and a film subjected to an antiglare treatment that scatters incident light by applying fine unevenness to the surface to apply a projected image. Among these, the former antireflective film needs to form a multilayer film having a uniform optical film thickness, which is expensive. On the other hand, since the latter anti-glare film can be produced at a relatively low cost, it is widely used for large-scale personal computers, monitors, and the like.

Such anti-glare films are conventionally applied by, for example, a method of forming a random unevenness on a sheet by applying a resin solution obtained by dispersing a filler onto a base sheet, adjusting the coating film thickness and exposing the filler to the coating film surface. Is being manufactured. However, the anti-glare film produced by dispersing such a filler is difficult to obtain the unevenness as intended, because the arrangement and shape of the unevenness depends on the dispersed state, the coated state, and the like of the filler in the resin solution. There was a problem that sufficient anti-glare effect was not obtained. Moreover, when arrange | positioning such a conventional anti-glare film on the surface of an image display apparatus, there existed a problem that what is called "cloudiness" which the whole display surface becomes whitish by a scattered light and a display became a dim color was easy to generate | occur | produce. Moreover, with the recent high precision of image display apparatuses, the so-called "glittering" phenomenon that the surface of the pixel of an image display apparatus and the surface uneven | corrugated shape of an anti-glare film interferes, and a brightness distribution arises and it becomes difficult to see as a result occurs. There was problem to be easy to do.

In addition, in the anti-glare film produced by dispersing the filler, when the refractive index of the filler and the refractive index of the binder resin for dispersing the filler are different, when such an anti-glare film is placed on the surface of the image display device, the filler and the binder resin are There was also a problem that contrast tends to be lowered due to scattering of light at the interface.

On the other hand, there exists an attempt to express anti-glare only by the fine unevenness | corrugation formed in the surface of a transparent resin layer, without containing a filler. For example, Japanese Patent Laid-Open No. 2002-189106 (Patent Document 1) discloses a three-dimensional 10-point average by curing the ionizing radiation curable resin in a state where an ionizing radiation curable resin is sandwiched between an embossed mold and a transparent resin film. The average distance between adjacent convex portions on the roughness and the three-dimensional roughness reference planes each form a fine unevenness that satisfies a predetermined value, and the ionizing radiation curable resin layer on which the unevenness is formed is provided on the transparent resin film. Anti-glare films, such as these are disclosed.

Moreover, using the film in which the fine unevenness | corrugation was formed in the surface as a light-diffusion layer arrange | positioned at the back side of a liquid crystal display device instead of the anti-glare film arrange | positioned at the display surface of a display apparatus is disclosed, for example. 34961 (patent document 2), Unexamined-Japanese-Patent No. 2004-45471 (patent document 3), Unexamined-Japanese-Patent No. 2004-45472 (patent document 4), etc. are disclosed. Among these, Patent Literatures 3 and 4 are filled with an ionizing radiation curable resin liquid in an embossing roll having a shape in which unevenness is inverted as a method of forming unevenness on the surface of the film, and the filled resin in the rotational direction of the roll intaglio. When the transparent base material traveling in synchronization is brought into contact with each other, and the transparent base material contacts the roll intaglio, the resin between the roll intaglio and the transparent base material is cured, and the cured resin and the transparent base material are brought into close contact with each other after curing. The method of peeling a laminated body with a transparent base material from a roll intaglio is disclosed.

However, in the methods disclosed in Patent Documents 3 and 4, the composition of the ionizing radiation curable resin liquid that can be used is limited, and the same leveling as when diluted and applied with a solvent cannot be expected. It is expected that there will be. In addition, in the methods disclosed in Patent Documents 3 and 4, it is necessary to fill the resin liquid directly into the embossed roll intaglio. Therefore, in order to ensure uniformity of the uneven surface, high mechanical precision is required for the embossed roll intaglio, and the embossed roll There was problem that production of was difficult.

Next, as a manufacturing method of the roll used for manufacture of the film which has an unevenness | corrugation on the surface, the patent document 2 mentioned above makes a cylindrical body using a metal etc., for example, an electron engraving, an etching, sandblasting on the surface is carried out. The method of forming an unevenness | corrugation by the technique of these etc. is disclosed. In addition, Japanese Patent Application Laid-Open No. 2004-29240 (Patent Document 5) discloses a method of producing an embossing roll by the bead short method, and Japanese Patent Application Laid-Open No. 2004-90187 (Patent Document 6) discloses an embossing roll. The method of manufacturing an embossing roll is provided through the process of forming a metal plating layer in the surface, the process of mirror-polishing the surface of a metal plating layer, and the process of peening as needed.

However, in the state which blasted the surface of the embossing roll in this way, distribution of the uneven diameter resulting from the particle size distribution of blast particle | grains arises, and it is difficult to control the depth of the recessed part obtained by a blast, There was a problem in obtaining a shape of irregularities having excellent function with good reproducibility.

Further, Patent Document 1 described above preferably describes the formation of an uneven surface by a sand blasting method or a bead shorting method using a roller chromium-plated on the iron surface. Moreover, in order to improve the durability at the time of use, it is preferable to use it after performing chromium plating on the mold surface in which the unevenness | corrugation was formed in this way, and there also mentions that cured film and corrosion prevention can be aimed at by this. On the other hand, in each of the above-described examples of Patent Documents 3 and 4, it is described that the surface of the iron core is chromium plated, the liquid sand blast treatment of # 250 is performed, and then the chromium plating process is performed again to form fine concavo-convex shapes on the surface. have.

However, in the manufacturing method of such an embossing roll, since blasting and shot are performed on chromium plating with high hardness, unevenness | corrugation is hard to form and it was difficult to control the shape of the unevenness | corrugation formed precisely. In addition, as described in Japanese Patent Laid-Open No. 2004-29672 (Patent Document 7), chromium plating is often roughened depending on the underlying material and its shape, and chromium is formed on unevenness formed by blasting. Since fine cracks formed by plating are formed, there is a problem that it is difficult to design what unevenness occurs. Moreover, since there exist the minute crack which arises by chromium plating, there also existed a subject that the scattering characteristic of the finally obtained anti-glare film changes to an undesirable direction. In addition, since the finished roll surface varies in various ways by the combination of the material of the embossed roll base material surface and the plated species, in order to obtain the required surface irregularities with good accuracy, the appropriate roll surface material and the appropriate plated species are obtained. There was also a problem that must be selected. Moreover, even if the required surface asperity shape was obtained, the durability at the time of use may become inadequate depending on the plated species.

Japanese Unexamined Patent Publication No. 2000-284106 (Patent Document 8) discloses performing a sand blasting process on a substrate and then performing an etching process and / or a lamination process of a thin film, but providing a metal plating layer before the sand blast process. Neither description nor suggestion is given. In addition, Japanese Patent Laid-Open No. 2006-53371 (Patent Document 9) describes that after polishing a substrate to perform sand blasting, electroless nickel plating is performed. In addition, Japanese Patent Application Laid-Open No. 2007-187952 (Patent Document 10) discloses that a substrate is subjected to copper plating or nickel plating, then polished, sandblasted, and then chrome plated to produce an embossed plate. In addition, Japanese Unexamined Patent Publication No. 2007-237541 (Patent Document 11) discloses chromium plating after copper plating or nickel plating, followed by polishing and sandblasting, followed by an etching process or a copper plating process. It is described to produce an embossed plate by carrying out. In the manufacturing method using these sand blasting processes, it is difficult to form the surface irregularities in a precisely controlled state, so that a relatively large irregular shape having a period of 50 µm or more in the surface irregularities is also produced. As a result, there existed a problem that these so-called uneven | corrugated shapes and so-called glittering which a pixel of an image display apparatus interferes and a luminance distribution generate | occur | produce easily become difficult to produce.

<Start of invention>

The present invention provides a method for producing a mold having a fine concavo-convex shape on the surface, which is useful for the production of an anti-glare film exhibiting a high anti-glare function, and also exhibits excellent anti-glare function using the mold, while sufficiently preventing visibility deterioration due to cloudiness. It is an object of the present invention to provide a method for producing an antiglare film in which no glittering occurs and the contrast does not decrease when disposed on the surface of a high-precision image display device.

In addition, the present invention also employs chromium plating excellent in hardness, surface gloss, and the like as the plating on the surface of the mold, while producing a mold suitable for the production of an antiglare film without producing roughness on the surface of the chromium plating. It is another object to produce an antiglare film that exhibits excellent antiglare function.

The manufacturing method of the metal mold | die of this invention is a 1st plating process which performs copper plating or nickel plating on the surface of the base material for metal mold | die, the grinding | polishing process of grinding | polishing the surface by which the plating was performed by the 1st plating process, and the polished surface The photosensitive resin film forming process of apply | coating a photosensitive resin film | membrane film formation, the exposure process of exposing a pattern on a photosensitive resin film, the developing process of developing the photosensitive resin film by which the pattern was exposed, and the developed photosensitive resin film were used as a mask. An etching step of forming irregularities on the polished plated surface by performing an etching process, and a second plating step of applying chromium plating on the uneven surface formed by the etching step, wherein the etching step is performed on the entire surface of the mold substrate It is characterized by performing a process.

Here, the etching process on the whole surface of a metal mold | die base material means performing the etching process on the whole surface containing the area | region covered with the said mask in the metal mold | die base material. In the process of an etching process, the area | region not normally covered with the mask is etched first, and also the area | region covered with the mask is etched with subsequent process progress.

In the manufacturing method of the metal mold | die of this invention, the said etching process uses the developed photosensitive resin film as a mask, and uneven | corrugated plating surface polished by performing an etching process to the whole surface containing the area | region covered with the said mask in the base material for metal mold | die It is an aspect which is preferable in the process of forming a (Hereinafter, it may be called manufacturing method A of a metal mold | die).

In addition, when performing the etching process on the whole surface of a metal mold | die base material, etching is complete | finished once before all of the area | region covered with a mask is etched, and etching is performed once again after peeling a mask, and as a result, it etches on the whole metal substrate surface as a result. Processing can also be performed.

In the manufacturing method of the metal mold | die of this invention, the said etching process uses the developed photosensitive resin film as a mask, and performs the etching process, The 1st etching process which forms an unevenness | corrugation on the polished plating surface, and the photosensitive resin which peels off the photosensitive resin film It is another preferable aspect to include the film peeling process and the 2nd etching process which dulls the uneven surface formed by the 1st etching process after peeling a photosensitive resin film completely by an etching process (when manufacturing method B of a mold). There).

In the manufacturing method of the metal mold | die of this invention, it is preferable that the etching amount in an etching process is 2-100 micrometers.

It is preferable that the etching amount in the 1st etching process in the manufacturing method B of the metal mold | die of this invention is 1-50 micrometers.

It is preferable that the etching amount in the 2nd etching process in the manufacturing method B of the metal mold | die of this invention is 1-50 micrometers.

In the manufacturing method of the metal mold | die of this invention, it is preferable that pattern exposure on the photosensitive resin film in an exposure process is performed by drawing the pattern data created on the computer by the laser beam emitted from a computer-controlled laser head.

In the manufacturing method of the metal mold | die of this invention, the projected area on the surface of the metal mold | die base material of the photosensitive resin film (Hereinafter, the photosensitive resin film remaining without melt | dissolution after image development is called a "mask.") Is a base material for metal mold | die. It is preferable that it is 1 to 70% with respect to the area of the area | region in which the surface asperity shape is formed in the surface.

In the manufacturing method of the metal mold | die of this invention, it is preferable that the standard deviation of the projection area of the mask to the metal mold | die base material surface in the area | region of 100 micrometers x 100 micrometers of the metal substrate surface is 1000 micrometer <^2> or less.

In the manufacturing method of the metal mold | die of this invention, after performing chromium plating, it is preferable to use a chromium plating surface as an uneven surface of a metal mold as it is, without grind | polishing the surface.

In the manufacturing method of the metal mold | die of this invention, it is also preferable that the chromium plating layer formed by chromium plating has a thickness of 1-10 micrometers.

This invention also includes the process of transferring the uneven surface of the metal mold | die manufactured by the manufacturing method of the metal mold | die of the present invention mentioned above to a transparent resin film, and the process of peeling the transparent resin film from which the uneven surface of the metal mold | die was transferred from the metal mold | die. It also provides about the manufacturing method of the anti-glare film.

According to the manufacturing method of the metal mold | die of this invention, since the fine uneven | corrugated shape is formed in the surface with good precision, the metal mold | die useful for manufacture of the anti-glare film which shows high anti-glare function is manufactured with favorable reproducibility, and almost no defect exists. can do. Moreover, according to the manufacturing method of the anti-glare film of this invention, anti-glare film which is low in haze, and excellent in anti-glare performance, such as anti-projection, anti-reflection, suppression of cloudiness, prevention of glittering prevention, contrast reduction, etc., maintaining the brightness of a display image. Can be produced industrially advantageously.

<Mode for carrying out the invention>

<Method of manufacturing mold>

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically a preferable example of the first half part of the manufacturing method of the metal mold | die of this invention.

1, the cross section of the metal mold | die in each process is shown typically. The first half part of the manufacturing method of the metal mold | die of this invention contains a [1] 1st plating process, [2] grinding | polishing process, [3] photosensitive resin film formation process, and [4] exposure process fundamentally. Hereinafter, each process of the first half part of the manufacturing method of the metal mold | die of this invention is demonstrated in detail, referring FIG.

[1] first plating processes

In the manufacturing method of the metal mold | die of this invention, first, copper plating or nickel plating is given to the surface of the base material used for a metal mold | die. Thus, by performing copper plating or nickel plating on the surface of the base material for metal mold | die, the adhesiveness and glossiness of chromium plating in a subsequent 2nd plating process can be improved. That is, as described above as a background art, when chromium plating is performed on the surface of iron or the like, or when chromium plating is performed again after the unevenness is formed on the surface of the chromium plating by a sand blasting method or a bead short method, etc. It becomes easy to be rough, a minute crack arises, and the uneven shape of the mold surface becomes difficult to control. On the other hand, this problem can be eliminated by giving copper plating or nickel plating to the surface of a base material first. This is because copper plating or nickel plating has a high coating property and a strong smoothing action, so that minute unevenness or cavity of the base material for a mold is embedded to form a flat and glossy surface. By the characteristics of these copper plating or nickel plating, even if chromium plating is performed in the 2nd plating process mentioned later, the roughness of the chromium plating surface considered to originate in the micro unevenness and cavity which existed in the base material is eliminated, In addition, since the coating property of copper plating or nickel plating is strong, the occurrence of fine cracks is reduced.

The copper or nickel used in the first plating step may be not only pure metals, but also copper-based alloys or nickel-based alloys. Thus, "copper" as used herein refers to copper and It is a meaning containing a copper alloy, and "nickel" is a meaning containing nickel and a nickel alloy. Copper plating and nickel plating may be performed by electrolytic plating or electroless plating, respectively, but electrolytic plating is usually employed.

When carrying out copper plating or nickel plating, if the plating layer is too thin, since the influence of the base surface cannot be excluded, the thickness thereof is preferably 50 µm or more. The upper limit of the thickness of the plating layer is not critical, but is generally sufficient to about 500 μm because of the balance with the cost.

Moreover, in the manufacturing method of the metal mold | die of this invention, as a metal material preferably used for formation of a base material, aluminum, iron, etc. are mentioned from a cost viewpoint. Moreover, lightweight aluminum is more preferable from the convenience of handling. In addition to the aluminum and the railway, the metal may not only be a pure metal, but also an alloy mainly composed of aluminum or iron.

In addition, the shape of a base material will not be restrict | limited in particular, if it is a suitable shape conventionally employ | adopted in the said field | area, A flat form may be sufficient, and a cylindrical or cylindrical roll may be sufficient as it. When a metal mold | die is produced using roll base material, there exists an advantage that an anti-glare film can be manufactured in continuous roll shape.

[2] polishing processes

In the polishing process, the surface of the substrate on which copper plating or nickel plating is performed in the above-described first plating process is polished. Through the above steps, the substrate surface is preferably polished in a state close to the mirror surface. This is because the metal plate or the metal roll serving as the base material is often subjected to machining, such as cutting or grinding, in order to achieve a desired precision, and thus processing scratches remain on the surface of the base material, and copper plating or nickel plating is performed. This is because even in the state, these processing scratches may be left and the surface may not be completely smoothed in the plated state. That is, even if the process described later is performed on the surface where such deep processing scratches and the like remain, the irregularities such as processing scratches may be deeper than the irregularities formed after each process, and there is a possibility that the influence of processing scratches and the like remains. When manufacturing an anti-glare film using such a metal mold | die, it may have an unexpected effect on an optical characteristic. In Fig. 1 (a), the plate-like base material 1 is subjected to copper plating or nickel plating on its surface in the first plating process (not shown for the layer of copper plating or nickel plating formed in the process). Moreover, the state which had the mirror-polished surface 2 by the grinding | polishing process is shown typically.

The method for polishing the surface of the substrate subjected to copper plating or nickel plating is not particularly limited, and any mechanical polishing method, electrolytic polishing method or chemical polishing method can be used. Examples of the mechanical polishing method include a super speed completion method, a lapping, a fluid polishing method, a buff polishing method, and the like. As for the surface roughness after grinding | polishing, it is preferable that center line average roughness Ra based on the specification of JISB0601 is 0.1 micrometer or less, and it is more preferable that it is 0.05 micrometer or less. If the centerline average roughness Ra after polishing is larger than 0.1 µm, it is not preferable because the influence of the surface roughness after polishing may remain on the uneven shape of the final mold surface. The lower limit of the center line average roughness Ra is not particularly limited, and since there is a limit in terms of processing time and processing cost, there is no need to specify it in particular.

[3] photosensitive resin film forming processes

In the photosensitive resin film formation process, the photosensitive resin film is formed by apply | coating as a solution which melt | dissolved photosensitive resin in the solvent, and heating and drying it to the surface 2 of the base material 1 which performed mirror polishing by the above-mentioned grinding | polishing process. In FIG.1 (b), the state in which the photosensitive resin film 3 was formed in the surface 2 of the base material 1 is shown typically.

As the photosensitive resin, a conventionally known photosensitive resin can be used. For example, as a negative photosensitive resin which has the property which a photosensitive part hardens | cures, the monomer and prepolymer of an acrylic acid ester which has an acryl group or a methacryl group in a molecule | numerator, a mixture of bis azide and diene rubber, and a polyvinyl cinnamate system Compounds and the like can be used. Moreover, a phenol resin type, a novolak resin type, etc. can be used as positive type photosensitive resin which has the property which a photosensitive part elutes by development and only an unphotosensitive part remains. Moreover, you may mix | blend various additives, such as a sensitizer, a development promoter, an adhesive modifier, and a coating property improving agent, with photosensitive resin as needed.

When applying these photosensitive resins to the surface 2 of the base material 1, in order to form a favorable coating film, it is preferable to dilute and apply in a suitable solvent, and it is a cellosolve solvent, a propylene glycol solvent, ester solvent, alcohol Solvents, ketone solvents, high polar solvents and the like can be used.

As a method of applying the photosensitive resin solution, known methods such as meniscus coating, fountain coating, dip coating, rotary coating, roll coating, wire bar coating, air knife coating, blade coating and curtain coating can be used. It is preferable to make the thickness of a coating film into the range of 1-6 micrometers after drying.

[4] exposure steps

In an exposure process, a predetermined pattern is exposed on the photosensitive resin film 3 formed in the photosensitive resin film formation process mentioned above. The light source used in the exposure process can be appropriately selected according to the photosensitive wavelength, sensitivity, etc. of the coated photosensitive resin. For example, g-rays of high-pressure mercury lamp (wavelength: 436 nm), h-rays of high-pressure mercury lamp (wavelength: 405 nm) I-ray of high pressure mercury lamp (wavelength: 365 nm), semiconductor laser (wavelength: 830 nm, 532 nm, 488 nm, 405 nm, etc.), YAG laser (wavelength: 1064 nm), KrF excimer laser (wavelength: 248 nm) , ArF excimer laser (wavelength: 193 nm), F ₂ excimer laser (wavelength: 157 nm) and the like can be used.

In the manufacturing method of the metal mold | die of this invention, in order to form surface uneven | corrugated shape with favorable precision, it is preferable to expose a predetermined pattern in the state controlled precisely on the photosensitive resin film in an exposure process. In the manufacturing method of the metal mold | die of this invention, in order to expose a predetermined | prescribed pattern on a photosensitive resin film with favorable precision, pattern data is created on a computer, and the pattern based on the pattern data is made from the computer-controlled laser head. It is preferable to draw by laser light which emits. When performing such laser drawing, the laser drawing apparatus for printing plate manufacture can be used. As such a laser drawing apparatus, Laser Stream FX (made by Sync Lab Laboratories) etc. are mentioned, for example.

In FIG.1 (c), the state which the pattern was exposed to the photosensitive resin film 3 is typically shown. When the photosensitive resin film is formed of negative photosensitive resin, crosslinking reaction of resin advances by exposure in light, and the solubility with respect to the developing solution mentioned later falls. Therefore, the area | region 5 which was not exposed in the image development process is melt | dissolved with a developing solution, and only the exposed area | region 4 remains on a surface of a base material, and becomes a mask. On the other hand, when the photosensitive resin film is formed of positive photosensitive resin, the bond of resin is cut | disconnected by the exposure in the exposed area | region 4, and the solubility to the developing solution mentioned later increases. Therefore, the area | region 4 exposed at the image development process is melt | dissolved by the developing solution, and only the unexposed area | region 5 remains on a surface of a base material and becomes a mask.

Here, the projection area of the area | region to which the photosensitive resin film is exposed to the surface of the metal mold | die base material is M, and the area of the area | region in which the surface asperity shape is formed in the surface of a metal mold | die base material is T. When using a negative photosensitive resin for a photosensitive resin film, it is preferable to manufacture and expose a pattern so that ratio M / T may be 0.01-0.7. In addition, when using positive photosensitive resin for a photosensitive resin film, it is preferable to manufacture and expose a pattern so that ratio (1-M) / T may be 0.01-0.7. By manufacturing and exposing a pattern in such a ratio, the projection area of a mask to the surface of a metal mold | die base material can be made into 1 to 70% with respect to the area of the area | region in which the surface asperity shape is formed in the surface of a metal mold | die base material. In FIG. 2, the state which the pattern was exposed to the photosensitive resin film observed from the upper surface of the base material surface for metal mold | die is typically shown. The sum of the areas of the exposed areas 4 is M, and the sum of the areas of the exposed areas 4 and the unexposed areas 5 is T.

Moreover, when the projection area of the photosensitive resin film in the area | region of 100 micrometer x 100 micrometer of the surface of a metal mold | die base material to the metal mold | die base material surface is M100, it is preferable that the standard deviation of M100 is 1000 micrometer <^2> or less. By producing and exposing a pattern with a computer, the standard deviation of the projection area of the mask on the surface of the mold base material in the region of 100 μm × 100 μm of the surface of the mold base material can be 1000 μm ² or less. Here, the standard deviation of M100 can be calculated by obtaining the area M100 exposed in an area of 100 μm × 100 μm with respect to the pattern at three or more different points. In calculating the standard deviation of M100, in order to reduce the error, it is preferable to obtain the area M100 exposed in an area of 100 µm x 100 µm with respect to the pattern at five or more points.

The shape of the pattern to be drawn by the exposure is not particularly limited, and the arrangement of patterns such as circles, squares, hexagons, and the like may be drawn, a continuous pattern may be drawn, or a combination of these may be drawn. Moreover, what arrange | positioned patterns, such as a circle | round | yen, a square, a hexagon, etc. of a different size can also be drawn. In addition, the pattern to draw may be arrange | positioned regularly and may be arrange | positioned irregularly. 2, 3 and 4 schematically show an arrangement of circular patterns. Among them, FIG. 3 schematically shows an arrangement of three different circular patterns, and FIG. 4 schematically shows an irregular arrangement of circular patterns. In addition, in FIG. 5, the rectangular pattern was arrange | positioned, the hexagonal pattern was arrange | positioned in FIG. 6, and the circular pattern was arrange | positioned in FIG. 7, and the continuous pattern was drawn typically.

In the latter part of the manufacturing method of the metal mold | die of this invention, the image development process which develops the photosensitive resin film to which the pattern was exposed, and the etching process which forms an unevenness | corrugation on the polished plating surface by performing an etching process using the developed photosensitive resin film as a mask. And the 2nd plating process which performs chromium plating on the uneven surface formed by the etching process is performed. However, in the said etching process, an etching process is given to the whole surface of a base material for metal molds. Here, the etching process on the whole surface of a metal mold | die base material means performing an etching process on the whole surface containing the area | region covered with the said mask in the metal mold base material.

In the process of an etching process, the area | region not covered with a mask is etched first, and even the area | region covered with a mask is etched with subsequent process progress. In the manufacturing method A of the metal mold | die mentioned as one aspect of the manufacturing method of the metal mold | die of this invention, this is used. That is, in the manufacturing method A of the metal mold | die of this invention, the said etching process was grind | polished by carrying out the etching process to the whole surface containing the area | region covered with the said mask in the base material for metal molds using the developed photosensitive resin film as a mask. It is a process of forming irregularities on the plated surface.

In addition, the said etching process may be comprised by one etching process like the manufacturing method A of a metal mold | die, it is comprised by the process of performing an etching process in 2 or more times, and removing the said mask between these etching processes. It may be. For example, when performing the etching treatment on the entire surface of the mold base material, the etching is once finished before all of the regions covered with the mask are etched, and the etching process is performed once again after removing the mask. An etching process is performed. In the manufacturing method B of the metal mold | die mentioned as another aspect of the manufacturing method of the metal mold | die of this invention, this is employ | adopted. That is, in the manufacturing method B of the metal mold | die of this invention, the said etching process performs an etching process using the developed photosensitive resin film as a mask, and peels off the 1st etching process which forms an unevenness | corrugation in the polished plating surface, and the photosensitive resin film. It is a process including the photosensitive resin film peeling process mentioned above, and the 2nd etching process which dulls the uneven surface formed by the 1st etching process by an etching process after removing a photosensitive resin film completely.

Hereinafter, the manufacturing method A and B of the metal mold | die of this invention are further demonstrated.

<< manufacturing method A >> of the mold

[5A] Development Process

In the image development process, when negative photosensitive resin is used for the photosensitive resin film 3, the unexposed area | region 5 melt | dissolves with a developing solution, and only the exposed area | region 4 remains on a base material for metal molds, and is continued It acts as a mask in the etching process. On the other hand, when positive type photosensitive resin is used for the photosensitive resin film 3, only the exposed area | region 4 is melt | dissolved by a developing solution, the unexposed area | region 5 remains on the base material for metal mold | die, and is continued in the etching process Acts as a mask.

As the developing solution used in the developing step, a conventionally known one can be used. For example, inorganic alkalis, such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia water, 1st amines, such as ethylamine and n-propylamine, diethylamine, di-n-butylamine, etc. Tertiary amines such as secondary amines, triethylamine, methyldiethylamine, alcoholamines such as dimethylethanolamine and triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide and trimethylhydroxyethylammonium hydroxide And alkaline aqueous solutions such as cyclic amines such as quaternary ammonium salts such as roxide, pyrrole and piperidine, and organic solvents such as xylene and toluene.

The developing method in the developing step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

In the manufacturing method A of the metal mold | die of this invention, it is preferable to make the projection area of a mask on the metal substrate surface into 1 to 70% with respect to the area of the area | region in which the surface asperity shape is formed in the metal substrate surface. In order to satisfy this requirement, the pattern of the ratio mentioned above can be exposed. That is, when using negative photosensitive resin, a pattern can be manufactured and exposed so that ratio M / T may be 0.01-0.7. In addition, when using positive photosensitive resin, a pattern can be manufactured and exposed so that ratio (1-M) / T may be 0.01-0.7. If the ratio of the projection area of the mask to the substrate surface is too small, in the etching step described later, approximately the entire surface of the mold substrate surface is uniformly etched, making it difficult to form sufficient irregularities on the substrate surface. In the anti-glare film manufactured by the present invention, sufficient anti-glare performance tends to be difficult to be obtained. In addition, if the ratio of the projection area of the mask to the substrate surface is too large, many unetched surfaces remain as flat surfaces after the etching process. Also in this case, there exists a tendency for sufficient anti-glare performance to be acquired in the anti-glare film manufactured using the obtained metal mold | die. In order to form the unevenness which reflected the pattern of the mask on the surface of the metal mold | die base material with good precision, and in order to perform an etching process to the whole surface of the metal mold substrate including the area | region covered with a mask in the etching process mentioned later, As for the projection area to the surface of the metal mold | die base material with respect to the area of the area | region where a surface asperity shape is formed, it is more preferable to exist in 5 to 55% of range.

Moreover, it is preferable to make the standard deviation of the projection area of the mask on the surface of a metal mold | die base material in the area | region of 100 micrometer x 100 micrometers of the surface of metal mold | die base material into 1000 micrometer <^2> or less. In order to satisfy this requirement, it can expose in the pattern which the standard deviation of M100 will be 1000 micrometer <^2> or less as mentioned above. When the standard deviation of the projected area of the photosensitive resin film on the mold base material surface remaining undissolved after development in a region of 100 μm × 100 μm of the base material surface of the mold exceeds 1000 μm ² , the surface unevenness of the obtained mold is 50. Nonuniformity of the surface irregularities having a period of μm or more occurs, and as a result, the antiglare film produced by using the obtained mold tends to cause glittering when placed in a high precision image display device. From a viewpoint of making the surface uneven | corrugated shape of the obtained metal mold | die more uniform, it is more preferable that the standard deviation of the projection area of the mask in the 100 micrometer x 100 micrometers area | region of the base material surface of a metal mold | die to the mold base material surface is 500 micrometer <^2> or less. .

In FIG.1 (d), the state which developed the photosensitive resin film 3 using negative photosensitive resin is shown typically. In FIG.1 (c), the unexposed area | region 5 melt | dissolves with a developing solution, and only the exposed area | region 4 remains on the surface of a base material and becomes the mask 6. In FIG. 1 (e), the state which developed the photosensitive resin film 3 using positive photosensitive resin is shown typically. In FIG.1 (c), the exposed area | region 4 melt | dissolves with a developing solution, and only the unexposed area | region 5 remains on the surface of a base material and becomes the mask 6. In addition, the exposed region 4 of FIG. 2 remains on the substrate surface in the case of a negative photosensitive resin after the developing process, and serves as a mask in the subsequent etching process. On the other hand, in the case of positive type photosensitive resin, the unexposed area | region 5 of FIG. 2 remains on the surface of a base material, and acts as a mask in the subsequent etching process.

[6A] etching process

In the etching process of the manufacturing method A of a metal mold, the base material for metal mold | die of a location without a mask is mainly etched using the photosensitive resin film which remained on the surface of the metal mold | die base material after the above-mentioned image development process as a mask. It is a figure which shows typically a preferable example of the latter part of the manufacturing method A of the metal mold | die of this invention. FIG. 8A schematically shows a state in which the base material 1 for a mold 1 in the portion 7 without a mask is etched mainly by an etching step. Although the base material 1 for metal mold | die 1 below the mask 6 is not etched on the surface of a metal mold | die base material, etching progresses in the area | region 7 without a mask with progress of an etching. Therefore, near the boundary between the mask 6 and the region 7 without the mask, the base material 1 for the mold under the mask 6 is also etched. In the vicinity of the boundary between the mask 6 and the mask-free region 7, the die substrate 1 under the mask 6 is also etched, hereinafter referred to as side etching. 9, the progress of side etching is shown typically. The dotted line 8 of FIG. 9 has shown the surface of the base material for metal mold | die changes with the progress of an etching step by step.

In the manufacturing method A of this invention, side etching is advanced and the etching process is given to the whole surface of the metal substrate surface. That is, the etching process is performed until the side etching which advances from the location 7 without an adjacent mask is connected over the whole surface of the surface of the metal mold | die base material, and the metal mold | die base material 1 under the mask 6 is also etched, It is characterized by the above-mentioned. do. 9, the side etching progresses and the state in which the base material 1 for metal mold | die 1 of the mask 6 lower is also etched typically is shown.

The etching process in the etching process usually corrodes the metal surface by using ferric chloride (FeCl ₃ ) solution, cupric chloride (CuCl ₂ ) solution, alkaline etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), or the like. Although it is performed by making it a strong acid, strong acids, such as hydrochloric acid and a sulfuric acid, can also be used, and reverse electrolytic etching by applying the reverse electric potential at the time of electroplating can also be used. Since the concave shape formed on the base material for a mold when the etching process is performed varies depending on the type of the base metal, the type of the photosensitive resin film, the etching method, and the like, but cannot be uniformly described, when the etching amount is 10 μm or less, the etching solution It is etched approximately isotropically from the metal surface in contact with. Etching amount here is the thickness of the base material shaved by etching.

The etching amount in the etching step is preferably 2 to 100 µm. In the case where the etching amount is less than 2 m, almost no irregularities are formed on the metal surface, and the mold becomes almost flat. Therefore, the anti-glare property is not exhibited. Moreover, it becomes difficult to advance side etching and to etch the whole surface of the metal substrate surface. In addition, when the etching amount exceeds 100 µm, the curvature of the concave-convex shape formed on the metal surface becomes large, and the mold becomes almost flat. Therefore, the anti-glare property is not exhibited. In order to perform side etching and to etch the whole surface of the metal substrate surface, etching amount is an important factor, and at least etching amount needs to be larger than the width of a mask.

In addition, when etching is not performed to the whole surface of the base material surface of a metal mold | die in this way, it is mentioned later in order to fully slow down the inclination of the surface which is the steepness of the surface asperity shape 9 formed by the etched location and the non-etched location. The chromium plating in the second plating process must be thickened. However, when the thickness of chromium plating is too thick, it is not preferable because nodules tend to occur. In addition, when the thickness of the chromium plating is thinned, the surface inclination, which is a steep inclination of the surface irregularities 9 formed by the etched portion and the unetched portion, cannot be sufficiently slowed, so that a mold having the required surface shape cannot be obtained. Since it does not, the anti-glare film produced using the metal mold | die does not show the outstanding anti-glare performance. 10, the schematic diagram of the surface of the metal mold | die base material which left the unetched part was not shown in the whole surface of the metal substrate surface. The surface concave-convex shape 9 formed by the etched point and the non-etched point will have a steep surface slope.

Moreover, in the manufacturing method A of the metal mold | die of this invention, it is preferable to include the photosensitive resin film removal process between an etching process and a 2nd plating process. By performing side etching in the etching process and etching the entire surface of the surface of the mold substrate, the mask is peeled off from the surface of the mold substrate, and the peeled mask adheres to the surface of the mold substrate, thereby causing defects in the second plating process. There is a possibility. This attached mask is completely dissolved and removed in the photosensitive resin film removing step. In the photosensitive resin film removal process, a photosensitive resin film is dissolved using a removal liquid. As the removal solution, the same developer as that described above can be used, and by changing the pH, temperature, concentration, and immersion time, the photosensitive resin of the exposed portion when the negative photosensitive resin film is used and the non-exposed portion when the positive photosensitive resin film is used The membrane is completely dissolved and removed. The peeling method in the photosensitive resin film removal step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

<< manufacturing method B >> of the mold

[5B] Development Process

In the developing step, when a negative photosensitive resin is used for the photosensitive resin film 3, the unexposed region 5 is dissolved by a developing solution, and only the exposed region 4 remains on the base material for a mold and continues. 1 serves as a mask in the etching process. On the other hand, when positive type photosensitive resin is used for the photosensitive resin film 3, only the exposed area | region 4 is melt | dissolved by a developing solution, and the area | region 5 which is not exposed remains on the base material for metal mold | die, and continues 1st etching It acts as a mask in the process.

As the developing solution used in the developing step, a conventionally known one can be used. For example, inorganic alkalis, such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia water, 1st amines, such as ethylamine and n-propylamine, diethylamine, di-n-butylamine, etc. Tertiary amines such as secondary amines, triethylamine, methyldiethylamine, alcoholamines such as dimethylethanolamine and triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide and trimethylhydroxyethylammonium hydroxide And alkaline aqueous solutions such as cyclic amines such as quaternary ammonium salts such as roxide, pyrrole and piperidine, and organic solvents such as xylene and toluene.

The developing method in the developing step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

In the manufacturing method of the metal mold | die of this invention, it is preferable to make the projection area of a mask to the base material surface for metal mold | die to 1 to 70% with respect to the area of the area | region where a surface asperity shape is formed in the base material surface for metal mold | die. In order to satisfy this requirement, the pattern of the ratio as mentioned above can be exposed. That is, when using negative photosensitive resin, a pattern can be manufactured and exposed so that ratio M / T may be 0.01-0.7. In addition, when using a positive photosensitive resin, a pattern can be manufactured and exposed so that ratio (1-M) / T may be 0.01-0.7. If the ratio of the projection area of the mask to the substrate surface is too small, in the first etching step described later, approximately the entire surface of the mold substrate surface is uniformly etched, making it difficult to form sufficient irregularities on the substrate surface. In the anti-glare film manufactured by using a film, there is a tendency that sufficient anti-glare performance is difficult to be obtained. If the ratio of the projection area of the mask to the substrate surface is too large, the flat surface remaining after the first etching process, that is, the surface which is not etched, becomes large, and the flat surface remains even after the second etching process. Also in this case, there exists a tendency for sufficient anti-glare performance to be acquired in the anti-glare film manufactured using the obtained metal mold | die. From the viewpoint of forming the irregularities reflecting the pattern of the mask on the surface of the mold substrate with good precision, the projection area of the mask onto the mold substrate surface with respect to the area of the region where the surface irregularities are formed on the substrate surface for mold is 30 to 65. It is more preferable to exist in the range of%.

Moreover, it is preferable to make the standard deviation of the projection area of the mask on the surface of a metal mold | die base material in the area | region of 100 micrometer x 100 micrometers of the surface of metal mold | die base material into 1000 micrometer <^2> or less. In order to satisfy this requirement, it can expose in the pattern which the standard deviation of M100 will be 1000 micrometer <^2> or less as mentioned above. When the standard deviation of the projected area of the photosensitive resin film on the mold base material surface remaining undissolved after development in a region of 100 μm × 100 μm of the base material surface of the mold exceeds 1000 μm ² , the surface unevenness of the obtained mold is 50. Unevenness of the surface irregularities having a period of μm or more occurs, and as a result, the antiglare film produced by using the obtained mold tends to cause glittering when placed on a high precision image display device. From a viewpoint of making the surface uneven | corrugated shape of the obtained metal mold | die more uniform, it is more preferable that the standard deviation of the projection area of the mask in the area | region of 100 micrometers x 100 micrometers of the base material surface of a metal mold | die to the mold base material surface is 500 micrometer <^2> or less.

In FIG.1 (d), the state which developed the photosensitive resin film 3 using negative photosensitive resin is shown typically. In FIG.1 (c), the unexposed area | region 5 melt | dissolves with a developing solution, and only the exposed area | region 4 remains on the surface of a base material and becomes the mask 6. In FIG. 1 (e), the state which developed the photosensitive resin film 3 using positive photosensitive resin is shown typically. In FIG.1 (c), the exposed area | region 4 melt | dissolves with a developing solution, and only the unexposed area | region 5 remains on the surface of a base material and becomes the mask 6. In addition, the exposed region 4 of FIG. 2 remains on the surface of the substrate in the case of negative photosensitive resin after the developing process, and serves as a mask in the subsequent first etching process. On the other hand, in the case of positive type photosensitive resin, the unexposed area | region 5 of FIG. 2 remains on the surface of a base material, and acts as a mask in the subsequent 1st etching process.

[6A1] first etching process

In the 1st etching process of the manufacturing method B of a metal mold | die, the base material for metal mold | die of a location without a mask is mainly etched using the photosensitive resin film which remained on the surface of the metal mold | die base material after the above-mentioned image development process as a mask. It is a figure which shows typically a preferable example of the latter part of the manufacturing method B of the metal mold | die of this invention. 14A schematically shows a state in which the mold base 1 of the portion 7 mainly without a mask is etched by the first etching step. Although the base material 1 for metal mold | die 1 below the mask 6 is not etched on the surface of a metal mold | die base material, etching progresses in the area | region 7 without a mask with progress of an etching. Therefore, near the boundary between the mask 6 and the region 7 without the mask, the base material 1 for the mold under the mask 6 is also etched. In the vicinity of the boundary between the mask 6 and the mask-free region 7, the die substrate 1 under the mask 6 is also etched, hereinafter referred to as side etching. 15, the progress of side etching is shown typically. The dotted line 8 of FIG. 15 has shown the surface of the base material for metal mold | die changes with the progress of an etching step by step.

The etching treatment in the first etching step is usually performed by using a ferric chloride (FeCl ₃ ) solution, a cupric chloride (CuCl ₂ ) solution, an alkali etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), or the like. Although it is performed by corrosive, strong acids, such as hydrochloric acid and sulfuric acid, can also be used, and reverse electrolytic etching by applying the opposite electric potential at the time of electroplating can also be used. Since the concave shape formed in the base material for a metal mold | die at the time of an etching process differs by the kind of base metal, the kind of photosensitive resin film, the etching method, etc., it cannot say uniformly, but when etching amount is 10 micrometers or less, It is etched approximately isotropically from the contacted metal surface. Etching amount here is the thickness of the base material shaved by etching.

The etching amount in the first etching step is preferably 1 to 50 µm. When the etching amount is less than 1 µm, almost no irregularities are formed on the metal surface, and the mold becomes almost flat, so that anti-glare properties are not exhibited. Moreover, when etching amount exceeds 50 micrometers, since the height difference of the uneven | corrugated shape formed in a metal surface becomes large, and the anti-glare film produced using the obtained metal mold | die is cloudy, it is unpreferable. The etching treatment in the first etching step may be performed by one etching treatment, or may be performed by dividing the etching treatment into two or more times. In the case where the etching treatment is performed in two or more times, the total amount of etchings in the two or more etching treatments is preferably 1 to 50 µm.

[6B2] Photosensitive Resin Film Peeling Process

In the photosensitive resin film peeling process of the manufacturing method B of a metal mold | die, the remaining photosensitive resin film used as a mask in a 1st etching process is melt | dissolved and removed completely. In the photosensitive resin film peeling process, a photosensitive resin film is melt | dissolved using a peeling liquid. As the peeling solution, the same developer as described above can be used, and by changing the pH, temperature, concentration and immersion time, the photosensitive property of the exposed portion when the negative photosensitive resin film is used and the non-exposed portion when the positive photosensitive resin film is used The resin film is completely dissolved and removed. The peeling method in the photosensitive resin film peeling step is not particularly limited, and methods such as immersion development, spray development, brush development, and ultrasonic development can be used.

14B schematically shows a state in which the photosensitive resin film 6 used as a mask is completely dissolved and removed by the photosensitive resin film peeling step. By the mask 6 and etching by the photosensitive resin film, the 1st surface uneven | corrugated shape 9 is formed in the surface of the metal mold | die base material.

[6B3] second etching process

In the 2nd etching process of the manufacturing method B of a metal mold | die, the 1st surface uneven | corrugated shape 9 formed by the 1st etching process which used the photosensitive resin film as a mask is blunted by an etching process. By this 2nd etching process, the part whose surface inclination in the 1st surface uneven | corrugated shape 9 formed by the 1st etching process has a steep inclination disappears, and the optical characteristic of the anti-glare film manufactured using the obtained metal mold | die is preferable. Direction is changed. In FIG. 14C, the first surface uneven shape 9 of the substrate 1 is slowed by the second etching process, the portion having the steep slope is slowed, and the second surface unevenness having a gentle surface slope. The state in which the shape 10 was formed is shown.

The etching treatment of the second etching step is also the same as that of the first etching step, usually ferric chloride (FeCl ₃ ) solution, cupric chloride (CuCl ₂ ) solution, alkaline etching solution (Cu (NH ₃ ) ₄ Cl ₂ ), or the like. Although it is carried out by corroding the surface using, strong acids such as hydrochloric acid and sulfuric acid may be used, or reverse electrolytic etching may be used by applying a potential opposite to that of electrolytic plating. The degree of slowing of the unevenness after the etching treatment varies depending on the type of the base metal, the etching method, and the size and depth of the unevenness obtained by the first etching step. The biggest factor in is the etching amount. Etching amount here is also the thickness of the base material shaved by etching similarly to a 1st etching process. If the etching amount is small, the effect of blunting the surface shape of the unevenness obtained by the first etching step is insufficient, and the optical properties of the antiglare film obtained by transferring the uneven shape to the transparent film are not very good. On the other hand, if the etching amount is too large, the uneven shape is almost eliminated, and since the mold becomes almost flat, no anti-glare property is exhibited. Therefore, it is preferable that the etching amount exists in the range of 1-50 micrometers, and it is more preferable to exist in the range which is 4-20 micrometers. Also about the etching process in a 2nd etching process, it may be performed by one etching process similarly to a 1st etching process, and you may divide and perform an etching process in 2 or more times. In the case where the etching treatment is performed in two or more times, the total amount of etchings in the two or more etching treatments is preferably 1 to 50 µm.

In the case where the second etching step is not performed, the chromium plating in the second plating step described later is performed in order to sufficiently slow the surface inclination, which is a steep slope of the first surface uneven shape 9 formed by the first etching step. It must be thickened. However, if the thickness of the chromium plating is made too thick, nodules are likely to occur, which is not preferable. In addition, when the thickness of chromium plating is made thin, since the surface inclination which is the steep inclination of the 1st surface uneven | corrugated shape 9 formed by the 1st etching process cannot fully be slowed down, since the metal mold | die of the required surface shape is not obtained. Also, the antiglare film produced by using the mold does not exhibit excellent antiglare performance.

<< manufacturing method A and B >> of mold

[7] second plating processes

Subsequently, the surface unevenness is further blunted by chromium plating. 8 (b) shows a state in which the chromium plating layer 11 is formed on the surface uneven shape 10 formed by the etching process and the surface 12 is blunted. In FIG.14 (d), after performing the process which dulls the surface asperity shape by the etching process of a 2nd etching process, the state which formed the chromium plating layer 11 and made the surface 12 further dull is shown.

In the present invention, chromium plating is adopted which has gloss on the surfaces of flat plates, rolls, and the like, high hardness, low coefficient of friction, and which can provide good release properties. Although the kind of chromium plating is not specifically limited, It is preferable to use chromium plating which expresses favorable gloss called so-called gloss chrome plating, decorative chromium plating, etc. Chromium plating is usually performed by electrolysis, and an aqueous solution containing chromic anhydride (CrO ₃ ) and a small amount of sulfuric acid is used as the plating bath. By adjusting the current density and the electrolysis time, the thickness of the chromium plating can be controlled.

Although Japanese Patent Laid-Open Publication No. 2002-189106, Japanese Patent Laid-Open Publication No. 2004-45472, Japanese Patent Laid-Open Publication No. 2004-90187 and the like have been disclosed to adopt chromium plating, the basis before the plating of a metal mold is used. Depending on the kind of chromium plating, the surface may be rough after plating or a large number of minute cracks may occur due to chromium plating. As a result, the optical properties of the antiglare film to be produced are directed in an undesirable direction. . The metal mold | die of the state with which the plating surface was rough is not suitable for manufacture of an anti-glare film. This is because, in general, polishing of the plating surface after chrome plating is performed in order to remove roughness, but as described later, surface polishing after plating is not preferable in the present invention. In the present invention, the base metal is subjected to copper plating or nickel plating to solve such a problem that is easily caused by chromium plating.

In addition, it is not preferable to perform plating other than chromium plating in a 2nd plating process. This is because, in plating other than chromium, hardness and wear resistance are lowered, so that durability as a mold decreases, irregularities are worn out during use, and the mold may be damaged. In the anti-glare film obtained from such a metal mold | die, the possibility of a sufficient anti-glare function is hard to be obtained, and the possibility of a defect generate | occur | producing on a film also increases.

Also, as disclosed in Japanese Patent Laid-Open No. 2004-90187 and the like described above, polishing the surface after plating is also not preferable in the present invention. Since polishing produces a flat portion on the outermost surface, there is a possibility of causing deterioration of the optical characteristics, and an increase in the control factor of the shape, which leads to difficulty in shape control with good reproducibility.

As described above, in the present invention, by performing chromium plating on the surface irregularities formed by the above-described etching step, the mold having the surface unevenness is further slowed and the surface hardness thereof is increased. Although the slowing state of the unevenness at this time also varies depending on the type and thickness of the unevenness obtained by the base metal, the etching process, and the like, and the type and thickness of the plating, it cannot be said uniformly, but in controlling the slowed state The biggest factor is also the plating thickness. When the thickness of chromium plating is thin, the effect of blunting the surface shape of the unevenness | corrugation obtained before chrome plating process is inadequate, and the optical characteristic of the anti-glare film obtained by transferring the uneven | corrugated shape to a transparent film does not become very favorable. On the other hand, when the plating thickness is too thick, not only productivity is worsened but also a plating defect on the protrusion called nodule is generated, which is not preferable. Therefore, it is preferable that the thickness of chromium plating exists in the range of 1-10 micrometers, and it is more preferable to exist in the range which is 3-6 micrometers.

It is preferable that the chromium plating layer formed in the said 2nd plating process is formed so that Vickers hardness may be 800 or more, and it is more preferable to form so that it may become 1000 or more. When the Vickers hardness of the chromium plating layer is less than 800, not only the durability at the time of use of the metal mold is lowered, but also the decrease in hardness due to chromium plating is likely to cause abnormalities in plating bath properties, electrolytic conditions, etc. This is because it is highly likely to adversely affect the occurrence situation.

In this way, a mold having substantially no flat portion can be obtained. Thus, the metal mold | die without a substantially flat part is used suitably for obtaining the anti-glare film which shows preferable optical characteristic. Moreover, the metal mold | die obtained by the manufacturing method of this invention is arithmetic mean height Pa in the arbitrary cross-sectional curve of the uneven surface, 0.01-0.2 micrometer, and average length PSm in the cross-sectional curve is 8-50 micrometer, It is preferable that the largest cross-sectional height Pt in a cross-sectional curve is 0.1-1.0 micrometer. When the arithmetic mean height Pa of the mold is smaller than 0.01 μm or the maximum cross-sectional height Pt is smaller than 0.1 μm, the surface shape of the antiglare film produced by using the mold becomes almost flat, and exhibits sufficient antiglare performance. There is a tendency to not. In addition, when the arithmetic mean height Pa is larger than 0.2 µm or the maximum cross-sectional height Pt is larger than 1.0 µm, the antiglare film produced by using the mold tends to become cloudy, glittering occurs or the texture is degraded. There is this. Moreover, when the said average length PSm of a metal mold | die is smaller than 8 micrometers, there exists a tendency for the anti-glare film produced using this metal mold | die to not show sufficient anti-glare performance. On the other hand, when the said average length PSm of a metal mold | die is larger than 50 micrometers, it exists in the tendency for glittering to arise when the anti-glare film produced using this metal mold | die is arrange | positioned in a high precision image display apparatus.

<Method for Producing Anti-glare Film>

This invention also provides about the manufacturing method of the anti-glare film using the metal mold | die obtained by the manufacturing method of the metal mold | die of this invention mentioned above. That is, the manufacturing method of the anti-glare film of this invention peels the process of transferring the uneven surface of the metal mold | die manufactured by the manufacturing method of the metal mold | die of this invention to a transparent resin film, and the transparent resin film to which the uneven surface of the metal mold | die was transferred from a metal mold | die. It includes a process to make. By the manufacturing method of such an anti-glare film of this invention, the anti-glare film which shows preferable optical characteristic is manufactured preferably.

It is preferable to perform transfer to the film of a mold shape by embossing. As embossing, the UV embossing method using a photocurable resin and the hot embossing method using a thermoplastic resin are illustrated, and UV embossing method is preferable especially from a viewpoint of productivity.

The UV embossing method is a method in which the uneven surface of the mold is transferred to the photocurable resin layer by forming a photocurable resin layer on the surface of the transparent resin film and curing the photocurable resin layer while pressing the uneven surface of the mold. Specifically, an ultraviolet curable resin is coated on the transparent resin film, and the ultraviolet curable resin is cured by irradiating ultraviolet rays from the transparent resin film side in a state in which the coated ultraviolet curable resin is brought into close contact with the uneven surface of the mold. From this, the shape of the mold is transferred to the ultraviolet curable resin by peeling off the transparent resin film on which the ultraviolet curable resin layer after curing is formed.

In the case of using the UV embossing method, the transparent resin film may be a substantially optically transparent film, for example, a triacetyl cellulose film, a polyethylene terephthalate film, a polymethyl methacrylate film, a polycarbonate film, norbor And resin films such as solvent cast films and extruded films of thermoplastic resins such as amorphous cyclic polyolefins having a n-ne compound as a monomer.

Moreover, although the kind of ultraviolet curable resin in the case of using UV embossing method is not specifically limited, A commercially available suitable thing can be used. Moreover, it is also possible to use resin which can harden | cure even visible light which has a wavelength longer than an ultraviolet-ray by combining the photoinitiator suitably selected with ultraviolet curable resin. Specifically, polyfunctional acrylates, such as trimethylolpropane triacrylate and pentaerythritol tetraacrylate, are used alone or in combination of two or more thereof, and Irgacure 907 (Shiba Specialty Chemical Co., Ltd.) is used. The thing which mixed photopolymerization initiators, such as the Z company make, Irgacure 184 (made by Ciba Specialty Chemicals Co., Ltd. make), and Lucirin TPO (made by BASF Corporation), can be used preferably.

On the other hand, the hot embossing method is a method of pressing a transparent resin film formed of a thermoplastic resin into a mold in a heated state and transferring the surface shape of the mold to the transparent resin film. The transparent resin film used for the hot embossing method may be any one as long as it is substantially transparent. For example, a polymethyl methacrylate, polycarbonate, polyethylene terephthalate, triacetyl cellulose, norbornene-based compound is used as a monomer. A solvent cast film, an extruded film, etc. of thermoplastic resins, such as an amorphous cyclic polyolefin, can be used. These transparent resin films can also be used suitably also as a base film for coating the ultraviolet curable resin in the UV embossing method demonstrated above.

<Examples>

Although an Example is given to the following and this invention is demonstrated in more detail, this invention is not limited to these Examples.

<Example A1>

It was prepared that a copper ballad plating was performed on the surface of an aluminum roll (A5056 by JIS) having a diameter of 200 mm. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the whole plating layer was set so that it might be set to about 200 micrometers. The copper plating surface was mirror-polished, and the photosensitive resin was apply | coated and dried on the polished copper plating surface, and the photosensitive resin film was formed. Subsequently, the pattern which repeated and arranged the pattern shown to FIG. 11 (a) was exposed and developed by the laser beam on the photosensitive resin film. Exposure and development by laser light were performed using a laser stream FX (manufactured by Sync Lab., Ltd.). By using a positive photosensitive resin for the photosensitive resin film and exposing the pattern shown in Fig. 11 (a), the area of the area where the surface irregularities are formed on the mold substrate surface of the projection area of the mask onto the mold substrate surface is formed. The ratio was 9.3%. In addition, since the pattern which repeated and arranged the pattern shown to FIG. 11 (a) is exposed by a laser beam, the standard deviation of the projection area of the mask to the mold base material surface in the area | region of 100 micrometers x 100 micrometers of the metal substrate surface. Was 1000 μm ² or less.

Then, the etching process was performed with the cupric chloride liquid. The etching amount at that time was set to be 8 micrometers. The photosensitive resin film was removed from the roll after the etching treatment, and chrome plating was performed to form a mold. At this time, the chromium plating thickness was set to 4 µm.

<Comparative Example A1>

A metal mold | die was produced like Example A1 except having exposed the pattern which repeated and arranged the pattern shown in FIG. 11 (b) with a laser beam on the photosensitive resin film. By exposing the pattern shown to FIG. 11 (b), the ratio with respect to the area of the area | region in which the surface asperity shape is formed in the surface of the metal mold | die base material of the projection area of a mask to the base material surface for metal mold | die was 67.4%.

<Evaluation test 1>

The surface shape about each metal mold obtained in Example A1 and Comparative Example A1 was evaluated. Since it is difficult to measure each surface shape directly, the sample of the anti-glare film was produced by the method of Example A2 and the comparative example A2 mentioned later, and the surface shape of this sample was measured and evaluated as the surface shape of a metal mold | die. In addition, although the cross-sectional curve on an anti-glare film turns up and down of the cross-sectional curve on a metal mold | die, both arithmetic mean height Pa, average length PSm, and maximum cross-sectional height Pt become the same. In the measurement of the surface shape, a confocal microscope PLμ2300 (manufactured by Sensofar Co., Ltd.) was used, and an optically transparent adhesive was used to bond the glass to the glass substrate so that the concave-convex surface became a surface in order to prevent bending of the sample. It was. In the measurement, the magnification of the objective lens was 50 times. Based on the measurement data, the arithmetic mean height Pa, the average length PSm and the maximum cross-sectional height Pt were calculated by calculating by the method according to JIS B 0601. The results are shown in Table A1.

<Example A2>

Photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink & Chemicals Co., Ltd.) was dissolved in ethyl acetate to give a solution having a concentration of 50% by weight, and luciferin TPO (manufactured by BASF Corporation, chemical name) as a photopolymerization initiator. : 2,4,6-trimethylbenzoyldiphenylphosphine oxide) was added 5 parts by weight per 100 parts by weight of the curable resin component to prepare a coating liquid. On the 80-micrometer-thick triacetyl cellulose (TAC) film, this coating liquid was apply | coated so that the coating thickness after drying might be set to 10 micrometers, and it dried for 3 minutes in the dryer set to 60 degreeC. The film after drying was pressed and adhere | attached on the uneven surface of the metal mold | die obtained in Example A1 by the rubber roll so that a photocurable resin composition layer might be a metal mold | die side. In this state, the light from the high-pressure mercury lamp of 20 mW / cm ² intensity | strength was irradiated so that it might become 200 mJ / cm <^2> by h line conversion light quantity, and the photocurable resin composition layer was hardened from the TAC film side. Thereafter, the TAC film was peeled from the mold together with the cured resin to obtain a transparent anti-glare film of Example A2, which is composed of a laminate of a cured resin having irregularities on the surface and a TAC film.

<Comparative Example A2>

As a metal mold | die, except having used the metal mold | die obtained by the comparative example A1, it carried out similarly to Example A2, and obtained the transparent anti-glare film.

<Evaluation test 2>

About each anti-glare film of obtained Example A2 and comparative example A2, the following optical characteristics and anti-glare performance were evaluated.

(1) Evaluation of Optical Properties 1: Measurement of Haze

The haze of the antiglare film was measured by the method specified in JIS K 7136. Specifically, haze was measured using the haze meter HM-150 type (made by Murakami Shikisai Kijutsu Co., Ltd.) which conformed to this standard. In order to prevent curvature of an anti-glare film, it measured after bonding to a glass substrate so that an uneven surface might become a surface using an optically transparent adhesive. Generally, when a haze becomes large, an image will become dark when it is applied to an image display apparatus, and as a result, a front contrast will fall easily. Therefore, it is preferable that haze is low.

(2) Evaluation of Optical Properties 2: Measurement of Reflection Sharpness

Reflection sharpness was measured by the method prescribed | regulated to JISK7105. Specifically, the reflection sharpness of the anti-glare film was measured using a filament measuring instrument ICM-IDP (manufactured by Suga Shikeki Co., Ltd.) in accordance with this standard. In this standard, as the optical slit used for image sharpness measurement, the ratio of the width | variety of a dark part and a wrist is 1: 1, and four types of the width | variety are 0.125 mm, 0.5 mm, 1.0 mm, and 2.0 mm. Among these, when an optical slit having a width of 0.125 mm is used, in the anti-glare film defined in the present invention, the error of the measured value becomes large, so that the measured value when the optical slit having a width of 0.125 mm is used does not add to the sum. The sum of the image sharpness measured using three types of optical slits of 0.5 mm, 1.0 mm and 2.0 mm in width is called reflection sharpness. The maximum value of the reflection sharpness in the case of this definition is 300%. When the reflection clarity by this definition becomes too large, since an image, such as a light source, will tend to project and anti-glare property will fall easily, it is preferable that it is 100% or less, and it is more preferable that it is 50% or less. At the time of evaluation, in order to prevent curvature of an anti-glare film and to prevent reflection in a back surface, it uses the optically transparent adhesive agent, and it is made to bond to the black acrylic resin plate of 2 mm thickness so that the uneven surface of an anti-glare film may become a surface. Then measured. In this state, light was incident on the antiglare film side and measured.

(3) Evaluation of Optical Properties 3: Measurement of 60 Degree Glossiness

60 degree glossiness was measured by the method of JIS Z 8741. Specifically, the glossiness of the antiglare film was measured using a glossmeter PG-1M (manufactured by Nippon Denshoku Kogyo Co., Ltd.) in accordance with this standard. Also in this case, in order to prevent the anti-glare film from bending and to prevent reflection from the back surface, the anti-glare film is bonded to the black acrylic resin plate having a thickness of 2 mm so that the uneven surface becomes the surface by using an optically transparent adhesive. Then measured. In this state, light was incident on the antiglare film side and measured. Generally, a 60 degree glossiness means that the sample surface is cloudy, and as a result, cloudiness tends to occur. Therefore, it is preferable that glossiness is high, but when glossiness is too high, since projection will arise and anti-glare property will fall, the value of about 30 to 90% is preferable.

(4) Evaluation of antiglare performance 1: Visual evaluation of projection

In order to prevent reflection on the back surface of the antiglare film, the antiglare film is bonded to the black acrylic resin plate so that the uneven surface becomes the surface, and the naked eye is visually observed from the uneven surface side in the room where the fluorescent lamp is installed to visually check the presence or absence of the projection of the fluorescent lamp. The evaluation was carried out in three steps as a reference.

1: no projection is observed

2: projection slightly observed

3: the projection is clearly observed

(5) Evaluation of antiglare performance 2: Visual evaluation of cloudiness

In order to prevent reflection on the back surface of the antiglare film, the antiglare film is bonded to the black acrylic resin plate so that the uneven surface becomes the surface, and visually observed from the uneven surface side in a bright room where fluorescent lamps are installed, and the degree of clouding is visually determined by the following criteria. Evaluated in three steps.

1: no turbidity observed

2: slight clouding observed

3: cloudiness is clearly observed

(6) Evaluation of antiglare performance 3: Evaluation of glittering

First, the photomask which has the pattern of the unit cell 31 as shown by the top view in FIG. 12 was prepared. In Fig. 12, the unit cell 31 is formed with a key chrome light shielding pattern 32 having a line width of 10 m on a transparent substrate, and the opening 33 is formed at a portion where the chrome light shielding pattern 32 is not formed. It became. Next, as shown in Fig. 13, the chromium light shielding pattern 32 of the photomask 41 is placed upward, placed in a light box 42 provided with a light source 43 therein, and is 1.1 mm thick. The degree of glittering was sensory in seven steps by placing a sample on which the antiglare film 51 was bonded to the glass plate 44 with an adhesive having a thickness of 20 μm on the photomask 41 and visually observing at a place about 30 cm away from the sample. Of the seven stages of the sensory evaluation evaluated, level 1 corresponds to a state in which no glittering is observed at all, level 7 corresponds to a state in which severe glittering is observed, and level 3 is a state in which slight glittering is observed. As the unit cell of the photomask, the unit cell length x unit cell width in FIG. 12 was 282 μm x 94 μm, so that the opening length x opening width in the same figure was 272 μm x 84 μm. . This cell corresponds to a pixel density of 90 pixels per inch (ppi).

The results are shown in Table A2. In addition, in Table A2, the detail of the reflection sharpness of the comparative example A2 is as follows, for example.

Reflection sharpness

0.5 mm optical slit: 30.2%

1.0 mm optical slit: 39.2%

0.5 mm optical slit: 43.2%

112.6%

TABLE A1

TABLE A2

From the results shown in Tables A1 and A2, in the mold produced by the production method of the present invention, since the portion of the inclined surface unevenness is steeply inclined, a mold having no point of the steepness of the inclination was obtained. Moreover, the anti-glare film obtained from the manufacturing method of this invention showed the outstanding anti-glare performance. On the other hand, in the mold produced by the manufacturing method which does not perform the etching process on the whole surface, since the inclination of the inclination exists in the surface uneven | corrugated shape, the cloudyness produced in the anti-glare film produced using the said mold, and also Projections also occurred because the point where the slope was not a steep slope was flat. Therefore, the anti-glare film obtained from the manufacturing method of this invention shows the outstanding anti-glare performance.

<Example B1>

It was prepared that a copper ballad plating was performed on the surface of an aluminum roll (A5056 by JIS) having a diameter of 200 mm. Copper ballad plating consists of a copper plating layer / thin silver plating layer / surface copper plating layer, and the thickness of the whole plating layer was set so that it might be set to about 200 micrometers. The copper plating surface was mirror-polished, the photosensitive resin was apply | coated and dried on the polished copper plating surface, and the photosensitive resin film was formed. Subsequently, the pattern which repeated and arranged the pattern shown in FIG. 16 was exposed and developed by the laser beam on the photosensitive resin film. Exposure and development by laser light were performed using a laser stream FX (manufactured by Sync Lab., Ltd.). By using positive type photosensitive resin for the photosensitive resin film and exposing the pattern shown in FIG. 16, the ratio with respect to the area of the area | region in which the surface asperity shape is formed in the surface of the metal mold | die base material of the projection area of a mask to the base material surface of a metal mold | die is 45.9. %. In addition, since the pattern which repeated and arranged the pattern shown in FIG. 16 is exposed by a laser beam, the standard deviation of the projection area of the mask to the mold base material surface in the area | region of 100 micrometers x 100 micrometers of the base material surface of a metal mold | die is 1000 micrometers. ² or less.

Then, the 1st etching process was performed with the cupric chloride liquid. The etching amount at that time was set to be 7 micrometers. The photosensitive resin film was removed from the roll after the first etching treatment, and the second etching treatment was again performed with a second copper chloride solution. The etching amount at that time was set to be 18 micrometers. Then, the chrome plating process was performed and the metal mold | die was produced. At this time, the chromium plating thickness was set to 4 µm.

<Comparative Example B1>

A metal mold | die was produced like Example B1 except not having performed the 2nd etching process.

<Evaluation test 1>

The surface shape of each mold obtained in Example B1 and Comparative Example B1 was evaluated in the same manner as in the evaluation for each mold obtained in Example A1 and Comparative Example B1. However, the sample of the anti-glare film was produced by the method of Example B2 and comparative example B2 mentioned later, the surface shape of this sample was measured, and it evaluated as the surface shape of a metal mold | die. The results are shown in Table B1.

<Example B2>

Photocurable resin composition Grandik 806T (manufactured by Dainippon Ink & Chemicals Co., Ltd.) was dissolved in ethyl acetate to obtain a solution having a concentration of 50% by weight, and luciferin TPO (manufactured by BASF Corporation, chemical name: 2,) as a photopolymerization initiator. 4,6-trimethylbenzoyldiphenylphosphine oxide) was added 5 parts by weight per 100 parts by weight of the curable resin component to prepare a coating liquid. On the 80-micrometer-thick triacetyl cellulose (TAC) film, this coating liquid was apply | coated so that the coating thickness after drying might be set to 10 micrometers, and it dried for 3 minutes in the dryer set to 60 degreeC. The film after drying was pressed and adhere | attached on the uneven surface of the metal mold | die obtained in Example B1 by the rubber roll so that a photocurable resin composition layer might become a metal mold | die side. In this state, the light from the high-pressure mercury lamp of 20 mW / cm ² intensity | strength was irradiated so that it might become 200 mJ / cm <^2> by h line conversion light quantity, and the photocurable resin composition layer was hardened from the TAC film side. Thereafter, the TAC film was peeled off from the mold together with the cured resin to obtain a transparent antiglare film of Example B2, which is composed of a laminate of a cured resin having irregularities on the surface and a TAC film.

<Comparative Example B2>

As a metal mold | die, except having used the metal mold | die obtained by the comparative example B1, it carried out similarly to Example B2, and obtained the transparent anti-glare film.

<Evaluation test 2>

About each anti-glare film of obtained Example B2 and Comparative Example B2, it carried out similarly to Example A2 and Comparative Example A2, and evaluated the optical characteristic and anti-glare performance.

The results are shown in Table B2. In addition, in Table B2, the detail of the reflection sharpness of Example B2 was as follows.

      Reflection sharpness

0.5 mm optical slit: 11.4%

1.0 mm optical slit: 42.7%

0.5 mm optical slit: 23.9%

Total 78.0%

TABLE B1

TABLE B2

From the results shown in Tables B1 and B2, in the mold produced by the manufacturing method of the present invention, since the portion of the inclined surface unevenness is steeply slanted by the second etching step, there is no point where the slope is steeply inclined. A mold was obtained. Moreover, the anti-glare film obtained from the manufacturing method of this invention showed the outstanding anti-glare performance. On the other hand, since the mold produced by the manufacturing method which does not perform a 2nd etching process has a part with a steep inclination in the surface asperity shape, in the anti-glare film produced using the mold, white turbidity generate | occur | produced and also inclination Since the part which is not a steep slope is flat, projection also occurred. Therefore, the anti-glare film obtained from the manufacturing method of this invention shows the outstanding anti-glare performance.

The embodiments and examples disclosed herein are to be considered in all respects only as illustrative and not restrictive. The scope of the present invention is shown by above-described not description but Claim, and it is intended that the meaning of a claim and equality and all the changes within a range are included.

According to the manufacturing method of the metal mold | die of this invention, since the fine uneven | corrugated shape is formed in the surface with favorable precision, the metal mold | die which becomes useful for manufacture of the anti-glare film which shows high anti-glare function is in good reproducibility, and a state with almost no defect exists. It can be prepared as. Moreover, according to the manufacturing method of the anti-glare film of this invention, anti-glare film which is low in haze, and excellent in anti-glare performance, such as anti-projection, anti-reflection, suppression of cloudiness, prevention of glittering prevention, contrast reduction, etc., maintaining the brightness of a display image. Can be produced industrially advantageously.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows typically a preferable example of the first half part of the manufacturing method of the metal mold | die of this invention.

It is a figure which shows typically the state in which the pattern was exposed to the photosensitive resin film.

It is a figure which shows typically the pattern exposed on a photosensitive resin film.

It is a figure which shows typically the pattern exposed on a photosensitive resin film.

It is a figure which shows typically the pattern exposed on the photosensitive resin film.

It is a figure which shows typically the pattern exposed on a photosensitive resin film.

It is a figure which shows typically the pattern exposed on a photosensitive resin film.

It is a figure which shows typically a preferable example of the latter part of the manufacturing method of the metal mold | die of this invention.

It is a figure which shows typically the state in which side etching progresses in an etching process.

It is a figure which shows typically the base material for metal mold | die in which the etched part and the unetched part exist.

It is a figure which shows the pattern used at the time of metal mold manufacture of Example A1.

FIG. 12: is a top view which shows typically the unit cell 31 in the photomask used for a glittering evaluation test.

It is a figure which shows typically a mode of performing a glittering evaluation test.

It is a figure which shows typically a preferable example of the latter part of the manufacturing method of the metal mold | die of this invention.

It is a figure which shows typically the state in which side etching advances in a 1st etching process.

It is a figure which shows the pattern used at the time of metal mold manufacture of Example B1.

<Explanation of symbols for the main parts of the drawings>

1 base material for metal mold | die, the surface of the base material polished by 2 grinding | polishing processes, the 3 photosensitive resin film, the photosensitive resin film exposed at the 4 exposure process, the photosensitive resin film which was not exposed at the 5 exposure process, the photosensitive resin film which acts as a 6 mask, 7 parts without mask, 8 surfaces formed stepwise by etching, 9 substrate surfaces with etched and unetched locations, 10 substrate surface after surface etching (surface irregularities), 11 chromium plating layers, 12 chromium plating Surface, 31 unit cells, 32 chrome shading patterns, 33 openings, 41 photomasks, 42 light boxes, 43 light sources, 44 glass plates, 45 observers, 51 antiglare films.

Claims (11)

1st plating process which performs copper plating or nickel plating on the surface of the base material for metal molds, A polishing step of polishing the surface plated by the first plating step, A photosensitive resin film forming step of applying a photosensitive resin to a polished surface to form a film; An exposure step of exposing the pattern on the photosensitive resin film, A developing step of developing the photosensitive resin film exposed with the pattern; An etching step of forming irregularities on the polished plated surface by performing an etching process using the developed photosensitive resin film as a mask; A second plating step of performing chromium plating on the uneven surface formed by the etching process, An etching process is performed on the whole surface of the base material for metal molds in the said etching process. The method of claim 1, wherein the etching process, The manufacturing method which is a process of forming an unevenness | corrugation in the polished plating surface by performing an etching process to the whole surface which included the area | region covered with the said mask in the base material for metal molds using the developed photosensitive resin film as a mask. The manufacturing method of Claim 2 including the photosensitive resin film removal process which removes the said photosensitive resin film between an etching process and a 2nd plating process. The method of claim 1, wherein the etching process, A first etching step of forming irregularities on the polished plating surface by performing an etching process using the developed photosensitive resin film as a mask, A photosensitive resin film peeling step of peeling the photosensitive resin film, And a second etching step of slowing the uneven surface formed by the first etching step after the photosensitive resin film is completely peeled off by the etching treatment. The manufacturing method in any one of Claims 1-4 whose etching amount in an etching process is 2-100 micrometers. The manufacturing method of Claim 4 whose etching amount in a 1st etching process is 1-50 micrometers, and the etching amount in a 2nd etching process is 1-50 micrometers. The pattern exposure on the photosensitive resin film in an exposure process is performed by drawing the pattern data created on the computer by the laser beam emitted from a computer controlled laser head in any one of Claims 1-6. Manufacturing method. The projection area of the photosensitive resin film which does not melt | dissolve after a developing process to the surface of the metal mold | die base material is 1 with respect to the area of the area | region where surface uneven | corrugated shape is formed in the surface of metal mold | die base materials in any one of Claims 1-7. To 70%. The standard deviation of the projected area of the photosensitive resin film on the surface of the metal mold | die base material which does not melt | dissolve after developing in the area | region of 100 micrometer x 100 micrometers of the surface of a metal mold | die base material is 1000 micrometers in any one of Claims 1-8. ^The manufacturing method which is ² or less. The manufacturing method according to any one of claims 1 to 9, wherein the chromium plating layer formed by chromium plating has a thickness of 1 to 10 µm. The process of transferring the uneven surface of the metal mold | die manufactured by the method of any one of Claims 1-10 to a transparent resin film, The manufacturing method of the anti-glare film containing the process of peeling from the metal mold | die the transparent resin film with which the uneven surface of the metal mold | die was transferred.

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