KR200382573Y1 - Release sheet used in OLB and TAB process - Google Patents

Release sheet used in OLB and TAB process Download PDF

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Publication number
KR200382573Y1
KR200382573Y1 KR20-2005-0001471U KR20050001471U KR200382573Y1 KR 200382573 Y1 KR200382573 Y1 KR 200382573Y1 KR 20050001471 U KR20050001471 U KR 20050001471U KR 200382573 Y1 KR200382573 Y1 KR 200382573Y1
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polyimide film
olb
release sheet
coating layer
present
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KR20-2005-0001471U
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Korean (ko)
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임용묵
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유한회사 한국 타코닉
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2427/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
    • C08J2427/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
    • C08J2427/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08J2427/18—Homopolymers or copolymers of tetrafluoroethylene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers

Abstract

본 고안은 OLB 및 TAB 공정에서 가해지는 열과 압력을 드라이버 IC 또는 인쇄회로기판(PCB)에 간접적으로 균일하게 전달해 주기 위해서 사용되는 방출시트(Release sheet)에 관한것으로, 폴리이미드 필름(11), 상기 폴리이미드 필름의 양면중 어느 일면에 형성되어 있는 폴리테트라플루오로에틸렌 코팅층(12) 및 상기 폴리이미드 필름의 양면중 나머지 일면에 형성되어 있는 실리콘 수지 코팅층(13)으로 구성됨을 특징으로 한다.The present invention relates to a release sheet used to indirectly and uniformly transfer heat and pressure applied in an OLB and a TAB process to a driver IC or a printed circuit board (PCB), a polyimide film (11), the It is characterized by consisting of a polytetrafluoroethylene coating layer 12 formed on either side of the polyimide film and the silicone resin coating layer 13 formed on the other side of the both sides of the polyimide film.

본 고안은 치수안정성 및 쿠션성이 우수하여 반복사용이 가능하며 광폭 LCD등의 제조에 적합하고, 표면조도 및 평활성이 우수하여 접착의 균일성을 향상시킬 수 있고, 두께를 얇게 할 수 있고 내열성 및 열전도성이 뛰어나 라인 텍트 타임(Line Tact Time)을 단축시킬 수 있어서 생산성을 향상시킬 수 있다.The present invention can be used repeatedly because of its excellent dimensional stability and cushioning properties, and is suitable for the manufacture of wide LCDs. Its excellent surface roughness and smoothness can improve the uniformity of adhesion, reduce its thickness, heat resistance and thermoelectricity. Its excellent conductivity reduces line Tact time, improving productivity.

Description

ＯＬＢ 및 ＴＡＢ 공정용 방출 시트{Release sheet used in OLB and TAB process} Release sheet used in OLB and TAB process

본 고안은 OLB(Outer Lead Bonding) 및 TAB(Tape Automated Bonding) 공정용 방출 시트(Release Sheet)에 관한 것으로서, 보다 구체적으로는 쿠션성, 치수안정성 및 평활성이 우수함과 동시에 내열성 및 열전도성 등이 뛰어나 반복사용이 가능하고 광폭 제품 생산에 특히 유용한 OLB 및 TAB 공정용 방출 시트에 관한것이다.The present invention relates to a release sheet (Release Sheet) for outer lead bonding (OLB) and tape automated bonding (TAB) process, and more specifically, excellent in cushioning, dimensional stability and smoothness, and excellent in heat resistance and thermal conductivity. A release sheet for OLB and TAB processes that can be used and particularly useful for the production of wide products.

OLB 및 TAB 공정용 방출 시트는 OLB 및 TAB 공정에서 가해지는 열과 압력을 드라이브 IC 또는 인쇄회로기관(이하 "PCB"라고 한다)에 간접적으로 균일하게 전달하기 위해서 사용되는 일종의 보조 시이트이다.The release sheet for the OLB and TAB process is a kind of auxiliary sheet used to indirectly and uniformly indirectly transfer heat and pressure applied in the OLB and TAB process to a drive IC or a printed circuit (hereinafter referred to as "PCB").

일반적으로, LCD(Liquid Crystal Display), OLED(유기발광다이오드) 및 PDP(플라즈마 디스플레이 패널) 등의 제품들은 유리기판에 드라이브 IC를 접착시키는 공정을 거쳐 제조되고 있다.In general, products such as liquid crystal display (LCD), organic light emitting diode (OLED), and plasma display panel (PDP) are manufactured through a process of adhering a drive IC to a glass substrate.

상기 OLB 공정에서는 드라이브 IC의 전극(31)에 범프(32)를 형성한 다음 이를 복수개의 금속선이 접착제에 의해 접착된 폴리이미드계 필름에 접속하는 ILB(Inner Lead Bonding)공정을 거친후 상기 드라이브 IC를 유리기판에 부착 할 수도 있고, 유리기판에 도전볼(42)이 산포된 접착성수지로 구성된 이방성 도전필름(Anisotropic Conductive Film : ACF)을 탑제한 다음, 그 위에 범프(32)가 형성된 드라이브 IC(30)를 열압착 공법으로 직접 부착할 수도 있다.In the OLB process, the bumps 32 are formed on the electrode 31 of the drive IC, and the plurality of metal wires are subjected to an inner lead bonding (ILB) process in which a plurality of metal wires are connected to a polyimide film bonded by an adhesive. May be attached to a glass substrate, an anisotropic conductive film (ACF) composed of an adhesive resin in which conductive balls 42 are scattered on the glass substrate, and then a drive IC having bumps 32 formed thereon. 30) may be directly attached by thermocompression method.

열압착 공법으로 유리기판과 드라이브 IC를 접착시키는 OLB 공정과 드라이브 IC와 PCB를 접착시키는 TAB 공정에서는 열 압착시 가해지는 열과 압력이 드라이브 IC 또는 PCB에 간접적으로 균일하게 전달될 수 있도록 열압착기구와 드라이브 IC 또는 PCB 사이에 방출 시트(Release Sheet)를 배치, 사용하고 있다.In the OLB process, which bonds the glass substrate and the drive IC with the thermocompression method, and the TAB process, which bonds the drive IC and the PCB, the thermocompression mechanism and the drive ensure that the heat and pressure applied during thermal compression are indirectly and uniformly indirectly transferred to the drive IC or the PCB. Release sheets are used between ICs and PCBs.

종래의 방출 시트(Release Sheet)로는 절삭처리된 폴리테트로플루오로에틸렌 필름(Skived PTPE Film)이 사용되어 왔으나, 상기의 절삭처리된 폴리테트로플루오로에틸렌 필름은 신축율이 약 300% 수준으로 높아(치수안정성이 나빠) 장력을 균일하게 가할수 없어서 광폭인 경우 중앙부분이 아래로 쳐지는 현상이 발생되어 광폭의 LCD 제품 등에는 사용할 수 없는 문제가 있었다.Conventional release sheet (Release Sheet) has been used a cut polytetrofluoroethylene film (Skived PTPE Film), but the cut polytetrofluoroethylene film has a stretch ratio of about 300% The high (bad dimension stability) could not be applied evenly in the case of the wide width, the center portion is hit down, there was a problem that can not be used in wide LCD products.

또한 상기의 절삭처리된 폴리테트로플루오로에틸렌 필름은 탄성이 낮아 접착력이 저하되고 표면조도 및 평활성이 나빠 균일한 접착이 어렵고, 비정화된 결정들에 의해 가루가 발생하고, 반복사용이 불가능한 등의 여러 문제점들이 있었다.In addition, the cut polytetrofluoroethylene film has a low elasticity, the adhesive strength is lowered, the surface roughness and smoothness is poor, uniform adhesion is difficult, powder is generated by the crystallized crystals, it is impossible to use repeatedly There were several problems.

또 다른 종래의 방출 시트(Release Sheet)로는, 실리콘수지로 제조된 시트가 사용되어 왔으나, 상기의 실리콘시트는 치수안정성이 낮아 광폭의 제품생산에는 적용이 불가능하고, 두께가 두꺼워 라인 텍트 타임(Line Tact Time)이 길어 생산성이 낮고, 열압착 공정에서 가해지는 열에 의해서 실리콘수지가 탄화되어 오염물이 발생하고, 이로 인해 쇼트 현상이 발생하고, 반복사용이 불가능한 등의 여러 문제점 들이 있었다.As another conventional release sheet, a sheet made of silicone resin has been used. However, the silicon sheet has low dimensional stability and is not applicable to production of a wide product. Due to the long tact time, the productivity is low, and contaminants are generated by carbonization of the silicone resin by the heat applied in the thermocompression process, which causes short-circuit and repeated use is not possible.

또다른 종래의 방출 시트(Release Sheet)로는, 폴리테트로플루오로에틸렌(이하 "PTPE"라고 한다) 수지가 코팅된 유리직물과 실리콘시트와 폴리이미드 필름 각각을 차례로 겹쳐 사용하기도 하였다.As another conventional release sheet, a glass cloth coated with a polytetrofluoroethylene (hereinafter referred to as "PTPE") resin, and a silicon sheet and a polyimide film were used in turn.

그러나 상기의 경우에는 PTPE 수지가 코팅된 유리직물, 실리콘시트 및 폴리이미드 필름이 일체로 형성되어 있지 않기 때문에 이들을 각각 별도로 공급 및 관리해야 하는 번거러움이 있고, 두께가 두꺼워 방열시간이 길어져 생산성이 낮고, 가격이 상승하는 등의 여러 문제가 있었다.However, in the above case, since the glass fabric, silicone sheet, and polyimide film coated with PTPE resin are not integrally formed, there is a need to supply and manage them separately, and the thickness is long, so that the heat dissipation time is long, resulting in low productivity. There were several problems, such as rising prices.

본 고안의 목적은 이와 같은 종래의 문제점들의 해결할 수 있는 OLB 및 TAB 공정용 방출 시트(Release Sheet)를 제공하기 위한 것이다.An object of the present invention is to provide a release sheet for the OLB and TAB process that can solve these conventional problems.

본 고안은 치수안정성 및 쿠션성이 우수하여 반복사용이 가능하며 광폭의 제품생산에 특히 적합한 OLB 및 TAB 공정용 방출 시트를 제공하고자 한다.The present invention aims to provide a release sheet for the OLB and TAB process that can be used repeatedly because of excellent dimensional stability and cushioning properties and is particularly suitable for producing a wide range of products.

또한, 본 고안은 표면조도 및 평활성이 우수하여 접착의 균일성이 크게 향상되는 OLB 및 TAB 공정용 방출 시트를 제공하고자 한다.In addition, the present invention is to provide a release sheet for the OLB and TAB process that is excellent in surface roughness and smoothness, the adhesion uniformity is greatly improved.

또한, 본 고안은 두께가 얇고 내열성 및 열전도성이 뛰어나 방열시간을 단축시킬 수 있어 생산성을 크게 향상 시킬 수 있는 OLB 및 TAB 공정용 방출 시트를 제공하고자 한다. In addition, the present invention is to provide a release sheet for the OLB and TAB process that can significantly improve the productivity by reducing the heat dissipation time because of the thin thickness, excellent heat resistance and thermal conductivity.

이와같은 과제를 달성하기 위한 본 고안의 OLB 및 TAB 공정용 방출 시트(Release Sheet)는, 폴리이미드 필름(11), 상기 폴리이미드 필름의 양면중 어느 일면에 형성되어 있는 폴리테트라플루오로에틸렌 코팅층(12) 및 상기 폴리이미드 필름의 양면중 나머지 일면에 형성되어 있는 실리콘 수지 코팅층(13)으로 구성됨을 특징으로 한다.The release sheet for the OLB and TAB process of the present invention for achieving such a problem is a polytetrafluoroethylene coating layer formed on either side of the polyimide film 11 and the polyimide film ( 12) and the silicone resin coating layer 13 formed on the other side of both sides of the polyimide film.

이하 첨부한 도면 등을 통하여 본 고안을 상세하게 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

본 고안은 도 1과 같이 폴리이미드 필름(Polyimide Film,11), 상기의 폴리이미드 필름의 일면에 형성되어 있는 PTPE 코팅층(12) 및 상기의 폴리이미드 필름의 나머지 일면에 형성되어 있는 실리콘수지 코팅층(13)으로 구성되어 있다.The present invention is a polyimide film 11, a PTPE coating layer 12 formed on one side of the polyimide film and a silicone resin coating layer formed on the other side of the polyimide film as shown in FIG. 13).

도 1은 본 고안의 단면확대도 이다.1 is an enlarged cross-sectional view of the present invention.

실리콘수지 코팅층(13)이 형성되어 있는 폴리이미드 필름(11)의 일면이 식각처리(Etching)되어 있는 것이 더욱 바람직하다.More preferably, one surface of the polyimide film 11 on which the silicone resin coating layer 13 is formed is etched.

본 고안은 폴리이미드 필름(11)의 양면중 어느 일면에 PTPE 수지를 코팅하여 PTPE 코팅층(12)을 형성하고, 상기 폴리이미드 필름(11)의 나머지 일면에는 실리콘수지를 코팅하여 실리콘수지 코팅층(13)을 형성시키는 방법으로 제조된다.The present invention forms a PTPE coating layer 12 by coating a PTPE resin on one side of both sides of the polyimide film 11, and a silicone resin coating layer 13 by coating a silicone resin on the other side of the polyimide film 11 It is prepared by the method of forming).

폴리이미드 필름(11) 일면에 실리콘수지 코팅층(13)을 형성시킬때에는 폴리이미드 필름(11)에 실리콘수지가 잘 접착되도록 상기 폴리이미드 필름(11)을 먼저 식각처리(Etching)한 다음 그 위에 실리콘수지를 코팅하는 것이 더욱 바람직하다.When the silicone resin coating layer 13 is formed on one surface of the polyimide film 11, the polyimide film 11 is first etched so that the silicone resin adheres well to the polyimide film 11, and then silicon is placed thereon. It is more preferable to coat the resin.

본 고안은 폴리이미드 필름(11)을 포함하고 있어서 치수안정성이 뛰어나 광폭의 경우에도 중앙부가 아래로 처지는 현상이 발생되지 않아 광폭의 LCD 등의 제조에 특히 유용하다.The present invention includes a polyimide film 11, and excellent in dimensional stability, and even in the case of a wide width, the phenomenon that the center portion sags downward does not occur, which is particularly useful for manufacturing a wide LCD.

아울러, 본 고안은 상기의 폴리이미드 필름(11)의 일면에 PTPE 코팅층(12)이 형성되어 있기 때문에 평활성 및 표면조도가 뛰어나 OLB 또는 TAB 공정에서의 접착성을 균일하게 한다.In addition, the present invention is because the PTPE coating layer 12 is formed on one surface of the polyimide film 11 is excellent in smoothness and surface roughness to uniform adhesion in the OLB or TAB process.

또한 본 고안은 폴리이미드 필름(11)의 나머지 일면에 실리콘수지 코팅층(13)이 형성되어 있기 때문에 탄성이 뛰어나 OLB 또는 TAB 공정에서의 접착성을 크게 향상시킬 수 있다.In addition, since the silicone resin coating layer 13 is formed on the remaining surface of the polyimide film 11, the present invention can greatly improve the adhesion in the OLB or TAB process.

특히, 본 고안은 상기와 같이 치수안정성 및 탄성이 뛰어나 반복사용이 가능하고, 두께를 얇게 할 수 있어서 방열시간을 단축시켜 생산성을 크게 향상시킬 수 있다.In particular, the present invention is excellent in dimensional stability and elasticity as described above can be used repeatedly, and the thickness can be thin, so that the heat dissipation time can be shortened and productivity can be greatly improved.

본 고안이 OLB 공정에서 사용되는 일례는 도 2에 도시된 바와 같다.An example in which the present invention is used in an OLB process is shown in FIG. 2.

도 2는 본 고안이 OLB 공정에서 사용되는 상태를 나타내는 모식도이다.Figure 2 is a schematic diagram showing a state in which the subject innovation is used in the OLB process.

구체적으로, 유리기판(10)상에 도전볼(42)이 산포된 접착성 수지로 구성된 이방성 도전필름(40 ; ACF)와 범퍼(32)와 전극(31)으로 구성된 드라이버 IC(30)를 차례로 배열한 다음, 상기의 드라이버 IC(30)상에 본 고안의 방출 시트(10)를 위치시킨 다음, 열압착 기구(50)로 상기 방출 시트(10)를 눌러주면 유리기판(20) 상에 드라이버 IC(30)가 접착된다.Specifically, the driver IC 30 composed of an anisotropic conductive film 40 (ACF) composed of an adhesive resin in which conductive balls 42 are scattered on the glass substrate 10, a bumper 32, and an electrode 31 is sequentially turned on. After arranging, placing the ejection sheet 10 of the present invention on the driver IC 30, and then pressing the release sheet 10 with the thermocompression mechanism 50, the driver on the glass substrate 20 IC 30 is bonded.

본 고안은 치수안정성 및 쿠션성이 우수하여 반복사용이 가능하고 광폭 제품 생산에 특히 적합하다.The present invention has excellent dimensional stability and cushioning properties, so that it can be used repeatedly and is particularly suitable for producing a wide range of products.

또한, 본 고안은 표면조도 및 평활성이 뛰어나 접착의 균일성이 향상되고, 정전기 방지기능을 갖고 있어서 쇼트현상을 방지할 수 있다. In addition, the present invention has excellent surface roughness and smoothness, improves the uniformity of adhesion, and has an antistatic function, thereby preventing short phenomenon.

또한, 본 고안은 두께를 얇게 할 수 있고, 내열성 및 열전도성이 뛰어나 라인 텍트 타임(Line Tact Time : 방열시간)을 단축시킬 수 있어서 생산성을 크게 향상시킬 수 있다.In addition, the present invention can reduce the thickness, excellent heat resistance and thermal conductivity can shorten the line Tact Time (heat dissipation time) can greatly improve the productivity.

도 1은 본 고안의 단면확대도.1 is an enlarged cross-sectional view of the present invention.

도 2는 본 고안이 OLB 공정에서 사용되는 상태를 나타내는 모식도.Figure 2 is a schematic diagram showing a state in which the subject innovation is used in the OLB process.

* 도면 중 주요 부분에 대한 부호 설명* Explanation of symbols on the main parts of the drawings

10 : 방출 시트(Release Sheet) 20 : 유리기판10: Release Sheet 20: Glass Substrate

30 : 드라이브 IC30: drive IC

40 : 이방성 도전필름(ACF : Anisotropic Conductive film)40: Anisotropic Conductive Film (ACF)

50 : 열압착 기구 50: thermocompression mechanism

11 : 폴리이미드 필름11: polyimide film

12 : 폴리테트라플루오로에틸렌(PTPE) 코팅층12: polytetrafluoroethylene (PTPE) coating layer

13 : 실리콘수지 코팅층13: silicone resin coating layer

31 : 드라이브 IC의 전극 32 : 드라이버 IC의 범퍼31: electrode of drive IC 32: bumper of driver IC

41 : 접착성수지 42 : 도전볼41: adhesive resin 42: conductive ball

Claims (2)

폴리이미드 필름(11), 상기 폴리이미드 필름의 양면중 어느 일면에 형성되어 있는 폴리테트라플루오로에틸렌 코팅층(12) 및 상기 폴리이미드 필름의 양면중 나머지 일면에 형성되어 있는 실리콘 수지 코팅층(13)으로 구성됨을 특징으로 하는 OLB 및 TAB 공정용 방출 시트.The polyimide film 11, the polytetrafluoroethylene coating layer 12 formed on any one of both surfaces of the polyimide film, and the silicone resin coating layer 13 formed on the other side of the both sides of the polyimide film. Release sheet for the OLB and TAB process, characterized in that configured. 제 1항에 있어서, 실리콘수지 코팅층(13)이 형성되어 있는 폴리이미드 필름(11)의 일면이 식각처리(Etching)된 것을 특징으로 하는 OLB 및 TAB 공정용 방출 시트.The release sheet for the OLB and TAB process according to claim 1, wherein one surface of the polyimide film (11) on which the silicone resin coating layer (13) is formed is etched.
KR20-2005-0001471U 2005-01-18 2005-01-18 Release sheet used in OLB and TAB process KR200382573Y1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190135499A (en) * 2017-03-30 2019-12-06 닛토덴코 가부시키가이샤 Heat-resistant release sheet and manufacturing method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190135499A (en) * 2017-03-30 2019-12-06 닛토덴코 가부시키가이샤 Heat-resistant release sheet and manufacturing method thereof
KR102544023B1 (en) 2017-03-30 2023-06-16 닛토덴코 가부시키가이샤 Heat-resistant release sheet and manufacturing method thereof

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