KR100830100B1 - Flat Panel Display - Google Patents

Abstract

The present invention provides a substrate, a pixel portion formed on the substrate, a pad portion formed on the substrate, electrically connected to the pixel portion to transmit a driving signal, and including a pad portion including a plurality of pads, and formed on one side of the film. Provided is a flat panel display including a lead portion including a plurality of pads electrically connected to a portion, and a connection portion including a low thermal expansion characteristic film formed on a material having a lower thermal expansion coefficient than that of the film.

Flat Panel Display, Thermal Expansion

Description

Flat Panel Display {Flat Panel Display}

1 is a schematic diagram showing a state in which a short occurs between a pad portion and a connection portion of a conventional flat panel display.

2 is a schematic diagram showing the structure of a pad part and a lead part of a flat panel display device according to a first embodiment of the present invention;

3 is a cross-sectional view taken along the line A1-A2 of FIG.

4 is a schematic diagram showing the structure of a pad portion and a lead portion of a flat panel display device according to a second embodiment of the present invention.

Explanation of the main symbols in the drawings

310, 510: substrate 350, 550: pad portion

400, 600: connection part 410, 610: film

420 and 620: driving circuit unit IC 430: first conductive layer

432: second conductive layer 450, 650a: lead portion

460: low thermal expansion film L1, L2, L3: area

The present invention relates to a flat panel display.

Recently, the importance of flat panel displays (FPDs) has increased with the development of multimedia. In response, various types of liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), light emitting display (light emitting display), etc. Flat panel displays have been put to practical use.

Among them, the liquid crystal display (LCD) has advantages of better visibility than the cathode ray tube, and an average power consumption and a small amount of heat generation. In particular, the electroluminescent display has a high response time with a response speed of 1 ms or less, low power consumption, and wide light viewing angle due to self-luminous.

In the flat panel display device as described above, a pixel part including a light emitting layer or a liquid crystal layer interposed between two electrodes is formed on a substrate to realize a predetermined image.

In addition, a data pad portion and a scan pad portion that are electrically connected to two electrodes of the pixel portion, respectively, and transmit a driving signal are formed on the substrate.

On the other hand, the connecting portion is formed, for example, a lead portion including a plurality of pads on a film formed of polyimide, the pads of the lead portion is electrically connected to the IC (Intergrated Circuit) for controlling the driving signal applied to the pixel portion Was connected.

The data pad portion, the scan pad portion, and the lead portion as described above are disposed so that the respective pads face each other, and then are bonded by applying heat and pressure.

In this bonding process, a portion of the connection part which is separated from the pads and only the film is drawn irregularly by heat and pressure, so that the pads of the pad part and the pads of the lead part are mismatched.

Such a mismatch between the pad portion and the lead portion is deepened as the number of pads increases and the pitch between the pads narrows.

In addition, a short occurred when the pads of the connection overlapped over two pads on the substrate with a mismatch.

1 is a schematic diagram illustrating a state in which a short occurs between a pad part and a connection part of a conventional flat panel display.

Referring to FIG. 1, a data pad unit 151 including a plurality of data pads 151a electrically connected to a pixel unit on the substrate 110 to apply a data signal, and a scan signal electrically connected to the pixel unit. The scan pad unit 152 including the plurality of scan pads 152a to which the P is applied is formed.

Meanwhile, the connection part 200 electrically connected to the data pad part 151 and the scan pad part 152 includes a first lead part 251 including a plurality of pads 251a and 252a on the film 210. And a second lead portion 252 were formed.

As described above, in the substrate 110 and the connection unit 200, the data pads 151a of the data pad unit 151 and the pads 251a of the first lead unit 251 face 1: 1, and the scan pad After the scan pads 152a of the unit 152 and the pads 252a of the second lead unit 252 are disposed to face 1: 1, they are bonded by heat and pressure. In this bonding process, the pads of the connection part 200 at the boundary between the first lead part 251 and the second lead part 252 are irregularly stretched by the film 210 and thus the data pad 151a and the scan pad 152a. In the case where the parts are overlapped with each other, a short S occurs between the data pad unit 151 and the scan pad unit 152.

Therefore, in order to prevent a short S between the data pad part 151 and the scan pad part 152 which may be caused by the pads at the boundary between the first and second lead parts 251 and 252, the substrate 110 may be disposed on the substrate 110. Dummy pads are formed between the data pad part 151 and the scan pad part 152. In this case, the pad parts 151 and 152 and the lead part 251 generated during the bonding process of the substrate 110 and the connection part 200 are formed. 252) mismatches became more serious.

Although not shown in detail, when the dummy pad part including one or more dummy pads is present between the data pad part and the scan pad part on the substrate, the lead part of the connection part may be a first lead part electrically connected to the data pad part. And a second lead part electrically connected to the scan pad part, and a gap region in which only a film exists without a pad is generated between the first lead part and the second lead part.

Accordingly, the film corresponding to the gap region is irregularly drawn by heat and pressure applied in the bonding process, so that the pads of the pad portion and the pads of the lead portion are mismatched.

The mismatch problem of the pad part and the lead part as described above caused short circuits in some areas in the connection structure of the pad part and the lead part, which led to display malfunction of the flat panel display.

On the other hand, the flat panel display device, in terms of manufacturing process, the elongation of the film due to thermal expansion of the lead portion, the degree of overlap between the pad portion and the corresponding pad of each of the lead portion, which varies according to the time required for the bonding process, the lead Various variables, such as the tensile force acting on the negative film, had to be taken into account.

Therefore, the process of aligning the pad part and the lead part takes a considerable time, the production error is greatly reduced due to the process error in the bonding process.

SUMMARY OF THE INVENTION An object of the present invention is to provide a flat panel display device capable of preventing a malfunction of a display and improving a production yield.

In order to achieve the above object, the present invention provides a substrate, a pixel portion formed on the substrate, a pad portion formed on the substrate, electrically connected to the pixel portion to transmit a driving signal, and including a plurality of pads, and a film. A flat plate including a lead portion including a plurality of pads formed on the side surface and electrically connected to the pad portion, and a connection portion including a low thermal expansion characteristic film formed on a material having a lower coefficient of thermal expansion than the film and positioned on the other side of the film. Provide a display device.

The other side of the film on which the low thermal expansion film is formed may be the back of the side on which the lead of the film is formed.

The low thermal expansion film may include one metal selected from the group consisting of high nickel steel invar, elinvar, super invar, and iron-nickel alloy based invar.
In addition, the present invention is a substrate, a pixel portion formed on the substrate, a pad portion formed on the substrate and electrically connected to the pixel portion to transmit a driving signal, and formed on one side of the film and the pad portion including a plurality of pads A flat display including a lead part including a plurality of pads electrically connected to the part and a connection part including at least one dummy pattern having a thermal expansion coefficient lower than that of the pad included in the lead part and formed in an area distinct from the lead part of the film. Provide the device.

The pad part includes a first pad part for transmitting a data signal to the pixel part and a second pad part for transmitting a scan signal to the pixel part, and at least one dummy in a partial area on the substrate which is separated from the area in which the first and second pad parts are formed. It may include a third pad portion including a pad.

The lead part includes a first lead part electrically connected to the first pad part and a second lead part electrically connected to the second pad part, and the connection part is a first wiring part electrically connected to the first lead part on the film. And a second wiring portion electrically connected to the second lead portion, wherein the second wiring portion is electrically connected to the second lead portion, wherein the first wiring portion and the second lead portion are formed in the region and the first wiring portion and the second wiring portion. The dummy pattern may be included.

The dummy pattern may include a first dummy pattern in the form of a pad formed in a partial region on the film corresponding to the third pad part, and a second dummy pattern formed in a partial region on the film that is distinct from the first dummy pattern.

The dummy pattern may be formed of a material having the same thermal expansion coefficient as the pad of the first lead portion or the pad of the second lead portion or having a relatively low thermal expansion coefficient.

The pixel unit may include an organic emission layer between two electrodes.
In another aspect, the present invention provides a substrate, a pixel portion formed on a substrate, a pad portion formed on the substrate, electrically connected to the pixel portion to transmit a driving signal, and including a plurality of pads, and on one side of the film. According to an aspect of the present invention, there is provided a flat panel display device including a lead part formed in the lead part, the lead part including a plurality of pads electrically connected to the pad part, and a connection part including one or more dummy patterns formed in an area distinct from the lead part of the film.

delete

The pad part includes a first pad part for transmitting a data signal to the pixel part and a second pad part for transmitting a scan signal to the pixel part, and at least one dummy in a partial area on the substrate which is separated from the area in which the first and second pad parts are formed. It may include a third pad portion including a pad.

The lead part includes a first lead part electrically connected to the first pad part and a second lead part electrically connected to the second pad part, and the connection part is a first wiring part electrically connected to the first lead part on the film. And a second wiring portion electrically connected to the second lead portion, wherein the second wiring portion is electrically connected to the second lead portion, wherein the first wiring portion and the second lead portion are formed in the region and the first wiring portion and the second wiring portion. The dummy pattern may be included.

The dummy pattern may include a first dummy pattern in the form of a pad formed in a partial region on the film corresponding to the third pad part, and a second dummy pattern formed in a partial region on the film that is distinct from the first dummy pattern.

The connection part may include a low thermal expansion characteristic film formed of a material having a lower coefficient of thermal expansion than a film on a rear surface of a side on which the lead portion of the film is formed.

delete

The pixel unit may include an organic emission layer between two electrodes.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

2 is a schematic diagram showing the structure of a pad portion and a lead portion of a flat panel display device according to a first embodiment of the present invention.

3 is a cross-sectional view taken along the line A1-A2 of FIG. 2.

2 and 3, a pad part 350 including a plurality of pads 350a electrically connected to the pixel part 320 is formed on the substrate 310. The pad part 350 is connected to the pixel part 320 through the wiring 325, Deliver the drive signal.

On the other hand, the connection part 400, for example, the lead part 450 including a plurality of pads (450a) electrically connected to the driving circuit (IC, 420) on one side of the film 410 formed of polyimide Is formed.

The pad 450a of the lead unit 450 may improve conductivity of the lead unit 450 on the first conductive layer 430 electrically connected to the driving circuit unit 420 through the wiring 425 and may provide a contact resistance. The second conductive layer 432 that can be lowered is stacked.

The first conductive layer 430 may be formed of, for example, copper (Cu), and the second conductive layer 432 is one selected from the group consisting of gold (Au), gold alloys, nickel (Ni), and nickel alloys. It may include the above, but is not limited thereto.

As described above, in the first embodiment of the present invention, the second conductive layer 432 is formed on the first conductive layer 430, and the pad 450a structure of the lead portion 450 is described with reference to the drawing. The pad structure of the lead portion is not limited thereto.

Accordingly, the second conductive layer 432 may be formed of one or more layers, and the first and second conductive layers 430 and 432 may be formed of one layer.

The low thermal expansion film 460 is formed of a material having a lower coefficient of thermal expansion than that of the film 410 in a region corresponding to the position where the lead 450 is formed on the rear surface of the side of the film 450 formed of the lid 450. do.

The low thermal expansion film 460 may include any one or more selected from the group consisting of high nickel steel invar, elinvar, super invar, and iron-nickel alloy based invar.

The pad portion 350 and the lead portion 450 are disposed so that the pads 350a and 450a face each other, and are then joined by applying heat and pressure. In this case, the low thermal expansion characteristic film 460 serves to suppress irregular thermal expansion caused by heat and pressure in the region of the connection portion 400 where only the film 410 is present.

Meanwhile, the driving circuit unit 420 is electrically connected to the external circuit unit, and controls the driving signal received from the external circuit unit to drive the pixel unit 320 through an electrical connection structure between the pad unit 350 and the lead unit 450. Done.

In the connection structure of the pad unit 350 and the lead unit 450 as described above, the low thermal expansion characteristic film 460 is a pad by the heat and pressure applied during the bonding process of the pad unit 350 and the lead unit 450 The area of the connection part 400 where only the film 410 is present may be prevented from being irregularly drawn from the area where the 450a is formed.

Therefore, the first embodiment of the present invention can prevent the mismatch between the pads 350a of the pad portion 350 and the pads 450a of the lead portion 450 by the irregular stretching of the film 410. have.

In addition, in the connection part 400 according to the first embodiment of the present invention, since the low thermal expansion characteristic film 460 prevents irregular stretching of the film 410, the pad part 350 and the lead part 450 are bonded together. In consideration of various variables including the elongation of the film 410 acting in the process, it is not necessary to reduce the pitch between pads 450a of the lead portion 450 at a predetermined ratio. Accordingly, it is possible to form the pads 350 and the pads 350a and 450a of the lead portion 450 in a 1: 1 pitch ratio. Accordingly, the first embodiment of the present invention shortens the process time required to form the connection part 400 and to align the pad part 350 of the substrate 310 and the lead part 450 of the connection part 400. Can improve the production yield.

4 is a schematic diagram showing the structure of a pad portion and a lead portion of a flat panel display device according to a second embodiment of the present invention.

Referring to FIG. 4, a first pad part 530 including a plurality of pads 530a electrically connected to a pixel part on one side of the substrate 510 and transmitting a data signal to the pixel part is formed. .

In addition, a second pad portion 540 including a plurality of pads 540a electrically connected to the pixel portion, and transmitting a scan signal to the pixel portion is formed.

In addition, in the electrical connection structure between the first pad part 530 and the second pad part 540 and the connection part 600, a short may occur between the first pad part 530 and the second pad part 540. The third pad part 550 including the dummy pads 550a is formed between the first pad part 530 and the second pad part 540 to prevent). As shown in FIG. 4, the third pad part 550 may be formed at the same pitch as the first pad part 530 and the second pad part 540, and may be formed of the first pad part 530. The second pads 540 are spaced apart from each other by a predetermined interval. Therefore, both the pad 530a of the first pad portion 530 and the pad 540a of the second pad portion 540 disposed adjacent to the boundary between the first pad portion 530 and the second pad portion 540. Short between the first pad part 530 and the second pad part 540 generated by contacting one pad on the connection part 400 can be prevented.

Meanwhile, the connection part 600 may include, for example, a pad including pads 630a electrically connected to the pads 530a of the first pad part 530 on one side of the film 610 formed of polyimide. One lead portion 630 is formed.

In addition, a second lead part 640 including pads 640a electrically connected to the pads 540a of the second pad part 540 is formed.

In addition, a first dummy pattern part 650 including first dummy patterns 650a patterned in the form of one or more pads is formed at a position on the film 610 corresponding to the third pad part 550.

The first dummy patterns 650a of the first dummy pattern part 650 may be formed according to the same material and structure as the pads 630a and 640a of the first and second lead parts 630 and 640. It is not limited.

In addition, the first dummy patterns 650a of the first dummy pattern part 650 have a smaller thermal expansion coefficient than the pads 630a of the first lead part 630 or the pads 640a of the second lead part 640. It may be formed of a material.

The first dummy pattern part 650 fills the gap area, which is an area where only the film 610 exists between the first lead part 630 and the second lead part 640, thereby padding the first lead part 630. The first pattern 650a having a better heat transfer rate than the film 610 may be generated when the device is driven by maintaining the pitch between the pads 630a and the pads 640a of the second lead part 640. Since the heat transmitted to the film 610 of the 600 is uniformly diffused, irregular stretching of the first dummy pattern portion 650 and the adjacent film 610 may be prevented.

The pads 630a of the first lead part 630 are connected to the wires formed in the first region L1 and electrically connected to the driving circuit part 420.

In addition, the pads 640a of the second lead part 640 are connected to the wires formed in the second region L3 and electrically connected to the driving circuit part 620.

In addition, at least one agent may be formed in the third region L2 which is separated from the formation region of the first lead portion 630 and the second lead portion 640, and is separated from the first region L1 and the second region L3. The second dummy pattern portion including the second dummy pattern 650b is formed. The second dummy pattern 650b may be evenly spread in the third region L3 for the purpose of heat transfer in a range that is not electrically connected to the driving circuit unit 620.

Referring to the enlarged second dummy pattern 650b of FIG. 4, the second dummy pattern 650b may be formed in the same structure as the wiring formed in the first region L1 or the second region L2. The structure of the second dummy pattern of the present invention is not limited thereto.

The second dummy pattern 650b may be formed according to the same material and structure as the wiring formed in the first region L1 or the wiring formed in the second region L2, but the material and the material of the second dummy pattern 650b may be different. The structure is not limited to this. The second dummy pattern 650b may be patterned in a branched closed curve connected to the first dummy patterns 650a of the first dummy pattern portion 650 or may be patterned in a single thin film form, and the pattern may be heat-transferred. All forms which are advantageous for this are applicable.

In addition, the second dummy pattern 650b may be formed of the same material as the first dummy pattern 650a of the first dummy pattern portion 650. Since the second dummy pattern 650b has better thermal conductivity than the film 610, before the film 610 of the connection part 600 is directly drawn by the heat applied when the substrate 510 and the connection part 600 are bonded together. In the connection part 600, the heat transmitted to the film 610 together with the first dummy pattern 650a is uniformly distributed. In addition, the first and second dummy patterns 650a and 650b are generated when the device is driven to uniformly diffuse heat transferred to the film 610 of the connection part 600, and thus, the first and second dummy patterns 650a and 650b. It is possible to prevent the irregular stretching of the film 610 adjacent to.

Therefore, the first and second dummy patterns 650a and 650b according to the second embodiment of the present invention prevent irregular stretching of the film 610 of the connecting portion 600, and elongation of each part of the connecting portion 600. Since it can be adjusted, it is possible to prevent the mismatch between the pad portion (530, 540) and the lead portion (630, 640).

In addition, since the pad parts 530 and 540 and the lead parts 630 and 640 can be designed in a 1: 1 pitch ratio, the time required for the bonding process of the substrate 510 and the connection part 600 can be reduced. It is possible to improve the production yield.

As described above, in the second embodiment of the present invention, the first dummy pattern 650a and the second dummy pattern 650b are separately formed, but the first dummy pattern 650a and the second dummy pattern 650b are formed as one. Can be.

In addition, the first and second dummy patterns 650a and 650b according to the second embodiment of the present invention may not be a conductive material, and may be formed of a material having a lower thermal expansion coefficient than the film, similarly to a low thermal expansion film.

In addition, the connection part 600 according to the second embodiment of the present invention has one or more low thermal expansion properties along the same material and pattern as the low thermal expansion property film 460 formed on the connection part 400 according to the first embodiment of the present invention. The film may be further formed in a region corresponding to the positions of the lead parts 630 and 640 on the rear surface of one side of the film 610 in which the lead parts 630 and 640 are formed.

In the first and second embodiments of the present invention, the present invention has been described with reference to a case of a chip on film (COF) type in which a flexible printed circuit (FPC) is applied to the connection parts 400 and 600. Is not limited to this.

In addition, the scope of the present invention is not limited to the position of a drive circuit part or the wiring pattern of a connection part.

In addition, although the first embodiment of the present invention has been described with reference to the flat panel display as an example of an electroluminescent element, the present invention is not limited to the type or driving method of the pixel portion.

The pixel unit included in the flat panel display device according to the present invention may include a light emitting layer including any one or more of organic materials and inorganic materials between two electrodes.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the above-described technical configuration of the present invention may be embodied in other specific forms by those skilled in the art to which the present invention pertains without changing its technical spirit or essential features. It will be appreciated that it may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

As described above, the present invention can provide a flat panel display device which can prevent malfunction of the display by preventing mismatch between the pad portion and the lead portion, and can improve the production yield.

Claims (10)

Board; A pixel portion formed on the substrate; A pad unit formed on the substrate and electrically connected to the pixel unit to transmit a driving signal, the pad unit including a plurality of pads; And A lead part including a plurality of pads formed on one side of the film and electrically connected to the pad part, and a low thermal expansion characteristic film formed of a material positioned on the other side of the film and having a lower thermal expansion coefficient than the film. Flat panel display device comprising a connection. The method of claim 1, And the other side of the film on which the low thermal expansion characteristic film is formed is a rear surface of the side on which the lead portion of the film is formed. The method of claim 1, The low thermal expansion film is a flat display device including a metal selected from the group consisting of high nickel steel invar, elinvar, super invar, iron-nickel alloy-based invar. Board; A pixel portion formed on the substrate; A pad unit formed on the substrate and electrically connected to the pixel unit to transmit a driving signal, the pad unit including a plurality of pads; A lead part formed on one side of the film and including a plurality of pads electrically connected to the pad part; And A connection part formed in a region distinct from the lead part of the film and including at least one dummy pattern having a lower coefficient of thermal expansion than a pad included in the lead part; Flat display device comprising a. The method of claim 4, wherein The pad part includes a first pad part for transmitting a data signal to the pixel part and a second pad part for transmitting a scan signal to the pixel part. And a third pad part including one or more dummy pads in a partial area on the substrate which is separated from the areas in which the first and second pad parts are formed. The method of claim 4, wherein The lead part includes a first lead part electrically connected to the first pad part and a second lead part electrically connected to the second pad part. The connection part includes a first wiring part electrically connected to the first lead part on the film, and a second wiring part electrically connected to the second lead part, And at least one dummy pattern in a portion of the film on which the first lead portion and the second lead portion are formed, and a portion of the film which is separated from the first wiring portion and the second wiring portion. The method of claim 5, The dummy pattern may include a first dummy pattern having a pad shape formed in a partial area on the film corresponding to the third pad part, and a second dummy pattern formed in a partial area on the film separated from the first dummy pattern. Flat panel display including. delete The method of claim 4, wherein And the connection part comprises a low thermal expansion characteristic film formed of a material having a lower coefficient of thermal expansion than that of the film on a rear surface of a side surface of the film. The method according to claim 1 or 4, The pixel unit includes a flat panel display including an organic emission layer between two electrodes.

Images