TW201017228A - Method for making a mold and method for making an anti-glare film - Google Patents

Method for making a mold and method for making an anti-glare film Download PDF

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Publication number
TW201017228A
TW201017228A TW098131854A TW98131854A TW201017228A TW 201017228 A TW201017228 A TW 201017228A TW 098131854 A TW098131854 A TW 098131854A TW 98131854 A TW98131854 A TW 98131854A TW 201017228 A TW201017228 A TW 201017228A
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Taiwan
Prior art keywords
mold
photosensitive resin
film
substrate
plating
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TW098131854A
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Chinese (zh)
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TWI459040B (en
Inventor
Tsutomu Furuya
Hiroshi Miyamoto
Toru Jinno
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Sumitomo Chemical Co
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Priority claimed from JP2008250613A external-priority patent/JP5150945B2/en
Priority claimed from JP2008250614A external-priority patent/JP5294310B2/en
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW201017228A publication Critical patent/TW201017228A/en
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Publication of TWI459040B publication Critical patent/TWI459040B/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/38Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842Manufacturing moulds, e.g. shaping the mould surface by machining
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424Moulding surfaces provided with means for marking or patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould
    • B29C37/0017Discharging moulded articles from the mould by stripping articles from mould cores
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00Producing optical elements, e.g. lenses or prisms
    • B29D11/0074Production of other optical elements not provided for in B29D11/00009- B29D11/0073
    • B29D11/00788Producing optical films
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

This invention provides a method for making a mold, the method comprising the steps of: performing a copper plating or a nickel plating on the surface of a mold material, polishing the plated surface, forming film by spreading a photosensitive resin, exposing the photosensitive resin film in the form of a pattern, developing the photosensitive resin film, performing an etching by using the developed photosensitive resin film as a mask, forming an undulation on the polished surface, plating the undulated surface with chromium, wherein the etching is performed over the entire surface of the mold material during the etching step. This invention also provides a method for making an anti-glare film by using the abovesaid mold.

Description

201017228 六、發明說明: 【發明所屬之技術領域】 本發明係關於-種在表面具有微細凹凸形狀之❹ 之製以方法、以及使用藉由該方法所獲得之模具,來萝造 既為低霧度(haze)又具優異防炫特性之防炫(anti_gia^) 膜之製造方法。[註:防_,有稱為防_之情形,同指 防止炫耀光之膜片或獏層而言] 【先前技術】 液晶顯示器及電渡顧 一。。女^ 肩不益面板、顯像管(陰極射線管: ㈣顯有機電致發光(士咖— new,㈦ 顯不4之圖像顯示裝置,當外光映人其顯示面時,會使 可視性文到顯相害。為了防止此種外光之映人,在重視 晝質的電錢個人電腦、外光㈣之㈣概用 (v=广era)及數位相機、利用反射光進行顯示之行動 電話等中’自以往以來在圖像顯示裝置之 =映入之薄膜層。此薄膜層大致可區分為: 膜所產生之干擾之無反射處理的薄二 错由在表面形成微細凹凸使射入光散射而 將映入影像晕化之防炫處理的薄膜所構成者。4二: 的無反㈣膜,係需形成均勻之光學膜厚的多層膜,因1 成本較尚。相對於此,德去的 、 造,因此^^ 4者的防炫膜,由於可較低廉地製 造口此廣泛用在大型個人電腦及監視器等之用途。 此種防炫膜自以往以來,係例如藉由將分散 之樹脂溶㈣料基㈣wt)上,且锻塗佈膜厚^ 321506 4 201017228 r- .填錢露出於塗佈臈表面,藉以在薄片上 凸之方法等來製造。然而,此種藉由使填充刺分散 之防炫膜,由於凹凸之配置及形狀會受到樹月旨 製邊 i充劑之分散狀態及塗佈狀態等所影響,因此難〜之填 的凹凸,而會有在較低霧度之防炫膜中無法獲得充二預期 炫效果之問題。再者,將此種習知之防炫臈配置防 ο 亮度分布而難《觀看,之所謂易於產生「閃燦°果產生 (Glittering)」現象之問題。 此外’在藉由使填充劑分散所製造之防炫膜中 二::射:與使填充劑分散之結合劑(binder)樹腊之折射 夹面:之情形下’於將該種防炫膜配置於圖像顯示裝置之 日、,亦會有因為填充劑與結合劑樹脂界面之光之散 '而使對比容易降低之問題。 « 方面,亦有一種不含有填充劑,僅以在透明樹脂 曰表面所形成之微細凹凸而顯現防炫性之嘗試。例如, ^種^特開2GG2'1891G6號公報(專利文獻丨)中,係揭示 透明Jr、、電離輻射線硬化性樹脂夾在壓花(emb〇SS)鑄模與 化,开/知薄膜之間之狀態下使該電離輻射線硬化性樹脂硬 凸呷彳成—維10點平均粗度及三維粗度基準面上相鄰接之 匕之平均距離分別滿足預定值之微細凹凸,且將形 321506 5 201017228 成有該凹凸之電離輻射線硬化性樹脂層設於前述透明樹脂 薄膜上之形態之防炫膜。 此外’使用一種在表面形成有微細凹凸之薄膜作為配 置於液日日顯不裝置之背面侧之光擴散層而非配置於顯示裝 置之顯示面之防炫膜,亦揭示於例如日本特開平6-34961 號心報(專利文獻2)、日本特開2004-45471號公報(專利 文獻3)日本特開2〇〇4_45472號公報(專利文獻4)等。其 =在專利文獻3、4中,係揭示—種將電離輻射線硬化性樹 脂液充填於具有使凹凸反轉之形狀之壓花輥(embossing roll)且使與板之旋轉方向时行進之透明基材與所 充真之樹^接觸,透明基材與較凹板接觸時,使位在親凹 板:、透月基材之間的樹脂硬化,並與硬化同時使硬化樹脂 ”透月基材貼緊之後’將硬化後之樹脂與透明基材之疊層 體從親凹版_之方法,以作為在薄縣面形成凹凸之方 ; 在此種專利文獻3、4所揭示之方法中,由於 ::用之電離輻射線硬化性樹脂液之組成有限,而且無 膜ί之:布時之調平—a ’因此預料在 方法中,Γ 再者’在專利文獻3、4所揭示之 了確保凹凸樹脂液充填於壓花輥凹版’因此為 精確度,而會’乃要求壓花親凹版要有較高機械 — 有難以製作壓花輕之問題。 作方Ϊ二Μ面具有凹凸之薄膜之製作所制之糙之案 、D例如,在上述之專利文獻2中,係揭示一種 321506 6 201017228 使用金屬等製作圓筒體,且在其表面藉由電t 喷砂(sand blast)等方法形成凹凸之^電子雕刻、侧、 〇疋方法。此外,在 特開2004-29240號公報(專利文獻5)中,係 在日本 ‘ 噴擊(beads shot)法製作壓花輥 不種藉由 聰-麵號公報(專利文獻6)中則揭示 輥之表面形成織覆層之步驟、將層 •行鏡面研磨之步驟、再者視需要進行細敲^之表^進 之步驟,以製作壓花輥之方法。 ning)處理 ❹ 然而,在以此方式對壓花镜之表_ 處理之狀態下,會產生因為喷石少 ' ^ (blast) 一布,並且難以控制二:t布㈣起之 度,而在要以重現性良好地獲^ 士 又侍之凹陷之深 之形狀上尚有其問題。Ί、有優⑽炫功能之凹凸 此外,在上述之專利文獻丨 鐵之表面施行鉻錢覆(鑛鉻)之_ ” 5己載較佳為使用在 ❹ 成凹凸模面。再者,亦記載有在把’藉由珠擊法或珠擊法形 中,為了提升使用時之耐t在:^此方式形成凹凸之模面 # 旺,係以實施鍍鉻等後再使用 ,較佳’猎此可謀求硬膜化及防止義之内容。另-方面, 上达專=獻3、4各個實施例巾,係記載有對鐵愁表面 施订鉻鐘覆⑽鉻),並在進行#25〇之液體喷砂處理之後, 再度進讀鉻處理,而在表面形成微細凹凸形狀。 然而’在此種壓花輥之製作法甲,由於在硬度較高之 =鉻之上進行噴砂射擊,因此難以形成凹凸,而且難以 精密地控制所形成之凹凸之形狀。此外,亦如日本特開 321506 7 201017228 2004-29672 #υ公報(專利文獻7)所記戴,由於祕本身取 , 、'、於構成基底之材質及其形狀而使其表面常會變粗繞,1 - 在藉由噴砂所形成之凹凸上形成因為鍊鉻所產生之微細之 裂縫(Crad〇,因此會有難以設計要形成何種凹凸之問題。. 再者’由於有因為鑛鉻所產生之微細之裂缝,因此亦有最 , 終獲得之防炫膜之散射特性往不理想之方向變化之問題。 再者’由於因壓花輥母材表面之材質與錢覆種類之組合,. 會使精加工之輥表面有各種變化,因此亦會有為了要以良 子精確度獲彳$所需之表面凹凸形狀,必須選擇適當之絲 ❹ 面之材質與適當之錢覆種類之問題。再者,即使獲得所希 表面凹凸开乂狀,也會有因為鍍覆種類而有使用時之而才 久性不足之問題。 在日本特開2000-284106號公報(專利文獻8)中,雖 記載有在對基材施行喷砂加工之後,施行侧步驟及/或 4膜之f層步驟’惟並未記載及暗示在噴砂步驟前設置金 屬鍍覆層。此外,在日本特開2〇〇6_53371號公報(專利文 獻9)中,係記載有在將基材研磨,且施行噴砂加工之後, 施仃無電解鍍鎳◊此外,在日本特開2〇〇7_187952號公報 y專利文獻10)中,係記載有對基材施行鍍銅或鍍鎳之後進 仃研磨,並於施行喷砂加工之後,施行鍍鉻而製作壓花版, 再者,在日本特開2007-237541號公報(專利文獻n)中, 係記載有在施行鐘銅或鍍錄之後進行研磨,並於施行喷砂 加工之後,施行蝕刻步驟或鍍銅步驟,之後再施行鍍鉻而 製作壓花版。在此等使用喷砂加工之製法中,由於難以在 321506 8 201017228 精密控制表面凹凸形狀之狀態下形成,因此在表面凹凸形 狀亦會製作出具有50//m以上周期之較大之凹凸形狀。結 果,有該等較大之凹凸形狀與圖像顯示裝置之像素產生干 ‘ 擾,產生亮度分布而難以觀看,之所謂容易產生閃爍之問 . 題。 【發明内容】 . 本發明之目的係提供一種有助於製作顯示較高防炫 功能之防炫膜,在表面具有微細凹凸形狀之模具之製造方 ❹ 法,再者,亦提供一種使用該模具,製造既顯示優異之防 炫功能,又充分防止因為白濁導致可視性之降低,且配置 在高精細之圖像顯示裝置之表面時不會產生閃爍,對比不 會降低之防炫膜之製造方法。 此外,本發明之另一目的係雖採用硬度及表面光澤等 具有優異性之鍍鉻作為對於模具表面之鍍覆,但製造不會 在該鍍鉻面產生粗糙化,而適於製作防炫膜之模具,且使 _ 用該模具製造顯示優異防炫功能之防炫膜。 本發明之模具之製造方法,其特徵為包括:第1鍍覆 步驟,對模具用基材之表面施行鍍銅或鍍鎳;研磨步驟, 將藉由第1鍍覆步驟施行鍍覆之表面進行研磨;感光性樹 脂膜形成步驟,將感光性樹脂塗佈於所研磨之面而形成 膜;曝光步驟,使圖案曝光在感光性樹脂膜上;顯影步驟, 將經曝光有圖案之感光性樹脂膜進行顯影;蝕刻步驟,使 用經顯影之感光性樹脂膜作為遮罩,施行姓刻處理,且在 經研磨之鍍覆面形成凹凸;及第2鍍覆步驟,對於藉由蝕 9 321506 201017228 刻步驟所形成之凹凸面施行鍍鉻;而且,在前述⑽步驟 中,對模具用基材整面施行餃刻處理。 在此,所謂賴具隸㈣面施行_處理,係指在 模具用基材中,對於包含由前述遮罩所覆蓋之區域之登面 施行姓刻處理。在㈣處理之過程中,通常係首先將未由 遮罩所覆蓋之區域進行_,且隨著之後之處理的進行, 連由遮罩所覆蓋之區域亦進行蝕刻。201017228 VI. Description of the Invention: [Technical Field] The present invention relates to a method for producing a crucible having a fine concavo-convex shape on a surface, and a mold obtained by the method, which is a low mist Haze has an anti-glare property (anti_gia^) film manufacturing method. [Note: Anti-_, there is a case called anti-_, the same refers to the film or layer to prevent the display of light] [Prior Art] LCD monitor and electric pass. . Female ^ shoulderless panel, picture tube (cathode ray tube: (four) display organic electroluminescence (Shi coffee - new, (7) not 4 image display device, when the external light reflects its display surface, will make the visibility text In order to prevent this kind of external light, the mobile phone that pays attention to the enamel, the personal computer, the external light (4), the general purpose (v=wideera), the digital camera, and the mobile phone that uses the reflected light for display. In the past, the film layer has been reflected in the image display device. The film layer can be roughly divided into: the film-free interference caused by the non-reflective treatment of the film is formed by forming fine concavities and convexities on the surface to make the light into the light. A film that scatters and reflects the anti-glare treatment of the image hazy. 4: The anti-reflection (four) film is a multilayer film that needs to form a uniform optical film thickness, because the cost is relatively high. It is widely used in large personal computers and monitors because it can be manufactured at a lower cost because it can be manufactured at a lower cost. This anti-glare film has been used, for example, by Dispersed resin dissolved (four) material base (four) wt), and forging coating film thickness ^ 32150 6 4 201017228 r- . The filling is exposed on the surface of the coated crucible, whereby it is made by the method of convexizing on the sheet, etc. However, the anti-glare film which is dispersed by the filling thorn is subject to the tree due to the arrangement and shape of the concavities and convexities. Because of the influence of the dispersion state and the coating state of the side-filling agent, it is difficult to fill the unevenness, and there is a problem that the anti-glare film in the lower haze cannot be obtained. It is difficult to "view", which is easy to produce the phenomenon of "Glittering". It is also made by dispersing the filler. In the anti-glare film, the second:: shot: the refractive index of the binder of the binder dispersed in the filler: in the case of the anti-glare film disposed on the image display device, There is a problem that the contrast is easily lowered due to the dispersion of light at the interface between the filler and the binder resin. « In terms of the aspect, there is also a filler which does not contain a filler, and exhibits anti-glare property only by fine irregularities formed on the surface of the transparent resin crucible. Try it. For example, ^ species ^ special open 2GG2'1891 In the G6 publication (Patent Document No.), it is disclosed that the transparent Jr, the ionizing radiation curable resin is sandwiched between the embossing (emb〇SS) mold and the film, and the ionizing radiation is hardened in a state between the film. The hard resin of the resin is formed into a 10-point average roughness and the average distance between adjacent ones on the three-dimensional thickness reference surface respectively satisfies a predetermined value of fine concavities and convexities, and the shape 321506 5 201017228 is formed with the irregular ionizing radiation An anti-foam film in which the line curable resin layer is provided on the transparent resin film. Further, a film having fine concavities and convexities formed on the surface is used as a light diffusion layer disposed on the back side of the liquid day display device instead of the configuration. The anti-glare film on the display surface of the display device is disclosed in, for example, Japanese Laid-Open Patent Publication No. Hei 6-34961 (Patent Document 2), and Japanese Patent Laid-Open Publication No. 2004-45471 (Patent Document 3). No. (Patent Document 4) and the like. In Patent Documents 3 and 4, it is disclosed that the ionizing radiation curable resin liquid is filled in an embossing roll having a shape in which the unevenness is reversed and is transparent in the direction of rotation of the plate. The substrate is in contact with the true tree, and when the transparent substrate is in contact with the concave plate, the resin is hardened between the hydrophilic plate and the hardened resin, and the hardened resin is cured at the same time as the hardened resin. After the material is adhered, 'the method of forming the laminate of the cured resin and the transparent substrate from the pro-gravure plate as the concave and convex surface on the thin surface; in the method disclosed in the patent documents 3 and 4, Because:: The composition of the ionizing radiation hardening resin liquid used is limited, and there is no film: the leveling of the cloth - a 'so expected in the method, Γ again, as disclosed in Patent Documents 3 and 4. It is ensured that the embossed resin liquid is filled in the embossing roll gravure', so it is accurate, and it is required to have a higher machine for the embossing pro-gravure plate - it is difficult to make the embossing light problem. The case of the production of the rough, D, for example, in the above In Document 2, a method of forming a cylindrical body using a metal or the like and forming irregularities on the surface by electric blasting, sand blasting, etc., is disclosed. Japanese Laid-Open Patent Publication No. 2004-29240 (Patent Document 5) discloses the formation of an embossing roll by the "beads shot" method in Japan, and discloses the surface formation of a roll by the Cong-face number (Patent Document 6). The step of weaving the coating layer, the step of polishing the layer and the mirror surface, and the step of finely tapping the surface of the surface to prepare the embossing roll. 宁) Processing ❹ However, in this way, the pressure is applied. The appearance of the flower mirror _ in the state of processing, there will be a ' ^ (blast) cloth because of the less stone, and it is difficult to control the degree of the second: t cloth (four), and it is necessary to obtain the reproducible good There is still a problem in the shape of the depth of the depression. Ί, there is the convexity of the excellent (10) illusion function. In addition, the chrome surface coating (mineral chrome) is applied to the surface of the above-mentioned patent document 丨铁. ❹ Become a concave and convex surface. In addition, it is also described that in the case of using the bead blasting method or the bead blasting method, in order to improve the resistance during use, the surface of the surface is formed by embossing, etc. It is better to hunt this to achieve hard film and prevent the content of justice. On the other hand, the stencils are provided with a chrome clock (10) chrome on the surface of the shovel, and after the liquid blasting of #25〇, the chrome is read again. The treatment is performed to form a fine uneven shape on the surface. However, in the method of producing such an embossing roll, since sandblasting is performed on the harder than the chromium, it is difficult to form irregularities, and it is difficult to precisely control the shape of the formed irregularities. In addition, as described in Japanese Patent Laid-Open No. 321506 7 201017228 2004-29672 #υ公刊(Patent Document 7), since the secret itself is taken, ', the surface of the substrate and its shape are often thickened, 1 - A fine crack (Crad〇) due to chain chrome is formed on the unevenness formed by sand blasting, so it is difficult to design what kind of unevenness is to be formed. Further, because of the occurrence of chromium Fine cracks, therefore, there is also the problem that the scattering properties of the anti-foam film obtained in the end are changed in an undesired direction. In addition, due to the combination of the material of the surface of the embossing roll and the type of money covered, There are various changes in the surface of the finished roll, so there is also the need to select the appropriate surface of the wire and the appropriate type of material to be able to obtain the desired surface shape with good precision. In addition, there is a problem that the surface of the surface is inferior in use, and there is a problem in that it is insufficient in use due to the type of plating. In JP-A-2000-284106 (Patent Document 8), it is described in Substrate After the blasting process, the side step and/or the f-layer step of the film 4 are not described and suggested to provide a metal plating layer before the blasting step. Further, Japanese Patent Laid-Open Publication No. Hei 2-6-53371 (Patent Literature) (9) In the case of polishing the base material and performing the blasting process, the electroless nickel plating is applied, and the base is described in Japanese Patent Laid-Open Publication No. Hei. No. Hei. The material is subjected to copper plating or nickel plating, and is subjected to pulverization, and after blasting, chrome plating is performed to produce an embossed plate, and in Japanese Laid-Open Patent Publication No. 2007-237541 (Patent Document n), After performing the copper plating or plating, the polishing is performed, and after the sandblasting is performed, an etching step or a copper plating step is performed, and then chrome plating is performed to prepare an embossed plate. In the method of using the blasting process, it is difficult to form the surface unevenness of the surface of the 321506 8 201017228. Therefore, a large uneven shape having a period of 50/m or more is produced in the surface uneven shape. As a result, there is such a large concave-convex shape and the pixels of the image display device generate a disturbance, and a luminance distribution is generated and it is difficult to watch, and the so-called flicker is easy to cause. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a mold which has a high anti-glare function and which has a fine concavo-convex shape on the surface, and further provides a mold for using the mold. , manufacturing method for preventing anti-glare film which exhibits excellent anti-glare function and sufficiently prevents visibility from being lowered due to white turbidity, and which does not cause flicker when disposed on the surface of a high-definition image display device, and which does not reduce contrast . Further, another object of the present invention is to use chrome plating having excellent properties such as hardness and surface gloss as plating on the surface of the mold, but the production does not cause roughening on the chrome surface, and is suitable for making a mold for preventing the glare film. And use this mold to manufacture an anti-glare film that exhibits an excellent anti-glare function. A method of manufacturing a mold according to the present invention, comprising: a first plating step of performing copper plating or nickel plating on a surface of a substrate for a mold; and a polishing step of performing a plating surface by the first plating step a polishing resin film forming step of applying a photosensitive resin to the surface to be polished to form a film; an exposure step for exposing the pattern to the photosensitive resin film; and a developing step for exposing the photosensitive resin film having a pattern Developing; etching step, using a developed photosensitive resin film as a mask, performing a surname process, and forming irregularities on the polished plated surface; and a second plating step for etching steps by etching 13 321506 201017228 The formed uneven surface is subjected to chrome plating; and, in the above step (10), the entire surface of the substrate for the mold is subjected to a dumping process. Here, the term "processing" means that the substrate for a mold is subjected to a surname treatment for a surface including a region covered by the mask. In the process of (iv) processing, the area not covered by the mask is usually first _, and the area covered by the mask is also etched as the subsequent processing proceeds.

以本發明之模具之製造方法而言,係以前述姓刻步驟 係為:使用_影之感紐樹賴作為料,對於模具用 基材中包含由前述遮精輕之區域之整面,施行触刻處 理,而在經研磨之鍍覆面形成凹凸之步驟為較佳之一態樣 (以下亦稱模具之製造方法A)。 此外,在對模具用基材整面施行姓刻處理時,在將由 遮罩所覆蓋之所有區域進行侧之前暫時結輕刻,將遮 罩剝離後再度進行關處理,結果對模制基材整面進行 敍刻處理亦可。In the method for manufacturing a mold according to the present invention, the step of the above-mentioned surname is as follows: using the sensation of the sensation of the sensation as a material, and performing the entire surface of the substrate for the mold containing the lighter area of the occlusion. The step of forming the irregularities on the polished plating surface is a preferred one (hereinafter also referred to as the manufacturing method A of the mold). In addition, when the entire surface of the substrate for the mold is subjected to the surname treatment, the surface of all the areas covered by the mask is temporarily etched, and the mask is peeled off and then closed again. It is also possible to carry out the engraving process.

/以本發明之模具之製衫m細前述制步〗 係包括:第1㈣步驟’使雜顯影之感紐樹脂膜作』 遮罩並進行蝕刻處理,在經研磨之鍍覆面形成凹凸;、感3 性樹脂膜剝離步驟,將感光性樹脂膜剝離丨及、γ ==完全_感光性樹脂膜之後,藉由_處理使= 第1蝕刻步驟所形成之凹凸面鈍化為較佳 9 稱為模具之製造方法B)。 態樣(亦 在本發明之模具之製造方法中,,步驟中之 321506 10 201017228 係以2至100//in為較佳。 本么月之模具之製造方法B中之第1敍刻步驟中之 • 侧量係以1至50心為較佳。 在本發明之模具之製造方法B中之第2蝕刻步驟中之 钱刻量係以1至50_為較佳。 、在本發明之模具之製造方法中,係以將在電腦上所作 成之圖案貝料以從經電腦控制之雷射頭所發出之雷射光進 行、、'曰而藉此在曝光步驟中對於感光性樹脂膜上進行圖 罾案之曝光為較佳。 、於1本發明之模具之製造方法中,係以在顯影步驟後未 被/合解所殘留之感光性樹脂膜(以下亦將顯影後未被溶解 所T之感光性樹脂膜稱為「遮罩」)對於模具用基材表面 之才又〜面積,相對於在模具用基材表面中形成有表面凹凸 形狀之區域之面積為1至70%為較佳。 在本發明之模具之製造方法中,係以在模具用基材表 ❹面„mxl〇0/zm之區域中之遮罩對於模具用基^表面 之投影面積之標準偏差為l〇〇〇#m2以下為較佳。 ^在本發明之模具之製造方法中,係以在施行鍍鉻之 後,不研磨表面,直接使用鍍鉻面作為模具之凹凸面為較 佳。 ”、 本發明之模具之製造方法,係以藉由鍍鉻所形成之鍍 絡層具有1至10之厚度為較佳。 此外,本發明亦提供〆種防炫膜之製造方法,係包 括.將以上述本發明之模具之製造方法所製造 領:吳之凹 321506 11 201017228 凸面轉印至透明樹脂薄膜之步驟;及從模具將轉印有模具 之凹凸面之透明樹脂薄膜剝離之步驟。 依據本發明之模具之製造方法,由於在表面以良好精 確度形成有微細之凹凸形狀,因此可以良好重現性,且幾 ‘ 乎不存在缺陷之狀態下製造成為有助於製造顯示高防炫功 ' 能之防炫膜之模具。再者,依據本發明之防炫膜之製造方 法,既可保持低霧度、顯示圖像之明亮度,又可防止映入 及反射、抑制白濁、防止產生閃爍、防止對比降低等,在 工業上有助於製造具有優異防炫性能之防炫膜。 ❿ 【實施方式】 <模具之製造方法> 第1圖係示意性顯示本發明之模具之製造方法之前半 部分之較佳之一例圖。 在第1圖中係示意性顯示各步驟中之模具之剖面。本 發明之模具之製造方法之前半部分,基本上係包括:[1] 第1鍍覆步驟;[2]研磨步驟;[3]感光性樹脂膜形成步驟; _ 及[4]曝光步驟。以下,一面參照第1圖’一面詳細說明本 發明之模具之製造方法之前半部分之各步驟。 [1]第1鍍覆步驟 在本發明之模具之製造方法中,首先係對於用於模具 之基材之表面,施行鑛銅或鐘鎳。如此,藉由對模具用基 材之表面施行鍍銅或鍍鎳,即可提升之後之第2鍍覆步驟 中之鍍鉻之密接性及光澤性。亦即,如先前技術中所述, 對於鐵等之表面施行鍍鉻時,或是對鍍鉻表面以喷砂法或 12 321506 201017228 .珠擊法等形成凹凸後再度施行鍍鉻時,表面易於粗縫,產 生細微之裂縫,而難以控制模具之表面之凹凸形狀。相對 •於此,首先’藉由對基材表面施行鍍銅或鍍鎳,可消除此 種缺失。此係由於鍍銅或鍍鎳之覆蓋性較高,而且平滑化 ,強’因此將模具用基材之微小的凹凸及孔穴(cavity) 而形成平坦且具有光澤之表面之故。依據此等鍛銅 ^链錦之特性,即使在後述之第2链覆步驟中施⑽絡, ο 鉻2決存在於因為基材之微小的凹凸及孔穴所引起的鍍 此心之_ ’而且’由於鍍銅或錢鎳之覆蓋性較高,因 匕可減低細微裂縫的產生。 為純所使用之綱或鎳而言,除分別可 之人全 Α可為以銅為主體之合金、或以錄為主體 之:金’因此本說明書所稱之「銅」係指包含銅及銅合金 係;二外:鎳」係指包含鎳及錦合金之意。鍍銅及鍍鎳 φ 通常係採用電解鍍覆。電解鑛覆來進行,惟 武t行鑛鋼或鑛錄時,若鍍覆層過薄,則無法完全排 鍵二面::響’因此其厚度係—上為較佳。 般俜至t 雖無限定,惟從成本等之均衡而言,- ’、至5〇〇am左右就足夠。 基材發之製造方法中’以適用於形成 等。再者從而吕’從成本之觀點來看,例如有紹、鐵 此所稱之:::方便性來看’尤以輕量的鋁為較佳。在 冉之銘及鐵,除分別可為純金屬外,尚可為以铭或鐵 321506 13 201017228 為主體之合金。 此外,基材之形狀,在該領域中只要是習知所採用之 適當的形狀,則無特別限制,可為平板狀,亦可為圓柱狀 或圓筒狀之輥。若使用輥狀之基材製作模具,則具有能以 · 連續的輥狀製造防炫膜之優點。 ' [2]研磨步驟 在研磨步驟中,係將在上述之第1鍍覆步驟中施行鍍 銅或鍍鎳之基材表面進行研磨。經過該步驟,基材表面係 以研磨成接近鏡面之狀態為較佳。此係由於成為基材之金 © 屬板或金屬輥,為了作成所希望之精確度,大多係施行了 切削或研削等之機械加工,因而會在基材表面殘留下加工 傷痕,故即使在施行鍍銅或鍍鎳之狀態下,亦會有殘留下 該等加工傷痕之情形,而且,在鍍覆之狀態下,表面亦未 必會變得完全平滑。亦即,即使在此種殘留下較深加工傷 痕等之表面施行後述之步驟,亦會有加工傷痕等之凹凸較 施行各步驟後所形成之凹凸還深之情形,而有殘留加工傷 _ 痕等之影響之可能,而在使用該種模具製造防炫膜時,對 於光學特性會造成無法預期之影響。在第1圖(a)中,係示 意性顯示平板狀之模具用基材1,在第1鍍覆步驟中在基 材表面施行鍍銅或鍍鎳(至於該步驟中所形成之鍍銅或鍍 鎳之層並未圖示),再藉由研磨步驟作成具有鏡面研磨之表 面2之狀態。 關於將施行有鍍銅或鍍鎳之基材表面進行研磨之方 法並無特別限制,可使用機械研磨法、電解研磨法、化學 14 321506 201017228 • 研磨法之任一種。以 .機械研磨法而言,係例如有超精密加 耸laPPlng)、流體研磨法、拋光輪(buff)研磨法 ‘ ^度’係以依照川請01之規定之中 •較佳,且以u一 由於最終之^表^中心線平均粗度MQ.lM大時, 表面粗度的影響,故不^形t可能會殘留下研磨後之 Ο h之下限並無特別限制;二關於中心線平均粗度 , Α ^ ^ , 從加工^間與加工成本之觀點而 。,自齡有極限,因此無須特別指定。 [3 ]感光性樹脂膜形成步驟 在感光性樹脂膜形成步驟中,係對於藉由上述之研磨 2施行鏡面研磨之基材丨之表面2,塗佈將感光性樹脂 =於溶媒之溶液’並進行加熱、乾燥,藉此以形成感光 2,旨膜。在第1圖(b)中,係示意性顯示在基材ί之表面 2形成有感光性樹脂臈3之狀態。 ❹ 以感光性樹脂而言,係可使用習知公知之感光性樹 ^例如,以具有感光部分硬化之性質之負型感光性樹脂 。’係錢用在分子中具有丙烯醯基或甲基丙烯酿基之 3酸§1之單體或預聚物、二疊氮化合物(Bisazide)與二 =橡膠之混合物、聚肉桂酸乙_⑽yvinyicin_te) /、匕合物等。此外’以藉由顯影溶域光部分,且呈有僅 殘留下未感光部分之性質之正型感光性樹脂而言,係可使 ^樹脂系或麟清漆樹料。此外,在感光性誠中, 而要亦心周配敏化劑、顯影促進劑、密接性改質劑、塗 321506 15 201017228 佈性改良劑等之各種添加劑。 將此等感光性樹脂塗佈於基材1之表面2時,為了形 成良好的塗膜’係以稀釋於適當之溶媒進行塗佈為較佳, 可使用溶纖劑(cell〇s〇lve)系溶媒、丙二醇系溶媒、酯系 , 溶媒、醇系溶媒、酮系溶媒、高極性溶媒等。 - 以塗佈感光性樹脂溶液之方法而言,係可使用彎液式 塗覆(meniscus coat)、噴泉(fountain)塗覆、浸潰(dip) 塗覆、旋轉塗佈、輥塗佈、線棒(wire bar)塗佈、氣動刀 (air knife)塗佈、刮刀(blade)塗佈、及簾幕(curtain) ❹ 塗佈等之公知方法。塗佈膜之厚度係以設為乾燥後i至 6ym之範圍為較佳。 [4]曝光工程 在曝光步驟中,係將預定之圖案曝光於在上述之感光 性樹脂膜形成步驟中所形成之感光性樹脂膜3上。曝光步 驟中所使用之光源,係可配合所塗佈之感光性樹脂膜之感 光波長或靈敏度等而適當選擇,例如可使用高壓水銀燈之 g線(波長:436nm)、高壓水銀燈之^線(波長j〇5nm)、 ❹ 高壓水銀燈之i線(波長:365nm)、半導體雷射(波長: 830咖、53211111、48811111、4〇511111等)、以(;雷射(波長:1〇6411111)、/ The step of making the mold of the mold of the present invention is as follows: the first step (4) is to "make the hybrid resin film of the hybrid" mask and perform etching treatment to form irregularities on the polished plating surface; In the third resin film peeling step, after the photosensitive resin film is peeled off and the γ ==complete_photosensitive resin film, the uneven surface formed by the first etching step is passivated to be preferably 9 by the treatment. Manufacturing method B). In the method of manufacturing the mold of the present invention, the step of the step 32105 10 201017228 is preferably 2 to 100 / / in. In the first step of the manufacturing process of the mold of the month The side amount is preferably from 1 to 50. The amount of money in the second etching step in the manufacturing method B of the mold of the present invention is preferably from 1 to 50 mm. In the manufacturing method, the pattern of the beaker made on the computer is carried out by laser light emitted from a computer-controlled laser head, and is thereby performed on the photosensitive resin film in the exposure step. In the method for producing a mold according to the present invention, the photosensitive resin film remaining after the development step is not/resolved (the following is also not dissolved after development) The photosensitive resin film is referred to as a "mask". It is preferable that the area of the surface of the substrate for the mold is from 1 to 70% with respect to the area of the region in which the surface unevenness is formed on the surface of the substrate for the mold. In the manufacturing method of the mold of the present invention, the substrate for the mold is used The standard deviation of the mask in the area of „mxl〇0/zm for the projection area of the mold base surface is preferably l〇〇〇#m2 or less. ^ In the manufacturing method of the mold of the present invention, After the chrome plating is performed, it is preferable to use the chrome-plated surface as the concave-convex surface of the mold without using the chrome-plated surface. The method for manufacturing the mold of the present invention has a thickness of 1 to 10 by the chrome plating layer formed by chrome plating. Further, the present invention also provides a method for producing an anti-foam film, which comprises the steps of: transferring a convex surface to a transparent resin film by the method of manufacturing the mold of the present invention: Wu Zhishou 321506 11 201017228; a step of peeling off a transparent resin film on which a concave-convex surface of a mold is transferred from a mold. According to the method for producing a mold of the present invention, since a fine uneven shape is formed on the surface with good precision, good reproducibility can be obtained, and 'It is manufactured in a state where there is no defect, and it is a mold which contributes to the manufacture of an anti-glare film which exhibits high anti-glare function. Further, according to the manufacturing method of the anti-foam film of the present invention, It maintains low haze and displays the brightness of the image, prevents reflection and reflection, suppresses white turbidity, prevents flicker, prevents contrast reduction, etc., and industrially contributes to the manufacture of anti-glare film with excellent anti-glare properties. [Embodiment] <Manufacturing Method of Mold> Fig. 1 is a view schematically showing an example of the first half of the method for manufacturing a mold of the present invention. In Fig. 1, the mold in each step is schematically shown. The first half of the manufacturing method of the mold of the present invention basically comprises: [1] a first plating step; [2] a grinding step; [3] a photosensitive resin film forming step; _ and [4] an exposure step Hereinafter, each step of the first half of the manufacturing method of the mold of the present invention will be described in detail with reference to FIG. [1] First plating step In the method for producing a mold of the present invention, first, ore or nickel is applied to the surface of the substrate for the mold. Thus, by performing copper plating or nickel plating on the surface of the substrate for the mold, the adhesion and gloss of the chrome plating in the second plating step can be improved. That is, as described in the prior art, when chrome plating is applied to the surface of iron or the like, or when the chrome-plated surface is embossed by sandblasting or 12 321 506 201017228 . A fine crack is generated, and it is difficult to control the uneven shape of the surface of the mold. In contrast, first, the absence of such a defect can be eliminated by applying copper or nickel plating to the surface of the substrate. This is because the coating of copper plating or nickel plating is high, and it is smooth and strong, so that the surface of the mold substrate has a small unevenness and a cavity to form a flat and shiny surface. According to the characteristics of these wrought copper chains, even if the (10) layer is applied in the second chain coating step described later, the chromium 2 is present in the core due to the minute irregularities of the substrate and the holes. 'Because of the high coverage of copper or nickel, it can reduce the occurrence of fine cracks. For the purely used class or nickel, the person who can be used as the main body of the copper or the main body of the gold: 'the copper' means copper and Copper alloy system; second: nickel" means the meaning of nickel and nylon alloy. Copper plating and nickel plating φ are usually electrolytically plated. Electrolytic ore coating is carried out. However, if the plating layer is too thin, it is impossible to completely discharge the two sides: the sound is therefore better. There is no limit to the general 俜 to t, but in terms of the balance of cost, etc., it is enough to be around 〇〇am. In the method of producing a substrate, 'is suitable for formation and the like. In addition, from the point of view of cost, Lv's, for example, is referred to as: "Important:": Lightweight aluminum is preferred. In addition to the pure metal, it can be an alloy with Ming or iron 321506 13 201017228 as the main body. Further, the shape of the substrate is not particularly limited as long as it is a conventionally used shape, and may be a flat plate shape or a cylindrical or cylindrical roll. When a mold is produced using a roll-shaped base material, there is an advantage that the anti-foam film can be produced in a continuous roll shape. [2] Polishing step In the polishing step, the surface of the substrate on which copper plating or nickel plating is applied in the first plating step described above is polished. Through this step, it is preferred that the surface of the substrate be ground to a state close to the mirror surface. Since this is a gold plate or a metal roll that becomes a base material, in order to achieve the desired accuracy, machining such as cutting or grinding is often performed, so that scratches are left on the surface of the substrate, so even if it is performed In the case of copper plating or nickel plating, such processing flaws may remain, and the surface may not be completely smooth in the state of plating. In other words, even if the surface described later is subjected to deep processing of the flaws or the like, the irregularities such as the processing flaws are deeper than the irregularities formed after the respective steps are performed, and there are residual processing injuries and the like. The effect is that when the anti-glare film is manufactured using the mold, the optical characteristics may have an unpredictable influence. In Fig. 1(a), a flat substrate 1 for a mold is schematically shown, and in the first plating step, copper plating or nickel plating is applied to the surface of the substrate (as for the copper plating formed in the step or The nickel-plated layer is not shown), and the mirror-polished surface 2 is formed by the grinding step. The method of polishing the surface of the substrate to which copper plating or nickel plating is applied is not particularly limited, and any of mechanical polishing, electrolytic polishing, and chemical processing can be used. In terms of mechanical grinding, for example, ultra-precision plus laPPlng), fluid grinding method, buff grinding method '^ degree' is in accordance with the requirements of Chuan 01, preferably, and u Because the final thickness of the center line is the large thickness of MQ.lM, the influence of the surface roughness, so the lower limit of the Ο h after the grinding may not remain unrestricted; The thickness, Α ^ ^ , from the point of view of processing and processing costs. There are limits from age, so there is no need to specify. [3] Photosensitive Resin Film Forming Step In the photosensitive resin film forming step, a photosensitive resin = a solution of a solvent is applied to the surface 2 of the substrate 施 which is mirror-polished by the above-described polishing 2 Heating and drying are carried out to form a photosensitive film 2, which is a film. In Fig. 1(b), a state in which the photosensitive resin crucible 3 is formed on the surface 2 of the substrate 355 is schematically shown. ❹ In the case of a photosensitive resin, a conventionally known photosensitive resin can be used, for example, a negative photosensitive resin having a photosensitive portion hardening property. 'Used as a monomer or prepolymer of §1 with propylene fluorenyl or methacrylic acid in the molecule, a mixture of Biazazide and bis(rubber), poly(cinrylic acid) _(10)yvinyicin_te ) /, compound, etc. Further, in the case of a positive-type photosensitive resin which develops a light-dissolving portion and exhibits a property of leaving only the un-photosensitive portion, it is possible to use a resin or varnish. In addition, in the photosensitivity, various additives such as a sensitizer, a development accelerator, an adhesion modifier, and a 321506 15 201017228 cloth improver are also required. When such a photosensitive resin is applied to the surface 2 of the substrate 1, it is preferred to form a good coating film to be diluted with a suitable solvent, and a cellosolve can be used. A solvent, a propylene glycol solvent, an ester system, a solvent, an alcohol solvent, a ketone solvent, a highly polar solvent, and the like. - In the method of coating the photosensitive resin solution, a meniscus coat, a fountain coating, a dip coating, a spin coating, a roll coating, a wire can be used. A well-known method such as wire bar coating, air knife coating, blade coating, curtain coating, and the like. The thickness of the coating film is preferably in the range of i to 6 μm after drying. [4] Exposure process In the exposure step, a predetermined pattern is exposed to the photosensitive resin film 3 formed in the above-described photosensitive resin film forming step. The light source used in the exposure step can be appropriately selected in accordance with the photosensitive wavelength or sensitivity of the applied photosensitive resin film, for example, a g-line of a high-pressure mercury lamp (wavelength: 436 nm), a line of a high-pressure mercury lamp (wavelength) can be used. J〇5nm), i i-line of high-pressure mercury lamp (wavelength: 365nm), semiconductor laser (wavelength: 830 coffee, 53211111, 48811111, 4〇511111, etc.), (; laser (wavelength: 1〇6411111),

KrF準分子雷射(波長·· 248nm)、ArF準分子雷射(波長: 193nm)、F2準分子雷射(波長:157nm)等。 在本發明之模具之製造方法中為了以良好精確度形 成表面凹凸形狀’係以在曝光步驟中,在精密控制之狀態 下將預定之圖案曝光於感光性樹脂膜上為較佳。在本發明 321506 16 201017228 .之模具之製造方法中,為了以良好精確度將預定之圖案曝 光於感光性樹脂膜上,係以在電腦上作成圖案資料,且以 ‘=腦=之雷射頭所發射之雷射光,來贿根據該圖案 •胃料之圖案為較佳。在進行此種雷射描料,係可使用印 刷版作成用之雷射描繪裝置。以此種雷射崎襄置而古, 係例如有Laser stream FX(Think_Lab股份有限公司 ❹ ❹ 在第i圖(〇中,係示意性顯示圖案曝光於⑭ 脂膜3H在Μ型感紐樹脂 時’所曝光之區域4藉㈣ ^膜 表面上而成為遮:液:::,僅曝光之區域4殘留在基材 光性樹脂臈時,所曝光7 ajE型感光性樹脂形成感 結’而對於後述之顯影液藉由曝光切斷樹脂之鍵 驟中曝光之%性增加。因此,在顯影步 留在基材表面上而成為^所溶解,僅未曝光之區域5殘 在此以感光性樹脂 表面之投影面積為曝先之區域對於模具用基材 凸形狀之區域<面積4τ &具用基材表面形成有表面凹 樹脂膜時,如比0 ㈣光性樹脂於感先性 行曝光為娜。此外,2 . G1至G· 7之方式作成圖案進 膜時,係以比(1-Μ)/τ\正型感光性樹脂於感光性樹脂 行曝光為較佳。以此種:01至〇.7之方式作成圖案進 b率作成圖案進行曝光,即可藉此 321506 17 201017228 將遮罩對於模具用基材表面之投影面積,對於模具用基材 表面中形成有表面凹凸形狀之區域之面積設為1至7〇0/〇。 第2圖係示意性顯示圖案曝光在從模具用基材表面之上面 觀察之感光性樹脂膜之狀態。所曝光之區域4之面積之總 合係為Μ,所曝光之區域4及未曝光之區域5之面積之總 合係為Τ。 u 將模具用基材表面之之區域中感光性 樹脂膜所曝光之區域對模具用基材表面之投影面積設為 M100時,M100之標準偏差係以1〇〇〇/im2以下為較佳。藉 尤以電腦作成圖案進行曝光,即可將模具用基材表面之 100# mxlOOem之區域中遮罩對於模具用基材表面之投影 面積之標準偏差設為1〇〇〇#m2以下。在此,Μι〇〇之標準^ 差,係可藉由針對3點以上不同位置之圖案求出1〇〇#似 l〇〇/zm之區域中之所曝光之面積M1〇〇來計算。在計算耵卯 之標準偏差時’為了減少誤差,係以針對5點以上不同位 置中之圖案求出l〇0#mxi〇Mm2區域令所曝光之面 M100為較佳。 關於藉由曝光所描緣之圖案之形狀並無特別限制 描繪排列有圓形、四角形、六角形等之圖案者,亦可描检 連續之圖案者’亦可描輕此等予以組合者。此外; 描緣排列有不同大小之圓形、四角形、六角形等之圖 此外,所描社圖案可規祕配置,亦可不按規則配置 在第2、3、4时係示意性顯示排财圓形之圖 尹’第3圖係示意性顯示排列有3種不同大小之圓形圖案 321506 18 201017228 者,第4圖係示意性顯示不規則配置有圓形圖案者。此外, 第5圖係示意性顯示配置有四角形圖案者,第6圖係示意 性顯示配置有六角形圖案者,第7圖係示意性顯示以重疊 ' 圓形圖案之方式配置來描繪連續性之圖案者。 * 在本發明之模具之製造方法之後半部分,係進行:將 經曝光有圖案之感光性樹脂膜進行顯影之顯影步驟;使用 所顯影之感光性樹脂膜作為遮罩,施行蝕刻處理,以在所 研磨之鍍覆面形成凹凸之蝕刻步驟;在藉由蝕刻步驟所形 ❹ 成之凹凸面施行鍍鉻之第2鍍覆步驟。惟在前述蝕刻步驟 中,係對模具用基材整面施行蝕刻處理。在此,所謂對模 具用基材整面施行蝕刻處理,係指在模具用基材中,對包 含由前述遮罩所覆蓋之區域之整面施行蝕刻處理。 在蝕刻處理之過程中,首先蝕刻未由遮罩所覆蓋之區 域,隨著之後處理之進行,亦蝕刻由遮罩所覆蓋之區域。 在列舉作為本發明之模具之製造方法之一態樣之模具之製 ^ 造方法A中,係利用此。亦即,在本發明之模具之製造方 法A中,前述蝕刻步驟,係使用所顯影之感光性樹脂膜作 為遮罩,對於在模具用基材中包含由前述遮罩所覆蓋之區 域之整面施行蝕刻處理,且在所研磨之鍍覆面形成凹凸之 步驟。 此外,前述蝕刻步驟係可如模具之製造方法A以一次 的蝕刻處理來構成,亦可以構成為分成二次以上來進行蝕 刻處理,並在該等蝕刻處理之間進行將前述遮罩去除之步 驟。例如,對模具用基材整面施行蝕刻處理時,於由遮罩 19 321506 201017228 所覆蓋之所有區域進行蝕刻之前暫且結束蝕刻,將遮罩去 除之後再度進行蝕刻處理,結果對模具用基材整面進行蝕 刻處理。在列舉作為本發明之模具之製造方法B之另一態 樣之模具之製造方法B中,係採用此。亦即,在本發明之 模具之製造方法B中,前述蝕刻步驟係包括:使用所顯影 · 之感光性樹脂膜作為遮罩進行蝕刻處理,且在所研磨之鍍 覆面形成凹凸之第1蝕刻步驟;將感光性樹脂膜剝離之感 光性樹脂膜剝離步驟;在完全去除感光性樹脂膜之後,以 蝕刻處理使藉由第1蝕刻步驟所形成之凹凸面鈍化之第2 © 蝕刻步驟。 以下就本發明之模具之製造方法A及B進一步說明。 < <模具之製造方法A> > [5A]顯影步驟 在顯影步驟中,於使用負型感光性樹脂於感光性樹脂 膜3時,未曝光之區域5係由顯影液所溶解,僅曝光之區 域4殘留於模具用基材上,在接下來的蝕刻步驟中發揮作 ^ 為遮罩作用。另一方面,在使用正型感光性樹脂於感光性 樹脂膜3時,僅經曝光之區域4由顯影液所溶解,未曝光 之區域5則殘留於模具用基材上,在接下來的蝕刻步驟中 發揮作為遮罩作用。 至於顯影步驟中所使用之顯影液,係可使用習知公知 者。例如有氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽 酸納、氨水等無機驗類;乙胺、正丙胺等一級胺類;二乙 胺、二正丁胺等二級胺類;三乙胺、曱基二乙胺等三級胺 20 321506 201017228 .類;二甲基乙醇胺、三乙醇胺等醇胺類;氫氡化四甲銨 氫氧化四乙敍、氫氧化三甲基經乙基錄(Trimet屻 、KrF excimer laser (wavelength · 248 nm), ArF excimer laser (wavelength: 193 nm), F2 excimer laser (wavelength: 157 nm), and the like. In the method for producing a mold of the present invention, in order to form the surface uneven shape with good precision, it is preferable to expose a predetermined pattern to the photosensitive resin film in a state of precise control in the exposure step. In the manufacturing method of the mold of the present invention, 321506 16 201017228, in order to expose a predetermined pattern to the photosensitive resin film with good precision, a pattern material is formed on a computer, and a laser head of '= brain= The laser light emitted by the bribe is preferred according to the pattern of the pattern. In carrying out such laser scanning, it is possible to use a printing plate as a laser drawing device. For example, there is Laser stream FX (Think_Lab Co., Ltd. ❹ ❹ in the i-th picture (〇, is a schematic display pattern exposed to 14 lipid film 3H in the case of Μ type sensitizing resin) 'The exposed area 4 borrows (4) ^ on the surface of the film to become a liquid:::, only the exposed area 4 remains in the base photosensitive resin ,, the exposed 7 ajE type photosensitive resin forms a sensible knot' The developing solution described later is increased in the amount of exposure in the bonding of the resin by exposure to the resin. Therefore, the developing step remains on the surface of the substrate to be dissolved, and only the unexposed region 5 remains therein as the photosensitive resin. The projected area of the surface is the area of the exposed area for the convex shape of the substrate for the mold. When the surface of the substrate is formed with a surface concave resin film, for example, the photosensitive film is exposed to a lighter than 0 (four) light resin. Further, in the case where the film is formed into a film by the method of G1 to G·7, it is preferred to expose the photosensitive resin to a photosensitive resin in a ratio of (1-Μ)/τ\ positive photosensitive resin. 01 to 〇.7 way to create a pattern into the b rate to create a pattern for exposure, you can use this 3215 06 17 201017228 The area of the mask to the surface of the substrate for the mold is set to 1 to 7 〇 0 / 对于 for the area of the surface of the substrate for the mold which has the surface uneven shape. Fig. 2 is a schematic display pattern The state of the photosensitive resin film observed from the upper surface of the substrate for the mold is exposed. The total area of the area of the exposed region 4 is Μ, and the total area of the exposed area 4 and the area of the unexposed area 5 is In the case where the area exposed by the photosensitive resin film in the region of the surface of the substrate for the mold is M100 on the surface of the substrate surface for the mold, the standard deviation of M100 is 1 〇〇〇/im 2 or less. Preferably, the standard deviation of the projected area of the surface of the substrate for the mold is set to 1 〇〇〇 #m2 or less in the area of 100# mxlOOem of the surface of the substrate for the mold. Here, the standard difference of Μι〇〇 can be calculated by finding the exposed area M1〇〇 in the region of 1〇〇#like l〇〇/zm for the pattern of different positions of 3 points or more. In calculating the standard deviation of 耵卯 'in order to reduce The error is obtained by finding the surface of the l〇0#mxi〇Mm2 region for the exposed surface M100 for the pattern at different positions of 5 or more points. The shape of the pattern by the exposure is not particularly limited. If there are patterns such as circles, squares, hexagons, etc., it is also possible to trace the continuous patterns. It can also be used to combine them. In addition, the strokes are arranged in different sizes of circles, squares, hexagons, etc. In addition, the pattern of the logo can be configured in a regular manner, or it can be arranged in the second, third, and fourth without a regular arrangement. The diagram of the circular display is shown in Fig. 3, which is schematically arranged in three different sizes. The circular pattern 321506 18 201017228, the fourth figure is a schematic representation of a person who is irregularly arranged with a circular pattern. In addition, FIG. 5 schematically shows a configuration in which a quadrangular pattern is arranged, FIG. 6 schematically shows a person in which a hexagonal pattern is arranged, and FIG. 7 schematically shows a configuration in which a circular pattern is overlapped to describe continuity. Patterner. * In the latter part of the manufacturing method of the mold of the present invention, a development step of developing the photosensitive resin film exposed by the pattern is performed; and the developed photosensitive resin film is used as a mask, and etching treatment is performed to The polished plating surface is formed with an etching step of forming irregularities; and the second plating step of performing chrome plating is performed on the uneven surface formed by the etching step. However, in the etching step described above, the entire surface of the substrate for the mold is subjected to an etching treatment. Here, the etching treatment of the entire surface of the substrate for a mold means that the entire surface of the region covered by the mask is etched in the substrate for the mold. During the etching process, the area not covered by the mask is first etched, and the area covered by the mask is also etched as the processing proceeds thereafter. In the production method A of the mold which is one of the manufacturing methods of the mold of the present invention, this is utilized. That is, in the method A for manufacturing a mold according to the present invention, the etching step is performed by using the developed photosensitive resin film as a mask, and the entire surface of the region covered by the mask is included in the substrate for a mold. An etching process is performed, and a step of forming irregularities on the plated surface to be polished is performed. In addition, the etching step may be configured by one etching process as in the manufacturing method A of the mold, or may be configured to be divided into two or more to perform an etching process, and the step of removing the mask between the etching processes is performed. . For example, when the entire surface of the substrate for a mold is subjected to an etching treatment, the etching is temporarily terminated before etching is performed on all the regions covered by the mask 19 321506 201017228, and the mask is removed and then etched again. The surface is etched. In the manufacturing method B of the mold which is another aspect of the manufacturing method B of the mold of the present invention, this is employed. That is, in the method B for manufacturing a mold according to the present invention, the etching step includes a first etching step of performing etching treatment using the developed photosensitive resin film as a mask and forming irregularities on the polished plating surface. A photosensitive resin film peeling step of peeling the photosensitive resin film; and a second © etching step of passivating the uneven surface formed by the first etching step by etching after the photosensitive resin film is completely removed. Hereinafter, the manufacturing methods A and B of the mold of the present invention will be further described. <<Production Method of Mold A>> [5A] Development Step In the development step, when the negative photosensitive resin is used in the photosensitive resin film 3, the unexposed region 5 is dissolved by the developer, only The exposed region 4 remains on the substrate for the mold and acts as a mask in the subsequent etching step. On the other hand, when a positive photosensitive resin is used for the photosensitive resin film 3, only the exposed region 4 is dissolved by the developer, and the unexposed region 5 remains on the substrate for the mold, and the subsequent etching is performed. The step plays a role as a mask. As the developer used in the developing step, those known in the art can be used. For example, there are inorganic tests such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, ammonia, etc.; primary amines such as ethylamine and n-propylamine; and secondary amines such as diethylamine and di-n-butylamine. a tertiary amine such as triethylamine or decyldiethylamine 20 321506 201017228 . Classes; alcohol amines such as dimethylethanolamine and triethanolamine; hydroquinone tetramethylammonium hydroxide tetraethyl sulphate, trimethyl hydride Recorded by ethyl (Trimet屻,

Hydroxyethyl Ammcmium Hydr〇xide)等四級胺鹽;吡咯、 .哌啶(Piperidine)等環狀胺類等鹼性水溶液;二甲苯、、 苯等有機溶劑等。 甲 關於顯影步驟中之顯影方法並無特別限制,可使用、* 潰顯影、嘴霧(寧ay)顯影、磁刷(brush)顯影、超 = 影等之方法。 ” ❿纟本發明之模具之製造方法A中,係以將遮罩對於模 具用基材表面之投影_,相對於在模具用基材表面形成 有表面凹凸形狀之區域之面積設為!至7Q%為較佳。為了 滿足此要件,只要曝光如上述之比率之圖案即可。亦即, 使用負型感光性樹脂時,只要以比M/^為〇. 〇1至〇 7之 方式作成圖案進行曝光即可。此外,使用正型感光性樹脂 時,只要以比(1-M)/T $ 〇. 〇1至〇. 7之方式作成圖案進 ❹行曝光即可。若遮罩之投影面積相對於基板表面之比率過 小’則在後述之蝕刻步驟中,模具用基材表面之大致整面 會破均勻地#刻,而難以在基材表面形成充分的凹凸,而 在使用所獲得之模具所製造之防炫膜會有不易獲得充分的 防炫性能之傾向。此外,若遮罩之投影面積相對於基材表 面之比率過大,則在蝕刻步驟後未被蝕刻的面會殘留許多 作為平坦面。此時亦會有在使用所獲得之模具所製造之防 炫膜難以獲得充分的防炫性能之傾向。為了在模具用基材 之表面以良好精確度形成反映遮罩之圖案之凹凸,以及為 321506 21 201017228 驟中,對於包含由遮罩所覆蓋之區域之 ❹右: 了糾處理,相對於在模具用基柯表面 /有表面凹凸形狀之區域之面積之遮罩對於模 表面之投影面積’係以在5至祖範圍内為更佳基材 此外’較佳為將模具用基材表面之⑽㈣之 二中遮罩對於模制基材表面之投影面狀標 為1000 _以下。為了収此要件,只要如上所$ 之標準偏差成為1_^2以下之圖案進行曝光即可 用基材表面之ΙΟΟαπ^叫m之區域中顯影後未果具 留之感祕難膜對於模具隸材表面之投 〜所殘 ^超過酬^時,在所獲得之模具之表面凹凸^準 果具有5〇,以上周期之表面凹凸形狀之不均句性會 果,使用所獲得之模具·造之防_,在結 =像顯示裝置時’會有產生閃燦之傾向。從使所:精細 杈具之表面凹凸形狀更均句之觀 ,导< 之刚”测心之區域中遮罩對 、=用基持表每 影面積之標準偏差,係以 2 ;土材表面之较 第1圖⑷係示意性顯示佳。 性樹脂膜3,進行過顯影 性樹脂於感光 :之區域5由顯影液所溶解,未曝 :面上而成為遮罩^第…二:^殘留於基持 光性樹脂於感光性樹脂膜3進行^^性顯示使用正製我 圖(c)中曝光之區域4係由顯k顯影處理之狀態。第1 5殘留在基材表面上而:所溶解’僅未曝光 單6。此外,第2圖之曝^ 22 201017228 區域4在顯影步驟後,於負型感光性樹脂之情形下殘留在 基材表面上,在接下來的蝕刻步驟中發揮作為遮罩作用。 另一方面,於正型感光性樹脂之情形下,第2圖之未曝光 之區域5殘留在基材表面上,在接下來的蝕刻步驟中發揮 作為遮罩作用。 [6A]姓刻步驟 在模具之製造方法A之蝕刻步驟中,係使用在上述顯 影步驟後殘存於模制基材表面上之感紐樹_作= 罩,主要將無遮罩之部位之模具用基材進行蝕 :·、、 係示意性顯示本發明之模具之製造方法A之後 圖 仫之例圖。第8圖(a)係示意性顯 較 將無遮罩之部幻之難用緒驟’主要 6之下部之模具用基材i雖未被從模具用態。遮罩 刻’惟隨著_之進行,從無遮罩之^ ^進行钱 參 此,在遮單6與無遮罩之區域7之邊界附广:餘刻。因 部之模具用基材〗錢_。以 ^,遮罩6之下 罩之區域7之邊界附近,遮罩6之^ =遮罩6與無遮 被_之_稱為侧綱(side etehing)材1亦 性顯示側麵刻之進行。f 9圖之虛 2圖係示意 制之進W變化之模制基材之表面邊顯示隨著 本發明之製造方法八之特徵為 用基材表面整面施行_處理。亦即,,對模具 之無遮罩之部位進行之側酬直到遍及根:從相鄰 面連結為切行_處理 基材表面整 皁6之下部之模具用基材 321506 23 201017228 1亦被蝕刻。第9圖係示意性顯示側蝕刻進行,且遮罩6 下部之模具用基材1亦全部被蝕刻之狀態。 蝕刻步驟中之蝕刻處理,通常雖使用氣化鐵(FeCh)Aquarium salt such as Hydroxyethyl Ammcmium Hydr〇xide); an aqueous alkaline solution such as a cyclic amine such as pyrrole or piperidine; an organic solvent such as xylene or benzene. A The development method in the developing step is not particularly limited, and a method such as *crush development, nozzle fog development, magnetic brush development, and super shadow can be used. In the method A for manufacturing a mold according to the present invention, the area of the region where the surface of the substrate for the mold is formed with the surface unevenness is set to the projection of the surface of the substrate for the mold. % is preferable. In order to satisfy this requirement, it is only necessary to expose a pattern having a ratio as described above. That is, when a negative photosensitive resin is used, it is patterned by a ratio of M/^ to 〇1 to 〇7. In addition, when a positive photosensitive resin is used, it is only necessary to form a pattern in a ratio of (1-M)/T $ 〇. 〇1 to 〇. 7 to expose the projection. When the ratio of the area to the surface of the substrate is too small, in the etching step described later, the substantially entire surface of the surface of the substrate for the mold is uniformly broken, and it is difficult to form sufficient unevenness on the surface of the substrate, and the obtained surface is obtained. The anti-foam film manufactured by the mold tends to have insufficient tendency to obtain sufficient anti-glare performance. Further, if the ratio of the projected area of the mask to the surface of the substrate is too large, the surface that is not etched after the etching step remains as many Flat surface There is a tendency that it is difficult to obtain sufficient anti-glare property in the anti-foam film manufactured by using the obtained mold. In order to form the unevenness of the pattern reflecting the mask with good precision on the surface of the substrate for the mold, and it is 321506 21 201017228 In the middle of the process, the right side of the area covered by the mask is corrected, and the area of the mask on the surface of the surface of the surface of the surface of the mold/the surface having the surface unevenness is used to 5 to the ancestral range is a better substrate. In addition, it is preferable to mark the surface of the substrate of the mold for (10) and (4) the projection surface of the surface of the molded substrate by 1000 Å or less. If the standard deviation of $ is less than 1_^2, the pattern can be exposed by using the surface of the substrate ΙΟΟαπ^ called m in the region after development, and the sensation of the film is not affected by the surface of the mold. At the time of remuneration, the surface roughness of the obtained mold has 5 〇, and the unevenness of the surface irregular shape of the above cycle will result in the use of the obtained mold and the prevention _, in the junction = image display device Time' There will be a tendency to produce flashes. From the perspective of the surface of the fine-shaped cookware, the angle of the surface of the fine-grained utensils is more uniform, and the standard of the area of the mask is measured in the area of the heart-measuring area. The deviation is 2; the surface of the soil is better than the first diagram (4). The resin film 3 is subjected to a photosensitive resin in a photosensitive region: the region 5 is dissolved by the developer, and is not exposed to the surface to form a mask. The second resin is left on the photosensitive resin film 3 The ^4 display is used to display the state in which the area 4 exposed in the picture (c) is processed by the display k. The 15th residue remains on the surface of the substrate: the dissolved 'only unexposed single 6'. Further, the region 4 of the exposure of Fig. 2, 201017228, remains on the surface of the substrate in the case of the negative photosensitive resin after the development step, and functions as a mask in the subsequent etching step. On the other hand, in the case of a positive photosensitive resin, the unexposed region 5 of Fig. 2 remains on the surface of the substrate, and functions as a mask in the subsequent etching step. [6A] Last Name In the etching step of the manufacturing method A of the mold, the mold which is left on the surface of the molded substrate after the above development step is used as a mold, and the mold which is mainly a portion without a mask is used. Etching with a substrate: Illustratively, an example of the manufacturing method A of the mold of the present invention is shown. Fig. 8(a) is a schematic representation of the difficulty of using the maskless portion. The base material i for the lower part of the main portion 6 is not used from the mold. The mask is engraved ‘but as _ proceeds, the money is taken from the unmasked ^^, and the border between the cover 6 and the unmasked area 7 is attached: the remaining moment. Because of the mold of the part of the substrate, the money _. With ^, near the boundary of the region 7 of the mask 6 under the mask, the mask 6 and the mask 6 and the uncovered layer are also referred to as the side etehing material. . The virtual side of the Fig. 9 is a schematic representation of the surface side of the molded substrate which is shown to be in accordance with the manufacturing method of the present invention. That is, the unmasked portion of the mold is paid until it passes through the root: the adjacent substrate is joined as a tangential _ processing substrate surface under the soap 6 under the mold substrate 321506 23 201017228 1 is also etched . Fig. 9 is a view schematically showing the state in which the side etching is performed and the substrate 1 for the mold at the lower portion of the mask 6 is also etched. Etching treatment in the etching step, usually using gasified iron (FeCh)

液、氣化銅(CuClO液、鹼蝕刻液(Cu(;Nh3)4C12)等使金屬表 面腐姓來進行,惟亦可使用鹽酸或硫酸等強酸’或亦可使 用藉由施加與電解鍍覆時相反電位的逆電解蝕刻。在施行 蝕刻處理時之在模具用基材所形成之凹形狀,係依基底金 屬之種類、感光性樹脂膜之種類及蝕刻方法等而不同,因 此無法一概而論,惟蝕刻量為1〇//m以下時,係從接觸蝕 刻液之金屬表面大致等方性地㈣。在此所稱之關量, 係指由蝕刻所侵蝕之基材之厚度。 窃㈣步射之钱刻量係以2幻〇〇_為較佳 〇钱亥丨 I未達2,時’幾乎不會在金屬表面形成凹凸形狀,而 、’=致平坦之板具’因此不會顯現防炫性。此外,將難 飯=㈣’對模制基材表面整面施行似彳處理。此 餘刻量超過100時,由Liquid, vaporized copper (CuClO liquid, alkali etching solution (Cu (; Nh3) 4C12), etc., can be carried out by using a metal surface, but a strong acid such as hydrochloric acid or sulfuric acid can be used or an electrolytic plating can be used. In the reverse electrolytic etching of the opposite potential, the concave shape formed on the substrate for the mold during the etching treatment differs depending on the type of the base metal, the type of the photosensitive resin film, the etching method, and the like, and therefore cannot be generalized. When the etching amount is 1 〇//m or less, it is substantially equidistant from the metal surface contacting the etching liquid (4). The term "closed amount" refers to the thickness of the substrate eroded by the etching. The amount of money is 2 〇〇 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Hyun. In addition, it will be difficult to eat = (four) 'the entire surface of the molded substrate is treated like a ruthenium. When the amount exceeds 100,

之曲㈣大,㈣屬^卿成之凹㈣ 為了進行側關,對模且用^不會顯現防㈣ 姓刻量係為重要之因素:=?签面施行㈣處理 另外,刻量需較遮罩之寬度大 _ mu#:對模制基材表面整面施行姓刻 2為了使由偏刻之部位與未被 =形狀9之_之表面傾 := 第2鍍覆步驟中之鍍鉻增厚。然 := 增厚,易於產生結粒,因將鍍鉻之谷度和The song (4) is large, (4) belongs to the ^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^^ The width of the mask is large _ mu#: The entire surface of the surface of the molded substrate is subjected to the surname 2 in order to tilt the surface from the portion which is not cut and the surface of the shape is not = chrome plating in the second plating step thick. However: = thickening, easy to produce agglomeration, due to the chrome-plated valley and

此不理想。此外,將鍍鉻之厚Z 321506 24 201017228 薄化時由於無法將由被蝕刻之部位與未被敍刻之部位所 形成之表面凹凸形狀9之陡Λ肖之表面傾斜充分緩和,而無 法獲知所希望之表面形狀之模具,因此使用該模具所製作 之防炫膜亦不會顯示優異之防炫性能。第10圖係顯示未對 模具隸材表面整面施行_處理,而·未独刻之部 位之板具用基材表面之示意圖。由被⑽之部位與未被钱 刻之4位所㈣之表面凹凸形狀g係具有㈣之表面傾 斜。 此外在本發明之模具之製造方法Α中,係以在钱刻 步驟鮮2料步驟之間,包含感光性樹脂膜去除步驟為 較佳。猎由在關步驟中進行側_對模具用基材表面整 面施賴财理,鮮雖會從模制基材表面_,惟所 剝離之遮罩有可能會附著在模具用基材表面上,而成為第 陷之賴。將此種附著之遮罩在感光性樹 =去除㈣中予以全轉而去除。在感紐樹脂膜去 衫制去除㈣感紐樹軸溶解。以去除液而 吕,係可使職上述㈣液相同者,藉由使pH、溫度 度、及浸潰時間等變化,於使用負型感 曝光部之感光性樹脂膜、及於使用正型 = 將非曝光部之感絲临m完全轉=㈣膜%可 := 旨膜去除步驟中之剝離方法並未特別::: ==:顯影、超音波顯影等之方法。 [5B ]顯影步驟 321506 25 201017228 在顯影步财、,❹負型感_樹脂於感光性樹脂膜 日、,未曝光之區*5係*顯影液所溶解,僅曝光之區域4 殘存於拉具用基材上,在接下來Μ丨侧步驟中發揮作 為遮罩作用°另—方面’使用正型感光性樹躲感光性樹 脂膜3時,僅曝光之區域4由顯影液所溶解,而未曝光之 區域5殘存於模具用基材上,在接下來的第1蝕刻步驟中 發揮作為遮罩作用。 關於顯影步驟所使用之顯影液係可使用習知公知者。 例如有氫氧化鈉、氫氧化鉀、碳酸鈉、矽酸鈉、偏矽酸鈉、 氣水專無機驗類,乙胺、正丙胺等一級胺類;二乙胺、二 正丁胺等二級胺類;三乙胺、甲基二乙胺等三級胺類;二 甲基乙醇胺、二乙醇胺等醇胺類;氫氧化四甲敍、氫氧化 四乙錢、氫氧化三甲基羥乙基銨(Trimethyl Hydroxyethyl Ammonium Hydroxide)等四級胺鹽;咣咯、哌啶(piperidine) 等環狀胺類等鹼性水溶液;二曱苯、曱笨等有機溶劑等。 關於顯影步驟中之顯影方法並無特別限制,可使用浸 潰顯影、噴霧(spray)顯影、磁刷(brush)顯影、超音波顯 在本發明之模具之製造方法中,係以將遮罩對於模具 =基材表面之投影面積,相對於在模具用基材表面形成有 =凸形狀之區域之面積設為i至7〇%為較佳。為了滿 用查/1,只要曝光如上述之比率之圖案即可。亦即,使 脂時’只要以_為。肩至。·7之方 案進仃曝先即可。此外,使用正型4光性樹脂時, 321506 26 201017228 •只要以比(1__M)/T為0.01至0.7之方式作成圖案進行曝 光即可。若遮罩之投影面積相對於基材表面之比率過小, 則在後述之蝕刻步驟中’模具用基材表面之大致整面會被 . 均勻地蝕刻,而難以在基材表面形成充分的凹凸,而在使 用所獲得之模具所製造之防炫膜會有不易獲得充分的防炫 性能之傾向。此外,若遮罩之投影面積相對於基材表面之 比率過大,則在第1蝕刻步驟後所殘留之平坦面,亦即未 被蝕刻之面會變大,在第2蝕刻步驟後亦殘留平坦面。此 ®丨肖形#亦會有在使用所獲得之模具所製造之防炫膜難以獲 得充分的防炫性能之傾向。從在模具用基材之表面以良好 精確度形成反映遮罩之圖案之凹凸之觀點來看,相對於在 模具用基材表面形成有表面凹凸形狀之區域之面積之遮罩 對於模具用基材表面之投影面積,係以在3〇至65%之範圍 内為更佳。 此外,較it為將板具用基材表面之1 QQ从q〇 #冚之 ❹區域中遮罩對於模具用基材表面之投影面積之標準偏差兮免 為1000 /zm2以下。為了滿足此要件,只要如上所述以叽㈧ 之標準偏差為1 000 /iin2以下之圖案進行曝光即可。模具用 基材表面之lOO/zmxlOO/iin之區域中顯影後未溶解所殘留 之感光性樹脂膜對於模具用基材表面之投影面積之標準偏 差超過1000 //m2時,在所獲得之模具之表面凹凸形狀會產 生具有50/zm以上周期之表面凹凸形狀之不均勻性,社 果,使用所獲得之模具所製造之防炫膜,在配置於高梦名 之圖像顯示裝置時,會有產生閃爍之傾向。從使所挥尸田 27 321506 201017228 模具之表面凹凸形狀更均勻之觀點來看,模具用基材表面 之100//mxl00/zm之區域中遮罩對於模具用基材表面之投 影面積之標準偏差,係以500 //m2以下為更佳。 第1圖(d)係示意性顯示使用負型感光性樹脂於感光 《 性樹脂膜3,進行顯影處理之狀態。在第1圖(c)中未曝光 — 之區域5由顯影液所溶解,僅曝光之區域4殘留於基材表 面上而成為遮罩6。第1圖(e)係示意性顯示使用正型感光 性樹脂於感光性樹脂膜3進行顯影處理之狀態。第1圖(c) 中曝光之區域4係由顯影液所溶解,僅未曝光之區域5殘 © 留在基材表面上而成為遮罩6。此外,第2圖之曝光之區 域4在顯影步驟後,於負型感光性樹脂之情形下殘留在基 材表面上,在接下來的第1蝕刻步驟中發揮作為遮罩作 用。另一方面,於正型感光性樹脂之情形下,第2圖之未 曝光之區域5殘留在基材表面上,在接下來的第1蝕刻步 驟中發揮作為遮罩作用。 [6A1]第1蝕刻步驟 在模具之製造方法B之第1蝕刻步驟中,係使用在上 述顯影步驟後殘存於模具用基材表面上之感光性樹脂膜作 為遮罩,主要將無遮罩之部位之模具用基材進行蝕刻。第 14圖係示意性顯示本發明之模具之製造方法B之後半部分 之較佳之一例圖。第14圖(a)係示意性顯示藉由第1蝕刻 步驟,主要將無遮罩之部位7之模具用基材1進行蝕刻之 狀態。遮罩6之下部之模具用基材1雖未被從模具用基材 表面進行蝕刻,惟隨著蝕刻之進行,從無遮罩之區域7進 28 321506 201017228 行蝕刻。因此,在遮罩6與無遮罩之區娀7之邊界附近, 遮罩6之下部之模具用基材1亦被蝕刻。以下將在此種遮 罩6與無遮罩之區域7之邊界附近,遮罩6之下部之模具 • 用基材1亦被蝕刻之情形稱為側蝕刻。第15圖係示意性顯 示側蝕刻之進行。第15圖之虛線8係階段性顯示隨著蝕刻 之進行而變化之模具用基材之表面。 第1蝕刻步驟中之蝕刻處理,通常雖使用氯化鐵 (FeCl3)液、氯化銅(cuci2)液、驗钱刻液(Cu(NH3)4Cl2)等使 ❹金屬表面腐蝕來進行,惟亦可使用鹽酸或硫酸等強酸,或 亦可使用藉由施加與電解鍍覆時相反電位的逆電解蝕刻。 在施行钱刻處理時之於模具用基材所形成之凹形狀’係依 基底金屬之種類、感光性樹脂膜之種類及蝕刻方法等而不 同’因此無法一概而論,惟蝕刻量為10 y m以下時’係從 接觸姓刻液之金屬表面大致等方性地蝕刻。在此所稱之钱 刻篁’係指由蝕刻所侵蝕之基材之厚度。 ❹ 第1钱刻步驟中之蝕刻量係以1至50//m為較佳。餘 刻量未達lem時,幾乎不會在金屬表面形成凹凸形狀,而 成為大致平坦之模具,因此不會顯現防炫性。此外,钱刻 量超過50/zm時’由於在金屬表面所形成之凹凸形狀之高 低差變大’使用所獲得之模具所製作之防炫膜成為白濁, 故不理想。帛1麵刻步驟中之钱刻處理可藉由1次餘刻處 理來進行’亦可分成2次以上來進行姓刻處理。在此,在 將姓刻處理分成2次以上進行時,係以2次以上飯刻處理 之银刻量合計為1至50/zm為較佳。 29 321506 201017228 [6B2]感光性樹脂膜剝離步驟 在模具之製造方法B之感光性樹脂膜剝離步驟中,係 ^ 將在第1蝕刻步驟中作為遮罩使用所殘存之感光性樹脂膜 完全溶解而去除。在感光性樹脂膜剝離步驟中,係使用剝 · 離液將感光性樹脂膜溶解。以剝離液而言,係可使用與上 述之顯影液相同者,藉由使pH、溫度、濃度、及浸潰時間 等變化,在使用負型感光性樹脂膜時將曝光部之感光性樹 脂膜、及在使用正型感光性樹脂膜時將非曝光部之感光性 樹脂膜完全溶解而去除。關於感光性樹脂膜剝離步驟中之 ❿ 剝離方法並無特別限制,可使用浸潰顯影、喷霧顯影、磁 刷顯影、超音波顯影等之方法。 第14圖(b)係示意性顯示藉由感光性樹脂膜剝離步 驟,將在第1蝕刻步驟中作為遮罩使用之感光性樹脂膜6 完全溶解而去除之狀態。藉由由感光性樹脂膜而成之遮罩 6與蝕刻,將第1表面凹凸形狀9形成於模具用基材表面。 [6B3]第2蝕刻步驟This is not ideal. In addition, when the thickness of the chrome-plated Z 321506 24 201017228 is thinned, the surface of the surface irregularities 9 formed by the portion to be etched and the portion which is not etched can not be sufficiently relaxed, and the desired state cannot be obtained. The mold of the surface shape, so the anti-foam film made using the mold does not exhibit excellent anti-glare properties. Fig. 10 is a view showing the surface of the substrate for the board which is not subjected to the treatment of the entire surface of the mold member. The surface unevenness g of the portion (4) and the fourth portion (4) which is not engraved has the surface inclination of (4). Further, in the method of manufacturing a mold of the present invention, it is preferred to include a step of removing the photosensitive resin film between the steps of the fresh-keeping step. Hunting is carried out in the closing step. _ The whole surface of the substrate surface for the mold is applied. Although the fresh surface will be molded from the surface of the substrate, the peeled mask may adhere to the surface of the substrate for the mold. Be the first to fall. The attached mask is removed by full rotation in the photosensitive tree = removal (four). In the sensation of the resin film, the shirt is removed (4). In order to remove the liquid, it is possible to use the photosensitive resin film of the negative-type exposure portion and the positive type by changing the pH, temperature, and immersion time. The sound of the non-exposed portion is completely turned to m = (4) The film % can be: = The peeling method in the film removing step is not particularly::: ==: development, ultrasonic development, and the like. [5B] Development step 321506 25 201017228 In the development step, the negative feeling _resin is on the photosensitive resin film day, the unexposed area is dissolved in the developing solution*5, and only the exposed area 4 remains in the holder On the substrate, in the next step, the mask function is used. In the other aspect, when the positive photosensitive substrate is used as the photosensitive resin film 3, only the exposed region 4 is dissolved by the developer, and The exposed region 5 remains on the substrate for the mold, and functions as a mask in the next first etching step. As the developer used in the developing step, a well-known person can be used. For example, there are sodium hydroxide, potassium hydroxide, sodium carbonate, sodium citrate, sodium metasilicate, gas and water special inorganic test, ethylamine, n-propylamine and other primary amines; diethylamine, di-n-butylamine and other secondary Amines; tertiary amines such as triethylamine and methyldiethylamine; alcohol amines such as dimethylethanolamine and diethanolamine; tetramethyl sulphate, tetraethyl hydroxide, trimethyl hydroxyethyl hydroxide A quaternary amine salt such as ammonium (Trimethyl Hydroxyethyl Ammonium Hydroxide); an alkaline aqueous solution such as a cyclic amine such as ruthenium or piperidine; or an organic solvent such as diphenylbenzene or hydrazine. The developing method in the developing step is not particularly limited, and a dipping development, a spray development, a brush development, and an ultrasonic wave can be used in the manufacturing method of the mold of the present invention. Mold = the projected area of the substrate surface is preferably i to 7 〇% with respect to the area of the region where the convex shape is formed on the surface of the substrate for the mold. In order to fully check /1, it is only necessary to expose a pattern of the ratio as described above. That is, when the fat is made, it is only _. Shoulder to the side. · The method of 7 can be exposed first. In addition, when a positive type four-light resin is used, 321506 26 201017228 • It is sufficient to form a pattern by exposure to (1__M)/T of 0.01 to 0.7. If the ratio of the projected area of the mask to the surface of the substrate is too small, the substantially entire surface of the surface of the substrate for the mold will be uniformly etched in the etching step described later, and it is difficult to form sufficient unevenness on the surface of the substrate. However, the anti-glare film produced by using the obtained mold has a tendency to be difficult to obtain sufficient anti-glare properties. Further, if the ratio of the projected area of the mask to the surface of the substrate is too large, the flat surface remaining after the first etching step, that is, the surface that is not etched becomes large, and remains flat after the second etching step. surface. This ® 丨 肖形# also has a tendency to prevent sufficient anti-glare properties when using the anti-foam film manufactured by the obtained mold. From the viewpoint of forming the unevenness of the pattern reflecting the mask with good precision on the surface of the substrate for the mold, the mask for the area of the region in which the surface uneven shape is formed on the surface of the substrate for the mold is used for the substrate for the mold The projected area of the surface is preferably in the range of 3 〇 to 65%. In addition, the standard deviation of the projected area of the surface of the substrate for the mold from the surface of the substrate of the substrate for the board is less than 1000 /zm2. In order to satisfy this requirement, it is sufficient to expose the pattern with a standard deviation of 叽 (8) of 1 000 /iin2 or less as described above. When the standard deviation of the photosensitive resin film remaining in the area of 100/zmx100/iin of the surface of the substrate for the mold is not more than 1000 //m2 for the projected area of the surface of the substrate for the mold, the obtained mold is The surface uneven shape produces unevenness of the surface unevenness shape having a period of 50/zm or more, and the anti-glare film produced by using the obtained mold is provided when the image display device of the high dream name is disposed. A tendency to produce flicker. The standard deviation of the projected area of the mask on the surface of the substrate for the mold in the area of 100//mxl00/zm of the surface of the substrate for the mold is obtained from the viewpoint of making the surface irregularity of the mold of the corpse 27 321506 201017228 more uniform. It is better to use 500 // m2 or less. Fig. 1(d) is a view schematically showing a state in which development processing is performed on the photosensitive resin film 3 by using a negative photosensitive resin. The region 5 which is not exposed in Fig. 1(c) is dissolved by the developer, and only the exposed region 4 remains on the surface of the substrate to form the mask 6. Fig. 1(e) is a view schematically showing a state in which development processing is performed on the photosensitive resin film 3 using a positive photosensitive resin. The exposed region 4 in Fig. 1(c) is dissolved by the developer, and only the unexposed region 5 remains as a mask 6 on the surface of the substrate. Further, the exposed region 4 of Fig. 2 remains on the surface of the substrate in the case of the negative photosensitive resin after the development step, and functions as a mask in the next first etching step. On the other hand, in the case of a positive photosensitive resin, the unexposed region 5 of Fig. 2 remains on the surface of the substrate, and functions as a mask in the next first etching step. [6A1] First etching step In the first etching step of the manufacturing method B of the mold, a photosensitive resin film remaining on the surface of the substrate for a mold after the development step is used as a mask, and the mask is mainly unmasked. The mold of the part is etched with the substrate. Fig. 14 is a view schematically showing an example of the latter half of the manufacturing method B of the mold of the present invention. Fig. 14(a) is a view schematically showing a state in which the substrate 1 for a mold having no mask portion 7 is mainly etched by the first etching step. The substrate 1 for the mold below the mask 6 is not etched from the surface of the substrate for the mold, but is etched from the unmasked region 7 to 28321506 201017228 as the etching progresses. Therefore, in the vicinity of the boundary between the mask 6 and the maskless region 7, the substrate 1 for the mold below the mask 6 is also etched. In the following, near the boundary between the mask 6 and the unmasked region 7, the mold under the mask 6 is also referred to as side etching by the substrate 1 being etched. Figure 15 is a schematic representation of the progress of the side etch. The dotted line 8 of Fig. 15 shows the surface of the substrate for a mold which changes as the etching progresses. The etching treatment in the first etching step is usually carried out by using a ferric chloride (FeCl3) liquid, a copper chloride (cuci2) liquid, a test engraving liquid (Cu(NH3)4Cl2), etc., to etch the surface of the base metal. A strong acid such as hydrochloric acid or sulfuric acid may be used, or a reverse electrolytic etching by applying a potential opposite to that at the time of electrolytic plating may be used. The concave shape formed by the base material for the mold at the time of performing the engraving treatment differs depending on the type of the base metal, the type of the photosensitive resin film, the etching method, and the like. Therefore, it cannot be generalized, but when the etching amount is 10 μm or less 'The etch is roughly equidistant from the metal surface contacting the surname engraving. The term "money" as used herein refers to the thickness of a substrate that is eroded by etching.蚀刻 The etching amount in the first step is preferably 1 to 50 / / m. When the residual amount is less than lem, the uneven shape is hardly formed on the surface of the metal, and the mold is substantially flat, so that the anti-glare property does not appear. Further, when the amount of money exceeds 50/zm, the height difference between the uneven shape formed on the metal surface becomes large, and the anti-foam film produced by using the obtained mold becomes cloudy, which is not preferable.钱1 The engraving process in the engraving step can be performed by one-time processing, and can be divided into two or more times to perform the surname processing. Here, when the surname processing is divided into two or more times, it is preferable that the total amount of silver engraving processed twice or more is 1 to 50/zm. 29 321506 201017228 [6B2] Photosensitive resin film peeling step In the photosensitive resin film peeling step of the manufacturing method B of the mold, the photosensitive resin film remaining as a mask in the first etching step is completely dissolved. Remove. In the photosensitive resin film peeling step, the photosensitive resin film is dissolved using a peeling liquid. In the same manner as the above-mentioned developing solution, the photosensitive resin film of the exposed portion can be used when the negative photosensitive resin film is used, by changing the pH, temperature, concentration, and immersion time. When the positive photosensitive resin film is used, the photosensitive resin film in the non-exposed portion is completely dissolved and removed. The 剥离 peeling method in the photosensitive resin film peeling step is not particularly limited, and methods such as dipping development, spray development, magnetic brush development, and ultrasonic development can be used. Fig. 14(b) is a view schematically showing a state in which the photosensitive resin film 6 used as a mask in the first etching step is completely dissolved and removed by the photosensitive resin film peeling step. The first surface uneven shape 9 is formed on the surface of the substrate for a mold by the mask 6 and the etching by the photosensitive resin film. [6B3] 2nd etching step

Q 在模具之製造方法B之第2蝕刻步驟中,係以蝕刻處 理使藉由使用感光性樹脂膜作為遮罩之第1蝕刻步驟所形 成之第1表面凹凸形狀9和緩。藉由此第2蝕刻處理,不 再有由第1蝕刻處理所形成之第1表面凹凸形狀9中之表 面傾斜陡峭之部分,而使用所獲得之模具所製造之防炫膜 之光學特性朝理想之方向變化。在第14圖(c)中,係顯示 藉由第2蝕刻處理,使基材1之第1表面凹凸形狀9和缓, 且使表面傾斜陡ώ肖之部分緩和,而形成具有和缓表面傾斜 30 321506 201017228 . 之第2表面凹凸形狀1Q之狀態。 …第2巧步驟之偏彳處理,亦與第1_步驟相同, 错:二氯化鐵(FeC10液、氯化銅(CuCl2)液、 驗侧液⑹⑽3)仙)钱表面腐料進行,惟亦 ❹ 鹽酸或硫酸等強酸,或亦可使用藉由施加與電解鍵 反電位的逆電解㈣。在施行钱刻處理後之凹凸之和緩程 度,係依基底金屬之種類、钕刻方法、及由第i _步驟 所獲传之凹凸之尺寸與深度等而不同,因 論’惟在㈣域錢上最A的目 =一概而 =r與第1 一同=刻::: 轉印於透明薄膜所獲得之防炫膜之光學特性 -方面,若_量過大,則凹凸形狀幾乎消失, 參 致平坦之模具,因此不會顯現防炫性。因此,_量係以 設為1至50心之範圍内為較佳,且以4至2〇_之範 内為更佳。關於第2勉刻步驟中之飯刻處理,亦與第μ 刻步驟相同,可藉由i次麵刻處思來^,獻可汾成2次 以上來進行钱刻處理。在此,在將姓刻處理分成卜以上" =,。係以2相洲處狀崎合物至人_ 另外’不經由此種第2侧步驟時,為了使藉 钱刻步驟所形成之第1表面凹凸形狀9之陡崎s 充分緩和,需將後述之第2鍍覆步驟中之鑛鉻增厚。然而,, 321506 31 201017228 若將鍍鉻之厚度過於增厚’則易於產生結粒,因此不理想。 此外’將祕之厚度薄化時,由於無法使藉由第!姓刻步 驟所形成之第1表面凹凸形狀9之㈣之表面傾斜充分緩 和無法獲得所希望之表面形狀之模具,因此使用該模 具所製作之防_亦不會顯示優異之防炫性能。 < <模具之製造方法A及B> > b [7]第2鍍覆步驟 接下來’藉由施行鍍鉻,使表面之凹凸形狀更為和 缓。第8圖⑻係顯示在由姓刻處理所形成之表面凹凸形狀 1〇上形成祕層U,進而使表面12和緩之狀態。第14 圖⑷係顯示在施行使藉由第2_步驟之_處理使表 面凹凸形紗之後形錢鉻層丨丨,進 和緩之狀態。 在本發明中’係在平板或觀等之表面,採用具有光 澤、硬度高、摩擦係數小 '可賦予良好離模性之鍍絡。錢 鉻之種類雖未__,惟錢㈣稱為所科澤錄鉻或 裝飾用祕等之呈魏好紐之鍍鉻躲佳。鍍鉻通常係 藉由電解進行以其錢覆浴而言,係使用含有無水鉻酸 (Cr〇3)與少|硫峻之水溶液。藉由調節電流密度與電解 間,可控制鍍鉻之厚度。 在上述之日本特開2002-189106號公報、日本特開 2004-45472號公報、日本特開2〇〇4_9〇187號公報等中, 雖揭不有採用鍍路,惟依據鍵覆前之基底與鑛鉻之種類, 大多在鍍覆後會有表面粗糙,或產生多數因為鍍鉻所導致 321506 32 201017228 之微小的裂縫,結果,所製作之防賴之光學特性朝 想之方向發展。鏟覆表面粗糖之狀態之模具,不適 製造防炫膜。此係由於-般為了消除_雖在鍍鉻後將= 覆表面進彳t職’惟如後賴,在本發财細鍵^ 作表面之研磨為較佳之故。在本發明中,係藉㈣基底金 屬施行鍍銅或鍍鎳,以消除在鍍鉻所易於產 另外,在第2鍍覆步驟中,施行鐘鉻以外之鍛覆。,並 Ο 不理想。此係因為在鉻以外讀覆巾,由於硬度及耐磨損 性變低,因此作為模具之财久性降低,使用中會使凹凸磨 損,或模具損傷。在從該翻具賴得之㈣财,極 可能難以獲得充分的防炫功能,而且,亦極有可能在薄膜 上產生缺陷。 此外’如上述日本特開2004,187號公報等所揭示 將錄覆後之表面進行研磨的作法,在本發明中仍較不理 想。此係基於因研磨,會在最表面產生平坦的部分,而導 〇致光學特性惡化、或由於形狀之控制因素增加,而形成難 以進行重現性良好之形狀控制等之理由。 ,、如此’在本發日种,储由對於藉由上述侧步驟所 形成之表面凹凸形狀施行鏟鉻,而可獲得使凹凸形狀更進 -步和緩,並且使其表面硬度提高之模具。此時之凹凸之 和緩情形,亦因為基底金屬之種類、藉由钱刻步驟等所獲 付之凹凸之尺寸與深度、及鍍覆之種類或厚度等而不同, 因此無法-概而論,惟在控制和緩程度上最大的因素仍係 為鐘覆厚度。若鑛鉻之厚度較薄’則使鑛鉻加工前所獲得 321506 33 201017228 之凹凸之表面形狀和緩之效果不足,而將該凹凸形狀轉印 於透明薄膜所獲得之防炫膜之光學特性不會變佳。另一方 面,若鐘覆厚度過厚,則生產能力惡化,而且產生被稱為 結粒之突起狀之鍍覆缺陷,故不理想。因此,鍍鉻之厚度 係以1至10 # m之範圍内為較佳,且以3至6以m之範圍内 為更佳。 在該第2鍍覆步驟中所形成之鍍鉻層,係以維氏硬度 (Vickers hardness)為800以上之方式形成為較佳,且以 成為1000以上之方式形成為更佳。此係由於鍍鉻層之維氏 ❿ 硬度未達800時,模具使用時之财久性會降低,而且在鑛 鉻硬度降低,極有可能於鍍覆處理時在鍍覆浴組成、電解 條件等產生異常,且極有可能對於缺陷之產生狀況造成不 理想之影響之故。 如此一來,即可獲得實質上無平坦部之模具。如此, 實質上無平坦部之模具,係適用於獲得呈現較佳光學特性 之防炫膜。另外,以本發明之製造方法所獲得之模具,較 | 佳為凹凸表面之任意剖面曲線之算數平均高度Pa係為 0. 01至0. 2//m,而該剖面曲線之平均長度PSm係為8至 50/z m,而且,該剖面曲線之最大剖面高度Pt係為0. 1至 1. 0/2in。模具之上述算數平均高度Pa較0. 01 /zm小,或最 大剖面高度Pt較0. 1 //m小時,使用此模具所製作之防炫 膜之表面形狀幾乎變為平坦,而有無法呈現充分防炫性能 之傾向。此外,上述算數平均高度Pa較0. 2 a m大,或最 大剖面高度Pt較1. 0 # m大時,則使用此模具所製作之防 34 321506 201017228 炫膜會有白濁、產生閃爍、或質感降低之傾向。此外,模 具之上述平均長度PSm較小時,使用此模具所製作之 防炫膜會有無法呈現充分之防炫性能之傾向。另一方面, 之上數平均長度psm較5Gum大時,在將使用此模具所 衣作之防炫膜配置於高精細之圖像顯示裳 閃爍之傾向。 曰肩座王 <防炫膜之製造方法> ❹ θ 本發明亦提供一種使用以上述本發明之模呈 方法所獲得之模具之防炫膜之製造方法n、本ς明之 方法係包括:將以本發明之模具之製造方法 棘印,、之凹凸面轉印域明樹脂薄膜之步驟;及將 凸面之透明樹脂薄膜從模具剝除之步驟。 ==發明之防炫膜之製造方法,適於製造顯現較佳 九學特性之防炫膜。 佳m:於薄膜之轉印,係以藉由壓花進行為較 化。,係例如有使用光硬化性樹脂之ϋν壓花 的觀點熱可塑性樹脂之熱壓花法,其中,從生產能力 的觀點㈣’細UVM花料餘。 性鮮I化法係—種在透明樹脂薄膜之表面形成光硬化 、曰s,士將該光硬化性樹脂層緊壓於模具之凹凸面並 ^硬化藉此使模具之凹凸面轉印於光硬化性樹脂層之 、。具體而言,係錢雜脂薄膜上塗覆紫外線硬化型 在將所塗覆之紫外線硬化型樹脂貼緊於模具之凹 凸面之狀態下從透明樹脂薄膜側照射紫外線而使紫外線硬 321506 35 201017228 化型树&硬化,之4從料將形成有硬化後之料線硬化 型樹脂層之透明樹脂薄_離,藉此將模具 紫外線硬化型樹脂。 mi7' 使用uv壓花法時,以透明樹脂薄膜而言,只要實質 上在光學性為透明的薄膜即可,例如有以三醋酸纖維素薄 膜、聚乙烯對苯二甲酸酿薄膜、聚甲基丙烯酸甲g旨薄膜、 聚碳酸酯薄膜、降伯烯系化合物為單體之非晶性環狀聚稀 烴等之熱可塑性㈣之溶劑流延薄膜(east或擠壓 薄膜等之樹脂薄膜。 此外使用U V壓花法時之紫外線硬化型樹脂之種類雖 未特別限定,惟可使用市售之適#者。此外,亦可將適當 選擇之光起始劑與紫外線硬化型樹脂組合,使用在波長較 务外線長之可視光亦可硬化之樹脂。具體而言,係可分別 單獨使用二經曱基丙燒三丙烯酸酯、季戍四醇四丙烯酸酯 (Pentaerythritol tetraacrylate)等之多官能丙烯酸 醋、或將該等2種以上混合來使用’且適用將其與 IRGACURE907(Ciba Specialty Chemicals 公司製品)、 IRGACURE184(Ciba Specialty Chemicals 公司製品)、 LUCIRINTPO(BASF公司製品)等之光聚合起始劑加以混合 者。 另一方面,熱壓花法係為一種將由熱可塑性樹脂所形 成之透明樹脂薄膜在加熱狀態下緊壓於模具,而將模具之 表面形狀轉印至透明樹脂薄膜之方法。以熱壓花法所使用 之透明樹脂薄膜而言,只要實質上為透明者即可,例如可 36In the second etching step of the manufacturing method B of the mold, the first surface uneven shape 9 formed by the first etching step using the photosensitive resin film as a mask is etched. By the second etching treatment, the surface of the first surface uneven shape 9 formed by the first etching treatment is not steeply inclined, and the optical characteristics of the anti-foam film produced by using the obtained mold are ideal. The direction changes. In Fig. 14(c), it is shown that the first surface uneven shape 9 of the substrate 1 is gentlened by the second etching treatment, and the surface is inclined to be steep, and the surface is inclined by 30 321506. 201017228 . The state of the second surface uneven shape 1Q. ...the second partial step of the hemiplegia treatment is also the same as the first step, wrong: ferric chloride (FeC10 liquid, copper chloride (CuCl2) liquid, side liquid (6) (10) 3))) Also, a strong acid such as hydrochloric acid or sulfuric acid, or a reverse electrolysis by applying an antipotential to an electrolytic bond (4). The degree of relief of the unevenness after the execution of the money engraving is different depending on the type of the base metal, the engraving method, and the size and depth of the concavities and convexities obtained by the i-th step, because of the fact that the (four) domain money The most A's head = the general = r and the first one = engraved::: The optical characteristics of the anti-glare film obtained by transferring the transparent film - if the amount is too large, the uneven shape almost disappears, and the flatness is flat The mold, so it does not appear anti-glare. Therefore, the amount of _ is preferably in the range of 1 to 50 hearts, and more preferably in the range of 4 to 2 Å. The meal engraving process in the second engraving step is also the same as the step of the first engraving step, and the engraving process can be performed by i-times of the engraving. Here, the surname processing is divided into the above and " =,. In the case of the second side step, the steepness of the first surface uneven shape 9 formed by the borrowing step is sufficiently alleviated, and the latter will be described later. The ore chromium in the second plating step is thickened. However, 321506 31 201017228 If the thickness of the chrome plating is too thick, it is prone to granulation, which is not preferable. In addition, when the thickness of the secret is thinned, it cannot be made by the first! The surface tilt of (4) of the first surface uneven shape 9 formed by the surname step sufficiently relaxes the mold in which the desired surface shape cannot be obtained, and therefore the anti-glare produced by using the mold does not exhibit excellent anti-glare properties. <<Manufacturing method A and B> of the mold> b [7] Second plating step Next, by performing chrome plating, the uneven shape of the surface is made more gentle. Fig. 8 (8) shows that the secret layer U is formed on the surface uneven shape 1 formed by the treatment of the surname, and the surface 12 is relaxed. Fig. 14 (4) shows the state in which the chrome layer is formed after the surface of the surface is embossed by the treatment of the second step. In the present invention, the surface of the flat plate or the like is made of a plating having a high gloss, a high hardness, and a small coefficient of friction. Money The type of chrome is not __, but the money (four) is called the chrome-plated chrome or the decoration of the secret. Chromium plating is usually carried out by electrolysis in the form of an aqueous solution containing anhydrous chromic acid (Cr〇3) and less sulfur. The thickness of the chrome plating can be controlled by adjusting the current density and the electrolysis. In the above-mentioned Japanese Laid-Open Patent Publication No. 2002-189106, Japanese Laid-Open Patent Publication No. 2004-45472, and Japanese Laid-Open Patent Publication No. Hei No. Hei. No. Hei. No. Hei. Unlike the types of chrome, most of them have a rough surface after plating, or most of the tiny cracks caused by chrome plating, 321506 32 201017228. As a result, the optical properties of the reptiles developed in the direction of thinking. A mold that scrapes the surface of the raw sugar, and does not manufacture an anti-glare film. This is because the general purpose of the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ In the present invention, copper plating or nickel plating is performed by (4) the base metal to eliminate the possibility of production by chrome plating. Further, in the second plating step, forging other than the clock chrome is performed. And Ο not ideal. This is because the hardness of the mold and the abrasion resistance are reduced when the cover is read outside the chrome. Therefore, the durability of the mold is lowered, and the unevenness is worn or the mold is damaged during use. It is very difficult to obtain sufficient anti-glare function in the money obtained from the turning device, and it is highly probable that defects will occur on the film. Further, the method of polishing the surface after the recording as disclosed in Japanese Laid-Open Patent Publication No. 2004-187 or the like is still not preferable in the present invention. This is based on the fact that the flat portion is formed on the outermost surface due to the polishing, and the optical characteristics are deteriorated or the shape control factor is increased to form a shape control which is difficult to reproducibly. In the present invention, the shovel chrome is applied to the surface uneven shape formed by the above-described side steps, whereby a mold having a more irregular shape and a higher surface hardness can be obtained. At this time, the convergence of the concavities and convexities is also different because of the type of the base metal, the size and depth of the concavities and convexities paid by the engraving step, and the type or thickness of the plating, and therefore cannot be generalized. The biggest factor in controlling the degree of relaxation is still the thickness of the bell. If the thickness of the chrome is thinner, the surface shape and the relief effect of the 321506 33 201017228 obtained before the chrome processing are insufficient, and the optical properties of the anti-foam film obtained by transferring the concave-convex shape to the transparent film are not Better. On the other hand, if the thickness of the bell is too thick, the productivity is deteriorated, and a plating defect called agglomerated protrusions is generated, which is not preferable. Therefore, the thickness of the chrome plating is preferably in the range of 1 to 10 #m, and more preferably in the range of 3 to 6 in the range of m. The chrome plating layer formed in the second plating step is preferably formed to have a Vickers hardness of 800 or more, and is preferably formed to have a thickness of 1,000 or more. This is because the Vickers hardness of the chrome layer is less than 800, the durability of the mold is reduced, and the hardness of the chrome is reduced. It is highly probable that the plating bath composition, electrolysis conditions, etc. will occur during the plating treatment. Abnormal, and most likely cause undesired effects on the condition of the defect. In this way, a mold having substantially no flat portion can be obtained. Thus, a mold having substantially no flat portion is suitable for obtaining an anti-foam film exhibiting preferable optical characteristics. Further, the average height Pa of the arbitrary profile of the surface of the embossed surface of the present invention is 0.01 to 0. 2 / / m, and the average length of the profile curve is PSm. 1至1. 0/2内。 The maximum cross-sectional height Pt of the cross-sectional curve is 0. 1 to 1. 0/2in. The average height Pa of the above-mentioned arithmetic of the mold is smaller than 0. 01 / zm, or the maximum sectional height Pt is less than 0.1 / m hours, the surface shape of the anti-fog film made by using the mold is almost flat, and it is impossible to present Fully anti-glare performance tendency. In addition, the arithmetic average height Pa is greater than 0.2 mm, or the maximum profile height Pt is 1. 0 # m, when the mold is made using the mold 34 321506 201017228 The film may be cloudy, flickering, or textured. Reduce the tendency. Further, when the above average length PSm of the mold is small, the anti-foam film produced by using the mold tends to fail to exhibit sufficient anti-glare properties. On the other hand, when the upper average length psm is larger than 5 Gum, the anti-glare film which is made by using the mold is placed on a high-definition image to show a tendency to flicker. The present invention also provides a method for producing an anti-foam film using the mold obtained by the above-described mold forming method of the present invention. The method of the present invention includes: The step of printing the mold of the present invention, the step of transferring the surface of the resin film, and the step of peeling the transparent transparent resin film from the mold. == The manufacturing method of the anti-glare film of the invention is suitable for producing an anti-glare film which exhibits better nine-study characteristics. Preferably, the transfer of the film is carried out by embossing. For example, there is a hot embossing method of a thermoplastic resin from the viewpoint of ϋν embossing using a photocurable resin, wherein, from the viewpoint of productivity (4), fine UVM is used. The brightening method is to form a photohardening, 曰s on the surface of the transparent resin film, and press the photocurable resin layer against the uneven surface of the mold and harden it to transfer the concave and convex surface of the mold to the light. The layer of the curable resin layer. Specifically, the ultraviolet curable film is coated with a UV-curable resin, and the ultraviolet curable resin is applied to the surface of the transparent resin film while the applied ultraviolet curable resin is adhered to the concave-convex surface of the mold to make the ultraviolet light 321506 35 201017228 The tree & hardened, 4 is formed from a thin resin which is formed with a hardened resin layer of a hardened resin layer, whereby the mold is cured by ultraviolet curing. When the uv embossing method is used, the transparent resin film may be a film which is substantially transparent in optical properties, for example, a cellulose triacetate film, a polyethylene terephthalate film, and a polymethyl group. A solvent-cast film (a resin film such as an east or an extruded film) which is a thermoplastic film of the acrylic acid film, a polycarbonate film, or a primary urethane-based compound, such as a monomeric amorphous cyclic hydrocarbon. The type of the ultraviolet curable resin in the case of using the UV embossing method is not particularly limited, but a commercially available one may be used. Alternatively, an appropriately selected photoinitiator may be combined with an ultraviolet curable resin to be used at a wavelength. The visible light of the outer line can also be hardened by the visible light. Specifically, the polyfunctional acrylic vinegar such as dimercaptopropyl triacrylate or pentaerythritol tetraacrylate can be used separately. Either two or more of these may be used in combination and 'applicable to IRGACURE 907 (product of Ciba Specialty Chemicals Co., Ltd.), IRGACURE 184 (product of Ciba Specialty Chemicals), LUCIRINT A photopolymerization initiator such as PO (product of BASF Co., Ltd.) is mixed. On the other hand, the hot embossing method is a method in which a transparent resin film formed of a thermoplastic resin is pressed against a mold in a heated state, and the mold is pressed. The method of transferring the surface shape to the transparent resin film. The transparent resin film used in the hot embossing method may be substantially transparent, for example, 36.

321506 201017228 , 使用以聚甲基丙烯酸甲酯、聚碳酸酯、聚乙烯對苯二甲酸 酯、三醋酸纖維素、降伯烯化合物為單體之非晶性環狀^ 烯烴等之熱可塑性樹脂之溶劑流延薄膜或擠壓薄膜等。此 • 等透明樹脂薄膜亦可適用作為如上所說明之uv壓花法中 用以塗覆紫外線硬化型樹脂之基材薄膜。 [實施例] 以下列舉實施例進一步詳述本發明,惟本發明並不限 定於實施例。 ❿〈實施例Al&gt; 準備在直徑200mm之鋁輥(依據JIS之Α5056)之表面 施行銅巴拉德鍍覆(Ba 11 ard plating)者。銅巴拉德鍍覆係 由鍍銅層/較薄之銀鍍覆層/表面鍍銅層所構成者,鏟覆 層整體之尽度係设疋成為約200//1〇。將該鑛銅表面進行鏡 面研磨,且在經研磨之鏟銅表面塗佈感光性樹脂,使之乾 燥而形成感光性樹脂膜。接著,將第11圖(a)所示重複並 ❹排圖案之圖案藉由雷射光曝光於感光性樹脂膜上並進行顯 影。藉由雷射光之曝光、及顯影係使用Laser Stream FX (Think-Lab股份有限公司製)來進行。在感光性樹脂膜中 係使用正型感光性樹脂’藉由將第11圖(a)所示圖案進行 曝光,遮罩對於模具用基材表面之投影面積,相對於模具 用基材表面中形成有表面凹凸形狀之區域之面積之比率為 9. 3%。此外’為了藉由雷射光將重複並排第11圖(a)所示 圖案之圖案進行曝光,模具用基材表面之100#mxl00/zm 區域中遮罩對於模具用基材表面之投影面積之標準偏差係 37 321506 201017228 為1000 #〇12以下。 之後’以氯化銅液進行蝕刻處理。此時之蝕刻量係設 定成為8/zm。從蝕刻處理後之輥將感光性樹脂膜去除,進 行鍍鉻加工而製作模具。此時,鍍鉻厚度係設定成為4//m。 . &lt;比較例Al&gt; 除藉由雷射光將重複並排第11圖(b)所示圖案之圖案 曝光於感光性樹脂膜上以外,均以與實施例A1相同方式製 作模具。藉由將第11圖(b)所示圖案進行曝光,遮罩對於 模具用基材表面之投影面積相對於模具用基材表面中形成 ❹ 有表面凹凸形狀之區域之面積之比率係為67. 4%。 &lt;評估實驗1&gt; 評估關於實施例A1及比較例A1所獲得之各模具之表 面形狀。由於各表面形狀難以直接測量,因此乃以後述之 實施例A2及比較例A2所記載之方法製作防炫膜之樣本, 且測量此樣本之表面形狀評估作為模具之表面形狀。另 外,防炫膜上之剖面曲線,雖成為模具上之剖面曲線之上 _ ❹ 下反轉者,惟算數平均高度Pa、平均長度PSm及最大剖面 高度Pt則在兩者相同。在測量表面形狀時,係使用共焦點 顯微鏡PL# 2300(Sensofar公司製),為了防止樣本之翹( 曲,係使用光學性透明的黏接劑以凹凸面成為表面之方式 黏合於玻璃基板提供測量。測量時,物鏡的倍率係設為50 倍。以測量資料為依據,以按照JISB 0601之方法進行計 算’藉此算出算數平均高度Pa、平均長度PSm及最大剖面 高度Pt。結果如表A1所示。 38 321506 201017228 〈實施例A2&gt; * 將光硬化性樹脂組成物GRANDIC 806T(大日本印墨化 學工業股份有限公司製)溶解於醋酸乙酯,作成50重量% * 濃度之溶液,且進一步將屬於光聚合起始劑之螢光素 (luciferin)TPO(BASF公司製,化學名稱:2, 4, 6-三甲基 本甲醯基二苯基氧化膦(2, 4, 6-Trimethylbenzoyl diphenylphosphine oxide))按硬化性樹脂成分每1〇〇重量 份添加5重量份來調配塗布液。在厚度80//m之三醋酸纖 ® 維素(TAC)薄膜上,將此塗佈液以乾燥後塗佈厚度成為 10//m之方式塗佈,在設定為6(TC之乾燥機中使之乾燥3 分鐘。將乾燥後之薄膜,以光硬化性樹脂組成物層成為模 具側之方式藉由橡膠輥緊壓貼緊於實施例Ai中分別獲得 之模具之凹凸面。在此狀態下從TAC薄膜侧,將來自強度 20mW/cm2之高壓水銀燈之光,以h線換算光量成為2〇〇mJ /cm2之方式照射,而使光硬化性樹脂組成物層硬化。之 ❹後’將TAC薄膜連同硬化樹脂從模具剝離,分別獲得由在 表面具有凹凸之硬化樹脂與TAC薄膜之疊層體所構成之實 施例A2之透明之防炫膜。 &lt;比較例A2&gt; 除使用在比較例A1所獲得之模具作為模具以外,均 係以與實施例A2相同方式獲得透明之防炫膜。 &lt;評估實驗2&gt; 關於所獲得之實施例A2及比較例A2之各防炫膜,係 進行以下之光學特性及防炫性能之評估。 321506 39 201017228 (1)光學特性之評估i :霧度之測量 防炫膜之霧度,係以JIS κ 7136所 Α τ祝弋之方法來測 量。具體而§,係使用依據此規格之霧产 ^ ▲ 務度儀ΗΜ-150型(村 上色彩技術研究所製)來測量霧度。為了 v J 1々止防炫膜之麵 曲,係在使用光學性透明之黏接劑且以 A « 凸面成為表面之 方式黏合於玻璃基板提供測量。一般而 Λ α右霧大變大’則 適用於圖像顯示裝置時,圖像變暗,έ士里 ^ ^ * iF 1¾ #1- f-l- J, 變低。因此,霧度係以較低為較佳。 (2)光學特性之評估2 :反射鮮明度之測量 反射鮮明度係以JIS K 7105所規定之方法來測量。 具體而言,係使用依據此規格之顯像性測量器丨⑶【肿 (LATEST股份有限公司製)來測量防炫膜之。反射鮮明度。 在此規格巾,以驗難时鮮日請之光學梳而十,係規 定有:暗部與明部之寬度比為1:1、而該寬度為 0. 5mm、1. 0丽及2. 〇mm等四種。其中,使用寬度〇. 125顏 之光學梳時,在本發明所規定之防炫膜中,由於該測量值 之誤差會變大,因此使用寬度〇· 125mm之光學梳時之測量 值,不加在總和中,而以使用寬度為05mm、丨.0mm及20mm 4二種光學梳所測量之圖像鮮明度之和稱為反射鮮明度。 依據此定義時之反射鮮明度之最大值係為3〇0%。若依據此 定義之反射鮮明度過大,則光源等之圖像映入,防炫性會 有容易降低之傾向,因此係以1〇〇%以下為較佳’且以5〇% 以下為更佳。在評估之際,為了防止防炫膜之翹曲,以及 為了防止從背面之反射,乃使用光學性透明之黏接劑,以 321506 40 201017228 防炫膜之凹凸面成為表面之方式黏合於2mm厚度之黑色丙 烯酸樹脂板提供測量。在此狀態下使光從防炫膜側射入來 進行測量。 • (3)光學特性之評估3 : 60度光澤度的測量 ' 60度光澤度係以JIS Z 8741所規定之方法測量。具 體而言,係使用依據此規格之光澤儀PG-1M(曰本電色工業 股份有限公司製)來測量防炫膜之光澤度。此時,亦為了防 止防炫膜之翹曲,以及為了防止來自背面之反射,使用光 ❹ 學性透明的黏接劑,將防炫膜以凹凸面成為表面之方式黏 合於2mm厚度之黑色丙烯酸樹脂板來提供測量。在此狀態 下使光從防炫膜側射入來進行測量。一般而言60度光澤度 較小的情形,係指樣本表面朦朧,結果,易於產生白濁。 因此,光澤度係以較高為較佳,惟光澤度過高則產生映入, 而使防炫性降低,因此係以30至90%左右之值為較佳。 (4) 防炫性能之評估1 :映入之目視評估 _ 為了防止來自防炫膜背面之反射,係將防炫膜以凹凸 面成為表面之方式黏合於黑色丙烯酸樹脂板,在點亮螢光 燈之明亮的室内從凹凸面側以目視觀察,依以下基準以目 視方式分三階段評估是否有螢光燈之映入。 1 :未觀察到映入 2:稍微觀察到映入 3 :清楚觀察到映入 (5) 防炫性能之評估2:白濁之目視評估 為了防止來自防炫膜背面之反射,係將防炫膜以凹凸 41 321506 201017228 面成為表面之方式黏合於黑色丙烯酸樹脂板,在點亮螢光 瓠 燈之明亮的室内從凹凸面側以目視觀察,依以下基準以目 視方式分三階段評估是白濁之程度。 1 :未觀察到白濁 . 2:稍微觀察到白濁 3:清楚觀察到白濁 (6)防炫性能之評估3 :閃爍之評估 首先準備第12圖平面圖所示具有測光單元(unit cel 1)31之圖案之光罩。在第12圖中,測光單元31係在 ❿ 透明的基板上形成線寬10//m且為鍵形之鉻遮光圖案32, 而未形成有該鉻遮光圖案32之部分則成為開口部33。接 著,如第13圖所示,將此光罩以光罩41之鉻遮光圖案32 朝上方式,放置在内部設有光源43之燈箱(light box)42, 且將以20//m厚度之黏接劑黏合防炫膜51在1. 1匪厚度之 玻璃板44之樣本放置在光罩41上,從距離樣本約30cm 之位置目視觀察,藉此以7個階段將閃爍程度進行官能評 _ 估之官能評估之7階段中,層級(level)1係相當於完全未 觀察到閃爍之狀態、層級7係相當於嚴重觀察到閃爍之狀 態,層級3係稍微觀察到閃爍之狀態。另外,光罩之測光 單元,係使用第12圖中測光單元長X測光單元寬為282 /zm x94 //m,因而該圖中開口部長X開口部寬為272# mx84 // m 者。此單元係相當於90ppi(pixel per inch,每英p寸像素) 之像素密度。 結果如表A2所示。另外,表A2中,例如比較例A2 42 321506 201017228 之反射鮮明度之詳細内容如下。 反射鮮明度 30.2% 39. 2% 43. 2% 112. 6% 0. 5mm光學梳: 1. Omm光學梳: 0. 5mm光學梳: 合計 表A1321506 201017228 , using a thermoplastic resin such as polymethyl methacrylate, polycarbonate, polyethylene terephthalate, cellulose triacetate, or a primary olefinic compound A solvent cast film or an extruded film or the like. The transparent resin film can also be suitably used as a substrate film for coating an ultraviolet curable resin in the uv embossing method as described above. [Examples] Hereinafter, the present invention will be described in further detail by way of examples, but the present invention is not limited to the examples.实施 <Example Al> A person who performs Ba 11 ard plating on the surface of an aluminum roll having a diameter of 200 mm (according to JIS Α 5056) was prepared. The copper ballard plating system is composed of a copper plating layer/thin silver plating layer/surface copper plating layer, and the overall thickness of the shovel coating layer is about 200//1 〇. The surface of the copper ore was mirror-polished, and a photosensitive resin was applied to the surface of the ground copper to be dried, and dried to form a photosensitive resin film. Next, the pattern of the pattern which is repeated and arranged in the pattern shown in Fig. 11(a) is exposed to the photosensitive resin film by laser light and developed. The laser light exposure and development were carried out using Laser Stream FX (manufactured by Think-Lab Co., Ltd.). In the photosensitive resin film, a positive photosensitive resin is used. By exposing the pattern shown in FIG. 11( a ), the projected area of the surface of the substrate for the mold is formed in the surface of the substrate for the mold. 3%。 The ratio of the area of the area of the surface has a surface roughness of 9.3%. In addition, in order to expose the pattern of the pattern shown in Fig. 11(a) by laser light, the standard of the projected area of the substrate surface for the mold in the 100#mx100/zm region of the substrate surface for the mold is exposed. The deviation system 37 321506 201017228 is 1000 #〇12 or less. Thereafter, etching treatment was carried out with a copper chloride solution. The etching amount at this time was set to 8/zm. The photosensitive resin film was removed from the roll after the etching treatment, and chrome-plated processing was performed to prepare a mold. At this time, the chrome plating thickness was set to 4/m. &lt;Comparative Example A&gt; A mold was produced in the same manner as in Example A1 except that the pattern of the pattern shown in Fig. 11(b) was repeatedly exposed by laser light on the photosensitive resin film. By exposing the pattern shown in Fig. 11(b), the ratio of the projected area of the mask to the surface of the substrate for the mold relative to the area of the surface of the surface of the substrate for the mold which has the surface unevenness is 67. 4%. &lt;Evaluation Experiment 1&gt; The surface shapes of the respective molds obtained in Example A1 and Comparative Example A1 were evaluated. Since it was difficult to directly measure the surface shape, a sample of the anti-foam film was prepared by the method described in Example A2 and Comparative Example A2 described later, and the surface shape of the sample was measured and evaluated as the surface shape of the mold. In addition, the profile curve on the anti-foam film is the same as the _ ❹ under-reversal on the profile curve on the die, but the arithmetic mean height Pa, the average length PSm, and the maximum profile height Pt are the same. In the measurement of the surface shape, a confocal microscope PL# 2300 (manufactured by Sensofar Co., Ltd.) was used, and in order to prevent the sample from being warped, it was measured by bonding an optically transparent adhesive to the glass substrate in such a manner that the uneven surface became a surface. When measuring, the magnification of the objective lens is set to 50. Based on the measurement data, the calculation is performed according to the method of JIS B 0601, thereby calculating the arithmetic average height Pa, the average length PSm, and the maximum profile height Pt. The results are shown in Table A1. 38 321506 201017228 <Example A2> * A photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink and Chemicals Co., Ltd.) was dissolved in ethyl acetate to prepare a solution of 50% by weight * concentration, and further Luciferin TPO (photochemical name: 2, 4, 6-Trimethylbenzoyl diphenylphosphine oxide) The coating liquid was prepared by adding 5 parts by weight per 1 part by weight of the curable resin component. The coating liquid was dried on a thickness of 80/m of a triacetate (TAC) film. After drying, the coating thickness was 10/m, and it was dried in a dryer set to 6 (TC) for 3 minutes. The dried film was formed into a mold side with a photocurable resin composition layer. The uneven surface of the mold obtained in each of Example Ai was pressed by a rubber roller. In this state, the light from the high-pressure mercury lamp having a strength of 20 mW/cm 2 was converted into light by the h-line from the TAC film side.光mJ /cm2 is irradiated to cure the photocurable resin composition layer. After that, the TAC film is peeled off from the mold together with the hardened resin, and a laminate of a cured resin having a concavity and convexity on the surface and a TAC film is obtained, respectively. The transparent anti-glare film of Example A2 was constructed. <Comparative Example A2> A transparent anti-glare film was obtained in the same manner as in Example A2 except that the mold obtained in Comparative Example A1 was used as the mold. Evaluation Experiment 2&gt; Each of the obtained anti-glare films of Example A2 and Comparative Example A2 was evaluated for the following optical characteristics and anti-glare properties. 321506 39 201017228 (1) Evaluation of optical characteristics i: haze Measuring anti-glare film The haze is measured by the method of JIS κ 7136 。 τ 。 。 。 。 。 。 。 § § 测量 测量 测量 测量 测量 测量 测量 测量 测量 ▲ ▲ ▲ ▲ 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 150 In order to vJ 1 stop the anti-glare film, it is measured by using an optically transparent adhesive and bonding to the glass substrate with A « convex surface as the surface. In general, Λ α right fog becomes larger and larger ’ when applied to an image display device, the image becomes darker, and the gentleman ^ ^ * iF 13⁄4 #1- f-l- J becomes lower. Therefore, the haze is preferably lower. (2) Evaluation of optical characteristics 2: Measurement of reflection sharpness The reflection sharpness was measured by the method specified in JIS K 7105. Specifically, the anti-foam film is measured using a developmental measuring device (3) [swelled by LATEST Co., Ltd.) according to this specification. Reflective clarity. 5 毫米,1. 0丽和2. 〇 规格 2 2 规格 规格 规格 规格 规格 规格 规格 规格 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 验 2 Mm and so on. Wherein, when the optical comb having a width of 颜. 125 is used, in the anti-foam film prescribed by the present invention, since the error of the measured value becomes large, the measurement value when using the optical comb having a width of 〇 125 mm is not added. In the sum, the sum of image sharpness measured using two optical combs having widths of 05 mm, 丨.0 mm, and 20 mm 4 is called reflection sharpness. The maximum value of the reflection sharpness according to this definition is 3〇0%. If the reflection sharpness according to this definition is too large, the image of the light source or the like is reflected, and the anti-glare property tends to be lowered. Therefore, it is preferably 1% or less and preferably 5% or less. . In the evaluation, in order to prevent the warpage of the anti-glare film and to prevent reflection from the back surface, an optically transparent adhesive is used, and the surface of the anti-glare film of the 321506 40 201017228 is bonded to the thickness of 2 mm. The black acrylic plate provides measurements. In this state, light is incident from the side of the anti-foam film to perform measurement. • (3) Evaluation of optical characteristics 3: Measurement of 60-degree glossiness '60-degree gloss is measured by the method specified in JIS Z 8741. Specifically, the glossiness of the anti-glare film was measured using a gloss meter PG-1M (manufactured by Sakamoto Denshoku Co., Ltd.) according to this specification. At this time, in order to prevent the warpage of the anti-glare film and to prevent the reflection from the back surface, the anti-glare film is adhered to the black acrylic having a thickness of 2 mm by using the optically transparent adhesive. A resin plate is used to provide the measurement. In this state, light is incident from the side of the anti-glare film to perform measurement. In general, a case where the gloss of 60 degrees is small means that the surface of the sample is flawed, and as a result, white turbidity is liable to occur. Therefore, the gloss is preferably higher, but if the gloss is too high, the reflection is caused, and the anti-glare property is lowered, so that a value of about 30 to 90% is preferable. (4) Evaluation of anti-glare performance 1: Visual evaluation of reflection _ In order to prevent reflection from the back of the anti-glare film, the anti-foam film is bonded to the black acrylic plate in such a manner that the uneven surface becomes a surface, and the fluorescent light is illuminated. The bright interior of the lamp was visually observed from the side of the uneven surface, and it was visually evaluated in three stages according to the following criteria whether or not the fluorescent lamp was reflected. 1 : No reflection was observed 2: A slight reflection was observed 3: A reflection was clearly observed (5) Evaluation of anti-glare property 2: Visual evaluation of white turbidity In order to prevent reflection from the back of the anti-fog film, an anti-foam film was used. The surface of the black and white acrylic resin plate was adhered to the surface of the illuminating neon lamp in the bright room where the fluorescent lamp was lit, and the degree of white turbidity was visually evaluated in three stages according to the following criteria. . 1 : No white turbidity was observed. 2: White turbidity was observed slightly 3: White turbidity was clearly observed (6) Evaluation of anti-glare property 3: Evaluation of flickering First, a photometric unit (unit cel 1) 31 was prepared as shown in the plan view of Fig. 12. Patterned hood. In Fig. 12, the photometric unit 31 forms a chrome-shielding pattern 32 having a line width of 10/m and having a key shape on a transparent substrate, and a portion where the chrome-shielding pattern 32 is not formed becomes the opening portion 33. Next, as shown in Fig. 13, the reticle is placed in a light box 42 having a light source 43 inside, with the chrome-shielding pattern 32 of the reticle 41 facing upward, and will be 20/m thick. The adhesive bonding anti-glare film 51 is placed on the reticle 41 in a sample of the thickness of the glass plate 44, and is visually observed from a position of about 30 cm from the sample, thereby performing the functional evaluation of the degree of flicker in seven stages. In the 7 stages of the evaluation of the functional evaluation, the level 1 corresponds to a state in which no flicker is observed at all, the level 7 is equivalent to a state in which scintillation is severely observed, and the level 3 is slightly observed in a state of scintillation. In addition, the photometric unit of the photomask uses the photometric unit length X metering unit width in Fig. 12 to be 282 /zm x 94 //m, so that the opening portion X opening width in the figure is 272# mx84 // m. This unit is equivalent to a pixel density of 90 ppi (pixel per inch). The results are shown in Table A2. Further, in Table A2, for example, the details of the reflection sharpness of Comparative Example A2 42 321506 201017228 are as follows. Reflectance sharpness 30.2% 39. 2% 43. 2% 112. 6% 0. 5mm optical comb: 1. Omm optical comb: 0. 5mm optical comb: total Table A1

最大剖号高度Pt 〇. 30//m 4. 23 //m 表A2 __ 光學特丨 實施例A2 霧 1. 3% 犮射透明度 112. 6%~ 澤度 映入 一白濁 閃爍 比較例A2 73. 7% 239.5% Π ^0/ 2 1 1 3 3 1 從表A1、A2所不結果來看’在藉由本發明之製造方 法所製作之模具中,由於表面凹凸形狀之傾斜陡峭之部分 和緩,因此可獲得無傾斜陡峭部位的模具。此外,從本^ 明之製造方法所獲得之防炫膜係顯現了優異防炫性能。另 一方面,藉由不對整面進行蝕刻處理之製造方法所製作之 模具,由於在表面凹凸形狀存在陡峭之傾斜部分,因此在 使用該模具所製作之防炫膜會產生白濁,此外,由於傾斜 不陡峭之部位平坦,因此亦產生映入。因此,從本發明之 321506 43 201017228 製邊方法所獲得之防炫犋係顯現優異的防炫性能。 、 &lt;實施例Bl&gt; 準備在直徑20〇關之鋁輥(依據JIS之A5056)之表面 施打銅巴拉德鑛覆者。銅巴拉德鍍覆係由鍍銅層/較薄之 ‘ 银艘覆層/表面鍍銅層所構成者,鍍覆層整體之厚度係設 定成為約200 // m。將該鍍銅表面進行鏡面研磨’且在經研 磨之錢銅表面塗佈感光性樹脂,使之乾燥而形成感光性樹 脂嫉。接著’將第16圖所示重複並排圖案之圖案藉由雷射 光曝光於感光性樹脂膜上進行顯影。藉由雷射光之曝光、 ❹ 及顯影係使用Laser Stream FX(Think-Lab股份有限公司 製)來進打。在感光性樹脂膜中係使用正型感光性樹脂,藉 由將第16圖所示圖案進行曝光,遮罩對於模具用基材表面 之投影面積,相對於模具用基材表面中形成有表面 凹凸形 狀之區域之面積之比率為45.9%。此外,為了藉由雷射光 將重複並排第16圖所示圖案之圖案進行曝光,模具用基材 表面之lOO/zinxlOO/zm區域中遮罩對於模具用基材表面之 投影面積之標準偏差係為10 〇 〇 # m2以下。 ❹ 之後,以氯化銅液進行第丨蝕刻處理。此時之蝕刻量 孫,設定成為從第1钱刻處理後之輕將感光性 女除,再度以氯化銅液進行第2蝕刻處理。此時之蝕刻曰亮 孫設疋成為18# m。之後,進行錢鉻加工而製作模具。此 時,鐘絡厚度係設定成為4 β 〇)。 &lt;比較例Β1 &gt; 除不進行第2姓刻處理以外,均係以與實施例幻相 321506 44 201017228 # 同方式製作模具。 &lt;評估實驗 關於實施例B1及比較例B1中所獲得之各模具之表面 ‘ 形狀,係以與評估上述實施例A1及比較例B1中所獲得之 各模具相同方式進行評估。惟以後述之實施例B2及比較例 B2所記載之方法製作防炫膜之樣本,且測量此樣本之表面 形狀評估作為模具之表面形狀。結果如表B1所示。 &lt;實施例B2&gt; ® 將光硬化性樹脂組成物GRANDIC 806T(大日本印墨化 學工業股份有限公司製)溶解於醋酸乙酯,作成5〇重量% 濃度之溶液,且進一步將屬於光聚合起始劑之螢光素 (luciferin)TPO(BASF公司製,化學名稱:2, 4, 6-三甲基 本曱醯基二苯基氧化膦(2, 4, 6-Tri methyl benzoyl diphenylphosphine oxide))按硬化性樹脂成分每ι〇〇重量 份添加5重量份來調配塗布液。在厚度8〇之三醋酸纖 _維素(TAC)薄膜上,將此塗佈液以乾燥後塗佈厚度成為 l〇#m之方式塗佈,在設定為6(rc之乾燥機中使之乾燥3 分鐘。將乾燥後之薄膜,以光硬化性樹脂組成物層成為模 具側之方式藉由橡膠輥緊壓貼緊於實施例B1中獲得之模 具之凹凸面。在此狀態下從TAC薄膜側,將來自強度2〇mw /cm2之高壓水銀燈之光,以h線換算光量成為2〇〇mJ/cm2 之方式照射,而使光硬化性樹脂組成物層硬化。之後,將 TAC薄膜連同硬化樹脂從模具剝離,分別獲得由在表面具 有凹凸之硬化樹脂與TAC薄膜之疊層體所構成之實施例μ 321506 45 201017228 之透明之防炫膜。 &lt;比較例B2 &gt; 除使用在比較例B1所獲得之模具作為模具以外,均 係以與實施例B2相同方式獲得透明之防炫膜。 &lt;評估實驗2&gt; 關於所獲得之實施例A2及比較例A2之各防炫膜,係 以與上述實施例A2及比較例A2相同方式進行光學特性及 防炫性能之評估。 結果如表B2所示。另外,表B2中,例如實施例B2 之反射鮮明度之詳細内容如下。 反射鮮明度 0.5mm 光學梳: 11.4°/〇 1.0mm 光學梳: 42.7% 0.5mm 光學梳: 23.9% 合計 78. 0% 表B1 模具之表面形狀 算數平均高度Pa 平均長度PSm 最大剖面高度Pt 實施例B1 0. 16/zm 40. 84//m 0. 60/zm 比較例B1 1. 79/zm 41. 02 /zm 6. 51 //in 表B2 \ 光學特性 防炫性能 霧度 反射透明度 60度光澤度 映入 白濁 閃爍 實施例B2 0. 7% 78. 0% 62. 3% 1 1 1 比較例B2 68.1°/〇 154.4% 3.6% 3 3 1 46 321506 201017228 從表B1、B2所示結果來看,在藉由本發明之製造方 4 法所製作之模具中,係藉由第2蝕刻步驟,而使表面凹凸 形狀之傾斜陡峭之部分和缓,因此可獲得無傾斜陡峭部位 ‘ 的模具。此外,從本發明之製造方法所獲得之防炫膜係顯 ‘ 現了優異防炫性能。另一方面,藉由不進行第2蝕刻處理 之製造方法所製作之模具,由於在表面凹凸形狀存在陡峭 之傾斜部分,因此在使用該模具所製作之防炫膜會產生白 濁,此外,由於傾斜不陡崎之部位平坦,因此亦產生映入。 ❹ 因此,從本發明之製造方法所獲得之防炫膜係顯現優異的 防炫性能。 此次揭示之實施形態及實施例在所有觀點均係為例 示而非用以限制本發明。本發明之範圍應由申請專利範圍 所示而非上述之說明所示,且當然包括與申請專利範圍均 等涵義及範圍内所有變更。 [產業上之可利用性] _ 依據本發明之模具之製造方法,由於在表面以良好精 確度形成有微細之凹凸形狀,因此能以良好重現性,且幾 乎不存在缺陷之狀態下製造成為有助於製造顯示高防炫功 能之防炫膜之模具。再者,依據本發明之防炫膜之製造方 法,既可保持低霧度、顯示圖像之明亮度,又可防止映入 及反射、抑制白濁、防止閃爍產生、防止對比降低等,在 工業上有助於製造具有優異防炫性能之防炫膜。 【圖式簡單說明】 第1圖(a)至(e)係示意性顯示本發明之模具之製造方 47 321506 201017228 法之前半部分之較佳之一例。 第2圖係示意性顯示圖案曝光於感光性樹脂膜之狀 態0 第3圖係示意性顯示曝光於感光性樹脂膜上之圖案。 第4圖係不意性顯示曝光於感光性樹脂膜上之圖案。 第5圖係示意性顯示曝光於感光性樹脂膜上之圖案。 第6圖係示意性顯示曝光於感光性樹脂膜上之圖案。 第7圖係示意性顯示曝光於感光性樹脂膜上之圖案。 第8圖⑴及(_示意性顯示本發明之模具之製造方 法之後半部分之較佳之一例。 第9圖係示意性顯示_步驟中侧㈣進行之狀能 第10圖係示意性顯示存在經關之部位與未腳Γ刻 之部位之模具用基材。 之模具時所 第11圖(a)及(b)係為顯示製作實施例μ 使用之圖案之圖。 弟W圖係示意性 内琛評估實驗所用之 測光單元(unit cell)31之平面圖。 第13圖係示意性顯示進行閃燦評估實驗之情形 第14圖(a)至(d)係示意性顯示本發 方法之後半部分之健之—例之圖。^之模具之製造 之狀^5。圖麵纽顯示在第1㈣步财_刻進行 之模具時所使用之圖案 第16圖係顯示製作實施例μ 之圖。 321506 48 4 201017228 【主要元件符號說明】 1 模具用基材 2 藉由研磨步驟所研磨之基材之表面 * 3 感光性樹脂膜 4 在曝光步驟中所曝光之感光性樹脂膜 5 在曝光步驟中未曝光之感光性樹脂膜 6 發揮遮罩作用之感光性樹脂膜 7 無遮罩之部位 ❹ 8 藉由蝕刻階段性形成之表面 9 存在被蝕刻之部位與未被蝕刻之部位之基材表面 10 蝕刻步驟後之基材表面(表面凹凸形狀) 11 鍍鉻層 12 鑛鉻之表面 31 測光單元 32 絡遮光圖案 33 開口部 41 光罩 42 燈箱 43 光源 44 玻璃板 45 觀祭者 51 防炫膜 Pa 算數平均高度 PSm 平均長度 Pt 最大剖面高度 Ra 中心線平均粗度 49 321506Maximum cut-off height Pt 〇. 30//m 4. 23 //m Table A2 __ Optical characteristics Example A2 Fog 1. 3% Transmittance transparency 112. 6%~ Zee is reflected in a white turbidity. Comparative example A2 73 7% 239.5% Π ^0/ 2 1 1 3 3 1 From the results of Tables A1 and A2, 'in the mold produced by the manufacturing method of the present invention, the steep portion of the surface irregular shape is gentle, Therefore, a mold having no steep portion can be obtained. Further, the anti-foam film obtained by the manufacturing method of the present invention exhibits excellent anti-glare properties. On the other hand, since the mold produced by the manufacturing method which does not etch the entire surface has a steep inclined portion in the surface uneven shape, the anti-foam film produced by using the mold is white turbid, and The parts that are not steep are flat, so they are also reflected. Therefore, the anti-glare system obtained by the edge-making method of the present invention 321506 43 201017228 exhibits excellent anti-glare properties. &lt;Example B1&gt; A copper bald ore cover was prepared on the surface of an aluminum roll having a diameter of 20 (according to JIS A5056). The copper ballard plating is composed of a copper plating layer/thin y silver cladding/surface copper plating layer, and the overall thickness of the plating layer is set to be about 200 // m. The copper-plated surface was mirror-polished, and a photosensitive resin was applied to the surface of the polished copper, which was dried to form a photosensitive resin crucible. Then, the pattern in which the side-by-side pattern is repeated as shown in Fig. 16 is exposed to the photosensitive resin film by laser light for development. Laser Stream FX (Think-Lab Co., Ltd.) was used to perform exposure, exposure, and development of laser light. In the photosensitive resin film, a positive photosensitive resin is used, and the pattern shown in FIG. 16 is exposed to cover the projected area of the surface of the substrate for the mold, and surface unevenness is formed in the surface of the substrate for the mold. The ratio of the area of the shape area is 45.9%. Further, in order to expose the pattern of the pattern shown in FIG. 16 by laser light repeatedly by laser light, the standard deviation of the projected area of the surface of the substrate for the mold in the 100/zinx100/zm region of the surface of the substrate for the mold is 10 〇〇# m2 or less. After that, the second etching treatment is performed with a copper chloride solution. At this time, the amount of etching was set to be lightly removed from the first minute, and the second etching treatment was again performed with a copper chloride solution. At this time, the etching is bright. Sun set 疋 becomes 18# m. After that, the chrome processing was performed to produce a mold. At this time, the thickness of the bell is set to 4 β 〇). &lt;Comparative Example 1 &gt; A mold was produced in the same manner as in the embodiment of the phantom 321506 44 201017228 # except that the second surname processing was not performed. &lt;Evaluation Experiment The surface ‘shape of each of the dies obtained in Example B1 and Comparative Example B1 was evaluated in the same manner as in the evaluation of each of the dies obtained in the above Example A1 and Comparative Example B1. A sample of the anti-foam film was prepared by the method described in Example B2 and Comparative Example B2 described later, and the surface shape of the sample was measured and evaluated as the surface shape of the mold. The results are shown in Table B1. &lt;Example B2&gt; ® The photocurable resin composition GRANDIC 806T (manufactured by Dainippon Ink and Chemicals Co., Ltd.) was dissolved in ethyl acetate to prepare a solution having a concentration of 5 〇% by weight, and further belongs to photopolymerization. Luciferin TPO (manufactured by BASF Corporation, chemical name: 2, 4, 6-Trimethyl benzoyl diphenylphosphine oxide) The coating resin was prepared by adding 5 parts by weight per ι by weight of the resin component. The coating liquid was applied to a thickness of 8 Å of a cellulose acetate-dimensional (TAC) film, and the coating liquid was applied to a thickness of 1 〇 #m after drying, and was set in a dryer set to 6 (rc). After drying for 3 minutes, the dried film was pressed against the uneven surface of the mold obtained in Example B1 by a rubber roller so that the photocurable resin composition layer became the mold side. In this state, the TAC film was used. On the other side, the light from the high-pressure mercury lamp having a strength of 2 〇mw/cm 2 is irradiated so that the amount of light converted into h lines becomes 2 〇〇 mJ/cm 2 , and the photocurable resin composition layer is cured. Thereafter, the TAC film is cured together with hardening. The resin was peeled off from the mold, and a transparent anti-glare film of Example μ321506 45 201017228 composed of a laminate of a cured resin having irregularities on the surface and a TAC film was obtained. <Comparative Example B2 &gt; The mold obtained in B1 was obtained as a mold, and a transparent anti-foam film was obtained in the same manner as in Example B2. <Evaluation Experiment 2> Each of the obtained anti-glare films of Example A2 and Comparative Example A2 was With the above embodiment A2 and comparative example A2 The evaluation of the optical characteristics and the anti-glare property was carried out in the same manner. The results are shown in Table B2. In addition, in Table B2, for example, the details of the reflection sharpness of Example B2 are as follows. Reflective sharpness 0.5 mm Optical comb: 11.4 ° / 〇 1.0mm optical comb: 42.7% 0.5mm optical comb: 23.9% total 78. 0% Table B1 mold surface shape arithmetic mean height Pa average length PSm maximum profile height Pt Example B1 0. 16/zm 40. 84//m 0. 60/zm Comparative Example B1 1. 79/zm 41. 02 /zm 6. 51 //in Table B2 \ Optical characteristics Anti-glare performance Haze reflection Transparency 60 degree Gloss is reflected in white turbidity Example B2 0. 7 % 78. 0% 62. 3% 1 1 1 Comparative Example B2 68.1°/〇154.4% 3.6% 3 3 1 46 321506 201017228 From the results shown in Tables B1 and B2, in the method of the manufacturer 4 of the present invention In the mold to be produced, the portion in which the inclination of the surface uneven shape is steeped is smoothed by the second etching step, so that the mold having no steep portion is obtained. Further, the anti-foam film obtained by the production method of the present invention is obtained. The system shows that it has excellent anti-glare performance. On the other hand, by not performing the second Since the mold produced by the manufacturing method of the etching treatment has a steep inclined portion in the surface uneven shape, the anti-foam film produced by using the mold is white turbid, and since the portion where the tilt is not steep is flat, it also occurs. Therefore, the anti-foam film obtained by the production method of the present invention exhibits excellent anti-glare properties. The embodiments and examples disclosed herein are illustrative and not restrictive of the invention. The scope of the present invention is intended to be limited by the scope of the claims [Industrial Applicability] According to the method for producing a mold of the present invention, since a fine uneven shape is formed on the surface with good precision, it can be manufactured with good reproducibility and almost no defects. It helps to create molds that display high anti-glare features. Furthermore, according to the method for manufacturing an anti-glare film of the present invention, it is possible to maintain low haze, display image brightness, prevent reflection and reflection, suppress white turbidity, prevent flicker generation, prevent contrast reduction, etc., in the industry. It helps to create an anti-foam film with excellent anti-glare properties. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 (a) to (e) schematically show a preferred example of the first half of the method of manufacturing the mold of the present invention 47 321506 201017228. Fig. 2 is a view schematically showing a state in which a pattern is exposed to a photosensitive resin film. Fig. 3 is a view schematically showing a pattern exposed on a photosensitive resin film. Fig. 4 is a view showing a pattern exposed on a photosensitive resin film. Fig. 5 is a view schematically showing a pattern exposed on a photosensitive resin film. Fig. 6 is a view schematically showing a pattern exposed on a photosensitive resin film. Fig. 7 is a view schematically showing a pattern exposed on a photosensitive resin film. Fig. 8 (1) and (_ schematically show a preferred example of the latter half of the method for manufacturing a mold of the present invention. Fig. 9 is a schematic view showing the state of the step (4) in the step (Fig. 10) schematically showing the existence of The base material for the part to be cut and the part of the mold which is not engraved is shown in Fig. 11. (a) and (b) of the mold are diagrams showing the pattern used in the production example μ.平面图Evaluation of the plan view of the unit cell 31 used in the experiment. Fig. 13 is a view schematically showing the case where the flash evaluation experiment is performed. Fig. 14 (a) to (d) schematically show the latter half of the method.健之—A diagram of the example. ^The manufacturing of the mold ^5. The pattern used to display the mold used in the first (four) step of the mold is shown in Figure 16. The figure shows the production example μ. 321506 48 4 201017228 [Description of main component symbols] 1 Substrate for mold 2 Surface of substrate to be polished by grinding step * 3 Photosensitive resin film 4 Photosensitive resin film 5 exposed in the exposure step is not exposed in the exposure step The photosensitive resin film 6 functions as a mask The portion of the photosensitive resin film 7 that is not covered ❹ 8 The surface 9 formed by etching stepwise has the surface of the substrate to be etched and the portion of the substrate that is not etched 10 The surface of the substrate after the etching step (surface unevenness) 11 chrome layer 12 surface of ore chrome 31 light metering unit 32 light shielding pattern 33 opening part 41 light cover 42 light box 43 light source 44 glass plate 45 spectator 51 anti-glare film Pa arithmetic average height PSm average length Pt maximum profile height Ra center line Average thickness 49 321506

Claims (1)

201017228 七、申請專利範圍: 1. 一種模具之製造方法,其特徵為包括: 第1鍍覆步驟,對模具用基材之表面施行鍍銅或鍍 鎳; 研磨步驟,將藉由第1鍍覆步驟施加鍍覆之表面進 行研磨; 感光性樹脂膜形成步驟,將感光性樹脂塗佈於經研 磨之面而形成膜; 曝光步驟,將圖案曝光在感光性樹脂膜上; 顯影步驟,將經曝光圖案之感光性樹脂膜進行顯 影; 蝕刻步驟,使用經顯影之感光性樹脂膜作為遮罩, 施行蝕刻處理,且在經研磨之鍍覆面形成凹凸;及 第2鍍覆步驟,對於藉由蝕刻步驟所形成之凹凸面 施行鍍鉻; 而且,在前述蝕刻步驟中,對模具用基材整面施行 蝕刻處理。 2. 如申請專利範圍第1項之製造方法,其中, 前述蝕刻步驟係為使用經顯影之感光性樹脂膜作 為遮罩,並對於模具用基材中包含由前述遮罩所覆蓋之 區域之整面,施行蝕刻處理,且在經研磨之鍍覆面形成 凹凸之步驟。 3. 如申請專利範圍第2項之製造方法,其中, 包括在蝕刻步驟與第2鍍覆步驟之間,將前述感光 50 321506 201017228 ^ 賴㈣錯之$辅樹 4.如申,範圍第1項之製造方二, 則述蝕刻步驟係包括: ‘罩並進行蝕刻處^ mi影之感光性樹脂骐作為^ 感光性樹脂膜《鍍覆面形成凹凸; 第2餘刻^ ,將感光性樹脂膜制離4 ❹ 由刻處理使藉由第光性樹脂膜之後1 .如申=利範圍第4項之製造方法,其;, 刻步驟二:中之崎係為1至5〇-,第Μ 如Φ钱垂 係為1至50㈣。 : 利乾圍第1至6項中任一項之f造方法 鵪 以從經電腦控制之=:媒上之圖案之緣先,係 s:::作成之圖d雷射光而進行在電 第1至7項中任-項―其中; 模具用基^躲溶解所殘留之感紐樹脂膜斜於 中形成=面之投影_,相躲在模制基材表面 I 咬有表面凹凸形狀之區域之面積為1至70%。 .申請專利範圍第1至δ項中任一項之製造方法,其中, 具用基材表面之⑽^雨111之區域中之 Ty驟後未溶解所殘留之感光性樹脂膜對於模具用 321506 51 201017228 基材表面之投影面積之標準偏差係為10 0 0 //m2以下。 10. 如申請專利範圍第1至9項中任一項之製造方法,其中, 藉由銀鉻所形成之鍵鉻層係具有1至10/im之厚 度。 11. 一種防炫膜之製造方法,係包括: 將以申請專利範圍第1至10項中任一項之方法所 製造之模具之凹凸面轉印至透明樹脂薄膜之步驟;及 從模具將轉印有模具之凹凸面之透明樹脂薄膜從 模具剝離之步驟。 52 321506201017228 VII. Patent application scope: 1. A method for manufacturing a mold, comprising: a first plating step of performing copper plating or nickel plating on a surface of a substrate for a mold; and a grinding step by using the first plating a step of applying a plated surface for polishing; a photosensitive resin film forming step of applying a photosensitive resin to the polished surface to form a film; an exposing step of exposing the pattern to the photosensitive resin film; and a developing step of exposing The photosensitive resin film of the pattern is developed; the etching step is performed by using the developed photosensitive resin film as a mask, performing etching treatment, and forming irregularities on the polished plating surface; and the second plating step, by etching step The formed uneven surface is subjected to chrome plating. Further, in the etching step, the entire surface of the substrate for the mold is subjected to an etching treatment. 2. The manufacturing method according to claim 1, wherein the etching step is a use of a developed photosensitive resin film as a mask, and the entire substrate for the mold includes a region covered by the mask. The surface is subjected to an etching treatment and a step of forming irregularities on the polished plating surface. 3. The manufacturing method of claim 2, wherein the photo-sensing 50 321506 201017228 ^ (4) is wrong between the etching step and the second plating step. In the manufacturing method of the second aspect, the etching step includes: 'covering and etching the photosensitive resin ^ as a photosensitive resin film, forming a concave-convex surface on the plating surface; the second remaining ^, the photosensitive resin film制 4 ❹ ❹ ❹ ❹ 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 利 利For example, Φ money is 1 to 50 (four). : The method of making any of items 1 to 6 of Liganwei is based on the computer-controlled =: the pattern of the medium on the media, the s::: Any one of the items 1 to 7 - where; the base of the mold is used to hide the residual resin film which is formed obliquely in the middle = the projection of the surface _, hiding on the surface of the molded substrate I biting the surface of the surface The area is from 1 to 70%. The manufacturing method according to any one of the items 1 to 3, wherein the photosensitive resin film remaining in the region of the surface of the substrate (10) which is not dissolved in the surface of the rain 111 is used for the mold 3215051 201017228 The standard deviation of the projected area of the substrate surface is below 100 @ m2. 10. The manufacturing method according to any one of claims 1 to 9, wherein the bond chrome layer formed by silver chrome has a thickness of from 1 to 10/im. 11. A method for producing an anti-foam film, comprising: a step of transferring a concave-convex surface of a mold manufactured by the method of any one of claims 1 to 10 to a transparent resin film; and transferring from the mold The step of peeling off the transparent resin film on which the uneven surface of the mold is printed from the mold. 52 321506
TW098131854A 2008-09-29 2009-09-22 Method for making a mold and method for making an anti-glare film TWI459040B (en)

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