KR20100012510U - Honeycomb structure heat sink for high power Light Emitting Diode lighting - Google Patents

Honeycomb structure heat sink for high power Light Emitting Diode lighting Download PDF

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Publication number
KR20100012510U
KR20100012510U KR2020090007395U KR20090007395U KR20100012510U KR 20100012510 U KR20100012510 U KR 20100012510U KR 2020090007395 U KR2020090007395 U KR 2020090007395U KR 20090007395 U KR20090007395 U KR 20090007395U KR 20100012510 U KR20100012510 U KR 20100012510U
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South Korea
Prior art keywords
heat sink
circuit board
heat
metal
printed circuit
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KR2020090007395U
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Korean (ko)
Inventor
전준영
최국환
안병철
이동광
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한국에너셀 주식회사
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Priority to KR2020090007395U priority Critical patent/KR20100012510U/en
Publication of KR20100012510U publication Critical patent/KR20100012510U/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0045—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by tongue and groove connections, e.g. dovetail interlocking means fixed by sliding
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

본 고안은 발열소자의 열을 흡수하여 외부로 방출하는 방열판의 구조에 있어서 고출력 LED조명용 금속회로기판과 상기 금속회로기판과 면 접촉되는 금속플레이트, 금속플레이트와 슬라이드식으로 결합되는 방열판의 구성이 방열의 효율을 극대화시키기 위해 방열판의 내부에 공기 통로가 있고 방열판의 양측면에는 벌집구조 6각형의 구멍을 뚫어 공기와의 접촉면을 최대한 확장시킨 구조를 특징으로 하는 고출력 LED조명용 금속회로기판의 방열판에 관한 것이고 상기방열판이 면 접촉하는 금속플레이트와 결합을 별도의 체결장치 없이 삼각홈을 이용하여 슬라이드식으로 끼워 넣을 수 있는 방열장치의 구조에 관한 것이다The present invention is a heat sink that absorbs heat from the heat generating element and emits it to the outside, the heat dissipation of the high-power LED lighting metal circuit board and the metal plate in contact with the metal circuit board, the heat sink coupled to the metal plate in a sliding manner In order to maximize the efficiency of the heat sink, the inside of the heat sink is a heat sink of the high power LED lighting metal circuit board, characterized in that the structure of the honeycomb structure hexagonal holes on both sides of the heat sink to expand the contact surface with the air as much as possible. It relates to a structure of the heat dissipation device that can be slide-fitted by using a triangular groove without a separate fastening device and the metal plate that the heat sink is in contact with the surface.

방열판(heat sink), 벌집구조, 고출력 LED조명, 금속인쇄회로기판, 슬라이드식 삽입,금속플레이트 Heat sink, honeycomb structure, high power LED lighting, metal printed circuit board, slide insert, metal plate

Description

고출력 엘이디 조명용 벌집구조 방열판{Honeycomb structure heat sink for high power Light Emitting Diode lighting}Honeycomb structure heat sink for high power Light Emitting Diode lighting}

본 발명은 고출력 LED조명용 금속인쇄회로기판에 있어 발생하는 고열을 방열시키기 위한 방열판의 구조 및 금속인쇄회로기판과 방열판의 결합장치에 관한 것이다. The present invention relates to a structure of a heat sink for radiating high heat generated in a metal printed circuit board for high power LED lighting, and a coupling device of a metal printed circuit board and a heat sink.

인쇄회로기판을 제작할 때 IC, 다이오드 및 기타 전자부품에서 고열이 발생할 경우 효율적으로 방열시키기 위해 금속인쇄회로기판을 사용하게 되는데, 이때 방열의 효율을 높이고 공기와 접촉면을 넓히기 위해 금속 플레이트의 표면에 수많은 돌출 구조의 돌기가 달려 있는 형태, 즉 라지에이터식 구조로 된 방열판을 부착하여 방열의 효과를 달성한다. 이때 방열판과 금속인쇄회로기판은 볼트나 양면테이프 등을 통해 면 접촉시켜 결합시켜 왔다. 또 방열판의 구조만으로 기대하는 수준의 방열효과를 거두지 못할 경우 팬을 부착하여 강제 방열시키는 방식으로 사용하기도 한다. 하지만 특히 고출력 LED조명용 회로기판에서는 지속적으로 발생하는 고열을 효과적으로 방열시키는 데는 방열구조에 한계성을 노출하여 왔다. 따라서 고출력 LED 조명용 금속인쇄회로기판의 경우 사용되는 전기의 양이 많을수록 더 많은 열이 발생하니 방열시키는 구조물은 점점 더 커지게 되고, 무게도 무거워져 제작된 LED조명 시스템을 벽에 부착하거나 높은 곳에 설치하기 위해 더 많은 무게를 지탱하기 위한 별도의 구조물이 또 필요하고 비용 또한 더 많이 소요되는 현상이 생기게 되었음When manufacturing printed circuit boards, metal printed circuit boards are used to efficiently dissipate heat when ICs, diodes and other electronic components generate high heat. The effect of heat radiation is achieved by attaching a heat sink having a shape of a protrusion structure, that is, a radiator structure. At this time, the heat sink and the metal printed circuit board have been coupled by surface contact through a bolt or a double-sided tape. In addition, if the structure of the heat sink does not achieve the expected level of heat dissipation, it may be used in a manner of forcibly dissipating heat by attaching a fan. However, especially in high power LED lighting circuit boards, the heat radiation structure has been limited in effectively dissipating high heat continuously generated. Therefore, in case of metal printed circuit board for high power LED lighting, the more electricity is used, the more heat is generated. In order to do this, a separate structure is needed to support more weight and the cost is more expensive.

본 고안은 상기와 같은 문제점을 해소하기 위해 금속인쇄회로기판에 발생되는 열을 냉각시키기 위해 기존의 라지에터식 구조의 방열판보다 방열판의 소재의 사용량은 줄이고 더 많은 표면적을 가지게 되는 형태로 제작하여 전체적으로 방열판이 금속인쇄회로기판에 부착되었을 때 많은 무게를 줄이고 소재 사용량을 줄여 제작 비용도 줄이고 방열 표면적을 더욱 넓혀 방열효과도 극대화시키고, 금속인쇄회로기판에 결합시킬 때는 볼트등으로 기 결합된 금속플레이트에 별도의 체결장치 없이 면 접촉하는 부분을 쉽게 삽입할 수 있도록 하는 장치를 만드는데 그 목적이 있다    In order to solve the above problems, the present invention is designed to reduce the amount of material used for the heat sink and to have more surface area than the heat sink of the conventional radiator structure in order to cool the heat generated in the metal printed circuit board. When the heat sink is attached to the metal printed circuit board, it saves a lot of weight, reduces the material usage, reduces the production cost, expands the heat dissipation surface area, and maximizes the heat dissipation effect. Its purpose is to make a device that allows easy insertion of surface-contacting parts without a separate fastening device.

본 고안은 상기와 같은 목적을 달성하기 위해 라지에터식 구조를 가진 방열판을 생산하는 단계에서 도1의 2와 같이 알미늄바의 양측면에 6각형의 벌집구조의 구멍을 뚫어 동일한 패턴을 가진 알미늄바를 만든다. 알미늄바에 구멍을 무분별하게 뚫으면 외부의 충격에 약하거나 무너질 수 있으므로 6각형의 벌집모양의 구조를 유지하면 외부의 충격에 대해 적절한 힘의 분산을 통해 안전하게 형태를 유지할 수 있으므로 구멍은 6각형을 유지한다. 금속플레이트에 부착되는 면인 바닥(도1의 4)은 수평으로 하되 하부의 측면은 급한 경사(도1의 3)를 가지도록 하고 삼각형 아랫부분 모양으로 제작하고 금속플레이트(도3의 5)는 방열판의 하부가 잘 삽입될 수 있도록 방열핀의 하부모양과 같은 삼각형 모양의 홈을 길게 가공하면 방열판과 금 속플레이트와의 결합을 보다 쉽고 용이하게 하도록 한다 The present invention to produce the aluminum bar having the same pattern by drilling a hexagonal honeycomb structure holes on both sides of the aluminum bar as shown in Figure 2 in the step of producing a heat sink having a radiator structure to achieve the above object. . If the hole is indiscriminately drilled on the aluminum bar, it can be weak or collapsed from the external impact. Therefore, if the hexagonal honeycomb structure is maintained, the hole can be maintained in a hexagonal shape by distributing the proper force against external impact. do. The bottom (4 in Fig. 1), which is a surface attached to the metal plate, should be horizontal, but the lower side should have a steep incline (3 in Fig. 1). If you make a long groove of triangular shape like the shape of the bottom of the heat sink fin so that the bottom of the heat sink can be inserted easily, the heat sink and metal plate can be easily and easily combined.

이상과 같이 본 고안에 따르면 열이 많이 발생하는 고출력 LED의 회로기판에서 그 열을 효과적으로 냉각시키기 위해 방열장치의 구성이 과거보다 가벼워져 방열판의 제작비용을 줄이고, 전체 LED 조명시스템의 무게도 가벼워져 천정이나 벽 등 기타 설치 장소에 설치할 거치대나 지지대의 구조물도 작아질 수 있어 많은 비용을 절감할 수 있다. 또, 본 고안에 따라 여러 개의 방열판이 달린 하나의 구조물을 제작, 가공할 경우 가공이 어렵고 제작하더라도 비용이 많이 들기 때문에 도1의 방열판을 각 각 제작하는 것이 좋고 이 방열판을 회로기판에 부착할 때 양면테이프나 볼트 등, 별도의 체결장치를 사용할 경우 부착 작업이 번거로우므로 금속인쇄회로기판의 배면에는 별도의 금속플레이트를 부착하고 금속플레이트와 금속인쇄회로기판이 면 접촉되는 반대면은 방열판의 하부모양과 같은 삼각홈을 만들면 방열판을 홈으로 끼워 넣어 방열판의 결합작업 또한 용이하다 (도4 참조) As described above, according to the present invention, in order to effectively cool the heat in the circuit board of the high power LED which generates a lot of heat, the heat dissipation device is lighter than in the past, reducing the manufacturing cost of the heat sink, and the weight of the entire LED lighting system is light. The structure of the pedestal or support to be installed in other places such as ceilings or walls can also be reduced, which can save a lot of cost. In addition, when manufacturing and processing a single structure with a plurality of heat sinks according to the present invention is difficult to manufacture and expensive even if manufactured, it is better to manufacture each of the heat sinks of Figure 1 when attaching the heat sink to the circuit board When using a separate fastening device such as double-sided tape or bolt, attaching work is cumbersome. Therefore, attach a separate metal plate to the back of the metal printed circuit board, and the opposite side where the metal plate and the metal printed circuit board are in contact with each other is in the shape of the bottom of the heat sink. If you make a triangular groove, such as inserting the heat sink into the groove is easy to join the heat sink (see Figure 4)

이하 본 고안에 따른 고출력 LED조명 장치의 냉각장치에 대한 바람직한 실시 예를 아래 도면을 참조하여 설명하면 Hereinafter, a preferred embodiment of the cooling device of the high power LED lighting device according to the present invention with reference to the drawings

<도면의 주요 부분에 대한 부호의 설명><Explanation of symbols for main parts of the drawings>

1 ‥‥‥에어벤트 (방열효과를 높이기 위해 각 방열판마다 공기의 흐름을 돕는 통로가 가공되어 있는 방열판이 있음)1 ‥‥‥ Air vents (In order to increase the heat dissipation effect, each heat sink has a heat sink with a passage to help the flow of air)

2‥‥‥벌집모양의 6각형 구멍 3‥‥‥하부경사면2 ‥‥‥ Hexagonal hexagonal hole 3 ‥‥‥ Bottom slope

4‥‥‥바닥(금속플레이트와 면접촉) 5‥‥‥금속플레이트4 ‥‥‥ Floor (face contact with metal plate) 5 ‥‥‥ Metal plate

6‥‥‥금속인쇄회로기판(Metal PCB)6 ‥‥‥ Metal Printed Circuit Board (Metal PCB)

본 고안에 따라 제작된 방열판은 하부에 금속회로기판과 결합이 용이하도록 삼각형의 하부형태로 가공이 되고, 같은 모양과 크기로 금속인쇄회로기판의 인쇄 배면에 삼각형 하부형태의 홈을 만들면 각 각의 방열판을 회로기판에 쉽게 삽입만 하면 결합이 되므로 작업이 용이하고 금속인쇄회로기판과의 접촉 면 또한 넓어서 열 전달 양이 많고 이는 다시 측면에 6각형의 구멍이 뚫어진 방열판에 의해 효과적으로 냉각됨으로써 원하는 냉각의 효과를 최대한 살릴 수 있다.The heat sink manufactured according to the present invention is processed into the lower part of the triangle to be easily combined with the metal circuit board at the bottom, and if the grooves of the lower shape of the triangle are formed on the printed back surface of the metal printed circuit board in the same shape and size, The heat sink can be easily inserted by simply inserting it into the circuit board, so it is easy to work with, and the contact surface with the metal printed circuit board is also wide, so that the amount of heat transfer is large, which is effectively cooled by the heat sink with hexagonal holes on the sides, so that the desired cooling can be achieved. You can make the most of the effect.

도 1은 방열판의 투시도1 is a perspective view of a heat sink

도 2는 방열판의 측면도2 is a side view of the heat sink

도 3은 방열판과 금속플레이트, 금속인쇄회로기판의 결합 투시도Figure 3 is a perspective view of the heat sink and the metal plate, metal printed circuit board combined

도 4는 방열판과 금속플레이트, 금속인쇄회로기판의 결합 정면도Figure 4 is a front view of the heat sink and the metal plate, the metal printed circuit board combined

Claims (2)

LED용 금속인쇄회로기판에 설치되는 발열소자와;A heating element installed on the metal printed circuit board for LEDs; 상기 발열소자와 면 접촉되어 발열소자의 열을 흡수하여 외부로 방출하는 방열판의 구조에 있어 각 내부에는 공기가 흐를 수 있는 공기 통로가 있는 방열판의 양 측면에는 6각형의 벌집 모양의 구멍이 뚫어진 구조를 특징으로 하는 고출력 LED용 인쇄회로기판의 냉각장치In the structure of the heat sink that is in contact with the heat generating element to absorb the heat of the heat generating element to the outside in the hexagonal honeycomb-shaped hole is formed on both sides of the heat sink having an air passage through which air flows Cooling device for printed circuit board for high power LED, characterized in that 상기 방열판을 금속인쇄회로기판에 결합시킬 때, 각 각의 방열판의 하부에는 삼각형의 하부 모양으로 가공하고 금속인쇄회로기판의 배면에는 금속플레이트를 면 접촉 결합시키고 일 측은 방열판의 하부와 같은 모양과 크기로 삼각홈을 가공하여 별도의 체결장치 없이 쉽게 키워 넣을 수 있는 슬라이드식 삽입구조를 가지는 냉각장치When the heat sink is coupled to the metal printed circuit board, the bottom of each heat sink is processed into a triangular bottom shape, the bottom of the metal printed circuit board is bonded to the metal plate surface contact and one side is the same shape and size as the bottom of the heat sink Cooling device with slide insert structure that can be easily raised by processing triangular grooves
KR2020090007395U 2009-06-09 2009-06-09 Honeycomb structure heat sink for high power Light Emitting Diode lighting KR20100012510U (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120126608A (en) * 2011-05-12 2012-11-21 삼성디스플레이 주식회사 Backlight assembly and display apparatus having the same
KR101230872B1 (en) * 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp
KR101309282B1 (en) * 2012-02-03 2013-09-17 박선숙 Lighting device having heat emission structure of LED module
KR101340411B1 (en) * 2013-09-04 2013-12-13 인지전기공업 주식회사 Heat-sink apparatus for led lighting equipment
WO2014104812A1 (en) * 2012-12-28 2014-07-03 Kim Kyung Eun Structure for heat-dissipating plate for ipm circuit and led light
KR200473677Y1 (en) * 2011-06-03 2014-07-22 김봉기 radiator assembly of LED lighting apparatus using porous aluminium
WO2018021725A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit
WO2018021724A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120126608A (en) * 2011-05-12 2012-11-21 삼성디스플레이 주식회사 Backlight assembly and display apparatus having the same
KR200473677Y1 (en) * 2011-06-03 2014-07-22 김봉기 radiator assembly of LED lighting apparatus using porous aluminium
KR101230872B1 (en) * 2011-11-08 2013-02-07 주식회사 레더스 Heat sink for led lamp
KR101309282B1 (en) * 2012-02-03 2013-09-17 박선숙 Lighting device having heat emission structure of LED module
WO2014104812A1 (en) * 2012-12-28 2014-07-03 Kim Kyung Eun Structure for heat-dissipating plate for ipm circuit and led light
KR101340411B1 (en) * 2013-09-04 2013-12-13 인지전기공업 주식회사 Heat-sink apparatus for led lighting equipment
WO2018021725A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit
WO2018021724A1 (en) * 2016-07-29 2018-02-01 엘에스오토모티브 주식회사 Vehicle led lamp unit

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