WO2014104812A1 - Structure for heat-dissipating plate for ipm circuit and led light - Google Patents

Abstract

The present invention relates to a structure for a heat-dissipating plate for an IPM circuit and an LED light, the structure comprising: a base plate (10); a plurality of thermally-conductive plates (20) standing on the base plate (10) at a set distance from each other as a single body therewith; and a heat-dissipating plate (30) formed by coating the base plate (10) and the thermally-conductive plates (20) with a heat-dissipating resin composition to a set thickness. The present invention is a useful a invention possessing particular advantages of being superbly economical as the product price is significantly reduced due to a reduction in material costs by forming a heat-dissipating member which is not separated from a heat-dissipating body by covering the heat-dissipating plates within the base plate with the heat-dissipating member or constructing the heat-dissipating plates without the thermally-conductive plates, the base plate being the bottom plate having a dovetail shape and comprising positive and negative poles, and as the flat surface of the base plate, from which the plurality of thermally-conductive plates are removed, is coated with a plurality of ceramic balls, increasing the surface area but being light-weight, the heat-dissipation efficiency is superb as the transfer of heat to the heat-dissipating plate is highly efficient, and furthermore, when the IPM module and the LED module are constructed, as the product manufacturing process can be simplified, self-water proofing is possible, and thus the overall product durability can be enhanced as well as the product manufacturing costs lowered.

Description

Structure of IPPM circuit and LED lighting heat sink

The present invention relates to a structure of an LED lighting heat sink for an IPM circuit used in a motor driving circuit of an air conditioner, a refrigerator, and a washing machine and a home appliance, and a base having a dovetail shape of a dovetail that forms an embossed and intaglio. The heat-dissipating resin composition is applied to the entire heatsink among the plates so that the heat-dissipating resin composition is not separated from the heat-dissipating element.The heat dissipation characteristics are excellent and the weight is greatly reduced. (LED) relates to the structure of a lighting heat sink.

LED (Light Emitting Diode) module refers to the finished product including the LED (hereinafter referred to as "LED") light source, mainly used for 30 200W inverter motor drive, lighting, display, etc. IPM solutions require relatively inefficient, bulky heat sinks and external heat sinks to achieve satisfactory thermal performance. In addition, LED has a long life, low power consumption, and all colors can be realized compared to other light sources.However, since the heat generation amount is high, the heat dissipation plate is applied to the LED module to prevent the failure of the related parts and the decrease of life due to the heat generation. This is essentially installed.

The conventional heat sink used for the LED module is a heat sink (2) in which a plurality of metal plates are arranged vertically on the base plate (1) having excellent thermal conductivity as shown in FIG. The heat is transferred to the heat sink 2, and the LED module is cooled by releasing heat transferred to the heat sink 2 to the surrounding air. That is, since the metal plate, which is a component of the heat sink 2, has a large contact area with the surrounding air, heat transmitted to the metal plate can be efficiently transferred to the air. However, the conventional heat sink has a problem that the weight is heavy while the heat dissipation efficiency is low, as well as the cost of the product is high due to the increase in the material cost, thereby lowering the economic efficiency.

In recent years, the use of LEDs in lighting and display products is increasing, and problems such as defects caused by LED heating and deterioration of product durability are becoming more important in terms of product quality and productivity. There are many studies on products and methods that can cool, reduce process costs, and simplify processes. As part of this study, Korean Patent Registration No. 1025207 as shown in FIG. 2, "The heat dissipation module for LED lamps and the heat dissipation plate for a customized LED lamp using the same" is a plurality of plates 101 are vertically arranged at regular intervals, The upper portion of the plurality of plates 101 are spaced apart from each other so that heat exchange by contact with the outside air, and the lower portion having a coupling section of the "U" shape formed integrally with each other the plurality of plates 101 Fastening formed with a heat dissipation member 100, a heat dissipation member adhesive portion 201 bonded to the lower end of the heat dissipation member 100, and a plurality of coupling holes 202 formed along the circumference of the heat dissipation member adhesive portion 201 Base portion 200 consisting of a portion 203 is bonded to each other to form a unit, the heat dissipation member 100 and the base unit 200 is bonded to each other is a heat dissipation module for LED made by a conductive adhesive 300 and the Using discloses a heat sink for custom LED lamp. However, the prior art has the advantage that it can be produced as a heat sink for a custom LED lamp, but the heat transfer efficiency (heat transfer efficiency that is transferred to the heat transfer member because the heat transfer member (and the base unit using a method of bonding only using a conductive adhesive) There is a problem in that the overall cooling efficiency is lowered, the waterproof is not possible when the LED module configuration is lowered, the overall product durability is lowered.

On the other hand, the module of the heat sink is disclosed in the domestic patent No. 1060226 with respect to the heat radiation resin composition for applying a heat sink in addition to the structure to facilitate heat dissipation. However, since the heat dissipating resin composition is a high molecular organosilane compound which covers a part or all of the heat dissipating plate and has a long chain functional group, the heat dissipating resin composition has a low durability against high heat, and has a low heat dissipation effect due to the use of a binder resin as a filler. When thicker than this, there existed a problem that the coating peeling of the coating layer occurs.

In particular, 0.1 10 parts by weight of the siloxane-based organosilane compound represented by R _3b Si (OR ⁴ ) _4-b is used with respect to 100 parts by weight of the total amount of the binder resin, and the thermally conductive material is made of metal powder or carbon black, graphite, or the like. 1 100 parts by weight, even in all cases, the thermal conductivity does not exceed the range of 1.5, and when the filler is added, there is an advantage to promote storage safety and curing rate, but there is a disadvantage that workability is lowered, adhesion is significantly lower .

Accordingly, the present invention has been invented to solve various defects and problems caused by the heat dissipation plate for heat dissipation and LED lamps for conventional motor driving IPM semiconductor circuits in view of the above-described situation, and the object thereof is the dovetail which forms an embossed and intaglio ( A heat-dissipating resin composition is applied to the base plate between the heat sinks among the base plates, which are dovetail), to form a heat dissipation member that is not separated from the heat sink, or to form a heat sink without a heat conduction plate, thereby providing excellent heat dissipation characteristics. It is to provide a structure of IPM circuit heat dissipation and LED lighting heat sink with excellent economic efficiency by reducing the price of the product drastically.

Another object of the present invention is to apply a plurality of spherical ceramic balls on the surface of the plate-shaped base plate from which the plurality of heat conductive plates are removed, thereby increasing the surface area of the spherical ceramic balls and increasing the heat transfer efficiency to be transferred to the heat sink. To provide a new structure of IPM circuit heat sink and LED lighting heat sink.

Another object of the present invention is to simplify the manufacturing process of the product can be self-waterproof when configuring the IPM module and LED module IPM heat sink and LED of a novel structure that can reduce the manufacturing process cost while improving the overall product durability (LED) is to provide the structure of the lighting heat sink.

The structure of the present invention IPM heat sink and LED lighting heat sink for achieving the above object is a base plate (10); A plurality of thermal conductive plates 20 formed integrally with the base plate 10 at regular intervals on the base plate 10; The base plate 10 and the heat conductive plate 20 is characterized in that composed of a heat sink 30 formed by coating with a heat-resistant resin composition of a predetermined thickness.

The present invention forms a heat dissipation member which is not separated from the heat dissipation member by applying a heat dissipation member to the entire heat dissipation plate of the base plate, which is a dovetail-type bottom plate which is embossed and intaglio, or forms a heat dissipation plate without a heat conductive plate. It is economical by drastically reducing the price of the product by reducing the cost, and by applying a large number of spherical ceramic balls to the surface of the flat base plate from which the plurality of heat conductive plates are removed, the weight of the spherical ceramic balls increases the surface area of the spherical ceramic balls, and the heat sink. The high heat transfer efficiency ensures excellent heat dissipation efficiency, and can simplify the manufacturing process of the product, enabling self-waterproofing when constructing IPM modules and LED modules. There is.

1 is a block diagram of a heat sink for the IPM and LED of the conventional embodiment,

2 is a block diagram of a heat sink for the IPM and LED of the prior embodiment,

Figure 3a is a perspective view showing the configuration of a first embodiment of the present invention IP and LED lighting heat sink,

Figure 3b is a cross-sectional view showing the configuration of a first embodiment of the present invention IP and LED lighting heat sink;

Figure 4a is a perspective view showing the configuration of a second embodiment of the present invention IP and LED lighting heat sink,

Figure 4b is a cross-sectional view showing the configuration of a second embodiment of the present invention IP and LED lighting heat sink;

5 is a view for explaining a method of measuring the heat radiation efficiency of the heat sink;

6 is a graph showing the temperature change with respect to the time of the heat sink and the conventional heat sink of the present invention,

Figure 7a is a perspective view showing the configuration of a third embodiment of the present invention IP and LED lighting heat sink,

Figure 7b is a cross-sectional view showing the configuration of a third embodiment of the present invention IP and LED lighting heat sink;

8 is an enlarged photograph of the surface of the base plate of the third embodiment of the present invention IP and LED lighting heat sink;

9 is a graph comparing the heat dissipation efficiency of the third embodiment of the present invention IP and LED lighting heat sink and the heat dissipation efficiency of the conventional heat sink.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment of the structure of the present invention IP LED and LED lighting heat sink.

Figure 3a is a perspective view showing the configuration of a first embodiment of the invention IP and LED lighting heat sink, Figure 3b is a cross-sectional view showing the configuration of a first embodiment of the invention IP and LED lighting heat sink, Figure 4a and the invention IP and Figure 4b is a perspective view showing the configuration of a second embodiment of the LED lighting heat sink, Figure 4 is a cross-sectional view showing the configuration of a second embodiment of the present invention LED and LED lighting heat sink, Figure 5 is a view for explaining a method of measuring the heat radiation efficiency of the heat sink 6 is a graph showing a temperature change with respect to the time of the heat sink and the conventional heat sink of the present invention, Figure 7a is a perspective view showing the configuration of a third embodiment of the present invention IP and LED lighting heat sink, Figure 7b is 8 is a cross-sectional view showing the configuration of the third embodiment of the LED lighting heat sink, Figure 8 is the base plate surface of the third embodiment of the present invention LED and LED lighting heat sink Enlarge, 9 is a third embodiment, heat radiation efficiency and a graph comparing the room heat efficiency of the conventional heat sink, the present invention child piem LED lighting and heat sink of the present invention and the LED lighting child piem heat sink includes a base plate 10 and; A plurality of thermal conductive plates 20 formed integrally with the base plate 10 at regular intervals on the base plate 10; The base plate 10 and the heat conductive plate 20 is composed of a heat-dissipating resin composition 30 formed by applying a heat-dissipating plate 30 formed by applying a heat-dissipating resin composition having a predetermined thickness.

The base plate 10 has a groove 21 having an intaglio dovetail structure having a wide bottom and a narrow bottom at a central portion of the base plate 10 between the thermal conductive plate 20 and the thermal conductive plate 20, and the groove 21. The heat dissipation plate 30 is coated with a heat dissipation resin composition of a predetermined thickness on the base plate 10 including.

The base plate 10 has grooves 22 and 22 'having an embossed dovetail structure having a wide bottom and a narrow bottom at both edges of the base plate 10 between the heat conductive plate 20 and the heat conductive plate 20. The heat dissipation plate 30 to which the heat dissipation resin composition is applied is formed to a predetermined thickness on the base plate 10 including the grooves 22 and 22 '.

Herein, the heat dissipation plate 30 coated with the heat dissipation resin composition is a heat dissipation resin composition composed of 55% by weight of epoxy resin 40 and 50% by weight of spherical or acicular crystallized alumina at 1,600 1,700. The average particle size distribution of is preferably 5 45.

In addition, as shown in FIGS. 7A and 7B, in the first and second embodiments (FIGS. 3A and 4A), the remaining heat conductive plates 20 except for the outermost heat conductive plates 20 are removed, and the outermost heat conductive plates ( The heat dissipation plate 30 to which the heat dissipation resin composition is applied is formed on the surface of the base plate 10 and the outermost heat conductive plate 20 on the plane between them.

Herein, the heat dissipating resin composition applied to the top surface of the base plate 10 and the surface of the outermost heat conductive plate 20 may be 15 wt% of methtrimethoxy- silane 10 and 10 wt% of silica 5. , A composition consisting of 5 to 10% by weight of polysiloxane, 10 to 50% by weight of spherical ceramic, 1 to 5% by weight of carbon black (hereinafter referred to as "Black Product"), or methtrimethoxy-silane (Methltri) 15 15% by weight of methoxy-silane, 10% by weight of silica 5, 10% by weight of polysiloxane, 10 50% by weight of spherical ceramic, 5% by weight of carbon black 1, TiO ₂ 1) a composition consisting of 5% by weight (hereinafter referred to as "Gray product"), and 10 15% by weight of Methlt rimethoxy-silane, 10% by weight of Silica 5, and polysiloxane (Polysiloxan e) ) 5 10 wt%, spherical ceramic 10 50 wt%, titanium dioxide (TiO ₂ ) 1 5 wt% ; "Whate product" can be used.

According to the present invention, by using an epoxy resin and a ceramic mixture as a heat dissipating resin composition in a product of which the weight is reduced to 1/2 by the existing aluminum extrusion drawing and die casting methods, the weight is not only maximized and the heat dissipation effect is maximized. By the structure of the heat sink 30 having the embossed and engraved structure extruded to the excellent heat shrink expansion when the epoxy resin and the crystallized alumina mixture is injected there is an excellent effect that does not separate from the heat sink (heat sink).

8 is a 300 magnification enlarged view of the surface of the base plate according to the third embodiment of the present invention IPM and LED lighting heat sink, the heat radiation according to the increase in the surface area of the sphere by the spherical ceramic coated on the surface of the base plate 10 with the heat sink 30 The increase in efficiency can reduce the material cost by 40% compared to the case where there are a plurality of thermal conductive plates 20, and can greatly reduce the cost required for manufacturing by simplifying the manufacturing process.

Next, the performance of the present invention IP and LED lighting heat sink constructed as described above was tested in comparison with the conventional heat sink.

Test 1

Test 1 is placed in the test enclosure (TB) the samples (IPPM and LED lighting heat sinks and conventional heat sinks of Examples 1 and 2 of the present invention) as shown in Figure 5 to the IPPM and LED lighting heat sink (P) Connect the heat source (HS), and then supply the power (W) to the heat source (HS) while measuring the temperature change of the IPM and LED lighting heat sink (P) with the thermocouple data Roger (TD), and in the same way Compared with the measured temperature change, the results are shown graphically in Table 1 and FIG. 6, respectively.

The test enclosure (TB) uses 500mm 500mm 620mm hermetic acrylic enclosure and supplies power (60W; 25V / 2.4A) and power (117W; 49V / 2.4A) to the power supply (PS) until temperature saturation for more than 8 hours. The temperature change was measured by supplying.

Table 1

	Power applied (W)	Temperature of heat sink ()	Temperature in enclosure (TB) ()	Weight (g)	(-)
Conventional heat sink	60	58.2	34.6	2,000	23.6
The present invention	60	56.3	35.1	851	21.2
Conventional heat sink	117	67.1	39.1	2,000	28
The present invention	117	65.1	28.6	851	26.5

As can be seen from Table 1, the LED lighting heat sink (P) of Examples 1 and 2 of the present invention was confirmed that the heat dissipation efficiency is superior to the conventional heat sink.

In the graph shown in FIG. 6, the vertical axis represents time Hr, and the horizontal axis represents the temperature difference between the maximum temperature of the heat sink and the temperature in the enclosure TB, respectively. From the graph of FIG. 6, the LED lighting heat sink P of the present invention is It was confirmed that the heat dissipation efficiency is superior to the conventional heat sink.

Test 2

Test 2 is to test the performance of the heat sink in the same manner as in Test 1 as shown in Figure 5, but the sample (Black product, Gray product, Whate product and conventional heat sink of Example 3 of the present invention) in the test enclosure (TB) Position the heat source (HS) to the IP and LED lighting heat sink (P) and supply the power (W) to the heat source (HS) while the thermocouple data Roger (TD) of the IP and LED lighting heat sink (P) The temperature change was measured and compared with the temperature change measured by the conventional heat sink in the same manner, and the results are shown in the following Table 2 and FIG. 9 graphically.

The test enclosure (TB) uses a 300mm 300mm 300mm sealed acrylic enclosure, power (4.81W; 17.2V / 0.28A-traditional) and power (4.9W) with the power supply PS until temperature saturation for at least 20 minutes; 16.9V / 0.29A) was supplied to measure the temperature change.

TABLE 2

division		Power applied (W)	Temperature of heat sink () b	Temperature in enclosure (TB) () a	Weight (g)	T (b-a)
Conventional products		4.81	92.3	26.6	50.2	65.7
Invention	Black products	4.9	79.3	27.4	51.6	51.9
	Gray products	4.9	82.2	26.5	51.4	55.7
	White product	4.9	79.1	26.3	51.7	52.8

As can be seen from Table 2, it was confirmed that the LED lighting heat sink (P) of the third embodiment of the present invention, that is, Black, Gray, Whate product is superior in heat dissipation efficiency than the conventional heat sink.

In the graph shown in FIG. 9, the vertical axis represents time (minutes), and the horizontal axis represents temperature difference T between the maximum temperature of the heat sink and the temperature in the enclosure TB, respectively. The LED illumination heat sink P of the present invention is also shown in the graph of FIG. 9. That is, it can be confirmed that Black, Gray, and Whate products have better heat dissipation efficiency than conventional heat sinks.

[ Description of the Code ]

10: base plate 11: cylindrical groove

20: heat conduction plate 21: groove

22, 22 ': groove 30: heat sink

P: IPM and LED lighting heatsink TB: Test enclosure

TD: Thermocouple Data Rogers HS: Heat Sources

PS: Power supply

The present invention forms a heat dissipation member which is not separated from the heat dissipation member by applying a heat dissipation member to the entire heat dissipation plate of the base plate, which is a dovetail-type bottom plate which is embossed and intaglio, or forms a heat dissipation plate without a heat conductive plate. It is economical by drastically reducing the price of the product by reducing the cost, and by applying a large number of spherical ceramic balls to the surface of the flat base plate from which the plurality of heat conductive plates are removed, the weight of the spherical ceramic balls increases the surface area of the spherical ceramic balls, and the heat sink. The high heat transfer efficiency ensures excellent heat dissipation efficiency, and can simplify the manufacturing process of the product, enabling self-waterproofing when constructing IPM modules and LED modules. There is.

Claims (8)

1. A base plate 10; A plurality of thermal conductive plates 20 formed integrally with the base plate 10 at regular intervals on the base plate 10; LED base and heat dissipation structure for the LED circuit consisting of a heat dissipation plate 30 formed by applying the heat dissipating resin composition of a predetermined thickness on the base plate 10 and the heat conductive plate 20.
2. According to claim 1, wherein the base plate 10 is formed in the center of the base plate 10 between the heat conducting plate 20 and the heat conducting plate 20, the groove 21 of the intaglio dovetail structure having a wide bottom and narrow The structure of the IPPM circuit and LED lighting heat sink, characterized in that the heat dissipation plate 30 is coated with a heat dissipating resin composition of a predetermined thickness on the base plate 10 including the groove 21.
3. According to claim 1, wherein the base plate 10 is a groove (22, 22 ') of the embossed dovetail structure having a wide bottom and narrow at both edges of the base plate 10 between the heat conductive plate 20 and the heat conductive plate 20 Is formed, and the heat dissipation plate 30 to which the heat dissipating resin composition is applied to a predetermined thickness on the base plate 10 including the grooves 22 and 22 'is formed. rescue.
4. The heat dissipating plate 30 is coated with a mixture of 55 55% by weight of epoxy resin 40 and 10 50% by weight of spherical or acicular crystallized alumina at 1,600 1,700, and the average particle size distribution of the crystallized alumina is 5 45. Features of IPPM circuit and LED lighting heat sink.
5. The method of claim 1, wherein the remaining heat conductive plate 20 of the heat conductive plate 20 except for the outermost heat conductive plate 20 is removed, and the planar base plate 10 between the outermost heat conductive plate 20 and The structure of the IPPM circuit and the LED illuminating heat sink, characterized in that the heat dissipation plate 30 is formed on the entire surface of the outermost heat conductive plate 20 is coated with a heat dissipating resin composition.
6. The heat dissipating resin composition applied to the top surface of the base plate 10 and the surface of the outermost heat conductive plate 20 is 15 wt% of methtrimethoxy-silane (Methl trimethoxy-silane), silica ( Silica) 5 10% by weight, polysiloxane (5) 10% by weight, spherical ceramic 10 50% by weight, carbon black (Carbone black) 1 5% by weight of the composition of the IPPM circuit and LED lighting heat sink characterized in that the composition .
7. The heat dissipating resin composition applied to the top surface of the base plate 10 and the surface of the outermost heat conductive plate 20 is 15 wt% of methtrimethoxy-silane (Methl trimethoxy-silane), silica ( Silica) 5 10% by weight, polysiloxane 5 10% by weight, spherical ceramic 10 50% by weight, carbon black (Carbone black) 1 5% by weight, titanium dioxide (TiO ₂ ) 1 5% by weight of the composition The structure of IPPM circuit and LED lighting heat sink.
8. The heat dissipating resin composition applied to the upper surface of the base plate 10 and the surface of the thermal conductive plate 20 is 15% by weight of Methtrimethoxy-silane 10, Silica 5 10 wt%, polysiloxane (5) 10 wt%, spherical ceramic 10 50 wt%, titanium dioxide (TiO ₂ ) 1 5 wt%, characterized in that the structure of the LED circuit and LED lighting heat sink.

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