WO2018021724A1 - Vehicle led lamp unit - Google Patents

Vehicle led lamp unit Download PDF

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Publication number
WO2018021724A1
WO2018021724A1 PCT/KR2017/007337 KR2017007337W WO2018021724A1 WO 2018021724 A1 WO2018021724 A1 WO 2018021724A1 KR 2017007337 W KR2017007337 W KR 2017007337W WO 2018021724 A1 WO2018021724 A1 WO 2018021724A1
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WO
WIPO (PCT)
Prior art keywords
unit
lamp
substrate
heat dissipation
vehicle
Prior art date
Application number
PCT/KR2017/007337
Other languages
French (fr)
Korean (ko)
Inventor
곽병훈
Original Assignee
엘에스오토모티브 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020160103120A external-priority patent/KR101840449B1/en
Application filed by 엘에스오토모티브 주식회사 filed Critical 엘에스오토모티브 주식회사
Publication of WO2018021724A1 publication Critical patent/WO2018021724A1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section

Definitions

  • the present invention relates to a lamp unit to be mounted on a vehicle, which can minimize manufacturing costs and improve durability and sensitivity.
  • Automotive lamps for example, vehicle room lamps simply provide lighting inside the vehicle, and in order to ensure durability of the vehicle, a typical lamp such as a bulb type such as a halogen is adopted in the vehicle.
  • the LED module of the bulb bulb socket shape is conventionally configured for compatibility with the bulb bulb.
  • it consists of the shape of the PCB for mounting the light source (LED) and the PCB for the driver configuration.
  • the present invention has been made to solve the problems of the prior art, the object of the present invention is to improve the structure of the direct contact method rather than the existing terminal connection method, and to provide a vehicle LED lamp unit that achieves a poor structure that can occur in the assembly process of the apparatus It is.
  • the invention is a vehicle LED lamp unit 10 mounted to be connected to the base terminal 20 to the vehicle lamp base (2) having a base terminal 20 mounted on the vehicle and disposed on the rear
  • the LED lamp unit 10 may include: a unit housing 100 at least partially inserted into the base terminal 20, and disposed in the unit housing 100 and in electrical communication with the base terminal 20.
  • a unit lamp 300 including a unit substrate 200, an LED element disposed on one surface of the unit substrate 200, and generated from the unit lamp 300 in contact with the unit substrate 200. It provides a LED lamp unit 10 for a vehicle comprising a unit heat dissipation unit 400 for dissipating the heat.
  • the unit substrate 200 is a flexible substrate (FPCB), and the unit substrate 200 includes: a lamp substrate 210 on which the unit lamp 300 is disposed; A device substrate 220 connected to a lamp substrate 210 side and configured to transmit an electrical signal to the unit lamp 300, and including at least a portion of the lamp substrate 210 and the device substrate 220. May be disposed on planes intersecting with each other.
  • FPCB flexible substrate
  • the unit heat dissipation unit 400 is: a lamp heat dissipation unit 410 in contact with the lamp substrate 210, the lamp heat dissipation unit 410 is connected to the device substrate It may also include a device heat dissipation unit 420 in contact with the 220 to release the heat of the device substrate 220.
  • a connector terminal portion in which an electrical connection is made between the base terminal 20 and the unit board 200 by contact and at least one end thereof is drawn out to the outside of the unit housing. 600 may be provided, and a contact terminal 500 may be further provided between the unit board 200 and the connector terminal 600 to transmit an electrical signal.
  • the contact terminal unit 500 may include: a substrate contact terminal 510 disposed on the unit substrate 200, the connector terminal unit 600, and the substrate contact unit. It may also have a connector contact terminal 520 connected to the terminal 510.
  • the connector contact terminal 520 may include: a connector contact terminal connection part 521 disposed opposite to the board contact terminal 510 in the unit housing 100, and one end thereof; May be connected to the connector contact terminal connecting portion 521, and the other end thereof may include a connector contact terminal connecting portion 522 connected to the connector terminal portion 600.
  • the connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed therebetween, and at least a part of the unit heat dissipating portion 400 therebetween. It is also possible to form an elastic contact state.
  • the connector terminal unit 600 may be connected to the side of the connector contact terminal connection unit 522.
  • the lamp heat dissipation unit 410 and the element heat dissipation unit 420 are orthogonally disposed, and the lamp heat dissipation unit 410 is at least one of a circular, disc, and square shapes. It may be provided.
  • the invention is a vehicle LED lamp unit 10 mounted to be connected to the base terminal 20 to the vehicle lamp base (2) having a base terminal 20 mounted on the vehicle and disposed on the rear
  • the vehicle LED lamp unit 10 may include: a unit housing 100 at least partially inserted into the base terminal 20, and disposed in the unit housing 100 and electrically connected to the base terminal 20.
  • a unit lamp 300 including a unit substrate 200 to communicate with each other, an LED element disposed on one surface of the unit substrate 200, and the unit lamp 300 in contact with the unit substrate 200.
  • a unit heat dissipation unit 400 for dissipating the generated heat wherein the unit substrate 200 is a flexible substrate FPCB, and the unit substrate 200 is a lamp substrate on which the unit lamp 300 is disposed.
  • the unit heat dissipation unit 400 includes: a lamp heat dissipation unit 410 in contact with the lamp substrate 210, and a lamp heat dissipation unit 410. And a device heat dissipation unit 420 connected to and in contact with the device substrate 220 to emit heat of the device substrate 220, wherein the lamp heat dissipation unit 410 and the device heat dissipation unit 420 are directly connected to each other. May be connected in contact.
  • the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be connected to each other.
  • the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be orthogonally connected.
  • the lamp heat dissipation unit 410 is provided with a lamp heat dissipation mounting unit 413, and the element heat dissipation unit 420 is engaged with the lamp heat dissipation mounting unit 413. 423 may be included.
  • the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 may be slide-fit on a plane to which the lamp heat dissipation portion 410 belongs.
  • the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 may be fitted in the orthogonal connection direction of the lamp heat dissipation portion 410 and the element heat dissipation portion 420. It may be.
  • the lamp substrate 210 and the element substrate 220 are connected between the connection substrate 230 between the, and the connection of the lamp radiator 410, A chamfered lamp heat dissipation cutoff 411 may be disposed on an end side of the 230.
  • the lamp substrate 210 includes a lamp substrate cutoff 211 formed inside the lamp substrate 210, the outer side of the connection point of the lamp substrate 210 and the connection substrate 230,
  • the lamp heat dissipation cutoff receiver 415 may be formed at the end of the lamp heat dissipation cutoff 411 toward the inside of the lamp heat dissipation unit 410 and form an accommodation of the connection substrate 230.
  • the unit housing 100 includes: a housing cover 120 that is mounted on a vehicle lamp base and a housing cover 120 that is engaged with the housing body 110 to form an inner space. It may include, and the housing cover 120 may include a cover substrate support rib 125 for stably supporting the unit substrate 200.
  • an LED lamp unit for a vehicle that ensures low cost, high efficiency and high reliability through a compact and simple structure.
  • the LED module using a conventional heat sink attached FPCB has a disadvantage in that a lot of labor is involved when assembling the LED PCB and the driver PCB is separated, the heat generated from the LED PCB was only a structure that emits only from the LED PCB, the present invention
  • the driver PCB is located at the center part of the LED PCB through the structure that connects the LED PCB and the driver PCB, and it is easy to fasten the driver PCB to the fixture by applying force to the upper LED PCB, and the heat generated from the LED PCB Can be transferred to the driver PCB to solve the heat problem that has an absolute impact on the life of the LED.
  • connection with the substrate may be made on a plane perpendicular to the longitudinal direction, thereby enabling a compact space arrangement.
  • a process cost reduction may be achieved through a structure formed through bending or punching of the strip, and a connection state reinforcing structure through connection and elastic support may be formed through a Y-shaped terminal structure.
  • connection state strengthening effect may be provided.
  • FIG. 1 and 2 are schematic perspective views showing the mounting state of the LED lamp unit for a vehicle according to an embodiment of the present invention.
  • 3 and 4 are schematic partial projection perspective views and partial perspective views of the LED lamp unit for a vehicle according to an embodiment of the present invention.
  • FIG. 5 is a schematic perspective view of a unit substrate and a unit heat dissipation unit of an LED lamp unit for a vehicle according to an embodiment of the present invention.
  • 6 and 7 are schematic plan and side views of a state before assembly of the LED lamp unit for a vehicle according to an embodiment of the present invention.
  • FIG. 8 is a schematic perspective view of a contact terminal unit and a connector terminal unit of the LED lamp unit for a vehicle according to an embodiment of the present invention.
  • 9 to 11 are schematic partial front and partial side views of the assembled connection state of the LED lamp unit for a vehicle according to an embodiment of the present invention.
  • FIG. 12 is a schematic state diagram of a rear surface of a vehicle lamp base to which a vehicle LED lamp unit is connected according to an embodiment of the present invention.
  • FIG. 13 is a schematic perspective view of a unit heat dissipation unit of a LED lamp unit for a vehicle according to an embodiment of the present invention.
  • FIG. 14 to 17 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIGS. 18 and 19 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • 20 and 21 are schematic partial perspective views of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 22 is a schematic partial cross-sectional view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 23 is a schematic perspective view of a LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 24 is a schematic exploded perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • 25 to 28 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • 29 is a schematic perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 30 is a schematic exploded perspective view of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 31 is a schematic partial perspective view of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
  • FIG. 32 is a schematic partial exploded perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
  • 33 and 34 are schematic plan and partially enlarged perspective views of a holding increment of the LED lamp unit for a vehicle according to another embodiment of the present invention.
  • 35 is a schematic perspective view of a modification of the substrate support unit of the LED lamp unit for a vehicle according to another embodiment of the present invention.
  • the vehicle LED lamp unit 10 of the present invention provides a lamp unit for generating light from the LED in the vehicle.
  • the vehicle LED lamp unit 10 is mounted to the vehicle lamp base 2.
  • the vehicle lamp base 2 is mounted on a vehicle.
  • the vehicle lamp base 2 has a vehicle lamp base cover 2a disposed on its front surface, and light generated from the vehicle LED lamp unit 10 described below is emitted through the vehicle lamp base cover 2a.
  • the vehicle lamp base 2 includes a mounting hole and a base terminal 20 to which the vehicle LED lamp unit 10 is inserted and mounted on a rear surface thereof.
  • Base terminal 20 is arranged in the form of two divided terminals on the outer periphery of the mounting hole, the vehicle LED lamp unit 10 is inserted into the mounting hole, the vehicle lamp base (2) to the front of the vehicle LED lamp unit 10
  • the connector terminal portion 600 connected to the corresponding position of the base terminal 20 formed on the back of the () is disposed.
  • the LED lamp unit 10 for a vehicle includes a unit housing 100, a unit substrate 200, and a unit lamp 300, and in some cases, a unit heat dissipation unit 400 and a contact terminal unit 500. ) May be further provided as an optional or as a whole, the vehicle LED lamp unit 10 according to the present embodiment will be described with a focus on the case having a unit heat dissipation unit 400 and the contact terminal unit 500, but the design specification Various choices and configurations are possible.
  • the unit housing 100 is at least partially inserted into the base terminal 20 side of the vehicle lamp base 2.
  • the unit housing 100 includes a housing body 110 and a housing cover 120, and the housing body 110 and the housing cover 120 are engaged with each other to form an interior space for accommodating different configurations.
  • the housing body 110 includes a main body 111, a body holder 113 is provided on an outer circumference of the main body 111, and includes a body accommodating part 115 that accommodates another configuration in the center.
  • the body holder 113 is configured to engage with the cover holder 123 corresponding to the outer circumference of the housing cover 120.
  • a body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is exposed to the outside, and ultimately, When the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, the vehicle LED lamp unit 10 is connected to the base terminal 20.
  • the front cover of the housing cover 120 may be provided with an optical display for smoothly transmitting a predetermined light or a cover transmission part 121 in which an icon or the like is disposed in some cases.
  • a cover substrate support rib 125 may be provided inside the housing cover 120 to stably support the unit substrate 200.
  • the unit board 200 is disposed in the unit housing 100 and makes electrical communication with the base terminal 20.
  • the unit board 200 is connected to the base through the connector terminal 600 to the contact terminal 500, which will be described later.
  • the terminal 20 may be connected to the side, and the base terminal 20 may be connected to an external power source so that the external power source may be transmitted to the LED lamp unit 10 for the vehicle as an electric signal.
  • the unit substrate 200 of the present invention may be implemented as a flexible substrate of an FPCB, or may be implemented as a conventional hard type printed circuit board. The present embodiment will be described with reference to a flexible printed circuit board.
  • the unit substrate 200 includes a lamp substrate 210 and an element substrate 220.
  • the unit lamp 300 is disposed on one surface of the lamp substrate 210.
  • the device substrate 220 is connected to the lamp substrate 210 side and the device for transmitting an electrical signal to the unit lamp 300 is disposed.
  • the lamp substrate 210 and the device substrate 220 are connected to the connection substrate 230 in the present embodiment, and the lamp substrate 210, the device substrate 220, and the connection substrate 230 are integrally formed. (See Figure 6).
  • the lamp substrate 210 and the element substrate 220 is disposed on a plane intersecting with each other, the lamp substrate 210 and the element substrate 220 is the same when disposed in the vehicle LED lamp unit 10 It is arranged on a plane that intersects each other without being located on a plane, that is, on a plane that is orthogonal in this embodiment (see FIG. 5).
  • connection board 230 connects the lamp substrate 210 attached to the lamp radiator 410 and the device substrate 220 attached to the element radiator 420.
  • the connection board 230 is a lamp radiator 410. Take a structure arranged along the sides and bottom of the).
  • a connector contact terminal 520 of the contact terminal part 500 described below is formed to form a contact connection state with the connector terminal part 600.
  • the unit lamp 300 is implemented with a predetermined LED element, in the present embodiment is a single number, but various configurations are possible according to the design specifications.
  • the unit lamp 300 includes an LED element disposed on one surface of the unit substrate 200.
  • unit heat dissipation unit 400 is in contact with the unit substrate 200 to release the heat generated by the unit lamp (300).
  • the unit heat dissipation unit 400 is limited to electrical communication but is formed of a non-conductive metal to allow heat dissipation.
  • the unit heat dissipation unit 400 includes a lamp heat dissipation unit 410 and an element heat dissipation unit 420.
  • the lamp radiator 410 is in contact with the lamp substrate 210
  • the device radiator 420 is connected to the lamp radiator 410 and is in contact with the device substrate 220 to emit heat from the device substrate 220. .
  • the lamp heat dissipating unit 410 and the element heat dissipating unit 420 are orthogonally arranged, and the lamp heat dissipating unit 410 may have various shapes, among which may have a disc shape.
  • the lamp substrate 210 may also have a circular shape.
  • the original (circular) shape of the lamp heat dissipation portion and the corresponding shape of the lamp substrate are preferable in terms of enhancing the manufacturability, but the shape of such a lamp heat dissipation portion / lamp substrate is not limited to the original (circular) shape. And various modifications are possible, such as may be made in the shape of substantially circular, oval and angular.
  • a predetermined adhesive part may be disposed on one surface of the lamp heat dissipating part 410 and the device heat dissipating part 420, and the lamp substrate 210 and the device substrate 220 may be bonded to each other.
  • the connector terminal portion 600 makes direct contact with the base terminal 20, and the connector terminal portion 600 forms an electrical connection by contact between the base terminal 20 and the unit board 200. At least one end of the connector terminal unit 600 is disposed to be drawn out of the unit housing 100.
  • a body connector through hole 117 is formed at an outer circumference of the main body 111 of the housing body 110, and at least one end of the connector terminal part 600 has a body connector through hole 117.
  • the contact terminal 500 transmits an electrical signal between the unit board 200 and the connector terminal 600.
  • the contact terminal unit 500 includes a board contact terminal 510 and a connector contact terminal 520, wherein the board contact terminal 510 is disposed on the unit board 200 and the connector contact terminal 520. ) Is connected to the connector terminal 600 and is connected to the substrate contact terminal 510.
  • the connector contact terminal 520 includes a connector contact terminal connector 521 and a connector contact terminal connector 522 (see FIG. 8).
  • the connector contact terminal 520 may be formed by bending a T-shaped conductive metal piece, and includes a connector contact terminal connector 521 and a connector contact terminal connector 522.
  • the connector contact terminal connecting portion 521 is disposed opposite to the substrate contact terminal 510 formed on the unit substrate 200 in the unit housing 100.
  • one end of the connector contact terminal connection part 522 is connected to the connector contact terminal connection part 521, and the other end is connected to the connector terminal part 600.
  • the connector terminal portion 600 is connected to the side of the connector contact terminal connection portion 522.
  • the connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed therebetween, with at least a portion of the unit heat dissipating portion 400 being elastically contacted inside the unit housing 100.
  • the connector contact terminal connecting portions 521 are formed at predetermined intervals.
  • the connector contact terminal connecting portion 521 disposed to face each other is disposed at a predetermined interval, and the predetermined interval is formed to a value smaller than the thickness of the element radiating portion 420 of the unit radiating portion 400. Is inserted and placed in position.
  • the unit heat dissipation unit 400 of the LED lamp unit 10 of the present invention can take a variety of configurations.
  • the unit substrate 200 is a flexible substrate (FPCB), the unit substrate 200 is connected to the lamp substrate 210, the lamp substrate 210 side on which the unit lamp 300 is disposed And an element substrate 220 on which an element for transmitting an electrical signal to the unit lamp 300 is disposed, wherein at least a portion of the lamp substrate 210 and the element substrate 220 are disposed on a plane crossing each other, and the unit
  • the radiator 400 is a lamp radiator 410 in contact with the lamp substrate 210 and an element connected to the lamp radiator 410 and in contact with the element substrate 220 to emit heat from the element substrate 220. It includes a heat dissipation unit 420, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 is directly contacted with each other.
  • the lamp radiator 410 and the device radiator 420 may have a structure in which they are connected to each other. That is, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be orthogonally connected, and the lamp heat dissipation unit 410 and the element heat dissipation unit 420 are orthogonally connected to the lamp heat dissipation unit 413 and the element heat dissipation mounting unit. 423, wherein the lamp heat dissipation mounting part 413 is provided at the lamp heat dissipation part 410, and the device heat dissipation mounting part 423 is formed at the device heat dissipation part 420 to be engaged with the lamp heat dissipation mounting part 413.
  • the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 may have a structure in which the lamp heat dissipation mounting unit 423 slides on a plane to which the lamp heat dissipation unit 410 belongs. . That is, the lamp heat dissipation mounting portion 413 has a slide line formed in a straight groove on the bottom surface of the lamp heat dissipation portion 410, and the element heat dissipation portion 420 has an element heat dissipation mounting portion 423 protrudingly formed on the upper end thereof, and device heat dissipation. The mounting portion 423 is inserted into the lamp heat dissipation mounting portion 413.
  • the engagement structure of the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 of the fitting method of the present invention may take a simple fitting method in the vertical direction in addition to the slide method.
  • the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 may be fitted in the orthogonal connection direction of the lamp heat dissipation unit 410 and the device heat dissipation unit 420. .
  • the lamp heat dissipation mounting unit 413 and the element heat dissipation mounting unit 423 may have a structure in which a protruding structure is fitted on a plane to which the lamp heat dissipation unit 410 belongs. That is, the lamp heat dissipation mounting part 413 has a recess structure formed on the bottom surface of the lamp heat dissipation part 410, the recessed part is formed on the bottom surface of the lamp heat dissipation part 410, and the element heat dissipation mounting part 423 is formed on the top of the lamp heat dissipation part 410, and the lamp heat dissipation part is formed.
  • the element heat dissipation part 420 is disposed in a direction perpendicular to the plane formed by the 410, and the element heat dissipation mounting part 423 is inserted into the lamp heat dissipation mounting part 413.
  • the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 take a structure in which two are spaced apart from each other, and each of the lamp heat dissipation mounting unit 413 and the element heat dissipation mounting unit 423 is fitted.
  • the unit heat dissipation unit 400 is attached to the unit substrate 200, to prevent damage due to the bending of the connection board 230 or when the unit heat dissipation unit 400 has a circular connection
  • a component for preventing peeling of the lamp substrate 210 and the device substrate 230 connected to the substrate 230 may be further provided. That is, the lamp substrate 210 and the element substrate 220 is connected between the connection substrate 230, the lamp heat dissipation chamfered on the end side of the lamp heat dissipation unit 410, the end of the connection substrate 230 is disposed Cutoff 411 is disposed.
  • the lamp heat dissipation cutoff 411 is formed at an end side of the lamp heat dissipation unit 410 to alleviate the bending angle of the unit substrate 200 or to cause the lamp heat dissipation unit 410 to peel off.
  • the lamp substrate 210 and the device substrate 220 may be undesirably separated from the device heat radiating part 420.
  • connection board 230 is disposed between the two element heat dissipation mounting portion 423 to take a configuration to be interposed between the lamp heat dissipation portion 410 and the element heat dissipation portion 420. It may be.
  • the unit lamp 300 disposed on the lamp substrate 210 and the element disposed on the element substrate 220 are disposed on the same surface of the unit substrate 200 (see FIG. 19), so that the connection substrate 230 It is disposed between the two element heat dissipation mounting portion 423 and the degradation due to aging that is fixed between the lamp heat dissipation portion 410 and the element heat dissipation portion 420 can be prevented.
  • the lamp substrate 210 to the device substrate 220 may be prevented from being separated from the lamp heat dissipation unit 410 and the device heat dissipation unit 420 due to the deterioration of adhesive performance due to heat generation.
  • vehicle LED lamp unit 10 of the present invention may further include a configuration for preventing the separation of the substrate from the heat radiating portion.
  • a lamp substrate cutoff 211 and a lamp heat dissipation cutoff receiver 415 may be further provided.
  • the lamp substrate cutoff 211 may be inside the lamp substrate 210, and a connection point between the lamp substrate 210 and the connection board 230 may be provided.
  • the lamp heat dissipation cutoff accommodating part 415 is formed at an outer side of the lamp heat dissipation cutoff 411 at an end side of the lamp heat dissipating cutoff 411 toward the inner side of the lamp heat dissipating part 410 and forms a housing of the connecting substrate 230.
  • the vehicle LED lamp unit 10 of the present invention unlike the contact terminal portion connected in the longitudinal direction of the vehicle LED lamp unit 10 in the longitudinal direction of the vehicle LED lamp unit 10
  • the structure which forms the connection state of the contact terminal part on a perpendicular plane may be taken.
  • the unit substrate 200 and the contact terminal unit 500 are connected and the unit heat dissipation unit 400 is excluded.
  • the same reference numerals are used for the same reference numerals, and redundant descriptions are omitted.
  • the vehicle LED lamp unit 10 includes a unit housing 100, a unit board 200, a unit lamp 300, a connector terminal unit 600, and a contact terminal.
  • the unit 500 includes a contact terminal unit 500 which transmits an electrical signal between the unit board 200 and the connector terminal unit 600, wherein the unit board 200 and the contact terminal unit 500 are unit boards. It is connected at the back side of 200.
  • the unit substrate 200 may be formed of a general printed circuit board.
  • the unit lamp 300 is disposed on one surface of the unit substrate 200.
  • a body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is exposed to the outside, and ultimately, When the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, the vehicle LED lamp unit 10 is connected to the base terminal 20.
  • a body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is externally formed. And ultimately, when the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, it is connected to the base terminal 20.
  • the connector terminal portion 600 makes direct contact with the base terminal 20, and the connector terminal portion 600 forms an electrical connection by contact between the base terminal 20 and the unit board 200.
  • At least one end of the connector terminal unit 600 is disposed to be drawn out of the unit housing 100. That is, as described above, a body connector through hole 117 is formed at an outer circumference of the main body 111 of the housing body 110, and at least one end of the connector terminal part 600 has a body connector through hole 117.
  • At least a portion of the connector terminal portion 600 exposed at least partially through the connector through hole 117 and the contact terminal portion 500 connected to the rear surface of the unit substrate 200 are integrally formed.
  • the contact terminal unit 500 includes a board contact terminal 510 and a connector contact terminal 520.
  • the board contact terminal 510 is disposed on the rear surface of one surface on which the unit lamp 300 of the unit board 200 is disposed, and the connector contact terminal 520 is connected to the connector terminal 600 and the unit board 200 It is connected to the substrate contact terminal 510 formed on the rear surface.
  • the connector contact terminal 520 and the connector terminal portion 600 may be integrally formed.
  • the connector terminal portion 600 includes a connector terminal base 601 and a connector terminal contact portion 603.
  • the connector terminal base 601 is inserted into the unit housing and connected with the connector contact terminal 520, and the connector terminal contact 603 is connected with the connector terminal base 601 and connects with the base terminal 20.
  • the connector contact terminal 520 and the connector terminal portion 600 may have a structure disposed at both ends of the conductive strip that is bent. That is, one long strip type conductive metal strip may be bent to form a Y-shaped conductive structure as shown in FIG. 24. In the case of bending one long strip type conductive metal strip, one long strip type Both ends of the conductive metal strip of the upper end of the upper side, respectively, the connector contact terminal 520 and the connector terminal portion 600 is formed with a fixed terminal contact protrusion 523 and a connector terminal contact protrusion 605 protrudingly formed Thus, the contact with the connector contact terminal 520 and the base terminal 20 formed on the back surface of the unit substrate 100 may be smooth.
  • the end of the unit housing is provided with a body connector through hole 117 through which the connector terminal contact portion 603 is protruded. Guidance or excessive bending of the connector terminal contact portion 603 of the terminal portion 600 may be prevented.
  • the unit housing accommodating part 112 is formed inside the unit housing 100, and the body substrate supporting part 114 is formed outside the unit housing accommodating part 112 to form a stable support state of the unit substrate 200. .
  • the unit heat dissipation unit that performs a heat dissipation function may be further provided in the unit housing accommodating part 112.
  • the body connector mounting part 119 is provided at the side of the unit housing accommodating part 112. That is, the unit housing 100 is provided with a body connector mounting portion 119, the body connector mounting portion 119 accommodates the connector terminal base 601 and limits the operation of the connector contact terminal 520.
  • the connector terminal base 601 is inserted into the inner surface of the unit housing accommodating part 112 and the body connector mounting part 119, and the connector contact terminal 520 and the connector terminal contact part disposed on the upper end of the connector terminal base 601. 603 is exposed to the upper end side, wherein the connector contact terminal 520 is disposed toward the inside of the unit substrate 200 and the connector terminal contact portion 603 is disposed toward the outside.
  • the connector contact terminal 520 and the connector terminal unit 600 implemented in the Y shape may be implemented in a manner of elastically supporting the unit substrate 200. That is, the body substrate support portion 114 forms a stable support state of the unit substrate, but the connector contact terminal 520 forms a Y-shaped one end portion to form a predetermined initial height step to elastically support the unit substrate. It is also possible to form a more accurate contact state with the substrate contact terminal 510 formed on the back of the (200).
  • the vehicle LED lamp unit 10 of the present invention may have a structure in which the contact terminal portion is excluded.
  • the same components and substantially the same components as in the previous embodiment are given the same names and reference numbers, and duplicate descriptions are omitted.
  • the vehicle LED lamp unit 10 includes a unit housing 100, a unit board 200, a unit lamp 300, and a connector terminal unit 600.
  • the terminal unit 600 may be disposed on the unit substrate 200, disposed on the same surface as the unit lamp 300, and the connector terminal unit 600 may be formed of solder.
  • the unit substrate 200 includes a lamp substrate 210 in which the unit lamp 300 is disposed, and an element substrate 220 connected to the lamp substrate 210 and configured to transfer an electric signal to the unit lamp 300.
  • the lamp substrate 210 and the element substrate 220 are integrally formed and disposed on the same plane as each other. As shown in FIG. 31, the lamp substrate 210 and the device substrate 220 are integrally formed, and the device substrate 220 is disposed to face 180 degrees on the outer circumference of the circular lamp substrate 210.
  • the connector terminal 600 is disposed on the device substrate 220.
  • the end of the unit housing is provided with a body connector through hole 117, which forms a position where the element substrate 220 is disposed unlike the case in which the connector terminal portion in the previous embodiment protrudes.
  • the substrate support part 700 is provided below the unit substrate 200.
  • the substrate support part 700 is disposed inside the unit housing 100 to elastically support the unit substrate 200.
  • the substrate support part 700 has a Y-shape, which is similar in structure to the Y-shaped contact terminal part and the connector terminal part in the previous embodiment in terms of the functional support for elastically supporting the unit substrate 200.
  • the substrate support part 700 includes a substrate support base 730 and substrate support contacts 710 and 720.
  • the substrate support base 730 is inserted into the unit housing 100, and the substrate support contacts 710 and 720 are connected to the substrate support base 730 and support the rear surface of the unit substrate 200.
  • the unit housing accommodating part 112 is formed inside the unit housing 100, and the body substrate supporting part 114 is formed on the outer side of the unit housing accommodating part 112 to form the unit substrate 200. Form a stable support state.
  • the unit heat dissipation unit that performs a heat dissipation function may be further provided in the unit housing accommodating part 112 as described above.
  • the unit housing 100 is provided with a body connector mounting portion 119, which accommodates and positions the substrate support base 730 and restricts the operation of the substrate support contacts 710 and 720.
  • the substrate support base 730 is inserted into the inner surface of the unit housing accommodating part 112 and the body connector mounting part 119, and the substrate support contact parts 710 and 720 disposed on the upper end of the substrate support base 730 are exposed to the upper end side.
  • One of the substrate support contacts 710 and 720 is disposed toward the inside of the unit substrate 200 and the other of the substrate support contacts 710 and 720 is disposed toward the outside.
  • the substrate support contacts 710 and 720 implemented in the Y shape may be implemented in a manner of elastically supporting the unit substrate 200. That is, the body substrate support part 114 forms a stable support state of the unit substrate, but the substrate support contact parts 710 and 720 form Y-shaped ends to form a predetermined initial height step, thereby forming the unit substrate 200 as the base terminal. It is also possible to form a more accurate contact state between the connector terminal portion 600 and the base terminal 20 by the elastic support to the (20) side.
  • the substrate support base 730 and the substrate support contacts 710 and 720 include bent strips.
  • the substrate support base 730 and the substrate support contact portions 710 and 720 may have structures arranged at both ends of the bent strip.
  • one long strip type non-conductive metal band may be bent to form a Y-shaped non-conductive structure as shown in FIG. 30.
  • One long strip type non-conductive metal band may be bent. Both ends of the elongated strip-like metal strip may form top ends of the substrate support contacts 710 and 720, respectively.
  • the non-conductive strip may be made of a configuration through a punching process. That is, the substrate support base 730 and the substrate support contacts 710 and 720 may be punched and bent into strips. As shown in FIG. 35, at least one of the substrate support contact portions 710 and 720 may be formed by punching and bending in the opposite direction to other portions to form a Y-shaped structure. This makes it possible to manufacture components more concisely and quickly by eliminating complicated bending structures, thereby achieving process time or manufacturing cost reduction.
  • the unit housing 100 may further include a component for reinforcing a connection state between the connector terminal 600 and the base terminal 20 implemented with solder.
  • the outer periphery of the) may be further provided with a holding increment 800 is formed along one circumference toward the vehicle lamp base (2) having a height that changes in the longitudinal direction of the vehicle LED lamp unit, the holding increment The 800 is disposed in the unit housing 100 and protrudes toward the rear surface of the vehicle lamp base.
  • the unit housing 100 includes a housing body 110 including a circumferential protruding portion, and the holding increment 800 is an inclined formation structure having different heights in the circumferential direction.
  • the solder in the process of mounting the vehicle LED lamp unit 10 to the vehicle lamp base 2 through the holding increment 800 of the inclined formation structure having a height difference is implemented to form a contact failure state due to the formation of the gap due to the deformation of the solder It is also possible to prevent or minimize the formation of clearance between the unit housing and the rear surface of the vehicle lamp base 2 by using the fastener 800 so as to form an accurate connection state of the connector terminal 600 and the base terminal 20.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

The present invention relates to a vehicle LED lamp unit (10) which attaches to a vehicle lamp base (2), which attaches to a vehicle and is provided with a base terminal (20) on the rear, so as to establish contact with the base terminal (20). The vehicle LED lamp unit (10) comprises: a unit housing (100) having at least a part thereof inserted into the base terminal (20); a unit substrate (200) arranged on the unit housing (100) and establishing an electrical connection with the base terminal (20); a unit lamp (300) comprising an LED element arranged on one side of the unit substrate (200); and a unit heat-dissipation unit (400), in contact with the unit substrate (200), for dissipating heat generated in the unit lamp (300).

Description

차량용 엘이디 램프 유니트LED Lamp Unit for Vehicle
본 발명은 차량에 장착되는 램프 유니트로서, 제조 비용을 최소화하고 보다 내구성 및 감성을 증진시킬 수 있는 램프 유니트에 관한 것이다.The present invention relates to a lamp unit to be mounted on a vehicle, which can minimize manufacturing costs and improve durability and sensitivity.
자동차용 램프, 예를 들어 차량용 룸 램프는 단순하게 차량 내부에 조명을 제공해 주는 형태로서, 차량의 내구성 확보를 위하여 차량에는 종래의 할로겐 등의 벌브 타입 등의 전형적 램프가 채택되었다.Automotive lamps, for example, vehicle room lamps simply provide lighting inside the vehicle, and in order to ensure durability of the vehicle, a typical lamp such as a bulb type such as a halogen is adopted in the vehicle.
하지만, 차량 운전자의 체감적 만족감에 대한 요구가 증대되어 LED 램프에 대한 수요가 증대되었다.However, the demand for bodily satisfaction of the vehicle driver has increased, and the demand for the LED lamp has increased.
이를 위하여, 종래에는 Bulb 전구와의 호환을 위하여 Bulb 전구 소켓형상의 LED Module을 구성하였다. 또한, 광원(LED) 실장을 위한 PCB와 Driver 구성을 위한 PCB를 체결한 형상으로 이루어졌다.To this end, the LED module of the bulb bulb socket shape is conventionally configured for compatibility with the bulb bulb. In addition, it consists of the shape of the PCB for mounting the light source (LED) and the PCB for the driver configuration.
하지만, 이러한 구조는 광원(LED)이 실장된 PCB와 Driver가 구성된 PCB는 서로 분리된 형태였으며, 연결을 위하여 커넥터를 필요로 하였고, 커넥터는 PCB의 사이즈 문제로 인하여 수작업으로 부착되었으며, 이에 따라 광원(LED) PCB와 Driver PCB간 정렬 문제가 발생하였고, 조립공정상 불량이 발생하는 경우가 있었다. 또한, 램프 접점과의 연결을 위한 터미널 PIN이 필요하였으며, 터미널 PIN과 PCB와의 연결을 위한 Soldering 공정이 필요하였다.However, in this structure, the PCB on which the light source (LED) is mounted and the PCB composed of the driver were separated from each other, and a connector was required for connection, and the connector was manually attached due to the size problem of the PCB. (LED) There was a problem of alignment between PCB and driver PCB, and there was a problem in assembly process. In addition, a terminal PIN was required to connect the lamp contacts, and a soldering process was needed to connect the terminal PIN to the PCB.
즉, 조립 공정이 복잡하고 원가가 증대되는 문제점이 수반되었다.In other words, the assembly process is complicated and the cost increases.
본 발명은 종래 기술의 문제점을 해결하기 위해 발명한 것으로서, 본 발명의 목적은 기존 터미널 연결방식이 아닌 직접 접촉 방식 구조 개선하고, 기구물 조립 공정상 발생 가능한 불량 구조 개선을 이루는 차량용 엘이디 램프 유니트를 제공하는 것이다.The present invention has been made to solve the problems of the prior art, the object of the present invention is to improve the structure of the direct contact method rather than the existing terminal connection method, and to provide a vehicle LED lamp unit that achieves a poor structure that can occur in the assembly process of the apparatus It is.
본 발명의 일면에 따르면, 본 발명은 차량에 장착되고 배면에 배치되는 베이스 터미널(20)을 갖는 차량용 램프 베이스(2)에 상기 베이스 터미널(20)과 접속되도록 장착되는 차량용 엘이디 램프 유니트(10)로서, 상기 차량용 엘이디 램프 유니트(10)는: 상기 베이스 터미널(20) 측으로 적어도 일부가 삽입 배치되는 유니트 하우징(100)과, 상기 유니트 하우징(100)에 배치되고 상기 베이스 터미널(20)과 전기적 소통을 이루는 유니트 기판(200)과, 상기 유니트 기판(200)의 일면 상에 배치되는 LED 소자를 포함하는 유니트 램프(300)와, 상기 유니트 기판(200)와 접촉하여 상기 유니트 램프(300)에서 발생된 열을 방출하는 유니트 방열부(400)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10)를 제공한다.According to one aspect of the invention, the invention is a vehicle LED lamp unit 10 mounted to be connected to the base terminal 20 to the vehicle lamp base (2) having a base terminal 20 mounted on the vehicle and disposed on the rear The LED lamp unit 10 may include: a unit housing 100 at least partially inserted into the base terminal 20, and disposed in the unit housing 100 and in electrical communication with the base terminal 20. A unit lamp 300 including a unit substrate 200, an LED element disposed on one surface of the unit substrate 200, and generated from the unit lamp 300 in contact with the unit substrate 200. It provides a LED lamp unit 10 for a vehicle comprising a unit heat dissipation unit 400 for dissipating the heat.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 유니트 기판(200)은 플렉서블 기판(FPCB)이고, 상기 유니트 기판(200)은: 상기 유니트 램프(300)가 배치되는 램프 기판(210)과, 상기 램프 기판(210) 측과 연결되고 상기 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하고, 상기 램프 기판(210)과 상기 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치될 수도 있다.In the vehicle LED lamp unit 10, the unit substrate 200 is a flexible substrate (FPCB), and the unit substrate 200 includes: a lamp substrate 210 on which the unit lamp 300 is disposed; A device substrate 220 connected to a lamp substrate 210 side and configured to transmit an electrical signal to the unit lamp 300, and including at least a portion of the lamp substrate 210 and the device substrate 220. May be disposed on planes intersecting with each other.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 유니트 방열부(400)는: 상기 램프 기판(210)과 접촉하는 램프 방열부(410)와, 상기 램프 방열부(410)와 연결되고 상기 소자 기판(220)과 접촉하여 상기 소자 기판(220)의 열을 방출하는 소자 방열부(420)를 포함할 수도 있다.In the vehicle LED lamp unit 10, the unit heat dissipation unit 400 is: a lamp heat dissipation unit 410 in contact with the lamp substrate 210, the lamp heat dissipation unit 410 is connected to the device substrate It may also include a device heat dissipation unit 420 in contact with the 220 to release the heat of the device substrate 220.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 베이스 터미널(20)과 상기 유니트 기판(200) 사이에는 접촉에 의한 전기적 접속을 이루고 적어도 일부의 일단이 상기 유니트 하우징의 외측으로 인출 배치되는 커넥터 터미널부(600)가 구비되고, 상기 유니트 기판(200)과 상기 커넥터 터미널부(600) 사이에는 전기적 신호를 전달하는 컨택 터미널부(500)가 더 구비될 수도 있다.In the LED lamp unit 10 for a vehicle, a connector terminal portion in which an electrical connection is made between the base terminal 20 and the unit board 200 by contact and at least one end thereof is drawn out to the outside of the unit housing. 600 may be provided, and a contact terminal 500 may be further provided between the unit board 200 and the connector terminal 600 to transmit an electrical signal.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 컨택 터미널부(500)는: 상기 유니트 기판(200)에 배치되는 기판 컨택 터미널(510)과, 상기 커넥터 터미널부(600)와 연결되고 상기 기판 컨택 터미널(510)과 접속되는 커넥터 컨택 터미널(520)을 구비할 수도 있다.In the vehicle LED lamp unit 10, the contact terminal unit 500 may include: a substrate contact terminal 510 disposed on the unit substrate 200, the connector terminal unit 600, and the substrate contact unit. It may also have a connector contact terminal 520 connected to the terminal 510.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 커넥터 컨택 터미널(520)은: 상기 유니트 하우징(100)의 내부에 상기 기판 컨택 터미널(510)에 대향 배치되는 커넥터 컨택 터미널 접속부(521)와, 일단은 상기 커넥터 컨택 터미널 접속부(521)와 연결되고, 타단은 상기 커넥터 터미널부(600)에 연결되는 커넥터 컨택 터미널 연결부(522)를 포함할 수도 있다.In the vehicle LED lamp unit 10, the connector contact terminal 520 may include: a connector contact terminal connection part 521 disposed opposite to the board contact terminal 510 in the unit housing 100, and one end thereof; May be connected to the connector contact terminal connecting portion 521, and the other end thereof may include a connector contact terminal connecting portion 522 connected to the connector terminal portion 600.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 커넥터 컨택 터미널 접속부(521)가 상기 커넥터 컨택 터미널 연결부(522)를 사이에 두고 쌍을 이루어 배치되어, 사이에 상기 유니트 방열부(400)의 적어도 일부를 탄성 접촉 상태를 형성할 수도 있다.In the LED lamp unit 10 for the vehicle, the connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed therebetween, and at least a part of the unit heat dissipating portion 400 therebetween. It is also possible to form an elastic contact state.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 커넥터 터미널부(600)는 상기 커넥터 컨택 터미널 연결부(522)의 측부에 연결될 수도 있다.In the vehicle LED lamp unit 10, the connector terminal unit 600 may be connected to the side of the connector contact terminal connection unit 522.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열부(410)와 상기 소자 방열부(420)는 직교 배치되고, 상기 램프 방열부(410)는 원형, 원판, 각형 형상 중 적어도 하나의 형상을 구비할 수도 있다.In the LED lamp unit 10 for the vehicle, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 are orthogonally disposed, and the lamp heat dissipation unit 410 is at least one of a circular, disc, and square shapes. It may be provided.
본 발명의 다른 일면에 따르면, 본 발명은 차량에 장착되고 배면에 배치되는 베이스 터미널(20)을 갖는 차량용 램프 베이스(2)에 상기 베이스 터미널(20)과 접속되도록 장착되는 차량용 엘이디 램프 유니트(10)로서, 상기 차량용 엘이디 램프 유니트(10)는: 상기 베이스 터미널(20) 측으로 적어도 일부가 삽입 배치되는 유니트 하우징(100)과, 상기 유니트 하우징(100)에 배치되고 상기 베이스 터미널(20)과 전기적 소통을 이루는 유니트 기판(200)과, 상기 유니트 기판(200)의 일면 상에 배치되는 LED 소자를 포함하는 유니트 램프(300)와, 상기 유니트 기판(200)와 접촉하여 상기 유니트 램프(300)에서 발생된 열을 방출하는 유니트 방열부(400)를 포함하고, 상기 유니트 기판(200)은 플렉서블 기판(FPCB)이고, 상기 유니트 기판(200)은: 상기 유니트 램프(300)가 배치되는 램프 기판(210)과, 상기 램프 기판(210) 측과 연결되고 상기 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하고, 상기 램프 기판(210)과 상기 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치되고, 상기 유니트 방열부(400)는: 상기 램프 기판(210)과 접촉하는 램프 방열부(410)와, 상기 램프 방열부(410)와 연결되고 상기 소자 기판(220)과 접촉하여 상기 소자 기판(220)의 열을 방출하는 소자 방열부(420)를 포함하고, 상기 램프 방열부(410)와 상기 소자 방열부(420)는 서로 직접적으로 접촉 연결될 수도 있다.According to another aspect of the invention, the invention is a vehicle LED lamp unit 10 mounted to be connected to the base terminal 20 to the vehicle lamp base (2) having a base terminal 20 mounted on the vehicle and disposed on the rear The vehicle LED lamp unit 10 may include: a unit housing 100 at least partially inserted into the base terminal 20, and disposed in the unit housing 100 and electrically connected to the base terminal 20. A unit lamp 300 including a unit substrate 200 to communicate with each other, an LED element disposed on one surface of the unit substrate 200, and the unit lamp 300 in contact with the unit substrate 200. And a unit heat dissipation unit 400 for dissipating the generated heat, wherein the unit substrate 200 is a flexible substrate FPCB, and the unit substrate 200 is a lamp substrate on which the unit lamp 300 is disposed. And an element substrate 220 connected to the lamp substrate 210 side and having an element for transmitting an electrical signal to the unit lamp 300, wherein the lamp substrate 210 and the element substrate are disposed. At least a portion of the 220 is disposed on a plane intersecting with each other, and the unit heat dissipation unit 400 includes: a lamp heat dissipation unit 410 in contact with the lamp substrate 210, and a lamp heat dissipation unit 410. And a device heat dissipation unit 420 connected to and in contact with the device substrate 220 to emit heat of the device substrate 220, wherein the lamp heat dissipation unit 410 and the device heat dissipation unit 420 are directly connected to each other. May be connected in contact.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열부(410)와 상기 소자 방열부(420)는 상호 맞춤 연결될 수도 있다.In the vehicle LED lamp unit 10, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be connected to each other.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열부(410)와 상기 소자 방열부(420)는 직교 연결될 수도 있다.In the vehicle LED lamp unit 10, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be orthogonally connected.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열부(410)에는 램프 방열 장착부(413)를 구비하고, 상기 소자 방열부(420)에는 상기 램프 방열 장착부(413)와 맞물림되는 소자 방열 장착부(423)를 포함할 수도 있다.In the LED lamp unit 10 for a vehicle, the lamp heat dissipation unit 410 is provided with a lamp heat dissipation mounting unit 413, and the element heat dissipation unit 420 is engaged with the lamp heat dissipation mounting unit 413. 423 may be included.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열 장착부(413)와 상기 소자 방열 장착부(423)는 상기 램프 방열부(410)가 속하는 평면 상에 슬라이드 끼워 맞춤될 수도 있다.In the vehicle LED lamp unit 10, the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 may be slide-fit on a plane to which the lamp heat dissipation portion 410 belongs.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 방열 장착부(413)와 상기 소자 방열 장착부(423)는 상기 램프 방열부(410)와 상기 소자 방열부(420)의 직교 연결 방향으로 끼워 맞춤될 수도 있다.In the vehicle LED lamp unit 10, the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 may be fitted in the orthogonal connection direction of the lamp heat dissipation portion 410 and the element heat dissipation portion 420. It may be.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 기판(210)과 상기 소자 기판(220)은 사이에 연결 기판(230)을 통하여 연결되고, 상기 램프 방열부(410)의, 상기 연결 기판(230)의 배치되는 단부 측에는 챔퍼링되는 램프 방열 컷오프(411)가 배치될 수도 있다.In the LED lamp unit 10 for the vehicle, the lamp substrate 210 and the element substrate 220 are connected between the connection substrate 230 between the, and the connection of the lamp radiator 410, A chamfered lamp heat dissipation cutoff 411 may be disposed on an end side of the 230.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 램프 기판(210) 내측으로, 상기 램프 기판(210)과 상기 연결 기판(230)의 연결 지점의 외측에 형성되는 램프 기판 컷오프(211)를 포함하고, 상기 램프 방열 컷오프(411)의 단부 측에는 상기 램프 방열부(410)의 내측을 향하여 돌입 형성되고 상기 연결 기판(230)의 수용을 형성하는 램프 방열 컷오프 수용부(415)를 포함할 수도 있다.In the vehicle LED lamp unit 10, the lamp substrate 210 includes a lamp substrate cutoff 211 formed inside the lamp substrate 210, the outer side of the connection point of the lamp substrate 210 and the connection substrate 230, The lamp heat dissipation cutoff receiver 415 may be formed at the end of the lamp heat dissipation cutoff 411 toward the inside of the lamp heat dissipation unit 410 and form an accommodation of the connection substrate 230.
상기 차량용 엘이디 램프 유니트(10)에 있어서, 상기 유니트 하우징(100)은: 차량 램프 베이스에 장착되는 하우징 바디(110)와 상기 하우징 바디(110)와 맞물리어 내부 공간을 형성하는 하우징 커버(120)를 포함하고, 상기 하우징 커버(120)의 내부에는 상기 유니트 기판(200)을 안정적으로 지지하는 커버 기판 지지 리브(125)을 구비할 수도 있다.In the LED lamp unit 10 for a vehicle, the unit housing 100 includes: a housing cover 120 that is mounted on a vehicle lamp base and a housing cover 120 that is engaged with the housing body 110 to form an inner space. It may include, and the housing cover 120 may include a cover substrate support rib 125 for stably supporting the unit substrate 200.
본 발명에 의하면, 컴팩트하고 간단한 구조를 통하여 저비용 고효율 고신뢰성을 확보하는 차량용 엘이디 램프 유니트를 제공할 수 있다.According to the present invention, it is possible to provide an LED lamp unit for a vehicle that ensures low cost, high efficiency and high reliability through a compact and simple structure.
또한, 기존 별도의 터미널 연결방식이 아닌 직접 접촉 방식 구조 개선하고, 기구물 조립 공정상 발생 가능한 불량 구조 개선시킬 수 있다.In addition, it is possible to improve the structure of the direct contact method instead of the existing terminal connection method, and improve the defective structure that may occur in the assembly process.
또한, 종래의 방열판 부착형 FPCB를 이용한 LED Module은 LED PCB와 Driver PCB가 분리된 구조로 조립 시 공수가 많이 들어가는 단점이 있으며, LED PCB에서 발생하는 열은 LED PCB에서만 방출 하는 구조였으나, 본 발명은 LED PCB와 Driver PCB를 체결하는 구조를 통하여 Driver PCB가 LED PCB의 중앙부분에 위치하게 되고, 상단 LED PCB에 힘을 가하여 Driver PCB를 기구물에 체결하는 것이 용이하게 되고, LED PCB에서 발생하는 열을 Driver PCB에 전달이 가능하여 LED의 수명에 절대적인 영향을 주는 발열 문제를 해결할 수도 있다.In addition, the LED module using a conventional heat sink attached FPCB has a disadvantage in that a lot of labor is involved when assembling the LED PCB and the driver PCB is separated, the heat generated from the LED PCB was only a structure that emits only from the LED PCB, the present invention The driver PCB is located at the center part of the LED PCB through the structure that connects the LED PCB and the driver PCB, and it is easy to fasten the driver PCB to the fixture by applying force to the upper LED PCB, and the heat generated from the LED PCB Can be transferred to the driver PCB to solve the heat problem that has an absolute impact on the life of the LED.
또한, 기판과의 접속이 길이 방향에 수직한 평면 상에서 이루어지도록 하여 컴팩트한 공간 배치를 가능하게 할 수도 있다.In addition, the connection with the substrate may be made on a plane perpendicular to the longitudinal direction, thereby enabling a compact space arrangement.
또한, 스트립의 절곡 내지 펀칭 등을 통하여 형성되는 구조를 통하여 공정 원가 절감을 이룰 수도 있고, Y자 형상의 터미널 구조를 통하여 접속 및 탄성 지지를 통한 접속 상태 강화 구조를 형성할 수도 있다.In addition, a process cost reduction may be achieved through a structure formed through bending or punching of the strip, and a connection state reinforcing structure through connection and elastic support may be formed through a Y-shaped terminal structure.
또한, 홀딩 인크리먼트를 통하여 땜납으로 형성되는 커넥터 터미널을 구비하는 경우 접속 상태 강화 효과를 제공할 수도 있다.In addition, when the connector terminal is formed of solder through the holding increment, the connection state strengthening effect may be provided.
도 1 및 도 2는 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 장착 상태를 나탸내는 개략적인 사시도이다.1 and 2 are schematic perspective views showing the mounting state of the LED lamp unit for a vehicle according to an embodiment of the present invention.
도 3 및 도 4는 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 투영 사시도 및 부분 사시도이다.3 and 4 are schematic partial projection perspective views and partial perspective views of the LED lamp unit for a vehicle according to an embodiment of the present invention.
도 5는 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 유니트 기판 및 유니트 방열부의 개략적인 사시도이다.5 is a schematic perspective view of a unit substrate and a unit heat dissipation unit of an LED lamp unit for a vehicle according to an embodiment of the present invention.
도 6 및 도 7은 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 조립 전 상태의 개략적인 평면도 및 측면도이다.6 and 7 are schematic plan and side views of a state before assembly of the LED lamp unit for a vehicle according to an embodiment of the present invention.
도 8은 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 컨택 터미널부 및 커넥터 터미널부의 개략적인 사시도이다.8 is a schematic perspective view of a contact terminal unit and a connector terminal unit of the LED lamp unit for a vehicle according to an embodiment of the present invention.
도 9 내지 도 11은 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 조립 접속 상태의 개략적인 부분 정면도 및 부분 측면도이다.9 to 11 are schematic partial front and partial side views of the assembled connection state of the LED lamp unit for a vehicle according to an embodiment of the present invention.
도 12는 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트가 접속되는 차량용 램프 베이스의 배면의 개략적인 상태도이다.12 is a schematic state diagram of a rear surface of a vehicle lamp base to which a vehicle LED lamp unit is connected according to an embodiment of the present invention.
도 13은 본 발명의 일실시예에 따른 차량용 엘이디 램프 유니트의 유니트 방열부의 개략적인 사시도이다.13 is a schematic perspective view of a unit heat dissipation unit of a LED lamp unit for a vehicle according to an embodiment of the present invention.
도 14 내지 도 17은 본 발명의 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 사시도이다.14 to 17 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 18 및 도 19는 본 발명의 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 사시도이다.18 and 19 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 20 및 도 21은 본 발명의 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 변형예의 개략적인 부분 사시도이다.20 and 21 are schematic partial perspective views of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
도 22는 본 발명의 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 단면도이다.22 is a schematic partial cross-sectional view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 23은 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 사시도이다.23 is a schematic perspective view of a LED lamp unit for a vehicle according to another embodiment of the present invention.
도 24는 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 분해 사시도이다.24 is a schematic exploded perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 25 내지 도 28은 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 사시도이다.25 to 28 are schematic partial perspective views of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 29는 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 사시도이다.29 is a schematic perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 30은 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 변형예의 개략적인 분해 사시도이다.30 is a schematic exploded perspective view of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
도 31은 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 변형예의 개략적인 부분 사시도이다.31 is a schematic partial perspective view of a modification of the LED lamp unit for a vehicle according to another embodiment of the present invention.
도 32는 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 개략적인 부분 분해 사시도이다.32 is a schematic partial exploded perspective view of an LED lamp unit for a vehicle according to another embodiment of the present invention.
도 33 및 도 34는 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 홀딩 인크리먼트의 개략적인 평면도 및 부분 확대 사시도이다.33 and 34 are schematic plan and partially enlarged perspective views of a holding increment of the LED lamp unit for a vehicle according to another embodiment of the present invention.
도 35는 본 발명의 또 다른 일실시예에 따른 차량용 엘이디 램프 유니트의 기판 서포트부의 변형예에 대한 개략적인 사시도이다.35 is a schematic perspective view of a modification of the substrate support unit of the LED lamp unit for a vehicle according to another embodiment of the present invention.
이하, 본 발명의 바람직한 실시예를 첨부된 도면들을 참조하여 상세히 설명한다. 우선 각 도면의 구성요소들에 참조부호를 부가함에 있어서, 동일한 구성요소들에 대해서는 비록 다른 도면상에 표시되더라도 가능한 한 동일한 부호를 가지도록 하고 있음에 유의해야 한다. 또한, 본 발명을 설명함에 있어, 관련된 공지 구성 또는 기능에 대한 구체적인 설명이 본 발명의 요지를 흐릴 수 있다고 판단되는 경우에는 그 상세한 설명은 생략한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related well-known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.
본 발명의 차량용 엘이디 램프 유니트(10)는 차량에 엘이디로부터 빛을 생성 제공하는 램프 유니트를 제공한다.The vehicle LED lamp unit 10 of the present invention provides a lamp unit for generating light from the LED in the vehicle.
보다 구체적으로, 차량용 엘이디 램프 유니트(10)는 차량용 램프 베이스(2)에 장착된다. 차량용 램프 베이스(2)는 차량에 장착된다. 차량용 램프 베이스(2)는 전면에 차량용 램프 베이스 커버(2a)가 배치되고, 하기되는 차량용 엘이디 램프 유니트(10)로부터 생성되는 빛은 차량용 램프 베이스 커버(2a)를 통하여 출사된다.More specifically, the vehicle LED lamp unit 10 is mounted to the vehicle lamp base 2. The vehicle lamp base 2 is mounted on a vehicle. The vehicle lamp base 2 has a vehicle lamp base cover 2a disposed on its front surface, and light generated from the vehicle LED lamp unit 10 described below is emitted through the vehicle lamp base cover 2a.
본 실시에 따른 차량용 램프 베이스(2)는 배면에 차량용 엘이디 램프 유니트(10)가 삽입 장착되는 장착구 및 베이스 터미널(20)을 구비한다. 베이스 터미널(20)은 장착구의 외주에 두 개의 분할된 단자 형태로 배치되는데, 이의 장착구에 차량용 엘이디 램프 유니트(10)가 삽입되고, 차량용 엘이디 램프 유니트(10)의 전면으로 차량용 램프 베이스(2)의 배면에 형성된 베이스 터미널(20)의 대응되는 위치에 접속되는 커넥터 터미널부(600)가 배치된다.The vehicle lamp base 2 according to the present embodiment includes a mounting hole and a base terminal 20 to which the vehicle LED lamp unit 10 is inserted and mounted on a rear surface thereof. Base terminal 20 is arranged in the form of two divided terminals on the outer periphery of the mounting hole, the vehicle LED lamp unit 10 is inserted into the mounting hole, the vehicle lamp base (2) to the front of the vehicle LED lamp unit 10 The connector terminal portion 600 connected to the corresponding position of the base terminal 20 formed on the back of the () is disposed.
본 발명에 따른 차량용 엘이디 램프 유니트(10)는 유니트 하우징(100)과, 유니트 기판(200)과, 유니트 램프(300)을 구비하고, 경우에 따라 유니트 방열부(400)와 컨택 터미널부(500)를 선택적으로 내지 전체적으로 더 구비할 수도 있는데, 본 실시예에 따른 차량용 엘이디 램프 유니트(10)는 유니트 방열부(400)와 컨택 터미널부(500)를 구비하는 경우를 중심으로 기술하나 설계 사양에 따라 다양한 선택 및 구성이 가능하다.The LED lamp unit 10 for a vehicle according to the present invention includes a unit housing 100, a unit substrate 200, and a unit lamp 300, and in some cases, a unit heat dissipation unit 400 and a contact terminal unit 500. ) May be further provided as an optional or as a whole, the vehicle LED lamp unit 10 according to the present embodiment will be described with a focus on the case having a unit heat dissipation unit 400 and the contact terminal unit 500, but the design specification Various choices and configurations are possible.
먼저, 유니트 하우징(100)은 차량용 램프 베이스(2)의 베이스 터미널(20) 측으로 적어도 일부가 삽입 배치된다.First, the unit housing 100 is at least partially inserted into the base terminal 20 side of the vehicle lamp base 2.
유니트 하우징(100)은 하우징 바디(110)와 하우징 커버(120)를 포함하고, 하우징 바디(110)와 하우징 커버(120)는 각각 맞물리어 다른 구성을 수용하는 내부 공간을 형성한다.The unit housing 100 includes a housing body 110 and a housing cover 120, and the housing body 110 and the housing cover 120 are engaged with each other to form an interior space for accommodating different configurations.
하우징 바디(110)는 메인 바디(111)를 구비하고, 메인 바디(111)의 외주에 바디 홀더(113)가 구비되고, 중앙에 다른 구성을 수용하는 바디 수용부(115)를 포함한다. 바디 홀더(113)는 하우징 커버(120)의 외주에 대응하는 커버 홀더(123)과 맞물리는 구성을 취한다.The housing body 110 includes a main body 111, a body holder 113 is provided on an outer circumference of the main body 111, and includes a body accommodating part 115 that accommodates another configuration in the center. The body holder 113 is configured to engage with the cover holder 123 corresponding to the outer circumference of the housing cover 120.
하우징 바디(110)의 메인 바디(111)의 외주에는 바디 커넥터 관통구(117)가 형성되는데, 바디 커넥터 관통구(117)를 통하여 하기되는 커넥터 터미널의 적어도 일부 단부가 외부로 노출되고, 궁극적으로 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착시키는 경우 베이스 터미널(20)과 접속되도록 한다.A body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is exposed to the outside, and ultimately, When the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, the vehicle LED lamp unit 10 is connected to the base terminal 20.
하우징 커버(120)의 전단에는 소정의 빛의 전달을 원활하게 하는 광학표시나 경우에 따라 아이콘 등이 배치되는 커버 전달부(121)가 구비될 수도 있다. 하우징 커버(120)의 내부에는 커버 기판 지지 리브(125)가 구비되어 유니트 기판(200)을 안정적으로 지지하는 구성을 취할 수도 있다.The front cover of the housing cover 120 may be provided with an optical display for smoothly transmitting a predetermined light or a cover transmission part 121 in which an icon or the like is disposed in some cases. A cover substrate support rib 125 may be provided inside the housing cover 120 to stably support the unit substrate 200.
유니트 기판(200)는 유니트 하우징(100)에 배치되고 베이스 터미널(20)과 전기적 소통을 이루는데, 유니트 기판(200)은 하기되는 커넥터 터미널부(600) 내지 컨택 터미널부(500)를 통하여 베이스 터미널(20) 측과 연결될 수 있고, 베이스 터미널(20)은 외부 전원과 연결되어 외부 전원이 전기적 신호로서 차량용 엘이디 램프 유니트(10)로 전달될 수 있다.The unit board 200 is disposed in the unit housing 100 and makes electrical communication with the base terminal 20. The unit board 200 is connected to the base through the connector terminal 600 to the contact terminal 500, which will be described later. The terminal 20 may be connected to the side, and the base terminal 20 may be connected to an external power source so that the external power source may be transmitted to the LED lamp unit 10 for the vehicle as an electric signal.
본 발명의 유니트 기판(200)은 FPCB의 플랙서블 기판으로 구현될 수도 있고, 종래의 하드 타입의 인쇄회로기판으로 구현될 수 있는데, 본 실시예에서는 플렉서블 인쇄회로기판인 경우를 중심으로 설명한다.The unit substrate 200 of the present invention may be implemented as a flexible substrate of an FPCB, or may be implemented as a conventional hard type printed circuit board. The present embodiment will be described with reference to a flexible printed circuit board.
유니트 기판(200)은 램프 기판(210)과, 소자 기판(220)을 포함한다.The unit substrate 200 includes a lamp substrate 210 and an element substrate 220.
램프 기판(210)의 일면 상에는 유니트 램프(300)가 배치된다.The unit lamp 300 is disposed on one surface of the lamp substrate 210.
소자 기판(220)은 램프 기판(210) 측과 연결되고 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치된다.The device substrate 220 is connected to the lamp substrate 210 side and the device for transmitting an electrical signal to the unit lamp 300 is disposed.
램프 기판(210)과 소자 기판(220)은 본 실시예에서 연결 기판(230)으로 연결되는데, 램프 기판(210)과 소자 기판(220)과 연결 기판(230)은 일체로 형성되는 구조를 이룬다(도 6 참조).The lamp substrate 210 and the device substrate 220 are connected to the connection substrate 230 in the present embodiment, and the lamp substrate 210, the device substrate 220, and the connection substrate 230 are integrally formed. (See Figure 6).
또한, 램프 기판(210)과 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치되는데, 램프 기판(210)과 소자 기판(220)은 차량용 엘이디 램프 유니트(10)에 배치되는 경우 동일 평면 상에 위치하지 않고 서로 교차하는 평면, 즉 본 실시예에서는 직교하는 평면 상에 배치된다(도 5 참조).In addition, at least a portion of the lamp substrate 210 and the element substrate 220 is disposed on a plane intersecting with each other, the lamp substrate 210 and the element substrate 220 is the same when disposed in the vehicle LED lamp unit 10 It is arranged on a plane that intersects each other without being located on a plane, that is, on a plane that is orthogonal in this embodiment (see FIG. 5).
연결 기판(230)은 램프 방열부(410)에 부착된 램프 기판(210)과 소자 방열부(420)에 부착된 소자 기판(220)을 연결하는데, 연결 기판(230)은 램프 방열부(410)의 측부 및 저면을 따라 배치되는 구조를 취한다.The connection board 230 connects the lamp substrate 210 attached to the lamp radiator 410 and the device substrate 220 attached to the element radiator 420. The connection board 230 is a lamp radiator 410. Take a structure arranged along the sides and bottom of the).
소자 기판(220)에는 하기되는 컨택 터미널부(500)의 커넥터 컨택 터미널(520)이 형성되어 커넥터 터미널부(600)와의 접촉 접속 상태를 형성한다.In the device substrate 220, a connector contact terminal 520 of the contact terminal part 500 described below is formed to form a contact connection state with the connector terminal part 600.
한편, 유니트 램프(300)는 소정의 LED 소자로 구현되는데, 본 실시예에서 단수 개가 되었으나 설계 사양에 따라 다양한 구성이 가능하다.On the other hand, the unit lamp 300 is implemented with a predetermined LED element, in the present embodiment is a single number, but various configurations are possible according to the design specifications.
유니트 램프(300)는 유니트 기판(200)의 일면 상에 배치되는 LED 소자를 포함한다.The unit lamp 300 includes an LED element disposed on one surface of the unit substrate 200.
또한, 유니트 방열부(400)는 유니트 기판(200)과 접촉하여 유니트 램프(300)에서 발생된 열을 방출한다. 유니트 방열부(400)는 전기적 소통을 제한하되 비도전성 금속으로 형성되어 열의 발산을 허용한다.In addition, the unit heat dissipation unit 400 is in contact with the unit substrate 200 to release the heat generated by the unit lamp (300). The unit heat dissipation unit 400 is limited to electrical communication but is formed of a non-conductive metal to allow heat dissipation.
유니트 방열부(400)는 램프 방열부(410)와, 소자 방열부(420)를 포함한다. 램프 방열부(410)는 램프 기판(210)과 접촉하고, 소자 방열부(420)는 램프 방열부(410)와 연결되고 소자 기판(220)과 접촉하여 소자 기판(220)의 열을 방출한다.The unit heat dissipation unit 400 includes a lamp heat dissipation unit 410 and an element heat dissipation unit 420. The lamp radiator 410 is in contact with the lamp substrate 210, and the device radiator 420 is connected to the lamp radiator 410 and is in contact with the device substrate 220 to emit heat from the device substrate 220. .
본 실시예에서 램프 방열부(410)와 소자 방열부(420)는 직교 배치되는데, 램프 방열부(410)는 다양한 형상을 구비할 수 있는데, 이 중 원판 형상을 구비할 수 있다. 이에 상응하여 램프 기판(210)도 원형 형상을 구비할 수 있다. 본 실시예에서의 램프 방열부의 원판(원형) 형상 및 램프 기판의 대응 형상의 경우 제조성을 증진시키는다는 점에서 바람직하나, 이러한 램프 방열부/램프 기판 등의 형상은 원판(원형) 형상에 국한되지 않고, 실질적 원형, 타원형 및 각형의 형상으로 이루어질 수도 있는 등 다양한 변형이 가능하다.In this embodiment, the lamp heat dissipating unit 410 and the element heat dissipating unit 420 are orthogonally arranged, and the lamp heat dissipating unit 410 may have various shapes, among which may have a disc shape. Correspondingly, the lamp substrate 210 may also have a circular shape. In the present embodiment, the original (circular) shape of the lamp heat dissipation portion and the corresponding shape of the lamp substrate are preferable in terms of enhancing the manufacturability, but the shape of such a lamp heat dissipation portion / lamp substrate is not limited to the original (circular) shape. And various modifications are possible, such as may be made in the shape of substantially circular, oval and angular.
램프 방열부(410)와 소자 방열부(420)의 일면에는 소정의 접착부가 배치되고 램프 기판(210) 및 소자 기판(220)이 접착 배치되는 구조를 형성할 수 있다.A predetermined adhesive part may be disposed on one surface of the lamp heat dissipating part 410 and the device heat dissipating part 420, and the lamp substrate 210 and the device substrate 220 may be bonded to each other.
또한, 커넥터 터미널부(600)는 베이스 터미널(20)과 직접적인 접촉을 이루는데, 커넥터 터미널부(600)는 베이스 터미널(20)과 유니트 기판(200) 사이에는 접촉에 의한 전기적 접속을 이룬다. 커넥터 터미널부(600)는 적어도 일부의 일단이 유니트 하우징(100)의 외측으로 인출 배치된다.In addition, the connector terminal portion 600 makes direct contact with the base terminal 20, and the connector terminal portion 600 forms an electrical connection by contact between the base terminal 20 and the unit board 200. At least one end of the connector terminal unit 600 is disposed to be drawn out of the unit housing 100.
즉, 앞서 기술한 바와 같이 하우징 바디(110)의 메인 바디(111)의 외주에는 바디 커넥터 관통구(117)가 형성되고, 커넥터 터미널부(600)는 적어도 일부의 일단이 바디 커넥터 관통구(117)를 통하여 외부로 노출되어 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착시키는 경우 커넥터 터미널부(600)는 베이스 터미널(20)과 접속된다.That is, as described above, a body connector through hole 117 is formed at an outer circumference of the main body 111 of the housing body 110, and at least one end of the connector terminal part 600 has a body connector through hole 117. When the vehicle LED lamp unit 10 is mounted to the vehicle lamp base 2 by being exposed to the outside, the connector terminal unit 600 is connected to the base terminal 20.
한편, 컨택 터미널부(500)는 유니트 기판(200)과 커넥터 터미널부(600) 사이에 전기적 신호를 전달한다.On the other hand, the contact terminal 500 transmits an electrical signal between the unit board 200 and the connector terminal 600.
보다 구체적으로, 컨택 터미널부(500)는 기판 컨택 터미널(510)과, 커넥터 컨택 터미널(520)을 구비하는데, 기판 컨택 터미널(510)은 유니트 기판(200)에 배치되고, 커넥터 컨택 터미널(520)은 커넥터 터미널부(600)와 연결되고 기판 컨택 터미널(510)과 접속된다.More specifically, the contact terminal unit 500 includes a board contact terminal 510 and a connector contact terminal 520, wherein the board contact terminal 510 is disposed on the unit board 200 and the connector contact terminal 520. ) Is connected to the connector terminal 600 and is connected to the substrate contact terminal 510.
커넥터 컨택 터미널(520)은 커넥터 컨택 터미널 접속부(521)와, 커넥터 컨택 터미널 연결부(522)를 포함한다(도 8 참조).The connector contact terminal 520 includes a connector contact terminal connector 521 and a connector contact terminal connector 522 (see FIG. 8).
본 실시예에서 커넥터 컨택 터미널(520)은 T자 형상의 도전성 금속편을 절곡시켜 형성할 수 있는데, 커넥터 컨택 터미널 접속부(521)와, 커넥터 컨택 터미널 연결부(522)를 포함한다.In the present embodiment, the connector contact terminal 520 may be formed by bending a T-shaped conductive metal piece, and includes a connector contact terminal connector 521 and a connector contact terminal connector 522.
커넥터 컨택 터미널 접속부(521)는 유니트 하우징(100)의 내부에서 유니트 기판(200)에 형성된 기판 컨택 터미널(510)에 대향 배치된다. 또한, 커넥터 컨택 터미널 연결부(522)는 일단이 커넥터 컨택 터미널 접속부(521)와 연결되고, 타단이 커넥터 터미널부(600)에 연결된다. 커넥터 터미널부(600)는 상기 커넥터 컨택 터미널 연결부(522)의 측부에 연결된다.The connector contact terminal connecting portion 521 is disposed opposite to the substrate contact terminal 510 formed on the unit substrate 200 in the unit housing 100. In addition, one end of the connector contact terminal connection part 522 is connected to the connector contact terminal connection part 521, and the other end is connected to the connector terminal part 600. The connector terminal portion 600 is connected to the side of the connector contact terminal connection portion 522.
또한, 커넥터 컨택 터미널 접속부(521)는 커넥터 컨택 터미널 연결부(522)를 사이에 두고 쌍을 이루어 배치되어, 사이에 유니트 방열부(400)의 적어도 일부가 유니트 하우징(100)의 내부에서 탄성 접촉 상태를 형성한다. 즉, 커넥터 컨택 터미널 접속부(521)는 커넥터 컨택 터미널 연결부(522)를 사이에 두고 쌍을 이루어 배치되고 절곡되어 대향 배치되는 경우, 소정의 사전 설정된 사이 간격을 두고 형성된다. 대향 배치되는 커넥터 컨택 터미널 접속부(521)는 사전 설정된 간격을 두고 배치되는데, 사전 설정 간격을 유니트 방열부(400)의 소자 방열부(420)의 두께보다 작은 값으로 형성되어 소자 방열부(420)가 삽입 배치되어 위치 유지되도록 한다. 이와 같은 구조를 통하여 소자 방열부(420)의 일면 상에 접촉 배치되는 소자 기판(220)의 일면 상에 형성된 기판 컨택 터미널(510)과 커넥터 컨택 터미널 접속부(521)와의 접속 상태를 보다 공고히 할 수 있다.In addition, the connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed therebetween, with at least a portion of the unit heat dissipating portion 400 being elastically contacted inside the unit housing 100. To form. That is, when the connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed and bent to face each other, the connector contact terminal connecting portions 521 are formed at predetermined intervals. The connector contact terminal connecting portion 521 disposed to face each other is disposed at a predetermined interval, and the predetermined interval is formed to a value smaller than the thickness of the element radiating portion 420 of the unit radiating portion 400. Is inserted and placed in position. Through such a structure, the connection state between the substrate contact terminal 510 and the connector contact terminal connecting portion 521 formed on one surface of the element substrate 220 disposed in contact with one surface of the element heat dissipating portion 420 can be more firmly established. have.
한편, 본 발명의 차량용 엘이디 램프 유니트(10)의 유니트 방열부(400)는 다양한 구성을 취할 수 있다.On the other hand, the unit heat dissipation unit 400 of the LED lamp unit 10 of the present invention can take a variety of configurations.
즉, 앞서 기술한 바와 같이, 유니트 기판(200)은 플렉서블 기판(FPCB)이고, 유니트 기판(200)은 유니트 램프(300)가 배치되는 램프 기판(210)과, 램프 기판(210) 측과 연결되고 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하고, 램프 기판(210)과 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치되고, 유니트 방열부(400)는 램프 기판(210)과 접촉하는 램프 방열부(410)와, 램프 방열부(410)와 연결되고 소자 기판(220)과 접촉하여 소자 기판(220)의 열을 방출하는 소자 방열부(420)를 포함하는데, 램프 방열부(410)와 소자 방열부(420)는 서로 직접적으로 접촉 연결된다.That is, as described above, the unit substrate 200 is a flexible substrate (FPCB), the unit substrate 200 is connected to the lamp substrate 210, the lamp substrate 210 side on which the unit lamp 300 is disposed And an element substrate 220 on which an element for transmitting an electrical signal to the unit lamp 300 is disposed, wherein at least a portion of the lamp substrate 210 and the element substrate 220 are disposed on a plane crossing each other, and the unit The radiator 400 is a lamp radiator 410 in contact with the lamp substrate 210 and an element connected to the lamp radiator 410 and in contact with the element substrate 220 to emit heat from the element substrate 220. It includes a heat dissipation unit 420, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 is directly contacted with each other.
램프 방열부(410)와 소자 방열부(420)는 상호 맞춤 연결되는 구조를 취할 수도 있다. 즉, 램프 방열부(410)와 소자 방열부(420)는 직교 연결될 수 있는데, 램프 방열부(410)와 소자 방열부(420)를 직교 연결시키는 구성은 램프 방열 장착부(413)와 소자 방열 장착부(423)를 포함하는데, 램프 방열 장착부(413)는 램프 방열부(410)에 구비되고, 소자 방열 장착부(423)는 소자 방열부(420)에 형성되어 램프 방열 장착부(413)와 맞물림된다.The lamp radiator 410 and the device radiator 420 may have a structure in which they are connected to each other. That is, the lamp heat dissipation unit 410 and the element heat dissipation unit 420 may be orthogonally connected, and the lamp heat dissipation unit 410 and the element heat dissipation unit 420 are orthogonally connected to the lamp heat dissipation unit 413 and the element heat dissipation mounting unit. 423, wherein the lamp heat dissipation mounting part 413 is provided at the lamp heat dissipation part 410, and the device heat dissipation mounting part 423 is formed at the device heat dissipation part 420 to be engaged with the lamp heat dissipation mounting part 413.
이와 같은 끼워 맞춤 방식의 일예로 도 21에 도시된 바와 같이, 램프 방열 장착부(413)와 소자 방열 장착부(423)는 램프 방열부(410)가 속하는 평면 상에 슬라이드 끼워 맞춤되는 구조를 취할 수 있다. 즉, 램프 방열 장착부(413)는 램프 방열부(410)의 저면에는 직선 형태 요홈으로 슬라이드 라인이 형성되고, 소자 방열부(420)는 상단에는 소자 방열 장착부(423)가 돌출 형성되고, 소자 방열 장착부(423)가 램프 방열 장착부(413)에 삽입 배치된다.As an example of such a fitting method, as illustrated in FIG. 21, the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 may have a structure in which the lamp heat dissipation mounting unit 423 slides on a plane to which the lamp heat dissipation unit 410 belongs. . That is, the lamp heat dissipation mounting portion 413 has a slide line formed in a straight groove on the bottom surface of the lamp heat dissipation portion 410, and the element heat dissipation portion 420 has an element heat dissipation mounting portion 423 protrudingly formed on the upper end thereof, and device heat dissipation. The mounting portion 423 is inserted into the lamp heat dissipation mounting portion 413.
이와 같은 슬라이드 삽입 공정을 통하여 보다 신속하고 원치 않는 분리 이탈을 방지하는 구성을 취할 수 있다.Through such a slide insertion process can be configured to prevent more rapid and unwanted separation and departure.
또한, 본 발명의 끼워 맞춤 방식의 램프 방열 장착부(413)와 소자 방열 장착부(423)의 맞물림 구조는 슬라이드 방식 이외에 직접 수직한 방향으로의 간결한 끼워 맞춤 방식을 취할 수도 있다.In addition, the engagement structure of the lamp heat dissipation mounting portion 413 and the element heat dissipation mounting portion 423 of the fitting method of the present invention may take a simple fitting method in the vertical direction in addition to the slide method.
즉, 도 14 내지 도 17에 도시된 바와 같이, 램프 방열 장착부(413)와 소자 방열 장착부(423)는 램프 방열부(410)와 소자 방열부(420)의 직교 연결 방향으로 끼워 맞춤될 수도 있다.That is, as illustrated in FIGS. 14 to 17, the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 may be fitted in the orthogonal connection direction of the lamp heat dissipation unit 410 and the device heat dissipation unit 420. .
램프 방열 장착부(413)와 소자 방열 장착부(423)는 램프 방열부(410)가 속하는 평면 상에 돌출 구조가 끼워 맞춤되는 구조를 취할 수 있다. 즉, 램프 방열 장착부(413)는 램프 방열부(410)에는 관통 형성 내지 저면에 요홈 구조가 형성되고, 소자 방열부(420)는 상단에는 소자 방열 장착부(423)가 돌출 형성되고, 램프 방열부(410)가 이루는 평면에 수직한 방향으로 소자 방열부(420)가 배치되고 소자 방열 장착부(423)가 램프 방열 장착부(413)에 삽입 배치된다. 본 실시예에서 램프 방열 장착부(413)와 소자 방열 장착부(423)는 두 개가 이격 배치되는 구조를 취하고 각각이 서로 끼워 맞춤되는 구조를 취한다.The lamp heat dissipation mounting unit 413 and the element heat dissipation mounting unit 423 may have a structure in which a protruding structure is fitted on a plane to which the lamp heat dissipation unit 410 belongs. That is, the lamp heat dissipation mounting part 413 has a recess structure formed on the bottom surface of the lamp heat dissipation part 410, the recessed part is formed on the bottom surface of the lamp heat dissipation part 410, and the element heat dissipation mounting part 423 is formed on the top of the lamp heat dissipation part 410, and the lamp heat dissipation part is formed. The element heat dissipation part 420 is disposed in a direction perpendicular to the plane formed by the 410, and the element heat dissipation mounting part 423 is inserted into the lamp heat dissipation mounting part 413. In this embodiment, the lamp heat dissipation mounting unit 413 and the device heat dissipation mounting unit 423 take a structure in which two are spaced apart from each other, and each of the lamp heat dissipation mounting unit 413 and the element heat dissipation mounting unit 423 is fitted.
이와 같은 압입 삽입 공정을 통하여 보다 신속하고 원치 않는 분리 이탈을 방지하는 구성을 취할 수 있다.Through such a press-fit insertion process, it is possible to take a configuration to prevent more rapid and undesired separation separation.
한편, 앞서 기술한 바와 같이, 유니트 방열부(400)에는 유니트 기판(200)이 부착 배치되는데, 연결 기판(230)의 꺾임으로 인한 손상을 방지하거나 유니트 방열부(400)가 원형 형상인 경우 연결 기판(230)과 연결되는 램프 기판(210) 및 소자 기판(230)의 박리를 방지하기 위한 구성요소가 더 구비될 수도 있다. 즉, 램프 기판(210)과 소자 기판(220)은 사이에 연결 기판(230)을 통하여 연결되고, 램프 방열부(410)의, 연결 기판(230)의 배치되는 단부 측에 챔퍼링되는 램프 방열 컷오프(411)가 배치된다.On the other hand, as described above, the unit heat dissipation unit 400 is attached to the unit substrate 200, to prevent damage due to the bending of the connection board 230 or when the unit heat dissipation unit 400 has a circular connection A component for preventing peeling of the lamp substrate 210 and the device substrate 230 connected to the substrate 230 may be further provided. That is, the lamp substrate 210 and the element substrate 220 is connected between the connection substrate 230, the lamp heat dissipation chamfered on the end side of the lamp heat dissipation unit 410, the end of the connection substrate 230 is disposed Cutoff 411 is disposed.
램프 방열부(410)가 원형 형상인 경우 램프 방열 컷오프(411)는 램프 방열부(410)의 단부 측에 형성되어 유니트 기판(200)의 꺾임 각도를 완화하거나 박리로 인한 램프 방열부(410) 내지 소자 방열부(420)로부터 램프 기판(210)과 소자 기판(220)이 원치 않게 분리 이탈되는 것을 방지할 수 있다.When the lamp heat dissipation unit 410 has a circular shape, the lamp heat dissipation cutoff 411 is formed at an end side of the lamp heat dissipation unit 410 to alleviate the bending angle of the unit substrate 200 or to cause the lamp heat dissipation unit 410 to peel off. The lamp substrate 210 and the device substrate 220 may be undesirably separated from the device heat radiating part 420.
한편, 이러한 구조의 방열 구조를 포함하는 경우 연결 기판(230)이 두 개의 소자 방열 장착부(423) 사이로 배치되어 램프 방열부(410) 및 소자 방열부(420)의 사이에 개재되도록 하는 구성을 취할 수도 있다. 이 경우 램프 기판(210)에 배치되는 유니트 램프(300)와 소자 기판(220)에 배치되는 소자는 유니트 기판(200)의 동일면 상에 배치되어(도 19 참조), 연결 기판(230)이 두 개의 소자 방열 장착부(423) 사이로 배치되고 램프 방열부(410) 및 소자 방열부(420)의 사이에서 위치 고정되는 노화에 따른 열화를 방지할 수 있다.On the other hand, in the case of including the heat dissipation structure of this structure, the connection board 230 is disposed between the two element heat dissipation mounting portion 423 to take a configuration to be interposed between the lamp heat dissipation portion 410 and the element heat dissipation portion 420. It may be. In this case, the unit lamp 300 disposed on the lamp substrate 210 and the element disposed on the element substrate 220 are disposed on the same surface of the unit substrate 200 (see FIG. 19), so that the connection substrate 230 It is disposed between the two element heat dissipation mounting portion 423 and the degradation due to aging that is fixed between the lamp heat dissipation portion 410 and the element heat dissipation portion 420 can be prevented.
즉, 발열로 인한 접착성능 저하로 인한 램프 기판(210) 내지 소자 기판(220)이 램프 방열부(410) 및 소자 방열부(420)로부터 박리 이탈되는 것을 방지할 수도 있다.That is, the lamp substrate 210 to the device substrate 220 may be prevented from being separated from the lamp heat dissipation unit 410 and the device heat dissipation unit 420 due to the deterioration of adhesive performance due to heat generation.
또한, 본 발명의 차량용 엘이디 램프 유니트(10)는 방열부로부터 기판이 박리 분리되는 것을 방지하기 위한 구성을 더 구비할 수도 있다.In addition, the vehicle LED lamp unit 10 of the present invention may further include a configuration for preventing the separation of the substrate from the heat radiating portion.
램프 기판 컷오프(211)와 램프 방열 컷오프 수용부(415)가 더 구비되는데, 램프 기판 컷오프(211)는 램프 기판(210) 내측으로, 램프 기판(210)과 상기 연결 기판(230)의 연결 지점의 외측에 형성되고, 램프 방열 컷오프 수용부(415)는 램프 방열 컷오프(411)의 단부 측에는 램프 방열부(410)의 내측을 향하여 돌입 형성되고 연결 기판(230)의 수용을 형성한다.A lamp substrate cutoff 211 and a lamp heat dissipation cutoff receiver 415 may be further provided. The lamp substrate cutoff 211 may be inside the lamp substrate 210, and a connection point between the lamp substrate 210 and the connection board 230 may be provided. The lamp heat dissipation cutoff accommodating part 415 is formed at an outer side of the lamp heat dissipation cutoff 411 at an end side of the lamp heat dissipating cutoff 411 toward the inner side of the lamp heat dissipating part 410 and forms a housing of the connecting substrate 230.
또 한편, 앞선 실시예에서와 달리 본 발명의 차량용 엘이디 램프 유니트(10)는 차량용 엘이디 램프 유니트(10)의 길이 방향으로 접속되는 컨택 터미널부와는 달리 차량용 엘이디 램프 유니트(10)의 길이 방향에 수직한 평면 상에서의 컨택 터미널부의 접속 상태를 형성하는 구조를 취할 수도 있다. 본 실시예에서는 앞선 실시예에서와 달리 유니트 기판(200)과 컨택 터미널부(500)가 접속되고 유니트 방열부(400)가 배제되는 구조를 중심으로 설명하고, 앞선 실시예에서와 동일한 구성요소에 대하여는 동일한 도면 부호를 부여하며 중복된 설명은 생략한다.On the other hand, unlike in the previous embodiment, the vehicle LED lamp unit 10 of the present invention, unlike the contact terminal portion connected in the longitudinal direction of the vehicle LED lamp unit 10 in the longitudinal direction of the vehicle LED lamp unit 10 The structure which forms the connection state of the contact terminal part on a perpendicular plane may be taken. In the present embodiment, unlike the previous embodiment, the unit substrate 200 and the contact terminal unit 500 are connected and the unit heat dissipation unit 400 is excluded. The same reference numerals are used for the same reference numerals, and redundant descriptions are omitted.
도 23 내지 도 28에 도시된 바와 같이, 차량용 엘이디 램프 유니트(10)는 유니트 하우징(100)과, 유니트 기판(200)과, 유니트 램프(300)와, 커넥터 터미널부(600)와, 컨택 터미널부(500)를 포함하는데, 컨택 터미널부(500)는 유니트 기판(200)과 커넥터 터미널부(600) 사이에서 전기적 신호를 전달하는데, 유니트 기판(200)와 컨택 터미널부(500)는 유니트 기판(200)의 배면 측에서 접속된다.As shown in FIGS. 23 to 28, the vehicle LED lamp unit 10 includes a unit housing 100, a unit board 200, a unit lamp 300, a connector terminal unit 600, and a contact terminal. The unit 500 includes a contact terminal unit 500 which transmits an electrical signal between the unit board 200 and the connector terminal unit 600, wherein the unit board 200 and the contact terminal unit 500 are unit boards. It is connected at the back side of 200.
본 실시예에서 유니트 기판(200)은 일반적인 인쇄회로기판으로 형성될 수 있다. 유니트 기판(200)의 일면 상에 유니트 램프(300)가 배치된다.In the present embodiment, the unit substrate 200 may be formed of a general printed circuit board. The unit lamp 300 is disposed on one surface of the unit substrate 200.
하우징 바디(110)의 메인 바디(111)의 외주에는 바디 커넥터 관통구(117)가 형성되는데, 바디 커넥터 관통구(117)를 통하여 하기되는 커넥터 터미널의 적어도 일부 단부가 외부로 노출되고, 궁극적으로 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착시키는 경우 베이스 터미널(20)과 접속되도록 한다.A body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is exposed to the outside, and ultimately, When the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, the vehicle LED lamp unit 10 is connected to the base terminal 20.
앞선 경우와 동일하게, 하우징 바디(110)의 메인 바디(111)의 외주에는 바디 커넥터 관통구(117)가 형성되는데, 바디 커넥터 관통구(117)를 통하여 하기되는 커넥터 터미널의 적어도 일부 단부가 외부로 노출되고, 궁극적으로 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착시키는 경우 베이스 터미널(20)과 접속되도록 한다.In the same manner as in the foregoing case, a body connector through hole 117 is formed on the outer circumference of the main body 111 of the housing body 110, and at least some end of the connector terminal described below through the body connector through hole 117 is externally formed. And ultimately, when the vehicle LED lamp unit 10 is mounted on the vehicle lamp base 2, it is connected to the base terminal 20.
또한, 커넥터 터미널부(600)는 베이스 터미널(20)과 직접적인 접촉을 이루는데, 커넥터 터미널부(600)는 베이스 터미널(20)과 유니트 기판(200) 사이에는 접촉에 의한 전기적 접속을 이룬다. 커넥터 터미널부(600)는 적어도 일부의 일단이 유니트 하우징(100)의 외측으로 인출 배치된다. 즉, 앞서 기술한 바와 같이 하우징 바디(110)의 메인 바디(111)의 외주에는 바디 커넥터 관통구(117)가 형성되고, 커넥터 터미널부(600)는 적어도 일부의 일단이 바디 커넥터 관통구(117)를 통하여 외부로 노출되어 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착시키는 경우 커넥터 터미널부(600)는 베이스 터미널(20)과 접속된다.In addition, the connector terminal portion 600 makes direct contact with the base terminal 20, and the connector terminal portion 600 forms an electrical connection by contact between the base terminal 20 and the unit board 200. At least one end of the connector terminal unit 600 is disposed to be drawn out of the unit housing 100. That is, as described above, a body connector through hole 117 is formed at an outer circumference of the main body 111 of the housing body 110, and at least one end of the connector terminal part 600 has a body connector through hole 117. When the vehicle LED lamp unit 10 is mounted to the vehicle lamp base 2 by being exposed to the outside, the connector terminal unit 600 is connected to the base terminal 20.
본 실시예의 경우, 커넥터 관통구(117)를 통하여 적어도 일부가 노출되는 커넥터 터미널부(600)와 유니트 기판(200)의 배면에 접속되는 컨택 터미널부(500)의 적어도 일부는 일체 형성된다.In the present exemplary embodiment, at least a portion of the connector terminal portion 600 exposed at least partially through the connector through hole 117 and the contact terminal portion 500 connected to the rear surface of the unit substrate 200 are integrally formed.
보다 구체적으로, 컨택 터미널부(500)는 기판 컨택 터미널(510)과, 커넥터 컨택 터미널(520)을 포함한다.More specifically, the contact terminal unit 500 includes a board contact terminal 510 and a connector contact terminal 520.
기판 컨택 터미널(510)은 유니트 기판(200)의 유니트 램프(300)가 배치되는 일면의 배면에 배치되고, 커넥터 컨택 터미널(520)은 커넥터 터미널부(600)와 연결되고 유니트 기판(200)의 배면에 형성되는 기판 컨택 터미널(510)과 접속된다.The board contact terminal 510 is disposed on the rear surface of one surface on which the unit lamp 300 of the unit board 200 is disposed, and the connector contact terminal 520 is connected to the connector terminal 600 and the unit board 200 It is connected to the substrate contact terminal 510 formed on the rear surface.
커넥터 컨택 터미널(520)과 커넥터 터미널부(600)는 일체로 형성될 수 있는데, 커넥터 터미널부(600)는 커넥터 터미널 베이스(601)와, 커넥터 터미널 접촉부(603)를 포함한다.The connector contact terminal 520 and the connector terminal portion 600 may be integrally formed. The connector terminal portion 600 includes a connector terminal base 601 and a connector terminal contact portion 603.
커넥터 터미널 베이스(601)는 유니트 하우징에 삽입 배치되고 커넥터 컨택 터미널(520)과 연결되고, 커넥터 터미널 접촉부(603)는 커넥터 터미널 베이스(601)와 연결되고 베이스 터미널(20)과 접속한다.The connector terminal base 601 is inserted into the unit housing and connected with the connector contact terminal 520, and the connector terminal contact 603 is connected with the connector terminal base 601 and connects with the base terminal 20.
커넥터 컨택 터미널(520)과 상기 커넥터 터미널부(600)는 절곡 형성되는 도전성 스트립의 양단에 배치되는 구조를 취할 수도 있다. 즉, 하나의 긴 스트립 타입의 도전성 금속띠를 절곡시켜서, 도 24에서와 같은 Y자 형상의 도전성 구조체를 형성할 수도 있는데, 하나의 긴 스트립 타입의 도전성 금속띠를 절곡시키는 경우 하나의 긴 스트립 타입의 도전성 금속띠의 양 단부는 각각 상단 측을 형성하는데, 커넥터 컨택 터미널(520)과 상기 커넥터 터미널부(600)에는 돌출 형성되는 고정 터미널 접촉 돌출부(523)와 커넥터 터미널 접촉 돌출부(605)가 형성되어 유니트 기판(100)의 배면에 형성되는 커넥터 컨택 터미널(520) 및 베이스 터미널(20)과의 접촉을 원활하게 할 수도 있다.The connector contact terminal 520 and the connector terminal portion 600 may have a structure disposed at both ends of the conductive strip that is bent. That is, one long strip type conductive metal strip may be bent to form a Y-shaped conductive structure as shown in FIG. 24. In the case of bending one long strip type conductive metal strip, one long strip type Both ends of the conductive metal strip of the upper end of the upper side, respectively, the connector contact terminal 520 and the connector terminal portion 600 is formed with a fixed terminal contact protrusion 523 and a connector terminal contact protrusion 605 protrudingly formed Thus, the contact with the connector contact terminal 520 and the base terminal 20 formed on the back surface of the unit substrate 100 may be smooth.
앞서 기술한 바와 같이, 유니트 하우징의 단부에는 커넥터 터미널 접촉부(603)가 돌출 배치되는 바디 커넥터 관통구(117)가 구비되는데, 바디 커넥터 관통구(117)의 외주에는 경사 배치 구조를 이루어 인출되는 커넥터 터미널부(600)의 커넥터 터미널 접촉부(603)의 안내 내지 과도한 휨을 방지할 수도 있다.As described above, the end of the unit housing is provided with a body connector through hole 117 through which the connector terminal contact portion 603 is protruded. Guidance or excessive bending of the connector terminal contact portion 603 of the terminal portion 600 may be prevented.
유니트 하우징(100)의 내부에는 유니트 하우징 수용부(112)가 형성되는데, 유니트 하우징 수용부(112)의 외측에는 바디 기판 지지부(114)가 형성되어 유니트 기판(200)의 안정적인 지지 상태를 형성한다. 본 실시예에서는 도시되지 않았으나, 경우에 따라 유니트 하우징 수용부(112)에 방열 기능을 수행하는 유니트 방열부가 더 구비될 수도 있다.The unit housing accommodating part 112 is formed inside the unit housing 100, and the body substrate supporting part 114 is formed outside the unit housing accommodating part 112 to form a stable support state of the unit substrate 200. . Although not shown in the present embodiment, in some cases, the unit heat dissipation unit that performs a heat dissipation function may be further provided in the unit housing accommodating part 112.
유니트 하우징 수용부(112) 측부에는 바디 커넥터 장착부(119)가 구비된다. 즉, 유니트 하우징(100)에는 바디 커넥터 장착부(119)가 구비되는데, 바디 커넥터 장착부(119)는 커넥터 터미널 베이스(601)를 수용 배치시키고 커넥터 컨택 터미널(520)의 가동을 제한한다.The body connector mounting part 119 is provided at the side of the unit housing accommodating part 112. That is, the unit housing 100 is provided with a body connector mounting portion 119, the body connector mounting portion 119 accommodates the connector terminal base 601 and limits the operation of the connector contact terminal 520.
유니트 하우징 수용부(112)의 내측면과 바디 커넥터 장착부(119)에는 커넥터 터미널 베이스(601)가 삽입 배치되고, 커넥터 터미널 베이스(601)의 상단에 배치되는 커넥터 컨택 터미널(520)과 커넥터 터미널 접촉부(603)가 상단부 측으로 노출되는데, 커넥터 컨택 터미널(520)은 유니트 기판(200)의 내측을 향하여 배치되고 커넥터 터미널 접촉부(603)는 외측을 향하여 배치된다.The connector terminal base 601 is inserted into the inner surface of the unit housing accommodating part 112 and the body connector mounting part 119, and the connector contact terminal 520 and the connector terminal contact part disposed on the upper end of the connector terminal base 601. 603 is exposed to the upper end side, wherein the connector contact terminal 520 is disposed toward the inside of the unit substrate 200 and the connector terminal contact portion 603 is disposed toward the outside.
이와 같이 Y자 형상으로 구현되는 커넥터 컨택 터미널(520)과 커넥터 터미널부(600)는 유니트 기판(200)을 탄성 지지하는 방식으로 구현될 수도 있다. 즉, 바디 기판 지지부(114)가 유니트 기판의 안정적인 지지 상태를 형성하되, 커넥터 컨택 터미널(520)이 Y자 형상의 일단부를 형성함으로써 소정의 초기 높이 단차를 형성하여 탄성 지지하는 방식을 통하여 유니트 기판(200)의 배면에 형성되는 기판 컨택 터미널(510)과의 보다 정확한 접촉 상태를 형성할 수도 있다.As such, the connector contact terminal 520 and the connector terminal unit 600 implemented in the Y shape may be implemented in a manner of elastically supporting the unit substrate 200. That is, the body substrate support portion 114 forms a stable support state of the unit substrate, but the connector contact terminal 520 forms a Y-shaped one end portion to form a predetermined initial height step to elastically support the unit substrate. It is also possible to form a more accurate contact state with the substrate contact terminal 510 formed on the back of the (200).
또 한편, 앞선 실시예에서와 달리 본 발명의 차량용 엘이디 램프 유니트(10)는 컨택 터미널부가 배제된 구조를 취할 수도 있다. 앞선 실시예에서와 동일 구성요소 내지 실질적인 동일 구성요소에 대하여는 동일한 명칭 및 도면번호를 부여하며 중복된 설명은 생략한다. 도 29 내지 도 35에 도시된 바와 같이 차량용 엘이디 램프 유니트(10)는 유니트 하우징(100)과, 유니트 기판(200)과, 유니트 램프(300)와, 커넥터 터미널부(600)를 구비하고, 커넥터 터미널부(600)는 유니트 기판(200) 상에 배치되되, 유니트 램프(300)와 동일면 상에 배치되고, 커넥터 터미널부(600)는 땜납으로 형성될 수 있다.On the other hand, unlike the previous embodiment, the vehicle LED lamp unit 10 of the present invention may have a structure in which the contact terminal portion is excluded. The same components and substantially the same components as in the previous embodiment are given the same names and reference numbers, and duplicate descriptions are omitted. 29 to 35, the vehicle LED lamp unit 10 includes a unit housing 100, a unit board 200, a unit lamp 300, and a connector terminal unit 600. The terminal unit 600 may be disposed on the unit substrate 200, disposed on the same surface as the unit lamp 300, and the connector terminal unit 600 may be formed of solder.
즉, 본 실시예에서는 별도의 컨택 터미널부의 구성이 배제되고, 커넥터 터미널부(600)가 직접 베이스 터미널(20)과 접속되는 구조를 형성할 수도 있다. 유니트 기판(200)은 유니트 램프(300)가 배치되는 램프 기판(210)과, 램프 기판(210) 측과 연결되고 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하는데, 램프 기판(210)과 소자 기판(220)는 일체로 형성되고, 서로 동일 평면 상에 배치된다. 도 31에 도시된 바와 같이, 램프 기판(210)과 소자 기판(220)은 일체 형성되는데, 원형 형상의 램프 기판(210)의 외주에 소자 기판(220)이 180도 대향 상태로 배치되는데, 본 실시예에서 소자 기판(220)에는 커넥터 터미널부(600)가 배치된다.That is, in the present embodiment, a separate contact terminal part may be excluded, and the connector terminal part 600 may be directly connected to the base terminal 20. The unit substrate 200 includes a lamp substrate 210 in which the unit lamp 300 is disposed, and an element substrate 220 connected to the lamp substrate 210 and configured to transfer an electric signal to the unit lamp 300. The lamp substrate 210 and the element substrate 220 are integrally formed and disposed on the same plane as each other. As shown in FIG. 31, the lamp substrate 210 and the device substrate 220 are integrally formed, and the device substrate 220 is disposed to face 180 degrees on the outer circumference of the circular lamp substrate 210. In an embodiment, the connector terminal 600 is disposed on the device substrate 220.
앞서 기술한 바와 같이, 유니트 하우징의 단부에는 바디 커넥터 관통구(117)가 구비되는데, 앞선 실시예에서의 커넥터 터미널부가 돌출되는 경우와 달리 소자 기판(220)이 배치되는 위치를 형성한다.As described above, the end of the unit housing is provided with a body connector through hole 117, which forms a position where the element substrate 220 is disposed unlike the case in which the connector terminal portion in the previous embodiment protrudes.
유니트 기판(200)의 하부에는 기판 서포트부(700)가 구비된다. 기판 서포트부(700)는 유니트 하우징(100)의 내부에 배치되어 유니트 기판(200)을 탄성 지지한다. 기판 서포트부(700)는 Y자 형상을 이루는데, 유니트 기판(200)을 탄성 지지하는 기능적 면에서 앞선 실시예에서의 Y자 형상의 컨택 터미널부 및 커넥터 터미널부의 구조와 유사하다.The substrate support part 700 is provided below the unit substrate 200. The substrate support part 700 is disposed inside the unit housing 100 to elastically support the unit substrate 200. The substrate support part 700 has a Y-shape, which is similar in structure to the Y-shaped contact terminal part and the connector terminal part in the previous embodiment in terms of the functional support for elastically supporting the unit substrate 200.
기판 서포트부(700)는 기판 서포트 베이스(730)와 기판 서포트 접촉부(710,720)를 포함한다. 기판 서포트 베이스(730)는 유니트 하우징(100)에 삽입 배치되고, 기판 서포트 접촉부(710,720)는 기판 서포트 베이스(730)와 연결되고 유니트 기판(200)의 배면을 지지한다.The substrate support part 700 includes a substrate support base 730 and substrate support contacts 710 and 720. The substrate support base 730 is inserted into the unit housing 100, and the substrate support contacts 710 and 720 are connected to the substrate support base 730 and support the rear surface of the unit substrate 200.
앞선 경우와 동일하게, 유니트 하우징(100)의 내부에는 유니트 하우징 수용부(112)가 형성되는데, 유니트 하우징 수용부(112)의 외측에는 바디 기판 지지부(114)가 형성되어 유니트 기판(200)의 안정적인 지지 상태를 형성한다. 본 실시예에서는 도시되지 않았으나, 경우에 따라 유니트 하우징 수용부(112)에 방열 기능을 수행하는 유니트 방열부가 더 구비될 수도 있음은 앞서 기술한 바와 동일하다.As in the case described above, the unit housing accommodating part 112 is formed inside the unit housing 100, and the body substrate supporting part 114 is formed on the outer side of the unit housing accommodating part 112 to form the unit substrate 200. Form a stable support state. Although not shown in the present embodiment, in some cases, the unit heat dissipation unit that performs a heat dissipation function may be further provided in the unit housing accommodating part 112 as described above.
유니트 하우징(100)에는 바디 커넥터 장착부(119)가 구비되는데, 바디 커넥터 장착부(119)는 기판 서포트 베이스(730)를 수용 배치시키고 기판 서포트 접촉부(710,720)의 가동을 제한한다.The unit housing 100 is provided with a body connector mounting portion 119, which accommodates and positions the substrate support base 730 and restricts the operation of the substrate support contacts 710 and 720.
유니트 하우징 수용부(112)의 내측면과 바디 커넥터 장착부(119)에는 기판 서포트 베이스(730)가 삽입 배치되고, 기판 서포트 베이스(730)의 상단에 배치되는 기판 서포트 접촉부(710,720)가 상단부 측으로 노출되는데, 기판 서포트 접촉부(710,720)의 하나는 유니트 기판(200)의 내측을 향하여 배치되고 기판 서포트 접촉부(710,720)의 다른 하나는 외측을 향하여 배치된다.The substrate support base 730 is inserted into the inner surface of the unit housing accommodating part 112 and the body connector mounting part 119, and the substrate support contact parts 710 and 720 disposed on the upper end of the substrate support base 730 are exposed to the upper end side. One of the substrate support contacts 710 and 720 is disposed toward the inside of the unit substrate 200 and the other of the substrate support contacts 710 and 720 is disposed toward the outside.
이와 같이 Y자 형상으로 구현되는 기판 서포트 접촉부(710,720)는 유니트 기판(200)을 탄성 지지하는 방식으로 구현될 수도 있다. 즉, 바디 기판 지지부(114)가 유니트 기판의 안정적인 지지 상태를 형성하되, 기판 서포트 접촉부(710,720)이 Y자 형상의 단부를 형성함으로써 소정의 초기 높이 단차를 형성하여 유니트 기판(200)을 베이스 터미널(20) 측으로 탄성 지지하는 방식을 통하여 커넥터 터미널부(600)와 베이스 터미널(20)과의 보다 정확한 접촉 상태를 형성할 수도 있다.As described above, the substrate support contacts 710 and 720 implemented in the Y shape may be implemented in a manner of elastically supporting the unit substrate 200. That is, the body substrate support part 114 forms a stable support state of the unit substrate, but the substrate support contact parts 710 and 720 form Y-shaped ends to form a predetermined initial height step, thereby forming the unit substrate 200 as the base terminal. It is also possible to form a more accurate contact state between the connector terminal portion 600 and the base terminal 20 by the elastic support to the (20) side.
기판 서포트 베이스(730)와 기판 서포트 접촉부(710,720)는 절곡 형성되는 스트립을 포함한다.The substrate support base 730 and the substrate support contacts 710 and 720 include bent strips.
즉, 기판 서포트 베이스(730)와 기판 서포트 접촉부(710,720)는 절곡 형성되는 스트립의 양단에 배치되는 구조를 취할 수도 있다. 즉, 하나의 긴 스트립 타입의 가능한 비도전성 금속띠를 절곡시켜서, 도 30에서와 같은 Y자 형상의 비도전성 구조체를 형성할 수도 있는데, 하나의 긴 스트립 타입의 비도전성 금속띠를 절곡시키는 경우 하나의 긴 스트립 타입의 금속띠의 양 단부는 각각 기판 서포트 접촉부(710,720)의 상단 측을 형성할 수도 있다.That is, the substrate support base 730 and the substrate support contact portions 710 and 720 may have structures arranged at both ends of the bent strip. In other words, one long strip type non-conductive metal band may be bent to form a Y-shaped non-conductive structure as shown in FIG. 30. One long strip type non-conductive metal band may be bent. Both ends of the elongated strip-like metal strip may form top ends of the substrate support contacts 710 and 720, respectively.
한편, 하나의 비도전성 스트립의 절곡에 의한 기판 서포트부의 형성 이외에 펀칭 공정을 통한 구성으로 이루어질 수도 있다. 즉, 기판 서포트 베이스(730)와 기판 서포트 접촉부(710,720)는 스트립으로 펀칭 절곡 형성될 수도 있다. 도 35에 도시된 바와 같이, 기판 서포트 접촉부(710,720) 중의 적어도 하나는 펀칭되어 형성되고 다른 부위와 반대 방향으로 꺾여 Y자 형상을 이루는 구조를 형성할 수 있다. 이는 복잡한 절곡 구조를 배제하여 보다 간결하고 신속하게 구성요소를 제조할 수 있도록 하여 공정 시간 내지 제조 원가 절감을 이룰 수 있다.On the other hand, in addition to the formation of the substrate support by bending the non-conductive strip may be made of a configuration through a punching process. That is, the substrate support base 730 and the substrate support contacts 710 and 720 may be punched and bent into strips. As shown in FIG. 35, at least one of the substrate support contact portions 710 and 720 may be formed by punching and bending in the opposite direction to other portions to form a Y-shaped structure. This makes it possible to manufacture components more concisely and quickly by eliminating complicated bending structures, thereby achieving process time or manufacturing cost reduction.
또한, 경우에 따라 유니트 하우징(100)에는 땜납으로 구현되는 커넥터 터미널부(600)와 베이스 터미널(20) 간의 접속 상태를 강화하기 위한 구성요소를 더 구비할 수도 있다.In addition, in some cases, the unit housing 100 may further include a component for reinforcing a connection state between the connector terminal 600 and the base terminal 20 implemented with solder.
즉, 땜납으로 구현되는 커넥터 터미널부(600)의 차량용 램프 베이스(2) 측으로의 삽입 접속 장착 과정에서 보다 원활한 접속 상태를 확보하도록, 유니트 하우징(100)의 하우징 바디(110)의 메인 바디(111)의 외주에는 차량용 램프 베이스(2)를 향한 일면에 원주를 따라 형성되되 차량용 엘이디 램프 유니트의 길이 방향으로 변화되는 높이를 갖는 홀딩 인크리먼트(800)가 더 구비될 수 있는데, 홀딩 인크리먼트(800)는 유니트 하우징(100)에 배치되고, 차량용 램프 베이스의 배면을 향하여 돌출 형성되는데, 유니트 하우징(100)에는 원주 돌출 형성 부분을 포함하는 하우징 바디(110)를 포함하고, 홀딩 인크리먼트(800)는 원주 방향으로 상이한 높이를 갖는 경사 형성 구조이다.That is, the main body 111 of the housing body 110 of the unit housing 100 to ensure a more smooth connection state in the insertion connection mounting process of the connector terminal portion 600 implemented by solder to the vehicle lamp base 2 side. The outer periphery of the) may be further provided with a holding increment 800 is formed along one circumference toward the vehicle lamp base (2) having a height that changes in the longitudinal direction of the vehicle LED lamp unit, the holding increment The 800 is disposed in the unit housing 100 and protrudes toward the rear surface of the vehicle lamp base. The unit housing 100 includes a housing body 110 including a circumferential protruding portion, and the holding increment 800 is an inclined formation structure having different heights in the circumferential direction.
즉, 도 32 내지 도 34에 도시된 바와 같이, 높이차를 갖는 경사 형성 구조의 홀딩 인크리먼트(800)를 통하여 차량용 엘이디 램프 유니트(10)를 차량용 램프 베이스(2)에 장착하는 과정에서 땜납으로 구현되는 커넥터 터미널부(600)와 베이스 터미널(20)이 땜납의 변형으로 유격 형성으로 인한 접촉 불량 상태 형성을 방지하도록 차량용 엘이디 램프 유니트(10)를 장착하는 방향으로 경사 단차를 갖는 홀딩 인크리먼트(800)를 이용하여 유니트 하우징과 차량용 램프 베이스(2)의 배면 간의 유격 형성을 방지 내지 최소화하여 커넥터 터미널부(600)와 베이스 터미널(20)의 정확한 접속 상태 형성을 이루도록 할 수도 있다.That is, as shown in FIGS. 32 to 34, the solder in the process of mounting the vehicle LED lamp unit 10 to the vehicle lamp base 2 through the holding increment 800 of the inclined formation structure having a height difference. Holding Increment having an inclined step in the direction of mounting the vehicle LED lamp unit 10 to prevent the connector terminal portion 600 and the base terminal 20 is implemented to form a contact failure state due to the formation of the gap due to the deformation of the solder It is also possible to prevent or minimize the formation of clearance between the unit housing and the rear surface of the vehicle lamp base 2 by using the fastener 800 so as to form an accurate connection state of the connector terminal 600 and the base terminal 20.
이상의 설명은 본 발명의 기술 사상을 예시적으로 설명한 것에 불과한 것으로서, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자라면 본 발명의 본질적인 특성에서 벗어나지 않는 범위에서 다양한 수정 및 변형이 가능할 것이다. 따라서, 본 발명에 개시된 실시예들은 본 발명의 기술 사상을 한정하기 위한 것이 아니라 설명하기 위한 것이고, 이러한 실시예에 의하여 본 발명의 기술 사상의 범위가 한정되는 것은 아니다. 본 발명의 보호 범위는 아래의 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 해석되어야 할 것이다.The above description is merely illustrative of the technical idea of the present invention, and those skilled in the art to which the present invention pertains may make various modifications and changes without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

Claims (18)

  1. 차량에 장착되고 배면에 배치되는 베이스 터미널(20)을 갖는 차량용 램프 베이스(2)에 상기 베이스 터미널(20)과 접속되도록 장착되는 차량용 엘이디 램프 유니트(10)로서,A vehicle LED lamp unit 10 mounted to a vehicle lamp base 2 having a base terminal 20 mounted on a vehicle and disposed on the rear thereof so as to be connected to the base terminal 20.
    상기 차량용 엘이디 램프 유니트(10)는:The vehicle LED lamp unit 10 is:
    상기 베이스 터미널(20) 측으로 적어도 일부가 삽입 배치되는 유니트 하우징(100)과,A unit housing 100 into which at least a portion of the base housing 20 is inserted and disposed;
    상기 유니트 하우징(100)에 배치되고 상기 베이스 터미널(20)과 전기적 소통을 이루는 유니트 기판(200)과,A unit substrate 200 disposed in the unit housing 100 and in electrical communication with the base terminal 20;
    상기 유니트 기판(200)의 일면 상에 배치되는 LED 소자를 포함하는 유니트 램프(300)와,A unit lamp 300 including an LED element disposed on one surface of the unit substrate 200;
    상기 유니트 기판(200)과 접촉하여 상기 유니트 램프(300)에서 발생된 열을 방출하는 유니트 방열부(400)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit (10) characterized in that it comprises a unit heat dissipation unit (400) in contact with the unit substrate (200) for dissipating heat generated by the unit lamp (300).
  2. 제 1항에 있어서,The method of claim 1,
    상기 유니트 기판(200)은 플렉서블 기판(FPCB)이고,The unit substrate 200 is a flexible substrate (FPCB),
    상기 유니트 기판(200)은:The unit substrate 200 is:
    상기 유니트 램프(300)가 배치되는 램프 기판(210)과,A lamp substrate 210 on which the unit lamp 300 is disposed;
    상기 램프 기판(210) 측과 연결되고 상기 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하고,A device substrate 220 connected to the lamp substrate 210 side and having an element for transmitting an electrical signal to the unit lamp 300,
    상기 램프 기판(210)과 상기 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit (10) characterized in that the lamp substrate 210 and at least a portion of the element substrate 220 is disposed on a plane intersecting each other.
  3. 제 2항에 있어서,The method of claim 2,
    상기 유니트 방열부(400)는:The unit heat dissipation unit 400 is:
    상기 램프 기판(210)과 접촉하는 램프 방열부(410)와,A lamp radiator 410 in contact with the lamp substrate 210;
    상기 램프 방열부(410)와 연결되고 상기 소자 기판(220)과 접촉하여 상기 소자 기판(220)의 열을 방출하는 소자 방열부(420)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The LED lamp unit 10 for a vehicle, comprising: an element heat dissipation unit 420 connected to the lamp heat dissipation unit 410 and in contact with the element substrate 220 to release heat of the element substrate 220. .
  4. 제 3항에 있어서,The method of claim 3, wherein
    상기 베이스 터미널(20)과 상기 유니트 기판(200) 사이에는 접촉에 의한 전기적 접속을 이루고 적어도 일부의 일단이 상기 유니트 하우징의 외측으로 인출 배치되는 커넥터 터미널부(600)가 구비되고,A connector terminal 600 is provided between the base terminal 20 and the unit board 200 to make an electrical connection by contact and at least one end thereof is drawn out to the outside of the unit housing.
    상기 유니트 기판(200)과 상기 커넥터 터미널부(600) 사이에는 전기적 신호를 전달하는 컨택 터미널부(500)가 더 구비되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).An LED lamp unit for a vehicle, further comprising a contact terminal unit 500 for transmitting an electrical signal between the unit board 200 and the connector terminal unit 600.
  5. 제 4항에 있어서,The method of claim 4, wherein
    상기 컨택 터미널부(500)는:The contact terminal unit 500 is:
    상기 유니트 기판(200)에 배치되는 기판 컨택 터미널(510)과,A substrate contact terminal 510 disposed on the unit substrate 200;
    상기 커넥터 터미널부(600)와 연결되고 상기 기판 컨택 터미널(510)과 접속되는 커넥터 컨택 터미널(520)을 구비하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).And a connector contact terminal (520) connected to the connector terminal portion (600) and connected to the board contact terminal (510).
  6. 제 5항에 있어서,The method of claim 5,
    상기 커넥터 컨택 터미널(520)은:The connector contact terminal 520 is:
    상기 유니트 하우징(100)의 내부에 상기 기판 컨택 터미널(510)에 대향 배치되는 커넥터 컨택 터미널 접속부(521)와,A connector contact terminal connecting portion 521 disposed in the unit housing 100 so as to face the substrate contact terminal 510;
    일단은 상기 커넥터 컨택 터미널 접속부(521)와 연결되고, 타단은 상기 커넥터 터미널부(600)에 연결되는 커넥터 컨택 터미널 연결부(522)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).One end is connected to the connector contact terminal connecting portion (521), the other end of the LED lamp unit for a vehicle comprising a connector contact terminal connecting portion (522) connected to the connector terminal portion (600).
  7. 제 6항에 있어서,The method of claim 6,
    상기 커넥터 컨택 터미널 접속부(521)가 상기 커넥터 컨택 터미널 연결부(522)를 사이에 두고 쌍을 이루어 배치되어, 사이에 상기 유니트 방열부(400)의 적어도 일부를 탄성 접촉 상태를 형성하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The connector contact terminal connecting portion 521 is disposed in pairs with the connector contact terminal connecting portion 522 interposed therebetween to form an elastic contact state between at least a portion of the unit heat dissipating portion 400 therebetween. LED lamp unit for vehicle (10).
  8. 제 7항에 있어서,The method of claim 7, wherein
    상기 커넥터 터미널부(600)는 상기 커넥터 컨택 터미널 연결부(522)의 측부에 연결되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The connector terminal unit 600 is connected to the side of the connector contact terminal connection unit 522, LED lamp unit for a vehicle, characterized in that.
  9. 제 3항에 있어서,The method of claim 3, wherein
    상기 램프 방열부(410)와 상기 소자 방열부(420)는 직교 배치되고,The lamp radiator 410 and the element radiator 420 are orthogonal to each other,
    상기 램프 방열부(410)는 원형, 원판, 각형 형상 중 적어도 하나의 형상을 구비하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The lamp heat dissipation unit 410 is a vehicle LED lamp unit (10), characterized in that it has at least one of a circular, disc, rectangular shape.
  10. 차량에 장착되고 배면에 배치되는 베이스 터미널(20)을 갖는 차량용 램프 베이스(2)에 상기 베이스 터미널(20)과 접속되도록 장착되는 차량용 엘이디 램프 유니트(10)로서,A vehicle LED lamp unit 10 mounted to a vehicle lamp base 2 having a base terminal 20 mounted on a vehicle and disposed on the rear thereof so as to be connected to the base terminal 20.
    상기 차량용 엘이디 램프 유니트(10)는: 상기 베이스 터미널(20) 측으로 적어도 일부가 삽입 배치되는 유니트 하우징(100)과, 상기 유니트 하우징(100)에 배치되고 상기 베이스 터미널(20)과 전기적 소통을 이루는 유니트 기판(200)과, 상기 유니트 기판(200)의 일면 상에 배치되는 LED 소자를 포함하는 유니트 램프(300)와, 상기 유니트 기판(200)과 접촉하여 상기 유니트 램프(300)에서 발생된 열을 방출하는 유니트 방열부(400)를 포함하고,The LED lamp unit 10 for a vehicle includes: a unit housing 100 at least partially inserted into the base terminal 20 and disposed in the unit housing 100 and in electrical communication with the base terminal 20. A unit lamp 300 including a unit substrate 200, an LED element disposed on one surface of the unit substrate 200, and heat generated by the unit lamp 300 in contact with the unit substrate 200. Including a unit heat dissipation unit 400,
    상기 유니트 기판(200)은 플렉서블 기판(FPCB)이고, 상기 유니트 기판(200)은: 상기 유니트 램프(300)가 배치되는 램프 기판(210)과, 상기 램프 기판(210) 측과 연결되고 상기 유니트 램프(300)에 전기적 신호를 전달하는 소자가 배치되는 소자 기판(220)을 포함하고, 상기 램프 기판(210)과 상기 소자 기판(220)의 적어도 일부는 서로 교차되는 평면 상에 배치되고,The unit substrate 200 is a flexible substrate (FPCB), and the unit substrate 200 is: a lamp substrate 210 on which the unit lamp 300 is disposed, connected to the lamp substrate 210 side, and the unit An element substrate 220 on which an element for transmitting an electrical signal to the lamp 300 is disposed, and at least a portion of the lamp substrate 210 and the element substrate 220 are disposed on a plane crossing each other,
    상기 유니트 방열부(400)는: 상기 램프 기판(210)과 접촉하는 램프 방열부(410)와, 상기 램프 방열부(410)와 연결되고 상기 소자 기판(220)과 접촉하여 상기 소자 기판(220)의 열을 방출하는 소자 방열부(420)를 포함하고,The unit heat dissipation unit 400 may include: a lamp heat dissipation unit 410 in contact with the lamp substrate 210, a lamp heat dissipation unit 410 connected to the lamp heat dissipation unit 410, and contacting the element substrate 220. An element heat dissipation unit 420 for dissipating heat of
    상기 램프 방열부(410)와 상기 소자 방열부(420)는 서로 직접적으로 접촉 연결되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The LED lamp unit 10 for a vehicle, characterized in that the lamp radiator 410 and the element radiator 420 are in direct contact with each other.
  11. 제 10항에 있어서, The method of claim 10,
    상기 램프 방열부(410)와 상기 소자 방열부(420)는 상호 맞춤 연결되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit for a vehicle, characterized in that the lamp radiator 410 and the element radiator 420 are connected to each other.
  12. 제 11항에 있어서,The method of claim 11,
    상기 램프 방열부(410)와 상기 소자 방열부(420)는 직교 연결되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit for a vehicle, characterized in that the lamp radiator 410 and the element radiator 420 are orthogonally connected.
  13. 제 12항에 있어서,The method of claim 12,
    상기 램프 방열부(410)에는 램프 방열 장착부(413)를 구비하고,The lamp heat dissipation unit 410 includes a lamp heat dissipation mounting unit 413,
    상기 소자 방열부(420)에는 상기 램프 방열 장착부(413)와 맞물림되는 소자 방열 장착부(423)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The device heat dissipation unit 420 includes an LED element heat dissipation mounting unit 423 engaged with the lamp heat dissipation mounting unit 413.
  14. 제 13항에 있어서, The method of claim 13,
    상기 램프 방열 장착부(413)와 상기 소자 방열 장착부(423)는 상기 램프 방열부(410)가 속하는 평면 상에 슬라이드 끼워 맞춤되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The lamp heat dissipation mounting portion (413) and the element heat dissipation mounting portion (423) is a vehicle LED lamp unit (10), characterized in that the slide fit on the plane to which the lamp heat dissipation portion (410) belongs.
  15. 제 13항에 있어서,The method of claim 13,
    상기 램프 방열 장착부(413)와 상기 소자 방열 장착부(423)는 상기 램프 방열부(410)와 상기 소자 방열부(420)의 직교 연결 방향으로 끼워 맞춤되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).The lamp heat dissipation mounting unit 413 and the element heat dissipation mounting unit 423 are fitted to the lamp heat dissipation unit 410 and the element heat dissipation unit 420 in the orthogonal connection direction, characterized in that the vehicle LED lamp unit 10 .
  16. 제 15항에 있어서,The method of claim 15,
    상기 램프 기판(210)과 상기 소자 기판(220)은 사이에 연결 기판(230)을 통하여 연결되고,The lamp substrate 210 and the device substrate 220 is connected between the connection substrate 230,
    상기 램프 방열부(410)의, 상기 연결 기판(230)의 배치되는 단부 측에는 챔퍼링되는 램프 방열 컷오프(411)가 배치되는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit (10) characterized in that the chamfered lamp heat radiation cutoff (411) is disposed on the end side of the lamp heat dissipation unit (410), the connection substrate 230 is disposed.
  17. 제 16항에 있어서,The method of claim 16,
    상기 램프 기판(210) 내측으로, 상기 램프 기판(210)과 상기 연결 기판(230)의 연결 지점의 외측에 형성되는 램프 기판 컷오프(211)를 포함하고,A lamp substrate cutoff 211 formed inside the lamp substrate 210 and outside of a connection point of the lamp substrate 210 and the connection substrate 230,
    상기 램프 방열 컷오프(411)의 단부 측에는 상기 램프 방열부(410)의 내측을 향하여 돌입 형성되고 상기 연결 기판(230)의 수용을 형성하는 램프 방열 컷오프 수용부(415)를 포함하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).An end side of the lamp heat dissipation cut-off 411 includes a lamp heat dissipation cut-off accommodating part 415 formed inwardly toward the lamp heat dissipation part 410 and forming an accommodation of the connection substrate 230. LED lamp unit for vehicle (10).
  18. 제 10항에 있어서, The method of claim 10,
    상기 유니트 하우징(100)은:The unit housing 100 is:
    차량 램프 베이스에 장착되는 하우징 바디(110)와,A housing body 110 mounted to the vehicle lamp base;
    상기 하우징 바디(110)와 맞물리어 내부 공간을 형성하는 하우징 커버(120)를 포함하고,And a housing cover 120 engaged with the housing body 110 to form an inner space.
    상기 하우징 커버(120)의 내부에는 상기 유니트 기판(200)을 안정적으로 지지하는 커버 기판 지지 리브(125)을 구비하는 것을 특징으로 하는 차량용 엘이디 램프 유니트(10).LED lamp unit (10), characterized in that the inside of the housing cover 120 has a cover substrate support rib 125 for stably supporting the unit substrate (200).
PCT/KR2017/007337 2016-07-29 2017-07-07 Vehicle led lamp unit WO2018021724A1 (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
KR20160097424 2016-07-29
KR10-2016-0097424 2016-07-29
KR20160097423 2016-07-29
KR10-2016-0097423 2016-07-29
KR10-2016-0103120 2016-08-12
KR10-2016-0103118 2016-08-12
KR1020160103120A KR101840449B1 (en) 2016-07-29 2016-08-12 Led lamp unit for a vehicle
KR1020160103118A KR101841841B1 (en) 2016-07-29 2016-08-12 Led lamp unit for a vehicle

Publications (1)

Publication Number Publication Date
WO2018021724A1 true WO2018021724A1 (en) 2018-02-01

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ID=61016345

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Application Number Title Priority Date Filing Date
PCT/KR2017/007337 WO2018021724A1 (en) 2016-07-29 2017-07-07 Vehicle led lamp unit

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WO (1) WO2018021724A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100012510U (en) * 2009-06-09 2010-12-17 한국에너셀 주식회사 Honeycomb structure heat sink for high power Light Emitting Diode lighting
KR20120016567A (en) * 2010-08-16 2012-02-24 장영환 The lamp having nonpolar circuit
JP2014041738A (en) * 2012-08-22 2014-03-06 Koito Mfg Co Ltd Light source module
KR20140122474A (en) * 2013-04-10 2014-10-20 이동철 Led lamp assembly
KR20160028081A (en) * 2014-09-02 2016-03-11 엘이디라이텍(주) LED socket assembly

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100012510U (en) * 2009-06-09 2010-12-17 한국에너셀 주식회사 Honeycomb structure heat sink for high power Light Emitting Diode lighting
KR20120016567A (en) * 2010-08-16 2012-02-24 장영환 The lamp having nonpolar circuit
JP2014041738A (en) * 2012-08-22 2014-03-06 Koito Mfg Co Ltd Light source module
KR20140122474A (en) * 2013-04-10 2014-10-20 이동철 Led lamp assembly
KR20160028081A (en) * 2014-09-02 2016-03-11 엘이디라이텍(주) LED socket assembly

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