KR100696214B1 - One layered multiple release sheet for outer lead bonding and tape automated bonding process - Google Patents

Abstract

        The present invention relates to a one layer composite sheet for outer lead bonding (OLB) and tape automated bonding (TAB) processes, and a multi-ply sheet (a glass fabric coated with PTFE resin and a silicone resin sheet). And polyamide film) to increase productivity by one sheet, repeatable use, excellent cushioning, thermal conductivity and dimensional stability, and one layer for OLB and TAB process suitable for wide product production. ) Relates to a composite sheet.

        Such a present invention, the glass cloth (glass cloth); Polytetra fluoroethylene (PTFE) coating layer 12 formed on both sides of the glass fabric; A silicone coating layer formed on the outside of any one of the PTFE coating layers 12; It consists of a polyimide film (Polyimide Film) attached to the silicon (silicone) coating layer, the air to prevent the air bubbles are formed in the polyimide film (Polyimide Film) to adhere to the glass cloth (glass cloth) through the silicon coating layer It is to provide a one layer composite sheet for outer lead bonding (OLB) and tape automated bonding (TAB) processes, characterized in that the discharge pores are formed.

OLB, TAB, One Layer Composite Sheet, Drive IC, PTFE Coating Layer, Silicone Resin Coating Layer

Description

One layered multiple release sheet for outer lead bonding and tape automated bonding process

 1 is an enlarged cross sectional view of a one layer composite sheet for an OLB and TAB process according to the present invention;

 FIG. 2 is a state diagram in which the original layer composite sheet shown in FIG. 1 is used in an OLB and a TAB process. FIG.

<Explanation of symbols for main parts of drawing>

10 glass cloth 12 PTFE coating layer

20: coated glass cloth 22: Polyimide Film

25: silicone resin coating layer 30: one layer composite sheet

40: thermocompression mechanism 50: TCP or COF with integrated drive IC

55: TCP or COF connector 65: LCD panel or PCB terminal

70: ACF (anisotropic conductive film) 72: conductive ball

74: adhesive resin 80: pores (not shown)

        The present invention relates to a one layer composite sheet for outer lead bonding (OLB) and tape automated bonding (TAB) processes, and in particular, has excellent cushioning, dimensional stability, smoothness, heat resistance and thermal conductivity. It is a one layer composite sheet for OLB and TAB processes that is excellent for repeatable use and is particularly useful for the production of wide products.

        Recently, as the information society has evolved rapidly, there is a need for a flat panel display having excellent characteristics such as thinning, light weight, and low power consumption. Among them, a liquid crystal display has a resolution, It is excellent in color display and image quality, and is actively applied to notebooks and desktop monitors.

        In general, a liquid crystal display device arranges two substrates on which electrodes are formed so that the surfaces on which the two electrodes are formed face each other, injects a liquid crystal material between the two substrates, and applies a voltage to the two electrodes to generate an electric field. By moving the liquid crystal molecules, the image is expressed by the transmittance of light that varies accordingly.

        The liquid crystal display device is characterized by light weight, thinness, low power consumption, and the like, and the image quality is rapidly improved by the improvement of the liquid crystal material and the development of micropixel processing technology, and its application range is gradually increasing. The scope of application is the application of small high precision display such as clock, electronic desk calculator, measuring instruments, etc. gradually, such as project display, notebook book, personal computer, workstation, television. It is widely used for large, multi-pixel display applications such as television.

        In particular, when a liquid crystal display device is used in a portable device such as a notebook computer, the liquid crystal display device should be manufactured in a portable type so as to be convenient for the user to carry.

        The liquid crystal display includes a liquid crystal panel in which liquid crystal is injected between two substrates, a backlight disposed under the liquid crystal panel and used as a light source, and a driving unit for driving the liquid crystal panel, which is located outside the liquid crystal panel. The liquid crystal panel is composed of pixels arranged in a matrix between two glass substrates and a switching element that controls signals supplied to these pixels, that is, a thin film transistor.

        Meanwhile, the driver is connected to a printed circuit board (PCB) on which components generating various control signals, data signals, and the like are mounted, and is connected to the liquid crystal panel and the printed circuit board to apply signals to the wiring of the liquid crystal panel. It includes a drive circuit (hereinafter referred to as a drive integrated circuit), the chip on glass (COG), tape carrier package (TCP :) according to the method of mounting the drive IC to the liquid crystal panel tape carrier package) and chip on film (COF).

        Since COG mounts the drive IC on the array substrate of the liquid crystal panel, the volume of the liquid crystal display device becomes large, whereas TCP or COF connects the drive IC using a separate film, so that the film containing the drive IC It can be bent to the back of the liquid crystal panel has a compact structure. Therefore, in recent years, TCP or COF is mainly used. Generally, TCP or COF refers to the film itself in which the drive IC is embedded, and TCP or COF incorporating the drive IC is also referred to as the drive IC.

        During the process of connecting the liquid crystal panel and the printed circuit board to each other, the operation of connecting the electrode terminal portion of the liquid crystal panel and the lead portion of the tab package (drive IC) is called OLB, that is, outer lead bonding, and the tab package (drive The operation of connecting the other lead portion of the IC to the electrode terminal portion of the printed circuit board is called TAB soldering.

        In general, the heat dissipation sheet used in the OLB and TAB process is a kind of auxiliary sheet used to indirectly and uniformly indirectly transfer heat and pressure applied in the OLB and TAB process to a drive IC or a printed circuit board (PCB). It is used in the process of adhering the drive IC to glass substrates of products such as liquid crystal display (OLED), organic light emitting diode (OLED), plasma display panel (PDP), etc. to perform a uniform connection.

        As a conventional heat dissipating sheet, a cut polytetrafluoroethylene film (Skived PTFE film) is used, but since the stretch ratio is about 300%, the dimensional stability is low and the tension cannot be applied uniformly. There is a problem that it is difficult to use in wide LCD products because the phenomenon is sagging downward.

        In addition, the Skived PTFE film has a low elasticity, the adhesive force is lowered, the surface roughness and smoothness is poor, it is difficult to uniformly adhere, there is a problem that the powder is generated by the uncrystallized crystals and repeated use is impossible.

        Another conventional heat dissipation sheet is a sheet made of silicone resin, but this silicone resin sheet has low dimensional stability and thus is not applicable to production of a wide product, and has a thick thickness so that line tact time is high. As long as the productivity is lowered, the silicone resin is carbonized by heat applied in the thermocompression process, and contaminants are generated, which causes short-circuit and it is impossible to repeatedly use it.

        As another conventional heat dissipating sheet, a glass cloth coated with a PTFE resin, and a silicone resin sheet and a polyamide film were used in turn. In this case, since the glass fabric coated with PTFE resin, the silicone resin sheet (or silicone rubber sheet) and the polyamide film are not integrally formed, they have to be fed, mounted and managed separately. There is a disadvantage in that a device for transferring it is required separately, and the heat dissipation time is long due to the thickness, so that the productivity is low, thereby increasing the price.

        The present invention is to solve the above problems of the prior art, an object of the present invention is to form a plurality of sheets (glass fabric, a silicone resin sheet and a polyamide film coated with PTFE resin) in one sheet to improve productivity It is to provide one layer composite sheet for OLB and TAB process that can be increased, can be used repeatedly, has excellent cushioning property, thermal conductivity and dimensional stability, and is suitable for producing a wide range of products.

The present invention for achieving the above object, a glass cloth (glass cloth); Polytetra fluoroethylene (PTFE) coating layer 12 formed on both sides of the glass fabric; A silicone coating layer formed on the outside of any one of the PTFE coating layers 12; It consists of a polyimide film (Polyimide Film) attached to the silicon (silicone) coating layer, the air to prevent the air bubbles are formed in the polyimide film (Polyimide Film) to adhere to the glass cloth (glass cloth) through the silicon coating layer Provided is a one layer composite sheet for outer lead bonding (OLB) and tape automated bonding (TAB) processes, characterized in that the discharge pores are formed.

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The silicon (silicone) coating layer is characterized in that the adhesive is formed to facilitate the attachment of a polyimide film (Polyimide Film).

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        Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

        1 is an enlarged cross-sectional view of a one-layer composite sheet for an OLB and TAB process according to the present invention, Figure 2 is a state diagram in which the one-layer composite sheet shown in Figure 1 is used in the OLB and TAB process, as shown in FIG. As described above, the one-layer composite sheet 30 for the OLB and TAB process according to the present invention forms a polytetra fluoroethylene (PTFE) coating layer 12 on both sides of a glass cloth 10. After the PTFE coated glass fabric 10 is manufactured on both sides, a silicone resin is coated on any one of the PTFE coating layers 12 formed on the glass fabric to form a silicone resin coating layer 25.

       The silicone resin coating layer 25 is made of a tacky material, and the polyimide film 22 is attached onto the tacky silicone resin coating layer 25 to form a sheet used separately.

       In this case, when the silicone resin coating layer 25 is formed on the PTFE coating layer 12, the PTFE coating layer 9 is first etched so that the silicone resin adheres well to the PTFE coating layer 12. The heat transfer and pressure transfer rate drop due to the treated PTFE coating layer is to solve the problem by forming a liquid silicone resin coating layer 25 on the glass cloth (10).

       PTFE (Poly Tetra Fluoro Ethylene) is a kind of Teflon and has three basic forms, and it is non-adhesive (release) and heat resistant as Poly Tetra Fluoro Ethylene (PTFE), Flourinated Ethylene Propylene (FEP), and Per Fluoro Alkoxy (PFA), respectively. It uses Teflon's unique characteristics such as chemical resistance, abrasion resistance, and electrical insulation.

       The one-layer composite sheet 30 for the OLB and TAB process according to the present embodiment configured as described above is an ACF (Anisotropic) on the connection terminal 65 formed on the LCD panel or the PCB substrate 60, as shown in FIG. ACF 70 composed of an adhesive resin 74 having conductive balls 72 dispersed on a conductor film (anisotropic conductor film), and an inner lead bonding (ILB) process, and a drive IC integrated with TCP or COF The connection terminal 55 is lowered, the one layer composite sheet 30 is placed thereon, and then the one layer composite sheet 30 is pressed by the thermocompression mechanism 40, thereby the LCD panel or the PCB substrate ( The connecting terminal 65 formed in 6) and the connecting terminal 55 of TCP or COF are bonded.

       Bonding the LCD panel 60 connection terminal 65 and the TCP or COF connection terminal 55 is called an OLB process, and the connection terminal 65 formed on the PCB board 60 and the connection terminal of the other end of TCP or COF are connected. Bonding (55) is called a TAB process.

        Since the present invention as described above includes a glass fabric (10) is excellent in dimensional stability, even in the manufacture of a wide range of the phenomenon that the central portion does not sag down is particularly useful for manufacturing a wide LCD. In addition, in the present invention, since the PTFE coating layer 12 is formed on both surfaces of the glass fabric 10, the smoothness and surface roughness are excellent, thereby making the adhesion in the OLB or TAB process uniform.

        In addition, the present invention is formed by attaching the silicone resin coating layer 25 and the polyimide film 22 to the PTFE coating layer 12 on one side, it is excellent in elasticity can greatly improve the adhesion in the OLB or TAB process.

        In addition, the present invention is excellent in the dimensional stability and elasticity as described above can be used repeatedly, and the thickness can be thin, it is possible to greatly improve the productivity through the reduction of heat dissipation time.

        On the other hand, when the air bubbles are formed when attaching the polyimide film 22 on the silicone resin coating layer 25, the thermal conductivity due to the air layer is reduced, the pores in the polyimide film 22 so that the air is well escaped (80) ), And the compressed air that is compressed by the thermocompression mechanism 40 through the formed pores 80 or the compressed air that has not escaped is in the gap of the pores 80 so as to effectively deliver pressure and heat transfer. This is configured to be done.

        As described above, the one-layer composite sheet for outer lead bonding (OLB) and tape automated bonding (TAB) processes according to the present invention has been described with reference to the illustrated drawings. The present invention is not limited by the embodiments and drawings disclosed herein, and various modifications may be made by those skilled in the art within the scope of the technical idea of the present invention, and all technical ideas equivalent to those described in the claims are included. You'll be crazy about it.

        The one-layer composite sheet for the OLB and TAB process of the present invention as described above is a single sheet of a plurality of sheets (glass fabric, silicone resin sheet and polyamide film coated with PTFE resin) It can be used to increase productivity, it can be used repeatedly, it has excellent cushioning property, thermal conductivity and dimensional stability, and it is useful for producing wide products. It has excellent surface roughness and smoothness. In addition, the heat resistance and thermal conductivity are increased along with the reduction of the thickness, and the productivity can be improved by shortening the heat dissipation time.

Claims (4)

Glass cloth; Polytetra fluoroethylene (PTFE) coating layer 12 formed on both sides of the glass fabric; A silicone coating layer formed on the outside of any one of the PTFE coating layers 12; Consists of a polyimide film (Polyimide Film) attached on the silicon coating layer, The outer lead bonding (OLB) and tape automated bonding is formed on the polyimide film by forming air bleed pores so that bubbles are not formed when adhering to a glass cloth through the silicon coating layer. One layer composite sheet for (TAB) process. delete The method of claim 1, The silicon (silicone) coating layer is tacky, one layer for outer lead bonding (OLB) and tape automated bonding (TAB) process, characterized in that formed to facilitate the attachment of a polyimide film (Polyimide Film) Composite Sheet. delete

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