KR20100024673A - Tool tip of bonding machine and manufacture method thereof - Google Patents

Tool tip of bonding machine and manufacture method thereof Download PDF

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KR20100024673A
KR20100024673A KR1020080083346A KR20080083346A KR20100024673A KR 20100024673 A KR20100024673 A KR 20100024673A KR 1020080083346 A KR1020080083346 A KR 1020080083346A KR 20080083346 A KR20080083346 A KR 20080083346A KR 20100024673 A KR20100024673 A KR 20100024673A
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tip
thermocompressor
bonding machine
manufacturing
base layer
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KR101008347B1 (en
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정상희
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정상희
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors

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  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: A tool tip of a bonding machine and a manufacturing method thereof are provided to fix a tip which transfers heat and pressure of a heat pressuring device to an IC or a printed circuit board, thereby removing an additional setting work to improve productivity. CONSTITUTION: A tool tip of a bonding machine includes a base layer(61) and a coating layer(62). The base layer is bent to be hooked in a heat pressuring device. The coating layer is made of a silicon material. And the coating layer is formed on an external bottom of the base layer.

Description

본딩 머신의 열압착기용 팁 및 그 제조방법{TOOL TIP OF BONDING MACHINE AND MANUFACTURE METHOD THEREOF}TOOL TIP OF BONDING MACHINE AND MANUFACTURE METHOD THEREOF}

본 발명은 본딩 머신에 관한 것으로서, 특히 본딩 머신에 장착된 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달하기 위한 열압착기용 팁 및 그 제조방법에 관한 것이다. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to bonding machines, and more particularly, to a thermocompressor tip for transferring heat and pressure from a thermocompressor mounted on a bonding machine to an IC or a printed circuit board and a method of manufacturing the same.

본딩 머신은 LCD(Liquid Crystal Display), OLED(유기발광다이오드) 및 PDP(플라즈마 디스플레이 패널) 등의 제품 제조시 유리기판과 드라이브 IC 또는 드라이브 IC와 인쇄회로기판(PCB)을 접착시키는데 사용된다. 즉, 본딩 머신에 장착된 열압착기의 열과 압력을 드라이브 IC 또는 인쇄회로기판에 전달함으로써 유리기판과 드라이브 IC 또는 드라이브 IC와 PCB를 접착시키게 되는 것이다. Bonding machines are used to bond glass substrates to drive ICs or drive ICs and printed circuit boards (PCBs) in manufacturing products such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and plasma display panels (PDPs). That is, the glass substrate and the drive IC or the drive IC and the PCB are bonded by transferring the heat and pressure of the thermocompressor mounted on the bonding machine to the drive IC or the printed circuit board.

그런데, 열압착 공법으로 유리기판과 드라이브 IC를 접착시키는 OLB 공정과, 드라이브 IC와 인쇄회로기판을 접착시키는 TAB 공정에서는 열 압착시 가해지는 열과 압력이 드라이브 IC 또는 인쇄회로기판에 간접적으로 균일하게 전달될 수 있도록 열압착기와 드라이브 IC 또는 PCB 사이에 별도의 완충 시트를 배치하여 사용하고 있다.However, in the OLB process that bonds the glass substrate to the drive IC by the thermocompression method, and the TAB process that bonds the drive IC and the printed circuit board, heat and pressure applied during thermal compression are indirectly and uniformly transferred to the drive IC or the printed circuit board. A separate cushioning sheet is used between the thermocompressor and the drive IC or PCB.

도 1은 종래 본딩 머신 열압착기의 사용 상태도로서, 부호 "10"은 유리기판, "20"은 이방성 도전필름(Anisotropic Conductive Film : ACF), "30"은 드라이브 IC, "40"은 열압착기, "50"은 시트를 나타낸다. 1 is a state diagram of a conventional bonding machine thermocompressor, "10" is a glass substrate, "20" is an anisotropic conductive film (ACF), "30" is a drive IC, "40" is a thermocompressor, "50" represents a sheet.

도 1을 참조하여 OLB 공정을 설명하자면, 먼저 유리기판(10) 위에 도전볼(21)이 산포된 접착성수지(22)로 이루어진 이방성 도전필름(20)을 탑재한다. 계속해서, 열압착기(40)를 사용하여 테프론 시트나 완충 시트(50)를 거쳐 이방성 도전필름(20) 위로 드라이브 IC(30)를 간접적으로 열압착함으로써 유리기판(10)과 드라이브 IC(30)를 접착하게 된다. To describe the OLB process with reference to FIG. 1, first, an anisotropic conductive film 20 made of an adhesive resin 22 in which conductive balls 21 are scattered is mounted on a glass substrate 10. Subsequently, the glass substrate 10 and the drive IC 30 are thermally compressed by indirectly thermally compressing the drive IC 30 onto the anisotropic conductive film 20 via the Teflon sheet or the buffer sheet 50 using the thermocompressor 40. Will be bonded.

그런데, 상술한 바와 같이 테프론 시트나 완충 시트를 사용하는 경우, 작업시마다 시트 간격, 평탄도, 피치 간격 및 텐션 등을 조절하면서 시트 세팅을 일일이 해야 함으로써 작업성 및 생산성이 저하되는 문제점이 있었다. However, in the case of using the Teflon sheet or the buffer sheet as described above, there is a problem that workability and productivity are deteriorated by adjusting the sheet setting while adjusting the sheet spacing, flatness, pitch spacing, tension, and the like every work.

이에 본 발명은 상기와 같은 문제점을 해결하기 위한 것으로서, 본딩 머신의 열압착기에 고정 부착되어 시트 간격, 평탄도, 피치 간격 및 텐션 등의 세팅이 불필요하여 작업성 및 생산성을 향상시킬 수 있도록 된 본딩 머신의 열압착기용 팁 및 그 제조방법을 제공하는데 그 목적이 있다. Accordingly, the present invention is to solve the above problems, the bonding is fixed to the thermocompressor of the bonding machine bonding is not required to set the sheet spacing, flatness, pitch spacing, tension, etc. to improve workability and productivity It is an object of the present invention to provide a tip for a thermocompressor of a machine and a manufacturing method thereof.

상기와 같은 목적을 달성하기 위하여 본 발명에 따른 본딩 머신의 열압착기용 팁은, 본딩 머신에 장착된 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달하기 위한 수단으로서, 열압착기에 걸어 부착할 수 있도록 '

Figure 112008060752552-PAT00002
'자 형태로 절곡된 형상이고, 플루오로 엘라스토머 재질의 베이스층과, 베이스층 외측 바닥면에 형성되는 실리콘 재질의 코팅층으로 이루어진 것을 특징으로 한다. In order to achieve the above object, a tip for a thermocompressor of a bonding machine according to the present invention is a means for transferring heat and pressure of a thermocompressor mounted on a bonding machine to an IC or a printed circuit board. So that
Figure 112008060752552-PAT00002
It is a shape bent in a 'shape, characterized in that consisting of a base layer of fluoroelastomer material, and a coating layer of silicon material formed on the outer bottom surface of the base layer.

여기에서, 상기 코팅층은 불소와 실리콘이 배합된 폴리머 재질일 수 있다. Here, the coating layer may be a polymer material in which fluorine and silicon are blended.

한편, 본 발명에 따른 본딩 머신의 열압착기용 팁 제조방법은, 본딩 머신에 장착된 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달하기 위한 수단을 제조하는 방법으로서, 플루오로 엘라스토머를 '

Figure 112008060752552-PAT00003
'자 형태로 압출하여 열압착기용 팁을 가공하는 단계와; 가공된 팁의 외측 바닥면을 실리콘으로 코팅 처리하는 단계를 포함하여 이루어진 것을 특징으로 한다. Meanwhile, the method for manufacturing a tip for a thermocompressor of a bonding machine according to the present invention is a method for manufacturing a means for transferring heat and pressure of a thermocompressor mounted on a bonding machine to an IC or a printed circuit board.
Figure 112008060752552-PAT00003
Extruding into a 'shape to process the tip for the thermocompressor; And coating the outer bottom surface of the processed tip with silicon.

여기에서, 상기 팁 가공 단계 및 코팅 처리 단계 사이에, 가공된 팁을 오븐 처리하는 단계를 더 포함할 수 있다. 또한, 상기 코팅 처리 단계 이후에, 코팅 처리된 팁을 숙성시키는 단계를 더 포함할 수 있다. Here, between the tip processing step and the coating treatment step, may further comprise the step of oven processing the processed tip. In addition, after the coating treatment step, it may further include the step of aging the coated tip.

본 발명에 따르면, 본딩 머신의 열압착기에 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달할 수 있는 팁을 고정 부착함으로써 추가적인 세팅 작업이 불필요하여 작업성 및 생산성을 향상시킬 수 있는 잇점이 있다. According to the present invention, there is an advantage in that the thermocompressor of the bonding machine is fixedly attached with a tip capable of transferring the heat and pressure of the thermocompressor to an IC or a printed circuit board, thereby eliminating additional setting work, thereby improving workability and productivity.

이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명하기로 한다.Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

도 2는 본 발명에 따른 본딩 머신의 열압착기용 팁 단면도이다. 2 is a cross-sectional view of a tip for a thermocompressor of the bonding machine according to the present invention.

본 발명에 따른 본딩 머신의 열압착기용 팁(60)은, 열압착기에 장착되어 열압착기의 열과 압력을 드라이브 IC 또는 인쇄회로기판에 전달할 수 있도록 되어 있다. The thermocompressor tip 60 of the bonding machine according to the present invention is mounted on the thermocompressor so as to transmit heat and pressure of the thermocompressor to a drive IC or a printed circuit board.

도 2에 도시한 바와 같이, 본 발명에 따른 본딩 머신의 열압착기용 팁(60)은 열압착기에 걸어 부착할 수 있도록 '

Figure 112008060752552-PAT00004
'자 형태로 절곡된 형상이면서 플루오로 엘라스토머 재질의 베이스층(61)과, 베이스층 외측 바닥면에 형성되는 실리콘 재질의 코팅층(62)으로 이루어진다. As shown in Figure 2, the thermocompressor tip 60 of the bonding machine according to the invention can be attached to the thermocompressor '
Figure 112008060752552-PAT00004
It is composed of a base layer 61 of fluoroelastomer material and a silicone coating layer 62 formed on the outer bottom surface of the base layer.

상기 플루오로 엘라스토머 재질의 베이스층(61)은 내열성과 열전도율이 우수하다. 그리고, 평활성이나 표면 조도가 우수하기 때문에 열압착기의 열과 압력이 드라이브 IC 또는 인쇄회로기판에 간접적으로 균일하게 전달될 수 있도록 한다. The fluoroelastomer base layer 61 is excellent in heat resistance and thermal conductivity. In addition, since the smoothness and surface roughness are excellent, the heat and pressure of the thermocompressor can be indirectly and uniformly transmitted to the drive IC or the printed circuit board.

상기 실리콘 재질의 코팅층(62)은 탄성, 내구성 및 이형성이 우수하여 반복 압착이 가능하도록 한다. 나아가서, 상기 코팅층(62)은 보다 우수한 특성을 발휘할 수 있도록 불소(F)와 실리콘(SI)이 적절히 배합(예컨대, 7:3의 비율)된 폴리머 재질일 수 있다. 물론, 불소(F)와 실리콘(SI)의 배율 비율은 필요에 따라 적절하게 조정할 수 있다. The coating layer 62 of the silicon material is excellent in elasticity, durability and releasability to allow repeated pressing. In addition, the coating layer 62 may be a polymer material in which fluorine (F) and silicon (SI) are properly blended (eg, a ratio of 7: 3) to exhibit more excellent characteristics. Of course, the magnification ratio of fluorine (F) and silicon (SI) can be suitably adjusted as needed.

도 3은 본 발명에 따른 본딩 머신의 열압착기용 팁 제조방법을 설명하기 위한 흐름도이다. 3 is a flowchart illustrating a method for manufacturing a tip for a thermocompressor of a bonding machine according to the present invention.

먼저, 내열성과 열전도율이 우수한 재질인 플루오로 엘라스토머를 280~350℃ 온도 조건 하에서 '

Figure 112008060752552-PAT00005
'자 형태로 압출하여 열압착기용 팁을 가공한다(S110). First, fluoroelastomer, a material having excellent heat resistance and thermal conductivity, was subjected to '
Figure 112008060752552-PAT00005
Process the tip for the thermocompressor by extruding in a 'shape (S110).

계속해서, 압출에 의해 가공된 팁을, 팁 가공에 따라 발생되는 실록산 가스 제거를 위해 180~220℃ 온도 조건 하에서 4시간 정도 오븐 처리한다(S120). Subsequently, the tip processed by extrusion is oven-treated for about 4 hours under 180-220 ° C. temperature conditions to remove siloxane gas generated by the tip processing (S120).

계속해서, 이형성을 향상시켜 반복 압축이 가능하도록 팁의 외측 바닥면을 불소와 실리콘이 적절히 배합된 폴리머 재질의 실리콘으로 코팅 처리한다(S130). Subsequently, the outer bottom surface of the tip is coated with silicone of a polymer material in which fluorine and silicon are properly blended to improve releasability and to allow repeated compression (S130).

마지막으로, 실리콘 코팅층이 플루오로 엘라스토머 베이스층에 안정적으로 안착될 수 있도록 코팅 처리된 팁을 10~25℃ 온도 조건 하에서 24~72 시간 정도 숙성시킨다(S140). Finally, in order to stably seat the silicon coating layer on the fluoroelastomer base layer, the coated tip is aged for 24 to 72 hours under the temperature condition of 10-25 ° C. (S140).

도 4는 본 발명에 따른 팁이 부착된 본딩 머신의 열압착기의 사용 상태도이다. Figure 4 is a state diagram of use of the thermocompressor of the bonding machine with a tip according to the present invention.

도 4에서 부호 "10"은 유리기판, "20"은 이방성 도전필름(ACF), "30"은 드라 이브 IC, "40"은 열압착기, "60"은 열압착기용 팁을 나타낸다. In FIG. 4, reference numeral “10” denotes a glass substrate, “20” denotes an anisotropic conductive film (ACF), “30” denotes a drive IC, “40” denotes a thermocompressor, and “60” denotes a tip for a thermocompressor.

도 4를 참조하여 OLB 공정을 설명하자면, 먼저 유리기판(10) 위에 도전볼(21)이 산포된 접착성수지(22)로 이루어진 이방성 도전필름(20)을 탑재한다. 계속해서, 하부에 팁(60)이 부착된 열압착기(40)를 사용하여 이방성 도전필름(20) 위로 드라이브 IC(30)를 간접적으로 열압착함으로써 유리기판(10)과 드라이브 IC(30)를 접착하게 된다. To describe the OLB process with reference to FIG. 4, first, an anisotropic conductive film 20 made of an adhesive resin 22 in which conductive balls 21 are scattered is mounted on a glass substrate 10. Subsequently, the glass substrate 10 and the drive IC 30 are connected by indirectly thermally compressing the drive IC 30 onto the anisotropic conductive film 20 by using a thermocompressor 40 having a tip 60 attached to the bottom thereof. To bond.

[시험예][Test Example]

본 발명에 따른 본딩 머신의 열압착기용 팁에 대한 신뢰성 시험을 하였다. The reliability test was carried out for the thermocompressor tip of the bonding machine according to the invention.

1. 내구성 시험 1.durability test

종래 완충 시트의 경우, 반복적으로 사용함에 따라 시트의 변형을 초래하는 경우가 있었다. In the case of the conventional buffer sheet, the sheet may be deformed by repeated use.

그렇지만, 본 발명의 열압착기용 팁의 경우, 도 5에 도시한 바와 같이 반복적으로 사용하여 40, 80, 120시간이 경과하더라도 팁이 변형되지 않을 정도로 내구성이 우수하였다. However, in the case of the thermocompressor tip of the present invention, as shown in FIG. 5, the tip was repeatedly used for 40, 80, and 120 hours, so that the tip was not deformed.

2. 이형성 시험2. Release test

종래 완충 시트의 경우, 반복적으로 사용함에 따라 시트가 이방성 도전필름에 달라붙는 경우가 있었다. In the case of the conventional buffer sheet, the sheet may stick to the anisotropic conductive film as it is repeatedly used.

그렇지만, 본 발명의 열압착기용 팁의 경우, 도 6에 도시한 바와 같이 반복 적으로 사용하여 40, 80, 120시간이 경과하더라도 이방성 도전필름에 달라붙는 현상이 발생되지 않을 정도로 이형성이 우수하였다. However, in the case of the tip for the thermocompressor of the present invention, as shown in Figure 6, even after 40, 80, 120 hours of repeated use, the releasability was excellent enough to not stick to the anisotropic conductive film.

3. 열전도율3. Thermal conductivity

본 발명의 열압착기용 팁의 경우, 도 7에 도시한 바와 같이 반복적으로 사용하더라도 종래 완충 시트와 동등 수준의 열전도율을 보였다. In the case of the thermocompressor tip of the present invention, even when repeatedly used as shown in Figure 7, the thermal conductivity was equivalent to that of the conventional buffer sheet.

한편, 본 발명에 따른 본딩 머신의 열압착기용 팁 및 그 제조방법을 한정된 실시예에 따라 설명하였지만, 본 발명의 범위는 특정 실시예에 한정되는 것은 아니며, 본 발명과 관련하여 통상의 지식을 가진자에게 자명한 범위내에서 여러 가지의 대안, 수정 및 변경하여 실시할 수 있다. On the other hand, although the tip for the thermocompressor of the bonding machine according to the present invention and a method of manufacturing the same have been described in accordance with a limited embodiment, the scope of the present invention is not limited to the specific embodiment, and having ordinary knowledge in connection with the present invention. Many alternatives, modifications and variations can be made without departing from the scope of the disclosure.

도 1은 종래 본딩 머신의 열압착기의 사용 상태도. 1 is a state diagram used in the thermocompressor of the conventional bonding machine.

도 2는 본 발명에 따른 본딩 머신의 열압착기용 팁 단면도. Figure 2 is a cross-sectional view of the tip for the thermocompressor of the bonding machine according to the present invention.

도 3은 본 발명에 따른 본딩 머신의 열압착기용 팁 제조방법을 설명하기 위한 흐름도. Figure 3 is a flow chart for explaining a tip manufacturing method for a thermocompressor of the bonding machine according to the present invention.

도 4는 본 발명에 따른 팁이 부착된 본딩 머신의 열압착기의 사용 상태도. Figure 4 is a state of use of the thermocompressor of the bonding machine with a tip according to the present invention.

도 5는 본 발명에 따른 팁의 내구성 시험에 관한 도면. 5 is a view of the durability test of the tip according to the invention.

도 6은 본 발명에 따른 팁의 이형성 시험에 관한 도면. 6 is a view of the releasability test of the tip according to the invention.

도 7은 본 발명에 따른 팁의 열전도율 시험에 관한 도면. 7 is a view of the thermal conductivity test of the tip according to the present invention.

*도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10 : 유리기판 20 : 이방성 도전필름10: glass substrate 20: anisotropic conductive film

30 : 드라이브 IC 40 : 열압착기30: drive IC 40: thermocompressor

50 : 완충 시트 60 : 열압착기용 팁50: cushioning sheet 60: tip for thermocompressor

61 : 베이스층 62 : 코팅층61: base layer 62: coating layer

Claims (5)

본딩 머신에 장착된 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달하기 위한 수단으로서, Means for transferring the heat and pressure of the thermocompressor mounted on the bonding machine to the IC or printed circuit board, 열압착기에 걸어 부착할 수 있도록 '
Figure 112008060752552-PAT00006
'자 형태로 절곡된 형상이고, To be attached to the thermocompressor,
Figure 112008060752552-PAT00006
Is a shape that is bent into a 플루오로 엘라스토머 재질의 베이스층과, 베이스층 외측 바닥면에 형성되는 실리콘 재질의 코팅층으로 이루어진 것을 특징으로 하는 본딩 머신의 열압착기용 팁. A tip for a thermocompressor of a bonding machine, comprising a base layer made of a fluoroelastomer material and a coating layer made of silicon formed on an outer bottom surface of the base layer. 청구항 1에 있어서, The method according to claim 1, 상기 코팅층은 불소와 실리콘이 배합된 폴리머 재질인 것을 특징으로 하는 본딩 머신의 열압착기용 팁. The coating layer is a tip for a thermocompressor of a bonding machine, characterized in that the fluorine and silicon compounded polymer material. 본딩 머신에 장착된 열압착기의 열과 압력을 IC 또는 인쇄회로기판에 전달하기 위한 수단을 제조하는 방법으로서, A method of manufacturing a means for transferring heat and pressure of a thermocompressor mounted on a bonding machine to an IC or a printed circuit board, 플루오로 엘라스토머를 '
Figure 112008060752552-PAT00007
'자 형태로 압출하여 열압착기용 팁을 가공하는 단계와; Fluoroelastomers'
Figure 112008060752552-PAT00007
Extruding into a 'shape to process the tip for the thermocompressor; 가공된 팁의 외측 바닥면을 실리콘으로 코팅 처리하는 단계를 포함하여 이루어진 것을 특징으로 하는 본딩 머신의 열압착기용 팁 제조방법. A method of manufacturing a tip for a thermocompressor of a bonding machine, comprising the step of coating the outer bottom of the processed tip with silicon. 청구항 3에 있어서 상기 팁 가공 단계 및 코팅 처리 단계 사이에, The method according to claim 3, between the tip processing step and the coating treatment step, 가공된 팁을 오븐 처리하는 단계를 더 포함하는 것을 특징으로 하는 본딩 머신의 열압착기용 팁 제조방법. The method of manufacturing a tip for a thermocompressor of a bonding machine, further comprising the step of oven processing the processed tip. 청구항 3에 있어서 상기 코팅 처리 단계 이후에, The method according to claim 3, after the coating treatment step, 코팅 처리된 팁을 숙성시키는 단계를 더 포함하는 것을 특징으로 하는 본딩 머신의 열압착기용 팁 제조방법. A method of manufacturing a tip for a thermocompressor of a bonding machine, further comprising the step of aging the coated tip.
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